JP2602087B2 - Difference hole positioning control method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a difference point guide pattern and a difference point guide pattern formed on a matrix board in order to accurately position a pin insertion / extraction mechanism in an arbitrary difference hole on a matrix board. The present invention relates to a difference hole positioning control method using a position detector which reads a difference point position from a difference point.

[Conventional technology]

It has a matrix board in which the difference holes are arranged in a two-dimensional mesh form, connects the subscriber line group to the vertical line group of the matrix board, connects the office line group to the horizontal line group, and inserts the conduction pin into the difference hole by an automatic mechanism. A main wiring board, which is a kind of automatic connection changing device which forms a communication path, is disclosed in, for example, JP-A-51-52706. In this type of conventional apparatus, the difference point density (the number of difference points per unit area) is low, that is, the difference hole on the matrix board is large. Therefore, even if there is a relative position error between the difference hole center and the automatic mechanism to some extent, the pin is not hindered. I was able to insert and remove.

However, there has been a problem that the demand for telephones has increased, and the connection switching device has been enlarged accordingly. The only solution to this problem is to use a matrix board with a high difference point density to increase the subscriber line accommodation efficiency.

However, since an increase in the difference point density involves a narrowing of the difference hole, a relative position error between the difference hole center and the automatic mechanism caused by an assembly error or a machining error of the matrix board or the matrix board frame cannot be ignored. In order to reduce the relative position error, in the related art, a mechanism for an automatic connection changing device such as a matrix board frame, a transfer mechanism, and a matrix board has been processed with high precision.

[Problems to be solved by the invention]

However, in this conventional technique, the cost of the apparatus increases, and the improvement of the difference point density is limited.

In addition, since the automatic reconnection device may use a large number of matrix boards for a long period of several decades, the reflectivity of the difference point guide pattern may vary due to manufacturing variations of the difference point guide pattern of the matrix board and long-term use. Deterioration and fluctuations in the detection sensitivity of the position detector are expected.

As described above, in the case of an automatic reconnection device using a matrix board, from the viewpoint of miniaturization and high reliability of the device, a matrix board rack and a transfer mechanism are required to cope with performance fluctuations and manufacturing variations due to long-term use. A difference hole positioning control that can autonomously calibrate the detection sensitivity with the reflected light from the reflectance reference on the matrix board without the need for a high-precision mechanism for the automatic connection changer such as a matrix board is essential. It has become.

The present invention has been made in view of such a point,
Its purpose is to enable the insertion and removal of pins into and out of the difference hole with a high difference point density without the need for a high-precision mechanism for the automatic connection / replacement device. It is an object of the present invention to provide a difference hole positioning control method capable of removing the influence of the deterioration of the reflectance of the difference point guide pattern and the variation of the detection sensitivity of the position detector due to the use of the method.

[Means for solving the problem]

In order to achieve such an object, the present invention detects the reflection of light applied to the reflectance reference pattern created on the matrix board, and scans the vicinity of the difference mark indicating the difference hole position with a position detector. , A detection signal of the position detector is accumulated, and an extreme value of the accumulated detection signal is estimated.

[Action]

In the difference hole positioning control method according to the present invention, it is not necessary to increase the precision of the mechanism for the automatic connection changing device, and the fluctuation in detection sensitivity is suppressed.

〔Example〕

Breakthrough the limit of improvement of difference point density in the prior art 1
One method is to equip an automatic mechanism with a position detector capable of detecting the center position of the difference hole. That is, in the automatic connection changing device with the position detector, the center of the difference hole is detected by the position detector from the difference guide pattern on the matrix board, and the insertion and removal of the conduction pin is performed. It can be inserted and removed, and the difference point density can be improved. Also, the unique address of each matrix board is assigned to the difference point guide pattern, and the matrix board address can be detected by the position detector, so that the reliability of transfer is improved.
Further, as the difference point density of the matrix board increases, the conductive pins also become smaller, but by measuring the relative inclination of the matrix board surface, the attitude of the pin insertion / extraction mechanism can be controlled to be perpendicular to the matrix board surface. So
The conductive pin can be inserted and removed with high reliability without buckling or damage in the difference hole of the thick matrix board.

In addition, for the manufacturing variation of the difference point guide pattern of the matrix board, the reflectance deterioration of the difference point guide pattern due to long-term use, and the variation in the detection sensitivity of the position detector, first, the emission intensity was increased by the expected variation. The adoption of the light emitting element for the position detector, and then, in daily use, is determined by the interaction between the position detector and the reflectance of the difference point guide pattern in a region serving as a reference for the reflectance provided on the matrix board. It is important to calibrate the detection sensitivity and to determine the center of the target difference point by detecting an extreme value in order to cope with local fluctuation of the difference point guide pattern reflectance near the target difference point.

The present invention calibrates the detection sensitivity of the position detector with the reflectance reference pattern formed on the matrix board, and observes the difference point guide pattern with the position detector, while arbitrarily selecting the address of the matrix board and the arbitrary position on the matrix board. The most important feature is that the position of the difference hole is detected and the pin insertion / extraction mechanism is moved to an arbitrary position of the difference hole on the matrix board. The difference from the conventional technique is that the difference point density can be improved and the positioning control can be made more reliable without increasing the precision of the mechanism for the automatic connection changing device such as the matrix board frame, the transfer mechanism, and the matrix board.

FIG. 1 is a schematic view of an automatic connection changer, 1 is an attitude control mechanism, 2 is a matrix board, 3 is a transfer mechanism, 4 is a lower rail, 5 is an upper rail, 6 is a rack, 7 is a position detector,
8 is a pin insertion / extraction mechanism, and 9 is a matrix board rack.

