JP2535670Y2 - Automatic electrolytic stripper for unnecessary electroplating part of lead frame - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION The present invention relates to an automatic electroplating apparatus for a lead frame for removing an electrodeposited / substituted metal from an unnecessary portion after electroplating the lead frame by electrolytic peeling. The present invention relates to a lead frame automatic electrolytic stripping apparatus.

[0002]

2. Description of the Related Art In an automatic electroplating apparatus for a lead frame, a step of performing electroplating is to perform a surface treatment of a material, and then to perform electroplating on a necessary portion using a jig for shielding an unnecessary portion of the electroplating. Things. At this time, due to the structure of the jig, metal is deposited and displaced on the unnecessary portions on the electroplating surface side, which are unnecessary portions of the electroplating surface, the non-electroplating surface side, and the side surfaces of the lead portions. Therefore, this metal needs to be separated by electrolysis.

[0003] In this apparatus for stripping a metal deposited and substituted and deposited, a lead frame is used as an anode electrode, and a cathode electrode is made of an insoluble metal or a metal which does not significantly affect the stripping solution or electroplating surface by electrolysis. Although the electrolytic stripping is performed, in the conventional apparatus, the cathode electrode is arranged on the electroplating surface side of the lead frame so as to be disposed at an equi-electrode distance.

Therefore, when this apparatus is used, a large amount of current is applied to the tip of the lead in the portion required for electroplating and to the corner portion of the island. There is a drawback that the quality of the product is deteriorated due to peeling, discoloration, and deterioration of the film. On the other hand, on the other hand, there is a defect that the metal deposited and substituted and deposited on the portion where the plating is to be peeled is not peeled, and the current cannot be lowered for the purpose of preventing the above-mentioned product quality deterioration. there were.

[0005]

SUMMARY OF THE INVENTION The present invention has been made in order to solve such conventional disadvantages, and sufficiently removes the metal deposited and replaced on the unnecessary portion of the lead frame by electroplating. An object of the present invention is to provide an automatic electrolytic stripping device for an unnecessary electroplating portion of a lead frame that performs electrolytic stripping to prevent deterioration in quality or insufficient peeling that occurs when trying to do so.

[0006]

According to the present invention, in order to achieve the above-mentioned object, after a lead frame is subjected to automatic electroplating, a metal deposited / substituted and deposited on an unnecessary portion of the electroplating is used to form a lead frame. As an anode, it is a device that automatically conducts electrolytic peeling by flowing a current between a separately provided cathode and
The anode electrode is arranged in the central part of the electrolytic stripping tank, while the lead frame to be electrolytically stripped is sandwiched, and the cathode electrodes are respectively arranged on the opposite sides, and two or more of the anode electrodes are positioned near the center of the electrolytic stripping tank. The cathode electrodes are arranged so as to increase the distance from the electroplating surface side of the lead frame, while the plurality of cathode electrodes located at both ends of the electrolytic stripping tank are located on the non-electroplating surface side of the lead frame. Is characterized by an automatic electrolytic peeling device for an electroplating part that does not require a lead frame and is arranged so that the distance between the electrodes is reduced.

[0007]

According to the present invention, if the electroplating unnecessary portion of the lead frame is subjected to electrolytic peeling by the means of the present invention, a strong current can be applied to the unnecessary portion of the electroplating without applying a strong current to the portion requiring the electroplating. In addition, the metal deposited / substituted and deposited on the unnecessary portion can be effectively electrolytically peeled off without significantly affecting the portion required for electroplating.
In addition, since the electrolytic peeling is continuously performed while the lead frame is transferred after the electroplating, the subsequent steps are also facilitated.

[0008]

FIG. 1 is a plan view showing an embodiment of an automatic electrolytic peeling apparatus for an unnecessary electroplating portion of a lead frame, and FIG.
AA sectional view of FIG. 3, FIG. 3 is a schematic view of a lead frame,
FIG. 4 shows hatched portions of the lead frame of the lead frame which require electroplating, but the lower surface of the leads is unnecessary.

[0009] As shown in the figure, the lead frame 1 after electroplating is placed on a horizontally arranged rotating roller 2 and is sent with its plating surface facing downward. One end of the rotating roller 2 is supported by a concave portion provided in the electrolytic stripping tank 3. The other end is formed by the wall of the electrolytic stripping tank 3 and the side plate 2.
And is connected to the drive chain 4 by a gear provided at the end. The drive chain 4 is driven via a gear provided on an output shaft of a drive motor (not shown), and drives the gear of the rotary roller 2. Upper roller 5
Is arranged above the rotating roller 2 of the lead frame 1,
One end is interlocked with the rotating roller 2 via a gear, and the other end is supported by a recess provided in the electrolytic stripping tank 3. The rotating roller 2 and the upper roller 5 have an interval through which the lead frame 1 can pass. The electrode roller 6 is supported and driven similarly to the upper roller 5, but is always in contact with the lead frame 1 and is energized. This conducting part 7
Are arranged so as to be in contact with the anode electrode 8.
The anode electrode 8 is connected to a positive electrode (anode) of a power supply device (a DC rectifier, a pulse rectifier, or the like), and is disposed in a central portion of the electrolytic stripping tank 3. On the other hand, a plurality of cathode electrodes 9 disposed at both ends of the electrolytic stripping tank 3 are located above the non-plated surface side of the lead frame 1 passing over the rotating roller 2, and are not in contact with each other. 10 to be immersed. Further, two or more cathode electrodes 11 arranged near the center of the electrolytic stripping tank 3 are arranged below the electroplating surface side of the lead frame 1, and the lead frame 1 is larger than the distance between the cathode electrode 9 and the lead frame 1. It is configured to keep the distance with the camera wide. The cathode electrodes 9 and 11 are connected to the negative side (cathode) of the power supply device, and the parts other than those used as electrodes are taken out of the apparatus or covered with a non-conductive material or the like so as not to come into direct contact with the electrolytic stripping solution. Better. The electrolytic stripping solution is sent to the bottom of the electrolytic stripping tank 3 by the pump 13 by the reserve tank 12, keeps the cathode electrode 9 at the liquid surface 10 for immersion, overflows, and returns to the reserve tank 12 again.

Next, the operation of the present invention will be described.

A chemical solution for electrolytic stripping is prepared in a reserve tank 12, and this chemical solution is sent to the bottom of the electrolytic stripping tank 3 by a pump 13, and the liquid surface 10 in which the cathode electrode 9 is immersed is held. Thus, the pressure of the chemical solution sent from the pump 13 is adjusted so as to overflow. The drive chain 4 is linked to the electrolytic stripping tank 3 in such a state from the previous process.
The lead frame 1 with the electroplating surface facing down is continuously transferred onto the rotating roller 2 being rotated. As the lead frame 1 is continuously transferred, the lead frame 1 comes into contact with the conducting portion 7 of the electrode roller 6 connected to the positive side of the power supply device, and the cathode electrodes 9 and 11 connected to the negative side of the power supply device. , And the electrolytic peeling starts.

The lead frame 1 is gradually advanced in the traveling direction by the rotating roller 2 and the upper roller 5,
During the contact, the non-electroplated surface side of the lead frame 1 obtains a stronger current than the upper portion, and the electroplated surface side performs electrolytic peeling with a weaker current than the lower portion. When the contact disappears, the power supply to the lead frame 1 is cut off, and the electrolytic peeling ends.

As described above, since a strong current is applied to the non-plated surface side of the lead frame 1 and a weak current is applied to the plated surface side, a portion of the lead frame 1 that requires electroplating has little effect. Electrodeposition on parts that do not require electroplating
The metal deposited by substitution can be effectively peeled off. In addition, 1 in the figure
4 indicates a lead and 15 indicates an island.

Further, the lead frame 1 may be detected by a lead frame sensing sensor or the like before coming into contact with the energizing section 7, and the power may be supplied to the anode electrode 8 and the cathode electrodes 9 and 11 by a power supply device. In addition, in the above embodiment, the lead frame 1 and the cathode electrodes 9 and 11
The conditions for electrolytic stripping such as the distance between the electrodes, the area ratio, the amount of current, the electrolytic stripping time, and the like have an appropriate range depending on the surface area of the lead frame 1, the type of the electrolytic stripping solution, and the like. Just do it.

[0015]

[Effects of the Invention] As described above, the apparatus of the present invention has a problem in that when the electrodeposited / substituted metal is peeled off from the unnecessary portion of the electroplating generated at the time of electroplating the lead frame, the remaining portion of the electroplated portion is not necessary. The metal deposited / substituted and deposited on the unnecessary portion of the electroplating can be effectively peeled off without affecting. In addition, this apparatus can be implemented as one of the post-processing steps of an electroplating apparatus, and since two or three or more rows can be subjected to electrolytic stripping simultaneously, the subsequent steps can be facilitated.

[Brief description of the drawings]

FIG. 1 is a plan view showing an embodiment of an automatic electrolytic peeling device for an unnecessary electroplating portion of a lead frame.

FIG. 2 is a sectional view taken along the line AA of FIG. 1;

FIG. 3 is a schematic view of a lead frame.

FIG. 4 is a perspective view in which a required portion of a lead end portion of the lead frame for electroplating is hatched.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lead frame 2 Rotating roller 3 Electrolysis peeling tank 4 Drive chain 5 Upper roller 6 Electrode roller 7 Current-carrying part 8 Anode electrode 9, 11 Cathode electrode 10 Liquid level 12 Reserve tank 13 Pump 14 Lead 15 Island

Claims (1)

(57) [Scope of request for utility model registration] After performing automatic electroplating on a lead frame, a current is passed between a metal deposited and substituted and deposited on an unnecessary portion of the electroplating between a lead frame as an anode and a separately provided cathode. A device for automatically performing electrolytic stripping, wherein an anode electrode is arranged in a central portion of an electrolytic stripping tank, a lead frame to be electrolytically stripped is sandwiched, and a cathode electrode is arranged on each of the opposing sides, and the electrolytic stripping tank is provided. The two or more cathode electrodes positioned near the center of the lead frame are arranged so as to have a large distance from the electroplating surface side of the lead frame, while the plurality of cathode electrodes positioned at both ends of the electrolytic stripping tank are arranged. An automatic electrolytic stripping apparatus for a lead frame unnecessary electroplating part, wherein the distance from the non-electroplating surface side of the lead frame is reduced. .