JP2542239B2 - Multi-stage electronic cooler - Google Patents
Multi-stage electronic coolerInfo
- Publication number
- JP2542239B2 JP2542239B2 JP63181802A JP18180288A JP2542239B2 JP 2542239 B2 JP2542239 B2 JP 2542239B2 JP 63181802 A JP63181802 A JP 63181802A JP 18180288 A JP18180288 A JP 18180288A JP 2542239 B2 JP2542239 B2 JP 2542239B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic cooler
- stage electronic
- stage
- cooler
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、ペルチエ効果を持つ熱電素子を、基板を介
して順次階段状に積み重ねて縦続してなるカスケード型
の多段電子クーラーに関するものである。Description: TECHNICAL FIELD The present invention relates to a cascade-type multi-stage electronic cooler in which thermoelectric elements having a Peltier effect are sequentially stacked in a stepped manner via a substrate. .
上記多段電子クーラーは、例えば第１図に示すように
６段になっていて、真空ベルジャ５に収納されており、
各段にはＮ型半導体１とＰ型半導体２とを一対とする熱
電素子Ａが、基板３に接合された電極４にて縦続されて
いる。そして各段の熱電素子Ａに通電することにより各
段の上側の基板側が吸熱され、最上段の基板（冷却板）
3aが最大冷却到達温度まで冷却されるようになってい
る。The multi-stage electronic cooler has, for example, six stages as shown in FIG. 1 and is housed in the vacuum bell jar 5.
A thermoelectric element A having a pair of an N-type semiconductor 1 and a P-type semiconductor 2 is cascaded at each stage by an electrode 4 joined to a substrate 3. By energizing the thermoelectric element A of each stage, the upper substrate side of each stage absorbs heat, and the uppermost substrate (cooling plate)
3a is cooled to the maximum cooling reached temperature.
現在、この種の多段電子クーラーの一例としてマーロ
ー社製のカスケード型の６段型の電子クーラーが知られ
ており、この従来例のものにあっては、流入熱量Ｑがゼ
ロの理想的な状態のときに電流Ｉが3.5Aでもって最大の
冷却到達温度は−100℃である。At present, a cascade type six-stage electronic cooler manufactured by Marlow is known as an example of this kind of multi-stage electronic cooler. In this conventional example, an inflowing heat quantity Q is in an ideal state. When the current I was 3.5 A, the maximum temperature reached for cooling was −100 ° C.
従来の上記多段電子クーラーにあっては真空ベルジャ
５内に収納しただけの構成であったため、外気、温度の
影響を受けやすく、流入熱量Ｑがあって到底−100℃近
くまで冷却することはできなかった。Since the conventional multi-stage electronic cooler described above has only been housed in the vacuum bell jar 5, it is easily affected by the outside air and temperature, and the inflowing heat quantity Q makes it possible to cool it to almost -100 ° C. There wasn't.
すなわち、真空ベルジャ５内の多段電子クーラーに対
するり流入熱量Ｑには真空ベルジャ５内での対流伝熱と
外側からの放射伝熱とがあり、このうち対流伝熱はベル
ジャ５内を真空にすることによりその影響をなくしてい
るが、上記したように、多段電子クーラーが真空ベルジ
ャ５内に収納されただけの構成となっているため、外側
からの放射伝熱を防ぐことができず、この放射伝熱によ
る流入熱量Ｑをゼロにすることができなかった。That is, the reflow heat quantity Q to the multi-stage electronic cooler in the vacuum bell jar 5 includes convective heat transfer in the vacuum bell jar 5 and radiant heat transfer from the outside, of which convective heat transfer makes the bell jar 5 vacuum. However, as described above, since the multi-stage electronic cooler is only housed in the vacuum bell jar 5 as described above, it is not possible to prevent radiation heat transfer from the outside. The inflowing heat quantity Q due to radiative heat transfer could not be made zero.
