JP2505719Y2 - Mold for upward marking - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention relates to a die for upward marking that is used to perform upward marking on a workpiece.

(Prior Art) Conventionally, for example, in a turret punch press, a plurality of stations are provided at appropriate intervals on the circumference of the upper and lower turrets, and each station is paired with an upper die and a lower die. Have been installed. When the workpiece is to be engraved upward, a die for upward engraving with a pair of upper and lower dies is attached to the station, and for example, one character is engraved in one station.

(Problems to be solved by the invention) By the way, in the case of randomly engraving a large number of characters on a work, there is a problem that the number of dies for engraving becomes large and many stations of the turret are used. .

Moreover, since one die is required to perform the marking of one character, the die cost is required. Moreover, since the turret is rotated every time the character is changed, there is a problem that it takes time.

The purpose of this invention is to improve the above-mentioned problems by using a single station, eliminating the loss of time to rotate the turret, speeding up the processing speed, and reducing the die cost. It is to provide a mold for use.

(Means for Solving the Problems) In order to achieve the above-mentioned object, the present invention provides an upper mold having a lower surface formed into a flat surface and a lower die having a plurality of marking chips mounted on the circumference of a die holder at appropriate intervals. An upward marking die for performing upward marking on a work in cooperation with a die, wherein a die plate is provided below the die holder, and a rotatable rotary member is engaged with the die plate. A desired marking chip is selected from a plurality of marking chips by rotating it relative to the die holder, and an upward marking mold is used as a structure for supporting the lower surface of the marking chip selected by the striker portion of the die plate. Configured.

(Operation) By adopting the upward marking die of this invention,
When the workpiece is subjected to upward marking, an upper mold having a flat lower surface and a lower mold having a plurality of marking chips mounted on the circumference of the die holder are positioned at the processing position. Next, a desired marking chip is selected from the plurality of marking chips mounted on the die holder. The rotating member is relatively rotated on the lower surface of the selected marking chip to index and position the striker portion of the die plate for support. The work is engraved by the cooperation of the upper die and the lower die.

When the workpiece is subjected to the next engraving process, the rotating member is rotated to index and position the striker portion of the die boulder on the lower surface of the desired engraving chip and to support it.

(Embodiment) Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.

Referring to FIG. 4, the turret punch press 1 has a gate-shaped structure composed of left and right columns 5 and 7 surrounding the gap 3 and upper and lower frames 9 and 11. Disk-shaped upper and lower turrets 13 and 15 are rotatably supported by rotating shafts 17 and 19 on the upper left and lower frames 9 and 11 of the gap portion 3 in FIG. In addition, the lower turrets 13 and 15 are adapted to be rotated synchronously by a drive motor such as a servo motor (not shown).

A plurality of upper and lower stations are provided on the circumference of the upper and lower turrets 13 and 15 at appropriate intervals, and the upper and lower dies 21 and 23 of the upper and lower stations face each other. And is installed.

A ram body 27 having a striker 25 for hitting the upper die 21 of the upper turret 13 is mounted on the upper frame 9 so as to be able to move up and down. A crankshaft 29 for raising and lowering the ram body 27 is provided on the upper frame 9, and a drive device for transmitting rotation is interlocked with the crankshaft 29.

A fixed table 31 for supporting the work W is provided on the lower frame 11 on the right side of the recess 3 in FIG. 4, and a movable table 35 is provided via a guide rail 33 installed on the lower frame 11. Are movably provided in the left-right direction (Y-axis direction) in FIG.

A carriage base 37 is provided on the moving table 35, and the carriage base 37 has a front-back direction (X
A carriage 41 movable in the X-axis direction is provided along a guide rail 39 extending in the axial direction).
A plurality of work clamps 43 are attached to the front side of the carriage 41, and the work W is clamped to the work clamps 43.

With the above configuration, the work W is clamped to the work clamp 43, and the work clamp 43 is moved in the X and Y axis directions to position the desired position of the work W at the machining position. Then, the upper and lower turrets 13 and 15 are rotated to index and position the desired upper and lower molds 21 and 23 at the processing position, and the work W is formed on the work W by the cooperation of the upper mold 12 and the lower mold 23. Punching will be performed.

The upper die 45A and the lower die 45B of the upward marking die 45 are attached to one of the upper and lower die 13 and 15 which are attached to a plurality of stations in the upper and lower turrets 13 and 15, respectively. .
As shown in FIG. 3, the upper die 45A has a well-known overall structure, so a detailed description thereof will be omitted, but the lower surface 47A of the punch tip 47 is formed as a flat surface. ing. That is, the punch chip 47 is a blind punch.

The lower mold 45B of the upward marking mold 45 is attached to one of a plurality of stations arranged on the lower turret 15, as shown in FIGS. 1 and 2. More specifically, in FIGS. 1 and 2, a die plate 51 is attached to the hole 49 formed in the lower turret 15. A pulley 53 as a rotating member is integrated with a key 55 on the outer periphery of the die plate 51. One end of the endless belt 57 is wound around the pulley 53, and the other end of the endless belt 57 is wound around another pulley provided in a drive device (not shown). Since this drive transmission is already known as, for example, Japanese Patent Publication No. 63-59774, the detailed description of the structure is omitted.

With the above configuration, when the driving device (not shown) is driven, the endless belt 57 travels and the rotation is transmitted to the pulley 53, so that the die plate 51 is rotated.

A die holder 59 is rotatably supported on the pulley 53, and ten marking chips 61 are provided on the circumference of the die holder 59 at intervals of, for example, 36 ° as shown in FIG. (61A to 61J) are mounted with a spring 63 interposed. For example, numbers 0 to 9 are engraved on the upper surface of the engraving chip 61 (61A to 61J).

A die spacer 65 is provided on the outer peripheral portion of the die holder 59, and an ejector plate 67 is provided on the inner peripheral portion of the die holder 59. Moreover, a support plate 69 is provided between the die plate 51 and the die holder 59, and an elastic member 71 is provided between the die holder 59 and the ejector plate 67. Further, the support plate 69, the die holder 59, the elastic member 71.
The ejector plate 67 and the ejector plate 67 are integrated with each other by the bolts 73 inserted into the holes formed in the axial centers of each other.
69 is rotatably supported on the die plate 51.

As shown in FIG. 1, a part of the upper portion of the die plate 51 is provided with, for example, a cam-shaped striker portion 51S, and the die plate 51 is rotated relative to the die holder 59 to obtain a desired marking chip. When indexed on the lower surface of 61, the indexed chip 61 that has been indexed is pushed upward and at the same time supports the processing force.

With the above configuration, when the workpiece W is subjected to the upward marking process, the upward marking mold 45 is selected from the plurality of upper and lower molds 21 and 23 mounted on the stations of the upper and lower turrets 13 and 15. The upper mold 45A and the lower mold 45B are indexed to the processing position by rotating the upper and lower turrets 13 and 15. Then
For example, when stamping the number 3 on the work W, the die plate 51 is rotated and the striker portion 51S is moved to the number 3.
When the index is applied to the lower surface of the marking chip 61D, the striker portion 51S pushes the marking chip 61D upward and
Support. In this state, the upper die 45A and the lower die 45B are caused to cooperate with each other, so that the work W is engraved with the numeral 3.

As described above, when engraving the numbers 0 to 9 on the work W, the die plate 51 is rotated relative to the die holder 59 to index the desired engraving tip 61 to the processing position. Since it is not necessary to index the lower die 45B one by one, it can be done in a short time and at a high processing speed. Further, the upward marking die 45 can be attached to one station instead of being attached to a large number of stations as in the conventional case, and the die cost can be reduced.

The present invention is not limited to the above-described embodiments, but can be implemented in other modes by making appropriate changes.

[Effects of the Invention] As can be understood from the above description of the embodiments, according to the present invention, when the workpiece is subjected to the upward marking, the upper die and the die holder whose lower surface is formed flat at the processing position. The lower die having a plurality of marking chips mounted thereon is positioned at appropriate intervals on the circumference of. Next, a desired marking chip is selected from the plurality of marking chips mounted on the die holder. The rotating member is relatively rotated on the lower surface of the selected marking chip to index and position the striker portion of the die plate for support. The work is engraved by the cooperation of the upper mold and the lower mold.

Further, when the next engraving process is performed on the work, the rotating member is rotated relative to the die holder to index and position the striker portion of the die holder on the lower surface of the desired engraving chip and to repeatedly support it. Be done.

Therefore, the upper and lower turret stations are equipped with one upward marking die, and the lower die is rotated for indexing. Therefore, it is necessary to individually index the lower die as in the past. Since it is not available, the processing speed can be increased in a short time. In addition, the upward marking die is not attached to many stations as in the past, and
Since an upward marking die having a large number of marking tips attached to one station is used, the die cost can be reduced.

[Brief description of drawings]

FIG. 1 shows the main part of this device, and I- in FIG.
A sectional view taken along the line I, FIG. 2 is a plan view of a lower turret of the upward marking die attached to the lower turret, and FIG. 3 is a schematic view of the upper die of the upward marking die. Schematic diagram,
FIG. 4 is a front view of a turret punch press according to an embodiment of the present invention. 1 …… Turret punch press, 15 …… Lower turret 45 …… Upward marking die, 45A …… Upper die 45B …… Lower die, 47 …… Punch tip 47A …… Bottom surface, 51 …… Die plate 51S ...... Strike part, 53 …… Pulley (rotating member) 61,61A, 61J …… Marking tip, 65 …… Die spacer

Claims (1)

(57) [Scope of utility model registration request] 1. An upward marking for performing upward marking on a work by cooperation of an upper mold having a flat lower surface and a lower mold having a plurality of marking chips mounted on the circumference of a die holder at appropriate intervals. A plurality of marking chips by providing a die plate below the die holder, engaging a rotatable rotating member on the die plate, and rotating the rotating member relative to the die holder. A die for upward marking, characterized in that a desired marking chip is selected from, and the lower surface of the selected marking chip is supported by the striker portion of the die plate.