JP2510850B2 - Thick film thermal print head - Google Patents
Thick film thermal print headInfo
- Publication number
- JP2510850B2 JP2510850B2 JP60073318A JP7331885A JP2510850B2 JP 2510850 B2 JP2510850 B2 JP 2510850B2 JP 60073318 A JP60073318 A JP 60073318A JP 7331885 A JP7331885 A JP 7331885A JP 2510850 B2 JP2510850 B2 JP 2510850B2
- Authority
- JP
- Japan
- Prior art keywords
- heating resistor
- substrate
- thick film
- print head
- thermal print
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Description
【発明の詳細な説明】 産業上の利用分野 この発明は厚膜サーマルプリントヘッドに関する。Description: FIELD OF THE INVENTION This invention relates to thick film thermal printheads.
従来の技術 通常の厚膜サーマルプリントヘッドは、それぞれ１つ
の基板に対して１つの発熱抵抗体が形成されており、前
記発熱抵抗体が形成される位置によりいわゆるセンター
タイプ、エッジタイプと呼ばれるものが知られている。2. Description of the Related Art A typical thick film thermal print head has one heating resistor formed on each substrate, and a so-called center type or edge type is used depending on the position where the heating resistor is formed. Are known.
発明が解決しようとする問題点 従来の厚膜サーマルプリントヘッドでは、その発熱抵
抗体の発熱−冷却サイクルに現段階において最小限度3m
sを要する関係上、印字速度の高速化にも限界がある。
しかも、カラー印字を行う場合にあっては、その発熱抵
抗体に対して印字すべき感熱紙を３往復させる必要があ
り、印字効率の低下を余儀なくされている。Problems to be Solved by the Invention In the conventional thick-film thermal print head, the minimum temperature of the heating-cooling cycle of the heating resistor is 3 m at the present stage.
Since it requires s, there is a limit to the increase in printing speed.
Moreover, in the case of performing color printing, it is necessary to reciprocate the thermal paper to be printed 3 times with respect to the heat generating resistor, which inevitably reduces the printing efficiency.
そこで、上記厚膜サーマルプリントヘッドを複数個寄
せ集めることでカラー印字の簡便化および印字効率の向
上を図るようなものが考えられるが、次の点によって実
施するに至らないのが現状である。即ち、前記複数個の
発熱抵抗体間のそれぞれの間隔が広いので、前記各発熱
抵抗体に印字すべき感熱紙を押圧せしめるプラテンがそ
れぞれに必要となり、装置自体が大型化するという問題
点である。Therefore, it is conceivable to simplify the color printing and improve the printing efficiency by gathering a plurality of the thick film thermal print heads, but the present situation is that it is not implemented due to the following points. That is, since the intervals between the plurality of heat generating resistors are wide, a platen for pressing the thermal paper to be printed on each of the heat generating resistors is required for each of them, which causes a problem that the apparatus itself becomes large. .
従ってこの発明の目的とする処は、カラー印字の簡便
化及び印字効率の向上が図れ、しかも装置自体をコンパ
クトにしうる厚膜サーマルプリントヘッドを提供するこ
とにある。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a thick film thermal print head capable of simplifying color printing and improving printing efficiency, and further making the apparatus itself compact.
問題点を解決するための手段 本発明に係る厚膜サーマルプリントヘッドは、絶縁基
板上に複数本の導体ラインが平行に形成されており、各
導体ラインの間に発熱抵抗体が導体ラインに対して直角
の方向に一列に並べて各々形成された第１、第２の基板
を備えており、第１、第２の基板を上下に重ねて多層構
造とし、第２の基板の絶縁基板上と発熱抵抗体列との間
に形成された断面が突状の絶縁層により当該発熱抵抗体
列と第１の基板の発熱抵抗体列とを同じ高さとし、第１
の基板の発熱抵抗体列と第２の基板の発熱抵抗体列とを
近接配置した構成となっている。Means for Solving the Problems In a thick film thermal print head according to the present invention, a plurality of conductor lines are formed in parallel on an insulating substrate, and a heating resistor is provided between the conductor lines with respect to the conductor lines. And a first and a second substrate which are respectively formed in a line at right angles to form a multilayer structure by stacking the first and the second substrates on top of each other to generate heat on the insulating substrate of the second substrate. The heating resistor array and the heating resistor array of the first substrate have the same height due to the insulating layer having a projecting cross section formed between the resistor array and the first resistor array.
The heat generating resistor array of the second substrate and the heat generating resistor array of the second substrate are arranged close to each other.
作用 第１、第２の基板の導体ラインに所定の電気信号を与
えると、これに応じて第１、第２の基板の発熱抵抗体が
個別に発熱する。Operation When a predetermined electric signal is applied to the conductor lines of the first and second substrates, the heating resistors of the first and second substrates individually generate heat in response to this.
