JP2520657Y2 - Soldering device - Google Patents

Description

[Detailed description of the device]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering iron for soldering chip parts.

[0002]

2. Description of the Related Art Conventionally, when soldering semiconductor chip parts or the like by flow work, nitrogen gas is circulated and released into the entire working chamber to form a non-oxidizing atmosphere in the chamber. Also, when soldering lead wires to precision parts such as semiconductors, which tend to lose their function due to heating, and fixing them to the board, pre-solder the board in advance and attach the lead wires to it. Soldering is performed, but in this case, the lead wire pitch around the solder was limited to 0.3 mm.

[0003]

However, in the conventional case where a non-oxidizing atmosphere is formed by the non-oxidizing circulating gas in the entire working chamber, the larger the indoor space is, the larger the gas generating and circulating equipment is required, and the higher the cost is. Was causing the problem. If the pitch of the lead wires around the chip is limited to 0.3 mm or more, there is a problem that the number of lead wires is insufficient with respect to the chip capacity.

[0004]

The present invention for solving the above problems BRIEF SUMMARY OF THE INVENTION may, on the brazed part 16 on the substrate 18
A holder 4 that can be raised and lowered to be pressed against from one side is provided, and the brazing is performed.
A device for soldering the lead wire 17 of the component 16 onto the substrate 18.
Gas flow passage between the holder 4 and the outer periphery of the holder 4.
A cylindrical inner case 1 forming A and having an open lower end;
By covering the outer periphery of the inner case 1
A cylindrical shape that forms another gas flow passage B and has an open tip
The outer case 7 of the above is provided, and the holder 4 is a brazed part.
The two gas flow passages A and B are
If the tip of the side case 1 is connected to allow ventilation
Both, the soldering portion of the lead wire 17 at the time of soldering
Supply pipe 11 for non-oxidizing gas that forms a non-oxidizing atmosphere
Is connected to one gas flow passage A, and the other gas flow passage B is connected.
The first characteristic is that the recovery pipe 14 for non-oxidizing gas is connected. Furthermore, the tip of the inner case 1 is the brazed component 1
6 lead wire 17 on substrate 18 and heat.
The second feature is that it is the third section .

[0005]

When the device of the present invention is used for soldering, the substrate 18
Lower the holder 4 and press the brazed component 16 into contact
However, between the lead wire 17 of the brazed component 16 and the board 18
Solder by heating the soldered part. This time
Inside gas that communicates with the lower end of the inner case 1 so that ventilation is possible
From one of the flow passage A and the outer gas flow passage B to the supply pipe 11.
Supplying more non-oxidizing gas, by the other times Osamukan 14
By discharging (recovering) the above-mentioned supply gas, the inner case
Of the lead wire 17 and the substrate 18 located on the lower end side of the switch 1.
A non-oxidizing gas circulates in the part with a non-oxidizing atmosphere.
Form. As a result, the non-oxidizing gas is only in the soldered part.
To form a non-oxidizing atmosphere locally and oxidize the molten solder.
To prevent soldering and ensure reliable soldering, and to other unnecessary locations
Of non-oxidizing atmosphere is prevented. Tip of inner case 1
The end should be the iron part 3 for heating and pressing the lead wire 17.
Therefore, no other heating and pressing means is required.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The embodiment shown in the drawings will be described in detail below.
Is made of heat-resistant metal, ceramic, etc., and its peripheral wall 1
A heating heater 2 is attached to a and 1c, and the lower end edges of the peripheral walls 1a to 1d heated by the heater 2 form the heating iron portion 3 as they are. Inner case 1
The pipe-shaped main body portion 4b of the holder 4 is provided substantially in the center of the upper wall 1e.
The holder head 4a is axially slidably fitted to the tip end side of the holder body 4b extending into the inner case 1 via the spring 6. The holder head 4a is normally elastically pushed by the spring 6 to the vicinity of the iron portion 3. Holder body 4b protruding upward from the inner case upper wall 1e
Is fixed through the upper wall 7e of the outer case 7 substantially at the center thereof.

The holder body 4b is connected to a vacuum pump (not shown), and the holder head 4
a is pressed against the upper surface of the chip component 16
A vacuum nozzle for adsorbing and adhering is adhered. The outer case 7 is one size larger than the inner case 1, is a hollow rectangular parallelepiped with a lower opening, is made of metal, ceramic, heat-resistant resin, or the like, and is fixedly provided so as to cover the inner case 1 and its surroundings. Between the holder 4 and the inner case 1 and between the inner case 1 and the outer case 7, gas flow passages A and B are formed which are open only at the tip end side.

A supply hole 8 is provided above the inner case side wall 1a.
A supply pipe 1 connected to a gas supply device (not shown) so that a non-oxidizing gas consisting of a reducing or inert gas such as hydrogen or formic acid is jetted and supplied into the hole 8.
The tip end side of 1 is connected. Also, the outer case upper wall 7e
A recovery hole 12 is formed in the hole 12, and a recovery pipe 14 for gas suction is connected to the hole 12. The non-oxidizing gas is ejected from the supply pipe 11, passes through the gas flow passages A and B, is sucked into the recovery pipe 14, and circulates.

As shown in FIG. 3, a chip 1 for soldering
6 is placed on a substrate 18 together with a large number of lead wires 17 attached around it, and a pre-solder 19 is pre-welded on the lower side of the lead wires 17, and the iron part 3 is seen in plan view. The edge of the rectangular inner case opening 1f has a shape corresponding to the outer shape of the chip 16. When the inner case 1 is brought close to the inner case opening 1f so as to accommodate the chip 16 and the opening end of the holder head 4a is brought into contact with the upper surface of the chip component 16 while resisting the spring 6, the holder head 4a will move to the chip component 4a. 16 is sucked and held by the vacuum action, and at this time, the iron portion 3 is in contact with all the lead wires 17 protruding to the outer periphery of the chip 16. As described above, the chip component 16 is grasped, carried to the position of the corresponding preliminary solder portion 19 on the printed circuit board 18 and pressed against it, so that the preliminary solder portion 19 is heated and the non-oxidizing property flowing therethrough is maintained. The lead wire is soldered to the preliminary solder portion 19 in a non-oxidizing atmosphere of gas. At this time, the spring 6 exerts an elastic gripping action on the chip component 16 and is useful for accurate positioning of the chip component 16.

As described above, according to the present invention, since the non-oxidizing gas only needs to flow in the inner and outer cases 1 and 7,
Compared with the conventional case where the entire working chamber is in a non-oxidizing atmosphere, the facility cost is greatly reduced. In addition, if hydrogen or formic acid is used to prevent oxidation, cleaning after soldering is unnecessary. Since the supply pipe 11 and the recovery pipe 14 are connected to a non-oxidizing gas circulation device (not shown), a non-oxidizing atmosphere is formed in the preliminary solder portion 19 only when necessary,
It will be more economical.

Further, the tip end side of the holder head 4a, which comes into contact with the surface of the chip 16 during soldering, performs a suction action, so that the chip 16 is cooled and is less likely to be affected by heating by soldering. In this case, it is possible to provide steps in the suction force so that the degree of cooling can be appropriately selected according to the temperature of the iron portion 3, the heat resistance of the tip 16, the degree of pitch of the lead wires 17, and the like. It is also possible to change the connection position of the supply pipe 11 and the recovery pipe 14 so that the flow direction of the non-oxidizing gas in the gas flow passages A and B is opposite to that in the above embodiment.

[0012]

According to the present invention configured as described above ,
Only in the inner outer case was circulated non-oxidizing gas inner cable
Partially non-oxidizing atmosphere only on the soldering part on the tip side
It is possible to form a non-acid in the space other than the soldered part.
It is possible to prevent the chemical gas from diffusing, and it is possible to reduce the size of the device compared to the conventional case where the entire working chamber is in a nitrogen atmosphere.
In addition to being able to reveal, a cable for shielding non-oxidizing gas
Since there is no need for things such as singing, facility costs can be greatly reduced and economic efficiency can be improved. In addition, press the lead wire against the tip of the inner case and
By using the trowel for heating, other pressing and heating means
do not need.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention.

FIG. 2 is a perspective view showing an embodiment of the present invention.

FIG. 3 is a perspective view showing a chip or the like which is an adherend member.

[Explanation of symbols]

 1 Inner case 1a to 1d Inner case peripheral wall 1f Inner case opening 3 Trowel part 4 Holder 4a Holder head 7 Outer case 11 Supply pipe 14 Recovery pipe 16 Brazing part (chip member)

Claims (2)

(57) [Scope of utility model registration request] 1. A brazing component (16) on a substrate (18).
A holder (4) that can be moved up and down to press from above is provided.
The lead wire (17) of the brazing component (16) is connected to the substrate (18).
In the above soldering device, the holder (4)
A gas flow passage (A) is formed between the outer circumference and the lower end is open.
Of the cylindrical inner case (1) and the inner case (1)
Other gas circulation by covering the outer circumference
A cylindrical outer case that forms the passage (B) and has an open end
(7) and the holder (4) is provided with a brazed component (1
6) The two gas flow passages (A), which are pressed against each other,
(B) communicates with the inner case (1) at the tip side so that it can be ventilated.
The structure of the lead wire (1
7) Non-oxidizing to form a non-oxidizing atmosphere in the soldered part
Connect the characteristic gas supply pipe (11) to one gas flow passage (A).
And the other gas flow passage (B) to the non-oxidizing gas recovery pipe.
A soldering device connected to (14) . 2. The inner case (1) has a brazed part at its tip.
Connect the lead wire (17) of (16) on the substrate (18)
The soldering device according to claim 1, wherein the soldering device is a heating iron part (3) .