JP2550400B2 - Insulating substrate and thermal head using the same - Google Patents
Insulating substrate and thermal head using the sameInfo
- Publication number
- JP2550400B2 JP2550400B2 JP63274829A JP27482988A JP2550400B2 JP 2550400 B2 JP2550400 B2 JP 2550400B2 JP 63274829 A JP63274829 A JP 63274829A JP 27482988 A JP27482988 A JP 27482988A JP 2550400 B2 JP2550400 B2 JP 2550400B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- conductive film
- heat conductive
- thermal head
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【発明の詳細な説明】 産業上の利用分野 本発明は電気絶縁性基板に関し、とくサーマルヘッド
等に用いられる絶縁性基板及びそれを用いたサーマルヘ
ッドに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrically insulating substrate, and more particularly to an insulating substrate used for a thermal head or the like and a thermal head using the same.
従来の技術 従来、電気絶縁性基板としては、アルミナ基板が耐熱
性、電気絶縁性、熱放散性の観点より主として利用され
ている。サーマルヘッド用基板においては、アルミナ基
板の上に、さらにグレーズ層と呼ばれるガラス層を設け
て、サーマルヘッドとしての熱特性、および表面粗さを
小さくすることで、回路パターン精度を向上させてい
る。また、その他の絶縁性基板としては、ホーロ基板等
も提案されているが基板としては、まず寸法精度、基板
の表面性等の点より実用化されていない。2. Description of the Related Art Conventionally, as an electrically insulating substrate, an alumina substrate has been mainly used from the viewpoint of heat resistance, electrical insulation and heat dissipation. In the thermal head substrate, a glass layer called a glaze layer is further provided on the alumina substrate to reduce the thermal characteristics and surface roughness of the thermal head, thereby improving the circuit pattern accuracy. Further, a holo substrate or the like has been proposed as another insulating substrate, but it has not been put into practical use as a substrate in terms of dimensional accuracy, surface properties of the substrate, and the like.
第３図、第４図は，従来のこの種の絶縁基板の断面構
成図で、第３図は、アルミナ基板１上に，グレーズ層９
を形成してなる主にサーマルヘッド用の絶縁基板であ
る。第４図は、金属基材３上にガラス材料４を形成して
なるホーロ基板４′よりなる絶縁基板である。3 and 4 are cross-sectional structural views of a conventional insulating substrate of this type, and FIG. 3 shows a glaze layer 9 on an alumina substrate 1.
Is an insulating substrate mainly for a thermal head. FIG. 4 shows an insulating substrate composed of a hollow substrate 4'formed by forming a glass material 4 on a metal base material 3.
第５図は、第３図の絶縁基板上に金よりなる通電用導
体電極６を形成し，この電極上に酸化ルテニウムとガラ
ス材料等からなる発熱抵抗体７を形成し，さらに耐摩耗
層８を形成した従来のサーマルヘッドの断面構成図であ
る。FIG. 5 shows that a conductive electrode 6 made of gold is formed on the insulating substrate shown in FIG. 3, a heating resistor 7 made of ruthenium oxide and a glass material is formed on the electrode, and a wear resistant layer 8 is formed. FIG. 8 is a cross-sectional configuration diagram of a conventional thermal head in which is formed.
第５図からなるサーマルヘッドにおいて、導体電極に
パルス的に電圧を印可することによって、発熱抵抗体に
電流を通し300〜400℃の高温に発熱させるとともに、電
圧の印加を止めた時は30〜40℃まで降温させ、この上面
部を通過する感熱記録紙を受信信号に合わせて発色さ
せ，文字，図柄などを記録する。In the thermal head shown in FIG. 5, by applying a voltage to the conductor electrodes in a pulsed manner, a current is passed through the heating resistor to generate heat at a high temperature of 300 to 400 ° C., and when the voltage application is stopped, The temperature is lowered to 40 ° C, and the thermosensitive recording paper that passes through this upper surface is colored according to the received signal, and characters, patterns, etc. are recorded.
