JP2558321Y2 - Electric signal device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an electric signal device, and more particularly to an electric signal device applied to a cable television.

[Conventional technology]

For example, cable television (hereinafter, referred to as CATV) has a large number of channels, and a viewer contracts with a cable television broadcasting station to transmit television signals of the channel to each home. ing. In addition, these many channels include channels that are watched for an additional fee. Normally, for the channel for which the additional fee is to be paid, an electric signal filter (trap filter) is provided on the cable of the CATV to cut off signals in this frequency range. By removing the electric signal filter in response to the payment of the additional charge, the system supplies the channel for paying the additional charge to the home.

FIG. 6 shows an example of a conventional electric signal filter (electric signal device). As shown in FIG. 1, the electric signal filter 1 includes a first substrate 2, a second substrate 3, a shield member 4, a shield case 5, and the like. First
A filter circuit is disposed on each of the second and second substrates 2 and 3, and a signal in a frequency range of a predetermined channel is cut by the filter circuit.

The shield member 4 is composed of the first substrate 2 and the second substrate 3
And the filter circuits disposed on the substrates 2 and 3 are electromagnetically isolated in the shield case 5. Further, the first substrate 2, the second substrate 3, and the shield member 4 are inserted into the shield case 5 in a line-up state.

The shield case 5 has an inner case 5a and an outer case 5b.
The inner case 5a is provided with a female connector 6 for external connection, and the outer case 5b is provided with a male connector 7 respectively.

Conventionally, the shield member 4 has been formed of a single disk-shaped metal plate. The shield member 4 is fixed in the inner case 5a while being electrically connected to the inner case 5a by being soldered to the inner wall of the inner case 5a in a state where the shield member 4 is disposed in the shield case 5. And it was.

[Problems to be solved by the invention]

In the electric signal filter 1 having the above configuration, the shielding member 4
When soldering to the inner wall of the inner case 5a, the first and second
After the inner case 5a is set up so that the opening of the inner case 5a into which the circuit boards 2 and 3 are inserted is positioned above, and the solder cream is applied to the outer peripheral portion of the shield member 4 (boundary portion with the inner case 5a) , Heated soldering is performed.

However, in the conventional electric signal filter 1, since the shield member 4 has a single disk shape, when the shield member 4 is soldered to the inner wall of the inner case 5a, the molten solder is applied to the shield member 4 from the outer peripheral portion. The phenomenon of escape to the center position was observed. Therefore, the amount of solder that actually contributes to the joining between the shield member 4 and the inner case 5a is reduced, and there has been a problem that reliable soldering cannot be performed.

The present invention has been made in view of the above points, and an object of the present invention is to provide an electric signal device capable of reliably joining a shield member and an inner case.

[Means for solving the problem]

In order to solve the above problem, in the present invention, a first substrate provided with a first filter circuit, a second substrate provided with a second filter circuit, and the substrate is inserted at one end side. An inner case having a first hollow portion and one of an input connector and an output connector integrally provided at the other end, and a second hollow portion into which the inner case is inserted at the other end. A cylindrical shield case into which the substrate is inserted, and an outer case in which the other of the input side connector or the output side connector is integrally provided on one end side, the first filter circuit and the first And a shield member having a disc shape so that an outer peripheral portion of the shield member faces the shield case. A tapered portion on an outer peripheral portion facing the Dokesu, is characterized in that the filled solder to the tapered portion was soldered formed by constituting said shield case and said shield member.

[Action]

With the above configuration, when the shield member is soldered to the shield case, the molten solder flows into the tapered portion. Therefore, the solder does not escape to the central portion of the shield member, and the shield member can be securely soldered to the shield case.

Further, the formation of the tapered portion increases the solder bonding area, so that the shield member can be securely soldered to the shield case.

〔Example〕

 Next, an embodiment of the present invention will be described with reference to the drawings.

1 and 2 show an embodiment using an electric signal filter as the electric signal device according to the present invention. In each of the figures, an electric signal filter 10 has a cylindrical input-side case (inner case) 12 constituting a substantially shield case 11 inserted into an output-side case (outer case) 13 and a filter circuit 14 inside the inner case 12. And the shield member 15 are housed.

The filter circuit 14 includes a first filter circuit 16 and a second filter circuit 17. The first filter circuit 16 is provided on a first circuit board 18, and the second filter circuit 17 is provided on a second circuit circuit. It is arranged on the substrate 19. The shield member 15 which is a feature of the present invention is disposed between the circuit boards 18 and 19.

The first and second filter circuits 16 and 17 include coils 20a to 20d
And a LC circuit including a capacitor and the like, and are connected to a printed pattern (not shown) formed on each of the substrates 18 and 19. The coils 20a to 20d have a configuration in which the inductance can be adjusted as described later.

Reference numeral 21 denotes an input side contact, which is a contact portion 21a for holding a connector pin or wire (not shown) inserted into the inner case 12 by a leaf spring action, and bent into an L shape to be soldered to the first circuit board 18. It consists of attached connection pieces 21b. The input side contact 21 is provided in a resin holder 30 attached to the first circuit board 18. Reference numeral 22 denotes an output contact pin, one end of which is soldered to the second circuit board 19 and the other end of which is bent in an L-shape and extends to the output side.

The shield member 15, which is a feature of the present invention, is formed by pressing a conductive metal plate, and includes first and second shield member halves 15a, 15b. Here, FIG. 3 is an enlarged view of the shield member 15, and FIGS. 4 and 5 are enlarged views of the respective shield member halves 15a and 15b.

Each of the first and second shield member halves 15a and 15b has a dish shape, and is formed with notches 23a and 23b and holes 23c and 23d, respectively. The notches 23a and 23b and the holes 23c and 23d are used to connect the first and second circuit boards 18 and 19 to each shield member half 1.
It is formed for positioning and temporarily fixing the substrates 18 and 19 to the respective shield member halves 15a and 15b when attaching them to the 5a and 15b.

Further, the first shield member half 15a has an outer peripheral portion 24a.
In FIG. 3, a tapered portion 25 is formed at a near position (a side different from the side where the second shield member half 15b is attached). Further, a pair of temporary fixing pieces 26a, 26b are formed at predetermined positions of the outer peripheral portion 24a facing the second shield member 15b. The temporary fixing pieces 26a and 26b have small projections 27a and 2 respectively.
7b is formed to project inward.

On the other hand, the second shield member half 15b is selected to have a diameter that can be fitted inside the first shield member half 15a, and is temporarily located at a position facing the above-mentioned temporary fixing pieces 26a, 26b. Stop holes 28a and 28b are formed. These temporary fixing holes 28a, 2
8b constitutes a temporary fixing mechanism for temporarily fixing the pair of shield member halves 15a and 15b together with the temporary fixing pieces 26a and 26b.

First and second shield member halves 15 configured as described above.
The a and 15b are positioned so as to face each other in the state shown in FIG. 3 and then assembled. In a state where the first and second shield member halves 15a and 15b are assembled, each of the temporary fixing pieces 2
6a and 26b fit into the temporary fixing holes 28a and 28b, and the small protrusions 27a and 27b formed on the respective temporary fixing pieces 26a and 26b
The first and second shield member halves 15a and 15b are temporarily fixed by engaging with the peripheral edges of the a and 28b.

After being temporarily fixed, the shield member 15 is disc-shaped (third
(It is clear from the figure), and the first and second shield member halves 15a and 15b can be handled as one member, so that the subsequent assembling work becomes easy. Also,
The temporary fixing operation is a simple operation in which the temporary fixing pieces 26a, 26b and the temporary fixing holes 28a, 28b are positioned, and the respective shield member halves 15a, 15b are pressed from both sides. Further, the temporary fixing mechanism can be integrally formed when the shield member halves 15a and 15b are formed. Therefore, the temporary fixing does not complicate the assembling work.

Further, since the shield member 15 has a structure in which the pair of shield member halves 15a and 15b are combined as described above, the shields of the first filter circuit 16 and the second filter circuit 17 are formed by two shield plates. Is equivalent to For this reason, each of the filter circuits 16 and 17 can be reliably shielded, and interference between the respective filter circuits 16 and 17 can be prevented.

 Returning to FIGS. 1 and 2, the description will be continued.

The electrical connection between the first circuit board 18 and the circuit board 19 is made by a conductor 29. The conductive wire 23 is arranged between the first circuit board 18 and the second circuit board 19 just diagonally. Further, since the shield member 15 has a structure in which the pair of shield member halves 15a and 15b are combined, a space is formed inside. The conductor 29 is wired so as to penetrate the space formed in the shield plate 15, and thus the circuit boards 18 and 19 are electrically connected by the conductor 29.

Subsequently, a procedure for assembling the electric signal filter 10 having the above configuration will be described below.

First, on each of the circuit boards 18 and 19, electronic components such as coils 20a to 20d and capacitors constituting the first and second filter circuits 16 and 17 are arranged, and the conducting wire 23 is connected to each of the circuit boards 18 and 19. (The circuit boards 18 and 19 in this state are in a state before being cut off from the mother board).

When predetermined components are placed on the circuit boards 18 and 19 as described above, dip soldering is performed on the circuit boards 18 and 19, and the electronic components and the conductive wires 23 are connected to the circuit boards 18 and 1.
Soldered to 9. When the dip soldering process is completed,
First and second shield member halves 15a, 15
b is temporarily fixed using a temporary fixing mechanism. Next, circuit boards 18, 19
Are arranged on the first and second shield member halves 15a and 15b which are temporarily fixed and integrated, the resin holder 30 and the input side contact pins 22 are arranged on the circuit boards 18 and 19, and subsequently, respectively by hand. Is carried out.

At this time, a pair of temporary fixing holes 26a, 26b and temporary fixing holes 28a, 2
The formation position of 8b is selected at an oblique position with respect to the circuit boards 18 and 19, and since the temporary fixing pieces 26b and the temporary fixing holes 28b are provided near the wiring pattern of the circuit board 18, the circuit board 18 and the shielding When the member 15 is fixed by soldering, the temporary fixing pieces 26b and the temporary fixing holes 28b can also be soldered at the same time, so that reliable fixing can be performed.

