JP2544266B2 - Processing method of photosensitive glass - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of exposing and processing photosensitive glass, and more particularly to a processing method including a step of cutting by etching.

[0002]

2. Description of the Related Art Conventionally, a method has been known in which a photosensitive glass is exposed, heat-developed, or subsequently etched. For example, it is shown in a paper "Chemical Cutting Photosensitive Glass" (hereinafter referred to as "Reference 1") by Takashi Matsuura, published on pages 1 to 7 of 1988 No. 11 of Practical Surface Technology. . This method comprises an exposing step of exposing a desired portion of the photosensitive glass with an ultraviolet lamp such as an ultra-high pressure mercury lamp, a heat developing step of heating the photosensitive glass to 500 to 700 ° C. to crystallize the exposed portion, and a crystallizing step. It is a method comprising an etching step of dissolving and removing the converted exposed portion with an etching liquid (hydrofluoric acid solution).

[0003]

As shown in FIG . 20 ,
In the conventional method of exposing the photosensitive glass 14 using an ultraviolet lamp (such as an ultra-high pressure mercury lamp) 13, as will be described later, there is a problem that the exposure time is long, a problem that the straightness is poor and fine processing cannot be performed, and Since the property is poor, there is a problem that the exposure pattern is blurred on the side 14b opposite to the light incident surface 14a.

FIG . 21 shows the spectral distribution of an ultra-high pressure mercury lamp, which is usually called an ultraviolet lamp. According to this, the mercury lamp has a spectral distribution characteristic not only in ultraviolet rays but also in a wide wavelength range. However, according to Reference 1, the exposure sensitivity wavelength range of a photosensitive glass to an ultraviolet light source is usually 24.
It is 0 to 360 nm. That is, when a mercury lamp is used, since the spectrum in the wavelength range of 360 nm or more does not participate in the exposure of the photosensitive glass, most of the irradiation energy is wasted and the exposure efficiency is low. The exposure time becomes longer. Note that Document 1 shows an example in which exposure is performed for 13 minutes using an Hg-Xe lamp. In addition, according to the result of an experiment conducted by the applicant, an ultra-high pressure mercury lamp of 500 W (multi-light II type manufactured by Ushio Inc.)
When the photosensitive glass was exposed with, the exposure for 30 minutes was required.

However, in the exposure process, the photosensitive glass must be processed one by one, and in order to improve the production efficiency, a large number of expensive exposure apparatuses must be prepared or the exposure time must be shortened. I had to do it.

On the other hand, in order to reduce the size of the exposure pattern and improve the blurring of the pattern on the side opposite to the incident side, it is necessary to improve the straightness of the light source. However, if this is done, the brightness of the light source will decrease, and the exposure time will take several times longer, resulting in a significant decrease in production efficiency. As described above, shortening the exposure time is desired in order to expand the application field of the photosensitive glass.

Regarding the limit of fine processing, the applicant of the present invention has disclosed that a semiconductor processing exposure apparatus (Canon mask aligner PLA: ultra-high pressure mercury lamp 2) in which the light source has relatively good straightness.
An experiment was conducted in which the photosensitive glass was exposed for 3 hours using 50 W). The main composition examples of the photosensitive glass used in the experiment at this time are as follows. _{SiO 2: 70~84% Li 2 O} : 5~20% Al 2 O 3: 3~10% CeO 2: 0.01~0.1% Ag: 0.05~0.3% As 2 O 3: 0.1 to 0.3% In addition to the above, in the experiment, Na ₂ O, SnO
₂ , Cu ₂ O, ZnO, K ₂ O, PbO, CaO, Sr
In some cases, minute amounts of substances such as O, BaO, and ZrO ₂ were added.

