JP2024511313A - Tools for changing the support surface - Google Patents

Abstract

A device and method for modifying a substrate support element of a substrate holder is disclosed. According to some embodiments, a device is disclosed, the device comprising: a substrate holder having a plurality of support elements protruding from a first side of the substrate holder; a support structure configured to laterally hold the substrate holder on two sides, and a cleaning tool having a spherical body. The device also includes a processor. The processor aligns the predetermined region of interest of the substrate holder with the predetermined location of the cleaning tool, manipulates movement of the support structure to produce contact between the predetermined region of interest and the predetermined location by alignment, and the predetermined location. start a cleaning operation for the region of interest.
[Selection diagram] Figure 2C

Description

(Cross reference to related applications)
[0001] This application claims priority to U.S. Provisional Patent Application No. 63/165,327, filed on March 24, 2021. This application is incorporated herein by reference in its entirety.

[0002] The present disclosure relates to a tool for modifying a holder, a method for modifying a holder using the tool, and a lithographic apparatus comprising the tool.

[0003] A lithographic apparatus is a machine that applies a desired pattern onto a substrate, usually onto a target portion of the substrate. A lithographic apparatus can be used, for example, in the manufacture of integrated circuits (ICs). In such cases, patterning devices, also referred to as masks or reticles, may alternatively be used to generate the circuit patterns to be formed on the individual layers of the IC. This pattern can be transferred onto a target portion (eg comprising part of one or several dies) on a substrate (eg a silicon wafer). Transfer of the pattern is typically accomplished by imaging onto a layer of radiation-sensitive material (resist) provided on the substrate. Typically, a single substrate will contain a network of adjacent target portions that are sequentially patterned. Conventional lithographic apparatus use a so-called stepper, in which each target area is irradiated by exposing the entire pattern onto the target area in one go, and a substrate synchronously parallel or antiparallel to a given direction (the "scan" direction). a so-called scanner, in which each target portion is irradiated by scanning the pattern with a beam of radiation in a given direction (the "scan" direction) while scanning the pattern. It is also possible to transfer a pattern from a patterning device to a substrate by imprinting the pattern onto the substrate.

[0004] There is a constant need to manufacture devices, such as integrated circuits, with ever smaller features. Although integrated circuits and other microscale devices are often manufactured using optical lithography, other manufacturing techniques are also known, such as imprint lithography, electron beam lithography, and nanoscale self-assembly.

[0005] During manufacturing, devices are subjected to irradiation. It is important to ensure that the irradiation process is as accurate as possible. One of the challenges with making the irradiation process as accurate as possible is ensuring that the device receiving the irradiation is in the correct position. A substrate holder can be used to control the position of the device. Generally, the substrate is supported by a substrate holder while being irradiated. When a substrate is positioned on a substrate holder, friction between the substrate and the substrate holder can prevent the substrate from lying flat on the surface of the substrate holder. To address this issue, the substrate holder can include support elements that minimize the contact area between the substrate and the substrate holder. Support elements on the surface of the substrate holder may otherwise be referred to as burls or protrusions. The support elements are generally spaced apart (eg, in a uniform array), of uniform height, and define an overall fairly flat support surface on which the substrate can be positioned. The support element reduces the contact area between the substrate holder and the substrate, thereby reducing friction and allowing the substrate to be moved to a flatter position on the substrate holder.

[0006] The support element generally extends substantially perpendicularly from the surface of the substrate holder. In operation, the back side of the substrate is supported on the support element at a small distance from the body surface of the substrate holder and in a position substantially perpendicular to the direction of propagation of the projection beam. Therefore, the upper part (ie the support surface) of the support element, rather than the body surface of the substrate holder, defines the effective support surface for the substrate.

[0007] There may still be room for improvement in known tools and methods to provide support elements with improved planarity. Additional or alternative methods and tools may be desirable to achieve the desired flatness differently. It is also advantageous to achieve this flatness while providing a desired level of roughness on the support element to provide some degree of friction between the support element and the substrate.

[0008] Due to cost of ownership, cost of goods, and/or quality of overlay, it would be desirable to provide improved height adjustment tools for use in lithographic apparatus, or at least an alternative thereof. Furthermore, it would be desirable to provide a method for using such an improved or alternative height adjustment tool, and a lithographic apparatus comprising such an improved or alternative height adjustment tool.

[0009] According to some embodiments, a device for modifying a substrate support element of a substrate holder is described. The device includes a substrate holder having a plurality of support elements projecting from a first side of the substrate holder. The device also includes a support structure configured to laterally hold the substrate holder on a second side of the substrate holder. The device also includes a cleaning tool and a processor having a spherical body. The processor aligns the predetermined region of interest of the substrate holder with the predetermined location of the cleaning tool, manipulates movement of the support structure to produce contact between the predetermined region of interest and the predetermined location by alignment, and the predetermined location. start a cleaning operation for the region of interest.

[0010] According to some embodiments, the predetermined region of interest includes one or more support elements and/or one support element having a support surface. According to some embodiments, the contact created between the predetermined region of interest and the predetermined location includes contact between the support surface and the predetermined location of the cleaning tool. According to some embodiments, the device includes a detector that measures a physical parameter of the support surface. Physical parameters include the degree of roughness of the support surface. Additionally, the physical parameters may include height deviation measurements of one or more support elements of the substrate holder. The height deviation measurement is the detected height deviation from a predetermined surface flatness of the substrate holder. According to some embodiments, the processor controls the cleaning operation to change the height of the support element in response to the detected height deviation of the support element.

[0011] According to some embodiments, the processor further controls the alignment to lower and tilt the support structure to align the predetermined region of interest with the predetermined location. According to some embodiments, the processor further operates based on the calculated correlation between the convexity measurements of the cleaning tool and the position of the support element that is subject to height or roughness modification. , to control the alignment execution. According to some embodiments, the processor can further select the predetermined position based on the calculated correlation and control the alignment operation to rotate the support structure about a horizontal axis. can do.

[0012] According to some embodiments, the cleaning tool can be made of quartz (SiO2), where the quartz is one of chromium nitride (CrN), chromium oxide (CrOx), or tantalum boride. It can be coated with.

[0013] According to some embodiments, a method for modifying a substrate support element of a substrate holder is disclosed. The method is performed by one or more processors to align a predetermined region of interest of a substrate holder with a predetermined location of a cleaning tool, the substrate holder protruding from a first side of the substrate holder. having a plurality of support elements, the cleaning tool having a spherical body, by aligning and manipulating the movement of the support structure to produce contact between a predetermined region of interest and a predetermined location by the alignment; The support structure includes laterally holding the substrate holder on a second side of the substrate holder, manipulating movement of the support structure, and initiating a cleaning operation of the predetermined region of interest.

[0014] According to some embodiments, a lithographic apparatus may be disclosed that includes a material removal device for modifying a substrate support element of a substrate holder. According to some embodiments, the device includes a substrate holder having a plurality of support elements projecting from a first side of the substrate holder. The device may also include a support structure configured to laterally hold the substrate holder on a second side of the substrate holder, and a cleaning tool having a spherical body. The device may also include a processor. The processor aligns the predetermined region of interest of the substrate holder with the predetermined location of the cleaning tool, manipulates movement of the support structure to produce contact between the predetermined region of interest and the predetermined location by alignment, and the predetermined location. start the cleaning operation for the region of interest.

[0015] Further features and advantages of the present disclosure, as well as the structure and operation of various embodiments of the invention, are described in detail below with reference to the accompanying drawings. Note that this disclosure is not limited to the particular embodiments described herein. Such embodiments are described herein by way of example only. Additional embodiments will readily occur to those skilled in the art based on the teachings contained herein.

