JP2607589Y2 - Multilayer chip inductance components - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer chip type inductance component such as a chip inductor, a chip LC filter, a chip transformer, etc. The main point is to connect not only a spirally formed internal conductor pattern but also external terminals. The present invention relates to improvement of an external connection pattern provided in the above.

[0002]

2. Description of the Related Art Conventionally, in a multilayer chip type inductance component, a plurality of layers are integrally laminated to each other via an insulating layer made of a magnetic ferrite or the like, and one end of one side is connected to each other in a spiral manner. (Japanese Patent Publication No. Sho 60-50331, Japanese Utility Model Application Laid-open No. Sho 59-14500) are known.
No. 9).

In the laminated chip type inductance component, in addition to the above-described internal conductor pattern, an insulating layer is provided to connect external terminals provided on both side ends of the component body and ends of the internal conductor pattern. A circuit for external connection is provided through the circuit.

The external connection pattern is geometrically determined based on the positional relationship between the end of the internal conductor pattern located inside the surface of the insulating layer and the external terminals provided on both side ends of the component body. Therefore, the shape of the external connection pattern changes depending on where the end of the internal conductor pattern is located inside the surface of the insulating layer.

The case where three-fourth internal conductor patterns 1a, 1b and 1c are connected in a spiral shape as shown in FIG. 3 will be described.
In particular, b and 1c are positioned with their end directions sequentially changed via an insulating layer forming a component body (not shown).
a, 11b, 12a,... are connected to each other in a spiral manner.

Assuming that it is formed from three patterns, the start and end points 10 of the internal conductor patterns 1a and 1c
In order to connect b and 12b to the external terminals, the external connection patterns 2 and 3 are connected to the external terminals and the conductor sides 2a and 3a connected to the ends 10b and 12b of the internal conductor patterns 1a and 1c. It is necessary to form a substantially U-shaped band-shaped pattern from the conductor sides 2b and 3b.

On the other hand, as shown in FIGS. 4 and 5, the end position changes depending on whether the number of turns by the internal conductor pattern is increased, or whether the end of the internal conductor pattern in the insulating layer serving as the lamination reference is oriented. Therefore, it is necessary to change the shape of the external connection patterns 3 and 4 into a band shape such as a substantially G-shaped or L-shaped pattern.

For this reason, the pattern for external connection greatly influences the product design to constitute the multilayer chip type inductance component. At present, the pattern is manufactured by designing and preparing a pattern dedicated for each product design. That is the fact.

However, this not only complicates the circuit configuration but also increases the number of patterns, resulting in an increase in cost. In addition, the time required from product design to manufacture is long, and the productivity is extremely poor in view of plate making work.

[0010]

[Problems to be Solved by the Invention] The present invention is to improve the external connection pattern to a common pattern which can be connected from an end position to an arbitrary place and can be shared by many products. It is an object of the present invention to provide a multilayer chip inductance component capable of shortening a lead time until product manufacture, reducing costs, and improving productivity.

[0011]

In a multilayer chip type inductance component according to the present invention, an internal connection conductor having an area corresponding to a spiral shape which can be connected to an end of an internal conductor pattern at any position is provided. It is configured by providing a strip-shaped external connection pattern including an external connection conductor having the same width and extending from the internal connection conductor to the edge of the insulating layer.

[0012]

In the multilayer chip type inductance component according to the first aspect of the present invention, since the external connection pattern has a conductor portion having an area connectable to the end of the internal conductor pattern at any position, the internal conductor pattern has A common pattern can be applied regardless of the position of the end portion in the plane of the insulating layer to facilitate product design, and the same width of the external portion extending from the internal connection conductor portion to the edge of the insulating layer. The provision of the connection conductor allows reliable connection to the external terminal, simplification of the circuit configuration, and shortens the lead time required for manufacturing the product.

[0013] In addition, the number of pattern plates can be reduced and can be used for many products, so that the cost can be reduced as a whole. In addition, since the same components can be shared, the connection between conductors can be easily and reliably performed, and a small component can be configured with high accuracy.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to FIGS. 1 and 2, for the sake of convenience, the inner conductor patterns 1a, 1b, 1c... Only the circuit configuration with the external connection patterns 20 and 30 connected to is shown. Are connected at one end of each of the internal conductor patterns 1a, 1b, 1c,...
The connection point with 30 is shown by the dotted line.

