JP2533460B2 - Chip component mounting device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip component mounting apparatus for automatically mounting a chip component on a printed circuit board. The chip component mounting apparatus is shortened by increasing the concentration density of its component supply section. And aim to make it smaller,
It is possible to reduce the mounting time of the chip component.

[0002]

2. Description of the Related Art The suction means of a suction head moving in a plane parallel to a printed circuit board conveyer corrects the position and direction of the chip parts that have sucked the chip parts of each component supply section with respect to the suction means. A chip component mounting device that mounts a chip component adsorbed at a predetermined position on the top is conventionally known (Japanese Patent Laid-Open No. 59-87900). In the above-mentioned known chip component mounting device, the chip component supply unit is arranged on one side of the printed circuit board transport path (conveyor), and the suction head support and guide mechanism are provided on the printed circuit board transport path so as not to interfere with the chip component supply unit. Since it is provided on the other side of the
The installation length of the component supply unit becomes longer in the printed circuit board transport direction, and as a result, the distance between the printed circuit board on which the chip component is to be mounted and the chip component supply unit becomes longer. Since it becomes longer, there is a problem that the mounting time of the chip component becomes longer and the working efficiency thereof decreases. Further, since a guide member for guiding the suction head so as to be movable in a direction perpendicular to the printed circuit board conveyance direction is extended outside the device on the other side of the printed circuit board conveyance path, the guide member moves. However, there is a problem that the space below is a dead space, the space utilization rate is low, and the area occupied by the chip component mounting apparatus is large.

[0003]

SUMMARY OF THE INVENTION In order to solve both of the problems described above, the present invention provides a suction head in a centralized manner so that the chip component supply portions can be arranged on both sides of a printed circuit board conveyance path. An object of the present invention is to devise a support and guide mechanism for a suction head so that the support of the suction head and the strength and rigidity of the guide mechanism can be improved in order to improve the efficiency of component mounting work.

[0004]

[Means for Solving the Problems] The measures taken to solve the above problems are constituted by the following elements (a) to (n). (A) Two frames that are orthogonal to each other are provided in the space above the printed circuit board transport conveyor, one frame is a fixed frame, and the other frame is a running frame. (B) The running frame can run on the fixed frame. (C) The fixed frame is a pair of guide rails provided in parallel with each other across the printed circuit board conveyor, and (d) the traveling frame has both ends of the pair of guides. Both ends of the frame are guided and supported by rails so that they can travel. (E) A first guide rail that supports and guides the suction head support portion on the traveling frame and a first drive that drives the suction head support portion. And a first driving force transmission means for transmitting the driving force of the driving source to the suction head supporting portion driving means, and the suction head supporting portion is driven as described above. Along the row frame, supported and guided so as to be able to travel in the same direction as the direction in which the board transfer conveyor is carried, (f) Running and driving a running frame that runs in a direction perpendicular to the direction in which the board transfer conveyor is carried out. Two drive sources and a second drive force transmitting means for transmitting the drive force of the drive source to the traveling frame traveling drive means are provided outside the pair of guide rails, and (g) the pair of guide rails. In between, a plurality of component supply units are arranged along the board conveyer, (h) The pair of guide rails are extended in the end direction of the component supply unit from the component suction position (P ₂ ), ) Arranging a plurality of suction heads on the suction head support portion along a traveling frame, (e) the first guide rail, and the first driving force transmission means for driving the suction head support portion to travel. Placed between the suction head.

[0005]

