JP2583585B2 - Method for manufacturing semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a semiconductor chip, in which at least two terminals are connected so as to sandwich the semiconductor chip, and the whole is packaged with a synthetic resin mold part. And a method of manufacturing a semiconductor device.

[Problems to be solved by conventional technology and invention]

Conventionally, this type of semiconductor device is manufactured by a first lead frame A in which one terminal 2 is formed at an appropriate pitch P and a second lead frame A in which the other terminal 3 is formed at an appropriate pitch P, as shown in FIG. First, each terminal 2 in the first lead frame A is used by using two lead frames with the
Next, as shown in FIG. 20, the semiconductor chip 1 is bonded, and then, as shown in FIG. 21, each terminal 3 of the second lead frame B is superimposed on each semiconductor chip 1 and bonded. The entire package is packaged in a synthetic resin mold section 4 and then separated from both lead frames A and B.

However, since this manufacturing method uses two lead frames, in addition to wasteful materials, the terminals 2 and 3 of both the lead frames A and B are bent and deformed during the manufacturing process. As a result, the incidence of defective products is high, and the production cost is significantly increased.

Therefore, Japanese Patent Application Laid-Open No. 62-35549 as a prior art discloses that both frame frames C1, C2 connected to a section bar C4 in a lead frame C as shown in FIG.
The terminal 2 having a long length and the terminal 3 having a short length are formed side by side in a direction perpendicular to the longitudinal direction of the lead frame C, and the semiconductor chip 1 is bonded to the tip of each short terminal 3. After bending the tip of the terminal 2 along the folding line C3 so that the tip of the long terminal 2 overlaps the semiconductor chip 1 at the tip of the short terminal 3, the terminal 2 is folded in the lateral direction, and then the long terminal 2 is bent. The tip of
Bonding to the semiconductor chip 1 is proposed. Reference numeral 4 denotes a synthetic resin mold part.

In addition, this prior art method can reduce material waste because a single lead frame is used, and
During the manufacturing process, there is an advantage that the bending deformation of each of the terminals 2 and 3 is small and the incidence of defective products is low.

However, on the other hand, the length of one terminal 2 of the two terminals 2 and 3 must be increased by the amount of bending the tip of the terminal 2 in a laterally folded shape, which increases the weight of the product semiconductor device. In addition, since the two terminals 2 and 3 are arranged side by side in the horizontal direction in plan view of the product semiconductor device, the width S of the product semiconductor device increases,
This leads to an increase in the size of the semiconductor device.

Moreover, this prior art method requires that the pitch P between each terminal 2, 3 be widened by bending the tip of the long terminal 2 sideways by the dimension that allows the tip of the long terminal 2 to be bent sideways. In addition, the number of products per unit length in the lead frame C is reduced, and in addition to this, a complicated process is required to bend the distal end of the long terminal 2 in the lateral direction so that a complicated process is required. Since the transfer speed must be reduced, the productivity is low, and the reduction in manufacturing cost is still not enough.

An object of the present invention is to provide a method for manufacturing a semiconductor device which solves these problems.

[Means for solving the problem]

To achieve this object, in one lead frame, inwardly protruding terminals are formed on both frame frames connected to each other by section bars, and one terminal of each of the two terminals is formed. Each of the narrow connection pieces are formed, and the semiconductor chip is bonded to the other terminal during the transfer of the lead frame. After being bent so as to come into contact with the semiconductor chip, the connection piece was bonded to the semiconductor chip.

Claim 2 relates to a single lead frame.
Inwardly protruding terminals are formed on both frame frames connected to each other by the section bar, and a semiconductor chip is bonded to each terminal during transfer of the lead frame. By folding a part of one of the frame frames in the longitudinal direction of the lead frame, or by folding a part of the section bar in the width direction of the lead frame, the other terminal is overlapped with the semiconductor chip in the one terminal. Thereafter, the other terminal is bonded to a semiconductor chip.

According to a third aspect of the present invention, in a single lead frame, terminals protruding inward are provided on both frame frames connected to each other by a section bar, and the tips of these terminals overlap in the width direction of the lead frame. During the transfer of the lead frame, the leading ends of the two terminals are bent in the direction of the front surface or the back surface of the lead frame, and a semiconductor chip is inserted between them and bonded.

[Functions and effects of the invention]

With this configuration, the narrow connecting piece formed on one terminal may be bent so as to contact the semiconductor chip bonded to the other terminal, and then bonded to the semiconductor chip. Unlike the prior art, it is not necessary to fold one terminal in a folded direction in the lateral direction, and the pitch between the terminals along the longitudinal direction of the lead frame is narrowed to reduce the product per unit length of the lead frame. In addition to being able to increase the number, the bending and lowering of the narrow connecting piece at one terminal can be extremely easily performed, and the transfer speed of the lead frame can be increased, so that the manufacturing cost of the semiconductor device can be significantly reduced. Since both terminals are not aligned in a horizontal direction as in the prior art but aligned in a plan view of the product semiconductor device, the width of the product semiconductor device is reduced. Together can be reduced, it can be lighter.

In addition, as in claim 2, a part of one of the two frame frames is folded in the longitudinal direction of the lead frame, or a part of the section bar is folded in the width direction of the lead frame. Accordingly, when the other terminal is superimposed on the semiconductor chip bonded to the one terminal and bonded, the one terminal does not need to be folded in the lateral direction as in the prior art, and the longitudinal direction of the lead frame can be reduced. In addition to reducing the pitch between each terminal along the length of the lead frame, the number of products per unit length of the lead frame can be increased, and the folding of a part of the frame or the folding of a section bar can also be performed by the prior art. It is extremely easy to fold the long terminal sideways and fold it up. Since the transfer speed of the frame can be increased, the manufacturing cost of the semiconductor device can be significantly reduced, and both terminals are not aligned in a horizontal direction as in the prior art as in the prior art, but in a straight line. As a result, the width of the product semiconductor device can be reduced and the weight can be reduced.

Furthermore, when the tip portions of both terminals are bent in the direction of the front surface or the back surface of the lead frame and a semiconductor chip is inserted and bonded between the bent portions as in the third embodiment, one of the terminals is bent as in the prior art. There is no need to fold the terminals in the horizontal direction, and the pitch between each terminal along the longitudinal direction of the lead frame can be narrowed to increase the number of products per unit length of the lead frame. The bending of the part can be extremely easily performed as compared with the conventional technique in which the long terminal is folded back in the lateral direction and the transfer speed of the lead frame can be increased, so that the manufacturing cost of the semiconductor device can be greatly reduced. In addition, both terminals are not aligned in the horizontal direction as in the prior art in a plan view of the product semiconductor device, and are in a straight line. , It is possible to reduce the width dimension of a product semiconductor device, it can be lighter.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings. FIGS. 1 to 3 show a first embodiment of the present invention.

1 to 3, reference numeral 10 denotes a long strip-shaped lead frame having an appropriate width L. In the lead frame 10, two frame frames 11, 12 connected to each other by a section bar 13 include: Inwardly protruding terminals 2 and 3 are integrally formed, and one of the two terminals 2 and 3 has
A narrow connecting piece 14 extending along the side surface of the other terminal 3
Each is integrally molded.

In the course of transferring the lead frame 10 in the longitudinal direction, the semiconductor chip 1 is supplied and loaded at the tip of each of the other terminals 3 of the two terminals 2 and 3 as shown in FIG. And bond it to the other terminal 3.
Next, as shown in FIG. 3, the narrow connecting piece 14 of each of the terminals 2 is bent so as to be in contact with the upper surface of the semiconductor chip 1 bonded to each of the other terminals 3. The connection piece 14 having a width is bonded to the semiconductor chip 1, and the whole is formed of a synthetic resin mold part 4.
, And then cut off from the lead frame 10 to manufacture a product semiconductor device.

4 to 7 show a second embodiment of the present invention.

In this embodiment, a narrow connecting piece 15 is formed by engraving a U-shaped cutting line 16 on one terminal 2 and a semiconductor chip 1 is formed on the other terminal 3 as shown in FIG. Is supplied and bonded to the other terminal 3, and then, as shown in FIGS. 6 and 7, the narrow connection piece 15 formed on one terminal 2 is connected to the semiconductor chip on the other terminal 3. 1 is bent so as to be in contact with the upper surface of the first connecting piece.
15 is bonded to the semiconductor chip 1, and
The whole is packaged in a synthetic resin mold section 4 and then cut off from the lead frame 10 to manufacture a product semiconductor device.

8 to 11 show a first embodiment of the present invention.

In this embodiment, the section bars 13 connecting the two frame frames 11 and 12 to each other are arranged at an interval between the plurality of terminals 2 and 3,
Each terminal 2 in one frame frame 11 and each terminal 3 in the other frame frame 12 are arranged side by side in the longitudinal direction of the lead frame 10, and the frame frame 12 is cut into the other frame frame 12. Location 12a and the frame 1
2 is provided with two bending lines 12b and 12c for folding a part of the semiconductor chip 1. As shown in FIG. 9, the semiconductor chip 1 is supplied and mounted on each terminal 2 of one frame 11 as shown in FIG. After bonding to the terminal 2, as shown in FIGS. 10 and 11, the other frame 12 is cut at the cut portion 12 a, and a part of the other frame 12 is cut into two sections. Each terminal 3 on the other frame 12 is folded along the bending lines 12b and 12c to displace the other frame 12 in the longitudinal direction of the lead frame 10 so as to be displaced. The semiconductor device is manufactured by superimposing it on the upper surface of the device 1 and bonding it, packaging the entire product in a synthetic resin mold part 4 and then cutting it off from the lead frame 10. In this case, one of the frames 11 may be folded.