The attitude control mechanism 1 to which the present invention is applied is mounted on a transfer mechanism 3 guided by upper and lower rails 4 and 5, and is transferred between matrix boards 2 mounted on opposed wall surfaces to a target difference point.

FIG. 2 (a) is a view for explaining a first embodiment of the difference point guide pattern, and FIG. 2 (b) is a view for explaining one cross section of the difference hole of the matrix board and the positional relationship between the pin insertion / extraction mechanism 8. FIG. As shown in these figures, the matrix board 2 includes the difference point guide patterns 21 to 25 and the first conductor group 21.
0, a second layer 202 having a second conductor group 211 (shown by a broken line in FIG. 2 (a)) orthogonal to the first conductor group 210, and a first layer. Has a three-layer structure (see FIG. 2 (b)) composed of an insulating layer 201 for electrically insulating the second conductor group from the second conductor group. There is a connection difference hole 212. Reference numeral 220 in FIG. 2A indicates a coordinate axis for explanation, and reference numeral 203 in FIG. 2B indicates a conduction pin (hereinafter, simply referred to as a “pin”).

The reflection reference pattern 213 and the difference point guide pattern are formed of a high reflectance material such as gold plating, and are clearly distinguished from other portions. As will be described later, the mark portions in the difference point guide pattern have protrusions 29a and 29b on both sides of the difference point guide pattern.
Is provided so that the level has a maximum value when the position detector 7 passes.

First, a procedure for transferring the attitude control mechanism 1 to the desired difference hole 212 of the matrix board will be described. In the present invention, coarse positioning control for positioning the attitude control mechanism 1 on the reflectance reference pattern 213 of a desired matrix board using a transfer distance sensor incorporating a transfer mechanism in accordance with a command from a control device (not shown); Precision positioning control for positioning the target difference hole while measuring the relative error from the difference guide pattern by operating the position detector 7. In the coarse positioning control, since the transfer control does not use the position signal from the matrix board 2, the matrix board 9, the transfer mechanism 3, the matrix board 2 and the like can be accurately moved to an arbitrary position on the matrix board 2 due to processing and adjustment errors. Positioning is difficult, and positioning is performed within a limited range (reflectance reference pattern 213). In the reflectance reference pattern 213, as described later, the detection sensitivity of the position detector 7 that detects the state quantity from the difference point guide pattern is calibrated.

Next, it is necessary to detect the matrix board base mark 26 from the reflectance reference pattern 213 by the position detector 7 and position the attitude control mechanism 1 at the base point of the precision control. At the time of completion of the coarse positioning control, the position of the attitude control mechanism 1 on the matrix board 2 cannot be specified. Therefore, first, from the reflectance reference pattern 213, the matrix in which the matrix board position can be most easily specified by the following transfer operation. The end face of the board is detected. In other words, the posture control mechanism 1 until the matrix board base point guide pattern 22 is detected.
Is transported in the + Y direction as shown by the arrow AR1. Since the difference point guide pattern is formed of a high reflectance material such as gold plating, the difference point guide pattern can be determined when the output value of the position detector 7 exceeds a specified value. After detecting the matrix board base point guide pattern 22, the arrow AR2
As shown by, the substrate is further fed in the + Y direction, and the matrix board edge pattern 21 is detected. Since only these two difference point guide patterns are arranged on the matrix board in the vicinity of the reflectance reference pattern 213 (strictly in the + Y direction), these two difference point guide patterns could be detected. The attitude control mechanism 1 can be specified to be substantially on the matrix board edge pattern 21. In order to determine that the attitude control mechanism 1 has been positioned on the matrix board edge pattern 21, it is further fed in the + Y direction as shown by the arrow AR3, and it is confirmed that the matrix board area is interrupted. That is, when the matrix board edge pattern 21 is moved in the + Y direction, the matrix board area is interrupted, and the reflected light from the matrix board is extremely reduced. It can be confirmed from zero. After the detection of the matrix board end face, the matrix board edge pattern 21 is searched and detected by sending it in the -Y direction as shown by an arrow AR4. After detecting the difference point guide pattern 21 of the matrix board edge, the matrix board base point difference point guide pattern 22 is sent again in the -Y direction as shown by an arrow AR5 to search and detect again. Next, in order to specify the matrix board base point mark 26, after detecting the mark board base point difference point guide pattern 22, as shown by an arrow AR6 along the matrix board base point guide pattern 22 in FIG. 2 (a). The attitude control mechanism 1 is transferred until the matrix board base mark 26 is detected in the X direction. After the detection of the matrix board base point mark 26, the matrix board unique address is read while the attitude control mechanism 1 is moved in the -Y direction along the matrix board address difference point guide pattern 23. In order to confirm that the matrix board has been transferred to the desired matrix board by the coarse positioning, marks for matrix board address detection are arranged at regular intervals in the matrix board address difference point guide pattern 23, and according to the numbers given to the matrix boards individually. , A binary bit pattern 27 is provided. Assuming that the total number of matrix boards in the automatic connection changing device is N, the number of bits arranged in the matrix board address difference point guide pattern 23 is log ₂ N. The position detector 7 obtains matrix board address information by reading this bit pattern 27 at regular intervals, and performs collation with the matrix board address sent from the control device. After confirming that the matrix board is the specified matrix board, the specified distance-
It is moved in the Y direction to search for and detect the origin mark 28 on the horizontal line difference point guide pattern 24. The matrix board origin mark 28 serves as the origin of subsequent difference hole positioning. That is, since the difference point hole mark on the matrix board is assigned using the matrix board origin mark 28 as the coordinate origin, for example, when the coordinates of the pin insertion / removal difference hole are given as (m, n) from the control device, the posture control is performed. Mechanism 1 is arrow AR8
As shown by, first, the mark is transferred in the + X direction along the horizontal line difference point guide pattern 24 until m marks 28 'are detected. Thereafter, as shown by an arrow AR9, the attitude control mechanism 1 is transferred along the vertical difference guide pattern 25 until n marks 29 are detected in the -Y direction, and a difference hole mark indicating a desired position of the difference hole 212 is obtained. Is detected, positioning is performed according to a difference point position detection method described in detail later.

FIG. 2 (c) shows a second embodiment of the difference point guide pattern, where 213 is a reflectance reference pattern, 24 is a horizontal line, 25 is a vertical line, 212 is a difference hole, 29 is a difference mark, and 27v is a vertical line. A number mark, 27h is a horizontal line number mark, 28u is an upper origin mark, and 28d is a lower origin mark.

In the second embodiment of the grid-like difference point guide pattern manufactured by utilizing the printed board technology, the wide area at the center in the Y direction of the difference point guide pattern is a reflectance reference pattern 213.
This is a target area when moving between matrix boards at high speed and a start area for precise positioning control. The reason why this area is provided at the center in the Y direction of the difference point guide pattern is that the joint (not shown) of the link line connector is located at this part, which is a waste area where the difference point cannot be arranged, and that the vertical precision positioning control is performed. The average moving distance at the time can be shortened by half compared with the difference point guide pattern type in which the precise positioning control start area is arranged at the end of the matrix board, and the speed can be increased. The second feature of the difference point guide pattern is that a vertical line number mark 27v at the center of the vertical pattern and a horizontal line number mark 27h at the end point of the horizontal pattern are provided in order to assign a vertical and horizontal two-dimensional absolute address to each difference hole 212. Is that the binary address information is buried. Therefore, for example, the difference address located at the position where the vertical and horizontal lines intersect can be specified as (Xi, Yj) by the vertical and horizontal line numbers. Here, Xi (i = 1,..., N) and Yj (j = 1,.
The maximum value n, m of m) is equal to the total number of vertical and horizontal lines on the matrix board. The address information of the difference point is indispensable information for high reliability of pin insertion and removal, such as confirmation of an insertion difference point at the time of insertion of a connection pin and search for an incorrectly inserted connection pin.

The difference point guide pattern is formed of a high-reflectance material such as gold plating, and is clearly distinguished from other portions. In the figure, the difference mark section 29 indicating the center of the difference point indicated by a circle and the vertical / horizontal line number marks 27v and 27h indicating the address information are formed by peeling a high-reflectivity material into a circle or the like or applying a non-reflective paint or the like to reflect the material. It is formed so that the rate can be reduced and it can be clearly distinguished optically from the difference point guide pattern.

FIG. 2 (d) shows a third embodiment of the difference point guide pattern, which is different from the second embodiment in that the circled line number mark and the difference point mark are replaced with diagonal marks.
Since the area of the mark portion is increased by oblique lines from the circles, the ratio of the damaged portion to the entire mark area due to a handling error during the manufacture and assembly of the matrix board can be reduced, so that the reliability of the mark pattern can be improved. .

The precise positioning control using the above-described grid-like difference point guide pattern will be described in more detail. In the coarse positioning control, since the transfer control does not use the position signal from the matrix board, the matrix board 2, the transfer mechanism 1, the matrix board 2 and the like (refer to FIG. 1) are processed accurately due to processing and adjustment errors. It is difficult to position it on an arbitrary location above, and it is positioned in a certain limited range (reflectance reference pattern 213) on the matrix board. next,
The pin insertion / extraction mechanism 8 on which the optical sensor 7 is mounted is positioned at the origin 28u or 28d on the matrix board by utilizing the reflectance difference between the currently positioned reflectance reference pattern 213 and the non-difference guide pattern area. Specifically, the transfer mechanism is moved in the + X direction until the reflected light detected by the optical sensor 7 disappears (displaced outside the reflectance reference pattern 213), and at the point where the reflected light disappears, the transfer mechanism is moved to -X. In the direction until reflected light can be detected again. Furthermore, X
A transfer method similar to the direction is applied to the Y direction. these
When the X, Y transfer control is completed, the optical sensor 7 is positioned at the upper right end or the lower right end of the reflectance reference pattern 213. The selection of the upper and lower ends depends on whether the target difference point is below (upper end) or above (lower end) the vertical line number mark 27v. For example, when the target difference point is located above the vertical line number mark 27v, the optical sensor 7 positioned at the lower right end is transferred in the -X direction. Eventually, when the light deviates from the reflectance reference pattern 213 and reaches the lateral difference point guide pattern 24, the relative position error (difference between the center of the difference point guide pattern and the center of the optical sensor) is obtained from the optical sensor 7 having the function described later.
Is detected, the lower origin mark 28d can finally be detected when the transport mechanism is further driven in the -X direction while drive control of the transport mechanism is performed to make this error zero. After detecting this origin mark,
Further, while moving in the −X direction, Xi difference marks are counted. When the number of passing difference points reaches a predetermined value, the transport mechanism is transported in the + Y direction, and the vertical line number is read from the vertical line number mark 27v. The vertical line number read in this manner is compared with the target difference point two-dimensional address X (Xi) received from the host device by the control device, and the pin insertion / extraction mechanism is moved in the X direction according to the excess or deficiency. Then, the correction movement on the horizontal pattern 24 is performed. Since the X address was determined by this correction operation, the pin insertion / extraction mechanism was then moved in the Y direction to move the vertical pattern.
The top 25 is transferred to the target difference Yj. This Y-direction transfer is executed until the count value of the difference mark reaches Yj. After the optical sensor 7 is positioned at the target difference point (Xi, Yj), in order to position the pin insertion / extraction mechanism installed at a physically different position from the optical sensor at the target difference point, a known offset is used. Offset feed for correcting the amount (the distance between the optical sensor and the pin insertion / extraction mechanism) is performed. At the time of transfer to the target difference point on the vertical / horizontal line, a relative position error is detected from the optical sensor 7 and the vertical / horizontal line by a method described later, and the transfer mechanism is drive-controlled in a direction in which the relative position error becomes zero. Details of this drive control method are well known to this kind of trader,
Detailed description is omitted.

The pin is inserted / extracted by the pin inserting / extracting mechanism positioned at the target difference point in this way, and thereafter, it is transferred to the horizontal line number mark 27h on the horizontal pattern in order to confirm the address Y of the insertion / extraction difference point. The Y address information read from the area is compared with the Y address (Yj) of the target two-dimensional addresses received from the host device by the control device, and when they match, an operation end signal is transferred to the host device. . If the address information does not match, return to the difference point where the pin was inserted and removed on the same horizontal pattern, remove the pin when inserting the pin, insert the pin when removing the pin, and return the difference state to the initial state before operation Then, the vertical pattern is transferred again to the reflectance reference pattern 213, and the above-described precision feeding is repeated.

The position detector 7 used in the first and second embodiments of the calibration circuit to be described later to which the present invention is applied emits measurement light and receives reflected light from the difference point guide pattern to detect a state quantity. Because of this method, the main factors of the received light intensity fluctuation are the plating condition fluctuation at the time of creating the difference point guide pattern and the dust adhesion to the guide surface due to long-term use.
This is characteristic deterioration due to long-term use of a semiconductor laser or LED as a light emitting element. Therefore, if the measurement light is emitted to the reflectance reference pattern 213 representing the representative value of the guide pattern reflectance on each matrix board, and the position detector 7 can calibrate so that the detected value of the reflected light becomes a predetermined value, Detection errors can be significantly reduced. Here, the following two methods are disclosed as calibration methods.

FIG. 3 (a) shows a first embodiment of the calibration circuit, in which 30 is a comparison circuit, 31 is a reference value generator, 32 is a light receiving signal amplifier, 33
Is a light emitting element drive current circuit. The first embodiment is a method of adjusting the light emission intensity of the light emitting element so that the detected value of the reflected light becomes a predetermined value. It needs to be adopted. That is, a standard current is applied to the light emitting element from the light emitting element drive current circuit 33, the reflected light a is amplified from the reflectance reference pattern 213 by the light receiving signal amplifier 32,
Input to the input terminal as a b signal. In the comparison circuit 30, in which a predetermined value is input to the B input terminal as the c signal from the reference signal generator 31, the levels of the b and c signals are compared, and the b signal level>
When the signal level is c, the current reduction instruction is issued, and the signal level b is smaller than
When the signal level is at the signal level, a current amplification instruction is input to the light emitting element drive current circuit 33 to adjust the reflected light to be equal to a predetermined value.

FIG. 3B shows a second embodiment of the calibration circuit.
Is a variable gain amplifier. The second embodiment is a method of adjusting the gain of the light receiving signal amplifier so that the emission intensity of the light emitting element is constant and the detected value of the reflected light becomes a predetermined value. That is, the reflected light from the light emitting element is amplified by the variable gain amplifier 34 and input to the A input terminal of the comparison circuit 30 as the b signal. In the comparison circuit 30 in which a predetermined value is input as the c signal from the reference signal generator 31 to the B input terminal, the levels of the b and c signals are compared, and when the level of the b signal> the level of the c signal, a gain reduction command is issued. When the level of the signal b is smaller than the level of the signal c, a gain increase command is input to the gain adjustment terminal of the variable gain amplifier 34 so that the amplified reflected signal is adjusted to be equal to a predetermined value. The same effect as in the second embodiment can also be obtained by using a method of storing the reflected light from the reflectance reference pattern 213 in a memory and normalizing the reflected light from the difference guide pattern when detecting the state quantity from the difference point guide pattern. Needless to say, the present invention includes such variations.

Next, the structure and operation of the position detector 7 shown in FIG. 3 will be described. FIG. 4 (a) shows a first embodiment of the position detector 7, in which 41 is a semiconductor laser, 42 is a collimator lens, 43 is a beam diameter conversion lens, 44 is a beam splitter, 45 is a wave plate, and 46 is half. Mirror, 47 is polarizing beam splitter, 48
Is a first position sensor, 49 is a second position sensor, 410 is an extraordinary ray, 411 is a normal ray, 412 is a reflected ray of a normal ray from a difference point guide pattern, and 413 is a reflected ray of an extraordinary ray from a difference point guide pattern. It is.

4 (b) is an enlarged view of the matrix board 2 (see FIG. 1), FIG. 4 (c) is a detailed view of the first position sensor 48, and 414 to 417 are difference point guide patterns on the matrix board. It is a movement track of the reflected light 412 from 25. 418 is a coordinate axis for explaining FIGS. 4 (b) and 4 (c).

In FIG. 4 (a), the spread light emitted from the semiconductor laser 41 is converted into parallel light by a collimator lens 42, narrowed down to a predetermined beam diameter by a beam diameter conversion lens 43, and is incident on a beam splitter 44. The beam splitter 44 made of a birefringent material such as calcite converts incident light into an extraordinary ray 410 and a normal ray 411.
There is a function to split. The division distance d is determined by the product of the refractive index and the optical path length L. That is, since the refractive index is a unique value of the birefringent material, here, the difference point guide pattern 25 width 2
^The optical path length L is determined so as to be equal to ^1/2 times. The reason why the divided light is inclined 45 degrees with respect to the difference point guide pattern 25 (see the light rays 410 and 411 in FIG. 4B) is that X or Y is obtained from the information on the feeding direction and the position information from the position sensors 48 and 49 described later. This is for detecting a relative position error in the direction (a relative position error between the difference point guide pattern and the attitude control mechanism). Two light beams 410 and 411 equally divided into ^21/2 times the width of the difference point guide pattern 25 irradiated on the matrix board
Is reflected by the difference point guide pattern 25, and is reflected by the half mirror 46.
And enters the polarization beam splitter 47 through the. In the polarization beam splitter 47, the reflected light 413 from the difference point guide pattern of the extraordinary ray is reflected at 90 degrees, and the second position sensor 49
It is led to. Also, the reflected light 412 from the normal light difference point guide pattern passes through the polarizing beam splitter 47, and
To the position sensor 48. In addition, the wavelength plate 45 polarizes the output light from the birefringent material by 45 degrees so that the polarization beam splitter 47 separates the extraordinary ray from the normal ray. In addition, as described in detail in the document "Kurasawa, Yamamoto, Non-scanning type position sensor, O plus E, No. 16, p. 79-87, 1981", the position sensors 48 and 49 are two-dimensional light spots. Position and light intensity can be measured. Therefore, for example, 410a and 411a in FIG.
When the attitude control mechanism is shifted to the right with respect to the difference point guide pattern 25 as shown in FIG. 5, the irradiation area of the abnormal light 410a with respect to the difference point guide pattern 25 becomes
Difference guide pattern
When each reflected light from 25 enters the position sensors 48 and 49, a difference in light intensity is generated, and the direction of the deviation from the polarity of the difference and the magnitude of the deviation from the absolute value can be measured. Further, when the two beams 410, 411 catch the mark in the difference point guide pattern (410b, 411b), the sum of the light intensities incident on the position sensors 48, 49 increases, so that the light of each position sensor 48, 49 increases. The center of the mark can be detected by detecting the maximum value of the sum of the intensities. When the two beams 410 and 411 catch a diagonal mark as shown in the third embodiment of the difference point guide pattern, the sum of the light intensities decreases. Therefore, the minimum value is detected to detect the center of the mark. it can. On the other hand, when the matrix board is tilted, the light spot is shifted from the center of the position sensor as shown in FIG.
The deviation in the Φ and Ψ directions can be detected from the measurement result of the two-dimensional position. Specifically, if the matrix board is displaced in the Φ direction, the position of the reflected light spot from the difference point guide pattern 25 on the position sensor 48 becomes 414 or 4 shown in FIG.
If the matrix board is displaced in the direction of 15 or in the direction of Ψ, the position of the reflected light spot from the difference point guide pattern 25 on the position sensor 48 is shown in FIG. 4 (c) according to the magnitude and direction of the displacement. Since it changes in the direction of 416 or 417,
By detecting the amount of change, the shift in the Ψ direction can be easily detected.

FIG. 5 (a) shows a second embodiment of the position detector 7,
50 is a semiconductor laser, 51 is a collimator lens, 52 is a beam splitter, 53 is a half mirror, 54 is an objective lens, 55 is a convex lens, 56 is a cylindrical lens, 57 is a 6-element, 58 is central light, 59a and 59b are side lights Light, 510 is reflected light of center light from the matrix board 2, 511a and 511b are reflected lights of side light from the matrix board 2, 512 is a focus actuator, 513 is a relative position error actuator, 514
Is an actuator driving coil for focusing, 515 is an actuator driving coil for relative position error, 516 is a bearing for both rotation and thrust, and 517 is a bearing guide.

The coherent light beam emitted from the semiconductor laser 50 is converted into a parallel light beam by a collimator lens 51, and is converted into three light beams (one central light 58 and two side lights 59a, 59b) by a beam splitter 52. Divided. Half mirror 5
The three light beams that travel straight through 3 are applied to the difference point guide pattern on the matrix board 2 via the objective lens 54. The reflected light from the difference point guide pattern incident on the half mirror 53 via the objective lens 54 is guided to the six-segment element 57 via the convex lens 55 and the cylindrical lens 56. In the present embodiment, in order to measure the distance (focal length) between the center lens 58 and the objective lens 54 and the matrix board 2 by an astigmatism method which is well known as a focus measuring technique in an optical disc optical head, A cross-shaped element portion including a convex lens 55, a cylindrical lens 56, and four light receiving elements in the six-segment element 57 is used. In addition, the reflected lights 511a and 511b of the side lights that irradiate both edges of the difference point guide pattern are:
The above-described optical system and the cross-shaped element 571 (the fifth
(See Fig. (B)).
The light is guided to the splitting element 572 (see FIG. 5B), and the direction of the relative position error is detected from the polarity of the difference in the amount of received light between the two elements, and the magnitude of the relative position error is detected from its absolute value. This position detector is a swing type equipped with an actuator 512 that can move the objective lens 54 in the focal direction (up and down movement) and an actuator 513 that can operate in the width direction (rotation) of the difference point guide pattern. Rotating and thrust bearing 516 and bearing guide 517
It consisted of. Therefore, if the above-mentioned focal length signal / relative error signal is coupled to an actuator control circuit described later so as to feed back to the actuator drive coils 514 and 515, an optical sensor that autonomously keeps the focal length constant and makes the relative error zero. Can be configured.