As a result, the first and second circuit boards 18 and 19 are integrated, and the two circuit boards 18 and 19 can be integrally handled in each of the assembling steps performed later, thereby facilitating the assembling work. Can be.

The circuit boards 18, 19 and the shield member 15 integrated as described above are inserted into the inner case 12. At this time, the first and second circuit boards 18 and 19 are connected to the shield member 15 as described above.
, The insertion operation can be easily performed.

When the circuit boards 18 and 19 are inserted into the inner case 12, the shield member 15 and the inner case 12 are subsequently soldered.
This soldering is performed in the following procedure. First, the circuit boards 18, 19
Is inserted through the opening of the inner case 12, and then the inner case 12 is erected so that the opening is located above. Subsequently, in this state, the outer peripheral portion of the shield member 15 (the inner case 12)
The solder cream is applied to the boundary between the inner surface and the inner surface of the device using a jig similar to a syringe. Next, the outer peripheral position near the shield member 15 of the inner case 12 is heated by the high-frequency induction heating device. This melts the solder cream,
The shield member 15 and the inner side surface of the inner case 12 are soldered.

During this soldering, the tapered portion 25 is formed on the outer peripheral portion 24a of the first shield member half 15a as described above. Therefore, when the circuit boards 18 and 19 are inserted, the tapered portion 25 causes a gap between the first shield member half 15a and the inner surface of the inner case 12 (see FIGS. 1 and 2). (Indicated by reference numeral A). As described above, when the soldering process is performed in a state where the gap A is formed, the molten solder is deeply filled in the gap A along the inclined surface of the tapered portion 25. Therefore, at the time of the soldering process, it is possible to prevent the molten solder from escaping to the central portion of the shield member 15 and to form the gap A to increase the bonding area of the solder. Inner case
Soldering with 12 can be performed reliably (note that the solder is indicated by a satin finish in the figure).

On the other hand, at the time of this soldering, the temporary fixing pieces 26a, 26b and the temporary fixing holes 28a, 28b constituting the temporary fixing mechanism are also soldered together, and the first and second shield members 15a, 15b are completely Fixed.

When the soldering of the shield member 15 is completed as described above, the contact pins 22
The cap 31 is attached while passing through each coil, and each coil 20a-20d
After performing the inductance adjustment described above, the inner case 12 is inserted into the outer case 13. Next, the case 12 and 13 are integrated by caulking the vicinity of the opening of the outer case 13, thereby forming the electric signal filter 10.

In the above-described embodiment, the tapered portion 25 is formed over the entire circumference of the first shield member half 15a in order to improve the solder joint surface between the shield member 15 and the inner case 12.
The tapered portion 25 does not necessarily need to be formed all around.
Also, the configuration for forming the gap is not limited to the taper,
Other configurations may be used as long as the configuration is such that soldering is good.

Further, in the above embodiment, the temporary fixing mechanism is changed to the temporary fixing pieces 26a, 26b.
And the temporary fixing holes 28a and 28b, but the temporary fixing mechanism is not limited to this, and any other configuration can be used as long as the first and second shield member halves 15a and 15b can be temporarily fixed. It may be configured.

[Effect of the invention]

As described above, according to the present invention, when the shield member is soldered to the shield case, the molten solder flows into the tapered portion, so that the solder does not escape to the central portion of the shield member, and the tapered portion is removed. Since the formation area increases the solder joint area, the shield member can be securely soldered to the shield case.

[Brief description of the drawings]

1 and 2 are cross-sectional views of an electric signal filter according to an embodiment of the present invention, FIGS. 3 to 5 are enlarged views of a temporary fixing mechanism, and FIG. 6 is a conventional electric signal filter. FIG. 10 …… Electrical signal filter, 11 …… Shield case, 12…
... inner case, 13 ... outer case, 15 ... shield member, 15a ... first shield member half, 15b ... second shield member half, 18 ... first circuit board, 19 ... 2nd circuit board, 25 ... taper part, 26a, 26b ... temporary fixing piece, 27
a, 27b: Small projection, 28a, 28b: Temporary fixing hole.

Claims (1)

(57) [Scope of request for utility model registration] 1. A first substrate provided with a first filter circuit, a second substrate provided with a second filter circuit, and a first hollow portion into which the substrate is inserted at one end. An inner case integrally provided with one of an input connector or an output connector at the other end, and a second hollow portion into which the inner case is inserted at the other end, and an input side at one end. A cylindrical shield case in which the other of the connector and the output-side connector is integrally provided and in which the board is inserted; and between the first filter circuit and the second filter circuit And a shield member having a disk shape so that an outer peripheral portion thereof faces the shield case, wherein a taper portion is provided at an outer peripheral portion of the shield member facing the shield case. form An electrical signal device having a configuration in which the taper portion is filled with solder and the shield member and the shield case are soldered.