発明が解決しようとする課題 しかし，この時の発熱体の昇温スピードおよび降温ス
ピードにより印字速度が決定され、この時の過渡特性が
速いほど高速印字が可能である。従来のサーマルヘッド
は、この点で問題を有していた。However, the printing speed is determined by the heating speed and the cooling speed of the heating element at this time, and the faster the transient characteristics at this time, the higher the speed of printing is possible. The conventional thermal head has a problem in this respect.
本発明は上記した従来技術の欠点をなくし，熱特性の
優れた絶縁性基板を提供し、サーマルヘッドにおいて
は、過渡特性に優れた高速印字可能なものを提供するこ
とを目的とする。An object of the present invention is to eliminate the above-mentioned drawbacks of the prior art and to provide an insulating substrate having excellent thermal characteristics, and to provide a thermal head capable of high-speed printing with excellent transient characteristics.
課題を解決するための手段 本発明は、絶縁基板表面上に、熱伝導性膜を形成し、
さらに、前記、熱伝導性膜上に、ガラスセラミッツク層
を形成したものである。Means for Solving the Problems The present invention forms a heat conductive film on the surface of an insulating substrate,
Further, a glass ceramics layer is formed on the heat conductive film.
また、本発明は、絶縁基板表面上に、熱伝導性膜を形
成し、さらに、前記、熱伝導性膜上に、ガラスセラミッ
ツク層を形成し、ついで通電用導体電極および発熱体、
耐摩耗層を形成したことを特徴とするサーマルヘッドで
ある。Further, the present invention, a heat conductive film is formed on the surface of the insulating substrate, further, a glass ceramic layer is formed on the heat conductive film, and then a conductor electrode for conduction and a heating element,
A thermal head is characterized in that a wear resistant layer is formed.
作用 本発明の構成によれば，絶縁基板と熱伝導性膜上に形
成されるガラスセラミック層との熱膨張係数に多少違い
があっても、熱伝導性膜の介在により大きい密着強度が
得られ、特定の材料に限定されない。特に、熱伝導性膜
に金（Au）を用いると金（Au）は、延性展性に富み熱歪
を吸収する働きが大である。また、局部的に熱伝導性膜
を形成し、この熱伝導性膜が導電性膜であれば、この膜
を電極として、電気泳動電着を行い、ガラスセラミック
層を精度よく局部的に形成することも可能であり、各種
多機能の絶縁基板を提供することが可能である。Effect According to the structure of the present invention, even if there is a slight difference in the coefficient of thermal expansion between the insulating substrate and the glass ceramic layer formed on the heat conductive film, greater adhesion strength can be obtained due to the interposition of the heat conductive film. , Not limited to a particular material. In particular, when gold (Au) is used for the heat conductive film, gold (Au) is highly ductile and has a large effect of absorbing thermal strain. Further, if a heat conductive film is locally formed, and this heat conductive film is a conductive film, electrophoretic electrodeposition is performed using this film as an electrode to accurately and locally form the glass ceramic layer. It is also possible to provide various multifunctional insulating substrates.
実施例 以下に、本発明の実施例を図面に基づいて説明する。Embodiment An embodiment of the present invention will be described below with reference to the drawings.
実施例−１ 第１図（ａ），（ｂ）は本発明の一実施例の絶縁基板
の断面構成図である。第１図（ａ）はアルミナ基板１上
に金（Au）からなる熱伝導性膜２をメタル・オルガニッ
ク・ペーストを用いてスクリーン印刷、乾燥、焼成によ
り形成し、さらにガラスセラミック層５をガラスペース
トを用いて熱伝導性膜２と同様な方法で形成した絶縁基
板である。第１図（ｂ）は第１図（ａ）の構成における
アルミナ基板１の代わりにホーロ基板４′上に熱伝導性
膜２およびガラスセラミック層５を形成した絶縁基板の
実施例である。Example-1 FIGS. 1 (a) and 1 (b) are sectional structural views of an insulating substrate according to an example of the present invention. FIG. 1 (a) shows that a heat conductive film 2 made of gold (Au) is formed on an alumina substrate 1 by screen printing, drying and firing using a metal organic paste, and a glass ceramic layer 5 is formed on a glass. This is an insulating substrate formed by using a paste in the same manner as the heat conductive film 2. FIG. 1 (b) is an embodiment of an insulating substrate in which a heat conductive film 2 and a glass ceramic layer 5 are formed on a hollow substrate 4'instead of the alumina substrate 1 in the configuration of FIG. 1 (a).
このように、絶縁基板は、上記のごとくきわめて簡単
に熱伝導性膜を内蔵した特に熱特性に優れた絶縁基板を
製造することが可能である。As described above, as the insulating substrate, as described above, it is possible to manufacture the insulating substrate having the heat conductive film built therein and having particularly excellent thermal characteristics.
実施例−２ 第２図は、実施例１の第１図（ａ）の絶縁基板上に通
電用導体電極６および発熱抵抗体７、耐摩耗層８を形成
したサーマルヘッドの一実施例である。Example-2 FIG. 2 is an example of a thermal head in which a conducting electrode 6 for conduction, a heating resistor 7 and a wear resistant layer 8 are formed on the insulating substrate of FIG. 1 (a) of Example 1. .
なお通電用導体電極は、金のメタルオルガニックペー
ストを印刷、焼成し、さらにホトエッチングすることに
より回路パターンを形成した。また、発熱抵抗体は、Ru
O2を含むガラスフリット系のペーストを印刷、焼成する
ことにより形成し、耐摩耗層はガラスペーストを印刷、
焼成することにより形成した。The conductive conductor electrode was formed by printing a gold metal organic paste, firing it, and then photoetching it to form a circuit pattern. Also, the heating resistor is Ru
It is formed by printing and firing a glass frit-based paste containing O2, and the abrasion-resistant layer is printed with glass paste.
It was formed by firing.
このような構成とした時のサーマルヘッドの熱特性
を、第５図の従来サーマルヘッドと比較するため0.4W/d
ot、1/4duty,16ms/cycleの条件で駆動し感熱紙に印字し
た。本発明のヘッドは、従来のヘッドに較べ同一入力で
印画濃度が1.2〜1.3倍程度高く熱応答性に優れたヘッド
であることがわかった。また、発熱ドットの温度変化を
赤外線顕微鏡で測定した結果、従来のヘッドに較べ極め
て過渡応答に優れており、温度変化の時定数が10〜20％
程度小さかった。In order to compare the thermal characteristics of the thermal head with such a configuration with the conventional thermal head of FIG. 5, 0.4 W / d
Printed on thermal paper by driving under the conditions of ot, 1 / 4duty, 16ms / cycle. It has been found that the head of the present invention has a print density of 1.2 to 1.3 times higher than that of the conventional head with the same input and excellent thermal response. In addition, as a result of measuring the temperature change of the heating dot with an infrared microscope, it has an extremely excellent transient response compared to the conventional head, and the time constant of the temperature change is 10 to 20%.
It was small.
実施例において、熱伝導性膜として、Auを使用して説
明したが、その他の、Ni,Pt,Cr等の熱伝導性膜であって
も良く、特に限定するものではない。本発明の熱伝導性
膜とは、熱伝導性膜を形成する絶縁基板よりも熱伝導性
に優れることが前提であり、その条件内において優れた
効果を発揮するものである。Although Au is used as the heat conductive film in the examples, other heat conductive films such as Ni, Pt, and Cr may be used, and the heat conductive film is not particularly limited. The heat conductive film of the present invention is premised on having higher heat conductivity than the insulating substrate on which the heat conductive film is formed, and exhibits excellent effects under the conditions.
発明の効果 本発明によれば、サーマルヘッドの各発熱ドットの優
れた熱応答性、階調記録性、省電力過を極めて簡便に実
現することができ、低コストで、高速に高品位印字可能
な高信頼性のサーマルヘッドを提供できる。EFFECTS OF THE INVENTION According to the present invention, excellent heat response, gradation recording property, and power saving of each heating dot of a thermal head can be realized very easily, and low cost and high quality printing can be performed at high speed. It is possible to provide a highly reliable thermal head.
第１図は本発明の一実施例の絶縁基板の断面構成図、第
２図、は本発明の一実施例のサーマルヘッドの断面構成
図、第３図、第４図は従来の絶縁基板の断面図、第５図
は従来絶縁基板を用いたサーマルヘッドの断面構成図で
ある。 １……アルミナ基板、２……熱伝導性膜、５……ガラス
セラミック層、６……通電用導体電極、７……発熱抵抗
体、８……耐摩耗層FIG. 1 is a sectional view of an insulating substrate according to an embodiment of the present invention, FIG. 2 is a sectional view of a thermal head according to an embodiment of the present invention, and FIGS. 3 and 4 show conventional insulating substrates. A sectional view and FIG. 5 are sectional structural views of a thermal head using a conventional insulating substrate. DESCRIPTION OF SYMBOLS 1 ... Alumina substrate, 2 ... Thermal conductive film, 5 ... Glass ceramic layer, 6 ... Conducting conductor electrode, 7 ... Heating resistor, 8 ... Wear resistant layer
───────────────────────────────────────────────────── フロントページの続き (72)発明者 吉池 信幸 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (72)発明者 渡辺 善博 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (56)参考文献 特開 昭60−180853（ＪＰ，Ａ) 特開 昭62−109984（ＪＰ，Ａ) 特開 昭62−178359（ＪＰ，Ａ) ─────────────────────────────────────────────────── --- Continuation of the front page (72) Inventor Nobuyuki Yoshiike 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Yoshihiro Watanabe 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. (56) References JP-A-60-180853 (JP, A) JP-A-62-109984 (JP, A) JP-A-62-178359 (JP, A)
Claims (4)
し、さらに、前記、熱伝導性膜上に、ガラスセラミック
層を形成したことを特徴とする絶縁基板。1. An insulating substrate, wherein a heat conductive film is formed on the entire surface of the insulating substrate, and a glass ceramic layer is further formed on the heat conductive film.
とする特許請求の範囲第１項記載の絶縁基板。2. The insulating substrate according to claim 1, wherein the heat conductive film is made of Au.
層を電気泳動電着により形成したことを特徴とする特許
請求の範囲第１項、または第２項記載の絶縁基板。3. The insulating substrate according to claim 1 or 2, wherein the glass ceramic layer formed on the heat conductive film is formed by electrophoretic deposition.
し、さらに、前記、熱伝導性膜上に、ガラスセラミック
層を形成し、ついで通電用導体電極および発熱体、耐摩
耗層を形成したことを特徴とするサーマルヘッド。4. A heat conductive film is formed on the entire surface of an insulating substrate, a glass ceramic layer is further formed on the heat conductive film, and then a current-carrying conductor electrode, a heating element, and a wear-resistant layer are formed. A thermal head characterized by being formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63274829A JP2550400B2 (en) | 1988-10-31 | 1988-10-31 | Insulating substrate and thermal head using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63274829A JP2550400B2 (en) | 1988-10-31 | 1988-10-31 | Insulating substrate and thermal head using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02121851A JPH02121851A (en) | 1990-05-09 |
| JP2550400B2 true JP2550400B2 (en) | 1996-11-06 |
Family
ID=17547155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63274829A Expired - Fee Related JP2550400B2 (en) | 1988-10-31 | 1988-10-31 | Insulating substrate and thermal head using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2550400B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009184272A (en) | 2008-02-07 | 2009-08-20 | Sony Corp | Thermal head, thermal printer and manufacturing method of thermal head |
| JP2009292119A (en) * | 2008-06-09 | 2009-12-17 | Alps Electric Co Ltd | Thermal head |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60180853A (en) * | 1984-02-29 | 1985-09-14 | Fujitsu Ltd | Thermal head |
| JPS62109984A (en) * | 1985-11-08 | 1987-05-21 | Matsushita Electric Ind Co Ltd | Formation of insulating enamel layer |
| JPS62178359A (en) * | 1986-01-31 | 1987-08-05 | Seikosha Co Ltd | Electrothermal recording head |
-
1988
- 1988-10-31 JP JP63274829A patent/JP2550400B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02121851A (en) | 1990-05-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |