JP2590380Y2 - Chip type variable resistor - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an improvement of a chip type variable resistor in which a resistance value can be arbitrarily adjusted.

[Conventional technology]

Conventionally, this type of chip-type variable resistor is described in, for example, Japanese Patent Application Laid-Open No. 63-296203, and FIGS.
As shown in the figure, on a top surface of a chip-type insulating substrate 1, a resistance film 2 is formed into an arc shape, and an adjusting rotor 4 having a slider 3 that contacts the resistance film 2 is attached to the insulating substrate 1. Is rotatably mounted on a hollow shaft 6 formed from a collector terminal plate 5 disposed on the back surface of the collector terminal plate 5.
Is bent upward along one side surface a of the insulating substrate 1, and a pair of left and right protrusions 1 a and 1 b is integrally formed on the other side surface b of the insulating substrate 1 to form the two protrusions. 1a,
1b, a terminal electrode film on both ends of the resistance film 2
7, 8 are formed.

When automatically mounting the chip-type variable resistor on a printed circuit board by an automatic mounting device, the chip-type variable resistor is mounted on the upper surface of the printed circuit board, and the camera is disposed just above a predetermined mounting position on the printed circuit board. 6, the tip-type variable resistor is positioned by a pair of left and right positioning pieces 9a and 9b as shown by a two-dot chain line in FIG.
By moving the chip-type variable resistor in the X-axis direction in a state where the chip-type variable resistor is sandwiched, the chip-type variable resistor is positioned at a predetermined mounting position along the X-axis direction. By moving the chip-type variable resistor in the Y-axis direction in a state sandwiched by 10a and 10b, the chip-type variable resistor is positioned at a predetermined mounting position along the Y-axis direction. Is soldered to a printed circuit board, and when positioning along the X-axis direction and positioning along the Y-axis direction,
The image photographed by the camera is appropriately processed by a computer to recognize a rectangular silhouette having four side surfaces a, b, c, and d on the insulating substrate 1,
This is performed so that the rectangular silhouette recognized by this image processing is located at a predetermined mounting position.

[Problems to be solved by the invention]

However, in the conventional chip-type variable resistor, one of the four sides a, b, c, d of the insulating substrate 1 has one side a.
The upwardly bent piece 5a partially protrudes from the collector terminal plate 5, and a pair of protrusions 1a and 1b provided with terminal electrode films 7, 8 are relatively high on the other side b. When the rectangular shape on the insulating substrate 1 is recognized by the image processing, it is partially protruded from one side a of the four sides a, b, c, and d. An upwardly bent piece 5 is attached to the projecting collector terminal plate 5.
An error occurs due to both the terminal electrode films 7, 8 and the protruding portions 1a, 1b partially protruding relatively high from the other side surface b.

Accordingly, the chip-type variable resistor is positioned at a predetermined mounting position along the X-axis direction, and the Y-axis is perpendicular to the X-axis.
When positioning at a predetermined mounting position along the axial direction,
Since it is necessary to shift by the amount of the above error, the algorithm of calculation at the time of positioning becomes extremely complicated, and the speed of automatically mounting the chip type variable resistor on the printed circuit board is slow. In addition, there is a problem that not only the cost is increased, but also that the positioning accuracy is reduced.

An object of the present invention is to provide a chip-type variable resistor in a form that does not cause the above-described problem.

[Means for solving the problem]

In order to achieve this object, the present invention provides a method for rotating an adjusting rotor having a slider in contact with an arc-shaped resistive film on an upper surface of an insulating substrate formed in a quadrilateral chip shape in plan view. On the other hand, one of the four side surfaces of the insulating substrate is provided with an upwardly bent piece of a collector terminal plate electrically connected to the adjusting rotor, while the other side is provided with both ends of the resistive film on both sides. A chip-type variable resistor formed by forming a pair of terminal electrode films electrically connected to each other so as to extend from the upper surface to the lower surface of the insulating substrate. A concave portion is provided, and the upward bent piece is inserted into the concave portion, while both terminal electrode films on the other side surface of the insulating substrate are formed in the concave portion provided on the other side surface, or the insulating substrate The two terminal electrode films on the other side surface are formed so as to extend outward to both end portions on the other side surface, and further, on the lower surface of the insulating substrate between the two terminal electrode films, the lower surface and the other A recess from the side is provided. "

[Actions and effects of the invention]

As described above, a concave portion is provided at a position corresponding to the upwardly bent piece in the collector terminal plate on one side surface of the insulating substrate, and the upwardly bent piece is inserted into the concave portion,
The two terminal electrode films on the other side of the insulating substrate are formed in the recesses provided on the other side, or the two terminal electrode films are formed so as to extend outward to both ends on the other side. Thereby, the upward bent piece and both terminal electrode films do not protrude from one side surface and the other side surface of the insulating substrate, or the protrusion dimensions are reduced, and the four side surfaces of the insulating substrate are , A straight line or a shape close to a straight line.

For this reason, when the chip-type variable resistor is automatically mounted on the printed circuit board by the automatic mounting device, when the chip-type variable resistor is photographed by a camera disposed thereabove, the insulating substrate is Since it is extremely easy, accurate and reliable to recognize a rectangular silhouette having four side surfaces in the above, the chip type variable resistor is positioned at a predetermined mounting position along the X-axis direction, and The algorithm for positioning at a predetermined mounting position along the Y-axis direction perpendicular to the axial direction is simplified.

Therefore, according to the present invention, the speed of automatically mounting the chip-type variable resistor accurately at the predetermined mounting position on the printed circuit board can be improved, the cost can be reliably reduced, and the positioning accuracy can be improved. It has an effect that can be greatly improved.

〔Example〕

Hereinafter, an embodiment of the present invention will be described with reference to the drawings (FIGS. 1 to 4).

In the figure, reference numeral 11 denotes a chip-type insulating substrate having a through hole 12 substantially at the center, and a resistive film 13 is formed on the upper surface of the insulating substrate 11 in an arc shape centering on the through hole 12. ing.

Reference numeral 14 denotes a collector terminal plate having an upwardly bent piece 15 at one end, and the collector terminal plate is disposed so as to be in close contact with the lower surface of the insulating substrate 11, and the collector terminal plate 11, The hollow shaft 16 fitted in the through hole 12 in the insulating substrate 11 is integrally formed.

Reference numeral 17 denotes an adjusting rotor provided with a slider 18 that contacts the resistive film 13, and the rotor 17 is connected to the hollow shaft.
After being fitted to the tip of the hollow shaft 16, the hollow shaft 16 is rotatably mounted by caulking and widening the tip.

In addition, while one of the four side surfaces a, b, c, and d of the insulating substrate 11 has the upwardly bent piece 15 of the collector terminal plate 14 on one side surface a, the other side surface b opposite to the one side surface a The terminal electrode films 19 and 20 with respect to both ends of the resistance film 13
To form

Then, a concave portion 21 is provided at a position corresponding to the upward bent piece 15 on one side surface of the insulating substrate 11, and the concave portion 21 is provided.
In the inside, the upward bent piece 15 is inserted, and the other side surface b of the insulating substrate 11 is provided with recesses 22 and 23 at corresponding portions of the terminal electrode films 19 and 20, and the recesses 22 and 23 are provided. Within 23,
The configuration is such that both terminal electrode films 19 and 20 are formed.

As described above, the recess 21 is provided at a position corresponding to the upward bent piece 15 of the collector terminal plate 14 on one side surface a of the insulating substrate 11, and the upward bent piece 15 is inserted into the recess 21. On the other side b of the insulating substrate 11, recesses 22 and 23 are provided at locations corresponding to the two terminal electrode films 19 and 20, respectively, and the two terminal electrode films 19 and 20 are formed in the two recesses 22 and 23. By doing so, the upward bent piece 15 and both terminal electrode films 19, 20
May not protrude from one side a and the other side b of the insulating substrate 11 or may have a reduced protruding dimension.
In plan view, four sides of the insulating substrate 11
a, b, c, d are in a straight line or a form close to a straight line.

Further, on the lower surface of the insulating substrate 11, the two-terminal electrode film is provided.
Depressions 24, 25, 26 from the lower surface and the other side surface b are provided in a portion between 19, 20 and an outer portion of both terminal electrode films 19, 20, and both ends of each of these depressions are provided. Sub-electrode films 19, 20
When the chip type variable resistor is mounted on the printed board by soldering, one of the two terminal electrode films 19 and 20 is provided on the printed board. Molten solder when soldering
This is for preventing flow along the other side surface b in the direction of the other terminal electrode film 20 in FIG.

Incidentally, a portion between the two terminal electrode films 19 and 20 on the other side surface b of the insulating substrate 11 may be provided with a depression as shown by a two-dot chain line 27. Reference numerals 28 and 29 denote cutting burrs when the collector terminal plate 14 is cut off from the lead frame.

FIG. 5 shows another embodiment. In this embodiment, when the two terminal electrode films 19 and 20 are formed on the other side face b of the insulating substrate 11, the two terminal electrode films 19 and 20 are formed. ,
20 is configured to extend outward to the left and right ends of the other side surface b of the insulating substrate 11, in other words, to the corners of the other side surface b and the left and right side surfaces c and d. With such a configuration, the four side surfaces a, b, c, and d of the insulating substrate 11 have a straight line or a shape close to a straight line.

In this embodiment, the insulating substrate 11
In the lower surface in the portion between the two terminal electrode films 19 and 20, a recess 24 from the lower surface and the other side surface b is provided, and the other side surface b of the insulating substrate 11 is provided. Alternatively, a configuration may be adopted in which a depression is provided as shown by a two-dot chain line 27.

[Brief description of the drawings]

1 to 5 show an embodiment of the present invention, and FIG.
FIG. 2 is a bottom view of FIG. 1, FIG. 3 is a sectional view taken along line III-III of FIG. 1, FIG. 4 is a side view of IV-IV of FIG. 1, and FIG. 6 is a plan view of a conventional chip-type variable resistor, FIG. 7 is a bottom view of the conventional chip-type variable resistor, and FIG. 8 is a view taken along line VII-VII of FIG. It is sectional drawing. 11 ... insulating substrate, 12 ... through-hole, 13 ... resistive film, 14 ...
Collector terminal plate, 15 ... bent-up piece, 16 ... hollow shaft,
17 ... Rotor, 18 ... Slider, 19,20 ... Terminal electrode film, 2
1,22,23 …… Concave, a, b, c, d …… Side of insulating substrate, 24 ……
Depressed part.

────────────────────────────────────────────────── (5) References JP-A-60-175406 (JP, A) JP-A-2-45607 (JP, U) JP-A-58-7706 (JP, U) (58) Survey Field (Int.Cl. ⁶ , DB name) H01C 10/00

Claims (2)

(57) [Scope of request for utility model registration] 1. An adjusting rotor having a slider contacting an arc-shaped resistive film on an upper surface of an insulating substrate formed in the shape of a quadrilateral chip in a plan view so as to be rotatable. On one of the four sides of the board,
An upwardly bent piece of a collector terminal plate electrically connected to the adjusting rotor is provided, and a pair of terminal electrode films electrically connected to both ends of the resistive film are provided on the other side from the upper surface of the insulating substrate. In a chip-type variable resistor formed so as to extend to a lower surface, a concave portion is provided at a corresponding portion of the upward bent piece on one side surface of the insulating substrate, and the upward bent piece is inserted into the concave portion. On the other hand, both terminal electrode films on the other side surface of the insulating substrate are formed in recesses provided on the other side surface, and further, in the portion of the lower surface of the insulating substrate between the two terminal electrode films, the lower surface and the lower surface are formed. A chip-type variable resistor provided with a recess from another side. 2. An adjusting rotor having a slider which comes into contact with an arc-shaped resistive film on the upper surface is provided on an upper surface of an insulating substrate formed in the shape of a quadrilateral chip in a plan view so as to be rotatable. On one of the four sides of the board,
An upwardly bent piece of a collector terminal plate electrically connected to the adjusting rotor is provided, and a pair of terminal electrode films electrically connected to both ends of the resistive film are provided on the other side from the upper surface of the insulating substrate. In a chip-type variable resistor formed so as to extend to a lower surface, a concave portion is provided at a corresponding portion of the upward bent piece on one side surface of the insulating substrate, and the upward bent piece is inserted into the concave portion. On the other hand, both terminal electrode films on the other side surface of the insulating substrate are formed so as to extend outward to both end portions of the other side surface, and further, a portion of the lower surface of the insulating substrate between the two terminal electrode films. A chip-type variable resistor provided with a concave portion from the lower surface and the other side surface.