JP2514551Y2 - Power supply structure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a power supply structure for supplying power to electronic equipment.

[Conventional technology]

Conventionally, this type of electric power supply structure is composed of a backboard panel that holds a power receiving terminal and a power supply connector in a housing unit and is connected by an internal wiring pattern, and a card guide that guides the logic package, which is a pair on the upper and lower surfaces. The logic package has a power supply connector on one end surface and a signal relay connector on one end surface, and a stiffener is attached to the center of the logic package to prevent the warp of the package.

[Problems to be solved by the device]

As shown in FIG. 3, the above-mentioned conventional power feeding structure has a terminal 2 for receiving power from the end of the backboard panel 1, and the electricity supplied to the terminal 2 is distributed through the electrical wiring pattern in the backboard panel 1. As described above, the power feeding connector 3 attached to the backboard panel 1 is energized and the logic package 4 is mounted on the accommodation unit 5, so that the logic package 4 is connected to the power receiving connector 6 and the power is fed into the logic package and the electric circuit is connected. After being converted into a signal through the signal relay connector 7, the power is mounted to the outside through the signal relay connector 7, and since the power receiving connector 6 is provided only on the back side surface of the logic package 4, Considering voltage drop and voltage drop,
The size of the package cannot be increased to secure the required voltage.
In addition, since the power is supplied from the terminal 2 to the power receiving connector 6 via the wiring pattern in the backboard panel and the power feeding connector 3, the energization distance becomes long, and many voltage drops occur during this time. Further, since the signal relay connector 7 is provided only on one end surface of the logic package 4, it is necessary to increase the size of the package or increase the number of packages in order to secure the required number of signals, which lowers the mounting efficiency. In addition, there is a drawback that the stiffener 8 is required to prevent the warpage of the logic package in order to facilitate the insertion / removal of the power feeding connector 3 and the power receiving connector 6 and to prevent the contact with the adjacent logic package.

An object of the present invention is to provide a power supply structure that solves the above problems.

[Means for solving the problem]

In order to achieve the above object, the power supply structure according to the present invention comprises:
A backboard panel having a first connector, a substrate having a second connector at an end portion for connecting to the first connector, and a side edge portion of the substrate facing each other, and a first board of the backboard panel. And a pair of card guides that guide the board so as to connect the connector to the second connector of the board, and a power supply to the board, the card guide being suspended between the pair of card guides. A bus bar disposed along a plate surface on one side of the board, and a bus bar of the board relative to the bus bar when the first connector of the backboard panel and the second connector of the board are connected. A device for electrically connecting the substrate and the bus bar by fitting from the insertion / removal direction, and is provided on the plate surface of the substrate in the direction of opposite side edge portions of the substrate sandwiched by the pair of card guides. Mounted salary And a power block.

Further, the power feeding block has a leaf spring, and the leaf spring sandwiches the bus bar inserted in the power feeding block and electrically connects the bus bar to the bus bar.

Further, the first connector of the backboard panel and the second connector of the board are signal relay connectors.

The power supply block has a concave structure that receives the bus bar.

Further, the mounting position of the power feeding block is the central portion of the substrate.

〔Example〕

Next, the present invention will be described with reference to the drawings. First
1 and 2 are views showing an embodiment of the present invention. FIG. 1 is a perspective view when a logic package is mounted in a housing unit, and FIG. 2 is a view when a power supply block and a bus bar are connected. FIG. The accommodation unit 5 is provided with a terminal 2 for receiving a power supply coming from outside, and the terminal 2 is connected to a bus bar 11 arranged between card guides 10 provided above and below the accommodation unit 5. As a result, the electricity received at terminal 2 flows through bus bar 11. Since the logic package (board) 4 is mounted in the accommodation unit 5, it enters the groove of the card guide 10 and is moved inward in the groove. By moving, the bus bar 11 is pinched by the leaf spring 13 in the power supply block 12 in the central portion of the logic package 4, and the electricity flowing through the bus bar 11 is a leaf spring.
Power is supplied to the logic package substrate by flowing to the power supply block 12 via 13 and connecting the power supply block 12 to the electric wiring pattern in the logic package 4. By providing the power supply block 12 between the upper and lower parts of the center of the logic package, the power supply and the warpage of the logic package 4 can be prevented, and the wiring pattern length from the power supply part can be shortened to reduce the voltage drop value. The voltage deviation of is also reduced. Further, by moving the logic package 4 inward, the connector 9 on the rear surface of the logic package and the signal relay connector 7 mounted on the backboard panel 1
Signals can be taken out from the backboard panel 1 surface by joining with. As a result, signals can be taken out from two points, that is, the front part of the logic package 4 and the backboard panel 1, so that many signals can be taken out.

[Effect of device]

As described above, according to the present invention, since the power supply block is attached to the board, the power supply block can prevent the board from warping. Further, the length of the wiring pattern from the power feeding unit can be shortened by using the bus bar for power supply and the power feeding block, and therefore the voltage drop value can be reduced.

Further, since the power supply block sandwiches the bus bar with the leaf spring and is electrically connected to the bus bar via the leaf spring, the wiring structure can be simplified, the wiring pattern length can be shortened, and the insertion / extraction is performed. Can be done easily.

Further, since the backboard panel and the board are provided with the signal relay connector, many signals can be taken out.

As described above, the present invention makes it possible to design a package with a small voltage deviation and a high mounting density, realize a large package board mounting, and realize a small size, high density package board mounting capable of inputting / outputting multiple signals. There is.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention, and FIG.
FIG. 3 is a sectional view taken along the line AA in FIG. 3, and FIG. 3 is a perspective view showing a conventional example. 1 ... Backboard panel, 2 ... Terminal 3 ... Power supply connector, 4 ... Logic package 5 ... Accommodating unit, 6 ... Power receiving connector, 7 ... Signal relay connector, 8 ... Stiffener, 9 ... Connector, 10 …… Card guide 11 …… Bus bar, 12 …… Power supply block 13 …… Flat spring

Claims (5)

(57) [Scope of utility model registration request] 1. A backboard panel having a first connector, a substrate having a second connector connected to the first connector at an end, and a side edge portion of the substrate sandwiched between the backboard panel and the backboard panel. A pair of card guides for guiding the board so as to connect the first connector of the board panel and the second connector of the board, and a card guide for supplying power to the board. The bus bar, which is suspended between the bus bar and is disposed along the plate surface on one side of the substrate, and the first connector of the backboard panel and the second connector of the substrate are connected to each other. The board and the bus bar are electrically connected to each other by fitting in the board insertion / removal direction, and the board and the bus bar are electrically connected to each other in the direction of opposite side edges of the board sandwiched by the pair of card guides. Set on the board surface A power feeding structure having a power feeding block attached thereto. 2. The power feeding block has a leaf spring, and the leaf spring sandwiches a bus bar inserted in the power feeding block and electrically connects the bus bar to the bus bar. The power feeding structure according to claim 1, which is characterized in that. 3. The power feeding structure according to claim 1, wherein the first connector of the backboard panel and the second connector of the substrate are signal relay connectors. 4. The power feeding block has a concave structure for receiving the bus bar.
The power supply structure described in. 5. The power feeding structure according to claim 1, 2 or 4, wherein a mounting position of the power feeding block is a central portion of the substrate.