[Operation] Two frames that are orthogonal to each other are provided in the space above the printed circuit board conveyer, one frame is a fixed frame and the other frame is a running frame, and the running frame can run along the fixed frame. Since the traveling frame is supported and guided by the fixed frame, the traveling frame moves in the space above the printed circuit board conveyor in a direction parallel to the printed circuit board conveyor (for example, the X-axis direction) or orthogonal to the printed circuit board conveyor (for example, the Y-axis direction). can do. Then, since the suction head support portion is supported and guided so as to be able to travel along the traveling frame, the suction head moves in a space above the suction head transport conveyor in a direction orthogonal to the substrate transport conveyor (for example, the Y-axis direction), Alternatively, it can move along the traveling frame in a parallel direction (X-axis direction). As a result, the suction head can move in the X-axis and Y-axis directions in the space above the printed circuit board transport conveyor and the space above both sides of the conveyor. Therefore, even if the component supply unit is arranged on both sides of the printed circuit board transport conveyor, the suction head is supported, and the suction mechanism does not interfere with the component supply unit arranged on both sides of the printed circuit board transport conveyor. Chip components can be picked up from the component supply unit by accessing the component supply units arranged on both sides of the printed circuit board conveyer from above. Therefore, the component supply parts can be arranged on both sides of the printed circuit board transport conveyor. Further, since the fixed frame is a pair of parallel guide rails provided across the printed circuit board conveyer, and the traveling frame is a both-ends supporting frame that is guided and supported by the pair of guide rails so that the traveling frame can travel. Can be stably driven with a simple structure on the component supply units arranged on both sides of the printed circuit board conveyor. Furthermore, between the pair of parallel guide rails described above, along the board transport conveyor, the component supply units are arranged, so a large number of component supply units are collectively arranged along the printed circuit board transport conveyor, and a large number of these are provided. It is possible to efficiently transfer the component from the component supply section to the printed circuit board on the printed circuit board conveyer by a large number of suction heads, and furthermore, it is possible to easily perform the component supply operation to the large number of component supply sections. Furthermore, the fixed frame is a pair of guide rails provided across the printed circuit board conveyor, and both ends of the traveling frame are guided so as to be capable of traveling on the pair of parallel guide rails, and both end supporting frames are supported, ,
Install the pair of guide rails at the component suction position (P ₂ ).
By extending the suction head to the component supply portion side, it is possible to adopt a configuration in which a plurality of suction heads are mounted on the suction head support portion and are stably supported and run. (When the traveling frame is cantilevered, since the suction head support is bent and the traverse is not stable, it is impossible to find a configuration in which a plurality of suction heads are mounted on the suction head support). Furthermore, the traveling frame supported and guided by the guide rails can be retracted to the vicinity of the end of the component supply unit. Since maintenance work can be performed with a large space above the component suction position, the workability can be improved. Furthermore, a configuration is adopted in which a plurality of suction heads are arranged on the suction head support portion along a traveling frame, and the first guide rail is configured to drive the suction head support portion to travel. By adopting a configuration in which it is arranged between the driving force transmission means and the suction head, the mechanism / structure of the chip component mounting device can be configured with high rigidity and as small as possible, compact and lightweight. As a result, acceleration and deceleration for starting and stopping the chip component mounting apparatus can be accelerated (because the inertial mass can be reduced as much as possible), and the chip component mounting operation can be significantly speeded up.

[0006]

