JP2025524883A - 電子コンポーネントを液浸冷却するための冷却システム - Google Patents

電子コンポーネントを液浸冷却するための冷却システム

Info

Publication number
JP2025524883A
JP2025524883A JP2025503095A JP2025503095A JP2025524883A JP 2025524883 A JP2025524883 A JP 2025524883A JP 2025503095 A JP2025503095 A JP 2025503095A JP 2025503095 A JP2025503095 A JP 2025503095A JP 2025524883 A JP2025524883 A JP 2025524883A
Authority
JP
Japan
Prior art keywords
condenser unit
heat transfer
cooling system
transfer fluid
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025503095A
Other languages
English (en)
Japanese (ja)
Other versions
JP2025524883A5 (cg-RX-API-DMAC10.html
Inventor
ゴッターバルム，アヒム
ガイブラー，ハラルド
フェッツァー，ギュンター
オブスト，ヴェレナ
ロイター，アレクサンダー
レッシュ，ヘリベルト
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wieland Werke AG
Original Assignee
Wieland Werke AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wieland Werke AG filed Critical Wieland Werke AG
Publication of JP2025524883A publication Critical patent/JP2025524883A/ja
Publication of JP2025524883A5 publication Critical patent/JP2025524883A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2025503095A 2022-07-25 2023-06-30 電子コンポーネントを液浸冷却するための冷却システム Pending JP2025524883A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102022002696.1 2022-07-25
DE102022002696.1A DE102022002696B3 (de) 2022-07-25 2022-07-25 Kühlsystem zur Flüssigkeitsimmersionskühlung von elektronischen Bauteilen
PCT/EP2023/000042 WO2024022606A1 (de) 2022-07-25 2023-06-30 Kühlsystem zur flüssigkeitsimmersionskühlung von elektronischen bauteilen

Publications (2)

Publication Number Publication Date
JP2025524883A true JP2025524883A (ja) 2025-08-01
JP2025524883A5 JP2025524883A5 (cg-RX-API-DMAC10.html) 2026-04-13

Family

ID=85476964

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025503095A Pending JP2025524883A (ja) 2022-07-25 2023-06-30 電子コンポーネントを液浸冷却するための冷却システム

Country Status (10)

Country Link
US (1) US20260107416A1 (cg-RX-API-DMAC10.html)
EP (1) EP4562980A1 (cg-RX-API-DMAC10.html)
JP (1) JP2025524883A (cg-RX-API-DMAC10.html)
KR (1) KR20250042706A (cg-RX-API-DMAC10.html)
CN (1) CN119318213A (cg-RX-API-DMAC10.html)
CA (1) CA3258202A1 (cg-RX-API-DMAC10.html)
DE (1) DE102022002696B3 (cg-RX-API-DMAC10.html)
MX (1) MX2024015423A (cg-RX-API-DMAC10.html)
TW (1) TW202423231A (cg-RX-API-DMAC10.html)
WO (1) WO2024022606A1 (cg-RX-API-DMAC10.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12363862B2 (en) * 2022-09-06 2025-07-15 Delta Electronics, Inc. Two-phase immersion cooling system, working fluid recovery device and method
WO2024237947A1 (en) * 2023-05-16 2024-11-21 MTS IP Holdings Ltd Bellows for immersion cooling
DE102023002672B3 (de) 2023-06-30 2024-08-29 Wieland-Werke Aktiengesellschaft Kühlsystem zur Flüssigkeitsimmersionskühlung von elektronischen Bauteilen
CN116723685B (zh) * 2023-08-08 2023-11-03 苏州浪潮智能科技有限公司 液冷散热系统
US20260020183A1 (en) * 2024-07-09 2026-01-15 Quanta Computer Inc. Immersion cooling system

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10512192B2 (en) 2015-08-28 2019-12-17 Mark Miyoshi Immersion cooling system with low fluid loss
GB2549946A (en) 2016-05-03 2017-11-08 Bitfury Group Ltd Immersion cooling
US11102912B2 (en) 2018-09-19 2021-08-24 TMGCore, LLC Liquid immersion cooling platform
US11076508B2 (en) 2019-11-14 2021-07-27 Baidu Usa Llc Cooling systems for immersion cooled IT equipment
US11076505B2 (en) * 2019-12-13 2021-07-27 Baidu Usa Llc Cooling system for edge computing device
JP7421176B2 (ja) 2020-01-07 2024-01-24 大成建設株式会社 液浸冷却システム
US10966349B1 (en) 2020-07-27 2021-03-30 Bitfury Ip B.V. Two-phase immersion cooling apparatus with active vapor management
US20210410320A1 (en) * 2021-09-13 2021-12-30 Intel Corporation Immersion cooling system with coolant boiling point reduction for increased cooling capacity

Also Published As

Publication number Publication date
DE102022002696B3 (de) 2023-03-30
KR20250042706A (ko) 2025-03-27
MX2024015423A (es) 2025-02-10
US20260107416A1 (en) 2026-04-16
EP4562980A1 (de) 2025-06-04
TW202423231A (zh) 2024-06-01
CA3258202A1 (en) 2025-04-08
CN119318213A (zh) 2025-01-14
WO2024022606A1 (de) 2024-02-01

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Effective date: 20260402

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