JP2560080B2 - Positioning mechanism for IC carrier mounted socket - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION INDUSTRIAL APPLICABILITY The present invention allows an IC package to be housed and held in an IC carrier,
The present invention relates to an IC positioning mechanism in an IC carrier mounting type socket in which the IC carrier is mounted on an IC socket so that the IC package and the IC socket can come into contact with each other.

Conventional technology Conventionally, in the above IC carrier mounting type socket,
As shown in FIGS. A and B, while the IC package 5 is housed in the IC carrier 3, the contact piece 5a of the IC package 5 is housed and positioned in the slot 3a formed on the carrier surface.
The IC holding claws 8 are engaged with the edges of the IC package 5 to accommodate and hold the IC package 5. Further, a plurality of positioning grooves 4 are provided on the side edges of the IC carrier 3, and the carrier mounting surface side of the other socket 1 is provided. A plurality of positioning pins 2 corresponding to the positioning grooves 4 are provided upright, and the IC carrier 3 for accommodating and holding the IC package 5 is inverted and mounted in the socket 1 to insert the positioning pins 2 into the positioning grooves 4. A lock lever provided on the socket 1 for introducing the contact portion of the contact 6 arranged in the accommodation groove 9 of the socket 1 into the slot 3a of the IC carrier 3 to make contact with the IC contact piece 5a while achieving relative positioning. The IC carrier 3 is engaged with the IC carrier 3 to maintain contact with the union of the two.

Problems to be Solved by the Invention However, the contacts 6 of the IC socket 1 are installed with a gap between the contact accommodating groove 9 and the contacts 6 of the socket 1 in order to smooth the elastic displacement that causes the contact pressure. Therefore, there is a positional error in the contact portion of the contact 6. In addition, since a gap is usually formed between the IC carrier positioning pin 2 of the IC socket 1 and the positioning groove 4 of the IC carrier 3, a positional error occurs and the contact piece 5a of the IC package 5 and the contact 6 of the IC socket 1 are separated from each other. The position error from the contact portion becomes large, and good positioning cannot be performed.

If the gap between the contact accommodating groove 9 and the contact 6 of the socket 1 is reduced in order to reduce the positional error, the elastic displacement that causes the contact pressure of the contact 6 will not be smooth, or the IC carrier positioning pin 2 of the IC socket 1 will become unstable. If the gap between the IC carrier 3 and the positioning groove 4 of the IC carrier 3 is reduced, the IC socket 1 and the IC carrier 3 are difficult to mount.

The present invention is directed to positioning the contacts of the IC carrier and the IC socket in the IC carrier mounting type socket, and by extension,
To ensure the relative position between the contact piece of the IC package held by the IC carrier and the contact of the IC socket so that the above positioning can be achieved more reliably without strict positioning by the slot etc. It was done.

Means for Solving the Problems As a means for solving the above problems, the present invention provides a socket for mounting the IC carrier as described above, wherein
A guide member that adjusts to a corresponding position in association with the mounting of the IC carrier is provided, and the contact of the IC socket is elastically displaced in accordance with the adjustment of the guide member. The IC package held in this) can be properly dealt with.

According to the present invention, when the IC carrier holding the IC package is mounted on the socket, the guide member is adjusted to correspond to the IC carrier, and at the same time, the contact follows the adjustment of the guide member. It is possible to easily obtain a proper correspondence between the contact and the IC carrier, that is, the IC package held by the contact and the IC carrier and the contact piece thereof due to elastic displacement. That is, the IC carrier, the IC package, and the contact held in the socket are interlocked with each other through the guide member, and the guide member is relatively moved to the mounting position of the IC carrier. As described above, the contact can be followed so that the above correspondence can be surely obtained.

Further, the accuracy of the positioning pin positioning groove for positioning the IC carrier and the socket or the accuracy of the accommodating groove for positioning the contact can be implemented by a relatively rough design. It is possible to improve the operability when attaching or detaching the IC carrier to or from the socket in any case,
Even if there is a play between the contact in the IC socket and its housing groove, proper positioning can be achieved by the above method.

Embodiments Embodiments of the present invention will be described in detail below with reference to FIGS. 1 to 6.

11 indicates an IC carrier, and 12 indicates a socket. As shown in FIG. 1B, the IC carrier 11 has an IC accommodating portion 13 that opens at the center of the surface, and the four sides or two sides that define the IC accommodating portion 13 are defined by the four or two sides of the IC package 15. A pedestal (14) for accommodating and supporting a group of IC contact pieces (15a) of each row to be projected is defined. The pedestal 14 is provided with an IC contact piece supporting surface 14a which is substantially equal in width to the row of the IC contact piece 15a and has a flat surface having no slot for accommodating each IC contact piece 15a in the entire width. , At the side walls at both ends of the IC contact piece supporting surface 14a
C Contact piece 15a IC contact piece restricting part 14b that controls the IC contact piece at the end of the group
To form.

Thus, while the IC package 15 is housed (dropped) in the IC housing portion 13, the IC contact piece 15a is supported by the IC contact piece support surface 14a of the pedestal 14 and is provided in the IC housing portion 13 or the peripheral area of the housing portion. The lock member 13 engaged with the peripheral edge of the IC package
The IC package 15 is housed and held in.

In the IC package 15, the IC contact piece 15a is the supporting surface 14a of the pedestal 14 described above.
Is supported with a play so that it can slide a little along the surface of the support surface 14a in the direction in which the contact pieces are arranged,
Alternatively, the position is fixed and supported so that the base 14 can hardly slide on the support surface 14a.

Also, the IC package 15 has a slot as shown in FIG. 1C.
It is also possible to use an IC carrier having 29 and accommodate an IC contact piece so that it can be moved by a small amount in the slot, and mount it on the socket 12 described below.

On the other hand, the socket 12 has a contact 17 arranged so as to correspond to the contact piece 15a of the IC package 15 housed and held in the IC carrier 11, and the IC carrier 11 housing and holding the IC package 15 is inverted to be a socket. When mounted on 12, the contact between the contact 17 and the IC contact piece 15a is obtained.
A contact piece portion of the contact 17, which is elastically displaced, is arranged in the accommodation groove 20, and a free end of the contact 17 projects forward from the accommodation groove 20 and engages with a guide member 26 as described later.

The socket 12 defines a guide member accommodating portion 25 corresponding to the IC accommodating portion 13 of the IC carrier 11, and the guide member accommodating portion 25 is formed.
A guide member (26) is installed in the guide member (25), and the guide member (26) is movably provided in the inner region of the guide member accommodation section (25) so as to fit the IC carrier. For example, as shown in FIG. 3, an engaging leg 32 is provided on the guide member 26, and the engaging leg 32 is loosely engaged with a guide hole 33 formed in the bottom of the guide member accommodating portion 25 of the socket 12. The portion is engaged with the stepped portion of the wall forming the guide hole 33, and the engaging leg 32 is movably coupled in the guide hole 33.

As shown in FIG. 6, the guide member 26 is adjusted by at least one of a lateral movement component in the X-axis direction, a lateral movement component in the Y-axis direction, a rotation component, or a composite component thereof. These adjustment components are set according to conditions such as the case where the IC contact piece 15a is projected from two sides or four sides of the main body of the IC package 15.

Further, the guide member 26 may be subjected to vertical movement (floating / sinking movement) in the Z-axis direction in addition to the lateral movement. In this case, the guide member 26 is moved by combining the lateral movement component and the vertical movement component.

The guide member 26 is provided with a carrier guide portion for restricting the IC carrier 11. As the carrier guide part, for example, the first
As shown in the figure, a plurality of positioning projections 27 are provided to be intervened in the inner peripheral edge of the IC housing portion 13 of the IC carrier 11. The protrusions 27 are provided so as to protrude from the four corners of the IC housing portion 13 of the IC carrier 11 respectively, or two pieces thereof are provided so as to correspond to a pair of diagonal corners of the IC housing portion 13. That is, the protrusion 27 serving as the carrier guide portion is provided so as to project at a position corresponding to a side forming a corner portion of the IC accommodation portion 13, and the IC accommodation portion
Intervene in the inner peripheral edge of 13.

Thus, the protrusion 27 is intervened in the circumferential edge portion of the IC housing portion 13 of the IC carrier 11, and the IC carrier 11 is regulated and positioned by the outer surface of the protrusion 27.

The carrier 27, which is the carrier guide portion, forms an IC housing space 28 in its inner region, and when the IC carrier 11 that holds the IC package 15 is mounted in the socket 12, the inner peripheral edge portion of the IC housing portion 13 of the IC carrier 11 is formed. The guide member 26 is adjusted so as to fit the IC carrier 11 while regulating the inner peripheral edge portion by the outer surface of the protrusion.

At this time, the IC package 15 is placed in the IC housing space 28 in a state of being separated from the surface of the guide member 26, and the IC contact piece 15a is mounted on the contact 17 in a state of floating from the guide member 26. Alternatively, the IC package 15 may be brought into contact with the surface of the guide member 26, and the IC contact piece 15a may be brought into pressure contact with the contact 17 while lowering the guide member 26. In this case the guide member
Numeral 26 is elastically held up and down by a spring member.

The protrusion 27 forming the carrier guide is an IC carrier.
The corner part of the body of the IC package 15 is regulated at the same time
It can be arranged to regulate 15b.

The IC carrier is attached to the lead-in end of the carrier 27, which is the carrier guide section.
An inclined surface 18 or an arcuate surface is formed to guide the introduction of 11 into the accommodating portion 13.

IC carrier 11 holding IC package 15 and guide member 26
The relative position is given by the guiding action of the positioning protrusion 27. That is, the guide member 26 is adjusted in the guide member accommodating portion 25 to be provided with an appropriate relative position with respect to the IC carrier 11 and the IC package 15. Alternatively, at the same time, the IC carrier 11 can be adjusted within a range allowed by the positioning groove 23 and the positioning pin 22 so that the relative position is given.

On the other hand, the guide member 26 has a contact guide portion 30 for elastically displacing the contact 17 following the adjustment of the guide member. For example, the guide portion 30 is shown in FIGS. 1A, 2A, 3 and 4
As shown in the figure, the free end of the elastically displacing contact piece portion arranged in the accommodation groove 20 of the contact 17 is engaged with the contact engagement groove 31 or the same hole formed in the peripheral portion of the guide member 26, By the engagement, the elastic displacement force is applied to the free end forming the contact portion of the contact 17 following the lateral movement or rotation of the guide member 26. IC contact piece at the free end of the contact 17
A contact portion with 15a is provided, and the contact portion is projected from the surface of the guide member 26.

Thus, the IC carrier 11 that holds and holds the IC package 15
Is mounted on the socket 12, the guide member 26 provided on the socket 12 is adjusted by the action of the carrier guide portion provided on the guide member 26 so as to be aligned with the peripheral portion of the IC carrier 11 (translated or rotated). ) At the same time, the contact guide portion 30 provided on the guide member 26 elastically displaces the contact 17 held in the socket 12 in accordance with the above-mentioned adjustment of the guide member 26. As a result, the correspondence between the contact 17 and the IC carrier 11, that is, the contact piece 15a of the IC package 15 held by the contact, can be obtained.

Fig. 4A shows the IC socket before the IC carrier 11 is mounted.
It shows the state of the guide member 26 and the contact 17 of 12,
FIG. 9B shows the state of the IC package 15, the guide member 26, and the contact 17 when the IC carrier 11 is mounted in the proper position from the beginning. In this case, the IC is adjusted without adjusting the guide member 26 and elastically displacing the contact 17.
Correspondence between the contact piece 15a and the contact 17 is obtained.

Further, in FIG. 6C, the IC carrier 11 is displaced and mounted, and
When the IC package 15 is displaced, the IC carrier 11 is mounted in the socket 12 and the guide member 26 is adjusted in the oblique lateral direction by the IC carrier 11, and the contact 17 is elastically displaced by following this. Similarly, FIG. 6D shows a state in which the guide member 26 is similarly adjusted in the rotational direction and following the guide member 26 to elastically displace the contact 17 to obtain the above correspondence.

Further, depending on the implementation, the positioning groove 23 is
On the other hand, a plurality of positioning pins 22 corresponding to the positioning grooves 23 are provided upright on the carrier mounting surface side of the other socket 12, and the IC carrier 11 that holds and holds the IC package 15 is inverted and mounted in the socket 12. The positioning pin 22 is inserted into the positioning groove 23 by means of the above to achieve relative positioning, and the protrusion 27 that forms the carrier guide portion is inserted into the IC carrier.
11, the IC carrier 11 is introduced into the peripheral portion of the IC carrier 11 while directly restricting the IC carrier 11, and the guide member 26 or the guide member 26 and the IC carrier 11 are relatively adjusted to the alignment position and follow the same. The contact 17 of the socket 12 is elastically displaced and introduced into the pedestal 14 or the slot 29 of the IC carrier 11 to obtain contact with the IC contact piece 15a. Lock lever 24 on socket 12
Is rotatably provided, and the lock lever 24 is provided on the IC carrier.
The socket 12 and the IC carrier 11 are brought into engagement with each other to hold the contact between the socket and the IC package.

Since the guide member 26 has a function of positioning the IC carrier 11 and the contact of the IC socket 12, it is possible to save the positioning groove 23 and the like that were conventionally provided in the outer edge portion of the IC carrier 11, thus reducing the size of the IC carrier 11. Can be achieved.

In addition, a positioning hole 34 into which the protrusion 27 is inserted is provided in the corner defining wall portion of the IC housing portion 13 of the IC carrier 11, and the inner surface of the positioning hole is regulated by the protrusion 27 so as to obtain the adjustment. You can The positioning hole is a bottomed hole or a through hole.

EFFECTS OF THE INVENTION Conventionally, when the IC carrier is mounted in the socket, the IC carrier is regulated and positioned by the socket body using the positioning pin and the engaging means of the positioning groove as described above. Even if the carrier can be positioned, it is difficult to sufficiently position the contact between the IC carrier or the IC package held by the carrier and the socket contact.

Thus, in the present invention, in the IC carrier mounting type socket, when the IC carrier holding the IC package is mounted in the socket, the guide member provided in the socket is
At the same time as being adjusted so as to correspond to the IC carrier, the contact is elastically displaced in accordance with the adjustment of the guide member, and the contact and the IC carrier, that is, the contact and the contact piece of the IC package held by the IC carrier, are properly adjusted. Correspondence is easily obtained.

INDUSTRIAL APPLICABILITY The present invention makes it possible to position the IC carrier by using the guide member as a medium so that the contacts of the socket can be made to react with each other so as to match the carrier side irrespective of the positioning error between the socket body and the IC carrier. It is possible to effectively prevent the problem of misalignment of the contact and the IC contact piece as in the conventional IC carrier mounting type socket.

Further, the accuracy of the positioning pin and the positioning groove for positioning the IC carrier and the socket or the accuracy of the groove for positioning and accommodating the contact can be implemented by a relatively rough design, and further, the positioning pin and the positioning groove can be omitted by the implementation. In any case, it is possible to improve the operability when attaching and detaching the IC carrier to the socket.
Even if there is play between the contacts in the socket and its receiving groove, the above method still allows proper contact element correspondence.

[Brief description of drawings]

1A is a perspective view showing an IC carrier mounting type socket according to an embodiment of the present invention in a state before mounting an IC carrier, and FIG. 1B is a plan view of a slotless type IC carrier for accommodating and holding an IC package, FIG. C is a plan view of a slotted type IC carrier, FIG. D is a plan view of an IC package, FIG. E is a plan view showing another example of the IC carrier, and FIG. 2A is a socket of the IC carrier that holds and holds the IC package. FIG. 3B is a perspective view showing the mounted state of the carrier as seen through, FIG. 3B is a plan view of the essential parts showing a state where the IC carrier is installed in the socket, FIG. FIG. 4A is a plan view of the socket before mounting the IC carrier, and FIGS. 4B to 4D are plan views showing a state in which the IC carrier is mounted in the socket with the IC carrier omitted. FIG. 4B shows the IC carrier and the IC. Package suitable for IC socket from the beginning FIG. 6C shows a case where the IC carrier and the IC package are displaced in the IC carrier, and the guide member is adjusted in an oblique direction (horizontal movement). FIG. 5 shows a case where the member is adjusted in the rotational direction, FIG. 5 is a cross-sectional view showing the engaged state of the guide member and the IC carrier, FIG. 6 is a plan view for explaining the adjustment of the guide member, and FIG. FIG. 1 is a perspective view showing a conventional IC carrier mounting type socket before mounting an IC carrier, and FIG. B is a perspective view of an IC carrier on which an IC package can be mounted. 11 …… IC carrier, 12 …… Socket, 13 …… IC housing,
15 …… IC package, 15a …… IC contact piece, 17 …… contact, 25 …… guide member accommodating part, 26 …… guide member, 27 …… positioning protrusion exemplifying carrier guide part, 30 …… contact Information department.

Claims (1)

(57) [Claims] 1. An IC package is held on an IC carrier,
An IC carrier mounting type socket in which the IC carrier is mounted in the socket so that the contact piece of the IC package and the socket contact can be contacted, and the socket is guided to move to the corresponding position in conjunction with the mounting of the IC carrier. An IC carrier, wherein a member is provided, and a contact portion of a contact provided for contact with the IC contact piece is engaged with the guide member so as to elastically displace following the adjustment of the guide member. Positioning mechanism for mounted sockets.