JP2606112B2 - Semiconductor device manufacturing system - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device manufacturing system.

[0002]

2. Description of the Related Art Many semiconductor devices such as passive elements, active elements, and integrated circuits are manufactured from a single wafer. In the manufacture of this semiconductor device, wafers are sequentially processed over a plurality of work facilities. The work equipment includes a single-wafer processing method for processing wafers one by one, a batch processing method for processing a plurality of wafers at a time, and a processing apparatus for processing a lot for storing a plurality of wafers. For example, a thin film forming apparatus, an oxidizing apparatus, a doping apparatus, an annealing apparatus, a resist processing apparatus, an exposure apparatus, an etching apparatus, a cleaning apparatus, or the like is used. One work facility is operated by one worker. In addition, many lots containing wafers of the same type are set in each work facility. For this reason, even when the work is performed in the same work equipment, the work condition differs depending on the type of the lot, and the work condition needs to be changed.

[0003] In general, at a semiconductor device manufacturing site, a manufacturing plan for wafers in a lot is established and work is performed by the following method. First, an operator determines a work priority from a large number of lots carried to one work facility. This decision was based on wafer delivery, experience and intuition. Then, the worker attaches a label of a color corresponding to the work priority to the lot, and then starts processing the wafer. If there are multiple lots containing the same type of wafer,
Wafer processing was started after a lot was put into a lot storage box colored according to the work priority. Then, the worker has started the work from the wafers in the lot having a higher priority, judging from the color corresponding to the above-mentioned priority from the lot started in front of the work equipment in charge.

[0004] Further, in consideration of the working conditions of the wafers set in the working equipment two to three steps before the assigned working equipment, the operator has to plan the work so as to reduce the number of switching of the working conditions of the assigned working equipment. Was standing up. In addition, a batch-type operation facility such as a diffusion furnace can collectively operate a large number of wafers having the same operation conditions. For this reason, the worker has made a production plan in consideration of the working conditions of the wafers set in the working equipment two or three steps before, so that the number of wafers working in the work equipment in charge increases.

[0005] However, the operator cannot grasp all of the progress of the wafer in process, the delivery date, and the operation of the work equipment in the entire manufacturing site. That is, a human cannot make an accurate judgment in consideration of many conditions like a computer. For this reason, a manufacturing plan has been made based on experience and intuition based on partial manufacturing site information. As a result, the operator has created a manufacturing plan that does not correspond to the capacity of the manufacturing site. In addition, since it is impossible to grasp the entire manufacturing site, it is difficult to freely change the manufacturing plan during the operation. As a result, a lot of in-process lots are formed in the work equipment, and a delivery date is delayed.

Therefore, a "manufacturing plan creation apparatus" disclosed in Japanese Patent Application Laid-Open No. 3-251349 has been proposed. With this manufacturing plan creation device, it has become possible to grasp the situation of the entire manufacturing site. For this reason, it has become possible to create a production plan that adheres to the delivery date and does not generate a work in progress in the work equipment. In addition, the uncertain judgments involved in the production plan based on the experience and intuition of workers were also eliminated.

[0007]

However, the above-mentioned manufacturing plan making apparatus does not consider efficient changes in working conditions. For this reason, the number of times of changing the working conditions of the working equipment has increased. Further, in the above-mentioned work plan creation device, efficient change of batch conditions is not considered. For this reason, the number of changes in the batch conditions has increased. A predetermined time is required to change the work conditions or the batch conditions. During this predetermined time, the work equipment cannot be operated. Therefore, the manufacturing plan creation device described above
The time during which the operation equipment cannot be operated has been prolonged, and the operation rate of the operation equipment has been low.

[0008]

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a semiconductor device manufacturing system which improves the operation rate of work equipment.