本発明は、上記のことにかんがみなされたもので、対
流伝熱はもちろんのこと、放射伝熱による流入熱量Ｑを
極めて小さくできて、最大冷却到達温度を従来のものよ
り低くできるようにした多段電子クーラーを提供するこ
とを目的とするものである。The present invention has been conceived in view of the above, and in addition to convection heat transfer, the inflow heat quantity Q by radiant heat transfer can be made extremely small, and the maximum cooling ultimate temperature can be made lower than the conventional one. The purpose is to provide an electronic cooler.
上記目的を達成するために、本発明に係わる多段電子
クーラーは、真空容器内に収容してなる多段電子クーラ
ーにおいて、上記多段電子クーラーを構成する部材に、
この多段電子クーラーの構成部材より熱の放射率の小さ
い物質を接着、圧着、蒸着、メツキ等により付着させた
構成となっている。In order to achieve the above object, a multi-stage electronic cooler according to the present invention is a multi-stage electronic cooler housed in a vacuum container, wherein a member constituting the multi-stage electronic cooler comprises:
This multi-stage electronic cooler has a structure in which a substance having a smaller emissivity of heat is adhered by adhesion, pressure bonding, vapor deposition, plating or the like.
上記多段電子クーラーの構成部材より熱の放射率の小
さい物質にはAuが用いられる。Au is used as a substance having a smaller emissivity of heat than the constituent members of the multi-stage electronic cooler.
多段電子クーラーを構成するセラミック製の基板にAu
を箔状にして接着、あるいは蒸着により付着する。Au on the ceramic substrate that constitutes the multi-stage electronic cooler
Is made into a foil shape and attached by adhesion or vapor deposition.
多段電子クーラーの各熱電素子の側面にAuメツキを施
す。Apply Au plating to the side of each thermoelectric element of the multi-stage electronic cooler.
上記真空容器を多段電子クーラーの構成部材より熱の
放射率の小さい物質で構成する。The vacuum container is made of a material having a smaller emissivity of heat than the constituent members of the multi-stage electronic cooler.
真空容器に多段電子クーラーの構成部材より熱の放射
率の小さい物質を接着、圧着、蒸着、メツキ等により付
着させる。A substance having a lower emissivity of heat than the constituent members of the multi-stage electronic cooler is attached to the vacuum container by adhesion, pressure bonding, vapor deposition, plating, or the like.
上記真空容器における多段電子クーラーの構成部材よ
り熱の放射率の小さい物質にAuを用いる。Au is used as a substance having a smaller emissivity of heat than the constituent members of the multi-stage electronic cooler in the vacuum container.
真空容器の外側からこの中に収容した多段電子クーラ
ーへの熱の放射による熱の流入量が少なくなり、多段電
子クーラーの最大冷却温度が低くなる。The amount of heat flowing from the outside of the vacuum container to the multi-stage electronic cooler housed therein is reduced, and the maximum cooling temperature of the multi-stage electronic cooler is lowered.
本発明の実施例を比較例と共に説明する。 Examples of the present invention will be described together with comparative examples.
比 較 例 第１図に示す多段電子クーラーを、これの基板３をAl
Nで、熱電素子Ａの構成素子対をBi−Teにてそれぞれ作
成し、ガラス製の真空ベルジャ５内で10-6torrの真空中
で作動させた。このときの外気温度（室温）は27℃であ
った。Comparative Example The multi-stage electronic cooler shown in FIG.
In N, the constituent element pairs of the thermoelectric element A were each made of Bi-Te and operated in a vacuum bell jar 5 made of glass in a vacuum of 10 -6 torr. At this time, the outside air temperature (room temperature) was 27 ° C.
このときの最大の冷却到達温度は−95℃であった。 The maximum cooling temperature reached at this time was -95 ° C.
実施例 １ 上記比較例における多段電子クーラーで、AlNにて構
成した各基板３に厚さ５μの多段電子クーラーの構成部
材より熱の放射率の小さな材料であるAu箔を接着して同
様の測定を行なったところ、最大の冷却到達温度は−98
℃であった。Example 1 In the multi-stage electronic cooler in the above-mentioned comparative example, Au foil, which is a material having a smaller heat emissivity than the constituent member of the multi-stage electronic cooler having a thickness of 5 μ, was adhered to each substrate 3 made of AlN and the same measurement was performed. The maximum temperature reached was −98
° C.
実施例 ２ 実施例１における多段電子クーラーで、さらに各熱電
素子Ａの側面にAuメッキを施して同様の測定を行なった
ところ、最大の冷却到達温度は−101℃であった。Example 2 With the multi-stage electronic cooler in Example 1, the side surface of each thermoelectric element A was further plated with Au, and the same measurement was performed. The maximum cooling ultimate temperature was -101 ° C.
実施例 ３ 実施例１のガラス製も真空ベルジャ５の代りに、Auメ
ッキを施したCu製容器を用いて同様の測定を行なったと
ころ最大の冷却到達温度は−108℃であった。Example 3 When the same measurement was carried out using the Cu-plated container plated with Au instead of the vacuum bell jar 5 of the glass of Example 1, the maximum attainable cooling temperature was -108 ° C.
上記のように実施例１〜３での最大の冷却到達温度は
比較例のものに比較して大きくすることができた。As described above, the maximum cooling ultimate temperature in Examples 1 to 3 could be made larger than that in the comparative example.
このことは以下のことからも説明することができる。 This can also be explained from the following.
すなわち、多段電子クーラーへの放射流入熱量QRは ただし、 CS:ステファンボルツマン定数 （5.67×10-12W/cm2・K4） εH:高温部（真空容器）の放射率 εC:クーラー各部の放射率 TH:クーラー作動時の外気温度（常温） TCi:クーラーｉ段の温度 Ai:クーラーｉ段の受光面積 であらわされる。That is, the radiant heat input Q R to the multi-stage electronic cooler is However, C S : Stefan Boltzmann constant (5.67 × 10 -12 W / cm 2 · K 4 ) ε H : Emissivity of high temperature part (vacuum container) ε C : Emissivity of each part of cooler T H : Outside temperature at cooler operation ( Normal temperature) T C i: Temperature of cooler i-th stage Ai: Light receiving area of cooler i-th stage
Bi−Teからなる熱電素子Ａを用いて第２図、第３図、
第４図に示すように６段、８段、10段の多段電子クーラ
ーを構成したときのクーラーの最大冷却温度Tcmaxと上
記Ｅの関係を計算により求めた。そしてその結果を第５
図に示す。2, 3 using the thermoelectric element A made of Bi-Te.
As shown in FIG. 4, the relationship between the maximum cooling temperature Tcmax of the cooler and the above E when a multi-stage electronic cooler of 6, 8, and 10 stages was constructed was obtained by calculation. And the result is the fifth
Shown in the figure.
なお各多段電子クーラーを構成する熱電素子の対数は
各図面中に記載した通りである。そしてそれぞれの使用
素子のサイズは、６段用が1.7角×2.3t、８段用が６角
×2.3t、10段用が0.6角×2.3tである。The number of thermoelectric elements forming each multi-stage electronic cooler is as described in each drawing. The size of each used element is 1.7 squares × 2.3t for 6 stages, 6 sides × 2.3t for 8 stages, and 0.6 sides × 2.3t for 10 stages.
上記計算において、ＥはεＨ、εＣが０〜１の値をと
るので、０〜5.67の値となる。In the above calculation, E has a value of 0 to 5.67 because ε H and ε C have a value of 0 to 1.
Ｅ＝０（εＨ＝εＣ＝０）のときは、放射流入熱量QR
はゼロとなり、Ｅ＝5.67（εＨ＝εＣ＝１）のときは、
完全黒体の容器内で、完全黒体のクーラーを作動させた
場合でQRは最大となる。When E = 0 (ε H = ε C = 0), radiant heat input Q R
Becomes zero, and when E = 5.67 (ε H = ε C = 1),
In a container full black body, Q R is the maximum when operated cooler full black body.
