JP2560908Y2 - Magnetic circuit for sputtering equipment - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a magnetic circuit for a sputtering apparatus mainly used for a sputtering apparatus for producing a thin film.

[0002]

2. Description of the Related Art As shown in a sectional view of a magnetic circuit of a conventional sputtering apparatus, a magnetic circuit in which two permanent magnets are opposed to each other has an opposed disk-shaped permanent magnet magnetized in the thickness direction, as shown in FIG. The magnet 1 and the permanent magnet 2 are opposed to each other with magnetic poles opposite to each other with a gap length L to generate a necessary magnetic field in the gap.

[0003]

Conventionally, this type of magnetic circuit has a magnetic field strength in the gap by determining the demagnetization characteristic of the permanent magnet, the size of the permanent magnet, and the distance between the permanent magnets, that is, the gap length. Is fixed at a certain value, and the distribution of the magnetic field strength in the radial direction shows the magnetic field strength distribution as shown in FIG. 4 and cannot be formed into an arbitrary distribution state or changed during use. There was a problem.

[0004]

SUMMARY OF THE INVENTION In order to eliminate these drawbacks, the present invention divides one or both of two permanent magnets into a plurality of rings in a ring shape, and separates each of the divided permanent magnets into a gap between opposing permanent magnets. Sputtering by adjusting the magnetic field intensity distribution between permanent magnets by changing the position of each permanent magnet by dividing the gap length between two permanent magnets by attaching a mechanism that can move any distance in the direction It is a magnetic circuit for a device.

That is, according to the present invention, one or both permanent magnets of a magnetic circuit in which two permanent magnets of a sputtering apparatus are opposed to each other are divided into a plurality of concentric rings in a ring shape, and the divided permanent magnets are opposed to each other. A movable base is fixed to the back of the divided permanent magnet surface so that it can be moved arbitrarily in the magnet direction, and a female screw is provided at equal intervals on the circumferential center of the movable base fixed for each divided permanent magnet, A guide pin provided with a male screw at the end corresponding to the female screw is attached to the other end with an adjustment bolt and attached via a fixed base, and rotation of the adjustment bolt reduces the strength of the radial magnetic field in the gap between the two permanent magnets. A magnetic circuit for a sputtering apparatus, characterized in that the distribution is adjusted.

[0006]

Since the permanent magnets are annularly divided and the gap length of each of the divided permanent magnets can be changed arbitrarily, the magnetic field strength between the magnets is determined by the difference in the gap length of each magnet. Can be changed, and the magnetic field strength distribution in the radial direction can be arbitrarily changed.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a sectional view showing an example of a magnetic circuit for a sputtering apparatus according to the present invention. In the magnetic circuit for a sputtering device of the present invention, one of the opposed permanent magnets is a permanent magnet 1a,
The permanent magnets 1b and 1c are divided into a plurality of concentric rings like the permanent magnet 1c, and the movable bases 3a, 3b and 3c are bonded and fixed to each of the divided permanent magnets. A male screw is formed on the movable base having female screws formed at four locations, the male screw being aligned with the tip of the guide pin. By rotating the adjustment bolt 6, the movable base 4
Are moved in the direction of the permanent magnets facing each other, and the gap lengths of the permanent magnets 1a, 1b, and 1c and the permanent magnet 2 are separately set, and the gap lengths L ₁ , L ₂ , and L ₃ are set separately. It is configured so that it can be set as follows.
Therefore, the magnetic field strength between the permanent magnets can be changed by the difference in the gap length between the permanent magnets, and the magnetic field strength distribution in the radial direction can be arbitrarily changed.

In general, when the gap length between two permanent magnets is constant, the magnetic field strength distribution in the radial direction at the center of the gap decreases as shown in FIG. Further, when the gap length is reduced, the magnetic field strength increases. Therefore, the magnetic circuit for a sputtering apparatus according to the present invention is used for a sputtering apparatus having a large uniform portion of the radial magnetic field strength as shown in FIG. 2 by reducing the gap length of the outer peripheral portion between the permanent magnets as shown in FIG. It can be a magnetic circuit. In addition, the electrodes of the sputtering apparatus and the sputtering material are arranged on the surface of the two permanent magnets facing each other or in the gap between the two permanent magnets.

Although the magnetic circuit for a sputtering apparatus according to the present invention has been described with an example in which one permanent magnet is divided into three, the permanent magnet may be multi-divided in order to ensure radial uniformity in the gap.

[0010]

As described above, the magnetic circuit for a sputtering apparatus according to the present invention is a magnetic circuit in which two permanent magnets are opposed to each other. By providing a mechanism capable of moving an arbitrary distance in the direction, it is possible to provide a magnetic circuit for a sputtering apparatus capable of arbitrarily and easily changing the magnetic field intensity distribution in the radial direction.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an example of a magnetic circuit for a sputtering apparatus according to the present invention.

FIG. 2 is a characteristic diagram showing a magnetic field strength distribution in a radial direction at a center of a gap of a magnetic circuit for a sputtering apparatus according to the present invention.

FIG. 3 is a cross-sectional view showing a conventional magnetic circuit for a sputtering apparatus of this type.

FIG. 4 is a characteristic diagram showing a magnetic field strength distribution in a radial direction at a center of a gap of the magnetic circuit of FIG. 3;

[Explanation of symbols]

 1, 1a, 1b, 1c Permanent magnet 3a, 3b, 3c Movable base 4 Fixed base 5 Guide pin 6 Adjusting bolt 7 Female screw 8 Male screw

Claims (1)

(57) [Scope of request for utility model registration] 1. A magnetic circuit in which two permanent magnets of a sputtering apparatus are opposed to each other, one or both permanent magnets are concentrically annularly divided into a plurality of rings, and the divided permanent magnets are respectively directed in the direction of the opposed permanent magnets. A movable base is fixed to the back of the divided permanent magnet surface so that it can be moved arbitrarily, and female screws are provided at equal intervals on the peripheral center of the movable base fixed for each of the divided permanent magnets. A guide pin provided with a male screw at the leading end is mounted with an adjustment bolt at the other end via a fixed base, and the rotation of the adjustment bolt adjusts the distribution of the magnetic field strength in the radial direction in the gap between the two permanent magnets. A magnetic circuit for a sputtering apparatus, wherein the magnetic circuit is configured to perform the following.