FIGS. 12 to 14 show a second embodiment of the present invention.

In this embodiment, the section bars 13 connecting the two frame frames 11 and 12 to each other are arranged at an interval between the plurality of terminals 2 and 3,
Each terminal 2 of one frame frame 11 and each terminal 3 of the other frame frame 12 are shaped by abutting on the same place, while the section bar 13 is used to fold a part of the section bar 13. Double fold line 13a, 1
When the semiconductor chip 1 is supplied and mounted on each terminal 2 of one of the frame frames 11 and bonded to the terminal 2 as shown in FIG.
As shown in FIG. 13 and FIG. 14, a part of the section bar 13 is folded along the two bending lines 13a and 13b, and the other frame 12 approaches the one frame 11 to form the lead frame 10. By reducing the width dimension from L to L1, each terminal 3 in the other frame 12 is bonded to the upper surface of the semiconductor chip 1 in the one terminal 2 and bonded, and the whole is formed of a synthetic resin mold portion 4. After the package is cut off from the lead frame 10, a product semiconductor device is manufactured.

 15 to 18 show an embodiment according to claim 3.

In this embodiment, each of the terminals 2 and 3 formed from the two frame frames 11 and 12 connected to each other by the section bar 13 has a tip 2a which is overlapped with each other in the width direction of the lead frame 10. , 3a, and these both end portions 2a, 3a are bent toward the back side or the front side of the lead frame 10 as shown in FIGS. 16 and 17, and then, between the front end portions 2a, 3a. As shown in FIG. 18, the semiconductor chip 1 is inserted, bonded to both ends 2a and 3a, and the whole is packaged in a synthetic resin mold part 4, and then cut from the lead frame 10. By releasing, a product semiconductor device is manufactured.

[Brief description of the drawings]

FIGS. 1, 2, and 3 are diagrams showing a first embodiment of the present invention, and FIGS. 4, 5, and 6 are diagrams showing a second embodiment of the present invention. FIG. 7 is a sectional view taken along the line VII-VII in FIG.
FIG. 8, FIG. 9, FIG. 10, and FIG. 10 are views showing the first embodiment of the present invention, FIG. 11 is an enlarged cross-sectional view of FIG. 10 taken along line XI-XI, FIG. FIG. 13 shows a second embodiment of the present invention.
FIG. 14 is an enlarged sectional view taken along the line XIV-XIV of FIG. 13, FIG. 15, FIG. 16 and FIG. 18 are views showing an embodiment according to claim 3, FIG. FIG. 16 is an enlarged sectional view taken along the line XVII-XVII of FIG. 16, and FIGS. 19, 20, 21 and 22 are views showing a conventional method. 1 ... Semiconductor chip, 2,3 ... Terminal, 4 ... Synthetic resin molded part, 10 ... Lead frame, 11,12 ... Frame frame, 13 ... Section bar, 14,15 ... Narrow width Connection piece, 12a: cut portion, 12b, 12c: folding line for folding the frame, 13a, 13b: folding line for folding the section bar.

Claims (3)

(57) [Claims] In one lead frame, inwardly protruding terminals are formed on both frame frames connected to each other by section bars, and one of the two terminals has a narrow width. Each of the connection pieces is formed, and the semiconductor chip is bonded to the other terminal during the transfer of the lead frame. Then, the narrow width at one terminal is bent so that the connection piece contacts the semiconductor chip at the other terminal. A method of manufacturing a semiconductor device, comprising bonding the connection piece to a semiconductor chip. 2. In a single lead frame, terminals protruding inward are respectively formed on both frame frames connected to each other by section bars, and during the transfer of the lead frame,
A semiconductor chip is bonded to each terminal, and then a part of one of the two frame frames is folded in the longitudinal direction of the lead frame, or a part of the section bar is connected to the lead frame. A method for manufacturing a semiconductor device, comprising: folding the semiconductor device in the width direction so that the other terminal overlaps the semiconductor chip in one terminal, and bonding the other terminal to the semiconductor chip. 3. In a single lead frame, terminals protruding inward are provided on both frame frames connected to each other by section bars such that the tips of these two terminals overlap in the width direction of the lead frame. Wherein the front ends of the two terminals are bent in the direction of the front surface or the back surface of the lead frame during the transfer of the lead frame, and a semiconductor chip is inserted and bonded during the bending. Production method.