JP2542781Y2 - High frequency electronic equipment - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency electronic device in which a transmission line is accommodated.

[0002]

2. Description of the Related Art A high-frequency electronic device having functions such as an amplifier and a filter has a substrate made of ceramic or the like on which a predetermined transmission line is formed, and is connected to the outside via a coaxial connector. FIGS. 5A and 5B are diagrams each showing a transmission line. FIG. 5A shows a microstrip line 30 in which a signal path 32 is formed on one surface of a substrate 31 and a ground surface 33 is formed on the entire other surface. FIG. 5B shows a coplanar line 40 in which a signal path 42 is formed only on one surface of the substrate 41, and ground planes 43 are formed on both sides of the signal path 42. is there.

[0003] These transmission lines are accommodated in a metal case, which is a housing of the device, and the coaxial connector is provided on a side surface of the metal case. FIGS. 6A and 6B are diagrams showing a connection state between the transmission line and the metal case, respectively, and the transmission line is a coplanar line 40. FIG. In the case of the one shown in the perspective view of FIG. 6A, the end of the substrate 41 is provided near the inside of the metal case 50. The end of the signal path 42 is soldered to the center conductor 51a of the coaxial connector 51. The ground conductor 51b of the coaxial connector 51 is directly fixed to the metal case 50, and the ground surface 43 and the metal case 50 are fixed.
And the ribbon 55 is wired between them.

FIG. 6B is a side sectional view showing a structure in which a step 60 a is provided inside a metal case 60, and the step 60 a is provided.
The structure is such that the substrate 41 is pressed against the portion a from below by a biasing means 61 such as a spring, and the ground surface 43 is grounded. The central conductor 51a of the coaxial connector 51 has a step 60.
a is not formed, and the signal path 42 is directly connected to the center conductor 5.
Contact 1a.

[0005]

The coplanar line 40 in which the transmission line is formed only on the back surface of the substrate is different from the case where the transmission line is the microstrip line 30 formed on both surfaces of the substrate, as described above. Had to have a special connection structure. For this reason, in the case of the structure shown in FIG. 6A, the ribbon 55 must be used, and wiring must be performed with the ribbon 55 slackened, which is troublesome.

In the case of the structure shown in FIG.
Since the contact between the step 60a and the ground surface 43 is a surface contact, the contact between them is likely to be unstable. Also,
When the urging force of the urging means 61 is reduced due to aging, poor contact between them is also likely to occur. In particular, since the transmission line handles signals in a high-frequency band, the adverse effect of this poor contact cannot be ignored. Also, step 60
Since the structure is such that the substrate 41 is pressed from below against a, the substrate 41 must be attached from the lower surface side of the metal case 60 at the time of assembly, making this work difficult.

[0007] The present invention has been made in view of the above problems, and it is possible to make good contact between the transmission line and the metal case accommodating the transmission line, and to change the contact state over time. It is an object of the present invention to provide a high-frequency electronic device that does not cause any problem.

[0008]

In order to achieve the above object, a high-frequency electronic device according to the present invention includes a transmission line 40 of a coplanar line having a signal path 42 and a ground plane 43 on one surface of a substrate 41; Metal case 1 for housing the transmission line
And a high-frequency electronic device provided with a coaxial connector 2 having a center conductor 2a and a ground conductor 2b. In the high-frequency electronic device, a fixed portion 3a attached to the metal case is electrically connected to a ground conductor of the coaxial connector, and And a contact spring 3 having an arcuate portion 3c having a predetermined diameter, which abuts on both the ground surface and the side piece 1b of the metal case at a predetermined angle, and conducts between the ground surface and the ground conductor. And

[0009]

The arcuate portion 3c of the contact spring 3 contacts the ground surface 43 of the substrate 41 at a predetermined angle. The arc portion 3c has an arc shape having a predetermined diameter, and simultaneously contacts the side piece 1a.
As a result, the ground surface 43 is conducted to the side piece 1a via the contact spring 3, and is conducted to the ground conductor 2b of the coaxial connector 2 fixed to the side piece 1a. And the contact spring 3
Since the arc-shaped portion 3c is formed in an arc shape and has a force to simultaneously urge in the direction of the ground surface 43 and the side piece 1a, poor contact due to aging hardly occurs.

[0010]

1 is a partial perspective view showing a high-frequency electronic device according to the present invention. The transmission line 40 is a coplanar line in which a signal path 42 is formed on one surface of a substrate 41 and a ground plane 43 is formed on a side of the signal path 42. The transmission line 40 is housed in a metal case 1 that forms an outer case of the high-frequency electronic device.

In the metal case 1, the coaxial connector 2 is fixed to the side piece 1a, and the ground conductor 2b of the coaxial connector 2 is electrically connected to the side piece 1a. The central conductor 2a of the coaxial connector 2 penetrates through the opening 1b formed in the side piece 1a and protrudes into the metal case 1.

Contact springs 3 are provided on both sides of the coaxial connector 2 inside the side piece 1a of the metal case 1, respectively. As shown in the side sectional view of FIG. 2, the contact spring 3 is formed in a substantially J-shape with a spring property by a conductive material. The contact spring 3 has a fixed portion 3 a fixed to the upper surface of the side piece 1 a by a screw 4. In addition, the contact spring 3
It may be fixed by a method other than screwing, for example, spot welding. The base 3b bent at a right angle to the fixing portion 3a protrudes downward along the side piece 1a, and has a lower end having an arc-shaped portion 3c having a predetermined diameter on the side of the side piece 1a. Note that the arc portion 3c is located below the center conductor 2a in a natural state.

Next, the operation of the above configuration will be described. When the transmission line 40 is provided in the metal case 1, the signal path 42 of the substrate 41 is fixed at a height position where the signal path 42 comes into contact with the center conductor 2 a of the coaxial connector 2. The signal path 2a of the coaxial connector 2 has a predetermined elasticity, and the central conductor 2a
Is fixed at a height enough to push upward slightly. For this reason, the substrate 41 is fixed on a spacer or a step provided on the bottom of the metal case 1 and protruding in the height direction.

Next, the fixing portion 3a of the contact spring 3 is fixed to the side piece 1a with the screw 4. At this time, the arc-shaped portion 3c of the contact spring 3 contacts the ground surface 43 on the substrate 41 as shown in the enlarged view of FIG. At the same time, as the screw 4 is tightened, the arc-shaped portion 3c of the contact spring 3 is pressed toward the lower portion where the ground surface 43 is located, and at the same time, slides in the lateral direction with the side piece 3c due to the arc shape. As a result, the arc-shaped portion 3c generates a biasing force in the direction of the arrow shown in the drawing, and the arc-shaped portion 3c makes a point contact with the corner piece 3ca with the side piece 1a.
cb makes a point contact with the ground plane 43. Each of the two point contact points maintains the contact state by the generated urging force.

At the same time, the substrate 41 is drawn in the direction of the side piece 3c where the urging force is generated, and
3 is a side piece 3 via the corners 3cb and 3ca of the contact spring 3.
c. The contact spring 3 is electrically connected to the side piece 1a at the fixed portion 3a from the corner 3cb through the base 3b. The side piece 1a is electrically connected to the ground conductor 2b of the coaxial connector 2, so that the ground conductor 2b and the ground plane 43 can be electrically connected. Further, the center conductor 2a of the coaxial connector 2 is fixed to the signal path 42 by an adhesive or bonding, so that mutual conduction is achieved.

Since the contact spring 3 generates an urging force on both the lower substrate 41 and the lateral side piece 1a due to the shape of the arc-shaped portion 3a, there is little aging. Further, even if the urging force is slightly reduced, the contact spring 3 does not generate the urging force only in a single direction, so that the reduction of the contact pressure on the ground surface 43 can be reduced.

In the above embodiment, the arc-shaped portion 3c is formed with a predetermined diameter.
As shown in FIG. 4, the shape may be an arc or a wedge. In these cases, the same operation and effect as in the above embodiment can be obtained.

[0018]

According to the high-frequency electronic device of the present invention, conduction between the ground plane of the transmission line of the coplanar line and the side piece of the metal case is established by a contact spring having an arc-shaped portion having a predetermined diameter. The contact is made by using a contact spring that biases and contacts the side piece in both directions. Therefore, the contact state between the ground plane and the side piece is well maintained without being affected by the decrease in the biasing force due to aging. Has the effect that can.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a high-frequency electronic device of the present invention.

FIG. 2 is a side sectional view of the high-frequency electronic device.

FIG. 3 is a partially enlarged view showing a contact spring.

FIG. 4 is a side sectional view showing another example of the contact spring.

FIGS. 5A and 5B are side sectional views showing a microstrip line and a coplanar line as a transmission line, respectively.

FIGS. 6A and 6B are a perspective view and a side sectional view, respectively, showing a contact structure between a transmission line and a metal case according to a conventional technique.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Metal case, 1a ... Side piece, 2 ... Coaxial cable, 2
a: center conductor, 2b: ground conductor, 3: contact spring, 3a
... fixed part, 3b ... base part, 3c ... arc-shaped part, 3ca, 3cb
... corner, 40 ... transmission line, 41 ... board, 42 ... signal path,
43 ... ground side.

Claims (1)

(57) [Scope of request for utility model registration] A signal path (4) is provided on one surface of a substrate (41).
2) a transmission line (40) of a coplanar line having a ground plane (43), a metal case (1) accommodating the transmission line, a center conductor (2a) and a ground conductor (2b).
A high-frequency electronic device provided with a coaxial connector (2) having: a conductive portion between a fixed portion (3a) attached to the metal case and a ground conductor of the coaxial connector; Case side piece (1b)
A high-frequency electronic device comprising a contact spring (3) having an arc-shaped portion (3c) having a predetermined diameter for contacting both at a predetermined angle and conducting between the ground surface and the ground conductor.