JP2533225B2 - How to connect TAB tape - Google Patents

How to connect TAB tape

Info

Publication number
JP2533225B2
JP2533225B2 JP2208753A JP20875390A JP2533225B2 JP 2533225 B2 JP2533225 B2 JP 2533225B2 JP 2208753 A JP2208753 A JP 2208753A JP 20875390 A JP20875390 A JP 20875390A JP 2533225 B2 JP2533225 B2 JP 2533225B2
Authority
JP
Japan
Prior art keywords
connection
terminal portion
conductive film
tape
tab tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2208753A
Other languages
Japanese (ja)
Other versions
JPH0499039A (en
Inventor
裕明 小林
健一 黒岩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP2208753A priority Critical patent/JP2533225B2/en
Publication of JPH0499039A publication Critical patent/JPH0499039A/en
Application granted granted Critical
Publication of JP2533225B2 publication Critical patent/JP2533225B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits

Description

【発明の詳細な説明】 〔概要〕 TABテープの接続方法に関し、 液晶表示パネルの基板端子部とTABテープのテープ端
子部の接続に際して、仮接続したTABテープの交換を可
能にして、その接続を確実にするとともに液晶表示パネ
ルの品質,信頼性および歩留りの向上を目的とし、 液晶表示パネルのガラス基板上の基板端子部に接続用
導電膜を用いてTABテープのテープ端子部を接続するTAB
テープの接続方法において、前記基板端子部あるいはテ
ープ端子部のいずれか一方に前記接続用導電膜を半硬化
処理による仮接続をしたあと、両端子部の位置合わせと
再度前記接続用導電膜の半硬化処理による仮接続を行
い、両端子部の接続状態を検査確認したあとで前記接続
用導電膜を硬化条件で処理することにより本接続状態に
するようにTABテープの接続方法を構成する。
[Detailed Description of the Invention] [Outline] Regarding the connection method of the TAB tape, when connecting the substrate terminal portion of the liquid crystal display panel and the tape terminal portion of the TAB tape, it is possible to replace the TAB tape that has been temporarily connected, and connect it. TAB that connects the tape terminal part of the TAB tape with the conductive film for connection to the substrate terminal part on the glass substrate of the liquid crystal display panel for the purpose of ensuring the quality, reliability and yield of the liquid crystal display panel.
In the tape connecting method, after temporarily connecting the conductive film for connection to either one of the substrate terminal portion or the tape terminal portion by a semi-curing treatment, the terminals are aligned and the conductive film for connection is half-finished again. A TAB tape connection method is configured so that temporary connection is performed by curing treatment, and after the connection state of both terminal portions is inspected and confirmed, the connection conductive film is treated under curing conditions to achieve the main connection state.

〔産業上の利用分野〕[Industrial applications]

本発明は液晶表示パネルなどの電極端子部へのTABテ
ープの接続方法の改良に関する。
The present invention relates to an improvement in a method of connecting a TAB tape to an electrode terminal portion of a liquid crystal display panel or the like.

近年、表示装置の発展は目覚ましく、とくに、平面デ
ィスプレイは薄型・軽量などの点から急速に普及してき
た。なかでも液晶表示装置は駆動電圧が低く、低価格で
あることからパソコンやワープロなどOA機器分野への導
入が活発である。
2. Description of the Related Art In recent years, the development of display devices has been remarkable, and in particular, flat displays have rapidly spread due to their thinness and light weight. Among them, liquid crystal display devices have a low driving voltage and are low in price, so that they are being actively introduced into the field of office automation equipment such as personal computers and word processors.

これらの用途に用いられる液晶表示パネルは、文字表
示や図形表示が求められるので必然的に大画面,多画
素,高精細の方向へ向かっており、液晶表示パネルの表
示用ライン電極の端子数は、数100本以上に達するもの
があり、駆動回路との接続を確実に行うとともに高価な
液晶表示パネルの仕損を低減することがますます重要に
なってきている。
Since liquid crystal display panels used for these purposes are required to display characters and figures, they are inevitably moving toward large screens, multiple pixels, and high definition, and the number of display line electrodes for liquid crystal display panels is There are some hundreds or more, and it is becoming more and more important to surely connect with the driving circuit and reduce the damage of the expensive liquid crystal display panel.

〔従来の技術〕[Conventional technology]

液晶表示装置は、一般に2枚のガラス基板にストライ
プ状の透明電極(ITO:In2O3−SnO2)を形成し、両電極
面を対面させ、かつ、互いに直交させ10μm程度の間隔
をあけて張り合わせる。そして、前記2枚のガラスパネ
ルが作るギャップに液晶を注入して電圧を印加すると、
液晶の電気光学効果と両側に配設した偏光板により両ス
トライプ状電極の交点が光スイッチとなって画素を構成
し明暗の表示が行なわれる。
In general, a liquid crystal display device has two glass substrates on which stripe-shaped transparent electrodes (ITO: In 2 O 3 -SnO 2 ) are formed, both electrode surfaces are opposed to each other, and are orthogonal to each other with a space of about 10 μm. Stick together. Then, when liquid crystal is injected into the gap formed by the two glass panels and a voltage is applied,
The electro-optical effect of the liquid crystal and the polarizing plates disposed on both sides serve as optical switches at the intersections of the two striped electrodes to form pixels, thereby displaying light and dark.

ストライプ状の透明電極の末端は基板端子部を構成し
ており、それぞれ駆動回路に適宜接続され動作時に両ス
トライプ状電極の交点が駆動制御されるようになってい
る。
The ends of the striped transparent electrodes form substrate terminal portions, which are appropriately connected to drive circuits so that the intersections of the striped electrodes are drive-controlled during operation.

基板端子部の駆動回路への接続方法として現在最も多
く使用されているのは、TABテープ(Tape Auto−mated
Bonding)を使用する,いわゆる、TAB方式である。
TAB tape (Tape Auto-mated) is currently the most commonly used method of connecting circuit board terminals to drive circuits.
This is the so-called TAB method using Bonding).

第3図は駆動電極用基板端子部とTABテープの接続例
を示す図で、同図(イ)は平面図、同図(ロ−1),
(ロ−2)はA−A′断面図である。
FIG. 3 is a diagram showing an example of connection between the drive electrode substrate terminal portion and the TAB tape. FIG. 3 (a) is a plan view, FIG. 3 (b-1),
(B-2) is a sectional view taken along the line A-A '.

図中、10は液晶表示パネルのガラス基板で,たとえ
ば、大きさ200mm×300mm、厚さ1.1mmの透明なガラス
板、11a〜11gはストライプ状の透明電極(ITO:In2O3−S
nO2)で,たとえば、巾0.27mm,厚さ100nm,隣接電極間隔
0.03mm,すなわち、電極間ピッチは0.3mm程度に形成され
たものである。1は前記ストライプ状の透明電極(IT
O)の未満に形成された基板端子部で、この例では前記
ストライプ状の透明電極11a〜11gと等ピッチで、巾が0.
15mm,スペースが0.15mmのライン/スペース等間隔の基
板端子部の電極列1a〜1gによって構成されている。
In the figure, 10 is a glass substrate of a liquid crystal display panel, for example, a transparent glass plate having a size of 200 mm × 300 mm and a thickness of 1.1 mm, and 11a to 11g are striped transparent electrodes (ITO: In 2 O 3 -S).
nO 2 ), for example, width 0.27 mm, thickness 100 nm, spacing between adjacent electrodes
The pitch between electrodes is 0.03 mm, that is, about 0.3 mm. 1 is the transparent electrode (IT
Substrate terminal portion formed less than O), in this example, at the same pitch as the stripe-shaped transparent electrodes 11a to 11g, the width is 0.
It is composed of electrode rows 1a to 1g of the terminal portion of the substrate, which are 15 mm and have a space of 0.15 mm.

20は,いわゆる、TABテープでフレキシブルな薄い樹
脂板に多数の導体配線が設けられた一種のプリント配線
板である。2はテープ端子部で、前記TABテープの端部
に前記基板端子部の端子列1a〜1gと,たとえば、同じ巾
で同じ間隔に形成されたテープ端子部の端子列2a〜2gが
設けられている。100はTABテープ上に搭載されたドライ
バーICで液晶表示パネルを駆動するICである。
Reference numeral 20 is a so-called printed wiring board in which a large number of conductor wirings are provided on a flexible thin resin board using a TAB tape. Reference numeral 2 is a tape terminal portion, and the terminal rows 1a to 1g of the board terminal portion and the terminal rows 2a to 2g of the tape terminal portion formed with the same width and at the same interval are provided at the end of the TAB tape. There is. 100 is an IC that drives a liquid crystal display panel with a driver IC mounted on a TAB tape.

3は接続用導体膜で、接着材として働く樹脂,たとえ
ば、熱可塑性あるいは半熱硬化性樹脂の中に、導電粒
子,たとえば、粒径10μm程度のNiなどの金属粒子30を
混和し、厚0.01〜0.05mmのフィルム状にしたもので、こ
れを電極端子間に挟んで加熱圧着すると膜厚方向には導
通するが、膜面方向には絶縁性を保つ,たとえば、異方
性導電膜である。
Reference numeral 3 is a conductor film for connection, in which a conductive particle, for example, a metal particle 30 such as Ni having a particle diameter of about 10 μm is mixed with a resin that functions as an adhesive, for example, a thermoplastic or semi-thermosetting resin, and a thickness of 0.01 It is made into a film of ~ 0.05mm, and when it is sandwiched between electrode terminals and thermocompression bonded, it conducts in the film thickness direction, but maintains insulation in the film surface direction. For example, it is an anisotropic conductive film. .

いま,たとえば、液晶表示パネルの基板端子部1とTA
Bテープ20のテープ端子部2との間に、接続用導電膜3
を挟みそれぞれの端子列1a〜1gと2a〜2gとを合致するよ
うに重ね合わせ,たとえば、150℃,20kg/cm2で加熱押圧
すれば、金属粒子30を介して基板端子部1とテープ端子
部2とが電気的に接続され、かつ、機械的にも接着固定
される。
Now, for example, the substrate terminal portion 1 of the liquid crystal display panel and the TA
The conductive film 3 for connection is provided between the B tape 20 and the tape terminal portion 2.
The terminal rows 1a to 1g and 2a to 2g are superposed so as to match each other by sandwiching them, and, for example, if they are heated and pressed at 150 ° C. and 20 kg / cm 2 , the board terminal portion 1 and the tape terminals are connected via the metal particles 30. The part 2 is electrically connected and mechanically bonded and fixed.

第4図は従来のTABテープの接続方法の例を示す工程
図で、上記第3図で示した例の接続方法を具体的に工程
順に図示したものである。
FIG. 4 is a process diagram showing an example of a conventional TAB tape connection method, and specifically shows the connection method of the example shown in FIG. 3 in the order of processes.

先ず、ガラス基板10の基板端子部1に接続用導電膜3,
たとえば、異方性導電膜を仮接続する。仮接続条件は本
接続条件よりもゆるい条件で仮固定すればよい。次に、
仮接続された接続用導電膜3の上にTABテープ20を重ね
端子部の位置合わせを行う。位置合わせには,たとえ
ば、第3図に示したガラス基板10上の位置合わせマーク
41とTABテープ上の位置合わせマーク42とを顕微鏡付きT
Vモニタ上で合致させる方法で容易に行うことができ
る。
First, the conductive film 3 for connection to the substrate terminal portion 1 of the glass substrate 10,
For example, an anisotropic conductive film is temporarily connected. The temporary connection condition may be looser than the main connection condition. next,
The TAB tape 20 is overlapped on the temporarily connected conductive film 3 for connection, and the terminals are aligned. For alignment, for example, the alignment mark on the glass substrate 10 shown in FIG.
41 with the alignment mark 42 on the TAB tape
This can be easily done by the method of matching on the V monitor.

位置合わせを終了したら接続用導電膜3の所定の硬化
条件で本接続を行えば両端子部は強固に接着固定され
る。その後で接続部の外観検査を行い良品は次工程に進
め不良品は廃棄される。
If the main connection is performed under a predetermined curing condition of the conductive film 3 for connection after the alignment is completed, both terminal portions are firmly bonded and fixed. After that, the appearance of the connection part is inspected and non-defective products proceed to the next process, and defective products are discarded.

〔発明が解決しようとする課題〕[Problems to be Solved by the Invention]

しかし、前記各電極端子列の電極巾は0.15mmと非常に
狭く、さらに、今後の表示の高精細化への要求や、カラ
ー化への要求によって、より一層電極巾が小さくなる傾
向がある。そのために、両電極端子列の理想的な接続は
だんだんと難しくなってくる。
However, the electrode width of each of the electrode terminal rows is very narrow at 0.15 mm, and there is a tendency for the electrode width to become further smaller due to future demands for higher definition of display and for colorization. Therefore, ideal connection between the two electrode terminal rows becomes increasingly difficult.

たとえば、第3図(ロ−1)に模式的に示したごと
く、両端子間に絶縁性のゴミ50や導電性の異物2が介在
して導通不良や短絡不良が生じたり,あるいは、同図
(ロ−2)に同じく模式的に示したような位置ずれを生
じて同様に導通不良や短絡不良が生じるといった不都合
が起こる場合がある。
For example, as schematically shown in FIG. 3 (b-1), insulative dust 50 and conductive foreign matter 2 are present between both terminals to cause conduction failure or short circuit failure, or In some cases, the positional deviation as schematically shown in (b-2) may occur, which may cause a conduction failure or a short circuit failure.

第4図に示した前記従来の接続方法では、本接続した
後で外観検査を行い前記のごとき不都合が発見されて
も、ガラス基板10とTABテープ20とは強固に接着されて
おり、無機に引き剥がそうとするとガラス基板10の基板
端子部1が破損し再使用することができず、液晶表示パ
ネル全体が不良になり大きな仕損を生じるという重大な
問題がありその解決が必要であった。
In the conventional connection method shown in FIG. 4, even if the appearance is inspected after the main connection and the inconvenience is found, the glass substrate 10 and the TAB tape 20 are firmly adhered to each other, and the When it is attempted to peel it off, the substrate terminal portion 1 of the glass substrate 10 is damaged and cannot be reused, and there is a serious problem that the entire liquid crystal display panel becomes defective and causes a large damage. .

〔課題を解決するための手段〕[Means for solving the problem]

上記の課題は、液晶表示パネルのガラス基板10上の基
板端子部1に接続用導電膜3を用いてTABテープ20のテ
ープ端子部2を接続するTABテープの接続方法におい
て、前記基板端子部1あるいはテープ端子部2のいずれ
か一方に前記接続用導電膜3を半硬化処理による仮接続
をしたあと、両端子部1,2の位置合わせと再度前記接続
用導電膜3の半硬化処理による仮接続を行い、両端子部
1,2の接続状態を検査確認したあとで前記接続用導電膜
3を硬化条件で処理することにより本接続状態にするTA
Bテープの接続方法により解決することができる。
The above-mentioned problem is the TAB tape connecting method in which the tape terminal portion 2 of the TAB tape 20 is connected to the board terminal portion 1 on the glass substrate 10 of the liquid crystal display panel by using the conductive film 3 for connection. Alternatively, after temporarily connecting the connecting conductive film 3 to either one of the tape terminal portions 2 by semi-curing treatment, the terminal portions 1 and 2 are aligned and the connecting conductive film 3 is temporarily cured by semi-curing treatment again. Connect and connect both terminals
After the connection state of 1 and 2 is inspected and confirmed, the connection conductive film 3 is treated under curing conditions to obtain the main connection state.
It can be solved by connecting the B tape.

〔作用〕[Action]

本発明方法によれば、ガラス基板10上の基板端子部1
とTABテープ20のテープ端子部2とを、接続用導電膜3
を間に挟んで,先ず、位置合わせをして仮接続を行い本
接続の前に外観検査をし、もし、ゴミ50や異物60,ある
いは、位置ずれがあったら接続部を引き剥がして新しい
TABテープ20を同様の手順で仮接続し直し、外観検査に
合格してから本接続するので最終的な接続不良が大巾に
低減されるのである。
According to the method of the present invention, the substrate terminal portion 1 on the glass substrate 10
And the tape terminal portion 2 of the TAB tape 20 with the conductive film 3 for connection.
First, align the parts, make a temporary connection, and inspect the appearance before the main connection. If there is dust 50, foreign matter 60, or misalignment, remove the connection part and remove the new one.
The TAB tape 20 is temporarily connected again by the same procedure, and after the appearance inspection is passed, the main connection is made, so that the final connection failure can be greatly reduced.

〔実施例〕〔Example〕

液晶表示パネルのガラス基板10として,たとえば、大
きさが200mm×300mmで、厚さ1.1mmの透明なガラス板を
用い、その上にIn2O3−SnO2の混合酸化物からなるスト
ライプ状の透明電極(ITO)を形成した。その末端に形
成された基板端子部1の電極端子の巾0.15mm,厚さ100n
m,隣接端子間隔0.15mm,すなわち、端子間ピッチは0.3mm
程度である。
As the glass substrate 10 of the liquid crystal display panel, for example, a transparent glass plate having a size of 200 mm × 300 mm and a thickness of 1.1 mm is used, and a striped pattern made of a mixed oxide of In 2 O 3 —SnO 2 is formed thereon. A transparent electrode (ITO) was formed. The width of the electrode terminal of the board terminal portion 1 formed at the end is 0.15 mm and the thickness is 100 n
m, spacing between adjacent terminals 0.15 mm, that is, the pitch between terminals is 0.3 mm
It is a degree.

一方、TABテープ20には、端部に前記基板端子部1の
端子列1a〜1gと,たとえば、同じ巾で同じ間隔に形成さ
れたテープ端子部2の端子列2a〜2gが設けられている。
On the other hand, the TAB tape 20 is provided with the terminal rows 1a to 1g of the substrate terminal section 1 and the terminal rows 2a to 2g of the tape terminal section 2 formed at the same width and at the same intervals at the ends. .

基板端子部1とテープ端子部2の所要個所には,たと
えば、第3図に示したごとき位置合わせマーク41および
42,たとえば、0.2φの円環(たとえば、基板側にはITO
の,一方、TABテープ側には金属導体の)が形成されて
いる。
The required positions of the board terminal portion 1 and the tape terminal portion 2 are, for example, the alignment marks 41 and the marks shown in FIG.
42, for example, 0.2φ ring (for example, ITO on the substrate side
On the other hand, a metal conductor) is formed on the TAB tape side.

なお、その他については第3図(イ)の平面図に図示
したものに準じているので詳細説明は省略する。ただ
し、第3図は全体の一部分を示したもので、実際は基板
側に数100端子が配列され、TABテープ側は数10端子のテ
ープが複数本使用されているのが一般的である。
Other details are the same as those shown in the plan view of FIG. 3 (a), and detailed description thereof will be omitted. However, FIG. 3 shows a part of the whole, and in general, several 100 terminals are arranged on the substrate side and a plurality of tapes having several tens terminals are generally used on the TAB tape side.

接続用導電膜3としては、異方性導電膜(たとえば熱
可塑性導電膜)を使用する。
An anisotropic conductive film (for example, a thermoplastic conductive film) is used as the connecting conductive film 3.

第1図は本発明の実施例方法を示す工程図で、上記の
実施例部材を用いた場合の本発明の接続方法を具体的に
工程順に図示したものである。
FIG. 1 is a process chart showing an embodiment method of the present invention, and specifically shows the connection method of the present invention when the above-mentioned embodiment members are used in the order of steps.

先ず、ガラス基板10の基板端子部1に接続用導電膜3,
たとえば、異方性導電膜の仮接続を行う。仮接続条件
は,たとえば、140℃,10kg/cm2の圧力をかけながら2〜
3秒間加熱して接続を行う。このような加圧・加熱に
は,たとえば、公知のウエッジ型(この例では長さ50m
m,巾3mmの加熱ヘッドを用いて60〜80端子を一括加
熱))のパルスヒータを用いて行えばよい。
First, the conductive film 3 for connection to the substrate terminal portion 1 of the glass substrate 10,
For example, the anisotropic conductive film is temporarily connected. Temporary connection conditions, for example, 140 ° C., under pressure of 10 kg / cm 2. 2 to
Heat for 3 seconds to make the connection. For such pressurization / heating, for example, a known wedge type (in this example, a length of 50 m
It is possible to use a heating head with a width of 3 mm and a width of 3 mm to heat 60 to 80 terminals together)).

次に、ガラス基板10の基板端子板1に仮接続された接
続用導電膜3の上にTABテープ20のテープ端子部2を重
ね位置合わせを行う。位置合わせには,たとえば、第3
図に示したガラス基板10上の位置合わせマーク41とTAB
テープ上の位置合わせマーク42とを顕微鏡付きTVモニタ
上で合致させる方法で行うことができる。
Next, the tape terminal portion 2 of the TAB tape 20 is superposed and aligned on the conductive film 3 for connection which is temporarily connected to the substrate terminal plate 1 of the glass substrate 10. For alignment, for example, the third
Alignment mark 41 and TAB on the glass substrate 10 shown
The alignment mark 42 on the tape can be matched on the TV monitor with a microscope.

位置合わせを終了したらそのまゝ仮接続を行う。仮
接続条件は,たとえば、上記仮接続の条件に準じで行
えばよい。仮接続および仮接続を行ったあとはガラ
ス基板10とTABテープ20は一応固定され接続抵抗は未だ
高いが簡単に外れることはない。
After completing the alignment, make the temporary connection. The temporary connection condition may be, for example, according to the above-mentioned temporary connection condition. After the temporary connection and the temporary connection, the glass substrate 10 and the TAB tape 20 are temporarily fixed, and the connection resistance is still high, but it cannot be easily removed.

この状態で外観検査,たとえば、顕微鏡検査を行い
合格したものは本接続を行う。本接続条件は,たとえ
ば、140℃,20kg/cm2の圧力をかけながら20秒間加熱して
接続を行う。本接続には,たとえば、仮接続と同様な加
熱ヘッドを有する公知のコンスタントヒータなどを用い
て行えばよい。
In this state, a visual inspection, for example, a microscopic inspection is performed, and a successful connection is made. The connection conditions are, for example, heating at 20 ° C. for 20 seconds while applying pressure of 140 ° C. and 20 kg / cm 2 . For this connection, for example, a known constant heater having a heating head similar to that for temporary connection may be used.

外観検査で不合格になったものは、ガラス基板10と
TABテープ20の間に100g程度の力をかけて引き剥がす。
このように仮接続状態のものは剥離によってガラス基板
10の基板端子部1が損傷を受けるようなことはなく,ま
た、予めそのような仮接続条件を実験的に求めておけば
よい。なお、テープ剥離のあと基板端子部1に接続用導
電膜3の残骸が残っていることがあるので,たとえば、
メチルエチルケトンその他適当な溶剤でそれを除去すれ
ばよい。清拭されたガラス基板10は図示したごとく前工
程に戻って接続用導電膜3の仮接続以下の工程を繰り
返す。
If it fails the visual inspection, the glass substrate 10
Apply 100g of force between the TAB tapes 20 to peel them off.
In this way, the one in the temporarily connected state is peeled off from the glass
The ten board terminal portions 1 are not damaged, and such temporary connection conditions may be experimentally obtained in advance. In addition, after the tape is peeled off, the remains of the conductive film 3 for connection may remain on the substrate terminal portion 1.
It may be removed with methyl ethyl ketone or other suitable solvent. As shown in the figure, the wiped glass substrate 10 returns to the previous step and the steps of temporary connection of the conductive film for connection 3 and the following steps are repeated.

一方、外観検査で合格し本接続を行った製品は、外
観検査を,たとえば、外観検査と同様に行い、合格
したものは良品として次工程に進め不良品は廃棄され
る。
On the other hand, for products that have passed the visual inspection and have been connected, the visual inspection is performed, for example, in the same manner as the visual inspection, and those that have passed are regarded as good products and proceed to the next process, and defective products are discarded.

なお、上記実施例では,先ず、ガラス基板10の基板端
子部に接続用導電膜3を仮接続する,いわゆる、単体供
給方式の場合について図示説明したが、逆にTABテープ2
0のテープ端子部2に,先ず、接続用導電膜3を仮接続
する,いわゆる、TABテープのリール供給方式の場合に
ついても全く同様に本発明方法を適用できることは言う
までもない。
In the above-described embodiment, first, the case where the conductive film 3 for connection is temporarily connected to the substrate terminal portion of the glass substrate 10, that is, a so-called single supply method is illustrated and described.
It goes without saying that the method of the present invention can be applied in the same manner to the case of the so-called TAB tape reel supply system in which the conductive film 3 for connection is temporarily connected to the tape terminal portion 0 of 0.

第2図は引張り剥離強度と加熱温度の関係を示す図
で、縦軸に引張り剥離強度を横軸に加熱温度をとってあ
る。引張り剥離強度の測定には、公知の,たとえば、プ
ッシュ・プル・ゲージを使用した。なお、使用した試料
や接続方法などは前記第1図の実施例で詳細説明したも
のと同様であるので省略する。
FIG. 2 is a diagram showing the relationship between tensile peel strength and heating temperature, where the vertical axis represents tensile peel strength and the horizontal axis represents heating temperature. A known push-pull gauge, for example, was used to measure the tensile peel strength. The sample used and the connection method are the same as those described in detail in the embodiment of FIG.

図中、の実線は圧力10kg/cm2,加熱時間3秒間のパ
ルスヒータ加熱の場合で、145℃程度までは剥離強度50g
前後であり、150℃を越えると200g程度になるものが出
てくる。この例(熱可塑性の異方性導電膜)の場合には
引張り剥離強度が130g程度までは剥離再生可能であるこ
とが確認され,また、50g程度以上あれば簡単に剥がれ
ることはなく検査などの作業に支障はない。この結果、
仮接続条件は140℃〜150℃,10kg/cm2,2〜3秒間といっ
た値に決めればよい。
In the figure, the solid line indicates the case of pulse heater heating with a pressure of 10 kg / cm 2 and a heating time of 3 seconds, and the peel strength is 50 g up to about 145 ° C.
It is around, and when it exceeds 150 ℃, some 200g will come out. In the case of this example (thermoplastic anisotropic conductive film), it was confirmed that the peeling strength can be peeled and regenerated up to a tensile peeling strength of about 130 g, and if it is about 50 g or more, it will not easily peel off and it will be There is no hindrance to the work. As a result,
The temporary connection condition may be set to a value such as 140 ° C to 150 ° C, 10 kg / cm 2 , and 2 to 3 seconds.

一方、の実線は圧力20kg/cm2,加熱時間15秒間、
の破線は圧力20kg/cm2,加熱時間25秒間のコンスタント
ヒータ加熱の場合で、いずれも引張り剥離強度が300g以
上で接続強度は極めて高く,したがって、剥離再生は不
可能である。こゝには図示していないが十分低い安定し
た接続抵抗を得るために、この例では本接続条件として
140℃,20kg/cm2,20秒間といった値に決めればよい。
On the other hand, the solid line is pressure 20kg / cm 2 , heating time 15 seconds,
The broken line indicates the case of constant heater heating with a pressure of 20 kg / cm 2 and a heating time of 25 seconds. In both cases, the tensile peel strength is 300 g or more and the connection strength is extremely high. Therefore, peel regeneration is impossible. Although not shown here, in order to obtain a sufficiently low stable connection resistance, in this example
You can set values such as 140 ℃, 20kg / cm 2 , 20 seconds.

以上、従来はTABテープ接続による液晶表示パネルの
不良が数%に達していたものが、上記実施例においては
ほゞ0%と大巾に改善された。
As described above, the defect of the liquid crystal display panel due to the TAB tape connection has reached several% in the related art, but in the above-mentioned embodiment, it is greatly improved to about 0%.

なお、本実施例では、液晶表示パネルの端子部の電極
端子列とTABテープ端子部の電極端子列との電気的接続
の場合を示したが、本発明はこれに限るものではなく、
同様の目的で行なわれる他の製品の接続方法にも適用で
きることは言うまでもない。
In the present embodiment, the case of electrical connection between the electrode terminal row of the terminal portion of the liquid crystal display panel and the electrode terminal row of the TAB tape terminal portion was shown, but the present invention is not limited to this.
It goes without saying that the present invention can also be applied to a method of connecting other products for the same purpose.

また、上記の仮接続条件や本接続条件は実施例に用い
た接続用導電膜(異方性導電膜)についてのものであ
り,したがって、これに限定されるものではなく使用す
る接続用導電膜3の種類により同様に測定評価してそれ
ぞれ最適の接続条件を決めればよい。接続用導電膜3と
しても上記異方性導電膜に限るものではなく、本発明方
法の趣旨に添うものであれば他の導電膜や接続用樹脂を
用いた圧着接続の場合にも適用できることは勿論であ
る。
Moreover, the above-mentioned temporary connection conditions and main connection conditions are for the conductive film for connection (anisotropic conductive film) used in the examples, and therefore, the present invention is not limited to this and the conductive film for connection used Similarly, the optimum connection conditions may be determined by measuring and evaluating the three types. The conductive film 3 for connection is not limited to the anisotropic conductive film described above, and may be applied to the case of pressure-bonding connection using another conductive film or a connection resin as long as it conforms to the gist of the method of the present invention. Of course.

〔発明の効果〕〔The invention's effect〕

以上説明したように、本発明によればガラス基板10上
の基板端子部1とTABテープ20のテープ端子部2とを、
接続用導電膜3を間に挟んで,先ず、位置合わせをして
仮接続を行い本接続の前に外観検査をし、もし、ゴミ50
や異物60,あるいは、位置ずれがあったら接続部を引き
剥がして新しいTABテープ20を同様の手順で仮接続し直
し、外観検査に合格してから本接続するので最終的な接
続不良が大巾に低減され、液晶表示パネルの製造歩留り
が大巾に向上し、液晶表示装置の品質向上と価格の低下
に寄与するところが極めて大きい。
As described above, according to the present invention, the substrate terminal portion 1 on the glass substrate 10 and the tape terminal portion 2 of the TAB tape 20 are
Firstly, the conductive film 3 for connection is sandwiched between them, and then they are aligned and temporarily connected to each other, and an external appearance inspection is performed before the main connection.
If there is any foreign matter 60, or if there is a misalignment, peel off the connection part and reconnect the new TAB tape 20 temporarily in the same procedure, and after passing the appearance inspection, make the final connection, so the final connection failure is large. The production yield of the liquid crystal display panel is greatly improved, and it greatly contributes to the quality improvement and the price reduction of the liquid crystal display device.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明の実施例方法を示す工程図、 第2図は引張り剥離強度と加熱温度の関係を示す図、 第3図は駆動電極用基板端子部とTABテープの接続例を
示す図、 第4図は従来のTABテープの接続方法の例を示す工程図
である。 図において、 1は基板端子部、 2はテープ端子部、 3は接続用導電膜、 10はガラス基板、 20はTABテープである。
FIG. 1 is a process diagram showing an embodiment method of the present invention, FIG. 2 is a diagram showing a relationship between tensile peel strength and heating temperature, and FIG. 3 is a diagram showing a connection example of a drive electrode substrate terminal portion and a TAB tape. FIG. 4 is a process drawing showing an example of a conventional TAB tape connection method. In the figure, 1 is a substrate terminal portion, 2 is a tape terminal portion, 3 is a conductive film for connection, 10 is a glass substrate, and 20 is a TAB tape.

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】液晶表示パネルのガラス基板(10)上の基
板端子部(1)に接続用導電膜(3)を用いてTABテー
プ(20)のテープ端子部(2)を接続するTABテープの
接続方法において、 前記基板端子部(1)あるいはテープ端子部(2)のい
ずれか一方に前記接続用導電膜(3)を半硬化処理して
仮接続をしたあと、両端子部(1、2)の位置合わせと
再度前記接続用導電膜(3)の半硬化処理による仮接続
を行い、次いで、両端子部(1、2)の接続状態を検査
確認し、次いで、前記接続用導電膜(3)を硬化条件で
処理することにより本接続状態にすることを特徴とする
TABテープの接続方法。
1. A TAB tape for connecting a tape terminal portion (2) of a TAB tape (20) with a conductive film (3) for connection to a substrate terminal portion (1) on a glass substrate (10) of a liquid crystal display panel. In the connection method, the connection conductive film (3) is semi-cured on either one of the substrate terminal portion (1) or the tape terminal portion (2) for temporary connection, and then both terminal portions (1, The connection of (2) and the temporary connection by the semi-curing treatment of the conductive film for connection (3) are performed again, then the connection state of both terminal portions (1, 2) is inspected and confirmed, and then the conductive film for connection. It is characterized in that the main connection state is obtained by treating (3) under curing conditions.
How to connect TAB tape.
【請求項2】前記両端子部(1、2)の位置合わせを、
基板端子部(1)に設けられた透明導電膜からなる位置
合わせマーク(41)と、テープ端子部(2)に設けられ
た金属導体からなる位置合わせマーク(42)とを用いて
行う請求項1記載のTABテープの接続方法。
2. Alignment of both terminal portions (1, 2),
The alignment mark (41) made of a transparent conductive film provided on the substrate terminal portion (1) and the alignment mark (42) made of a metal conductor provided on the tape terminal portion (2). How to connect the TAB tape described in 1.
【請求項3】前記仮接続条件が、加圧力:10Kg/cm2、加
熱時間:2〜3秒間、加熱温度:140〜150℃である請求項
1記載のTABテープの接続方法。
3. The method of connecting a TAB tape according to claim 1, wherein the temporary connection conditions are a pressing force of 10 kg / cm 2 , a heating time of 2 to 3 seconds, and a heating temperature of 140 to 150 ° C.
JP2208753A 1990-08-06 1990-08-06 How to connect TAB tape Expired - Lifetime JP2533225B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2208753A JP2533225B2 (en) 1990-08-06 1990-08-06 How to connect TAB tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2208753A JP2533225B2 (en) 1990-08-06 1990-08-06 How to connect TAB tape

Publications (2)

Publication Number Publication Date
JPH0499039A JPH0499039A (en) 1992-03-31
JP2533225B2 true JP2533225B2 (en) 1996-09-11

Family

ID=16561511

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2208753A Expired - Lifetime JP2533225B2 (en) 1990-08-06 1990-08-06 How to connect TAB tape

Country Status (1)

Country Link
JP (1) JP2533225B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3014020B2 (en) * 1993-12-16 2000-02-28 日本電気株式会社 Method for manufacturing semiconductor device
JP3323395B2 (en) * 1995-03-24 2002-09-09 松下電器産業株式会社 Method of bonding IC components to flat panel display
JP2007173375A (en) * 2005-12-20 2007-07-05 Nec Corp Compound packaging device and manufacturing method thereof

Also Published As

Publication number Publication date
JPH0499039A (en) 1992-03-31

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