JP2530126Y2 - Contact pin for IC socket - Google Patents

Contact pin for IC socket

Info

Publication number
JP2530126Y2
JP2530126Y2 JP4147691U JP4147691U JP2530126Y2 JP 2530126 Y2 JP2530126 Y2 JP 2530126Y2 JP 4147691 U JP4147691 U JP 4147691U JP 4147691 U JP4147691 U JP 4147691U JP 2530126 Y2 JP2530126 Y2 JP 2530126Y2
Authority
JP
Japan
Prior art keywords
contact pin
socket
present
contact
wiping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP4147691U
Other languages
Japanese (ja)
Other versions
JPH04113452U (en
Inventor
一久 小沢
博明 原田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Enplas Corp
Original Assignee
Enplas Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enplas Corp filed Critical Enplas Corp
Priority to JP4147691U priority Critical patent/JP2530126Y2/en
Priority to US07/931,925 priority patent/US5336096A/en
Publication of JPH04113452U publication Critical patent/JPH04113452U/en
Application granted granted Critical
Publication of JP2530126Y2 publication Critical patent/JP2530126Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Description

【考案の詳細な説明】[Detailed description of the invention]

【0001】[0001]

【産業上の利用分野】本考案はIC素子のリード端子と
外部回路との電気的接続を成すためのICソケット用コ
ンタクトピンで、特に隣接するコンタクトピンのピッチ
が狭い多端子型ICソケットに最適な、板厚の極めて薄
いコンタクトピンに関する。
The present invention relates to a contact pin for an IC socket for making an electrical connection between a lead terminal of an IC element and an external circuit, and is particularly suitable for a multi-terminal IC socket in which the pitch between adjacent contact pins is narrow. The present invention relates to an extremely thin contact pin.

【0002】[0002]

【従来の技術】従来よりIC素子等の電子部品を実装す
る場合に使用されるICソケット用コンタクトピンの
内、板厚の薄いコンタクトピンを形成し得るものとし
て、特開61−150249号等に示されるような環状
のコンタクトピンが知られているが(図9)、図10及
び図11のようにソケット本体20に多数列設したコン
タクトピンI0,の頂部3に載接されたIC素子のリー
ド端子は、軸23を介してソケット本体20に枢支され
ている蓋体21が閉合することにより、該蓋体21に固
設されたパッド21−1,21−2によって押圧されて
コンタクトピン10’に圧接せしめられるようになって
いる。
2. Description of the Related Art Japanese Patent Application Laid-Open No. 61-150249 and the like disclose a method of forming a contact pin having a small thickness among contact pins for an IC socket used for mounting electronic components such as IC elements. Although an annular contact pin as shown is known (FIG. 9), as shown in FIGS. 10 and 11, the IC element mounted on the top 3 of the contact pins I0 arranged in a large number in the socket body 20 is shown in FIG. The lead terminals are pressed by the pads 21-1 and 21-2 fixed to the lid body 21 when the lid body 21 pivotally supported by the socket body 20 via the shaft 23 is closed. It is designed to be pressed against 10 '.

【0003】[0003]

【考案が解決しようとする課題】しかしながら、かかる
従来のコンタクトピン10′では、蓋体21を閉合し
て、蓋体21に固設されたパッド21−1,21−2に
よる押圧力でリード端子と、コンタクトピン10′との
接続を図ろうとした場合、リード端子とコンタクトピン
10′との表面に形成された酸化皮膜が絶縁材となって
電気的接続が得られないといった問題が生じていた。
In such a conventional contact pin 10 ', however, the lid 21 is closed and the lead terminals are pressed by the pads 21-1 and 21-2 fixed to the lid 21. When the connection between the lead pin and the contact pin 10 'is attempted, an oxide film formed on the surface of the lead terminal and the contact pin 10' becomes an insulating material, and a problem occurs that electrical connection cannot be obtained. .

【0004】更に、本考案によるコンタクトピンは極め
て簿い板材を環状に形成したものであるから、大規模な
塑性変形には極めて弱いといった欠点を有していた。
Further, the contact pin according to the present invention has a drawback that it is extremely weak to large-scale plastic deformation because the contact pin is formed by forming a very round plate material in an annular shape.

【0005】本考案では、かかる実情に鑑み、リード端
子やコンタクトピン表面に形成されがちな酸化皮膜によ
る絶縁性もなく電気的接続が得られ、しかも塑性変形に
よって破損することのない極めて板厚の薄いICソケッ
ト用コンタクトピンを提供することを目的とする。
In the present invention, in view of such circumstances, an electrical connection can be obtained without insulation due to an oxide film which tends to be formed on the surface of a lead terminal or a contact pin, and an extremely thick plate which is not damaged by plastic deformation. An object of the present invention is to provide a contact pin for a thin IC socket.

【0006】[0006]

【課題を解決するための手段】本考案によるコンタクト
ピン10を図3に基づいて説明すれば、載接部3に上方
から矢印方向に力Fを加えると、一点鎖線で示すような
動作となるが、この動作の中心を解析すると0点とな
り、この0点はコンタクトピン10の環状の形状からわ
ずかばかり外方に離れた処にある。
The contact pin 10 according to the present invention will be described with reference to FIG. 3. When a force F is applied to the mounting portion 3 from above in the direction of the arrow, the operation will be as indicated by the dashed line. However, when the center of this operation is analyzed, the point becomes zero, and this point is located slightly away from the annular shape of the contact pin 10.

【0007】同じように他の形状を比較してみると、図
4では一枚の板状から成るコンタクトピン10である
が、力Fによる接触部のワイピング動作の中心Oはコン
タクトピンの形状内にあり、更に図5及び図6のように
環状アームの一部を切り欠いた場合でもワイピング動作
の中心Oは、前記一枚板と同様実質的にコンタクトピン
の形状内に存在する。
Similarly, when comparing other shapes, FIG. 4 shows a single pin-shaped contact pin 10, but the center O of the wiping operation of the contact portion by the force F is within the shape of the contact pin. 5 and 6, the center O of the wiping operation is substantially in the shape of the contact pin as in the case of the single plate, even when a part of the annular arm is cut off as shown in FIGS.

【0008】これをワイピング(こする)量と歪み量を
それぞれ横軸、縦軸に取ってグラフに示すと図8のよう
な関係になり、環状でしかも二本のアームから成る本考
案によるコンタクトピン10が最も歪み量が大きい反面
ワイピング量が小さい値を得る。この場合、図9のよう
に頂部3が直線状に下方移動しワイピング量が0であっ
てはならない。
FIG. 8 shows the relationship between the amount of wiping (rubbing) and the amount of distortion on the abscissa and the ordinate, respectively, as shown in a graph. The contact according to the present invention is annular and has two arms. Although the pin 10 has the largest distortion amount, the wiping amount is small. In this case, as shown in FIG. 9, the top 3 must move downward linearly and the wiping amount must not be zero.

【0009】更に、過大な力Fがコンタクトピン10の
頂部3に加えられた場合に起こる塑性変形によって破損
を防止しようとする場合、図7のように環状内部に規制
部材を配設することによつて首部1に発生する変形等を
防ぐことが可能となる。
Further, in order to prevent breakage due to plastic deformation occurring when an excessive force F is applied to the top 3 of the contact pin 10, a regulating member is provided inside the ring as shown in FIG. Therefore, it is possible to prevent deformation or the like occurring in the neck portion 1.

【0010】[0010]

【作用】本考案によれば、蓋体を閉合する際パッドによ
って生ずる押力の歪みは、図2に示すように二本のアー
ムに相反する力のベクトルが仂くことにより歪み量は大
きく、しかも接触部のワイピングを確実に行なうことが
できる。更に過大な力によるアクシデントに対しても環
状内部に規制部材100を配設したから必要以上に歪む
心配がない。
According to the present invention, the distortion of the pressing force caused by the pad when closing the lid is large due to the opposing force vectors acting on the two arms as shown in FIG. Moreover, the wiping of the contact portion can be performed reliably. Further, even if an accident is caused by an excessive force, since the regulating member 100 is disposed inside the annular portion, there is no need to worry about unnecessary distortion.

【0011】[0011]

【実施例】図Iは、本考案によるコンタクトピン10を
示しているが、図2のように上方から力Fを加えられて
も、二本のアームが上方位置、下方位置に力を分散し合
うので、板厚の薄いコンタクトピンでも捩れたり、倒れ
たりすることはない。しかも、ワイピング(こすれ)動
作の中心が形状外にわずかばかり離れているので歪み量
は大きくとも、ワイピング量としては小さく、益々多端
子化傾向にあるショートタイプのリードフレームには最
適である。
FIG. 1 shows a contact pin 10 according to the present invention. Even when a force F is applied from above as shown in FIG. 2, the two arms disperse the force in an upper position and a lower position. As it fits, even thin contact pins will not twist or fall. In addition, since the center of the wiping (rubbing) operation is slightly separated from the shape, the amount of wiping is small even if the amount of distortion is large, and the wiping amount is optimal for a short-type lead frame, which tends to have more terminals.

【0012】又、図7のように環状内部の首部1から左
縁位置に規制部材(ピン等)100を配設することによ
って塑性変形による破損を防止することが可能となる。
Further, as shown in FIG. 7, by disposing a restricting member (a pin or the like) 100 at a position on the left edge from the neck portion 1 inside the annular portion, it is possible to prevent breakage due to plastic deformation.

【0013】[0013]

【考案の効果】上述のように、本考案のコンタクトピン
によれば、板厚が薄くとも捩れたり倒れたりすることな
く、確実にリード端子とのワイピングをなし得、又規制
部材の配設によって塑性変形による破損を防ぐことがで
きる。
As described above, according to the contact pin of the present invention, wiping with the lead terminal can be surely performed without twisting or falling down even if the thickness is small, and the arrangement of the regulating member enables Damage due to plastic deformation can be prevented.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本考案による一実施例の正面図。FIG. 1 is a front view of an embodiment according to the present invention.

【図2】本考案図1のコンタクトピンに力を加えた場合
の説明図。
FIG. 2 is an explanatory diagram when a force is applied to the contact pin of FIG. 1 of the present invention.

【図3】本考案のコンタクトピンのワイピング動作の説
明図。
FIG. 3 is an explanatory view of the wiping operation of the contact pin of the present invention.

【図4】本考案とは異なる例のコンタクトピンのワイピ
ング動作の説明図。
FIG. 4 is an explanatory diagram of a contact pin wiping operation of an example different from the present invention.

【図5】本考案とは異なる他例のコンタクトピンのワイ
ピング動作の説明図。
FIG. 5 is an explanatory diagram of another example of a wiping operation of a contact pin different from the present invention.

【図6】本考案とは異なる更に他の例のコンタクトピン
のワイピング動作の説明図。
FIG. 6 is an explanatory view of a wiping operation of a contact pin according to still another example different from the present invention.

【図7】本考案の規制部材を用いた例の正面図。FIG. 7 is a front view of an example using the regulating member of the present invention.

【図8】図1及び図4乃至図6の各例の特性曲線を示す
説明図。
FIG. 8 is an explanatory diagram showing characteristic curves of each example of FIG. 1 and FIGS. 4 to 6;

【図9】従来例のコンタクトピンの正面図。FIG. 9 is a front view of a conventional contact pin.

【図10】従来のICソケットの平面図。FIG. 10 is a plan view of a conventional IC socket.

【図11】図I0の一部を断面とした側面図。11 is a side view showing a part of FIG. I0 as a cross section.

【符号の説明】[Explanation of symbols]

1 首部 2 アーム部 3 頂部 10 コンタクトピン 20 ソケット本体 21 蓋体 21−1 パッド 21−2 パッド 100 規制部材 DESCRIPTION OF SYMBOLS 1 Neck part 2 Arm part 3 Top part 10 Contact pin 20 Socket main body 21 Lid 21-1 Pad 21-2 Pad 100 Control member

Claims (2)

(57)【実用新案登録請求の範囲】(57) [Scope of request for utility model registration] 【請求項1】IC素子のリード端子と外部回路との電気
的接続を成すためのICソケット用コンタクトピンであ
って、相対向する二本のアームで形成された環状から成
り、一方側は基部に固定され、他方側の自由端の首部か
ら押圧方向に離れた線上にリード端子の接触部を設けた
ことを特徴とするICソケット用コンタクトピン。
1. A contact pin for an IC socket for making an electrical connection between a lead terminal of an IC element and an external circuit, the contact pin having an annular shape formed by two arms facing each other, and one side being a base. A contact pin for an IC socket, wherein a contact portion of a lead terminal is provided on a line which is fixed in a direction away from a neck of a free end on the other side in a pressing direction.
【請求項2】請求項1に記載のコンタクトピンにおい
て、環状内部に前記アームの大幅な塑性変形を抑止する
ための規制部材を配設して成るICソケット用コンタク
トピン。
2. The contact pin for an IC socket according to claim 1, wherein a regulating member for suppressing a significant plastic deformation of said arm is disposed inside the annular shape.
JP4147691U 1991-03-22 1991-03-22 Contact pin for IC socket Expired - Fee Related JP2530126Y2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP4147691U JP2530126Y2 (en) 1991-03-22 1991-03-22 Contact pin for IC socket
US07/931,925 US5336096A (en) 1991-03-22 1992-08-18 IC socket and its contact pin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4147691U JP2530126Y2 (en) 1991-03-22 1991-03-22 Contact pin for IC socket

Publications (2)

Publication Number Publication Date
JPH04113452U JPH04113452U (en) 1992-10-05
JP2530126Y2 true JP2530126Y2 (en) 1997-03-26

Family

ID=31922261

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4147691U Expired - Fee Related JP2530126Y2 (en) 1991-03-22 1991-03-22 Contact pin for IC socket

Country Status (1)

Country Link
JP (1) JP2530126Y2 (en)

Also Published As

Publication number Publication date
JPH04113452U (en) 1992-10-05

Similar Documents

Publication Publication Date Title
US5653598A (en) Electrical contact with reduced self-inductance
US5599194A (en) IC socket and its contact pin
EP0307946A2 (en) Method of manufacturing a resin insulated type semiconductor device
JP2530126Y2 (en) Contact pin for IC socket
JPH0517973U (en) IC Socket
KR100338225B1 (en) Semiconductor device
JP2663926B2 (en) IC socket
JP3258450B2 (en) Lead frame holding device for electronic components
JP2545016Y2 (en) IC socket
JPH10112365A (en) Ic socket
JP3725456B2 (en) Contact pin and IC socket
JPH07142528A (en) Presser of lead frame for electronic component and pressing method using this presser
JPS62235763A (en) Lead frame for semiconductor device
JPH08279377A (en) Plug connector for coaxial cable
KR100321163B1 (en) Apparatus for forming outer lead of semiconductor package
JPH07142529A (en) Presser of lead frame for electronic component and pressing method using this presser
JPH05283564A (en) Ic socket
JPH03206647A (en) Resin-sealed semiconductor device
KR200141173Y1 (en) Lead protrusion type package
JPH07114959A (en) Ic socket
JPH1012802A (en) Lead frame and semiconductor device using the same
JPS59171478A (en) Device for pressurizing flat element
JP2821587B2 (en) Electrical contact structure
JP2572191Y2 (en) IC socket
JPH01105187A (en) Testing method for board and electronic parts using said board

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees