JP2024077094A - How the chip is manufactured - Google Patents

Abstract

A method for manufacturing a chip that can reduce the probability of chip damage is provided.
[Solution] A chip manufacturing method for manufacturing multiple chips from a workpiece including a device region on the front side of which multiple devices are formed and a peripheral surplus region surrounding the device region, in which a groove is formed on the surface of the workpiece extending along the boundary between the multiple devices and not reaching the outer periphery of the workpiece, a resin sheet having adhesive only at a position corresponding to the peripheral surplus region is attached to the surface of the workpiece, ultraviolet rays are irradiated onto the ultraviolet-curable resin while pressing liquid ultraviolet-curable resin on the surface of the resin sheet against a flat surface, the back side of the workpiece is ground to divide the workpiece at the groove so that the peripheral surplus region is separated from the device region to form a surplus ring and multiple chips are manufactured from the device region, adhesive tape is attached to the back sides of the surplus ring and the multiple chips, and the resin sheet is peeled off from the surface of the surplus ring.
[Selected figure] Figure 2

Description

The present invention relates to a method for manufacturing chips that produces multiple chips from a workpiece that includes a device region on the front side of which multiple devices are formed and a peripheral excess region that surrounds the device region.

Chips for devices such as ICs (Integrated Circuits) are essential components in various electronic devices such as mobile phones and personal computers. These chips are manufactured, for example, by dividing a workpiece that includes a device region on the front side where multiple devices are formed and a peripheral excess region surrounding the device region along the boundaries (so-called streets) between the multiple devices.

One known method for manufacturing chips is to form a groove on the surface of a workpiece and then grind the back side of the workpiece (see, for example, Patent Document 1). Specifically, in this method, first, a groove is formed on the surface of the workpiece that extends along the boundaries between multiple devices and reaches the outer periphery of the workpiece. Then, while holding the front side of the workpiece, the back side of the workpiece is ground to divide the workpiece at the groove.

Here, the surface of the workpiece has an uneven shape due to the presence of multiple devices. In this case, it may be difficult to hold the front side of the workpiece. In light of this, a method has been proposed for flattening the front side of the workpiece prior to grinding the back side of the workpiece as described above (see, for example, Patent Document 2).

Specifically, in this method, a resin sheet with adhesive only applied to the area of the surface of the workpiece that corresponds to the peripheral excess area is first attached to the surface of the workpiece. Then, the liquid ultraviolet curing resin on the surface of this resin sheet is pressed against a flat surface while ultraviolet light is irradiated onto the ultraviolet curing resin.

In this case, the ultraviolet curing resin cures while the surface is flat. In other words, the front side of the workpiece is flattened. Then, by flattening the front side of the workpiece, it becomes easier to hold this front side and grind the back side. Then, as grinding of the back side of the workpiece progresses, the workpiece is divided at the grooves. As a result, multiple chips are produced from the device region of the workpiece, and multiple scraps are formed from the peripheral excess region.

JP 2003-7653 A JP 2019-186355 A

After the workpiece is divided, a film-like adhesive tape, also known as a die attach film, which is generally used to attach chips to a specified structure, is attached to the backside of each of the multiple chips and multiple scrap materials. Then, the resin sheet and ultraviolet curing resin that were provided on the surface of the workpiece before the workpiece was divided are peeled off from the front surface of each of the multiple chips and multiple scrap materials after the adhesive tape has been attached to the backside of each of the multiple chips and multiple scrap materials.

Here, the resin sheet is attached to the surface of the peripheral excess area of the workpiece, i.e., to the surface of each of the multiple scrap materials. When peeling the resin sheet from the surface of each of the multiple scrap materials, the resin sheet may not peel off from some of the multiple scrap materials, and these may peel off from the adhesive tape. In this case, some of the multiple scrap materials may come into contact with the chip, causing damage to the chip.

In view of this, the object of the present invention is to provide a method for manufacturing a chip that can reduce the probability of chip damage.

According to the present invention, a method for manufacturing a plurality of chips from a workpiece including a device region on the surface side of which a plurality of devices are formed and a peripheral excess region surrounding the device region includes a groove forming step for forming a groove on the surface of the workpiece that extends along the boundary between the plurality of devices and does not reach the outer periphery of the workpiece, a first attachment step for attaching a resin sheet, on the surface of the workpiece, in which an adhesive is provided only at a position corresponding to the peripheral excess region, after the groove forming step, and a liquid ultraviolet curing resin provided on the surface of the resin sheet, which is pressed against a flat surface after the first attachment step. The method for manufacturing chips includes an irradiation step of irradiating the ultraviolet curing resin with ultraviolet light while the ultraviolet curing resin is being heated, a division step of grinding the back side of the workpiece to divide the workpiece at the groove so that the peripheral excess region is separated from the device region to form an excess ring and the multiple chips are manufactured from the device region after the irradiation step, a second attachment step of attaching adhesive tape to the back sides of the excess ring and the multiple chips after the division step, and a peeling step of peeling the resin sheet from the surface of the excess ring after the second attachment step.

The flat surface is one side of a cover sheet made of a resin through which the ultraviolet light passes, and in the irradiation step, it is preferable that the ultraviolet light is irradiated onto the ultraviolet-curable resin through the cover sheet.

In the present invention, the resin sheet is peeled off from the surface of the surplus ring formed by the peripheral surplus area of the workpiece remaining without being divided into multiple scraps. Here, the surplus ring has a larger area of its back surface that is adhered to the adhesive tape compared to each of the multiple scraps.

In this case, the force fixing the surplus ring to the adhesive tape is stronger than the force fixing each of the multiple scrap materials to the adhesive tape. Therefore, the resin sheet is easily peeled off from the surplus ring, and the surplus ring is not easily peeled off from the adhesive tape. As a result, it is possible to reduce the likelihood that the surplus ring will come into contact with the chip and damage the chip.

FIG. 1 is a perspective view showing a schematic example of a workpiece. FIG. 2 is a flow chart showing an example of a method for producing a plurality of chips from a workpiece. FIG. 3(A) is a partially sectional side view showing a schematic diagram of a groove forming step being performed in a cutting device, and FIG. 3(B) is a perspective view showing a schematic diagram of a workpiece after the groove forming step. Figure 4(A) is a partial cross-sectional side view showing the manner in which the first adhesion step is performed in the adhesion device, Figure 4(B) is an oblique view showing the workpiece etc. after the first adhesion step, Figure 4(C) is a cross-sectional view showing the workpiece etc. after the first adhesion step, and Figure 4(D) is an enlarged cross-sectional view showing the workpiece etc. after the first adhesion step. Each of Figures 5 (A) and 5 (B) is a partially cross-sectional side view showing a schematic diagram of how an irradiation step is performed in a resin application device, and Figure 5 (C) is a cross-sectional view showing a schematic diagram of a workpiece etc. after the irradiation step. FIG. 6(A) is a partially sectional side view showing a schematic diagram of a state in which a dividing step is performed in a grinding apparatus, and FIG. 6(B) is a schematic sectional view showing a workpiece etc. after the dividing step. Figure 7(A) is a partial cross-sectional side view showing the manner in which the second bonding step is performed in the bonding device, Figure 7(B) is an oblique view showing the resin sheet etc. after the second bonding step, and Figure 7(C) is a cross-sectional view showing the resin sheet etc. after the second bonding step. 8A and 8B are each a partial cross-sectional side view that typically illustrates how a peeling step is performed in a peeling device.

An embodiment of the present invention will be described with reference to the attached drawings. FIG. 1 is a perspective view showing an example of a workpiece. The workpiece 11 shown in FIG. 1 has a disk-like shape and is made of a single crystal semiconductor material such as silicon (Si), silicon carbide (SiC) or gallium nitride (GaN). The workpiece 11 has a device region on the surface 11a side where multiple devices 13 are formed, and a peripheral excess region surrounding the device region.

The multiple devices 13 are arranged in a matrix. That is, the boundaries between the multiple devices 13 extend in a lattice pattern. The front surface 11a of the workpiece 11 has an uneven shape due to the presence of the multiple devices 13. On the other hand, the back surface 11b of the workpiece 11 is generally flat.

Figure 2 is a flow chart showing a schematic example of a method for manufacturing multiple chips from a workpiece 11. In this method, first, grooves that extend along the boundaries of multiple devices 13 and do not reach the outer periphery of the workpiece 11 are formed on the surface 11a of the workpiece 11 (groove formation step S1).

Figure 3(A) is a partially cross-sectional side view that shows a schematic diagram of the groove forming step S1 being performed in a cutting device. Note that the X-axis direction and the Y-axis direction shown in Figure 3(A) are directions that are perpendicular to each other on a horizontal plane, and the Z-axis direction is a direction (vertical direction) that is perpendicular to each of the X-axis direction and the Y-axis direction.

The cutting device 2 shown in FIG. 3(A) includes a holding table 4. This holding table 4 has a disk-shaped frame body with a diameter larger than that of the workpiece 11. This frame body is made of, for example, a metal material such as stainless steel or ceramics.

The frame also has a disk-shaped bottom wall and a cylindrical side wall that stands upright from the outer peripheral region of the bottom wall. That is, a disk-shaped recess is formed on the upper surface of the frame, which is defined by the bottom wall and the side wall.

A disk-shaped porous plate (not shown) with a diameter roughly equal to the diameter of the recess formed on the upper surface of the frame is fixed to the recess. This porous plate is made of, for example, porous ceramics.

The porous plate also communicates with a suction source (not shown), such as an ejector, through a through hole formed in the bottom wall of the frame. When the suction source is operated, a suction force acts on the space near the upper surface of the porous plate.

Furthermore, the holding table 4 is connected to an X-axis direction movement mechanism (not shown). This X-axis direction movement mechanism includes, for example, a ball screw and a motor. When this X-axis direction movement mechanism is operated, the holding table 4 moves along the X-axis direction.

The holding table 4 is also connected to a rotary drive source (not shown) such as a motor. When this rotary drive source is operated, the holding table 4 rotates around a rotation axis that passes through the center of the top surface of the holding table 4 and is aligned in the Z-axis direction.

A cutting unit 6 is provided above the holding table 4. This cutting unit 6 includes a spindle 8 that extends along the Y-axis direction. An annular cutting blade 10 is attached to the tip of the spindle 8.

The base end of the spindle 8 is connected to a rotary drive source (not shown) such as a motor. When this rotary drive source is operated, the cutting blade 10 rotates together with the spindle 8 around a straight line along the Y-axis direction as the rotation axis.

The cutting unit 6 is also connected to a Y-axis direction moving mechanism (not shown) and a Z-axis direction moving mechanism (not shown). Each of the Y-axis direction moving mechanism and the Z-axis direction moving mechanism includes, for example, a ball screw and a motor. When the Y-axis direction moving mechanism and/or the Z-axis direction moving mechanism is operated, the cutting unit 6 moves along the Y-axis direction and/or the Z-axis direction.

When performing the groove forming step S1 in the cutting device 2, first, the suction source is operated with the workpiece 11 placed on the holding table 4 with the surface 11a of the workpiece 11 facing upward. This causes the workpiece 11 to be held by the holding table 4. Next, the rotary drive source connected to the holding table 4 rotates the holding table 4 so that the linear portions included in the boundaries of the multiple devices 13 are parallel to the X-axis direction.

Next, the X-axis movement mechanism adjusts the position of the holding table 4 and/or the Y-axis movement mechanism adjusts the position of the cutting unit 6 so that one end of the linear portion and a point (one end point) located slightly inside the outer periphery of the workpiece 11 is positioned directly below the lower end of the cutting blade 10.

Then, the rotary drive source connected to the base end of the spindle 8 rotates the spindle 8 to rotate the cutting blade 10. Next, while the cutting blade 10 is still rotating, the Z-axis direction movement mechanism lowers the cutting unit 6 so that the lower end of the cutting blade 10 is positioned lower than the front surface 11a of the workpiece 11 and higher than the back surface 11b. This causes the lower end of the cutting blade 10 to cut into the one end point.

Next, while rotating the cutting blade 10, the holding table 4 is moved along the X-axis direction until the lower end of the cutting blade 10 reaches the other end of the linear portion and a point (other end point) located slightly inside the outer periphery of the workpiece 11. As a result, a linear groove 15 that does not reach the outer periphery of the workpiece 11 is formed on the surface 11a of the workpiece 11.

The above-mentioned operation is repeated until grooves 15 are formed along the entire boundaries of the multiple devices 13. This completes the groove forming step S1. FIG. 3(B) is a perspective view showing the workpiece 11 after groove forming step S1. This groove forming step S1 forms lattice-shaped grooves 15 on the surface 11a of the workpiece 11, which extend along the boundaries of the multiple devices 13 and do not reach the outer periphery of the workpiece 11.

After the groove forming step S1, a resin sheet having adhesive only at the position corresponding to the peripheral excess area is attached to the surface 11a of the workpiece 11 (first attachment step S2). Figure 4 (A) is a partially cross-sectional side view that shows a schematic diagram of the first attachment step S2 being performed in the attachment device.

The bonding device 12 shown in FIG. 4(A) includes a disk-shaped support table 14. In addition, a roller 16 is provided above the support table 14 for pressing a release paper 17, which has a disk-shaped resin sheet 19 made of polyolefin or the like attached to its underside, toward the support table 14.

The resin sheet 19 has a diameter roughly equal to the diameter of the workpiece 11 and a thickness of, for example, 30 μm to 150 μm. Furthermore, an adhesive (not shown) is provided on the underside of the region (adhesive region) of the resin sheet 19 that corresponds to the peripheral excess region of the workpiece 11, and no adhesive is provided on the underside of the region (non-adhesive region) that is further inward than the adhesive region.

When performing the first bonding step S2 in the bonding device 12, first, the workpiece 11 is placed on the support table 14 so that the surface 11a of the workpiece 11 faces upward. Next, the release paper 17 is placed on the workpiece 11 so that the multiple devices 13 are covered by the resin sheet 19.

Next, the roller 16 is rolled so that the release paper 17 is pressed against the support table 14. This causes the adhesive area of the resin sheet 19 to adhere to the peripheral excess area of the workpiece 11. Once the two are adhered, the release paper 17 is peeled off from the resin sheet 19. This completes the first adhesion step S2.

The adhesive applied to the underside of the attachment area of the resin sheet 19 may be a thermoplastic resin. In this case, the first attachment step S2 may be performed by pressing the resin sheet 19 against the workpiece 11 while heating the adhesive.

Figure 4(B) is a perspective view showing the workpiece 11 etc. after the first adhesion step S2, Figure 4(C) is a cross-sectional view showing the workpiece 11 etc. after the first adhesion step S2, and Figure 4(D) is an enlarged cross-sectional view showing the workpiece 11 etc. after the first adhesion step S2.

By this first attachment step S2, the resin sheet 19 covering the multiple devices 13 is attached to the surface 11a of the workpiece 11 in a state in which the lattice-shaped areas of the resin sheet 19 are deformed so as to be embedded inside the grooves 15.

After the first attachment step S2, the liquid ultraviolet curing resin on the surface of the resin sheet 19 is pressed against a flat surface while ultraviolet light is irradiated onto the ultraviolet curing resin (irradiation step S3). Each of Figs. 5(A) and 5(B) is a partial cross-sectional side view that shows a schematic diagram of how irradiation step S3 is performed in a resin application device. Note that Figs. 5(A) and 5(B) show simplified views of some of the components of the resin application device.

The resin application device 22 shown in Figures 5(A) and 5(B) includes a holding table 24. This holding table 24 has a disk-shaped bottom wall and a cylindrical side wall that stands up from the outer periphery of the bottom wall. That is, a disk-shaped recess 24a defined by the bottom wall and the side wall is formed on the upper surface side of the holding table 24. The diameter of this recess 24a is larger than the diameter of the workpiece 11.

The recess 24a is provided with a number of ultraviolet light sources 26. A support plate 28 is fixed above the ultraviolet light sources 26, and the upper surface of the support plate 28 is flush with the upper surface of the side wall of the holding table 24 and seals the recess 24a. The support plate 28 is made of a material that transmits ultraviolet light, such as borate glass, quartz glass, or translucent alumina.

Furthermore, inside the holding table 24, a suction passage 24b is formed, one end of which opens on the upper surface of the side wall of the holding table 24. The other end of the suction passage 24b is connected to a suction source 32 such as an ejector via a valve 30 or the like. When the valve 30 is opened while the suction source 32 is operating, a suction force acts on the space near the upper surface of the side wall of the holding table 24.

A holding unit 34 is provided above the holding table 24. This holding unit 34 has, for example, an electrostatic chuck on its underside. Alternatively, the holding unit 34 may have a structure similar to that of the holding table 4 shown in FIG. 3(A). In other words, the holding unit 34 may be configured to be able to apply a suction force to the space near its underside.

Furthermore, the holding unit 34 is connected to a vertical movement mechanism (not shown). This vertical movement mechanism includes, for example, a ball screw and a motor. When this vertical movement mechanism is operated, the holding unit 34 moves in the vertical direction.

When performing the irradiation step S3 in the resin application device 22, first, the workpiece 11 is placed on the holding table 24 so that the back surface 11b of the workpiece 11 faces upward. Next, the vertical movement mechanism lowers the holding unit 34 so that the bottom surface of the holding unit 34 contacts the back surface 11b of the workpiece 11.

Next, the holding unit 34 holds the workpiece 11. Next, the vertical movement mechanism raises the holding unit 34 so as to move the resin sheet 19 provided on the surface 11a side of the workpiece 11 away from the holding table 24.

Next, a disk-shaped cover sheet 21 is placed on the holding table 24 so as to close the suction passage 24b that opens on the upper surface of the side wall of the holding table 24. The cover sheet 21 has one flat surface (upper surface) and the other surface (lower surface), and is made of a resin that transmits ultraviolet light.

Next, liquid ultraviolet curing resin 23 is provided on the cover sheet 21 (see FIG. 5(A)). At this time, it is preferable that the liquid ultraviolet curing resin 23 is provided so as to bulge above the central region of the cover sheet 21 so as not to leave any gas between the liquid ultraviolet curing resin 23 and the resin sheet 19.

Next, the vertical movement mechanism lowers the holding unit 34 so as to press the liquid UV-curable resin 23 against one side of the cover sheet 21 via the resin sheet 19, etc., until the entire surface (lower surface) of the resin sheet 19 is covered with the liquid UV-curable resin 23 (see FIG. 5(B)).

Next, while the liquid ultraviolet curing resin 23 is pressed against one side of the cover sheet 21, ultraviolet light is irradiated from the multiple ultraviolet light sources 26 onto the ultraviolet curing resin 23 through the support plate 28 and the cover sheet 21. This causes the ultraviolet curing resin 23 to harden while pressed against the flat surface of the cover sheet 21. This completes the irradiation step S3.

Figure 5 (C) is a cross-sectional view showing the workpiece 11 etc. after irradiation step S3. This irradiation step S3 provides a cured UV-curable resin 23 on the surface 11a side of the workpiece 11 that is in close contact with the resin sheet 19 that has been deformed so as to be embedded inside the grooves 15 formed in the surface 11a of the workpiece 11 and has a flat surface (lower surface). In other words, the surface 11a side of the workpiece 11 is flattened.

After the irradiation step S3, the back surface 11b of the workpiece 11 is ground to divide the workpiece 11 at the grooves 15 (division step S4). Figure 6 (A) is a partially sectional side view that shows a schematic diagram of the manner in which division step S4 is performed in the grinding device.

The grinding device 42 shown in FIG. 6(A) includes a holding table 44. This holding table 44 has a structure similar to that of the holding table 4 shown in FIG. 3(A), for example. That is, the holding table 44 is configured to be able to apply a suction force to the space near its upper surface, for example.

Furthermore, the holding table 44 is connected to a rotational drive source for the holding table, such as a motor (not shown). When this rotational drive source is operated, the holding table 44 rotates around a straight line passing through the center of the upper surface of the holding table 44 as the rotation axis.