実施例 以下、図面を参照してこの発明の一実施例を詳細に説
明する。この発明の一実施例である厚膜サーマルプリン
トヘッドの側面図を第１図に、平面図を第２図にそれぞ
れ示している。Embodiment Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 shows a side view of a thick film thermal print head according to one embodiment of the present invention, and FIG. 2 shows a plan view thereof.
図例の厚膜サーマルプリントヘッド１は、３列の発熱
抵抗体のうち中央に配置され且つセンタータイプ交互リ
ード方式と呼ばれる配列の導体層が接続される第１発熱
抵抗体10と、この第１発熱抵抗体10の両側に平行に近接
して配置され且つエッジタイプ折り返しリード方式と呼
ばれる配列の導体層がそれぞれ接続される第２及び第３
発熱抵抗体20、30とで構成するものである。The thick film thermal print head 1 of the illustrated example has a first heating resistor 10 which is arranged in the center of the three rows of heating resistors and to which conductor layers of an array called a center type alternating lead system are connected, and the first heating resistor 10. Second and third conductor layers which are arranged in parallel and close to each other on both sides of the heating resistor 10 and to which conductor layers of an arrangement called an edge type folded lead system are respectively connected.
It is composed of heating resistors 20 and 30.
具体的には、第１発熱抵抗体10は、例えばセラミック
からなる基板40の表面略中央位置に例えばスクリーン印
刷等にて形成された突脈状のグレーズ層11の頂点に、そ
の長手方向に沿って形成されている。この第１発熱抵抗
体10には、その長手方向と直交する方向図中右側に延在
する導体層12a〜12nの一端が、また図中左側に延在する
導体層13a〜13nの一端がそれぞれ所定間隔をもって交互
に接続されている。この導体層12a〜12nの他端は、それ
を２分割して２つのコモン端子（図示省略）を介して２
個の電源回路（図示省略）に接続させており、導体層13
a〜13nの他端は、それぞれ個別のドライバ回路（図示省
略）に接続されている。即ち、この第１発熱抵抗体10
は、導体層12a〜12nと13a〜13nとで分離された記録ドッ
ト（図中破線で示す）を１個単位で発熱させるようにな
っている。Specifically, the first heating resistor 10 is arranged along the longitudinal direction at the apex of the pulse-shaped glaze layer 11 formed by, for example, screen printing at a substantially central position on the surface of the substrate 40 made of, for example, ceramics. Is formed. In the first heating resistor 10, one end of the conductor layers 12a to 12n extending to the right side in the drawing orthogonal to the longitudinal direction thereof and one end of the conductor layers 13a to 13n extending to the left side in the drawing are respectively provided. They are connected alternately at a predetermined interval. The other end of each of the conductor layers 12a to 12n is divided into two and divided into two via two common terminals (not shown).
It is connected to one power circuit (not shown), and the conductor layer 13
The other ends of a to 13n are connected to individual driver circuits (not shown). That is, the first heating resistor 10
Is designed to generate heat in units of one recording dot (shown by a broken line in the figure) separated by the conductor layers 12a to 12n and 13a to 13n.
第２発熱抵抗体20は、第１発熱抵抗体10の長手方向左
側に形成された絶縁層21の表面エッジ部近傍に第１発熱
抵抗体10と平行に近接して形成されている。この第２発
熱抵抗体20には、その長手方向と直交する方向図中左側
に延在する導体層22a〜22n、23a〜23nの一端がそれぞれ
所定間隔をもって交互に接続されている。導体層22a〜2
2nの他端はコモン端子（図示省略）を介して１つの電源
回路（図示省略）に接続されており、導体層23a〜23nの
他端は、それぞれ個別のドライバ回路（図示省略）に接
続されている。一方、第３発熱抵抗体30は、第１発熱抵
抗体10の長手方向右側に形成された絶縁層31の表面エッ
ジ部近傍に第１発熱抵抗体10と平行に近接して形成され
ている。この第３発熱抵抗体30には、その長手方向と直
交する方向図中中右側に延在する導体層32a〜32n、33a
〜33nの一端がそれぞれ所定間隔をもって交互に接続さ
れている。導体層32a〜32nの他端はコモン端子（図示省
略）を介して１つの電源回路（図示省略）に接続されて
おり、導体層33a〜33nの他端は、それぞれ個別のドライ
バ回路（図示省略）に接続されている。即ち、第２及び
第３発熱抵抗体20、30は、導体層22a〜22nと23a〜23nと
で、導体層32a〜32nと33a〜33nとでそれぞれ分離された
記録ドット（図示破線で示す）を２個単位で発熱させる
ようになっている。The second heating resistor 20 is formed in the vicinity of the surface edge of the insulating layer 21 formed on the left side in the longitudinal direction of the first heating resistor 10 in parallel with the first heating resistor 10. To the second heating resistor 20, one ends of conductor layers 22a to 22n and 23a to 23n extending to the left side in the direction orthogonal to the longitudinal direction of the second heating resistor 20 are alternately connected with a predetermined interval. Conductor layers 22a-2
The other end of 2n is connected to one power supply circuit (not shown) via a common terminal (not shown), and the other ends of the conductor layers 23a to 23n are connected to respective driver circuits (not shown). ing. On the other hand, the third heating resistor 30 is formed in parallel with the first heating resistor 10 near the surface edge of the insulating layer 31 formed on the right side in the longitudinal direction of the first heating resistor 10. The third heating resistor 30 includes conductor layers 32a to 32n, 33a extending rightward in the direction perpendicular to the longitudinal direction of the third heating resistor 30.
One end of each of ~ 33n is alternately connected at a predetermined interval. The other ends of the conductor layers 32a to 32n are connected to one power supply circuit (not shown) via a common terminal (not shown), and the other ends of the conductor layers 33a to 33n are each provided with individual driver circuits (not shown). )It is connected to the. That is, the second and third heating resistors 20 and 30 are the recording dots (indicated by broken lines in the figure) separated by the conductor layers 22a to 22n and 23a to 23n and the conductor layers 32a to 32n and 33a to 33n, respectively. It is designed to generate heat in units of two.
プラテン50は略円柱形状をしており、印字すべき記録
媒体である感熱紙（図示省略）を上記第１〜第３発熱抵
抗体10、20、30に均等に押圧せしめるものである。The platen 50 has a substantially columnar shape, and heat-sensitive paper (not shown), which is a recording medium to be printed, is evenly pressed against the first to third heating resistors 10, 20, 30.
しかして、第１発熱抵抗体10に接続された導体層12a
〜12n、13a〜13nと、第２及び第３発熱抵抗体20、30に
接続された導体層22a〜22n、23a〜23n及び導体層32a〜3
2n、33a〜33nとは、絶縁層21、31により絶縁分離された
多層構造になっており、第１〜第３発熱抵抗体10、20、
30は各々個別に駆動できるようになっている。更に、第
１〜第３発熱抵抗体10、20、30は、印字すべき感熱紙が
プラテン50にて均等に押圧されるような位置関係で形成
されている。Then, the conductor layer 12a connected to the first heating resistor 10
-12n, 13a-13n, and conductor layers 22a-22n, 23a-23n and conductor layers 32a-3 connected to the second and third heating resistors 20, 30.
2n and 33a to 33n have a multi-layer structure in which they are insulated and separated by insulating layers 21 and 31, and the first to third heating resistors 10 and 20,
Each 30 can be driven individually. Furthermore, the first to third heating resistors 10, 20, 30 are formed in such a positional relationship that the thermal paper to be printed is uniformly pressed by the platen 50.
従って、上記構成の厚膜サーマルプリントヘッド１の
印字動作は、従来のいわゆるセンタータイプ及びエッジ
タイプと呼ばれる厚膜サーマルプリントヘッドの印字動
作と原理的に同一であり、ここではその説明を省略す
る。但し、各発熱抵抗体10、20、30は同時に駆動させる
か、感熱紙の搬送ピッチに合わせて順次駆動させるかが
任意に行えることは勿論である。Therefore, the printing operation of the thick film thermal print head 1 having the above-mentioned configuration is the same as the printing operation of the conventional so-called center type and edge type thick film thermal print head in principle, and the description thereof is omitted here. However, it goes without saying that it is possible to arbitrarily drive the heating resistors 10, 20, 30 simultaneously or sequentially according to the conveyance pitch of the thermal paper.
なお、この発明は上記実施例に限定されるものではな
く、各発熱抵抗体に接続される導体層の配列を変えるこ
とによっていくつかの実施例が考えられる。例えば第３
図に示すように、第１〜第３発熱抵抗体16、27、36と接
続される導体層の配列をいわゆるエッジタイプ折り返し
リード方式にしたものを各導体層間に絶縁層25、35を介
在させて多層構造にして平行に近接する各発熱抵抗体1
6、27、36を基板41のエッジ部分近傍に形成するものが
考えられる。The present invention is not limited to the above-mentioned embodiments, and several embodiments can be considered by changing the arrangement of the conductor layers connected to the respective heating resistors. For example, the third
As shown in the figure, the conductor layers connected to the first to third heating resistors 16, 27 and 36 are arranged in a so-called edge type folded lead system with insulating layers 25 and 35 interposed between the conductor layers. Heat-generating resistors 1 in parallel and close to each other
It is conceivable to form 6, 27 and 36 near the edge portion of the substrate 41.
発明の効果 以上、本発明に係る厚膜サーマルプリントヘッドによ
る場合、発熱抵抗体列及び複数の導体ラインが形成され
た第１、第２の基板を多層構造にした構成となっている
ので、発熱抵抗体の隣合う間隔を小さくすることが容易
となり、これに伴って１つのプラテンによる高品位なカ
ラー印字が可能となる。従来法とは異なり、感熱紙を何
回も往復させる必要がない分だけカラー印字の高速化を
図ることができ、プラテンを省略することができる分だ
け装置全体の小型化を図ることができる。As described above, in the case of the thick film thermal print head according to the present invention, since the first and second substrates on which the heating resistor array and the plurality of conductor lines are formed have the multilayer structure, It becomes easy to reduce the interval between the resistors adjacent to each other, which enables high-quality color printing by one platen. Unlike the conventional method, it is possible to increase the speed of color printing by the fact that the thermal paper does not have to be reciprocated many times, and it is possible to reduce the size of the entire apparatus by omitting the platen.
第１図は厚膜サーマルプリントヘッドを側面視した構成
概略図、第２図は厚膜サーマルプリントヘッドを平面視
した構成概略図、第３図は厚膜サーマルプリントヘッド
の別の実施例を示す説明図である。 １…厚膜サーマルプリントヘッド 10…第１発熱抵抗体 11…グレーズ層 12a〜12n,13a〜13n…導体層 20…第２発熱抵抗体 30…第３発熱抵抗体 21,31…絶縁層 22a〜22n,23a〜23n,32a〜32n,33a〜33n…導体層 40…基板FIG. 1 is a schematic side view of the thick film thermal print head, FIG. 2 is a schematic plan view of the thick film thermal print head, and FIG. 3 is another embodiment of the thick film thermal print head. FIG. 1 ... Thick film thermal print head 10 ... First heating resistor 11 ... Glaze layer 12a-12n, 13a-13n ... Conductor layer 20 ... Second heating resistor 30 ... Third heating resistor 21, 31 ... Insulating layer 22a ... 22n, 23a to 23n, 32a to 32n, 33a to 33n ... Conductor layer 40 ... Substrate
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭48−55628（ＪＰ，Ａ) 特開 昭59−155075（ＪＰ，Ａ) 特開 昭60−48385（ＪＰ，Ａ) 特開 昭60−23069（ＪＰ，Ａ) 特開 昭60−52366（ＪＰ，Ａ) 特開 昭53−59438（ＪＰ，Ａ) 実開 昭48−108529（ＪＰ，Ｕ) ─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-48-55628 (JP, A) JP-A-59-155075 (JP, A) JP-A-60-48385 (JP, A) JP-A-60- 23069 (JP, A) JP-A 60-52366 (JP, A) JP-A 53-59438 (JP, A) Actual development Sho-48-108529 (JP, U)
Claims (1)
形成されており、各導体ラインの間に発熱抵抗体が導体
ラインに対して直角の方向に一列に並べて各々形成され
た第１、第２の基板を備えており、第１、第２の基板を
上下に重ねて多層構造とし、第２の基板の絶縁基板上と
発熱抵抗体列との間に形成された断面が突状の絶縁層に
より当該発熱抵抗体列と第１の基板の発熱抵抗体列とを
同じ高さとし、第１の基板の発熱抵抗体列と第２の基板
の発熱抵抗体列とを近接配置したことを特徴とする厚膜
サーマルプリントヘッド。1. A first conductor line in which a plurality of conductor lines are formed in parallel on an insulating substrate, and a heating resistor is formed between the conductor lines in a line at right angles to the conductor lines. , A second substrate, the first and second substrates are vertically stacked to form a multi-layer structure, and the cross section formed between the insulating substrate of the second substrate and the heating resistor array has a protruding shape. The heating resistor array of the first substrate and the heating resistor array of the first substrate are made to have the same height by the insulating layer of, and the heating resistor array of the first substrate and the heating resistor array of the second substrate are arranged close to each other. Thick film thermal print head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60073318A JP2510850B2 (en) | 1985-04-06 | 1985-04-06 | Thick film thermal print head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60073318A JP2510850B2 (en) | 1985-04-06 | 1985-04-06 | Thick film thermal print head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61230958A JPS61230958A (en) | 1986-10-15 |
| JP2510850B2 true JP2510850B2 (en) | 1996-06-26 |
Family
ID=13514701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60073318A Expired - Lifetime JP2510850B2 (en) | 1985-04-06 | 1985-04-06 | Thick film thermal print head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2510850B2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS527898B2 (en) * | 1971-11-12 | 1977-03-05 | ||
| JPS48108529U (en) * | 1972-03-16 | 1973-12-14 |
-
1985
- 1985-04-06 JP JP60073318A patent/JP2510850B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61230958A (en) | 1986-10-15 |
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