[Examples] Next, examples will be described with reference to the drawings. A cabinet 1 (see FIG. 11) of the chip component mounting apparatus is provided with a conveyor 2 as a printed board carrying path (hereinafter referred to as “board carrying path”), and the printed board 3 is carried from one side of the conveyor 2, When the printed circuit board 3 reaches the chip component mounting position P ₁ , the conveyor 2 is temporarily stopped, and the chip component is stopped at the chip component mounting position P ₁ . A pair of left and right guide rails (fixed frames) 5 and 5 which are installed across the conveyor and are orthogonal to the conveyor 2 are fixed,
A frame (running frame or movable frame) 4 parallel to the conveyor 2 is guided and supported by guide rails 5 and 5 at both ends thereof (see FIG. 10). A lead screw (second driving force transmitting means) 6 parallel to the guide rail 5 is rotatably provided outside the guide rail 5, and the lead screw is screwed into a screw hole at one end of the frame 4. This lead screw is rotated by a motor (second drive source) 7, and the lead screw is normally or reversely rotated, so that the frame 4 moves in a direction perpendicular to the conveying direction of the conveyor 2 (Y-Y direction in FIG. 10). Sent. A head support portion 8 is guided and supported by a frame (running frame or movable frame) 4 so as to run along a guide rail (first guide rail) 9 of the frame 4. A lead screw (first driving force transmitting means) 10 driven by a motor (first drive source) 11 is screwed into a screw hole of the head support portion 8, and the head support portion is rotated by the rotation of the lead screw. Is parallel to the conveying direction of the conveyor 2 (X- in FIG. 10).
Sent in the X direction). YY for frame 4 above
By the feeding in the direction and the feeding in the XX direction with respect to the head supporting portion, the head supporting portion 8 can move vertically and horizontally in the upper space of the conveyor 2 and the upper spaces of both sides thereof. On the cabinet, between the pair of guide rails, the conveyor 2 is sandwiched, and chip component supply units (hereinafter referred to as “component supply units”) 12 are provided on both sides thereof.
The component supply unit 12 includes a reel around which a rectangular parallelepiped chip component 14 is releasably attached at regular intervals and which is wound up, and a feeding mechanism 16 (see FIG. 2) for simply feeding out the adhesive tape. It is composed.
Although the mechanism itself of the component supply unit 12 is not specially new, its outline is as follows. The feed mechanism 16 includes an input wheel 19 having a ratchet wheel 17 and a hook 18, and the ratchet wheel 17 is rotated integrally with a feeder wheel (not shown) that meshes with the feed hole of the adhesive tape 13. Then, the input vehicle 19 is moved to the arrow A by pushing the push rod 20 downward.
While being rotated by a certain angle in the direction, it is then pulled back by the spring 21, and the claw 18 rotates the ratchet wheel 17 by a certain angle in the direction of the arrow B by the pulling back of this spring. By the rotation of the ratchet wheel 17, the adhesive tape 13 is intermittently fed out at a constant pitch, and the chip component 14 at the tip thereof is sequentially fed to the suction position P ₂ . Parts supply unit 12, 1
2 are provided facing each side of the conveyor 2,
Many kinds of chip parts are delivered to the suction position P ₂ near both side ends of the conveyor 2 by the large number of adhesive tapes 13 of each part supply unit. The head supporting portion 8 can freely move in these upper spaces without interfering with the component supplying portions on both sides of the conveyor 2, and the suction head 22 provided on the head supporting portion 8 is separated from the component supplying portion 12. Since the chip components sent to the suction position P ₂ can be accessed from above, the head support portion 8 can smoothly handle various types of chip components by moving in the XX direction within a narrow range. By the way, the head supporting portion 8 is provided with three suction heads 22.
The suction head 22 attaches the chip component 14 located at the suction position P ₂ to the chip component mounting position P ₁
The printed circuit board 3 is moved to a predetermined position. The mechanism and structure of the suction head 22 will be described below with reference to FIGS. 1 to 6. The head main body 23 is supported by the head supporting portion 8 and
A cylinder 24 and a mounting hole 25 having a diameter larger than that of the cylinder 24 are coaxially formed therein. A lid member 26 that closes the upper end release portion of the cylinder 24 is attached to the upper surface of the head body 23, and an intermediate member 27 that closes the lower end release portion of the cylinder 24 is fitted in the mounting hole 25. There is. Inside the mounting hole 25, a cylindrical guide 30 is coaxially supported via a sleeve 28 and a bearing 29, and the lower end of this guide 30 projects below the mounting hole 25. A hollow shaft component 31 is inserted into the cylinder 24 and the guide 30,
The shaft part 31 includes the outer shaft 32 and the inner shaft 3.
It has a double structure in which 3 and 3 are fitted so as to be slidable in the axial direction. The inner shaft 33 constitutes a mounting means and has a vacuum passage 34 extending in the axial direction therein. The upper end of the shaft part 31 penetrates the lid member and projects upward, and the upper end of the inner shaft 33 projects higher than the outer shaft 32. The upper end of the inner shaft 33 has a bearing 35. The end cap 36 is fitted in through. The vacuum passage 34 in the inner shaft 33 is connected to the end cap 36 via a hose 37 and a communication passage 38 in the head main body 23 to form a vacuum pump 39.
Is in communication with. The lower end of the inner shaft 33 is
A rubber damper 40 is fitted and fixed to the outer periphery of the outer shaft 32 at a position axially separated from the lower end surface of the outer shaft 32 by a distance L _{1 on} the outer periphery of the outer shaft 32. When the outer shaft 32 descends, the lower end of the outer shaft 32 comes into contact with the rubber damper 40 to push the inner shaft 33 downward. An adsorption nozzle (adsorption means) 41 for adsorbing the chip component 14 is mounted in the lower end opening of the vacuum passage 34 opening to the lower end surface of the inner shaft 33, and the adsorption nozzle 41 is provided with a shaft via a coil spring 42. When the chip component 14 is changed in thickness, the change in thickness can be absorbed by compressing the coil spring. A piston 45 that partitions the inside of the cylinder 24 into an upper chamber 43 and a lower chamber 44 is attached to the outer periphery of the outer shaft 32. These upper chambers 43
The lower chamber 44 and the lower chamber 44 are in communication with air pumps 46, 46 via air supply paths 47, 47, respectively. By supplying air to the upper chamber 43 or the lower chamber 44, the outer shaft 32 descends together with the piston 45. Or be raised. Therefore, the cylinder 24 and the piston 45
Constitutes the drive means for the outer shaft 32. Further, two guide shafts 51, 51 for guiding the up-and-down movement of the inner shaft 33 are connected to the bracket 50 provided on the end cap 36. The guide shafts 51, 51 slidably pass through the vertical holes of the head body 23 and extend below the shaft component 31, and the suction head 22 has a suction position P _{2 at} one lower end thereof.
When it is located at, it faces the pressing rod 20 of the feed mechanism 16. The inner shaft 33 and the guide shaft 5
1, 51 are urged upward via a return spring 52. An adjusting screw 53 for stroke adjustment is screwed into the lid member 26 through which the shaft component 31 penetrates. The upper portion of the adjusting screw 53 penetrates the bracket 50 in the vertical direction, and the adjusting screw 53 is in contact with the upper surface and the lower surface of the bracket 50 and restricts the stroke amount of the inner shaft 33 and the guide shafts 51, 51. 54,
55 is attached. The stopper 55 that abuts the lower surface of the bracket 50 is provided at a position separated from the lower surface by a distance L ₂ , and this distance L ₂ is the outer shaft 3.
It is set to be larger than the distance L ₁ between the lower end surface of 2 and the damper 40. Therefore, the inner shaft 33 is
When the lower end of the outer shaft 32 comes into contact with the damper 40, the outer shaft 32 and the outer shaft 32 start to descend integrally. The stroke amount L of the outer shaft 32 and the piston 45 is L ₁ + L ₂ . Further, the outer peripheral surfaces of the outer shaft 32 and the inner shaft 33 are flatly cut at a portion penetrating the guide 30, and the rotation stopping pins 57 which are in point contact with the flat surfaces 32a, 33a of the both shafts 32, 33 are pivotally supported. ing. As a result, the guide 30, the outer shaft 32, and the inner shaft 33 are connected so as to be relatively slidable in the axial direction but not relatively rotatable in the rotational direction. Therefore, the three members rotate together. A piston rod 63 of an air cylinder 62 is connected to an outer peripheral portion of the guide 30 via a joint 60, and the expansion, contraction, and expansion of the piston rod 63 causes the guide 30, the outer shaft 32, and the inner shaft 33 to fall within a predetermined range ( They are rotated together at 90 degrees, for example. By the way, at the lower end of the guide 30,
Four correction arms 63a, 63b and 64a for positioning the chip component 14 sucked by the suction nozzle 41,
64b are arranged at equal intervals in the circumferential direction. These correction arms 63a, 63b and 64a, 64b are a set of two diametrically opposed arms, the upper end of which enters the slit 65 ... Formed in the lower end of the guide 30 and the pivot 66 It is supported via the guide 30 so as to be rotatable in the radial direction. And the correction arms 63a, 63
A sandwiching piece 67 sandwiching two opposite surfaces of the chip component 14 is fixed to the lower ends of b, 64a and 64b.
Further, a lever portion 68 is integrally formed on the upper end portion thereof so as to project radially outward from the guide 30. Such correction arms 63a, 63b, 64a, 64b are arranged so as to surround the outer side of the shaft component 31, and the surfaces facing the shaft component 31 sandwiching the shaft component 31 when the outer shaft 32 descends. A cam portion 69 that is in contact with the outer peripheral surface of the lower end portion of the outer shaft 32 is provided in a protruding manner. The cam portion 69 extends obliquely inward, and depending on the shape of the cam portion 69, the correction arms 63a, 63b, 64a, 64b.
The lower end of the is expanded radially outward. Then, the cam portion 69 of the correction arm 63a, 63b, 64a, 64b
As shown in FIGS. 1 and 3, is located above the damper 40 at the lower end of the inner shaft 33. Further, the correction arms 63a, 63 are provided on the outer peripheral surface of the lower end portion of the guide 30.
sleeve 70 for urging b, 64a, 64b in the closing direction
Are fitted so as to be slidable in the axial direction. Sleeve 70
Has a double structure of an inner sleeve 71 for interlocking the correction arms 63a, 63b of one set and an outer sleeve 72 for interlocking the other correction arms 64a, 64b, and each sleeve 71, 72 is directed downward by a return spring 73. The lower end portion is abutted against the lever portion 68. In this case, the lower end portion of the inner sleeve 71 is provided with a recess 74 to avoid interference with the lever portion 68 of the other pair of correction arms 64a and 64b, and the lower end portion of the outer sleeve 72 thereof is provided with One set of correction arms 6
A recess 75 is provided to avoid interference with the lever portion 68 of 3a and 63b. Therefore, the correction arm 63a,
63b and 64a, 64b are independently opened and closed for each set by an inner sleeve 71, an outer sleeve 72 and an outer shaft 32. The correction arms 63a, 63b, 6
4a and 64b include inner shaft 3 when they are closed.
A damper 80 that comes into contact with the outer periphery of the lower end portion of 3 is attached, and the damper 80 is mounted via a coil spring 81 so as to be slidable in the opening / closing direction of the correction arms 63a, 63b, 64a, 64b. This absorbs and relaxes the shock when the sandwiching piece 67 sandwiches the chip component 14. In such a configuration, the X of the head support portion 8
When the suction head 22 stops at the suction position P ₂ due to the movement in the Y direction, the upper chamber 43 is passed through the air pump 46.
Is supplied with air, the piston 45 is pushed downward, and the outer shaft 32 connected to the piston 45 starts to descend. At this time, since the inner shaft 33 is biased upward by the return spring 52, the inner shaft 33 is
Never descends integrally with the outer shaft 32. When the outer shaft 32 descends and the outer peripheral surface of the lower end thereof contacts the cam portion 69 of each correction arm 63a, 63b, 64a, 64b, each correction arm 63a, 63b, 64a, 64b presses the sleeve 71, 72. It begins to open at the same time against the urging force of 73. As shown in FIG. 8, in order to reduce the time required for mounting the chip component, the timing at which the correction arm opens to separate from the chip component and the timing at which the suction nozzle starts descending can be set to be substantially the same. Further, by adjusting the timing of the lowering of the correction arm control means and the lowering of the suction nozzle appropriately in accordance with the largest chip component to be handled, all of the chip components to be handled have the suction nozzle after the correction arm is opened. It is possible to allow the chip component to be lowered after it has started to be lowered. As shown in FIG. 8, when the lower end portion of the outer shaft 32 passes through the cam portion 69 and comes into contact with the damper 40, the inner shaft 33 and the guide shaft 51 follow the outer shaft 32 and start descending. Due to the lowering of the inner shaft 33, the suction nozzle 41 projects from between the sandwiching pieces 67, and the one guide shaft 51 pushes in the pressing rod 20 to feed the feeding mechanism 1.
The input wheel 19 of 6 is rotated by a certain angle. When the inner shaft 33 descends to the lowest position and the suction nozzle 41 sucks the upper surface of the chip component 14, the upper chamber 43 is evacuated and the lower chamber 44 is supplied with air from the air pump 46. As a result, the piston 45 receives an upward force and the outer shaft 32 starts to rise, whereby the inner shaft 33 is pushed up by the urging force of the return spring 52, and the chip component 14 is peeled off from the adhesive tape 13. Simultaneously with the rise of the inner shaft 33, the guide shaft 51 also rises, and the input wheel 19 and the ratchet wheel 17 of the feed mechanism 16 are pulled back by the spring 21, so that the adhesive tape 13 is fed out and the next chip component 14 is sucked at the suction position P. Sent to ₂ . By the way, the correction arms 63a, 63b, 64a, 64b are provided with sleeves 71, 7
2 always receives a biasing force in the closing direction, and its cam portion 6
Since 9 is in contact with the outer peripheral surface of the lower end of the outer shaft 32,
When the lower end of the outer shaft 32 rises to the position of the cam portion 69, the correction arms 63a, 63b, 64a, 64
The holding piece 67 of b sandwiches the side surfaces of the chip component 14 sucked by the suction nozzle 41 from the directions orthogonal to each other. By this insertion, the chip component 14 with respect to the suction nozzle 41
The position of the chip component is adjusted with respect to the suction nozzle by adjusting the positions in the width direction and the longitudinal direction. Next, the head support portion 8 moves again in the XY directions, the suction head 22 that has sucked the chip component 14 is stopped at a predetermined position on the printed circuit board 3 at the chip component mounting position P ₁ , and sucked by the air cylinder 62. Nozzle (adsorption means) 41 and correction arms 63a, 63b, 64a, 64b
Are integrally rotated within a predetermined range (for example, 90 degrees), and the mounting direction of the chip component 14 is selected. Subsequently, the lower chamber 44 is evacuated, and at the same time, air is supplied to the upper chamber 43 and the shaft component 31 starts to descend, so that the correction arms 63a, 63b, 64a, 64b start to open again.
After that, as shown in FIG. 7, the suction nozzle 41 descends and the sucked chip component 14 is placed at a predetermined position on the printed circuit board 3. Then, the suction of the chip component 14 is released, and the mounting on the printed circuit board 3 is completed. Note that reference numeral B in FIG. 7 indicates an adhesive agent for fixing the chip component 14. The shape of the chip component is not limited to a rectangular parallelepiped, and it may be circular or cylindrical, and the number of correction arms may be appropriately selected according to the shape of the chip and the usage of the chip component mounting apparatus. Is.

[0007]

[Effect] The action of the present invention is

As described in the section of "Functions", the present invention has the following unique effects. (1) A large and heavy traveling frame equipped with a suction head can carry out a predetermined component mounting operation only by moving a short distance between the component supply unit and the substrate, so that it is large and heavy. The moving distance of a certain traveling frame can be shortened as much as possible, the chip mounting speed can be increased accordingly, and the load on the traveling drive device of the traveling frame can be reduced. Further, even in the case where a large number of component supply units are arranged along both sides of the substrate transfer conveyor, by adjusting the moving distance of the suction head support unit, which is lighter than the traveling frame, it is possible to reduce the number of chip component supply units. It is possible to suppress the decrease in the chip component mounting speed due to the parallel arrangement as much as possible. (2) By extending the pair of parallel guide rails to the component supply unit side from the component suction position (P ₂ ), the traveling frame supported and guided by the guide rails is retracted to near the end of the component supply unit. Therefore, at the time of maintenance work such as the printed circuit board transport conveyor and the feed mechanism of the component supply unit, it is possible to perform maintenance work by leaving a large space above the printed circuit board transport conveyor and the component suction position. It is possible to improve the sex. (3) When mounting a plurality of suction heads, the head support portion must be increased in size according to the number of suction heads, but since the suction heads are arranged along the traveling frame in the present invention, the suction head support portion is Since it only becomes longer along the traveling frame, it is possible to install a plurality of suction heads in an effortless manner, and the length of the suction head support portion becomes longer along the traveling frame. The support and guidance of the chip are extremely stable, and since multiple suction heads are arranged parallel to the arrangement of the component supply parts, it is possible for multiple suction heads to suction chip components simultaneously while the traveling frame is stopped. Therefore, the inefficient operation of moving the large and heavy traveling frame to suck the chip components on the respective suction heads becomes unnecessary. Therefore, it is possible to quickly perform the operation of attracting the chip components of the component supply unit to the plurality of suction nozzles. (4) Since the driving unit for driving the traveling frame is arranged outside the pair of guide rails parallel to each other, arrangement of the component supply unit, the board transfer conveyor, the suction head, etc. arranged between the pair of guide rails. The degree of freedom is high, and the movable range of the suction head is not restricted by the presence of the drive unit. (5) Since the first guide rail serving as a fulcrum is arranged between the suction head and the first drive transmission means, the driving force is smoothly transmitted to the suction head support portion that drives the suction head support portion. Therefore, the suction head support can be stably run.