The holding table 44 is also connected to a horizontal movement mechanism (not shown). This horizontal movement mechanism includes, for example, a ball screw and a motor. When this horizontal movement mechanism is operated, the holding table 44 moves in the horizontal direction.

A grinding unit 46 is provided above the holding table 44. This grinding unit 46 includes a spindle 48 that extends vertically. A disk-shaped mount 50 is fixed to the lower end of the spindle 48.

Furthermore, an annular grinding wheel 52 having an outer diameter roughly equal to the diameter of the mount 50 is attached to the underside of the mount 50 using a fixing member (not shown) such as a bolt. This grinding wheel 52 includes an annular wheel base 54 made of a metal such as stainless steel or aluminum.

A circular recess is formed on the underside of the wheel base 54, and multiple grinding wheels 56 are fixed to this recess at roughly equal angular intervals along the circumferential direction of the wheel base 54. The undersides of the multiple grinding wheels 56 are positioned roughly on the same plane.

A spindle rotation drive source such as a motor is connected to the upper end of the spindle 48. When this spindle rotation drive source is operated, the grinding wheel 52 rotates together with the spindle 48 around a straight line along the vertical direction as the rotation axis.

Furthermore, the grinding unit 46 is connected to a vertical movement mechanism (not shown). This vertical movement mechanism includes, for example, a ball screw and a motor. When this vertical movement mechanism is operated, the grinding unit 46 moves along the vertical direction.

When performing the division step S4 in the grinding device 42, first, the workpiece 11 is placed on the holding table 44 so that the back surface 11b of the workpiece 11 faces upward. Next, suction force is applied to the space near the upper surface of the holding table 44, so that the holding table 44 holds the workpiece 11 via the cover sheet 21, the ultraviolet curing resin 23, and the resin sheet 19.

Then, the horizontal movement mechanism adjusts the position of the holding table 44 so that the center of the back surface 11b of the workpiece 11 is positioned directly below the trajectory of the multiple grinding stones 56 when the grinding wheel 52 is rotated. Next, the vertical movement mechanism lowers the grinding unit 46 while operating the holding table rotary drive source and the spindle rotary drive source to rotate the holding table 44 and the grinding wheel 52.

When the lower surfaces of the grinding wheels 56 come into contact with the back surface 11b of the workpiece 11, the back surface 11b of the workpiece 11 is ground. As this grinding progresses, the workpiece 11 is divided at the grooves 15. This completes the division step S4.

Figure 6 (B) is a cross-sectional view showing the resin sheet 19, etc., after division step S4. By this division step S4, the peripheral excess region of the workpiece 11 is separated from the device region to form an excess ring 25, and multiple chips 27 are manufactured from the device region. Note that the excess ring 25 and multiple chips 27 will not come apart because they are integrated via the resin sheet 19, etc.

After the division step S4, adhesive tape is attached to the backside of each of the surplus ring 25 and the multiple chips 27 (second attachment step S5). Figure 7 (A) is a schematic partial cross-sectional side view showing how the second attachment step S5 is performed in the attachment device.

The attachment device 62 shown in FIG. 7(A) includes a disk-shaped support table 64. In addition, above the support table 64, a roller 66 is provided for pressing the disk-shaped dicing tape 31, which has a disk-shaped adhesive tape 29, also called a die attach film, attached to its underside, toward the support table 64.

The diameter of the adhesive tape 29 is larger than the outer diameter of the excess ring 25 and smaller than the inner diameter of the annular frame 33 described below. The diameter of the dicing tape 31 is also larger than the inner diameter of the annular frame 33.

The adhesive tape 29 is made of, for example, epoxy resin. The dicing tape 31 has, for example, a flexible film-like base layer and an adhesive layer (glue layer) provided on one side of the base layer (the side facing the adhesive tape 29).

The base layer is made of polyolefin (PO), polypropylene (PP), polyethylene terephthalate (PET), polyvinyl chloride (PVC), polystyrene (PS), etc. The adhesive layer is made of silicone rubber, acrylic material, epoxy material, etc.

