JP2024124069A - 電子装置の製造方法 - Google Patents

電子装置の製造方法 Download PDF

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Publication number
JP2024124069A
JP2024124069A JP2023031986A JP2023031986A JP2024124069A JP 2024124069 A JP2024124069 A JP 2024124069A JP 2023031986 A JP2023031986 A JP 2023031986A JP 2023031986 A JP2023031986 A JP 2023031986A JP 2024124069 A JP2024124069 A JP 2024124069A
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Japan
Prior art keywords
adhesive
electronic device
manufacturing
adhesive resin
resin layer
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Pending
Application number
JP2023031986A
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English (en)
Japanese (ja)
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JP2024124069A5 (https=
Inventor
惇史 尾▲崎▼
Atsushi Ozaki
仁 木下
Hitoshi Kinoshita
宏嘉 栗原
Hiroyoshi Kurihara
徹 三浦
Toru Miura
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Rm Tohcello Co Ltd
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Rm Tohcello Co Ltd
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Publication date
Application filed by Rm Tohcello Co Ltd filed Critical Rm Tohcello Co Ltd
Priority to JP2023031986A priority Critical patent/JP2024124069A/ja
Publication of JP2024124069A publication Critical patent/JP2024124069A/ja
Publication of JP2024124069A5 publication Critical patent/JP2024124069A5/ja
Pending legal-status Critical Current

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  • Adhesives Or Adhesive Processes (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
JP2023031986A 2023-03-02 2023-03-02 電子装置の製造方法 Pending JP2024124069A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023031986A JP2024124069A (ja) 2023-03-02 2023-03-02 電子装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2023031986A JP2024124069A (ja) 2023-03-02 2023-03-02 電子装置の製造方法

Publications (2)

Publication Number Publication Date
JP2024124069A true JP2024124069A (ja) 2024-09-12
JP2024124069A5 JP2024124069A5 (https=) 2025-10-31

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ID=92676415

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JP2023031986A Pending JP2024124069A (ja) 2023-03-02 2023-03-02 電子装置の製造方法

Country Status (1)

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JP (1) JP2024124069A (https=)

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