JP2536129Y2 - Solder supply device - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for supplying a solid solder to a solder tank of a soldering apparatus for soldering a wiring board or the like so as to keep the liquid level of the molten solder constant.

[0002]

2. Description of the Related Art In an apparatus for performing soldering by dipping a surface of a wiring board to be soldered into a liquid surface of a molten solder, when a liquid level of the molten solder changes, a constant soldering quality is obtained. Will be difficult to obtain. For this reason, in a typical prior art, when the soldering progresses, the amount of molten solder in the solder bath decreases, and when the level of the liquid level decreases, an operator puts the bar solder into the solder bath.

In such a conventional technique, it is necessary to arrange an operator near the solder bath for monitoring the liquid level. Therefore, the cost increases.

[0004] For this reason, in another conventional technique, Japanese Utility Model Application Laid-Open No.
As described in JP-A-102260, when a drop in the liquid level of the molten solder is detected, solid solder stacked and stored in the hopper is sequentially taken out from the lower side, and a slide provided on a solder tank is taken out. The solid solder is supplied into the solder bath via the solder bath.

[0005]

Therefore, in the above-described prior art, the impact of the solid solder being introduced causes splashes of the molten solder to scatter around, or the liquid level greatly fluctuates. It is difficult to maintain a proper soldering quality.

SUMMARY OF THE INVENTION An object of the present invention is to provide a solder supply device capable of suppressing a fluctuation in the liquid level of molten solder when a bar solder is supplied into a solder bath and securing stable soldering quality.

[0007]

According to the present invention, there is provided a detecting means for detecting a liquid level of molten solder in a solder bath, and a storage unit which is disposed adjacent to the solder bath and stores a plurality of bar solders. When,
An extruding means for extruding only one bar solder from the storage portion, and having a resilient outer peripheral surface, the outer peripheral surface is rotated while being pressed against the extruded bar solder, so that the bar solder is removed. A drive roller capable of being conveyed, a brake roller for pressing the outer peripheral surface against the bar solder conveyed by the drive roller to brake and hold the conveyance of the bar solder, and responding to an output of the detection means, And a control means for controlling the driving roller.

[0008]

According to the present invention, the height of the liquid level of the molten solder in the solder bath is detected by the detecting means realized by a proximity sensor using magnetism, and the control means controls the detecting means. In response to the output, for example, when the liquid level falls below a predetermined value, bar solder is supplied one by one into the solder tank. A plurality of the bar solders are stored in a storage portion arranged adjacent to the solder bath.

That is, when it is detected that the bar solder is to be supplied, the control means firstly drives the extruding means realized by an air cylinder or the like, and for example, the bar solder which is stacked and stored in the storage portion. Is extruded, and the tip of the solder bar is bitten into the drive roller. The drive roller is rotated by a motor or the like in response to an output from the control unit. The outer peripheral surface of this drive roller is made of a resilient material such as urethane. Therefore, the tip of the bar solder extruded by the extrusion means as described above is engaged with the drive roller. Therefore, when the driving means is rotated after the control means drives the pushing means, the bar solder is extracted from the pushing means and transported.

[0010] A brake roller is pressed against the conveyed bar solder by a resilient force generated by a spring or the like. This brake roller generates a braking force on the bar solder conveyed from the drive roller due to frictional force or the like, thereby preventing the bar solder that has escaped from the drive roller from slipping down when the conveyance path is inclined. I do.

In this manner, the bar solder is held by the brake roller, and is gradually pushed out of the brake roller by the subsequent bar solder conveyed by the drive roller, and is slowly fed into the solder tank. In this way, it is possible to safely feed the bar solder in accordance with the decrease in the liquid level of the molten solder without splashing of the solder and the like. In addition, fluctuations in the liquid level when the bar solder is supplied are small, and the soldering quality can be improved.

[0012]

1 is a perspective view of a charging device 2 used in a supply device 1 according to one embodiment of the present invention, FIG. 2 is a plan view of the charging device 2, and FIG. 3 is a side view thereof. . In the charging device 2, a worker inserts a band-shaped bar solder 10 into a storage space 5 formed by a pair of flat side walls 3 and 4 through a notch 6 formed in one side wall 3. They can be stacked and stored.

Between the side walls 3 and 4, bottoms 3a and 4
are connected by a plurality of connecting pins 11. Further, an end plate 12 is connected between the portions 3b and 4b of the bar solder 10 facing the front end 10a.
Ends 3c and 4c corresponding to b are connected by an end plate 13. The end plate 12 positions the tip 10 a of the bar solder 10.

A plurality of rollers 15 are rotatably mounted on the bottom 4a of the side wall 4 at equal intervals. Furthermore, between the bottoms 3a, 4a of the side walls 3, 4, the end plates 12,
A guide plate 16 is attached near 13. The guide plate 16 allows the bar solder 10 to be stored in the storage space 5 or when the bar solder 10 is transported, which will be described later.
0 can be prevented from being fitted between the connecting pin 11 and the roller 15 due to the inclination of the 0 from the level L1 described later.

An air cylinder 21 as a pushing means is fixed to a surface 4d of the side wall 4 opposite to the storage space 5. The air cylinder 21 has two pistons 22, 2
3, the tips 22a and 23a of which are connected to the connecting plate 2
4 interconnected. Also, this connecting plate 24
From above, an extrusion pin 26 is provided upright toward a slit 25 formed to communicate with the side wall 4 and the end plate 13.

The slit 25 is formed so as to have the same level as the level of the roller 15 indicated by the reference numeral L1, that is, the level of the bottom surface of the accommodated bar solder 10.
The diameter of 6 is approximately equal to or less than the thickness of the thinnest bar solder of the bar bars 10 to be used. Therefore, when the pistons 22 and 23 contract into the main body 27, the push-out pins 26 are displaced, and only the lowermost bar solder of the bar solder 10 stacked in the storage space 5 is pushed in the transport direction 14. .

The solder bar 1 extruded by the extrusion pin 26
The leading end 10a of the “0” protrudes from an extrusion port 30 formed by a lower end portion 12a of the end plate 12 and a guide plate 16a facing the lower end portion 12a, and meshes with a drive roller 31 arranged opposite to the guide plate 16. Put in. The outer peripheral surface of the driving roller 31 is made of a material having elasticity such as urethane, and the shaft 32 is rotatably supported by bearings 3e and 4e formed on the side walls 3 and 4, respectively. A bevel gear 33 is fixed to one end 32a of the shaft 32. A bevel gear 36 fixed to an output shaft 35 of a motor 34 meshes with the bevel gear 33.

The motor 34 is connected via a bracket 37 to
The side wall 3 is fixed to a surface 3 d opposite to the storage space 5. Therefore, the drive roller 31 is indicated by the arrow 38.
When the motor 34 is rotated so as to rotate in the direction, the tip 10a of the bar solder 10 that has been bitten by the drive roller 31 is further retracted, and thus the bar solder 10 can be transported in the transport direction 14.

A brake roller 41 is provided downstream of the drive roller 31 in the transport direction 14. The brake roller 41 is rotatably supported by a substantially U-shaped bracket 43 by a shaft 42. The bracket 43 is also swingably supported by shafts 44 on bearings 3f, 4f of the side walls 3, 4. One end 42a of the shaft 42 is spring-biased by a tension spring 45 in a direction indicated by an arrow 46, that is, a direction in which the brake roller 41 is pressed against the bar solder 10. The other end 42b of the shaft 42 is in contact with a head 47a of a screw 47 for adjusting the elasticity of the tension spring 45.

Therefore, the bar solder 10 conveyed from the driving roller 31 is braked by the brake roller 41. Therefore, even if the charging device 2 is inclined, the bar solder 10 that has escaped from the drive roller 31 has its rear end 10b held by the brake roller 41,
It is possible to prevent the solder from falling into the solder bath described later.

FIG. 4 is a block diagram showing the overall configuration of the supply device 1. As shown in FIG. This supply device 1 is provided adjacent to the soldering device 51. The soldering device 51 causes the molten solder 53 stored in the solder bath 52 to be jetted by a pump 57, and the jetted surface thereof is brought into contact with the soldered surface 55a of the wiring board 55 conveyed by the conveyor 54. This is an apparatus for simultaneously soldering portions to be soldered in the soldering surface 55a.

As the soldering operation proceeds, the solder bath 52
The molten solder 53 in the inside adheres to the wiring board 55 and gradually decreases, and the liquid level 56 lowers. When the wiring board 55 is soldered in a state in which the amount of the molten solder 53 is reduced in this manner, sufficient solder does not adhere to the soldering surface 55a, so that the soldering strength is reduced and a contact failure occurs. . In order to prevent such a problem, the supply device 1 supplies the bar solder 10.

The supply device 1 is generally provided with the charging device 2.
, A liquid level sensor 61, and a control device 62. The liquid level sensor 61 may be a proximity sensor using magnetism, a float sensor, or an optical sensor that detects the liquid level from the amount of reflected light using a light emitting / receiving element. The output of the liquid level sensor 61 is input to the control device 62.

The control device 62 also includes a solder detection sensor 6 provided near the drive roller 31 of the input device 2.
3 is input. This solder detection sensor 63
Is composed of, for example, a pair of light receiving / emitting elements,
It is detected whether or not the bar solder 10 exists at the position 1.

When the controller 62 detects that the liquid level 56 of the molten solder 53 has dropped by the liquid level sensor 61,
The motor 34 is driven to rotate the drive roller 31, and the bar solder 10 is charged into the solder tank 52. by this,
When the liquid level 56 rises to a predetermined level, the rotation of the drive roller 31 is stopped.

When the solder detection sensor 63 detects that the solder bar 10 has run out while the driving roller 31 is rotating, the solenoid valve 64 is driven to compress the compressed air from the compressed air source 65 such as a compressor. Air is supplied to the air cylinder 21, and the extrusion pin 26 is displaced in the transport direction 14 so that the next bar solder 10 is bitten by the drive roller 31.
In this way, in response to the lowering of the liquid level 56,
By supplying 0, the liquid level 56 is maintained at a predetermined level, and good soldering quality can be secured.

It should be noted that the lowermost layer solder 10 is
When it is extracted from the storage space 5 by 1, the next bar solder 10 descends by its own weight, and can be pushed out by the pushing pin 26.

FIG. 5 is a flowchart for explaining the above-described solder supply operation. The controller 62 reads the output of the liquid level sensor 61 at step n1 and
Is determined to be lower than a predetermined level, and if not, this step n1 is repeated, and when it is detected that the level has dropped, the process proceeds to step n2.
In step n2, the motor 34 is driven to drive the driving roller 3
Rotate 1

In this way, when the transfer of the bar solder 10 is started, the output of the solder detection sensor 63 is read in step n3, and it is determined whether or not the solder has been cut. Returning to step n1, if the solder has run out, the process proceeds to step n4. In step n4, the solenoid valve 64 is driven to operate the air cylinder 2
1 is reciprocated, the lowermost bar solder 10 is extruded in the storage space 5, and the tip 10a is bitten by the drive roller 31. Then, the process returns to the step n1, and the level of the liquid level 56 is determined in advance. When it is lower than the level, the supply of the solder bar 10 is further continued.

Thus, in the supply device 1 according to the present invention,
The rod solder 10 conveyed by the driving roller 31 is held by the brake roller 41 so that it does not slip off even if it escapes from the driving roller 31, so that it is accurate only by the shortage of the solder detected by the liquid level sensor 61. The level of the liquid level 56 can be constantly maintained at a desired level without abruptly changing, and the soldering quality can be improved.

Further, the molten solder 53 is not scattered around and the soldering operation can be performed safely. Furthermore, the operator does not need to constantly monitor the level of the liquid level 56, but only needs to periodically refill the storage space 5 with the solder bar 10, thereby significantly reducing the maintenance and management costs. it can.

[0032]

As described above, according to the present invention, the bar solder extruded from the storage section by the pushing means is conveyed by the drive roller and is held by the brake roller without slipping. Is gently pushed into the solder bath by the rod solder conveyed to the soldering bath. Therefore, it is possible to improve the safety without the splash of the molten solder being scattered to the surroundings, and it is possible to suppress the fluctuation of the liquid level when the solder bar is supplied, and to improve the soldering quality. . Further, the operator only needs to replenish the bar solder on a regular basis, so that maintenance and management work can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view of a charging device 2 used in a supply device 1 according to an embodiment of the present invention.

FIG. 2 is a plan view of the charging device 2;

3 is a side view of the charging device 2. FIG.

FIG. 4 is a block diagram showing the overall configuration of the supply device 1.

FIG. 5 is a flowchart for explaining a solder supply operation.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 supply device 2 input device 5 storage space 10 bar solder 21 air cylinder 26 push pin 31 drive roller 34 motor 41 brake roller 51 soldering device 52 solder tank 53 molten solder 55 wiring board 61 liquid level sensor 62 control device 63 solder detection sensor

Claims (1)

(57) [Scope of request for utility model registration] 1. A detecting means for detecting a liquid level of molten solder in a solder bath, a storage portion disposed adjacent to the solder bath and storing a plurality of bar solders, A pushing means for extruding only one rod, and a drive capable of transporting the bar solder by rotating while the outer peripheral surface is pressed against the extruded bar solder. A roller, a brake roller that presses the outer peripheral surface against the bar solder conveyed by the driving roller to brake and hold the bar solder conveyance, and controls the pushing unit and the driving roller in response to an output of the detection unit. A solder supply device, comprising: a control unit.