[Brief description of drawings]

FIG. 1 is a sectional view of an example.

FIG. 2 is a side view of the suction nozzle of FIG.

FIG. 3 is an enlarged cross-sectional view around the suction nozzle and the correction arm in FIG.

FIG. 4 is a view on arrow U in FIG.

5 is a perspective view around the correction arm of FIG. 1. FIG.

6 is a cross-sectional view taken along line VV of FIG.

FIG. 7 is a cross-sectional view showing a state in which the suction nozzle is most lowered.

FIG. 8 is a cross-sectional view showing a positioning state of a chip component.

9 is a view on arrow W of FIG. 8. FIG.

FIG. 10 is a plan view of the entire chip component mounting apparatus to which the present invention has been applied.

11 is a side view of FIG.

[Explanation of symbols]

 2 ... Conveyor (conveyance path) 3 ... Printed circuit board (board) 4 ... Frame (running frame or movable frame) 5 ... Guide rail (fixed frame) 8 ... Head support 12. ..Component supply unit 14 ... Chip component 22 ... Suction head 24, 45 ... Drive means (cylinder, piston) 30 ... Guide 31 ... Shaft component 32 ... Outer shaft (correction arm Control means) 33 ... Inner shaft 41 ... Suction nozzle (suction means) 63a, 63b, 64a, 64b, ... Correction arm 68 ... Lever portion 69 ... Cam portion 70 ... Sleeve

Claims (1)

(57) [Claims] 1. On the printed circuit board, the position and direction of each component supply unit with respect to the chip component suction unit that has sucked the chip component are corrected by the suction unit of the suction head that moves in a plane parallel to the printed circuit board conveyor. In the chip component mounting device for mounting the chip component adsorbed at the predetermined position, two frames that are orthogonal to each other are provided in the space above the printed circuit board transport conveyor, one frame is a fixed frame, and the other frame is a traveling frame, The traveling frame is movably supported and guided by a fixed frame, the fixed frame is a pair of parallel guide rails provided across the printed circuit board conveyor, and the traveling frame is a pair of guides at both ends thereof. Both ends of the frame are supported and guided by rails so that they can travel. Supporting the suction head support portion arm, first to drive the suction head supporting portion and the first guide rail for guiding
And a first driving force transmitting means for transmitting the driving force of the driving source to the suction head supporting portion driving means, and the suction head supporting portion is conveyed along the traveling frame by the substrate conveying conveyor. A second drive source that drives and drives a traveling frame that travels in a direction perpendicular to the transport direction of the substrate transport conveyor by supporting and guiding the traveling frame in the same direction, and the driving force of the drive source to drive the traveling frame. Second to communicate to means
And a driving force transmission means of the pair of guide rails are provided outside the pair of guide rails, and a plurality of component supply units are arranged between the pair of guide rails along the board transport conveyor. P ₂ )
The first guide rail is arranged to extend in the end direction of the component supply section, the plurality of suction heads are arranged on the suction head support along the traveling frame, and the first guide rail is driven to travel the suction head support. Chip component mounting device disposed between the driving force transmission means of the device and the suction head.