FIG. 5 (b) shows an embodiment of driving the actuator.
519, 520, 522 are adders, 521, 525 are subtractors, 523, 526 are dividers, and 524, 527 are power amplifiers with lag-lead compensators.

The reflected light 510 of the central light from the difference point guide pattern guided to the cross-shaped element 571 by the action of the convex lens 55 and the cylindrical lens 56 corresponds to the distance signal (focus signal) between the objective lens 54 and the matrix board 2. Since the beam shape is a left 45-degree ellipse (front focus), a circle (just focus), and a right 45-degree ellipse (back focus), a light reception signal is compared between two pairs of obliquely opposed elements of the cross-shaped element 571. The beam shape is determined, and the focus state is detected. Specifically, in the case of the shape of the front focus beam indicated by the solid line 510a in FIG. 5C, the output of the adder 519 is larger than the output of the adder 520, so that the output of the subtractor 521 is positive. A focus signal is output. Conversely, the fifth
In the case of the post-focus beam shape indicated by the dotted line 510b in FIG. 9C, the output of the adder 519 is smaller than the output of the adder 520, so that the output of the subtractor 521 outputs a negative focus signal. Further, in the case of the just-focused beam shape indicated by the dashed line 510c in FIG. 5C, since the center light of the same light amount is applied to each of the cross-shaped elements, the output of the adder 519 and the adder The outputs of 520 are equal and the subtractor 52
A zero focus signal is output at the output of 1. The focus signal detected in this way is phase-compensated by the power amplifier 524 with a lag-lead compensator and then current-amplified, so that the distance between the objective lens 54 and the matrix board 2 is constant, that is, the output of the subtractor 521 becomes zero. Feedback is made to the focus actuator drive coil 514 so as to have a just-focused beam shape indicated by a dashed line 510c.

On the other hand, the side lights 511a and 511b guided to the two-segment element 572
Since the area (light intensity) changes according to the relative position error, the relative position error can be detected by subtracting each signal from the two-divided element 572 by the subtractor 525. The magnitude and direction of the relative position error are determined by the magnitude and sign of the signal output from the subtractor 525. Therefore, similarly to the focus control, after the detected relative position error signal is phase-compensated by the power amplifier 527 with a lag lead compensator, the current is amplified, and the relative position error actuator drive coil 515 is energized,
The feedback is performed so that the relative position error between the objective lens 54 and the difference point guide pattern becomes zero. As described above, in the case where the position detector of the second embodiment is used, the optical sensor autonomously controls the difference guide pattern even with respect to the mechanism vibration generated when the transfer mechanism speeds up the precision positioning operation. , The deviation of the vertical / horizontal line can be suppressed to an allowable value or less, and the difference point positioning time can be shortened.

In this embodiment, the light beams 58, 59a, 59b of the position detector 7 are used.
Is a difference mark shown in the second embodiment of the difference guide pattern.
29 (see FIG. 2 (c)), the center beam 58
Since the amount of the reflected light 510 decreases, the center of the difference mark can be detected by detecting the minimum value. Also, the difference mark 29 shown in the third embodiment of the difference guide pattern is used.
Since the center of the difference mark can be detected by the same method even when the image is captured (see FIG. 2D), the description is omitted.

FIG. 6 (a) shows a third embodiment of the position detector 7, in which 61 is a semiconductor laser, 62 is a collimator lens, 63 is a light beam, 64 is a beam splitter, 65 is a difference point guide pattern, and 66 is a coupling. An image lens, 67 is a two-dimensional position detecting photoelectric element (hereinafter referred to as “two-dimensional PSD”), 68 is a condenser lens, and 69 is a one-dimensional position detecting photoelectric element (hereinafter, referred to as “one-dimensional PSD”). Incidentally, 62 may be an aperture lens.

The light beam 63 emitted from the semiconductor laser 61 is applied to a difference point guide pattern 65 provided on the matrix board 2 through a beam splitter 64. The diameter of the irradiation light beam 63 is set by the collimator lens 62 to have a beam diameter substantially equal to the pattern width w of the difference point guide pattern 65 (see FIG. 6B).

The difference point guide pattern 65 irradiated with the light beam 63 is imaged on a two-dimensional PSD 67 via an imaging lens 66, and the two-dimensional P
By processing the output signal from SD67, a relative position error and a difference mark are detected.

FIG. 6C is a diagram showing a light receiving unit of the two-dimensional PSD 67. In the two-dimensional PSD 67, the position of the center of gravity of the received beam 621 (α, β) is (References: Kurasawa, Yamamoto, “Non-scanning position sensor”, O Plus E, pp. 79-87, No. 16, 1
March 981). Here, T _X and T _Y are two-dimensional PSD67, respectively.
X-direction, Y-direction of the beam position signal _{from, X 1, X 2, Y} 1, Y 2
Is an output signal from the two-dimensional PSD 67, and h is an effective light receiving length of the two-dimensional PSD 67.

By utilizing the light receiving beam position detecting function of the two-dimensional PSD 67, a relative position error between the optical sensor and the difference point guide pattern can be detected.

6 (d) to 6 (g) are explanatory diagrams for explaining a method of detecting a relative position error in the present embodiment. Here, the center 63 ′ of the two-dimensional PSD 67 is maintained by the operation of the imaging lens 66 even if the surface of the matrix board 2 is slightly inclined.
Image at 7 '. Further, the position of the center of gravity of the image on the two-dimensional PSD 67 can be known from the beam position signals T _X and T _Y , similarly to the detection of the light receiving beam position shown in Expression (1).

When the relative position error is zero, the difference point guide pattern image on the two-dimensional PSD 67 becomes a circular image 631 (see FIG. 6D), and the center of gravity of the image coincides with the center 67 'of the two-dimensional PSD 67. When the relative position error in the X direction is −ΔX or + ΔX, the half-moon-shaped images 631 ′, 631 ″ (FIG. 6 (e),
(See (f)), and the center of gravity of the image is separated from the center 67 'of the two-dimensional PSD 67 by + ε or -ε. That is, if a relative position error occurs, the image shape on the two-dimensional PSD 67 and the center of gravity of the image change, and as a result, the beam position signal T _X changes (see FIG. 6 (g)). Therefore, the direction of the relative position error can be known from the polarity of the beam position signal T _X , and the magnitude of the error can be known from its absolute value.

In the above description of the detection of the relative position error, FIG.
(F) The method of detecting the relative position error with respect to the difference point guide pattern 65 in the X direction has been described. However, the same method can be used to detect the difference point guide pattern 65 provided in the Y direction. Needless to do.

FIGS. 6H and 6I are explanatory diagrams for explaining the detection of a difference mark in the present embodiment. The detection of the difference mark is based on the sum P (P = X ₁ + X ₂ ) of the received light output signals of the two-dimensional PSD 67.
+ Y ₁ + Y ₂ ).

When a difference mark 641 smaller than the diameter of the light beam 63 formed on the difference guide pattern 65 is irradiated with the light beam 63, a donut-shaped ring image 642 is formed on the two-dimensional PSD 67 (FIG. 6 (h)). . Light beam 63 is applied to the difference guide pattern 65
When the light beam 63 irradiates the difference mark 641, the total sum P of the light reception output signals of the two-dimensional PSD 67 is equal to the light reception output when the difference point guide pattern 65 other than the difference mark 641 is irradiated. Decreases compared to the sum of the signals. Therefore, the center of the difference mark can be detected by detecting the minimum value of the sum P of the light receiving output signals of the two-dimensional PSD 67,
In addition, since the position of the center of gravity of the image on the two-dimensional PSD 67 coincides with the center position of the PSD at the difference mark position, the relative position error detection ability does not decrease due to the presence or absence of the difference mark.

7 (a), 7 (b) and 7 (c), a method of detecting a relative position error and a position of a difference hole using the first embodiment of the difference point guide pattern and the first embodiment of the position detector. The method will be described. FIG. 7A is an enlarged view of the matrix board 2. FIGS. 7B and 7C are schematic diagrams of sensor outputs or calculation results accompanying the movement of the attitude control mechanism 1. FIG.

First, a method of detecting a displacement error when the attitude control mechanism 1 moves in the X direction with respect to the difference point guide pattern 25 as indicated by an arrow AR10 will be described. FIG. 7B is a schematic diagram of each sensor output accompanying the movement of the attitude control mechanism 1 in the X-axis direction. The horizontal axis is the relative position of the beam with respect to the difference point guide pattern 25 shown in FIG. 7A, and the vertical axis is the output of each sensor at each position. Dotted line 70 is the sensor output for abnormal light 410, and solid line 71 is the sensor output for normal light 411. By performing an operation on these output results,
A sum signal 72 and a difference signal 73 of each sensor output as shown in FIG. 7 (c) are obtained. Therefore, when the polarity of the difference signal 73 is positive, the attitude control mechanism 1 can determine that the position is shifted to the left with respect to the center position of the difference point guide pattern 25, and when the polarity is negative, the attitude control mechanism 1 is shifted to the right. Further, by simultaneously measuring the sum signal, it is possible to detect that the attitude control mechanism 1 has deviated from the difference point guide pattern 25 if the level of the sum signal is zero, even if the difference signal is zero. In the detection of the relative position error in the Y direction of the difference point guide patterns 21, 22, 24 in the X direction (see FIG. 2 (a)), similar detection is possible by setting the above moving direction to the Y direction. .

Next, a method for determining the difference hole center position will be disclosed. FIG. 7D is a schematic diagram of each sensor output when the attitude control mechanism 1 moves in the Y direction along the difference guide pattern 25 (see the arrow AR11 in FIG. 7A). In the difference hole position mark portion 29 (see FIG. 2A), convex portions 29a and 29b are formed in accordance with the beam interval between normal light and abnormal light. When this position is scanned by the position detector 7 in the Y direction, the sensor outputs 70 and 71 and the sum signal 74 of the two change from the level L at the position A to a value H which is about twice the level L at the position B. , At the position C again. Accordingly, the sum signal 74 takes a local maximum value at the center position B of the difference hole position mark portion 29, and becomes a characteristic curve similar to a quadratic curve convex upward and symmetrically with respect to the axis 75 passing through the position B. Therefore, three or more combinations of the position data in the Y direction near the position B and the sum signal data at the position are acquired, and stored in a storage circuit or a storage device (not shown) attached to the control device. , The equation of the approximate quadratic curve is determined by quadratic regression analysis. Since the regression analysis has already been described in many specialized books, it will be briefly described here. The set of position data is xi (i is a natural number), and the set of sum signal data at each position is yi. Assuming that the equation of the approximate curve is y = ax ² + bx + c (2) (A, b, c) that minimizes the Q of is obtained from the following normal equation.

From equation (2) of the approximate curve, the position B at which the sum signal is maximum is given by ｛− (b / 2a), so the position shifted by ｛− (b / 2a) from the position where data acquisition started is the difference mark. Can be determined as the center position.

By employing such a method, it is possible to detect a difference hole position with high reliability against a change in reflectance at a local difference mark. In the above description, the same method can be applied to the difference hole position detection in the second and third embodiments of the difference point guide pattern by replacing the maximum value detection with the minimum value detection.

As described above, the position detector 7 of this embodiment detects the relative position error from the difference between the light intensities of the position sensors 48 and 49 (see FIG. 4 (a)). In addition, by controlling the transfer amount in the Y direction, the transfer to the target difference point of the attitude control mechanism along the difference point guide pattern becomes possible. In detecting the relative position error, since the detection sensitivity of the position detector is calibrated using the reflectance reference pattern for each matrix board, highly reliable detection can be performed with respect to the fluctuation of the reflected light intensity. In addition, in the vicinity of the target difference point hole position, the position signal is accumulated while scanning by the position detector, and the difference point center is detected from the accumulated signal, so that the reliability is not affected by the local reflectance variation of the difference point guide pattern. It is possible to detect a difference hole position. Further, the posture in the Φ and 中心 directions is controlled so that the position of the reflected light spot from the difference point guide pattern 25 of the position sensors 48 and 49 is located at the center of the position sensor with respect to the posture control mechanism positioned at the center of the target difference point. The pin insertion / extraction mechanism can be positioned in a direction perpendicular to the surface of the matrix board 2, so that pin insertion / extraction without buckling can be performed.

〔The invention's effect〕

As described above, in the difference point hole positioning control method according to the present invention, the pin insertion / extraction mechanism mounted on the attitude control mechanism is transferred along the difference point guide pattern in the matrix board using the position detector integrated with the pin insertion / extraction mechanism. Therefore, there is no need to process a mechanism for an automatic connection changing device such as a matrix board rack, a transfer mechanism, and a matrix board with high precision as in the related art. As a result, there is an effect that the difference point density can be improved without increasing the apparatus cost.

In addition, with respect to the difference in the reflectance of the difference point guide pattern between the matrix boards and the deterioration of the reflectance due to corrosive gas, dust, etc., the reference reflection signal of each matrix board is used.
Since the relative position error signal can be calibrated, there is an effect that the detection sensitivity fluctuation of the received light signal can be suppressed.

Further, in detecting the center position of the difference mark, the data of the light intensity near the center position can be extracted and the center position can be determined from the characteristic curve, so that it is not affected by local reflectance fluctuation of the difference point guide pattern. Thus, there is an effect that the center position of the difference mark can be detected with high reliability.

[Brief description of the drawings]

FIG. 1 is a schematic view of an automatic connection changer, FIG. 2 (a) is an explanatory view for explaining a first embodiment of a difference guide pattern, and FIG. 2 (b) is a pin insertion / extraction mechanism and a cross section of the difference hole. FIGS. 2 (c) and 2 (d) are explanatory diagrams for explaining the second and third embodiments of the difference point guide pattern, and FIG. 3 is a diagram showing the calibration circuit. 1, an explanatory diagram for explaining the second embodiment, FIG. 4 (a) is an explanatory diagram for explaining the first embodiment of the position detector, and FIG. 4 (b) is an enlargement of the matrix board FIG. 4 (c) is a detailed view of the first position sensor, FIG. 5 (a) is an explanatory view for explaining a second embodiment of the position detector, and FIG. 5 (b) is an actuator. FIG. 5 (c) is an explanatory diagram showing a focus beam shape, and FIGS. 6 (a) and (b) are third embodiments of a position detector. Explanatory diagram for explaining an example, sixth
FIG. 6C is an explanatory diagram for explaining beam position detection on a two-dimensional PSD, FIGS. 6D to 6G are explanatory diagrams for explaining a relative position error detection method, and FIG. h), (i)
Is an explanatory diagram for explaining a method of detecting the difference mark center,
FIG. 7A is an enlarged view of the matrix board, FIG. 7B is an explanatory view for explaining the relationship between the difference point guide pattern, the relative position error of the position detector, and the sensor output, and FIG. 7C. 7 is an explanatory diagram for explaining a relative position error between the difference point guide pattern, the position detector, and a sensor output calculation result; FIG.
FIG. 6D is an explanatory diagram for explaining the relationship between the sensor output and the relative position error between the center of the difference mark and the position detector. DESCRIPTION OF SYMBOLS 1 ... Attitude control mechanism, 2 ... Matrix board, 3 ... Transfer mechanism, 4 ... Lower rail, 5 ... Upper rail, 6 ... Frame, 7 ... Position detector, 8 ... Pin insertion / extraction mechanism, 9 ... Matrix board frame.

Claims (1)

(57) [Claims] 1. A difference hole in which a signal path is formed and eliminated by inserting and removing a conductive pin into and out of the difference hole while reading positional information from a difference guide pattern on a matrix board by a position detector. A positioning control method, comprising: detecting reflection of light applied to a reflectance reference pattern created on a matrix board; scanning a position detector near a difference mark indicating the difference hole position with a position detector; And a step of estimating an extreme value of the accumulated detection signal.