JP2560611B2 - Protective film and manufacturing method thereof - Google Patents
Protective film and manufacturing method thereofInfo
- Publication number
- JP2560611B2 JP2560611B2 JP5183111A JP18311193A JP2560611B2 JP 2560611 B2 JP2560611 B2 JP 2560611B2 JP 5183111 A JP5183111 A JP 5183111A JP 18311193 A JP18311193 A JP 18311193A JP 2560611 B2 JP2560611 B2 JP 2560611B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- protective film
- paraformaldehyde
- manufacturing
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は、保護膜およびその製造
方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a protective film and a method for producing the same.
【０００２】[0002]
【従来の技術】従来、保護膜として耐熱性ポリイミドな
どが多く用いられている。本発者らはすでに高い耐熱性
を有する低分子であるカリックスアレーンおよび／また
はその誘導体を成膜すること、有機溶剤に対し高い溶解
度を有するメチルカリックスアレーンのアセチル化物を
提案した（特開平４−１５２３２号公報、特開平４−１
２８２５３号公報及び特開平４−１５５３４２号公
報）。2. Description of the Related Art Conventionally, heat resistant polyimide or the like has been widely used as a protective film. The present inventors have already proposed forming a low-molecular-weight calixarene and / or its derivative having a high heat resistance into a film, and proposing an acetylated product of methylcalixarene having a high solubility in an organic solvent (Japanese Patent Application Laid-Open No. Hei 4- No. 15232, Japanese Patent Laid-Open No. 4-1
28253 and JP-A-4-155342).
【０００３】[0003]
【発明が解決しようとする課題】このカリックスアレー
ン膜はクレゾール、パラホルムアルデヒド、酢酸という
極めて安価な原料から収率よく合成され、ポリイミドに
比べて遥かに経済的である。保護膜の成膜には、他に真
空蒸着による方法もあり、緊密な膜が得られるという利
点はあるが、コストはきわめて高くなる。This calixarene film is synthesized in high yield from extremely inexpensive raw materials such as cresol, paraformaldehyde and acetic acid, and is far more economical than polyimide. There is another method for forming the protective film by vacuum vapor deposition, which has the advantage that a dense film can be obtained, but the cost is extremely high.
【０００４】本発明の目的は、容易かつ安価に製造でき
る耐熱性の保護膜と、その製造方法を提供することにあ
る。An object of the present invention is to provide a heat resistant protective film which can be easily and inexpensively manufactured, and a manufacturing method thereof.
【０００５】[0005]
【課題を解決するための手段】本発明によればキシレノ
ールとパラホルムアルデヒドを主成分とする溶液を基板
に塗布し、１４０℃以上に加熱することにより重合を生
じさせて高分子化した保護膜を得ることができる。According to the present invention, a protective film polymerized by applying a solution containing xylenol and paraformaldehyde as main components to a substrate and heating it to 140 ° C. or higher to cause polymerization to occur is provided. Obtainable.
【０００６】[0006]
【作用】古くから知られているように、フェノール類
は、パラホルムアルデヒドと脱水縮合して高分子化す
る。すなわち、フェノール樹脂（ノボラック）として合
成高分子として最も古くから実用化されたものである。
フェノール樹脂は安価に製造てき、高い硬度を持ち、容
易に種々の官能器を導入できるので多様な機能を持たせ
ることができ、また他の材料との組成物としての応用も
広く、今日なお重要な工業材料である。[Function] As has been known for a long time, phenols are polymerized by dehydration condensation with paraformaldehyde. That is, it has been practically used as a phenolic resin (novolak) for the first time as a synthetic polymer.
Phenolic resin can be manufactured at low cost, has high hardness, and can easily introduce various functional units, so it can have various functions, and it is widely applied as a composition with other materials, and it is still important today. It is an industrial material.
【０００７】本発明は、一般に保護膜を形成するさいに
行われるように高分子材料を溶解塗布して成膜するので
はなく、フェノール類とパラホルムアルデヒドという高
分子（フェノール樹脂）の原料モノマを基板上で成膜し
てから反応を行わせて高分子化させるもので、きわめて
容易かつ安価に堅固な膜が形成できる。反応活性部位が
２箇所のフェノール類をもちいれば線状の高分子となる
が、反応活性部位が３箇所あるフェノール類をもちいる
か、あるいは混合してもちいれば重合のさいに三次元網
状構造の不溶性膜を生ずる。According to the present invention, a polymer monomer such as phenols and paraformaldehyde is used as a raw material monomer of a polymer such as phenols and paraformaldehyde, instead of dissolving and coating a polymer material to form a film as in the case of forming a protective film. A film is formed on a substrate and then reacted to polymerize it, and a solid film can be formed extremely easily and inexpensively. A linear polymer will be obtained if two reactive sites are used for phenols, but a three-dimensional network structure will be used during polymerization if phenols with three reactive sites are used or mixed. To give an insoluble film.
【０００８】[0008]
【実施例】次に本発明の実施例について説明する。EXAMPLES Next, examples of the present invention will be described.