As a result of such an experiment, the pattern size with an etching depth of 48 μm and a width of about 8 μm was the limit. However, in fields such as inkjet printer heads and micromachining, further fine photosensitivity is desired, and the above-mentioned microfabrication limit caused by poor straightness of the exposure light source is an application of the photosensitive glass to these fields. Is a factor that hinders

Regarding the blurring of the pattern on the back side of the incident light, according to the result of an experiment conducted by the applicant of the present invention, a photosensitive glass having the same composition as described above was used, and a 500 W ultra-high pressure mercury lamp (Ushio Denki Multilight II type) was used. Even when exposure was performed using a device having an improved optical system with improved straightness, a crystal part was formed which spread at an angle of 1.4 degrees with respect to the incident direction. That is, in the photosensitive glass with a plate thickness of 1 mm, 1
A pattern of 00 μm spreads by 24 μm on each side, and spreads to a pattern of 148 μm on the back side where light is incident, which is a practical problem.

Therefore, an object of the present invention is to provide a processing method capable of exposing a thick photosensitive glass with high dimensional accuracy. Another object of the present invention is to provide a processing method capable of efficiently performing exposure and shortening the working time.

[0011]

The method of processing a photosensitive glass according to the present invention is characterized by an exposure step of exposing the photosensitive glass by irradiation with a laser having an oscillation wavelength in the exposure sensitivity wavelength range of the photosensitive glass , near the place to carry out the heat development process of crystallizing the exposed portion, and etching the crystal portion
It An excimer laser is preferably used as this laser. The oscillation wavelength of this laser is specifically within the range of 150 to 400 nm.

In the exposure step, a scanning system in which a thin laser beam is moved with respect to the irradiated area of the photosensitive glass manually or according to a guide curve by a jig or the like,
By using a scanning system that moves according to information generated or stored by an electronic computer or the like, it is possible to irradiate while moving to form an exposure pattern. In addition, in such laser beam exposure, a more complicated exposure pattern can be obtained by repeatedly turning on and off the laser beam irradiation according to the information generated or stored by the electronic computer while moving the laser irradiation device relatively. It is also possible to form.

If the photosensitive glass after exposure is cut in a direction not parallel to the exposure direction and divided into a plurality of parts, the efficiency in obtaining a plurality of members made of the photosensitive glass can be improved.

Further, in the exposure step, when a plurality of laminated photosensitive glasses are exposed at the same time, it is possible to improve the efficiency in processing a large number of photosensitive glasses.

In the exposure step, if the laser irradiation is performed with the photosensitive glass placed in a liquid having a refractive index similar to that of the photosensitive glass, the exposure can be performed with higher accuracy.

By disposing the exposure pattern mask between the photosensitive glass and the laser irradiation optical system in the exposure step, it is possible to efficiently expose a fine shape controlled by the pattern mask size.

In the beam exposure using a fine laser beam as the exposure step, a complicated exposure pattern can be easily formed by using the exposure pattern mask.

[0018]

Embodiments of the present invention will be described below with reference to the drawings. First, a method of manufacturing a photosensitive glass inkjet printer head by a processing method according to the present invention will be described in order of steps with reference to FIGS. First,
As shown in FIG. 1, a photosensitive glass 1 (thickness 1 mm in this embodiment) whose front and back surfaces 1a and 1b are polished is placed on a moving table 2. Then, an XeCl excimer laser beam is emitted from the upper excimer laser oscillator 3. Then, by moving the moving table 2 or scanning the laser beam with a moving device or an optical system (not shown), the entire area of the photosensitive glass 1 to be etched is exposed as shown in FIG.

When the exposure is completed, the photosensitive glass 1 is heated to 50
Heating to a high temperature of 0 to 700 ° C., as shown in FIG.
A heat development step of crystallizing the exposed portion 1c is performed.

Next, the photosensitive glass 1 is etched by showering it with an etching solution composed of a hydrofluoric acid (HF) 5-10% solution. At this time, the amount of etching is changed by changing the time for which the etching liquid is applied depending on the part of the photosensitive glass. As shown in FIG. 4, the ink flow path 1d has a shape in which a part of the flow path is inclined.
To form. In this embodiment, the ink flow paths 1d are provided on both front and back surfaces by performing an etching process on both surfaces of the photosensitive glass 1.

After the flow path substrate 1 made of the photosensitive glass is formed in this manner, the ink flow paths 1d on both front and back surfaces are formed.
The vibrating plate 4 is attached so as to close the sheet, and the piezoelectric element 5 is further provided on the vibrating plate 4 to complete the inkjet printer head shown in FIG. In this printer head, the ink flow path 1d is filled with ink from a supply unit (not shown), and when electric power is supplied to the piezoelectric element 5, the vibration plate 4 is deformed inward and ink in the flow path is removed. It is pressurized and ejects.

In the present invention, the photosensitive glass 1 is exposed using a laser beam as shown in FIG.
The spread of the light emitted from the laser oscillator can be made extremely small, and the light can be made to travel substantially straight. As a result, even if the photosensitive glass 1 is slightly thick, both the light incident surface 1a and the opposite surface 1b are
Exposure can be performed accurately. Therefore, when etching is performed on both sides, it is possible to accurately form the channels having the same shape on both sides.

The spectral distribution of the XeCl excimer laser used in this example is shown in FIG. The oscillation wavelength of this XeCl excimer laser is 308 nm, and the light intensity at other wavelengths is almost zero. That is, there is almost no spectrum other than the light-sensitive region of the photosensitive glass, and all the light emission energy is used for exposing the photosensitive glass. Therefore, the exposure efficiency is high and the work can be shortened. Incidentally, as will be described later, since the laser has a higher light intensity than an ordinary ultraviolet lamp, the exposure sensitivity wavelength range of the photosensitive glass for the laser becomes wider than that for the ultraviolet lamp.
It is in the range of approximately 150 to 400 nm.

In this embodiment, a so-called beam exposure is carried out in which the photosensitive glass 1 is exposed by directly irradiating it with a laser beam having a fine diameter. Laser irradiation may be performed. For example, in the case of an exposure process in which the exposure pattern includes a finer pattern than the laser beam diameter, a lens is used to further narrow the laser beam diameter only in the fine pattern to make it smaller. It is conceivable to change the focal position, but this is an extremely complicated structure. Therefore, by performing laser beam exposure in a state in which a pattern mask corresponding to the fine pattern is arranged on the photosensitive glass, the exposure can be efficiently performed with a simple device.

An example of such an exposure process is shown in FIGS. That is, the transparent portion 15 having the shape of the ink flow path 1d.
An exposure pattern mask 15 including a and a light-shielding portion 15b having a shape other than that is disposed on the photosensitive glass 1, and a laser is applied to the photosensitive glass 1 through the pattern mask 15.
Irradiation. Then, as shown in FIG. 8, the entire transparent portion 15a is scanned and irradiated with a laser beam. Thereafter, similarly to the above-described example, the ink flow path 1d shown in FIG. 4 is formed by the heat development step and the etching step shown in FIG. 3, the vibration plate 4 and the piezoelectric element 5 are fixed, and the ink jet head shown in FIG. To complete.

According to this method, since the light-shielding portion 15b does not transmit the laser beam and the photosensitive glass in that portion is not exposed, extremely fine such as formation of a groove thinner than the laser beam diameter like a nozzle of an ink jet head is formed. It can be processed. Further, by forming the pattern mask 15 with high precision, the processing precision can be improved.

The above-mentioned embodiment using the exposure pattern mask shows an example of beam exposure in which a laser beam is scanned to expose when a range wider than the laser beam diameter is exposed. An example in which the entire area of the exposure pattern mask is exposed at once by expanding the size of the exposure pattern mask to the same extent or more will be described in detail below.

First, a conventional example in such a case is shown in FIG . That is, the light from the mercury lamp 16 is reflected by the elliptical concave mirror 17
Reflected by the first mirror 18 to irradiate the first mirror 18,
The reflected light from 8 is integrated (fly's eye
The second mirror 20 is irradiated through the lens 19 and the reflected light is projected onto the photosensitive glass 23 through the condenser lens 21 and the exposure pattern mask 22 to be exposed. In addition, in this conventional example,
The second mirrors 18 and 20 are for downsizing the optical system of the device.
The integrator 19 is used to make the light intensity uniform, and the condenser lens 21 is used to improve the straightness of light. Since the mercury lamp 16 is also used in this conventional example, as described above, there are problems that the straightness of light is insufficient and the exposure time is long.

On the other hand, the method of processing a photosensitive glass in which fine grooves are formed by etching according to the present invention will be described with reference to FIG.
~ It demonstrates in order of a process based on FIG. As shown in FIG. 9, in the first step, both the front surface 1a and the back surface 1b of the photosensitive glass 1 having a plate thickness of 1 mm are polished, and a XeCl excimer laser oscillator 3 is arranged above it to expose a laser beam to an exposure pattern. The entire surface 1a of the photosensitive glass is irradiated once through the mask 15. Note that the laser oscillator 3 is simply shown here, but in order to spread a narrow laser beam to a size comparable to that of the photosensitive glass, the drawing
An optical system similar to that of the conventional example of No. 22 is built in. The composition of the photosensitive glass is the same as that of the conventional example, and the exposure sensitivity wavelength range of the photosensitive glass is 240 to 360 nm, and the exposure sensitivity wavelength range to the laser light is usually 150 to 400 nm, which is based on the spectral transmittance characteristics by the ultraviolet light source. is there.

The specifications of the used XeCl excimer laser and its oscillator 3 are an oscillation wavelength of 308 nm, an energy intensity per pulse of 80 mJ / cm ² · pulse, a pulse width of 20 nsec, and a repetition frequency of 200 Hz.

As shown in FIG. 10, in the second step, the exposed photosensitive glass 1 is heated to a high temperature of about 500 to 700 ° C. to perform a heat development step of crystallizing the exposed portion 1c.

Next, in the third step, as shown in FIG. 11, the photosensitive glass 1 was crystallized by showering it with an etching solution of a hydrofluoric acid solution of 5 to 10% to perform etching. The exposed portion 1c is dissolved and removed to form a groove portion (ink flow path or the like) 1d.

FIG. 12 shows the relationship between the number of pulses of the XeCl excimer laser (total exposure energy amount) and the etching rate ratio at this time. A single pulse of XeCl excimer laser with an energy intensity of 80 mJ / cm ² per pulse gives an extremely high etching rate ratio of 10 or more, and it is possible to form crystals with a much higher etching rate than the unexposed portion. Recognize.

When photosensitive glass of the same composition was exposed with an ultra-high pressure mercury lamp, an exposure time of about 30 minutes was required to obtain the same etching rate ratio as above, but with the above XeCl excimer laser. , 1 pulse at 200 Hz, the time is 0.005 seconds, which means that the exposure time is shortened to 360,000 times.

Regarding the fine workability, in the case of the conventional ultra-high pressure mercury lamp, the limit of the fine work is about 6 μm, but when the XeCl excimer laser is used for the exposure, the etching work is performed up to a depth of about 10 μm. It was found that a pattern size of 2 μm is possible and is effective for fine processing.

Further, the spread of light can be suppressed to about 0.23 degrees, and when a 100 μm pattern is exposed on a photosensitive glass having a plate thickness of 1 mm, one side is 4 μm.
Is 108 .mu.m on the back side of the light incident. This means that it can be improved to 1/6 that of the conventional ultra-high pressure mercury lamp.

The pattern mask is not limited to the mask in which the light shielding portion is provided on the substrate 15 such as quartz as shown in FIG. 9, and may be a mask in which a patterned hole is formed in the light shielding plate.

Next, a second embodiment of the present invention will be described. In FIG. 13, the block 6 of photosensitive glass having a thickness of about 5 mm is exposed by irradiation with a XeCl laser as in the first embodiment. When exposure is completed,
The block 6 is cut along a cutting line 7 orthogonal to the exposure direction, and divided into small pieces 6a to 6e. For cutting the block 6, a slicing machine or a dicing machine known for cutting a semiconductor wafer is used.
Then, after thermally developing the divided small pieces 6a to 6e, as shown in FIG.
4, the small pieces 6a to 6e are arranged and one surface is covered with the protective member 8, and an etching solution (not shown) is drawn from above in the drawing.
Bathe and etch. When the etching of one surface is completed in this way, the small pieces 6a to 6e are inverted and the other surface is similarly etched. In this way, a plurality of small pieces 6a to 6e having the same processing on the front and back sides are obtained.