However, the internal conductor patterns 1a, 1
The numbers of the patterns b, 1c,... are for convenience and are shown more simplified than the actual circuit configuration. In addition, the component body, a plurality of insulating layers forming the component body, and external terminals are omitted in the drawing.

In the laminated chip type inductance component, a component main body is formed by stacking insulating layers such as magnetic ferrite by applying a printing method or a sheet method. The internal conductor pattern and the external connection pattern are printed and formed on the surface of the insulating layer, and a plurality of the insulating layers are laminated and baked integrally to incorporate a circuit configuration using the internal conductor pattern and the external connection pattern. It is manufactured as an inductance component.

In the multilayer chip type inductance component shown in FIG. 1, three quarter turns of the internal conductor patterns 1a, 1b, 1c are formed at ends 10a, 11a, 11b, 12c.
are formed in a spiral shape by sequentially connecting a with each other by printing of a conductive material or by filling through holes. In addition, the end 10 of the internal conductor patterns 1a, 1c
The circuit is configured by providing external connection patterns 20 and 30 for connecting the external terminals b and 12b to external terminals provided at both end portions of the component body.

The external connection patterns 20 and 30 include internal connection conductor portions 20a and 30a having an area corresponding to a spiral shape connectable to the end portions 10b and 12b of the internal conductor patterns 1a and 1c at any position. The external connection conductors 20b, 30b having the same width and extending from the internal connection conductors 20a, 30a to the edge of the insulating layer are formed in a strip shape.

The external connection patterns 20 and 30 have a common pattern except that the pattern directions are reversed and symmetric electrode patterns are formed. Also, as shown in FIG. 2, even if the number of the internal conductor patterns 1d, 1e. In particular, even if the directions of the start and end ends of the internal conductor patterns 1a and 1d are completely different, the same pattern can be applied.

The external connection patterns 20 and 30 can cover at least the entire area defined by the spiral shape of the internal conductor pattern with the internal connection conductor portions 20a and 30a. It is possible to improve the component characteristics by reducing the reduction and the crosstalk.

In the above-described embodiment, the external connection pattern connected to the beginning and end of the internal conductor pattern has been described. However, the present invention can be applied as an external connection lead pattern drawn from the middle of the internal conductor pattern.

[0022]

As described above, according to the multilayer chip type inductance component of the present invention, the external connection pattern has an area connectable to any position of the end of the internal conductor pattern. Can be connected to an arbitrary position from the end position of the terminal with a common pattern.Also, since it has the same width external connection conductor extending from the internal connection conductor to the edge of the insulating layer, it can be reliably connected to the external terminal. Further, the circuit design can be simplified, the circuit configuration can be simplified, the manufacturing lead time can be shortened, and the cost can be reduced. In addition, since the external connection patterns can all be made common within the same component, it can be configured as a small and highly accurate component, and the external characteristics can be reduced by reducing external noise and crosstalk due to the shielding effect. Can also be improved.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a circuit configuration of a multilayer chip inductance component according to the present invention.

FIG. 2 is a developed perspective view showing another circuit configuration of the inductance component.

FIG. 3 is an exploded perspective view showing a circuit configuration of a multilayer chip inductance component according to a conventional example.

FIG. 4 is a developed perspective view showing another circuit configuration of the inductance component.

FIG. 5 is a developed perspective view showing still another circuit configuration of the inductance component.

[Explanation of symbols]

1a, 1b, 1c ... Internal conductor pattern 10a, 10b, 11a, 11b, 12a, 12b ...
Ends of internal conductor pattern 20, 30 External connection pattern 20a, 30a Internal connection conductor 20b, 30b External connection conductor

Continuation of front page (58) Fields investigated (Int. Cl. ⁷ , DB name) H01F 17/00, 27/29, 41/04 H05K 3/46

Claims (1)

(57) [Scope of request for utility model registration] 1. A circuit configuration comprising an internal conductor pattern spirally connected and formed through an insulating layer integrally formed with a plurality of layers, and an external connection pattern connecting the internal conductor pattern to an external terminal. In the laminated chip-type inductance component, an internal connection conductor having an area corresponding to a spiral shape connectable to the end of the internal conductor pattern at any position, and an end of the insulating layer from the internal connection conductor. A multilayer chip-type inductance component provided with a strip-shaped external connection pattern comprising an external connection conductor portion of the same width extending to the edge side.