When performing the second attachment step S5 in the attachment device 62, first, the surplus ring 25 and the multiple chips 27 are placed on the support table 64 via a resin sheet 19 or the like so that the back surfaces of the surplus ring 25 and the multiple chips 27 face up, and the annular frame 33 is placed on the support table 64 so as to surround the surplus ring 25. The annular frame 33 is made of a metal material such as aluminum.

Then, the roller 66 is rolled so that the adhesive tape 29 and the dicing tape 31 are pressed against the support table 64. This causes the adhesive tape 29 to be adhered to the backside of each of the surplus rings 25 and the multiple chips 27, and the dicing tape 31 to be adhered to the top surface of the annular frame 33. This completes the second adhesion step S5.

Figure 7(B) is a perspective view that shows the resin sheet 19, etc., after the second attachment step S5, and Figure 7(C) is a cross-sectional view that shows the resin sheet 19, etc., after the second attachment step S5. Note that Figures 7(B) and 7(C) show the resin sheet 19, etc., shown in Figure 7(A), turned upside down.

By this second attachment step S5, a frame unit 35 is formed, which includes the resin sheet 19, the cover sheet 21, the UV-curable resin 23, the excess ring 25, the multiple chips 27, the adhesive tape 29, the dicing tape 31 and the annular frame 33.

In the first attachment step S2, the resin sheet 19 is attached only to the surface of the peripheral excess region of the workpiece 11, and is not attached to the surface of the device region. The excess ring 25 is a portion that corresponds to the peripheral excess region, and the multiple chips 27 are portions that correspond to the device region. Therefore, in the frame unit 35, the resin sheet 19 is attached only to the surface of the excess ring 25, and is not attached to the surfaces of the multiple chips 27.

After the second attachment step S5, the resin sheet 19 is peeled off from the surface of the excess ring 25 (peeling step S6). Each of Fig. 8(A) and Fig. 8(B) is a partial cross-sectional side view that shows the manner in which the peeling step S6 is carried out in a peeling device. Note that Fig. 8(A) and Fig. 8(B) show simplified views of some of the components of the peeling device.

The peeling device 72 shown in Figures 8(A) and 8(B) includes a holding table 74. This holding table 74 has a structure similar to that of the holding table 4 shown in Figure 3(A), for example. That is, the holding table 74 is configured to be able to apply a suction force to the space near its upper surface, for example.

A number of clamps 76 are provided around the holding table 74 at approximately equal intervals along the circumferential direction of the holding table 74. Each of the clamps 76 holds the annular frame 33 at a position lower than the upper surface of the holding table 74 when the frame unit 35 is held on the holding table 74.

The holding table 74 and the multiple clamps 76 are also connected to a horizontal movement mechanism (not shown). This horizontal movement mechanism includes, for example, a ball screw and a motor. When this horizontal movement mechanism is operated, the holding table 74 and the multiple clamps 76 move in the horizontal direction.

A gripping unit 78 capable of gripping the end of the cover sheet 21 is provided above the holding table 74. This gripping unit 78 is connected to a vertical movement mechanism (not shown). This vertical movement mechanism includes, for example, a ball screw and a motor. When this horizontal movement mechanism is operated, the gripping unit 78 moves in the vertical direction.

When performing the peeling step S6 in the peeling device 72, first, the frame unit 35 is placed on the holding table 74 so that the cover sheet 21 faces upward. Next, the frame unit 35 is held by the holding table 74 by applying suction force to the space near the upper surface of the holding table 74, and the annular frame 33 is held at a position lower than the upper surface of the holding table 74 by the clamp 76.

Next, the gripping unit 78 grips the end of the cover sheet 21 (see FIG. 8(A)). Next, the vertical movement mechanism raises the gripping unit 78, and the horizontal movement mechanism moves the holding table 74 and the multiple clamps 76 so that the resin sheet 19 attached to the surface of the surplus ring 25 is peeled off from the surface of the surplus ring 25 together with the cover sheet 21 and the UV-curable resin 23 (see FIG. 8(B)). This completes the peeling step S6.

In this peeling step S6, the resin sheet 19 is peeled off from the surface of the surplus ring 25, which is formed by the outer peripheral surplus area of the workpiece 11 remaining without being divided into multiple scrap materials. Here, the surplus ring 25 has a larger area of its back surface that is attached to the adhesive tape 29 compared to each of the multiple scrap materials.

In this case, the force fixing the excess ring 25 to the adhesive tape 29 is stronger than the force fixing each of the multiple scrap materials to the adhesive tape 29. Therefore, the resin sheet 19 is easily peeled off from the excess ring 25, and the excess ring 25 is not easily peeled off from the adhesive tape 29. As a result, it is possible to reduce the likelihood that the excess ring 25 will come into contact with the chip 27 and damage the chip 27.

Note that the above is one aspect of the present invention, and the present invention is not limited to the above. For example, in the irradiation step S3 of the present invention, the front surface side of the workpiece 11 may be flattened without using the cover sheet 21.

Specifically, in the irradiation step S3 of the present invention, ultraviolet rays may be irradiated onto the ultraviolet curing resin 23 while pressing the ultraviolet curing resin 23 against a flat surface included in any structure, and then the ultraviolet curing resin 23 may be separated from the flat surface so that the surface of the ultraviolet curing resin 23 is exposed.

In this case, in the peeling step S6, for example, the peeling tape may be attached to the edge of the surface of the ultraviolet curable resin 23, and the peeling tape and the holding table that holds the frame unit 35 may be moved relative to each other.

In addition, in the present invention, after the peeling step S6, the adhesive tape 29 may be divided along the boundaries of the multiple chips 27. For example, the division of the adhesive tape 29 is performed by irradiating the multiple chips 27 with a laser beam from the front side along their boundaries using a known laser processing device.

In addition, the structures and methods of the above-described embodiments can be modified as appropriate without departing from the scope of the present invention.

2: Cutting device 4: Holding table 6: Cutting unit 8: Spindle 10: Cutting blade 11: Workpiece (11a: front surface, 11b: back surface)
12: Adhesive device 13: Device 14: Support table 15: Groove 16: Roller 17: Release paper 19: Resin sheet 21: Cover sheet 22: Resin adhering device 23: Ultraviolet curing resin 24: Holding table (24a: recess, 24b: suction path)
25: Surplus ring 26: Ultraviolet light source 27: Chip 28: Support plate 29: Adhesive tape 30: Valve 31: Dicing tape 32: Suction source 33: Annular frame 34: Holding unit 35: Frame unit 42: Grinding device 44: Holding table 46: Grinding unit 48: Spindle 50: Mount 52: Grinding wheel 54: Wheel base 56: Grinding stone 62: Adhesion device 64: Support table 66: Roller 72: Peeling device 74: Holding table 76: Clamp 78: Grinding unit

Claims (2)

A method for manufacturing a plurality of chips from a workpiece including a device region on a front surface side of which a plurality of devices are formed and a peripheral excess region surrounding the device region, comprising:
a groove forming step of forming grooves in the surface of the workpiece, the grooves extending along the boundaries of the plurality of devices and not reaching the outer periphery of the workpiece;
a first adhering step of adhering a resin sheet having an adhesive only at a position corresponding to the peripheral excess region to the surface of the workpiece after the groove forming step;
After the first bonding step, an irradiation step of irradiating the ultraviolet curing resin with ultraviolet light while pressing the liquid ultraviolet curing resin provided on the surface of the resin sheet against a flat surface;
a dividing step of grinding a back side of the workpiece to divide the workpiece at the groove so that, after the irradiation step, the peripheral excess region is separated from the device region to form an excess ring and the plurality of chips are manufactured from the device region;
a second attaching step of attaching adhesive tape to the back surfaces of the surplus ring and each of the plurality of chips after the dividing step;
a peeling step of peeling the resin sheet from the surface of the excess ring after the second bonding step;
A method for manufacturing a chip comprising the steps of: the flat surface is one surface of the cover sheet made of a resin that transmits ultraviolet light,
2. The method for producing a chip according to claim 1, wherein in the irradiating step, the ultraviolet curing resin is irradiated with the ultraviolet light through the cover sheet.

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