JP2633426B2 - Resin sealing device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin sealing device for a semiconductor device.

[0002]

2. Description of the Related Art FIG. 5 is a front view showing a conventional resin sealing apparatus, wherein 1 is an upper mold (hereinafter referred to as an upper mold) for sealing and molding a semiconductor element with a resin. And a pair of lower dies (hereinafter referred to as lower dies), 3 is an upper platen on which the upper die 1 is mounted, 4 is a movable platen on which the lower die 2 is fixed, and 5 is a lower plate having a drive system (not shown). A platen 6 slides and guides the movable platen 4, and a tie bar connecting the upper platen 3 and the lower platen 5; a nut 7 fixing the tie bar 6 to the upper platen 3 and the lower platen 5; a ball screw 8; Is a nut holder for connecting the nut portion of the ball screw 8 and the moving platen 4. FIG. 6 is a side view showing a conventional resin sealing device, where 10 is a rail mounting plate fixed to the upper platen 3, 11 is fixed to the upper platen 3,
A rib for supporting the rail mounting plate 10; a side plate 12;
Is a transport unit supported and fixed to both side plates 12, 14
Is an LM guide for fixing the rail to the rail mounting plate 10 and the LM bearing to the side plate 12, respectively. Here, reference numeral 15 denotes a loader, and 16 denotes an unloader.

Next, the operation will be described. A loader 15 holding a lead frame on which a semiconductor element is mounted and electrically connected thereto and a resin tablet serving as a sealing material is provided.
The mold enters a mold controlled at 80 ° C. (in the direction of the arrow A), positions and installs the lead frame and the resin tablet in the lower mold 2, and then retreats. Next, the ball screw 8 is rotated, and the moving platen 4 is moved via the nut holder 9.
Is raised (in the direction of arrow C) to clamp the upper mold 1 and the lower mold 2,
Injection (not shown) and molding are performed. After the curing is completed, the upper die 1 and the lower die 2 are opened by rotating the ball screw 8 in the reverse direction. Next, the unloader 16 enters the mold (in the direction of arrow B) and removes the molded product.

[0004]

In the conventional resin sealing device, the rail mounting plate 10 is directly fixed to the upper platen 3, so that it is easily affected by the heat transferred from the mold directly. Since the upper platen 3 is deformed as indicated by the curve D, the loader 15 and the unloader 16 fluctuate in the directions of the arrows E and D accordingly, which hinders the preparation operation of the loader 15 and the processing operation of the unloader 16. was there.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a resin sealing device which is not affected by the deformation of the upper platen at the time of mold clamping and which is not thermally affected. And

[0006]

In a resin sealing device according to the present invention, both ends of a rail mounting plate are pivotally connected to both ends of an upper platen via a rotating shaft, and a sliding guide is provided at a central portion of the upper platen. In addition, a gap is provided between the rail mounting plate and the upper platen.

[0007]

The resin sealing device according to the present invention has a sliding guide and a pivotal portion provided between the upper platen and the rail mounting plate.
The rail mounting plate is moved up and down in parallel, and the gap reduces heat transfer.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. In the front view of FIG. 1, 1 is an upper mold, 2 is an upper mold 1 and a pair of lower molds, 3 is an upper platen on which the upper mold 1 is mounted, 4 is a movable platen on which the lower mold 2 is fixed, and 5 is a drive. Lower platen with system (not shown), 6 is moving platen 4
Slidably guides the upper platen 3 and the lower platen 5, a nut 7 for fixing the tie bar 6 to the upper platen 3 and the lower platen 5, a ball screw 8, and a nut portion 9 of the ball screw. It is a nut holder for connecting the moving platen 4. In the side view of FIG. 2, 12 is a side plate, 13 is a transfer unit supported and fixed to the side plates 12 on both sides, 17 is a rail mounting plate, 18 is a guide bush fixed to the center of the upper platen in the front and rear, 19 is both front and rear. A sliding post 14 is fixed to the rail mounting plate 17 and is slidable up and down with respect to a guide bush 18 fixed to the center of the upper platen 3. Reference numeral 14 denotes a rail to the rail mounting plate 17, and an LM bearing to the side plate 12. LM guides to be fixed, 15 is a loader, and 16 is an unloader. FIG. 3 is a detailed cross-sectional view of the H portion. In the figure, reference numeral 20 denotes a bracket fixed to the side surface of the upper platen, 21 denotes a shaft, 22 denotes a lock nut, 23 denotes a collar, and 24 denotes a rotatable shaft 21. It is a support plate fixed to the rail mounting plate.