[0016] Embodiments of the present disclosure will now be described, by way of example only, with reference to the accompanying schematic drawings, in which:

[0017] FIG. 1 depicts a lithographic apparatus. [0018] FIG. 2 shows a schematic diagram of a tool system according to some embodiments. [0018] FIG. 2 shows a schematic diagram of a tool system according to some embodiments. [0018] FIG. 2 shows a schematic diagram of a tool system according to some embodiments. [0019] FIG. 7 illustrates alignment operations in accordance with some embodiments. [0019] FIG. 7 illustrates alignment operations in accordance with some embodiments. [0019] FIG. 7 illustrates alignment operations in accordance with some embodiments. [0020] FIG. 2C shows a cross-sectional view of the tool of FIGS. 2A-2C used to modify a substrate holder. [0020] FIG. 2C shows a cross-sectional view of the tool of FIGS. 2A-2C used to modify a substrate holder. [0021] FIG. 7 illustrates a cleaning operation according to some embodiments. [0021] FIG. 7 illustrates a cleaning operation according to some embodiments. [0022] FIG. 4 illustrates a cleaning method according to some embodiments.

[0023] The drawings illustrate certain features included in some embodiments of the present disclosure. However, the drawings are not to scale. In the following description, examples of specific feature sizes and size ranges are described.

[0024] To avoid overlay errors when projecting the patterned radiation beam onto the substrate, it is desirable that the top surface of the substrate be flat. Irregularities on the support surface of the substrate support can result in an uneven top surface of the substrate. Therefore, it is desirable to avoid irregularities in the substrate support.

[0025] Irregularities in the support surface may be caused by differences in height of the materials that make up the support element itself. This is usually the case when a new substrate holder is manufactured. Wear and contamination can also cause irregularities. In known embodiments, the substrate support comprises a substrate table WT (otherwise referred to as a chuck), on which a substrate holder with support elements is supported. In an alternative embodiment, the substrate table WT and substrate holder may be integrated into a single unit. The irregularities may arise from differences in the height of the support element or from differences in the height of the backside of the substrate holder or substrate table WT. Therefore, these elements are carefully leveled. Nevertheless, it has been found that irregularities may occur when the substrate table WT and substrate holder (and any other elements) are assembled or installed. Similar problems can occur with support tables or holders for other articles that must be supported in a well-defined plane across the beam path, such as reflective or transmissive patterning devices.

[0026] US Patent Application Publication No. 2005/0061995A1, the contents of which are incorporated herein by reference in their entirety, provides a lithographic projection apparatus. The lithographic projection apparatus includes a detector for detecting height deviations of the support elements that affect the surface flatness of the article and a height deviation of the support element material of the individual support elements when a support table is operable in the apparatus. a height adjustment device configured to separately change the height of the support element; and a height adjustment device coupled between the detector and the height adjustment device configured to separately change the height of the support element; a controller (or control processor) arranged to control the height adjustment device to correspondingly adjust the height of the support element. It will be appreciated that the controller may be a central processing unit (CPU), a digital signal processor (DSP), or a device that includes circuitry capable of performing processing. A controller may implement a combination of hardware, software, firmware, and computer readable code that executes on the controller or on a readable medium. The controller and/or the computer-readable medium may be distributed over network-coupled computer systems so that the computer-readable code may be stored and executed in a distributed manner.

[0027] When the support table is in the operative position within the lithographic projection apparatus, the in situ height adjustment device changes the height of the material of which at least the upper part of the individual support element is made integrally. can be used for By "operable" is meant that the support holder can be moved from the operational position to the pattern projection position within the apparatus without any more destructive movement to the support table assembly than in normal use. "Integrated" means the materials used to manufacture the coating or other material layer on the support holder or support element, but does not mean incidental foreign matter such as contaminants. . By adjusting the height of the support elements of the assembled support holder in the lithographic apparatus in such operational positions, reliable local and global height adjustment can be achieved.

[0028] The detector may determine which support elements have a height deviation and the control unit may, for example, determine which support elements do not have an excessive height or have an excessive height below a threshold value. controlling the height adjustment device to remove a portion of the material of the selected support element having an excessive height but not from the element; Such a detector and height deviation adjustment tool are further described in FIG. 1 herein.

[0029] Figure 1 schematically depicts a lithographic apparatus 100 according to an embodiment of the present disclosure. The apparatus is constructed to support an illumination system (illuminator) IL configured to condition a radiation beam B (e.g. UV radiation or any other suitable radiation) and a patterning device (e.g. mask) MA. a patterning device support or support structure (e.g. a mask table) MT connected to a first positioning device PM configured to accurately position the patterning device according to certain parameters. The lithographic apparatus also includes a substrate table (for example a resist-coated wafer) connected to a second positioning device PW constructed to hold a substrate (e.g. a resist-coated wafer) and configured to precisely position the substrate according to certain parameters. (e.g. wafer table) WT or "substrate support". The substrate support may comprise a substrate table WT (otherwise referred to as a chuck) on which the substrate holder is supported. The substrate holder can be configured to support the substrate W. The lithographic apparatus comprises a projection system (e.g. a refractive projection lens) configured to project a pattern imparted to the radiation beam B by a patterning device MA onto a target portion C (e.g. comprising one or more dies) of a substrate W. System) The system further includes a PS.

[0030] The illumination system includes refractive, reflective, magnetic, electromagnetic, electrostatic, or other types of optical components or any of the following for directing, shaping, or controlling radiation. Various types of optical components may be included, such as combinations.

[0031] The patterning device support holds the patterning device MA in a manner that depends on the orientation of the patterning device MA, conditions such as the design of the lithographic apparatus, for example whether the patterning device MA is held in a vacuum environment. The patterning device support can use mechanical, vacuum, electrostatic, etc. clamping techniques to hold the patterning device. The patterning device support may be a frame or a table, for example, and may be fixed or movable as required. The patterning device support may ensure that the patterning device MA is in a desired position, for example with respect to the projection system PS. Any use of the terms "reticle" or "mask" herein may be considered synonymous with the more general term "patterning device."

[0032] The term "patterning device" as used herein refers to any device that may be used to impart a pattern to a cross-section of a beam of radiation, so as to produce a pattern in a target portion of a substrate. It should be interpreted broadly. It should be noted here that the pattern imparted to the radiation beam B may not correspond exactly to the desired pattern in the target portion of the substrate W, for example if the pattern includes phase-shifting features or so-called assist features. . Generally, the pattern imparted to the radiation beam B corresponds to a particular functional layer of a device being created in a target portion, such as an integrated circuit.

[0033] Patterning device MA may be transmissive or reflective. Examples of patterning devices MA include masks, programmable mirror arrays, and programmable LCD panels. Masks are well known in lithography and include mask types such as binary masks, alternating phase shift masks, attenuated phase shift masks, and even various hybrid mask types. It can be done. An example of a programmable mirror array uses a matrix arrangement of miniature mirrors, each of which can be individually tilted to reflect an incoming radiation beam in a different direction. The tilted mirror imparts a pattern to the radiation beam reflected by the mirror matrix.

[0034] As used herein, the term "projection system" may be used as appropriate depending on the exposure radiation used or other factors such as the use of immersion liquid or the use of a vacuum, e.g. refractive optical systems, reflective optical systems, etc. It should be broadly interpreted as covering any type of projection system, including a catadioptric system, a catadioptric optical system, a magneto-optical system, an electromagnetic optical system and an electrostatic optical system, or any combination thereof. Where the term "projection lens" is used herein, it may be considered synonymous with the more general term "projection system."

[0035] As shown herein, the apparatus is of a transmissive type (eg, uses a transmissive mask). Alternatively, the device may be of a reflective type (e.g. using a programmable mirror array of the type mentioned above, or using a reflective mask).

[0036] The lithographic apparatus may be of a type having two (dual stage) or more substrate tables or "substrate supports" (and/or two or more mask tables or "mask supports"). In such "multi-stage" machines, additional tables or supports are used in parallel, or one or more tables or supports are used for exposure while one or more other tables or supports are used for exposure. Preliminary steps can be performed.

[0037] The lithographic apparatus may be of a type that allows at least part of the substrate W to be covered with a liquid having a relatively high refractive index, such as water, so as to fill the space between the projection system PS and the substrate W. The immersion liquid can also be applied to other spaces of the lithographic apparatus, for example between the patterning device (eg mask) MA and the projection system PS. Immersion techniques can be used in the art to increase the numerical aperture of projection systems. As used herein, the term "immersion" does not mean that structures such as the substrate must be submerged in liquid, but rather that there is liquid between the projection system PS and the substrate W during exposure. It is.

[0038] Referring to FIG. 1, the illuminator IL receives a radiation beam B from a radiation source SO. The source and the lithographic apparatus may be separate components, for example when the source is an excimer laser. In such a case, the radiation source is not considered to form part of the lithographic apparatus, and the radiation beam B is e.g. Passed to Illuminator IL. In other cases the source may be an integral part of the lithographic apparatus, for example when the source is a mercury lamp. The radiation source SO and the illuminator IL can optionally be referred to as a radiation system together with the beam delivery system BD.

[0039] The illuminator IL may include an adjuster AD configured to adjust the angular intensity distribution of the radiation beam. Typically, the outer and/or inner radial extent (commonly referred to as the s-outer and s-inner, respectively) of the intensity distribution in the pupil plane of the illuminator can be adjusted. The illuminator IL may also include various other components such as an integrator IN and a capacitor CO. An illuminator may be used to adjust the radiation beam to obtain the desired uniformity and intensity distribution across its cross section.

[0040] The radiation beam B is incident on a patterning device (eg mask) MA held on a mask support structure (eg mask table) MT and is patterned by the patterning device. The radiation beam B that has traversed the patterning device (eg mask) MA passes through a projection system PS which focuses the beam onto a target portion C of the substrate W. With the aid of a second positioning device PW and a position sensor IF (e.g. an interferometric device, a linear encoder or a capacitive sensor), the substrate table WT is configured to, for example, position the various target portions C in the path of the radiation beam B. Can move accurately. Similarly, a first positioner PM and another position sensor (not explicitly shown in Figure 1) are used to pattern the path of the radiation beam B, such as after mechanical retrieval from the mask library or during scanning. The device (eg mask) MA can be accurately positioned. In general, movement of the patterning device support (eg mask table) MT can be realized with the aid of a long-stroke module (coarse positioning) and a short-stroke module (fine positioning), which form part of the first positioning device PM. Similarly, movement of the substrate table WT or "substrate support" can be achieved with the aid of a long-stroke module and a short-stroke module forming part of the second positioner PW. In the case of a stepper (as opposed to a scanner), the patterning device support (eg mask table) MT may be connected to a short-stroke actuator only, or may be fixed. Patterning device (eg mask) MA and substrate W may be aligned using patterning device alignment marks Ml, M2 and substrate alignment marks PI, P2. Although the substrate alignment marks as illustrated occupy dedicated target portions, they may also be located in spaces between target portions (these are known as scribe lane alignment marks). Similarly, in situations where multiple dies are provided on a patterning device (eg mask) MA, the alignment marks of the patterning device may be located between the dies.

[0041] The illustrated lithographic apparatus can be used in at least one of the following modes.

[0042] 1. In step mode, the patterning device support (e.g. mask table) MT or "mask support" and the substrate table WT or "substrate support" are kept essentially stationary, while the entire pattern imparted to the radiation beam B is It is projected onto the target portion C in one go (ie, a single static exposure). The substrate table WT or "substrate support" is then moved in the X and/or Y direction so that another target portion C can be exposed. In step mode, the maximum size of the exposure field limits the size of the target portion C that can be imaged in a single static exposure.

[0043] 2. In scan mode, the patterning device support (e.g. mask table) MT or "mask support" and the substrate table WT or "substrate support" are scanned synchronously while the pattern imparted to the radiation beam B is projected onto the target portion C. (i.e. single dynamic exposure). The speed and direction of the substrate table WT or "substrate support" relative to the patterning device support (eg mask table) MT or "mask support" may be determined by the (de)magnification and image reversal characteristics of the projection system PS. In scan mode, the maximum size of the exposure field limits the width (in the non-scan direction) of the target portion in a single dynamic exposure, and the length of the scan operation determines the height (in the scan direction) of the target portion.

[0044] 3. In another mode, the patterning device (e.g. mask table) MT or "mask support" is kept essentially stationary holding the programmable patterning device, while the substrate table WT or "substrate support" is moved or scanned. A pattern imparted to the radiation beam is projected onto a target portion C. In this mode, a pulsed radiation source is generally used to update the programmable patterning device as needed each time the substrate table WT or "substrate support" is moved, or between successive radiation pulses during a scan. This mode of operation is readily available for maskless lithography using programmable patterning devices, such as programmable mirror arrays of the type mentioned above.

[0045] Combinations and/or variations of the above-described modes of use or entirely different modes of use may also be utilized.

[0046] As shown in Figure 1, the lithographic apparatus includes an in-situ material removing device (MRD) configured to remove material from one or more support elements of a substrate holder of the lithographic apparatus. can include. The MRD is configured to remove material from one or more support elements of the substrate holder in order to more uniformly support the substrate W supported on the substrate holder. The MRD can be placed in a substantially stationary position and includes a material removal tool MRT. The MRT is contacted with the one or more support elements to remove material from the one or more support elements. According to some examples, the MRT can be placed in a substantially stationary position, and one or more support elements may be moved relative to the MRT to remove material from the one or more support elements. (for example, in a circular motion). According to some examples, the MRT can be movable relative to the support element to move the MRT in a motion (eg, in a circular motion) relative to the support element. Aspects of material removal operations in accordance with the present disclosure will be further described with reference to FIGS. 2-6 below.

[0047] The lithographic apparatus may further include a detector HDD configured to detect height deviations of the support element that affect the surface flatness of the substrate W supported on the substrate holder. The detector HDD may be, for example, a level sensor configured to measure the top surface of the substrate W supported on the substrate holder. Such level sensors are disclosed, for example, in US Pat. No. 5,191,200, which is hereby incorporated by reference in its entirety. The detector HDD can be used to measure the top surface of a large number of substrates and determine which errors in the surface are caused by the substrate itself and which errors are caused by the substrate support or support element. According to some embodiments, the detector HDD may be a combination of one or more components including, for example, a photodetector and/or a reticle with alignment marks, a light source, and one or more WS TIS sensors. good.

[0048] The detector HDD may be connected to a controller MRC coupled between the detector HDD and the MRD. The controller may be configured to control the MRD to adjust the height of the support element in response to detected height deviations of the protrusions 4 that affect the surface flatness of the substrate. The controller MRC may be a separate controller adapted to generate a planar surface by removing material of the support element of the substrate holder, or may be configured to perform multiple control tasks within the lithographic apparatus. can be integrated into the controller.

[0049] Further details regarding the general operation of MRDs are disclosed in US Patent Application Publication No. 2005/0061995A1, which is incorporated herein by reference in its entirety.

[0050] According to some embodiments, removal of material from one or more support elements can be performed by relative movement between the material removal tool MRT and the one or more support elements. This relative movement may be performed by translating the one or more support elements relative to the material removal tool MRT and/or by translating the material removal tool MRT relative to the one or more support elements. The material removal tool MRT can be rotated to enhance material removal of the support element. According to some examples, moving the material removal tool MRT vertically and rotating about an axis to target specific support elements one at a time, as further described herein. can be done.

[0051] FIGS. 2A-2C illustrate an MRT system 200 that may be used to modify a substrate holder (eg, a clamp) to improve the flatness of a support element (eg, a burl) of the substrate holder (eg, a clamp). MRT system 200 may correspond to the material removal tool MRT described above. MRT system 200 may otherwise be referred to as a height adjustment tool. MRT system 200 may include components that can be manufactured into various shapes that are optimal for reaching each support element individually. According to one embodiment, MRT system 200 may include a cleaning tool manufactured with a spherical surface. As described further herein, the spherical surface of the cleaning tool allows the system to contact support elements of the substrate holder one at a time. This makes it possible to target and customize the cleaning operation.

[0052] According to one embodiment, an MRT system 200 is provided that includes a tool for changing a substrate holder. This tool can be used more specifically to modify the substrate support elements of the substrate holder. The support element may in other cases be referred to as a burl. An example MRT system 200 is shown in FIGS. 2A to 2C. As shown in FIGS. 2A-2C, the MRT system 200 can include a substrate holder 204 having a support element 206. The substrate holder 204 is fixed by the support element 202 and its movement can be controlled by the support element 202. Although the embodiments described in FIGS. 2A-2C show the support element 202 supporting the substrate holder 204, it will be appreciated that the support element 202 can be configured to support different components within the MRT system 200. . In one such embodiment, support element 202 can be configured to support cleaning tool 208. This may be a situation where the relative movement between the cleaning tool and the substrate holder is driven by the movement of the tool rather than the movement of the substrate holder (as shown in Figures 2A to 2C).

[0053] The support element 202 can control movement of the substrate holder 204 in the X-axis direction (lateral movement), the Y-axis (vertical movement), and the Z-axis (rotation about the axis). can. In this manner, support element 202 can move substrate holder 204 to a position where the surface of cleaning tool 208 is aligned with a particular support element 206 in preparation for a cleaning operation. This may include movements of movement, tilting, and lowering, as discussed further herein.

[0054] According to some embodiments, FIGS. 2B and 2C show that the surface of the cleaning tool 208 contacts the substrate holder 204 at different support element locations (different burls). The surface of the cleaning tool 208 shown in FIGS. 2A-2C can be convex, and the substrate holder can be moved to contact specific points of the convex surface of the tool 1, as further described herein. It can be lowered (as shown in FIG. 2B) and/or rotated to various angles (as shown in FIG. 2C).

[0055] FIGS. 2A-2C illustrate an example of a substrate holder 204 having a support element 206. FIG. A cleaning tool 208 can be used to modify the support element 206 of the substrate holder 204. In other words, the cleaning tool 2081 can be used to remove material from the support element 206. This allows the overall height of the at least one support element 206a to be varied and/or the roughness of the at least one support element 206a to be varied. Support element 206 can have a support surface. The support surface can be used to contact the underside of the substrate W. Ideally, as mentioned above, the support surface provides a flat surface on which the substrate W can be supported. Thereby, the substrate W becomes relatively flat when irradiating, and errors can be reduced.

[0056] As described herein, cleaning tool 208 may be part of an MRD and/or material removal tool MRT. Cleaning tool 208 can be secured by base 210, removable for servicing/cleaning, and placed in position within base 210.

[0057] Substrate holder 204 may be part of a substrate support configured to support substrate W during projection of an image onto substrate W. A substrate holder 204 may be provided on the substrate table WT. The substrate holder 204 may be held on the substrate table WT using, for example, a vacuum system (not shown). Similarly, during cleaning operations, substrate holder 204 can be held on support element 202 using a vacuum system (not shown).

[0058] The configuration of the plurality of support elements 206 is designed to improve the support of the substrate W supported thereon. 2A to 2C show a portion of the substrate holder 204 in cross section, so that some support elements 206 are in the plane of the cross section and some support elements 206 are behind this plane.

[0059] As noted, substrate holder 204 may not provide a flat support surface for substrate W for a number of reasons. Over time, substrate holder 204 may deteriorate as support element 206 wears down due to interaction with various substrates. Wear of the support element 206 leads to variations in the height of the support element in the substrate holder 204.

[0060] The friction between the substrate W and the substrate holder 204 contributes to the shape of the substrate W positioned on the substrate holder 204. This friction changes over time due to contamination of the support element 206 and smoothing due to wear. This may result in variations in the roughness and height of the support elements 206 over the life of the substrate holder 204. Current correction methods (alignment, APC, base liner) do not always limit their impact on overlay errors that can reduce the yield of patterned substrates. Since the friction changes as the support element 208 wears down, the contact area between the substrate W and the substrate holder 204 may increase.

[0061] According to some embodiments, the larger the contact area, the greater the van der Waals forces generated, causing the substrate W to "stick" onto the substrate holder 204. Reducing the degree of roughness on the support surface of support element 206 reduces the total contact area and may help reduce or avoid such adhesion.

[0062] Generally, the support surface of the support element 206 used to contact the underside of the substrate W has a desired level of roughness. If the roughness of the support surface is too low, this can increase friction of the substrate holder and lead to adhesion and overlay errors. It is therefore advantageous to reduce friction by increasing the roughness of the support surface of the support element. Therefore, it is desirable to maintain roughness at a desired level.

[0063] The roughness of the support surface is generally on the nanometer scale. In other words, the support surface of the support element 208 generally has a structure on the order of a few nanometers or tens of nanometers. For example, the substrate table WT may have a contact roughness of at least 12nm. Atomic force microscopy (AFM) can be used to characterize contact roughness.

[0064] Additionally or alternatively, roughness can be measured using a white light interferometer. White measurements may generally match atomic force microscopy (AFM) measurements. When the contact roughness is less than about 12 nm, van der Waals bonding generally increases contact pressure, effectively increasing friction.

[0065] According to some embodiments, when the substrate W is positioned on the substrate holder 204, it rests on the peak structure of each support surface of the support element 208. Although not shown, it will be appreciated that in these situations, the substrate holder 204 can be positioned such that the support element 206 faces upwardly to receive and support the substrate W. Accordingly, the overall flatness of the substrate holder 204 can be improved by reducing the peak roughness of the support surface, which may have a higher peak than other support surfaces.

[0066] The roughness of the support surface can be determined by checking whether the contact pad is in contact with the support element. The amount of surface area of a contact pad that contacts the support surface of one support element (eg, 206a) can be indicative of the roughness of that support element 206.

[0067] According to some embodiments, the substrate holder 204 is modified to remove material using a cleaning tool 208. This may otherwise be referred to as polishing. The material and roughness of the cleaning tool 208 can be selected (or formed) such that the roughness and adhesion of the resulting substrate W on the substrate holder 204 is maintained at a desired level. Cleaning tool 208 may be used regularly, even daily, to reduce or avoid system drift. Ideally, the roughness of the cleaning tool 208 allows for improved support surface flatness, desired roughness, and van der Waals forces.

[0068] According to some embodiments, cleaning tool 208 can contact support element 206 and move its position relative to support element 206. In accordance with some embodiments presented herein, the relative movement is generated by manipulating the positioning of the substrate holder 204 relative to the cleaning tool 208, for example as shown in FIGS. 2A-2C. be able to. It will be appreciated that, depending on the setup of the lithographic apparatus, in some configurations the relative movement created by manipulating the position of the cleaning tool 208 relative to the substrate holder 204 can be exploited. According to one embodiment, the cleaning tool 208 can be used to scratch the support surface of the support element 206 to change the roughness of the support surface and influence the friction between the support surface and the substrate W. Additionally or alternatively, a cleaning tool 208 may be used to abrade at least one of the support surfaces in order to flatten the entire support surface provided by these support surfaces. The cleaning tool 208 can be used to make the substrate table WT flatter while simultaneously achieving a desired level of roughness. It may be advantageous to use the cleaning tool 208 to improve flatness without affecting roughness (which may be at a suitable level). Alternatively, it may be advantageous to use tool 208 to increase roughness without affecting flatness (which may be at a suitable level). Modifying the support surface may generally mean changing the flatness and/or roughness of the support surface.

[0069] A number of tools can be used. For example, a first tool can be used to improve the overall flatness of the substrate holder 204 without unduly affecting the roughness, and a second tool can be used to improve the overall flatness of the substrate holder 204 without unduly affecting the roughness. A suitable roughness can be created without affecting the roughness (or vice versa). For example, the first tool and the second tool may have different configurations (i.e. protrusions arranged in different configurations) that are better suited to influencing the flatness and/or roughness of the substrate table WT. .

[0070] The design of the cleaning tool 208 can vary how the cleaning tool 208 affects the roughness and flatness of the substrate holder 204 (eg, table WT). Thus, for example, the composition and convex shape of cleaning tool 208 can change the tool's effectiveness on cleaning operations. The desired radius of the convex surface of the cleaning tool depends on the flatness of the substrate holder, the distance between the support elements 206, the desired area of contact between the convex surface and the support elements, and the range of angular movement of the support 202. Increasing the radius (ie decreasing the curvature) of this surface increases the contact area.

[0071] According to some embodiments, cleaning tool 208 may have a uniform outer surface. Alternatively, the cleaning tool 208 can have different patches around its surface with different levels of roughness to produce different impact results when in contact with the substrate holder 204. For example, some patches may have a high degree of roughness on the cleaning tool with a high special frequency (eg, several grooves per support element). This provides the ability to collect debris generated by resurfacing operations.

[0072] During wear and modification of the substrate support element 206, debris can be generated. Debris generally refers to any contaminant, but specifically refers to material removed from substrate support element 206 and from cleaning tool 208 itself. Debris can affect the roughness and overall flatness of the substrate holder 204.

[0073] According to some embodiments, because various locations within the cleaning tool 208 and the support element 206 come into contact, there is a possibility that debris may accumulate at one particular location, resulting in degraded performance of the cleaning tool 208. It can be promoted to reduce the Additionally, the cleaning tool 208 can have protrusions in place to create a debris reservoir within the cleaning tool 208 (eg, allowing debris to accumulate within the gaps between the protrusions). Therefore, debris is less likely to remain on the support surface of the substrate support element 206. This reduces or prevents contamination on the support surface.

[0074] The convex shape of cleaning tool 208 may provide several advantages. For example, the surface area of cleaning tool 208 in contact with substrate holder 204 can be controlled to average into smaller spatial frequencies over the overall flatness of substrate holder 204.

[0075] Additionally, the convex shape means that the area of the cleaning tool 208 that is in contact with the substrate holder 204 during use is reduced. This generates scratches and makes it possible to provide the desired level of roughness to the support surface and improve the "sticking" problem. The smaller contact area also provides the ability to perform targeted cleaning operations one support element at a time. This allows for more targeted cleaning actions to speed up the cleaning process. Targeted cleaning operations are further discussed below with reference to FIGS. 3-6.

[0076] Cleaning tool 208 can be made of a variety of materials. According to some embodiments, the hardness of the cleaning tool 208 is greater than or equal to the hardness of the support surface of the support element 206. Advantageously, if the hardness of the cleaning tool 208 is greater than the hardness of the support element 206, the interaction between the cleaning tool 208 and the support surface of the support element 206 causes wear of the substrate holder 204 rather than the cleaning tool 208. Advantageously, if the hardness of the cleaning tool 208 is similar to the hardness of the support surface, this can produce a high roughness of the support surface due to the interaction between the cleaning tool 208 and the support surface.

[0077] Preferably, cleaning tool 208 is made of a relatively hard and strong material. Cleaning tool 208 includes quartz (SiO2) and can be further coated with one of chromium nitride (CrN), chromium oxide (CrOx), or tantalum boride. Cleaning tool 208 can be formed from a single piece of material. Accordingly, cleaning tool 208 may be formed from one of these materials. Alternatively, cleaning tool 208 can be formed from a combination of materials including at least one of these materials. In particular, the material selected may be at least one of carbon-reinforced silicon carbide, silicon carbide, aluminum oxide, and/or diamond-like carbon. Additionally or alternatively, cleaning tool 208 may have a layer or coating formed of at least one of these materials.

[0078] The back side 8 of the cleaning tool 208 may be provided in various shapes so that the cleaning tool 208 is more easily and/or securely retained within the base 210. Cleaning tool 208 may be connected or connectable to a tool support (not shown) within base 210 or connectable to support element 202, depending on the configuration. As previously mentioned, the relative movement driven by the support element 202 can be provided by manipulating the movement of the substrate holder 204, as shown in FIGS. 2A-2C, or by manipulating the movement of the cleaning tool 208. It can be provided by The back side 8 of the cleaning tool 208 may include at least one recess that fits into the support 210.

[0079] In use, cleaning tool 208 may be preferably held substantially flat relative to substrate holder 204. In other words, it may be preferred to hold the body/base of the cleaning tool 208 substantially parallel to the surface of the substrate holder 204. However, varying the orientation of the cleaning tool 208 can more effectively wear down or flatten an uneven support surface. Additionally, the cleaning tool support 202 can be connected to allow for orientation variations.

[0080] Cleaning tool 208 may be part of a larger system that includes multiple tools. Multiple tools may have the same or different convex shapes based on the surface area to be cleaned and other parameters. Cleaning tool 208 may be used to clean the entire substrate holder 204. In other words, the cleaning tool 208 can be used to contact each support element 206 at least once.

[0081] The cleaning tool 208 described above can be used to provide a method. More specifically, the method may be for modifying the substrate support element 206 of the substrate holder 204. Substrate support element 206 may include a support surface for supporting substrate W. The method may include providing a cleaning tool 208 as described above. The method may further include contacting at least a portion of the support surface of the substrate holder 204 with a distal protrusion of the cleaning tool 208 and modifying the support surface using the cleaning tool 208.

[0082] The substrate holder 204 may be moved along the cleaning tool 208 to remove material from the top of the substrate support element 206 that the cleaning tool 208 is in contact with. Alternatively, the cleaning tool 208 can be moved relative to the substrate holder 204, for example while the substrate holder 204 remains stationary. For example, the MRD can be configured to move the cleaning tool 208 over the substrate support element 22 without moving the substrate holder 204, or vice versa. Alternatively, substrate holder 204 and cleaning tool 208 can be moved simultaneously. According to some embodiments, regardless of whether cleaning tool 208 or substrate holder 204 is moved, a degree of relative movement that achieves the desired cleaning result is desired.

[0083] The pressure in the z direction between the cleaning tool 208 and the substrate support element 206 used to obtain the polishing effect is applied by the substrate holder 204 or the cleaning tool 208 (i.e. more particularly the MRD) or both. be able to. Preferably, the use of support 202 (selectively supporting cleaning tool 208 or substrate holder 204) can be precisely controlled. This is because if the force applied by the cleaning tool 208 is too great, it can adversely affect the flatness of the substrate holder 204.

[0084] Cleaning tool 208 can be used in a wide variety of ways. For example, the cleaning tool 208 can be used to modify the entire substrate holder 204, ie, to process the entire substrate holder 204 at once. Alternatively, the cleaning tool 208 can be used to modify localized areas, or portions, of the entire substrate holder 204. The convex shape nature of cleaning tool 208 allows for strategic cleaning of localized areas. In some examples, the local area includes one or more support elements 206. In some examples, a local area may include one support element 206. The frequency of use of cleaning tool 208 may vary. For example, localized cleaning of specific portions of the substrate holder 208 may be performed several times a day, such as four to five times a day. Cleaning the entire larger substrate holder 204 may be performed less frequently, for example once a day or once a week. The frequency or type of modification can be determined, for example, based on measurements indicative of the flatness of the substrate W and/or substrate holder 204. The flatness of the substrate holder 204 is considered to be the flatness of the support elements 206 (and their respective support surfaces) on which the substrate W is positioned.

[0085] A lithographic apparatus may be provided comprising a cleaning tool 208 as described above. A lithographic apparatus incorporating cleaning system 200 may be configured to modify substrate support element 206 of substrate holder 202 using cleaning tool 208 . The lithographic apparatus may include a substrate holder 204 having a plurality of support elements 206 configured to support a substrate.

[0086] The lithographic apparatus comprising the cleaning tool 208 may be all or part of the lithographic apparatus described above with reference to FIG. The lithographic apparatus comprising the cleaning tool 208 may be at least part of a metrology device and/or an inspection device (electron beam). A lithographic apparatus with cleaning tool 208 can be used in conjunction with the lithographic apparatus described in FIG. A lithographic apparatus comprising a cleaning tool 208 may more generally be referred to as an apparatus configured to modify a substrate support element 206 of a substrate holder.

[0087] The lithographic apparatus comprising the cleaning tool 208 includes a detector configured to detect a height deviation of one or more of the support elements affecting the surface flatness of a substrate supported on the substrate holder. may further include. The detector may correspond to the aforementioned detector HDD. The cleaning tool 208 can be configured to change the height of one or more support elements in response to a detected height deviation of the support elements.

[0088] FIGS. 2B and 2C illustrate a lowering motion and a rotation motion, respectively, according to some embodiments. These operations are further described in connection with the remaining figures in subsequent portions of this specification.

[0089] FIGS. 3A-3C illustrate a lowering and rotation operation 300 according to some embodiments. FIG. 3A, for example, shows the descending portion of cleaning system 200. Specifically, the lower portion may include a support structure 302, a substrate holder 304, and a substrate support element 306. Elements 302, 304, 306, and 308 are described in detail in connection with FIGS. 2A-2C, and the illustrations of FIGS. 3A-3C illustrate the combination of cleaning tool 308 and elements 302, 304, and 306, particularly the substrate holder. 304) to indicate movement and alignment.

[0090] According to some embodiments, FIG. 3A illustrates the act of aligning a predetermined region of interest (e.g., region 314) of substrate holder 304 with a predetermined location (e.g., location 312) of cleaning tool 308. . Such alignment may be performed based on one or more measurements made by a detector, which may be configured to detect height deviations of the support element, as described further herein below. Can be done. Upon reading the detection, the detector may be configured to send a read signal to the controller to provide a measured parameter of the support element. In one example, the measured parameter may indicate a height deviation of the support element. A height deviation can be understood as a deviation from the average height of all support elements of the substrate holder 304 that are considered to produce a flat surface of the substrate holder 304 receiving the substrate. In other words, the deviation can be understood as the length of the support element that deviates from this average, making it impossible for the substrate holder to provide a flat surface. The detector can also detect the roughness level of the support surface of the support element 306. This allows the controller to determine whether additional cleaning is desired/necessary and/or whether debris removal is to be performed.

[0091] FIGS. 3B and 3C illustrate relative movement between the cleaning tool 308 and the combination of support element 302, substrate holder 304, and support element 306. According to some embodiments, upon detection of the second support element among the plurality of support elements 306, the controller may align the new region of interest 314 with the new position 316. It will be appreciated that the region of interest 314 may correspond to one or more support elements. For example, how cleaning tool 308 is aligned with the combination of elements 302, 304, and 306 may depend on the convex shape of cleaning tool 308 and the size of region of interest 314. According to some examples, the convex shape of cleaning tool 308 can be uniform throughout cleaning tool 308. According to another embodiment, when another support element is detected that may be a candidate for a removal operation, the controller aligns the new region of interest 314 (corresponding to one or more support elements) with the predetermined location 318. can do. It will be appreciated that the alignment operation may include a series of movements along the X, Y, and Z directions, including lateral, longitudinal, tilt, and rotational movements of the support element 302.

[0092] FIG. 4 depicts a cross-sectional view of an exemplary cleaning operation. For example, according to some embodiments, one or more support elements 406 are moved in close proximity to the cleaning tool to initiate a cleaning operation that takes advantage of the initial alignment between the support elements 404 and the cleaning tool 408. Support element 404 can be tilted. In a second step, support elements 402 may be lowered a sufficient distance to effect some level of contact between one or more support elements. According to some embodiments, the level of contact and contact pressure can be determined by the controller based on the type of cleaning being performed. For example, surface modification operations may require high levels of pressure to be applied to cleaning tool 408 by support element 402.

[0093] FIGS. 5A and 5B illustrate a cleaning operation according to an example embodiment. FIG. 5A shows a top view of a substrate holder having multiple support elements 506 within dimensions 520 and 530. FIG. 5B shows an enlarged view of the substrate holder. FIG. 5B illustrates an example targeted cleaning operation, according to some embodiments. In one example, targeted cleaning may be a cleaning operation of a small number of target support elements 506 that are determined to have undesirable physical parameters (eg, height deviation measurements, etc.). In another example, the cleaning operation can be performed in a series of raster scan movements over the entire substrate holder to perform targeted cleaning operations on individual support elements. According to some embodiments, the cleaning operation may include a circular motion within a predetermined radius performed by the MRT system 200 for a predetermined duration. For example, the predetermined duration may depend on factors such as the roughness of the support surface and/or the measured height deviation. In other words, the predetermined duration may depend on the time required to resurface/clean the support element (eg, support element 206a) to the desired height, flatness, and/or roughness level.

[0094] According to some embodiments, each targeted cleaning operation of the support element 506 includes an operation of tilting, moving, and aligning the support element to target the predetermined support element 506. may include. Once the support element is in contact with the surface of the cleaning tool, the support element can then be moved in a circle of small diameter to perform a predetermined cleaning operation of the support element. According to some embodiments, the cleaning operation may include a scrubbing operation. According to some embodiments, the small diameter can be a 1 mm diameter. According to some embodiments, the support element can be moved in a direction transverse to the cleaning tool to contact the next desired support element. Such movement may be to the right, left, upward, or downward, depending on the position of the support element and the type of scan being performed (e.g. raster scan pattern), as shown in FIG. 5B. It can be done. According to some embodiments, for a more appropriate cleaning operation, movement between support elements (e.g., from cleaning one support element to the next) is accomplished by a tilting movement of the substrate holder 202. It's okay.

[0095] FIG. 6 illustrates an example method 600 for modifying a substrate support element 206 of a substrate holder 204, according to some embodiments. Method 600 may include aligning a predetermined region of interest (eg, region 314) of a substrate holder with a predetermined location (eg, location 312) of a cleaning tool, as shown at step 602. Further, method 600 may include manipulating movement of a support structure (e.g., 302) to create contact between a predetermined region of interest and a predetermined location by alignment, as shown in step 604. . Additionally, method 600 may include initiating a cleaning operation for the predetermined region of interest, as shown at step 606.

[0096] It will be appreciated that method 600 may include additional modification steps based on the measurements and structural components involved. For example, according to some embodiments, a predetermined region of interest may include one or more support elements. According to some embodiments, the predetermined region of interest includes one support element having a support surface. In one example, the contact created between the predetermined region of interest and the predetermined location includes contact between the support surface and the predetermined location of the cleaning tool.

[0097] According to some embodiments, method 600 may further include measuring a physical parameter associated with the support surface using a detector. In one example, the physical parameter includes the degree of roughness of the support surface. Additionally, the physical parameters may include height deviation measurements of one or more support elements of the substrate holder. The height deviation measurement is the detected height deviation from a predetermined surface flatness of the substrate holder. The cleaning operation of method 600 may also include changing the height of the support element in response to the detected height deviation of the support element.

[0098] According to some embodiments, the alignment operations of method 600 may further include lowering and tilting operations of the support structure to align the predetermined region of interest with the predetermined location. The method 600 also includes calculating a correlation between a convex shape measurement of a cleaning tool and a position of a support element that is subject to height or roughness modification, and determining a predetermined region of interest based on the calculated correlation. and aligning the predetermined position with the predetermined position. According to some embodiments, such a correlation measurement allows the controller to take into account the position of the support element to be modified and determine which part of the cleaning tool is best to contact this support element. It can be determined whether

[0099] According to some embodiments, method 600 may further include selecting the predetermined location based on the calculated correlation. Alignment involves rotational movement of the support structure about a vertical axis (eg, the Y-axis). The cleaning tools used within method 600 can be constructed of materials including silicon-infiltrated silicon carbide, silicon carbide, aluminum oxide, or diamond-like carbon.

[0100] The above describes the use of a cleaning system to remove material from one or more substrate support elements 206 of support holder 204 to provide more uniform support to the substrate support. Similar cleaning systems are used in other article support systems such as patterning device supports. Accordingly, cleaning tool 208 may be used more generally to contact a support surface. For example, in one embodiment a lithographic apparatus is provided. In this embodiment, the lithographic apparatus is configured to modify the support element of the article holder.

[0101] The lithographic apparatus comprising the cleaning tool 208 may be all or part of the lithographic apparatus described above with reference to FIG. The lithographic apparatus comprising the cleaning tool 208 may be at least part of a metrology device and/or an inspection device (electron beam). A lithographic apparatus with cleaning tool 208 can be used in conjunction with the lithographic apparatus described in FIG. A lithographic apparatus comprising cleaning tool 208 may more generally be referred to as an apparatus configured to modify a support element of an article holder.

[0102] According to some embodiments, the lithographic apparatus comprising the cleaning tool 208 further comprises height deviations of one or more of the support elements that affect the surface flatness of the article supported on the article holder. can include a detector for detecting. The detector may correspond to the aforementioned detector HDD. The detector is similar to the detector HDD, but can be used to detect the surface flatness of the article rather than the substrate. The cleaning tool 208 can be configured to change the height of one or more support elements in response to a detected height deviation of the support elements.

[0103] The tool used in this embodiment to modify the article may have any or all of the variations described above, particularly for the cleaning tool 208 used to modify the substrate holder 204.

[0104] Providing a cleaning tool 208 according to an embodiment of the present disclosure within a lithographic apparatus provides a number of advantages over existing systems. The first advantage is that by using the cleaning tool 208 the substrate holder can be flattened within the lithographic apparatus, so that the substrate table/holder (or other support surface) can be cleaned with less flatness and therefore less cost. It may be installed within a lithographic apparatus. Moreover, wear of the substrate holder becomes less important since non-flatness due to wear can be compensated for. As a result, the restrictions used on the material of the wafer table/substrate holder 204 can be relaxed. Furthermore, use of the cleaning tool 208 improves the flatness of the support surface over time, allowing for improved overlay performance of the lithographic apparatus.

[0105] Embodiments can be further described using the following clauses.
1. A device for modifying a substrate support element of a substrate holder, the device comprising:
a substrate holder having a plurality of support elements projecting from a first side of the substrate holder;
a support structure configured to laterally hold the substrate holder on a second side of the substrate holder;
A cleaning tool having a spherical body;
A processor,
aligning a predetermined region of interest on the substrate holder with a predetermined location on the cleaning tool;
manipulating movement of the support structure to produce contact between the predetermined region of interest and the predetermined location by alignment;
initiating a cleaning operation for a predetermined region of interest;
a processor configured to:
A device with.
2. 2. The device of clause 1, wherein the predetermined region of interest includes one or more support elements.
3. 2. The device of clause 1, wherein the predetermined region of interest includes one support element having a support surface.
4. 4. The device of clause 3, wherein the contact created between the predetermined region of interest and the predetermined location comprises contact between a support surface and the predetermined location of the cleaning tool.
5. 5. The device of clause 4, further comprising a detector configured to measure a physical parameter of the support surface.
6. 6. The device of clause 5, wherein the physical parameter comprises the degree of roughness of the support surface.
7. The physical parameter includes a height deviation measurement of one or more support elements of the substrate holder, the height deviation measurement being a detected height deviation from a predetermined surface flatness of the substrate holder. 5. The device according to 5.
8. 8. The device of clause 7, wherein the processor is further configured to control the cleaning operation to change the height of the support element in response to the detected height deviation of the support element.
9. The device of clause 1, wherein the processor is further configured to control alignment to lower and tilt the support structure to align the predetermined region of interest with the predetermined location.
10. The processor is further configured to control the performance of the alignment based on the calculated correlation between the convexity measurements of the cleaning tool and the position of the support element that is subject to height or roughness modification. A device according to clause 9, which is
11. 11. The device of clause 10, wherein the processor is further configured to select the predetermined location based on the calculated correlation.
12. 10. The device of clause 9, wherein the processor is further configured to control the alignment operation to rotate the support structure about a horizontal axis.
13. The device of clause 1, wherein the cleaning tool is comprised of quartz (SiO2), and the quartz is coated with any one of chromium nitride (CrN), chromium oxide (CrOx), or tantalum boride.
14. A method for modifying a substrate support element of a substrate holder, the method comprising:
aligning a predetermined region of interest of the substrate holder with a predetermined location of a cleaning tool, the substrate holder having a plurality of support elements projecting from a first side of the substrate holder, the cleaning tool having a spherical body; having, aligning;
manipulating movement of the support structure to produce contact between the predetermined region of interest and the predetermined location by alignment, the support structure laterally holding the substrate holder on a second side of the substrate holder; , manipulating the movement of the support structure;
initiating a cleaning operation of a predetermined region of interest;
A method performed by a processor, including:
15. 15. The method of clause 14, wherein the predetermined region of interest includes one or more support elements.
16. 15. The method of clause 14, wherein the predetermined region of interest includes one support element having a support surface.
17. 17. The method of clause 16, wherein the contact created between the predetermined region of interest and the predetermined location comprises contact between a support surface and the predetermined location of the cleaning tool.
18. 18. The method of clause 17, further comprising measuring a physical parameter associated with the support surface using a detector.
19. 19. The method of clause 18, wherein the physical parameter includes the roughness of the support surface.
20. The physical parameter includes a height deviation measurement of one or more support elements of the substrate holder, the height deviation measurement being a detected height deviation from a predetermined surface flatness of the substrate holder. 18. The method described in 18.
21. 21. The method of clause 20, wherein the cleaning operation further comprises changing the height of the support element in response to the detected height deviation of the support element.
22. 15. The method of clause 14, wherein the alignment further includes lowering and tilting movements of the support structure to align the predetermined region of interest with the predetermined location.
23. calculating a correlation between a convexity measurement of the cleaning tool and the position of the support element that is subject to a height or roughness change;
aligning a predetermined region of interest with a predetermined location based on the calculated correlation;
The method according to clause 22, further comprising:
24. 24. The method of clause 23, further comprising selecting the predetermined location based on the calculated correlation.
25. 23. The method of clause 22, wherein the alignment further includes rotational movement of the support structure about a horizontal axis.
26. 15. The method of clause 14, wherein the cleaning tool is comprised of quartz (SiO2), and the quartz is coated with any one of chromium nitride (CrN), chromium oxide (CrOx), or tantalum boride.
27. A material removal device for modifying a substrate support element of a substrate holder, the device comprising:
a substrate holder having a plurality of support elements projecting from a first side of the substrate holder;
a support structure configured to laterally hold the substrate holder on a second side of the substrate holder;
A cleaning tool having a spherical body;
A processor,
aligning a predetermined region of interest on the substrate holder with a predetermined location on the cleaning tool;
manipulating movement of the support structure to produce contact between the predetermined region of interest and the predetermined location by alignment;
initiating a cleaning operation for a predetermined region of interest;
a processor configured to:
A lithographic apparatus comprising a material removal device comprising:

[0106] Although this text specifically refers to the use of lithographic apparatus in the manufacture of ICs, it should be understood that there are other uses for the lithographic apparatus described herein. For example, this is the manufacture of integrated optical systems, guidance and detection patterns for magnetic domain memories, flat panel displays, liquid crystal displays (LCDs), thin film magnetic heads, etc. In light of these alternative uses, any use of the terms "wafer" or "die" herein shall be considered synonymous with the more general terms "substrate" or "target portion," respectively. Those skilled in the art will recognize that this is advantageous. The substrates described herein may be processed before or after exposure, e.g. by a track (a tool that typically applies a layer of resist to the substrate and develops the exposed resist), metrology tools, and/or inspection tools. be able to. Where appropriate, the disclosure herein may be applied to these and other substrate processing tools. Additionally, a substrate can be processed multiple times, for example to produce a multilayer IC, and thus the term substrate as used herein can also refer to a substrate that already includes multiple processed layers.

[0107] Although particular reference has been made to the use of embodiments of the invention in the field of optical lithography, the invention may also be used in other fields depending on the context, such as imprint lithography, and is not limited to optical lithography. I want you to understand. In imprint lithography, topography within a patterning device defines the pattern created on a substrate. The topography of the patterning device is imprinted into a resist layer provided to the substrate, and the resist is cured by applying electromagnetic radiation, heat, pressure, or a combination thereof. The patterning device is removed from the resist, leaving a pattern inside as the resist hardens.

[0108] As used herein, the terms "radiation" and "beam" refer to particle beams, such as ion beams or electron beams, as well as ultraviolet (UV) radiation (e.g., 365 nm, 248 nm, 193 nm, 157 nm or 126 nm). It covers all types of electromagnetic radiation, including extreme ultraviolet (EUV) radiation (eg, having wavelengths in the range of 5 nm to 20 nm).

[0109] The term "lens" can refer to any one or combination of various types of optical components, including refractive, reflective, magnetic, electromagnetic, and electrostatic optical components, where the context permits.

[0110] While particular embodiments of the disclosure have been described above, it will be understood that the disclosure may be practiced otherwise than as described. The above description is intended to be illustrative, not limiting. It will therefore be apparent to those skilled in the art that modifications may be made to the disclosed disclosure without departing from the scope of the claims set forth below.

[0111] The above description is intended to be illustrative, not limiting. It will therefore be apparent to those skilled in the art that modifications may be made to the disclosed disclosure without departing from the scope of the claims set forth below.

Claims (15)

A device for modifying a substrate support element of a substrate holder, the device comprising:
a substrate holder having a plurality of support elements projecting from a first side of the substrate holder;
a support structure configured to hold the substrate holder laterally on a second side of the substrate holder;
A cleaning tool having a spherical body;
A processor,
aligning a predetermined region of interest of the substrate holder with a predetermined location of the cleaning tool;
manipulating movement of the support structure so that the alignment produces contact between the predetermined region of interest and the predetermined location;
starting a cleaning operation of the predetermined region of interest;
a processor configured to:
A device with. 2. The device of claim 1, wherein the predetermined region of interest includes one or more support elements. the predetermined region of interest includes one support element having a support surface;
the contact created between the predetermined region of interest and the predetermined location includes contact between the support surface and the predetermined location of the cleaning tool;
The device further comprises a detector configured to measure a physical parameter of the support surface;
The physical parameter includes the degree of roughness of the support surface,
The physical parameter includes a height deviation measurement of one or more support elements of the substrate holder, the height deviation measurement being a detected height deviation of the substrate holder from a predetermined surface flatness. 2. The device of claim 1. 4. The device of claim 3, wherein the processor is further configured to control the cleaning operation to change the height of the support element in response to the detected height deviation of the support element. . 2. The device of claim 1, wherein the processor is further configured to control the alignment to lower and tilt the support structure to align the predetermined region of interest with the predetermined location. The processor further includes:
controlling the performance of the alignment based on a calculated correlation between a convex shape measurement of the cleaning tool and a position of the support element that is subject to a height or roughness change;
selecting the predetermined position based on the calculated correlation;
6. The device of claim 5, configured to. 6. The device of claim 5, wherein the processor is further configured to control the alignment operation to rotate the support structure about a horizontal axis. 2. The cleaning tool of claim 1, wherein the cleaning tool is comprised of quartz (SiO2), and the quartz is coated with one of chromium nitride (CrN), chromium oxide (CrOx), or tantalum boride. device. A method for modifying a substrate support element of a substrate holder, the method comprising:
aligning a predetermined region of interest of a substrate holder with a predetermined location of a cleaning tool, the substrate holder having a plurality of support elements projecting from a first side of the substrate holder; has a spherical body and is aligned;
manipulating movement of a support structure such that the alignment produces contact between the predetermined region of interest and the predetermined location, the support structure laterally on a second side of the substrate holder; manipulating movement of a support structure holding the substrate holder;
Initiating a cleaning operation of the predetermined region of interest;
A method performed by a processor, including: 10. The method of claim 9, wherein the predetermined region of interest includes one or more support elements. the predetermined region of interest includes one support element having a support surface;
the contact created between the predetermined region of interest and the predetermined location includes contact between the support surface and the predetermined location of the cleaning tool;
The method further includes measuring a physical parameter associated with the support surface using a detector;
The physical parameter includes the degree of roughness of the support surface,
The physical parameter includes a height deviation measurement of one or more support elements of the substrate holder, the height deviation measurement being a detected height deviation of the substrate holder from a predetermined surface flatness. The method according to claim 9. 12. The method of claim 11, wherein the cleaning operation further comprises changing the height of the support element in response to the detected height deviation of the support element. The alignment further includes lowering and tilting the support structure to align the predetermined region of interest with the predetermined location, and the method further includes:
calculating a correlation between a convex shape measurement of the cleaning tool and a position of the support element that is subject to a height or roughness change;
aligning the predetermined region of interest with the predetermined position based on the calculated correlation;
selecting the predetermined position based on the calculated correlation, and wherein the alignment further includes rotational movement of the support structure about a horizontal axis. . 10. The cleaning tool of claim 9, wherein the cleaning tool is composed of quartz (SiO2), and the quartz is coated with one of chromium nitride (CrN), chromium oxide (CrOx), or tantalum boride. Method. A material removal device for modifying a substrate support element of a substrate holder, the device comprising:
a substrate holder having a plurality of support elements projecting from a first side of the substrate holder;
a support structure configured to hold the substrate holder laterally on a second side of the substrate holder;
A cleaning tool having a spherical body;
A processor,
aligning a predetermined region of interest of the substrate holder with a predetermined location of the cleaning tool;
manipulating movement of the support structure so that the alignment produces contact between the predetermined region of interest and the predetermined location;
starting a cleaning operation of the predetermined region of interest;
a processor configured to:
A lithographic apparatus comprising a material removal device comprising:

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