JP2024106711A - ウエハ温度制御装置、ウエハ温度制御方法及びウエハ温度制御プログラム - Google Patents

ウエハ温度制御装置、ウエハ温度制御方法及びウエハ温度制御プログラム Download PDF

Info

Publication number
JP2024106711A
JP2024106711A JP2023011118A JP2023011118A JP2024106711A JP 2024106711 A JP2024106711 A JP 2024106711A JP 2023011118 A JP2023011118 A JP 2023011118A JP 2023011118 A JP2023011118 A JP 2023011118A JP 2024106711 A JP2024106711 A JP 2024106711A
Authority
JP
Japan
Prior art keywords
wafer
temperature
pressure
control
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023011118A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024106711A5 (enExample
Inventor
大介 林
Daisuke Hayashi
興太郎 瀧尻
Kotaro Takijiri
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Horiba Stec Co Ltd
Original Assignee
Horiba Stec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Horiba Stec Co Ltd filed Critical Horiba Stec Co Ltd
Priority to JP2023011118A priority Critical patent/JP2024106711A/ja
Priority to KR1020240005925A priority patent/KR20240118658A/ko
Priority to CN202410091898.1A priority patent/CN118412298A/zh
Priority to US18/423,244 priority patent/US20240258139A1/en
Priority to TW113103083A priority patent/TW202445712A/zh
Publication of JP2024106711A publication Critical patent/JP2024106711A/ja
Publication of JP2024106711A5 publication Critical patent/JP2024106711A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
    • G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
    • G05B13/04—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators
    • G05B13/048—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators using a predictor
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/30—Automatic controllers with an auxiliary heating device affecting the sensing element, e.g. for anticipating change of temperature
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/10—Complex mathematical operations
    • G06F17/16—Matrix or vector computation, e.g. matrix-matrix or matrix-vector multiplication, matrix factorization
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Automation & Control Theory (AREA)
  • Pure & Applied Mathematics (AREA)
  • Software Systems (AREA)
  • Mathematical Optimization (AREA)
  • Theoretical Computer Science (AREA)
  • Computational Mathematics (AREA)
  • Mathematical Analysis (AREA)
  • Data Mining & Analysis (AREA)
  • General Engineering & Computer Science (AREA)
  • Databases & Information Systems (AREA)
  • Algebra (AREA)
  • Computing Systems (AREA)
  • Health & Medical Sciences (AREA)
  • Artificial Intelligence (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Evolutionary Computation (AREA)
  • Medical Informatics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Control Of Temperature (AREA)
  • Feedback Control In General (AREA)
JP2023011118A 2023-01-27 2023-01-27 ウエハ温度制御装置、ウエハ温度制御方法及びウエハ温度制御プログラム Pending JP2024106711A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2023011118A JP2024106711A (ja) 2023-01-27 2023-01-27 ウエハ温度制御装置、ウエハ温度制御方法及びウエハ温度制御プログラム
KR1020240005925A KR20240118658A (ko) 2023-01-27 2024-01-15 웨이퍼 온도 제어 장치, 웨이퍼 온도 제어 방법 및 웨이퍼 온도 제어 프로그램
CN202410091898.1A CN118412298A (zh) 2023-01-27 2024-01-23 晶片温度控制装置、晶片温度控制方法及存储介质
US18/423,244 US20240258139A1 (en) 2023-01-27 2024-01-25 Wafer temperature control device, wafer temperature control method and wafer temperature control program
TW113103083A TW202445712A (zh) 2023-01-27 2024-01-26 晶片溫度控制裝置、晶片溫度控制方法及存儲介質

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2023011118A JP2024106711A (ja) 2023-01-27 2023-01-27 ウエハ温度制御装置、ウエハ温度制御方法及びウエハ温度制御プログラム

Publications (2)

Publication Number Publication Date
JP2024106711A true JP2024106711A (ja) 2024-08-08
JP2024106711A5 JP2024106711A5 (enExample) 2025-12-24

Family

ID=91963904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023011118A Pending JP2024106711A (ja) 2023-01-27 2023-01-27 ウエハ温度制御装置、ウエハ温度制御方法及びウエハ温度制御プログラム

Country Status (5)

Country Link
US (1) US20240258139A1 (enExample)
JP (1) JP2024106711A (enExample)
KR (1) KR20240118658A (enExample)
CN (1) CN118412298A (enExample)
TW (1) TW202445712A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1066620S1 (en) * 2021-02-12 2025-03-11 Applied Materials, Inc. Patterned heater pedestal with groove extensions
JP2022125685A (ja) * 2021-02-17 2022-08-29 株式会社Kelk 半導体ウエハの温度制御装置及び半導体ウエハの温度制御方法
CN118814145B (zh) * 2024-09-18 2025-01-28 浙江求是半导体设备有限公司 一种cvd反应器的温度控制方法和系统
CN118932321B (zh) * 2024-10-15 2024-12-13 杭州正丰半导体科技有限公司 一种半导体cvd工艺热控制方法及其陶瓷加热器

Also Published As

Publication number Publication date
TW202445712A (zh) 2024-11-16
KR20240118658A (ko) 2024-08-05
CN118412298A (zh) 2024-07-30
US20240258139A1 (en) 2024-08-01

Similar Documents

Publication Publication Date Title
JP2024106711A (ja) ウエハ温度制御装置、ウエハ温度制御方法及びウエハ温度制御プログラム
US12272575B2 (en) Advanced temperature control for wafer carrier in plasma processing chamber
US7415312B2 (en) Process module tuning
US7582491B2 (en) Method for diagnosing electrostatic chuck, vacuum processing apparatus, and storage medium
US20080228308A1 (en) Critical dimension uniformity optimization
JP2008177285A (ja) プラズマ処理装置
KR20240056414A (ko) 웨이퍼 온도 제어 장치, 웨이퍼 온도 제어 방법 및 웨이퍼 온도 제어 프로그램
KR20240045237A (ko) 웨이퍼 온도 제어 장치, 웨이퍼 온도 제어 장치용 제어 방법, 및 웨이퍼 온도 제어 장치용 프로그램
JP2025007181A (ja) ウエハ温度制御装置、ウエハ温度制御方法及びウエハ温度制御プログラム
El-Awady et al. Programmable thermal processing module for semiconductor substrates
JP2003229348A (ja) 半導体露光装置
KR102750126B1 (ko) 기판 처리 장치 및 기판 처리 방법
Tay et al. A lamp thermoelectricity based integrated bake/chill system for photoresist processing
US20250003112A1 (en) Virtual sensor for predicting and monitoring temperature of chamber components
WO2025006034A1 (en) Virtual sensor for predicting and monitoring temperature of chamber components
CN117594431A (zh) 基板处理方法、用于控制基板处理方法的方法及基板处理设备
Tay et al. A thermoelectricity-lamp based integrated bake/chill system for photoresist processing

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20251216

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20251216