Next, the operation according to the present invention will be described.
A loader 15 holding a lead frame and a resin tablet as a sealing material (not shown) enters the mold kept at 180 ° C. (in the direction of arrow A), and the lead frame, the resin tablet and Are positioned and installed, and then retracted. Next, the ball screw 8 is rotated, and the moving platen 4 is raised via the nut holder 9 (in the direction of arrow C).
Then, the upper die 1 and the lower die 2 are clamped, and injection (not shown) and molding are performed. After the molding and curing are completed, the upper die 1 and the lower die 2 are opened by rotating the ball screw 8 in the reverse direction. Next, the unloader 16 enters the mold (in the direction of arrow B) and removes the molded product. FIG. 4 shows a model at the time of mold clamping, where θ is the bending angle of the upper platen 3 due to the mold clamping load, and x is the bracket 2.
Reference numeral 0 denotes a mounting surface on the upper platen 3, y denotes a center point of the shaft 21, that is, a rotation center of the support plate 24, and z denotes a mounting surface of the support plate 24 to the rail mounting plate 17. Note that x, y,
Each of 1 and 2 of z means 1 before mold clamping and 2 means after mold clamping.
If the upper platen 3 is deformed by θ due to the load during mold clamping, the x-plane has a slope of θ, and the z-plane is lowered, and the sliding post provided at the center of the upper platen 3 by this lowering amount L 19 is lowered and the rail mounting plate 17 is parallel to the _{Z 2} side. Here, the lateral shift amount s of y is of a negligible level because θ is minimal. Further, the thermal effect on the loader 15 and the unloader 16 is such that the rail mounting plate 17 has a gap G with respect to the upper platen 3 which is in contact with the upper die 1 which is a heat source.・ The effect of thermal strain is reduced.

In the above-described embodiment, the slide post 19 and the guide bush 18 are fixed to the front and rear rail mounting plates 17 and slid up and down. It may be a sliding guide. Also, the guide portion need not be inside the upper platen. Furthermore, the bracket 20 and the support plate 24, which support the rail mounting plate 17 on the upper platen 3, are shown as being constituted by a rotating shaft composed of a shaft 21 and a collar 23, but a universal joint or another connection method is used. You may. In the case of a rotating shaft, a bearing or another bearing may be used, and the same effects as in the above embodiment can be obtained.

[0011]

As described above, according to the present invention, the rail mounting plates on both the front and rear sides for mounting the transfer unit have a vertical sliding portion at the center of the upper platen and a rotating shaft at the supporting portions at both ends. Furthermore, since the rail mounting plate is configured to have a gap in order to avoid contact with a heat source, an effect is obtained in that a stable device is obtained without bending of the upper platen during mold clamping and heat from the mold. There is.

[Brief description of the drawings]

FIG. 1 is a front view showing a resin sealing device according to an embodiment of the present invention.

FIG. 2 is a side view showing a resin sealing device according to one embodiment of the present invention.

FIG. 3 is a partial sectional view showing a resin sealing device according to an embodiment of the present invention.

FIG. 4 is a model diagram showing a resin sealing device according to one embodiment of the present invention.

FIG. 5 is a front view showing a conventional resin sealing device.

FIG. 6 is a side view showing a conventional resin sealing device.

[Explanation of symbols]

 1 Upper die 2 Lower die 3 Upper platen 4 Moving platen 5 Lower platen 6 Tie bar 7 Nut 8 Ball screw 9 Nut holder 12 Side plate 13 Transport unit 14 LM guide 15 Loader 16 Unloader 17 Rail mounting plate 18 Guide bush 19 Sliding post 20 Bracket 21 Shaft 22 Lock nut 23 Collar 24 Support plate

Claims (1)

(57) [Claims] 1. A loader unit for supplying a direct material to a resin-sealed mold, an unloader unit for discharging a molded product, a pair of LM guides for supporting and guiding the loader and the unloader in common, and the LM guide Respectively, a rail mounting plate having a gap between the upper platen, a support portion for pivotally connecting both ends of the rail mounting plate to both ends of the upper platen via a rotating shaft, and a rail mounting at the center of the upper platen. A resin sealing device including a vertical sliding portion of a plate.