JP2538703B2 - Printed wiring board wire machine - Google Patents

Description

TECHNICAL FIELD The present invention relates to a wiring machine for wiring a printed wiring board.

[Conventional technology]

Conventionally, in the wiring of a printed wiring board, the end of the wire is manually processed, and the wire is tentatively fixed by being bent from the lead of the discrete component, and then the wiring is carried out at one position with a thread solder and a soldering iron.

[Problems to be Solved by the Invention]

The above-mentioned conventional wiring method for printed wiring boards relies on manual work, resulting in poor work efficiency.In order to automate the manual work, the leads of discrete components may fall in different directions or may fall over. The lead wire of the wire rod, controlling the solder supply position and the amount of solder for the bending of the thread solder, treating foreign substances adhering to the tip of the soldering iron, and wearing the tip of the tip. You have to solve difficult problems such as how to manage.

An object of the present invention is to provide a wiring that can perform wiring at two locations at the same time.

[Means for solving the problem]

A printed wiring board wiring machine according to the present invention includes a frame, a guide frame fixed to the frame, a vertical guide supported by the guide frame, and a vertical guide held by the vertical guide. A vertically movable head that is movable, a rod-shaped horizontal guide having one end fixed to the vertically movable head and perpendicular to the vertically movable head, and a horizontally movable head that is guided by the horizontal guide and is movable along the horizontal guide. And a wire rod supply device for supplying the wire rod to the horizontal moving head via the vertical moving head, and a printed wiring board to which a part of the leads of the discrete component is exposed on the upper surface and is horizontally held. A horizontal movement table having a chuck for moving the lead of the printed wiring board to a designated position, and provided on the guide frame And a lead cut portion for cutting the lead of the discrete component and one head each provided to both the vertical moving head and the horizontal moving head, and grips the wire rod supplied from the wire rod feeding device. Then, a chuck unit for changing the inclination of the gripped wire rod and moving it up and down, and a cut and cut unit for cutting the wire rod for end treatment of the wire rod and removing the coating are provided so as to face each of the heads. A strip portion, a bender portion that is provided so as to face each of the both heads one by one, and forms core wires at both ends of the wire material whose coating is removed by the cut-and-strip portion into a U-shape. Solder distribution for supplying cream solder onto the ends of the formed wire rods, which are provided one by one and are pressed against the wiring position by the chuck and temporarily fixed. And a cream-like solder on the ends of the molded wire rods, which are respectively provided on the both heads so as to face each other and are temporarily fixed to the wiring portion, by irradiating the creamer-like solder with the cream-like solder. And a laser optical unit for melting.

[Action]

The wire rod supplied from the wire rod feeder is gripped by the chucks of both the vertical moving head and the horizontal moving head, and the wire rod is cut, the coating on both ends is removed, and the U-shaped forming of the core wires at both ends is performed. In parallel with this, the leads of the wiring place on the printed wiring board held on the horizontal moving table are cut by the lead cut part into a shape easy for soldering, and then directly under the wire material with both ends molded. It is moved horizontally by the horizontal movement table. Next, the chucks of both heads descend and the U-shaped portions at both ends of the formed wire rod are pressed against the wiring positions to temporarily fix the wire rod. Next, after the cream-like solder is supplied from the solder distributor onto the U-shaped portion, laser light is irradiated and soldering is automatically performed simultaneously at both ends of the wire.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a partially cutaway front view of an embodiment of a printed wiring board wiring machine according to the present invention, and FIGS. 2 to 7 are explanatory views sequentially showing each step of wiring work in this embodiment. , Fig. 2 is an explanatory view of the lead cutting process for discrete parts, and Fig. 3
The figure shows the wire gripping and cutting and stripping process of the chuck part. Fig. 4 shows U of the wire core wire by the bender.
FIG. 5 is an explanatory diagram of a character forming process, FIG. 5 is an explanatory diagram of a gripping angle change by a clamp and a wire rod temporary fixing process by a chuck portion, FIG. 6 is an explanatory diagram of a creamy solder supplying process by a solder distributor, and FIG. 7 is a laser. It is explanatory drawing of the soldering process by light.

The vertical guide 12a is fixed to the guide frame 12 fixed to a frame (not shown). The vertical moving head 5 held by the vertical guide 12a can be moved up and down along the vertical guide 12a by a moving device (not shown). One ends of two parallel rod-shaped horizontal guides 13 are horizontally fixed to the vertical moving head 5. The horizontal moving head 6 is provided so as to be held by the horizontal guide 13 and move horizontally along the horizontal guide 13 by rotation of a screw 14 provided on the vertical moving head 5. Both the vertical moving head 5 and the horizontal moving head 6 are provided with a device for performing each step of the wiring work, one device facing each other. The chuck portion 7 provided on both heads 5 and 6 has a clamp 7a for gripping the supplied wire 4a.
And a mechanism (not shown) for vertically moving the wire 4a while gripping it and a cylinder mechanism (not shown) for changing the inclination of the gripped wire 4a by changing the direction of the clamp 7a,
The end of the molded wire 4a can be pressed against the wiring location 2c to be temporarily fixed. A cut-and-strip section 8 for cutting the end of the wire 4a gripped by the clamp 7a of the chuck section 7 and removing the coating is provided outside the chuck sections 7 of both heads 5 and 6. The vendor part 9 has a tip mold part (not shown) for molding the end of the wire 4a processed by the cut and strip part 8 into a U-shape, and a mechanism for rotating the tip mold part around a vertical axis ( (Not shown) and a mechanism (not shown) that can change the position with respect to the chuck portion 7. On both heads 5 and 6,
A solder distributor 10 is provided so as to supply the cream-like solder 10a onto the U-shaped end of the wire 4a temporarily fixed by the chuck 7 on the wiring portion 2c. Both heads 5 and 6 are also provided with a laser optical section 11 for irradiating the cream-like solder 10a supplied to the U-shaped end of the wire 4a with a laser beam 11a to melt the solder for soldering. . The wire rod feeding device 4 includes a wire rod guide portion 4b, a wire rod feeding portion 4c,
It is composed of a wire reel 4d and is fixed to the guide frame 12, and sends the wire 4a to the chuck portion 7 of both heads 5 and 6. Horizontal moving table 1 fixed horizontally to the frame
However, the printed wiring board 2 is held horizontally by the chuck 1a provided on the upper surface of the table, and the two wiring positions 2c having the leads 2b to be subjected to the wiring work are horizontally moved to designated positions. .. The guide frame 12 is provided with a blade for cutting the lead 2b from a predetermined position and a lead cut portion 3 having a mechanism for moving the blade up and down.

Next, the operation of the wiring machine of this embodiment will be described with reference to FIGS.

First, the two designated wiring positions 2c of the discrete component 2a are moved by the horizontal movement of the horizontal movement table 1.
The lead cut portions 3 are successively positioned immediately below the lead cut portion 3, and the surplus portion of the lead b is horizontally cut by the blade of the lead cut portion 3 (FIG. 2). Next, the horizontal moving table 1 moves the printed wiring board 2 so that one wiring portion 2c is directly below the chuck portion 7 of the vertical moving head 5 and the other wiring portion 2c is the chuck portion of the horizontal moving head 6. Arrange so that it is directly below the position to be moved for the wiring of 7. In parallel with the above process, the wire rod 4a passes through the clamp 7a of the chuck unit 7 of the vertical moving head 5 by the wire rod supplying unit 4c, and is fed to the clamp 7a of the chuck unit 7 of the horizontal moving head 6 to mold the tip. Is gripped on the inner side of the length necessary for the wiring, and is pulled out by the horizontal movement of the horizontal moving head 6 by the length required for wiring, and then the other end is gripped by the clamp 7a of the chuck portion 7 of the vertical moving head 5. . Next, the cut-and-strip portions of both heads 5 and 6 move to the position of the end of the wire 4a,
4a is cut to the required length, and the coating on the end portion is removed (Fig. 3). Next, the benders of both heads 5 and 6 are connected to the wire 4a.
To the positions of the ends of the wire rod 4a and form both ends of the wire 4a into a U shape (Fig. 4). Next, the chuck portion 7 of both heads 5 and 6
While descending, change the angle of the clamp 7a to change the U of the wire 4a.
Both ends formed into a letter shape are pressed onto the respective wiring positions 2c and temporarily fixed to form a shape that facilitates soldering (Fig. 5). Next, the solder distributors 10 of both heads descend directly above the wiring portion 2c to supply the cream-like solder 10a on the U-shaped end in a specified amount (FIG. 6). Next, the laser optical parts 11 provided in both heads irradiate the laser light 11a to the wiring portion 2c for soldering, and the wiring work for both ends of one wire 4a is completed at the same time.

〔The invention's effect〕

As described above, the present invention is directed to various directions of tilting of leads of discrete components and a method of twisting a wire rod on the tilted leads. For the difficulty of mechanically pressing the end of the U-shaped treated wire material to the wiring location and temporarily fixing it, and the method of controlling the amount of solder with respect to the curl of the solder wire, In order to supply a fixed amount of solder using a solder distributor and to manage the tip of the contact-type hand-held soldering iron,
By using a non-contact laser beam without using a soldering iron and automating the wiring work, it is possible to work at two locations at both ends of the wire at the same time, and the workability is improved. is there.

[Brief description of drawings]

FIG. 1 is a front view in which a part of the wiring machine of the present invention is cut away,
The figure is an explanatory view of the lead cutting process for discrete parts,
FIG. 3 is an explanatory diagram of a wire rod gripping and cutting and stripping process of a chuck portion, FIG. 4 is an explanatory diagram of a U-shaped forming process of a wire rod core wire by a bender portion, and FIG. 5 is a gripping angle change by a clamp and a wire rod by a chuck portion. FIG. 6 is an explanatory diagram of a temporary fixing step, FIG. 6 is an explanatory diagram of a creamy solder supplying step by a solder distributor, and FIG. 7 is an explanatory diagram of a soldering step by a laser beam. 1 ... Horizontal movement table, 1a ... Chuck, 2 ... Printed wiring board, 2a ... Discrete parts, 2b ... Lead, 2c ... Wiring point, 3 ... Lead cut part, 4 ... Wire material supply device , 4a ...... Wire rod, 4b ...... Wire rod guide part, 4c ...... Wire rod supply part, 4d ...... Wire rod reel, 5 ... Vertical moving head, 6 ... Horizontal moving head, 7 ... Chuck part, 7a ... Clamp , 8 ... Cut and strip part, 9 ... Vendor part, 10 ... Solder distributor, 10a ... Cream solder, 11 ... Laser optical part, 11a ... Laser light, 12 ... Guide frame, 12a ... … Vertical guide, 13 …… Horizontal guide, 14 …… Screw.

Claims (1)

(57) [Claims] 1. A wiring machine for wiring a printed wiring board, comprising: a frame; a guide frame fixed to the frame; a vertical guide supported by the guide frame; and a vertical guide held by the vertical guide. And a vertical moving head that can move along the vertical guide, one end fixed to the vertical moving head, and a bar-shaped horizontal guide that is perpendicular to the vertical moving head, and the horizontal guide is guided by the horizontal guide. A horizontal moving head that can move along a guide, a wire feeding device that feeds the wire to the horizontal moving head via the vertical moving head, and a part of the lead of the discrete component is exposed and attached to the upper surface. A horizontal movement table having a chuck for holding the printed wiring board horizontally, and moving the lead of the printed wiring board to a designated position. A lead cut portion that is provided on the guide frame and cuts the lead of the discrete component, and one head is provided on each of the vertical moving head and the horizontal moving head so as to face each other, and is supplied from the wire rod supply device. A chuck part for gripping the held wire rod, changing the inclination of the gripped wire rod, and moving the wire rod up and down, and one head each provided on both heads for cutting and covering the wire rod for end treatment. And a bender portion that is provided on the both heads so as to face each other, and that forms a U-shaped core wire at both ends of the wire rod whose coating is removed by the cut and strip portion. And a crimp on the end of the formed wire rod, which is provided on each of the two heads so as to face each other and is pressed against the wiring position by the chuck and temporarily fixed. A solder distributor for supplying a solder paste, and a cream-like solder on the ends of the molded wire rod, which are respectively provided on the both heads so as to face each other, and are temporarily fixed to the wiring location, A printed wiring board wiring machine having a laser optical section for irradiating a laser light to melt the creamy solder.