従って多段電子クーラーほ最大冷却温度Tcmaxを下げ
るには、 （１） クーラーの構成部材に、このクーラーの構成部
材より熱の放射率の小さい物質を付着させることでεＣ
を減少させる。Therefore, in order to reduce the maximum cooling temperature Tcmax of the multi-stage electronic cooler, (1) εC is made by attaching a substance having a lower emissivity of heat to the cooler constituent members than the cooler constituent members.
To reduce.
（２） クーラーを、クーラーの構成部材より熱の放射
率の小さい物質製の容器に収容してεＨを減少させるこ
とでＥを減少させるのが有効であることがわかる。(2) It can be seen that it is effective to reduce E by housing the cooler in a container made of a material having a smaller emissivity of heat than the constituent members of the cooler to reduce εH.
また上記（１）、（２）を併用すればさらに大きな効
果が得られる。Further, if the above (1) and (2) are used together, an even greater effect can be obtained.
上記各実施例では比較例に比べ、εＣないしはεＨの
値を減少させる処理が施されたため、Ｅが減少し、第５
図に示される関係通りにTcmaxが低温側へ移行される。In each of the above-described examples, the value of ε C or ε H was decreased as compared with the comparative example, so that E was decreased and
Tcmax shifts to the low temperature side according to the relationship shown in the figure.
なお比較例では 、実施例１では 、実施例２では 、実施例３では 程度と推定できる。In the comparative example , In Example 1, , In Example 2 , In Example 3, It can be estimated as the degree.
また本発明に係る多段電子クーラーでは、多段カスケ
ードの多数が多くなる程その効果が顕著にあらわれる。
10段の多段電子クーラーを、基板をAlNで、熱電素子をB
i−Teでそれぞれ構成し、ガラス製の真空ベルジャに収
容して測定した場合、最大冷却温度Tcmaxは−104℃であ
るが、セラミック製の基板にAu箔を接着し、Bi−Teから
なる熱電素子の側面にAuメツキを施し、さらにAuメツキ
容器内で作動させることにより上記Tcmaxは−134℃程度
まで達するものと推定される。In the multi-stage electronic cooler according to the present invention, the effect becomes more remarkable as the number of multi-stage cascades increases.
A 10-stage multi-stage electronic cooler with a substrate of AlN and a thermoelectric element of B
The maximum cooling temperature Tcmax is -104 ° C when measured in a vacuum bell jar made of glass, which is composed of i-Te, but the Au foil is bonded to the ceramic substrate, and the It is estimated that the above Tcmax reaches about -134 ° C. by applying Au plating to the side surface of the element and further operating in the Au plating container.
また上記Au箔を接着するかわりにAuを蒸着してもよ
い。さらにAuメツキを施したCu製の容器のかわりにAu製
の容器を用いてもよい。Further, instead of adhering the Au foil, Au may be vapor-deposited. Further, a container made of Au may be used instead of the container made of Cu with Au plating.
本発明によれば、対流伝熱はもちろんのこと、放射伝
熱による流入熱量Ｑを極めて小さくできて、最大冷却到
達温度を従来のものに比較して低くできる。According to the present invention, not only the convective heat transfer but also the inflowing heat quantity Q due to the radiant heat transfer can be made extremely small, and the maximum cooling ultimate temperature can be made lower than the conventional one.
第１図は多段電子クーラーの概略的な全体構成図、第２
図、第３図、第４図は６段、８段、10段の各多段電子ク
ーラーの熱電素子の対数を示す説明図、第５図はＥとTc
maxの関係を示す線図である。 Ａは熱電素子、３は基板、５は真空ベルジャ。FIG. 1 is a schematic overall configuration diagram of a multi-stage electronic cooler, and FIG.