【０００９】３，５−キシレノール（３，５−ジメチル
フェノール）１３．５ｇとパラホルムアルデヒド１０ｇ
をジオキサン９４ｇに溶解した。これを０．２μｍフィ
ルターで濾過して均一な組成物を得た。これを例えば素
子が形成されたシリコンウェファに滴下し、スピナで４
００ｒｐｍで５秒、ひきつずき１５００ｒｐｍで６０秒
回転させて塗膜した。さらに窒素雰囲気中で１５０℃で
２時間加熱することにより堅固な膜を得た。13.5 g of 3,5-xylenol (3,5-dimethylphenol) and 10 g of paraformaldehyde
Was dissolved in 94 g of dioxane. This was filtered with a 0.2 μm filter to obtain a uniform composition. Drop this on, for example, a silicon wafer on which the device is formed, and spinner
The coated film was rotated at 00 rpm for 5 seconds and at Hitsukizuki 1500 rpm for 60 seconds. Furthermore, a firm film was obtained by heating at 150 ° C. for 2 hours in a nitrogen atmosphere.
【００１０】図１は基板上に塗膜した加熱前のＤＳＣ
（示差熱分析）の図、図２は１５０℃で２時間加熱後の
ＤＳＣである。図１では１２０℃付近に吸熱のピークが
示され、モノマが反応して高分子化していることがわか
る。また図２では吸熱のピークがなく、重合が完了して
いることがわかる。この膜は３００℃まで安定であっ
た。成膜条件を検討した結果、１４０℃以上で３０分以
上の加熱で安定な膜形成ができることが分った。FIG. 1 shows a DSC coated on a substrate before heating.
FIG. 2 is a DSC after heating at 150 ° C. for 2 hours. In FIG. 1, an endothermic peak is shown at around 120 ° C., and it can be seen that the monomer has reacted and polymerized. Further, in FIG. 2, there is no endothermic peak, and it can be seen that the polymerization is completed. This film was stable up to 300 ° C. As a result of examining the film forming conditions, it was found that a stable film can be formed by heating at 140 ° C. or higher for 30 minutes or longer.
【００１１】以上、実施例は望ましい実施態様をのべた
が、他の実施態様、例えば塗膜はスピンコート法ではな
くディップ法で行う等は当然本発明に含まれるものであ
る。また、塗膜する基板もシリコンウェファに限定され
るものではなく、保護膜の必要な他の金属板等であって
もよく、またもちいるキシレノールも３．５−ジメチル
置換体に限定されるものではない。Although the preferred embodiments have been described in the above examples, other embodiments, such as coating by a dip method instead of a spin coating method, are naturally included in the present invention. Further, the substrate to be coated is not limited to the silicon wafer, but may be another metal plate or the like requiring a protective film, and the xylenol used is also limited to the 3.5-dimethyl substitution product. is not.
【００１２】[0012]
【発明の効果】以上説明したように本発明は、キシレノ
ールとパラホルムアルデヒドを主成分とする溶液をもち
いることにより、容易に堅固な耐熱性の保護膜を製造で
きる。As described above, according to the present invention, by using the solution containing xylenol and paraformaldehyde as the main components, it is possible to easily manufacture a solid heat-resistant protective film.
【００１３】[0013]
【図１】３，５−キシレノールとパラホルムアルデヒド
を主成分とする溶液から成膜した膜の示差熱分析の結果
を示す図。FIG. 1 is a diagram showing the results of differential thermal analysis of a film formed from a solution containing 3,5-xylenol and paraformaldehyde as main components.
【図２】本発明の実施例で得られた膜を窒素中で１５０
℃２時間処理した後の示差熱分析の結果を示す図。FIG. 2 shows the film obtained in the example of the present invention in a nitrogen atmosphere at 150
The figure which shows the result of the differential thermal analysis after processing at 2 degreeC for 2 hours.
Claims (1)
主とする溶液を基板上に塗布し、１４０℃以上で加熱し
て重合させることを特徴とする保護膜の製造方法。 1. A method for producing a protective film, which comprises coating a solution mainly containing xylenol and paraformaldehyde on a substrate and heating the solution at 140 ° C. or higher to polymerize it.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5183111A JP2560611B2 (en) | 1993-07-26 | 1993-07-26 | Protective film and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5183111A JP2560611B2 (en) | 1993-07-26 | 1993-07-26 | Protective film and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0741534A JPH0741534A (en) | 1995-02-10 |
| JP2560611B2 true JP2560611B2 (en) | 1996-12-04 |
Family
ID=16129973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5183111A Expired - Lifetime JP2560611B2 (en) | 1993-07-26 | 1993-07-26 | Protective film and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2560611B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10217105A (en) * | 1997-02-06 | 1998-08-18 | Speedfam Co Ltd | Work polishing method and device |
| JPH10235552A (en) * | 1997-02-24 | 1998-09-08 | Ebara Corp | Polishing device |
| JP6312229B1 (en) | 2017-06-12 | 2018-04-18 | 信越半導体株式会社 | Polishing method and polishing apparatus |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5448892A (en) * | 1977-09-27 | 1979-04-17 | Matsushita Electric Works Ltd | Preparation of phenolic resin |
| JPH0649784B2 (en) * | 1985-01-28 | 1994-06-29 | 群栄化学工業株式会社 | Film or sheet phenolic resin |
| JP2961742B2 (en) * | 1989-02-23 | 1999-10-12 | ジェイエスアール株式会社 | Method for producing novolak resin |
-
1993
- 1993-07-26 JP JP5183111A patent/JP2560611B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0741534A (en) | 1995-02-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19960723 |