According to this, since the exposure process of a large number of plate members 6a to 6e can be performed at the same time, the working efficiency is greatly improved and the working time can be shortened. Then, by simultaneously performing a plurality of etching processes as shown in FIG. 14, the work can be further shortened. In particular, when many small pieces having the same shape are manufactured as in this embodiment, the work is extremely efficient.

Further, the surface of the photosensitive glass is polished in order to normally enter the light at the time of exposure, but conventionally, when manufacturing a plurality of plate members, the surface of each plate member is Although it was necessary to perform the polishing process, according to the present embodiment, only the surface of the block 6 needs to be polished, the number of polishing processes is significantly reduced, and the working efficiency is improved.

FIG. 15 shows an example of performing the exposure process using the exposure pattern mask in this processing method. That is, the pattern mask 1 including the light-transmitting portion 15a and the light-shielding portion 15b is provided on the upper surface of the photosensitive glass block 6.
5 is arranged, and the block 6 is irradiated with laser through the pattern mask 15. The subsequent heat development step and etching step are the same as those in the above example. By performing the exposure process using the pattern mask 15 as described above, extremely fine and precise processing is possible.

The third embodiment shown in FIG. 16 is a method of exposing a plurality of photosensitive glass plates 9a to 9e in a laminated state at a time. This method also shortens the exposure process,
Work efficiency is improved. Further, as shown in FIG. 17, it is also possible to perform an exposure step using the exposure pattern mask 15 to perform precise processing.

Since the laser has extremely good straightness, the second
In the case where the thickness of the photosensitive glass is thick as in the embodiment described above, or when a plurality of photosensitive glass plates are laminated as in the case of the third embodiment, there is almost no spread when light is transmitted through the glass. Accurate exposure can be performed from the upper surface to the lower surface. Therefore, the small pieces 6a to 6e, 9 manufactured according to the second and third embodiments are manufactured.
A to 9e can be etched with high dimensional accuracy.

In the first to third embodiments, the exposure is carried out with the photosensitive glass placed in the air. However, if the photosensitive glass is placed in a liquid having a refractive index close to that of the photosensitive glass, the exposure is carried out. The influence of reflection and refraction of light on the surface of the photosensitive glass is small, and exposure can be performed more accurately.
An example thereof is shown in FIG. According to this, the photosensitive glass (refractive index 1.51117) and a container 10 filled with a liquid 10 having a high light-transmitting property, for example, benzene (refractive index 1.5012), is filled with the photosensitive glass. The plates 12a to 12e are put therein. In this embodiment, each glass plate 12a to 12e is manufactured by using a jig (not shown).
Are laminated at intervals, and the liquid 10 is interposed in the gap. When laser exposure is performed as in the third embodiment, the photosensitive glass plates 12a to 12e are accurately exposed without being affected by the reflection and refraction of light.

The liquid 10 containing the photosensitive glass is
It is sufficient if the light transmittance is high with a refractive index of around 1.5 which is similar to that of photosensitive glass.
Liquids such as 7) and paraffin oil (refractive index 1.48) can be used. Further, in this embodiment, a plurality of photosensitive glass plates are placed in the liquid 10 in a state of being laminated at intervals, but when only one plate member is exposed as in the first embodiment, or Even when the exposure is performed in the block state as in the second embodiment, the precision can be improved by exposing the photosensitive glass in the liquid 10 in this way.

In this case, of course, as shown in FIG. 19, the photosensitive glass plate 12 is exposed through the exposure pattern mask 15.
By performing laser irradiation on a to 12e, finer processing becomes possible.

When the photosensitive glass is exposed by using the laser as in the first to fourth embodiments, the spread of light is extremely small and the processing accuracy is improved. In particular, if the photosensitive glass is irradiated with laser through a pattern mask, more precise processing becomes possible. In addition, efficiency is improved because there is no waste of laser irradiation energy.

An example in which the photosensitive glass is exposed by using another laser beam in the same manner as in the first example will be described below.

As in the embodiment shown in FIG. 9, both sides of a photosensitive glass substrate having a plate thickness of 1 mm were polished, a XeF excimer laser oscillator was placed above the photosensitive glass substrate, and laser light was sensitized through an exposure pattern mask. Irradiate the surface of the glass.