FIGS. 3, 3 and 4 are explanatory views showing the number of thermoelectric elements of multi-stage electronic coolers of 6, 8, and 10 stages, and FIG. 5 is E and Tc.
It is a diagram which shows the relationship of max. A is a thermoelectric element, 3 is a substrate, and 5 is a vacuum bell jar.
Claims (7)
ーにおいて、多段電子クーラーを構成する部材に、この
多段電子クーラーの構成部材より熱の放射率の小さい物
質を接着、圧着、蒸着、メツキ等により付着させたこと
を特徴とする多段電子クーラー。1. A multi-stage electronic cooler housed in a vacuum container, wherein a material having a smaller heat emissivity than a constituent member of the multi-stage electronic cooler is bonded, pressure-bonded, vapor-deposited or plated to a member constituting the multi-stage electronic cooler. A multi-stage electronic cooler characterized by being attached by means such as.
放射率の小さい物質にはAuを用いたことを特徴とする請
求項１記載の多段電子クーラー。2. The multi-stage electronic cooler according to claim 1, wherein Au is used as the substance having a smaller emissivity of heat than the constituent members of the multi-stage electronic cooler.
の基板にAuを箔状にして接着、あるいは蒸着ににより付
着したことを特徴とする請求項１記載の多段電子クーラ
ー。3. The multi-stage electronic cooler according to claim 1, wherein Au is foil-shaped and adhered to the ceramic substrate constituting the multi-stage electronic cooler by adhesion or vapor deposition.
ッキを施したことを特徴とする請求項１記載の多段電子
クーラー。4. The multi-stage electronic cooler according to claim 1, wherein the side surface of each thermal element of the multi-stage electronic cooler is plated with Au.
り熱の放射率の小さい物質で構成したことを特徴とする
請求項１記載の多段電子クーラー。5. The multi-stage electronic cooler according to claim 1, wherein the vacuum container is made of a material having a smaller emissivity of heat than the constituent members of the multi-stage electronic cooler.
り熱の放射率の小さい物質を接着、圧着、蒸着、メツキ
等により付着させたことを特徴とする請求項５記載の多
段電子クーラー。6. The multi-stage electronic cooler according to claim 5, wherein a substance having a smaller emissivity of heat than that of a constituent member of the multi-stage electronic cooler is attached to the vacuum container by adhesion, pressure bonding, vapor deposition, plating or the like.
率の小さい物質にはAuを用いたを特徴とする請求項５ま
たは６記載の多段電子クーラー。7. The multi-stage electronic cooler according to claim 5, wherein Au is used as the substance having a smaller emissivity of heat than the constituent members of the multi-stage electronic cooler.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63181802A JP2542239B2 (en) | 1988-07-22 | 1988-07-22 | Multi-stage electronic cooler |
| EP19880907379 EP0377740A4 (en) | 1987-08-20 | 1988-08-19 | Multistep electronic cooler |
| PCT/JP1988/000828 WO1989001594A1 (en) | 1987-08-20 | 1988-08-19 | Multistep electronic cooler |
| US07/795,271 US5237821A (en) | 1987-08-20 | 1991-11-20 | Multistep electronic cooler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63181802A JP2542239B2 (en) | 1988-07-22 | 1988-07-22 | Multi-stage electronic cooler |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0233576A JPH0233576A (en) | 1990-02-02 |
| JP2542239B2 true JP2542239B2 (en) | 1996-10-09 |
Family
ID=16107105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63181802A Expired - Lifetime JP2542239B2 (en) | 1987-08-20 | 1988-07-22 | Multi-stage electronic cooler |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2542239B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4924569B2 (en) * | 2008-08-25 | 2012-04-25 | トヨタ自動車株式会社 | Fuel pump motor and method for controlling applied voltage to fuel pump motor |
-
1988
- 1988-07-22 JP JP63181802A patent/JP2542239B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0233576A (en) | 1990-02-02 |
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