[0009]

According to the first aspect of the present invention, a plurality of materials are put into work equipment based on a manufacturing plan.
In a semiconductor device manufacturing system in which work is performed under the work conditions of each material, the first condition for manufacturing a finished product before the delivery date of the finished product and the number of materials to be worked on working equipment are set within a reference value. And a third condition for minimizing the number of changes in the working conditions in the work equipment, and a production plan creating means for determining the work priority of the material in the work equipment based on the second condition. .

According to a second aspect of the present invention, there is provided a semiconductor device manufacturing system in which a plurality of materials are supplied to a batch-type working facility based on a manufacturing plan and work is performed under the working conditions of each material. The first condition for manufacturing the finished product before the delivery date, the second condition for keeping the number of batches in the batch-type work equipment within a reference value, and the number of changes in the batch condition in the batch-type work equipment A production plan creating means for determining the work priority of the material in the batch-type work equipment based on the third condition for minimizing the work condition.

[0011]

In the semiconductor device manufacturing system according to the first aspect of the present invention, the work priority of the material is determined based on a condition for minimizing the number of times of changing the work condition in the work equipment. For this reason, the number of times of changing the working conditions is reduced. Therefore, the time during which the work equipment cannot be operated is shortened. Therefore, the operation rate of the work equipment is improved.

According to a second aspect of the present invention, in the semiconductor device manufacturing system, the work priority of the material is determined based on a condition for minimizing the number of times the batch condition is changed in the batch type work equipment. Is determined. Therefore, the number of times of changing the batch condition is reduced. Therefore, the time during which the batch-type work equipment cannot be operated is shortened. Therefore,
The operating rate of batch-type work equipment is improved.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a semiconductor device manufacturing system according to the present invention will be described below with reference to the drawings. FIG. 1 is a block diagram showing a schematic configuration of a semiconductor device manufacturing system according to one embodiment of the present invention. FIG. 2 is a flowchart showing an outline of the operation of the semiconductor device manufacturing system.

FIG. 1 shows a semiconductor device manufacturing system. In the semiconductor device processing line 101, 3
A work facility 102 for semiconductor devices and four terminals 103 are installed. These work facilities 102 and terminals 103 are connected to a host computer 105 via a local area network 104. The host computer 105 has a basic information storage unit 10
6. State storage unit 106 ', work process flow storage unit 10
7, the input plan storage unit 108 and the production plan storage unit 109 are connected to each other. Also, the host computer 10
5 is connected to a simulator 110 via a local area network 104.

The basic information storage unit 106 stores a product (material) name, a delivery date of a finished product, the number of steps of each product, the type and the number of the work facilities 102 in the processing line 101, and the number of the work facilities 102. The operable time is stored. The state storage unit 106 ′ stores the equipment operation status (normal or faulty) of the work equipment 102 and the terminal 103.
The in-process status of each product, which has been input by the user, is stored. The work process flow storage unit 107 stores work process procedures for processing products and work times required for individual work processes. The input plan storage unit 108 stores a daily input plan when the product is input to the work equipment 102. Further, the manufacturing plan storage unit 109 stores the manufacturing plans of all the work facilities 102. The simulator 110 stores the manufacturing plan stored in the manufacturing plan storage unit 109 in the basic information storage unit 10.
6. State storage unit 106 ', work process flow storage unit 107
And the data stored in the input plan storage unit 108.

Next, the manufacturing plan will be described. First, the simulator 110 sends the data stored in the basic information storage unit 106, the state storage unit 106 ', the work process flow storage unit 107, and the input plan storage unit 108 to the host computer 105 at a predetermined time. Request (step 201). The host computer 105 transfers the requested data to the simulator 110 via the local area network 104 (step 20).
2).

Next, the simulator 110 performs a future simulation based on the transferred data (step 203). This future simulation is a future prediction type process simulation that predicts how each product will progress to which processing equipment 102 in the future, in order to comply with the delivery date of the finished product. For example, a priority rank of a product based on a delivery date is determined in advance from the transferred data. The number of products to be worked on each work equipment 102 is planned so that the products with higher priority ranks are processed.

Next, the number of products is compared with a preset standard number of works in process for each of the work equipments 102, and it is determined whether the product is within the standard or out of the standard (step 204). In addition,
If the work equipment 102 is of a batch type, efficient change of batch conditions is considered in step 204.

If the result within the standard is not obtained and the result is out of the standard, the parameter is adjusted (step 205). The adjustment of this parameter is, for example, a change of the priority rank. Next, the process returns to step 203, and the future simulation is performed again. If a result within the standard cannot be obtained even after the predetermined time has elapsed, the production plan can be stopped. On the other hand, if it is determined in step 204 that the data is within the standard, the process proceeds to step 206. Then, a manufacturing plan is created based on the obtained result (step 206). In addition,
If the work equipment 102 is a single wafer type, efficient change of work conditions is considered in step 206.

The manufacturing plan is transferred to the host computer 105 by the simulator 110 (step 20).
7). The transferred manufacturing plan is stored in the manufacturing plan storage unit 109.
And is displayed on the terminal 103 in the processing line 101, and the worker is instructed on the work content. This work content eliminates the bias of products that are set in the work equipment 102,
In addition to strict adherence to the delivery date, efficient work condition changes and efficient batch condition change operations have been achieved.

Next, a manufacturing plan creation step (Step 2)
04 to 206) will be described in detail by dividing into two types of examples, a single-wafer type work facility 102 and a batch type work facility 102.

First, a case where the plurality of work facilities 102 are of a single wafer type will be described. FIG. 3 shows that the equipment name of one work equipment 102 is X
In the case of XX (301), step 2 shown in FIG.
03 is a data table in which the results of work-in-progress obtained by performing the future simulation of No. 03 are totaled and the work procedure is determined.
The data table includes the procedure No. Box 30
2. Product No. A column 303, a work condition column 304, a scheduled work time column 305, a priority rank column 306, and a standard work in progress column 307 are provided. FIG. 4 is a flowchart for explaining the creation of a work procedure decision from the in-process result of the future simulation.

First, by the above-mentioned future simulation,
The data table is output for each of the plurality of work facilities 102. In this output stage, the procedure No. The contents of the column 302 are not output, and the contents of the other columns are output.
For details, refer to each product No. Corresponding to the product (wafer) output in the column 303, the work condition, scheduled work end time and priority rank of this wafer are the product No. Column 303, work condition column 304, scheduled work time column 305, and priority rank column 306 are respectively output. For example, when the name of the wafer is N1-1111, the work condition name of the wafer is AA01, and the scheduled work end time of the wafer is 13:57 on July 25, 1993. The priority rank output to the priority rank column 306 is determined in consideration of the total work time of the wafers over all the work facilities 102 and the delivery date. For example, the time from the current time to the delivery date is divided by the total work time. At this time, a high priority rank is assigned to a wafer having a small quotient. In addition, a reference number of works in progress 307 is set in advance. For example, the reference number of work in process 307 is 12.

Next, the number of processes in process output to the data table, that is, the product number. The number of wafers output in the column 302 is compared with the reference number of in-process 307 of 12 (step 401). As a result of the comparison, when the number of processes is larger than 12 (out of the standard), the process proceeds to step 402. Next, sorting is performed using the scheduled work time column 305 as a key (step 40).
2). The sorting conditions are a time order and an ascending order. As a result, each row of the data table contains the scheduled work time 305
Are sorted in ascending order of work schedule time.

Next, the priority rank is lowered by one rank for the wafers after the 12th row (step 403). For example,
If the number of wafers is 14, 13
The priority rank output in the column of the priority rank 306 is changed for the 14th wafer and the 14th wafer.

Next, a re-simulation is performed (step 404). This re-simulation causes the progress speed of the wafer whose priority rank has been lowered to be lower than that in the future simulation. As a result, the equipment name: XXX
The number of wafers set in the work equipment 102 of (301) is reduced. In other words, this re-simulation
Finally, simulation is performed in the future so that the number of the wafers is equal to or smaller than the number of the standard work-in-process 307. Then, the process returns to step 401.

On the other hand, if it is determined in step 401 that the number of processes in process is 12 or less of the standard number of processes 307, step 40
Go to 5. Next, as in step 402, sorting is performed using the scheduled work time column 305 as a key (step 4).
05).

Next, sorting is performed using the work condition column 304 as a key (step 406). The sorting conditions at this time are in the order of names. As a result, each row of the data table is rearranged for the same work condition. That is, the names of the wafers are arranged for the same operation conditions, and the names of the wafers having the same operation conditions are arranged in the order of the earliest scheduled work end time.
Finally, the procedure No. The procedure number is output to the column 302 to determine the work procedure (step 407).

As a result, the worker is instructed on a production plan in which the delivery date is strictly observed and an efficient change of the working condition is taken into consideration, without causing the work in the work facility 102 to be unbalanced.

Although the above description has been made with reference to an example in which the wafer is set in the single-wafer work equipment 102, the work equipment 102 is not limited to the single-wafer work equipment. That is, the work equipment 102 that performs work for each lot in which a large number of wafers are accommodated may be used. As the work equipment 102, for example, there is a cleaning apparatus for immersing a lot in a cleaning liquid and cleaning wafers in the lot. That is, the wafer of the above embodiment may be replaced with a lot and used for a lot to be set in a cleaning apparatus.

Next, a case where the plurality of work facilities 102 are of a batch type will be described. FIG. 5 is a data table in which, in the case where the equipment name of one work equipment 102 is XXX (501), the future simulation of step 203 shown in FIG. The data table includes the procedure No. Column 5
02, product No. A column 503, a work condition column 504, a scheduled work time column 505, a number of sheets column 506, a batch column 507, a priority rank column 508, a maximum number of processed sheets column 509, and a reference batch number column 510 are provided. FIG. 6 is a flowchart for explaining the creation of the determination of the work procedure from the in-process result of the future simulation.

First, by the above-mentioned future simulation,
The data table is output for each of the plurality of work facilities 102. In this output stage, the procedure No. The contents of the column 502 and the contents of the batch column 507 are not output, and the contents of the other columns are output. For details, refer to each product No. Corresponding to the product (lot) output in the column 503, the operation condition, scheduled end time, number of sheets, and priority rank of the wafer provided in this lot are the product No. Column 503, work condition column 504, scheduled work time column 505, number of sheets column 50
6 and the priority rank column 508, respectively. For example, when the lot name is N1-1111, the work condition name of the wafer in this lot is AA01, and the scheduled work end time of this wafer is July 1993.
At 13:57 on March 25, the number of wafers is 25. The priority rank output to the priority rank column 508 is determined in advance in consideration of the delivery date and the total work time of the wafer. The work equipment 102 having this equipment name: XXX (501) has a maximum of 150
One wafer can be processed collectively (see the maximum processed number column 509). In addition, the reference batch number 51
0 is set. For example, this reference batch number 51
0 is 12.

Next, sorting is performed using the scheduled work time column 505 as a key (step 601). The sorting conditions at this time are time order and ascending order. As a result, the rows of the data table are rearranged in the order of earlier work end time. Next, sorting is performed using the work condition column 504 as a key (step 602). The sorting conditions at this time are in the order of names. As a result, each row of the data table is rearranged for the same work condition. That is, the names of the lots are arranged for each of the same work conditions, and the names of the lots having the same work conditions are arranged in the order of the earlier scheduled work end time.

Next, batch assembly is performed so as to minimize the number of batches (step 603). More specifically, a group is created such that the total number of wafers in each lot under the same working conditions approaches the maximum number of processed wafers 509 (150) as much as possible. For example, if the total number of the above-mentioned wafers is 150 or less, it is regarded as one group. Also,
If the total number of the above-mentioned wafers exceeds 150, it is classified into two or more groups. Further, when a plurality of groups are created under the same conditions, the number of wafers in each group is averaged as much as possible. Then, a batch field 50 is set for each group with respect to the names of the lots divided into groups.
7 are set with identification flags (A, B,...). For example, when divided into 14 groups, the identification flags A to N are set.

Next, sorting is performed using the batch column 507 as a key (step 604). The sorting conditions at this time are in the order of names. As a result, the rows of the data table are rearranged for the same group (the same identification flag).

Next, the number of group types is compared with the reference batch number 510 of 12 (step 605). As a result of the comparison, if the number of group types is more than 12 (out of the standard), the process proceeds to step 606. Next, the priority rank is reduced by one rank for groups having more than 12 types of groups (step 606). For example, if the number of groups is 1
In the case of 4, the priority rank output in the column of the priority rank 508 is changed for the lots of the 13th group and the 14th group.

Next, a re-simulation is performed (step 607). This re-simulation causes the progress speed of the lots of the group whose priority rank has been lowered to be lower than that in the future simulation. As a result, the number of lots in process for the work equipment 102 having the equipment name: XXX is reduced. In other words, this re-simulation eventually results in the number of the group types being equal to the reference batch number 510.
The simulation will be performed in the future so that the number is less than or equal to the number. Next, the process returns to step 601.

On the other hand, as a result of comparing the number of group types with 12 of the reference batch number 510, if the number of group types is 12 or less (within the standard), the process proceeds to step 608. Next, the procedure No. The procedure number is output to the column 502 to determine the work procedure (step 608). At this time, when the batch column 507 has the same symbol, that is, for the same group, the same procedure number is output.

As a result, the worker is instructed on a production plan in which the delivery date is strictly observed and an efficient change in batch conditions is taken into consideration, without causing an incomplete work in the work equipment 102.

[0040]

According to the first aspect of the present invention, conditions for minimizing the number of times of changing the operation conditions in the operation equipment are considered. For this reason, the operation rate of the work equipment is improved.

According to the second aspect of the present invention, conditions for minimizing the number of times batch conditions are changed in a batch-type work facility are considered. For this reason, the operation rate of the batch type operation equipment is improved.

[Brief description of the drawings]

FIG. 1 is a configuration block diagram showing a semiconductor device manufacturing system according to one embodiment of the present invention.

FIG. 2 is a flowchart of a semiconductor device manufacturing system according to one embodiment of the present invention.

FIG. 3 is a data table of products in process for each work facility.

FIG. 4 is a flowchart for explaining creation of a work procedure of the work equipment.

FIG. 5 is a data table of products in process for each batch-type work equipment.

FIG. 6 is a flowchart for explaining creation of a work procedure of a batch-type work facility.

[Explanation of symbols]

 Reference Signs List 101 processing line 102 work equipment 103 terminal 104 local area network 105 host computer 106 basic information storage unit 106 'state storage unit 107 work process flow storage unit 108 input plan storage unit 109 production plan storage unit 110 simulator (production plan creation means) 201 To 207 steps 301 to 307 data table 401 to 407 steps 501 to 510 data table 601 to 607 steps

Claims (2)

(57) [Claims] 1. A semiconductor device manufacturing system in which a plurality of materials are put into a work facility based on a manufacturing plan and work is performed under working conditions of each material, a first system for manufacturing a completed product before a delivery date of the completed product. , A second condition for keeping the number of materials to be worked on the work equipment within the reference value, and a third condition for minimizing the number of changes in the work conditions in the work equipment. A manufacturing system for a semiconductor device, comprising a manufacturing plan creating means for determining a work priority of a material in equipment. 2. A semiconductor device manufacturing system in which a plurality of materials are put into a batch-type work facility based on a manufacturing plan and work is performed under the working conditions of each material, wherein a completed product is manufactured before a delivery date of the finished product. The first condition, the second condition for keeping the number of batches in the batch-type work equipment within the reference value, and the third condition for minimizing the number of changes in the batch condition in the batch-type work equipment And a production plan creating means for determining a work priority of a material in a batch-type work facility based on the following.