JP2586791Y2 - Cooling device for electronic equipment housing - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a housing for an electronic device, and more particularly to a cooling device for a housing of an electronic device for releasing heat generated by an electronic device housed inside the housing to the outside of the housing.

[0002]

2. Description of the Related Art FIG. 5 is an external view of a conventional electronic device housing 1, and FIG. 6 is a cross-sectional view of the electronic device housing 1 taken along a dashed line and viewed from the direction of arrow C. As shown in the figure, in an electronic device housing 1 that houses a large number of electronic devices,
Each electronic device is housed in the chassis 2.
Then, each chassis 2 is spaced apart from each other at a certain interval,
Also, the electronic device housing 1 is housed so as to protrude toward the front of the front surface 3a. An exhaust window 4 is formed at an upper position on the back surface 3b of the electronic device housing 1, and an exhaust fan 5 is fitted and fixed to the exhaust window 4.

When the exhaust fan 5 is driven, outside air 6 flows into the electronic device 1 through a gap between the chassis 2. Then, the heat generated by the electronic devices housed in the chassis 2 is absorbed in the process of flowing through the gap between the chassis 2 and the inside of the chassis 2, and is turned into hot air 7 by the exhaust fan 5 to the outside from the exhaust window 4. Exhausted.

[0004]

However, the cooling device for the housing of an electronic device shown in FIGS. 5 and 6 has the following problems to be improved. Usually, in a factory or the like, many electronic device housings 1 are installed in a small room. In addition, a passage is provided in front of the front surface 3a of the electronic device housing 1 so that a monitor can monitor each electronic device while patrol. The rear faces 3b are arranged to face each other with a short gap.

As a result, as shown in FIG. 6, the exhaust windows 4 on the back surface 3b of each electronic device housing 1 face each other via a narrow gap. Therefore, the hot air 7 discharged from the exhaust window 4 on the other side collides with each other, and the hot air 7 is not efficiently exhausted to the outside.

Therefore, the cooling efficiencies are reduced.
In order to solve such a problem, it is necessary to change the exhaust fan 5 to one having an unnecessarily large output or to relocate the electronic device housing 1 so as to widen the gap between the back surfaces 3b. is there.

However, when the output of the exhaust fan 5 is increased, not only does the manufacturing cost of the entire electronic device housing 1 rise, but also the partner increases the output of the exhaust fan 5, so that the effects of the mutually increased outputs are offset. There are concerns that will be.

[0008] Further, if the gap between the electronic device housings 1 is set to be large, there arises a problem that the required area of a room in which a large number of electronic device housings 1 need to be installed increases. The present invention has been made in view of such circumstances, and a ceiling window is formed on an upper wall, and a rotating duct that can rotate upward is attached to the skylight, so that, for example, electronic device housings can be connected to each other. Even if the gap is narrowed, the exhausted hot air can be prevented from colliding with each other beforehand, and even if a small output exhaust fan is used, a sufficient cooling effect can be obtained, and Provided is a cooling device for an electronic device housing that can improve the reliability of each of the stored electronic devices, reduce the manufacturing cost, and reduce the installation area when installing a large number of electronic device housings. Aim.

[0009]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a cooling device for an electronic equipment housing which discharges heat generated by the electronic equipment in the electronic equipment housing containing the electronic equipment to the outside. A skylight formed on the upper wall of the housing of the electronic device, a rotation duct rotatably mounted on one edge of the skylight, and a free end mounted on the free end of the rotation duct to remove heat from the outside. An exhaust fan to be discharged to the vertical wall adjacent to the upper wall, a vertical window formed at a position facing the exhaust fan in a state where the rotating duct is rotated and the skylight is closed, and the vertical window is selectively formed. And a shutter that closes the shutter.

[0010]

In the cooling device for an electronic device housing configured as described above, a rotating duct that can rotate upward is attached to one edge of the skylight, and an exhaust fan is attached to a free end of the rotating duct. Have been. A vertical window is formed on a vertical wall adjacent to the skylight. If the exhaust fan is driven in a state where the rotating duct is rotated upward, the hot air in the electronic device housing is exhausted above the electronic device housing.

When the exhaust fan is driven in a state where the shutter is opened and the rotating duct is rotated downward to a position where the skylight is closed, the hot air in the electronic equipment housing is directed to the vertical wall of the electronic equipment housing. Air is exhausted from the perforated vertical window in the horizontal direction with respect to the electronic device housing.

Therefore, when the two electronic device housings are arranged back to back or next to each other, the turning duct of one electronic device housing is turned upward, and the turning duct of the other electronic device housing is turned up. Are set in the horizontal direction, that is, in a state in which the skylight is closed, and the exhaust fans are respectively driven, so that hot air exhausted from each other is prevented from directly colliding. Therefore, the cooling efficiency in each electronic device housing can be improved.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. FIG. 2 is an external view of the electronic device housing of the embodiment, and FIG.
FIGS. 3A and 3B are cross-sectional views of the electronic device housing shown in FIG.

A plurality of chassis 12 are arranged in the substantially rectangular parallelepiped electronic device housing 10 so as to be spaced apart from each other at a predetermined interval and to project in front of the front surface 13a of the electronic device housing 10. It is stored.

A rectangular skylight 15 is formed at a position adjacent to a rear wall 13b as a vertical wall of the upper wall 14 of the electronic device housing 1. One end of a rotating duct 16 is attached to one edge of the front side of the skylight 15 so as to be rotatable upward. The upper plate 16a of the rotating duct 16 has substantially the same shape as the skylight 15, and the pair of side plates 16b on both sides have a substantially right triangular shape. Three exhaust fans 18 are mounted on the free end side of the rotating duct 16.

A rectangular vertical window 19 is formed at the upper end of the rear wall 13b of the electronic device housing 10. The vertical window 19 can be closed by a shutter 20 slidably mounted on the inner surface of the rear wall 13b.

When the rotating duct 16 is rotated upward with respect to the upper wall 14 as shown in FIG. 1B, the exhaust fan 18 faces obliquely upward. Also, as shown in FIG. 1A, the upper plate 16a of the rotating duct 16 is
5 is rotated downward to the closing position.
8 faces the vertical window 19 formed in the back wall 13b.

When the exhaust fan 18 is driven in the state shown in FIG. 1A in the cooling device for the electronic device housing 10 having the above-described configuration, the outside air 21 flows from the gap between the chassis 12 to the electronic device housing 10. Flows into the interior. Then, the inflowing outside air 21 absorbs heat generated by the electronic devices housed in the chassis 12 in the process of flowing through the gap between the chassis 12 and the inside of the chassis 12 to become hot air 22,
The air is exhausted in the horizontal direction from a vertical window 18 provided on the rear wall 13 b by an exhaust fan 18 via a rotating duct 16.

When the exhaust fan 18 is driven with the rotating duct 16 shown in FIG. 1B being rotated upward,
The hot air 22 in the electronic device housing 10 is exhausted obliquely upward by the exhaust fan 18 via the rotating duct 16.

A method for setting each of the rotating ducts 16 and each of the shutters 20 when a plurality of electronic device housings 10 having such a configuration are installed adjacent to each other will be described with reference to FIGS. FIG. 3 is an external view showing a state in which a plurality of electronic device housings 10 are arranged back to back. FIG. 4 is a cross-sectional view of each electronic device housing 10 cut along a dashed line and viewed from the direction of arrow A. FIG.

As described above, when a plurality of electronic device housings 10 are arranged back to back, the rotating duct 16 of one electronic device housing 10 is turned upward,
In addition, the vertical window 19 is closed by the shutter 20.
Then, the rotation duct 16 of the other electronic device housing 10 is turned downward to close the skylight 15 with the upper plate 16a, and the shutter 20 is lowered to open the vertical window 19.

When each exhaust fan 18 of each electronic device housing 10 is driven in such a state, one of the electronic device housings 10 is driven.
The hot air 22 in the inside is exhausted obliquely upward and the hot air 22 in the other electronic device housing 10 is exhausted horizontally from the vertical window 19. Therefore, it is possible to prevent the hot air 22 exhausted from both electronic device housings 10 from colliding with each other.

Further, since the vertical window 19 of the electronic device housing 10 on the side where the rotating duct 16 is turned upward is closed by the shutter 20, the air is exhausted from the vertical window 19 of the adjacent electronic device housing 10. The hot air 22 that has been removed is
It does not flow into zero.

As described above, even if the electronic device housings 10 are arranged at a small interval, the cooling efficiency of each electronic device housing 10 does not decrease. Therefore,
It is not necessary to increase the output of the exhaust fan as in the case of a conventional electronic device housing, or to dispose the electronic device housings 10 with sufficient separation.

The present invention is not limited to the above embodiment. In the embodiment, the turning direction of the turning duct 16 is directed toward the rear wall 13b.
It may be directed to the left and right sides as viewed from 3a. in this case,
It is necessary to provide a vertical window on each side wall.

[0026]

As described above, according to the present invention, a skylight is formed on an upper wall, and a rotating duct that can rotate upward is attached to the skylight. Therefore, even if the electronic device housings are arranged with a narrow gap between them, it is possible to prevent the exhausted hot air from colliding with each other, and it is sufficient even if a small output fan is used. A cooling effect can be obtained, the reliability of each electronic device housed in the electronic device housing can be improved, the manufacturing cost can be reduced, and the installation area when installing a large number of electronic device housings can be reduced.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a schematic configuration of an electronic device housing in which a cooling device according to an embodiment of the present invention is incorporated.

FIG. 2 is an external view of the electronic device housing of the embodiment.

FIG. 3 is an external view showing a state in which a plurality of electronic device housings are installed.

FIG. 4 is a cross-sectional view showing a flow of hot air in each electronic device housing when the electronic device housings of the plurality of embodiments are installed.

FIG. 5 is an external view showing a state in which a plurality of conventional electronic device housings are installed.

FIG. 6 is a cross-sectional view showing a flow of hot air in each electronic device housing when a plurality of the conventional electronic device housings are installed.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Electronic device housing, 12 ... Chassis, 13a ... Front, 13b ... Back wall, 14 ... Top wall, 15 ... Skylight, 16 ...
Rotating duct, 18 ... exhaust fan, 19 ... vertical window, 20 ...
Shutter, 21 ... Outside air, 22 ... Hot air.

Claims (1)

(57) [Scope of request for utility model registration] 1. A cooling device for an electronic device housing, in which the electronic device generates heat to the outside in the electronic device housing in which the electronic device is stored, comprising: a skylight formed on an upper wall of the electronic device housing; A rotating duct mounted on one edge of the skylight so as to be rotatable upward, an exhaust fan mounted on a free end of the rotating duct, and discharging the heat to the outside, and adjacent to the upper wall. A vertical wall formed in a position facing the exhaust fan in a state in which the rotating duct is rotated to close the skylight window, and a shutter for selectively closing the vertical window. A cooling device for an electronic device housing, characterized in that: