JP2523895Y2 - Constant temperature spot type detector - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION INDUSTRIAL APPLICATION Field of the Invention The present invention relates to a constant temperature spot-type sensor utilizing inversion of bimetal by heat.

2. Description of the Related Art In a constant temperature spot type sensor using a bimetal, a bimetal is placed using a concave surface of a bimetal housing portion of a heat sensitive plate, and a main body formed so as to be a peripheral edge of the concave surface of the heat sensitive plate. The bimetal is housed in a reversible manner.

Also, if there is a gap between the bimetal housing part of the heat sensitive plate and the main body, the bimetal may rust due to moisture, so both are sealed with a filler etc. and both use metal screws. Is fixed.

Problems to be Solved by the Invention In the conventional constant temperature spot type sensor, a filler or the like is used to seal the space between the bimetal accommodating portion of the heat sensitive plate and the main body. In addition to the necessary, it takes a long time for the injected filler to dry,
A drying place is also needed.

In addition, when using a metal screw to fix the heat-sensitive plate,
Part of the heat from the heat-sensitive plate is transferred to the screw and absorbed.
As a result, the transfer of the heat of the heat-sensitive plate to the bimetal is delayed by that much, and the performance of the sensor deteriorates.

The present invention has been made in view of the above circumstances, and has as its object to efficiently and efficiently seal a heat sensitive plate and a main body. Another object is to allow the heat of the heat sensitive plate to be transmitted to the bimetal without delay.

Means for Solving the Problems The present invention provides a heat-sensitive plate mounting base formed on a main body; an annular packing fitted on an outer periphery of a bimetal support portion of the heat-sensitive plate mounting base; A heat-sensitive plate that is covered and presses the annular packing over the entire circumference from the outer peripheral side thereof; and a plurality of resin pins that fix the heat-sensitive plate to the heat-sensitive plate mounting base. It is to achieve the purpose.

Action After the bimetal is placed on the bimetal support of the heat-sensitive plate mounting base, an annular packing is fitted around the bimetal support and disposed.

Then, a heat-sensitive plate is put on the mounting base, and the heat-sensitive plate is fixed to the mounting base with a plurality of resin pins while pressing the annular packing from the outer peripheral side to the entire circumference. At this time, the inner periphery of the annular packing is brought into close contact with the outer periphery of the mounting base over the entire periphery, and the outer periphery is pressed by the heat-sensitive plate over the entire periphery.

The bimetal is sealed in a short time, and the heat of the heat-sensitive plate is transmitted to the bimetal as it is without being absorbed by the pins.

An embodiment of the present invention will be described with reference to the accompanying drawings, wherein the same reference numerals have the same names and functions.

As shown in FIG. 2, the bimetal 3 is formed in a bowl shape, and three rectangular projecting pieces 11 are formed upward and at equal intervals on the peripheral edge 3a. This protruding piece 11 is a peripheral wall
It plays the role of a locking piece with 10, and its shape and number are appropriately selected as needed.

The bimetal 3 is supported by a bimetal support 16, which is a cylindrical projection provided at the center of the heat-sensitive plate mounting base 15 of the main body 1, and the peripheral wall 10 is formed.

The projecting piece 11 of the bimetal 3 is engaged with the peripheral wall 10 and fixed.

At this time, when the peripheral edge 3a of the bimetal 3 is pressed in the direction of the peripheral wall 10, the protruding piece 11 easily engages with the peripheral wall 10, and is accurately set at a predetermined position, and the position is maintained as it is. Further, since the inner surface 3b of the bimetal 3 is always on the side of the peripheral wall 10, there is no danger that the front and back of the bimetal 3 are erroneously attached.

Next, an annular packing 13 is fitted to the step portion 12 provided on the outer periphery of the peripheral wall 10 of the bimetal support portion 16. The annular packing 13 is an O-ring as shown in FIG. While covering the heat-sensitive plate 2 on the heat-sensitive plate mounting base 15, the packing 13 is pressed from the outer peripheral side to the entire circumference to polymerize the heat-sensitive plate 2 on the bimetal 3, and to attach the heat-sensitive plate 2 to a plurality of resinous materials. It is fixed to the heat-sensitive plate mounting base 15 by the pins 14. The head of the pin 14 is formed in a dish shape, and the upper surface thereof is located substantially on the same plane as the surface of the heat sensitive plate 2. If the pins 14 are simply pressed into the mounting base 15, they are loosened by the influence of heat. Therefore, it is preferable that the pins 14 be fixed using a quick-drying adhesive or that they are ultrasonically bonded. The heat-sensitive plate 2 is protected by a protector 4, and the protector 4 has a cutout 9 for accommodating an operation confirmation light 8 inside the leg. In addition, 5
Denotes an electric contact portion provided on the printed circuit board 6, and 7 denotes a rod for transmitting the displacement of the bimetal 3 due to heat to the electric contact portion 5.

 The operation of this embodiment will be described.

The protruding piece 11 of the bimetal 3 is engaged with the peripheral wall 10 and packing is performed.
13 seals between the heat-sensitive plate mounting base 15 and the heat-sensitive plate 2,
Further, the heat sensitive plate 2 is fixed to the heat sensitive plate mounting base 15 by a plurality of resin pins 14 to form a constant temperature spot type sensor 20.
Then, the sensor 20 is installed on a ceiling or the like.

When a hot air flow is generated by the fire, the heat air plate 2 receives the hot air flow, and transfers the heat to the bimetal 3 to displace the rod.
The electric contact section 5 is closed via 13 and a fire signal is sent to a receiver or the like.

At that time, since the bimetal 3 does not wobble or shift, the displacement of the bimetal 3 is accurately transmitted to the rod 13. Also, at this time, since the protruding piece 11 of the bimetal 3 moves so as to open outward when the bimetal 3 is inverted, the peripheral wall 10 does not hinder the inversion of the bimetal 3.

Therefore, since the displacement of the bimetal 3 is performed smoothly, the rod 13 can be slid accurately.

A packing 13 is provided between the heat-sensitive plate mounting base 15 and the heat-sensitive plate 2.
Since it is more sealed, moisture does not enter the bimetal support portion 16. Therefore, there is no possibility that the bimetal 3 is rusted by moisture.

Further, the heat sensitive plate 2 has a resin pin 14 attached to the heat sensitive plate mounting base 15.
Is fixed through the bimetal 3 of the heat sensitive plate 2
The heat transfer to the pin 14 is not hindered by the pin 14.

Effect of the inventionThe constant temperature spot type sensor according to the invention, as described above, is provided with the resin pins for fixing the heat-sensitive plate over the heat-sensitive plate mounting base, so that the heat of the heat-sensitive plate is not transmitted to the pins. ,
It is transmitted to the bimetal as it is.

Therefore, the bimetal can be operated smoothly, and the performance of the sensor can be improved as compared with the conventional example.

In addition, since the space between the heat-sensitive plate and the heat-sensitive plate mounting base is sealed by packing, unlike the conventional example, the time for injecting the filler, the drying time, and the space for drying are not required.

Therefore, the sealing operation can be performed efficiently in a shorter time than in the conventional example. Further, the packing for sealing between the heat-sensitive plate and the heat-sensitive plate mounting base is formed in an annular shape, and is fitted on the outer periphery of the heat-sensitive plate mounting base. Since the outer periphery is pressed by the heat-sensitive plate over the entire periphery, the position of the packing is regulated by both the inner periphery and the outer periphery, and the packing is shifted from a predetermined position. There is no. Therefore, the space between the heat-sensitive plate and the heat-sensitive plate mount can be reliably sealed.

BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1 to 4 are views showing an embodiment of the present invention. FIG. 1 is a longitudinal sectional view, FIG. 2 is a perspective view showing a bimetal, and FIG. 3 is a packing. FIG. 4 is a plan view and FIG. 4 is an enlarged view of a main part of FIG. 1 ... body 2 ... thermal plate 3 ... bimetal 13 ... packing 14 ... pin 15 ... thermal plate mounting base 16 ... bimetal support 20 ... constant temperature spot type sensor

Claims (2)

(57) [Scope of request for utility model registration] 1. A heat-sensitive plate mounting base formed on a main body; an annular packing fitted on an outer periphery of a bimetal support portion of the heat-sensitive plate mounting base; A constant-temperature spot type comprising: a heat-sensitive plate that presses an annular packing over the entire circumference from its outer peripheral side; and a plurality of resin pins that fix the heat-sensitive plate to a heat-sensitive plate mounting base. sensor. 2. The constant temperature spot type sensor according to claim 1, wherein the pins are ultrasonically bonded.