The specifications of the XeF excimer laser and oscillator used were an oscillation wavelength of 351 nm and a pulse width of 20 ns.
ec, energy intensity per pulse 60 mJ / cm
² pulse, a repetition frequency of 200Hz.

After that, the thermal development step and the etching step were carried out in the same manner as in the above-mentioned embodiment. Then, it became possible to obtain a stable etching rate ratio with irradiation of 5 pulses or more. A total energy intensity of 300 mJ / cm ² or more provides stable exposure. The fine workability and straightness were as good as those of the XeCl excimer laser.

The above-mentioned wavelength of 351 nm is usually the relative exposure sensitivity of the photosensitive glass measured using an ultraviolet light source (see FIG. 2 ) .
According to ( 1 ), it is found that the photosensitive glass is provided with a practically sufficient exposure action under the normal use condition of a laser having a strong light energy, although it is outside the exposure sensitivity wavelength range.

Another embodiment in which the photosensitive glass is irradiated with ArF excimer laser light will be described. Both sides of a photosensitive glass substrate having a plate thickness of 1 mm having the same composition as in the above-mentioned example are polished, an ArF excimer laser oscillator is arranged above and laser light is applied to the surface of the photosensitive glass through an exposure pattern mask. . The specifications of the ArF excimer laser and the oscillator used were an oscillation wavelength of 193 nm, a pulse width of 20 nsec, an energy intensity per pulse of 5 mJ / cm ² · pulse, and a repetition frequency of 1 Hz. Then, when the heat development step and the etching step were performed, a stable etching rate ratio was obtained with irradiation of 50 pulses or more.

Although the wavelength of 193 nm is also outside the exposure sensitivity wavelength range ( see FIG. 21 ) of the photosensitive glass measured using the ordinary ultraviolet light source described in Document 1 and the like, It has been found that due to the strong light energy, the photosensitive glass can be provided with a practically sufficient exposure action under the conditions of normal use as a laser. As described above, the exposure sensitivity wavelength range of the photosensitive glass in the above examples is considered to be a wavelength range wider than the exposure sensitivity wavelength range of the photosensitive glass which is usually measured using ultraviolet rays.

From the above experimental results, it can be said that the exposure sensitivity wavelength range of the photosensitive glass by laser light irradiation is in the range of 150 to 400 nm by considering the above examples.

Therefore, it is optimal to use the XeCl excimer laser, but it is also possible to use other excimer lasers such as XeF, ArF, KrF, F ₂ excimer lasers. It is also possible to use an N2 laser. Further, it is also possible to use a light source in which the fundamental oscillation wavelength light of an Nd ⁺ : YAG laser, a dye laser, a Kr ion laser, an Ar ion laser or a copper vapor laser is converted into an ultraviolet wavelength by a non-linear optical element or the like.

[0057]

As described above, according to the present invention, by using a laser, the spread of light at the time of exposing the photosensitive glass becomes extremely small, the processing accuracy is improved, and the irradiation energy is not wasted, so that the efficiency is improved. Will get better.
In addition, since it is possible to accurately expose even thick photosensitive glass, block-shaped photosensitive glass can be divided after exposure,
By exposing a plurality of photosensitive glasses in a laminated state at a time, a large number of photosensitive glass members can be efficiently manufactured in a short time.

When the exposure step is carried out in a state where the photosensitive glass is placed in a liquid having a refractive index similar to that of the photosensitive glass, the influence of light reflection and refraction is small, so that the exposure can be performed more accurately.

[Brief description of drawings]

FIG. 1 is a front view showing an exposure process of a first embodiment of the present invention.

FIG. 2 is a front view of the photosensitive glass at the end of the exposure process shown in FIG.

FIG. 3 is a front view of the photosensitive glass in the heat development step.

FIG. 4 is a sectional view of the photosensitive glass after the etching process.

FIG. 5 is a cross-sectional view of an inkjet printer head manufactured using photosensitive glass.

FIG. 6 Spectral distribution map of xenon chloride excimer laser

FIG. 7 is a front view showing an exposure process using an exposure pattern mask in the first embodiment.

8 is a front view of the photosensitive glass at the end of the exposure process shown in FIG.

FIG. 9 is a front view showing another example of the exposure process using the exposure pattern mask in the first embodiment.

10 is a front view of the photosensitive glass shown in FIG. 9 after a heat development step.

11 is a front view of the photosensitive glass shown in FIG. 9 after an etching process.

FIG. 12 is a diagram showing the relationship between the total exposure energy amount and the etching rate ratio in the first embodiment.

FIG. 13 is a front view showing an exposure process of the second embodiment of the present invention.

FIG. 14 is a reduced front view showing the etching process of the second embodiment.

FIG. 15 is a front view showing an exposure process using an exposure pattern mask in the second embodiment.

FIG. 16 is a front view showing an exposure process of the third embodiment of the present invention.

FIG. 17 is a front view showing an exposure process using an exposure pattern mask in the third embodiment.

FIG. 18 is a front view showing an exposure process according to the fourth embodiment of the present invention.

FIG. 19 is a front view showing an exposure process using an exposure pattern mask in the fourth embodiment.

FIG. 20 is a front view showing a first example of a conventional exposure process.

FIG. 21: Spectral distribution map of mercury lamp

FIG. 22 is a front view showing a second example of a conventional exposure process.

[Explanation of symbols]

1 Photosensitive glass 1c Exposure part 3 Laser oscillator 6 Photosensitive glass 9a, 9b, 9c, 9d, 9e Photosensitive glass 10 Liquid 12a, 12b, 12c, 12d, 12e Photosensitive glass 15 Exposure pattern mask

 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Nobuhiro Kondo 4-1-1 Taihei, Sumida-ku, Tokyo Stock Company Seikosha (72) Inventor Hirokazu Ono 4-1-1 Taihei, Sumida-ku, Tokyo Stock Company Inside the Seikosha (72) Inventor Tomoaki Takahashi 4-1-1 Taihei, Sumida-ku, Tokyo Inside Seikosha Co., Ltd. (72) Inventor Chief Takahashi 4-1-1 Tahira, Sumida-ku, Tokyo Inside Seikosha Co., Ltd. (72) Inventor Toshio Matsumura 4-1-1 Taihei 4-chome, Sumida-ku, Tokyo Jin Misaki, Inspector, Seikosha Co., Ltd. (56) Reference JP 62-183981 (JP, A) JP 54-106524 ( JP, A)

Claims (8)

(57) [Claims] 1. A photosensitive glass is irradiated with a laser having an oscillation wavelength in the exposure sensitivity wavelength range of the photosensitive glass.
The exposure step of exposing and the exposed portion of the photosensitive glass
The heat development step of crystallization and the exposed portion crystallized
And a step of etching the photosensitive glass. 2. The irradiation step of the laser in the exposing step.
Exposure by moving the frame relative to the photosensitive glass
The method for processing a photosensitive glass according to claim 1 , wherein a pattern is formed . 3. The exposing step is performed on the photosensitive glass.
The above laser irradiation is performed through the arranged exposure pattern mask.
The method for processing the photosensitive glass according to claim 1 or 2, wherein the method is performed by irradiating. 4. The method for processing a photosensitive glass according to claim 1 , wherein the laser is an excimer laser . 5. The oscillation wavelength of the laser is 150
It is in the range of up to 400 nm.
5. The method for processing the photosensitive glass according to any one of to 4. 6. The photosensitive glass is exposed in the exposure direction after exposure.
Including the process of cutting in non-parallel directions and dividing into multiple
Method of processing a photosensitive glass according to any one of claims 1 to 5, wherein the free it. 7. The exposing step comprises stacking a plurality of layers.
The method for processing a photosensitive glass according to claim 1, wherein the method is performed on the photosensitive glass at the same time . 8. The exposure step is the same as that for the photosensitive glass.
Place the photosensitive glass in a liquid with a refractive index of the order of magnitude.
The method for processing a photosensitive glass according to any one of claims 1 to 7, wherein the laser irradiation is performed in such a state .