JP2024036514A - Photosensitive resin composition, and dry film, printed wiring board and method for manufacturing printed wiring board using the composition - Google Patents

Abstract

To provide a photosensitive resin composition having excellent adhesion strength with plated copper and showing excellent resolution and adhesiveness to a substrate made of a silicon raw material such as a silicon wafer and to a chip component, and a dry film, a printed wiring board and a method for manufacturing a printed wiring board using the above composition.SOLUTION: The photosensitive resin composition comprises (A) an acid-modified vinyl group-containing epoxy resin, (B) a photopolymerizable compound, (C) a photopolymerization initiator, (D) an inorganic filler, and (E) a silane compound, in which the content of the (D) inorganic filler is 20 to 60 mass% based on a total solid content of the photosensitive resin composition. A dry film, a printed wiring board and a method for manufacturing a printed wiring board using the above composition are also disclosed.SELECTED DRAWING: None

Description

The present disclosure relates to a photosensitive resin composition, a dry film using the same, a semiconductor device, and a method for manufacturing a printed wiring board.

2. Description of the Related Art In recent years, as electronic devices have become more sophisticated (smaller, lighter, and more multifunctional), semiconductor components such as LSIs and chips have become more highly integrated. Along with this, the form of semiconductor components is rapidly changing to have more pins and become smaller. In addition, with the increasing integration of semiconductor components, the density and definition of semiconductor elements, semiconductor packages, printed wiring boards, flexible wiring boards, etc. that make up semiconductor components are increasing, and chips, chip capacitors, etc. A board with built-in components embedded inside is being considered. Surface protection films or interlayer insulating films used in semiconductor components are required to be able to form via opening patterns for interlayer connections, and to be able to bond not only to substrate materials and copper patterns (conductor patterns), but also to chip components. has been done.

A build-up method is a conventional method for manufacturing printed wiring boards. This build-up method first laminates an insulating resin film on the inner layer circuit board (base material with the first conductor pattern), hardens it by heating to form an interlayer insulating film, and then forms via holes by laser processing. do. Next, the interlayer insulating film is roughened and smeared using alkaline permanganate treatment, etc., and then electroless copper plating is performed to form a second conductor pattern and a via hole that enables interlayer connection. (For example, see Patent Document 1).

In recent years, as conductor patterns have become more dense, surface protective films are required to have high resolution, and photosensitive resin compositions that can be patterned by photolithography are increasingly being used. Among these, alkaline-developable photosensitive resin compositions that can be developed with weak alkaline aqueous solutions such as aqueous sodium carbonate solutions have become mainstream from the viewpoint of preserving the working environment and preserving the global environment.

Japanese Patent Application Publication No. 7-304931

On the other hand, forming via holes in the build-up method using conventional laser processing requires forming each via one by one, which takes a lot of time when a large number of vias need to be provided due to higher density. There's a problem. Therefore, as a method for forming a large number of vias at once, formation of a surface protective film by photolithography is being considered. However, it cannot be said that sufficient adhesive strength between the surface protective film and electroless plated copper is obtained.

Therefore, the problem to be solved by the present disclosure is to create a photosensitive resin composition that has excellent adhesion strength to plated copper, excellent resolution, and excellent adhesion to silicon material substrates such as silicon wafers and chip components. The object of the present invention is to provide a product, a dry film using the same, a printed wiring board, and a method for producing a printed wiring board (hereinafter sometimes referred to as "photosensitive resin composition etc.").

The present inventors have conducted intensive research to solve the above problem, and as a result, have found that the problem can be solved by the following invention. That is, the present disclosure provides the following photosensitive resin composition, a dry film using the same, a printed wiring board, and a method for manufacturing a printed wiring board.

[1] Contains (A) an acid-modified vinyl group-containing epoxy resin, (B) a photopolymerizable compound, (C) a photopolymerization initiator, (D) an inorganic filler, and (E) a silane compound; A photosensitive resin composition in which the content of inorganic filler is 10 to 80% by mass based on the total solid content in the photosensitive resin composition.
[2] A dry film comprising a carrier film and a photosensitive layer using the photosensitive resin composition described in [1] above.
[3] A printed wiring board comprising at least one of a surface protective film and an interlayer insulating film formed from the photosensitive resin composition described in [1] above [4] The photosensitive resin composition described in [1] above on a substrate A step of providing a photosensitive layer using a resin composition or the dry film described in [2] above, a step of forming a resin pattern using the photosensitive layer, and a step of curing the resin pattern to form a surface protective film and interlayer insulation. A method for manufacturing a printed wiring board, comprising the steps of forming at least one of the films.

According to the present disclosure, there is provided a photosensitive resin composition that has excellent adhesion strength to plated copper, excellent resolution, and excellent adhesion to silicon material substrates such as silicon wafers, and chip components, and a photosensitive resin composition using the same. A dry film, a printed wiring board, and a method for manufacturing a printed wiring board can be provided.

FIG. 2 is a schematic diagram showing one aspect of the manufacturing process of a multilayer printed wiring board using the cured product of the photosensitive resin composition of the present embodiment as at least one of a surface protective film and an interlayer insulating film.

[Photosensitive resin composition]
A photosensitive resin composition according to an embodiment of the present disclosure (hereinafter sometimes simply referred to as the present embodiment) includes (A) an acid-modified vinyl group-containing epoxy resin, (B) a photopolymerizable compound, (C ) contains a photopolymerization initiator, (D) an inorganic filler, and (E) a silane compound, and the content of the (D) inorganic filler is 10 to 80% by mass based on the total solid content in the photosensitive resin composition. It is a resin composition called. In this specification, these components may be simply referred to as (A) component, (B) component, (C) component, etc. In this specification, "solid content" refers to non-volatile content excluding volatile substances such as water and solvent contained in the photosensitive resin composition, and when the resin composition is dried, It also includes components that are liquid, syrupy, and waxy at room temperature around 25°C.
Each component will be explained below.

<(A) Acid-modified vinyl group-containing epoxy resin>
The photosensitive resin composition of this embodiment contains an acid-modified vinyl group-containing epoxy resin as component (A). Component (A) is a compound obtained by modifying an epoxy resin with an organic acid containing a vinyl group, for example, a resin obtained by reacting an epoxy resin with a monocarboxylic acid containing a vinyl group, and a polybasic acid containing a saturated or unsaturated group. Examples include epoxy resins produced by reacting anhydrides.

Component (A) is, for example, bisphenol novolac type epoxy resin (a1) (hereinafter sometimes referred to as component (a1)) from the viewpoint of being alkaline developable and improving resolution and adhesive strength. ) (hereinafter sometimes referred to as the (A1) component), an epoxy resin (a2) other than the epoxy resin (a1) (hereinafter, the (a2) component) acid-modified vinyl group-containing epoxy resin (A2) (hereinafter sometimes referred to as component (A2)), etc., which are used alone or in combination of multiple types. It can be used as In addition, especially from the viewpoint of improving adhesion strength, component (A) includes at least one component (A1) using component (a1) and at least one component (A2) using component (a2). It may contain.

(Epoxy resin (a1))
As the component (A), it is preferable to contain a component (A1) using the component (a1), from the viewpoint of allowing alkaline development and improving resolution and adhesion strength. From the same viewpoint, as component (a1), one type selected from bisphenol novolac type epoxy resins having a structural unit represented by the following general formula (I) or (II) is preferable, and the following general formula (II) is preferred. ) A bisphenol novolac type epoxy resin having a structural unit represented by the following is more preferred.

[Epoxy resin having a structural unit represented by general formula (I)]
One preferred embodiment of component (a1) is an epoxy resin having a structural unit represented by the following general formula (I).

In general formula (I), R ¹¹ represents a hydrogen atom or a methyl group, and Y ¹ each independently represents a hydrogen atom or a glycidyl group. A plurality of R ^11s may be the same or different, and at least one of Y ^1s represents a glycidyl group.

R ¹¹ is preferably a hydrogen atom from the viewpoint of improving resolution and adhesive strength. Further, from the same viewpoint, it is preferable that Y ¹ is a glycidyl group.

The number of structural units in the epoxy resin (a1) having a structural unit represented by general formula (I) is 1 or more, and is 10 to 100, 15 to 80, or 15 to 70. It can be selected as appropriate. When the number of structural units is within the above range, resolution and adhesive strength are improved. Here, the number of structural units indicates an integer value in a single molecule, and indicates a rational number, which is an average value, in an aggregate of multiple types of molecules. The same applies to the number of structural units below.

[Epoxy resin having a structural unit represented by general formula (II)]
Moreover, one of the preferred embodiments of component (a1) is an epoxy resin having a structural unit represented by the following general formula (II).

In general formula (II), R ¹² represents a hydrogen atom or a methyl group, and Y ² each independently represents a hydrogen atom or a glycidyl group. A plurality of R ^12s may be the same or different, and at least one of Y ² represents a glycidyl group.

R ¹² is preferably a hydrogen atom from the viewpoint of improving resolution and adhesive strength.
Further, from the same viewpoint, it is preferable that Y ² is a glycidyl group.

The number of structural units in component (A2) having a structural unit represented by general formula (II) is 1 or more, and is appropriately selected from 10 to 100, 15 to 80, or 15 to 70. Just choose. When the number of structural units is within the above range, adhesive strength, heat resistance, and electrical insulation properties are improved.

In the general formula (II), those in which R ¹² is a hydrogen atom and Y ² is a glycidyl group are referred to as EXA-7376 series (manufactured by DIC Corporation, trade name), and those in which R ¹² is a methyl group, Those in which Y ² is a glycidyl group are commercially available as EPON SU8 series (manufactured by Mitsubishi Chemical Corporation, trade name).

(Epoxy resin (a2))
Component (a2) is not particularly limited as long as it is an epoxy resin different from component (a1), but from the viewpoint of improving adhesive strength and resolution, it may be a novolac type epoxy resin, such as the following: It may have a structural unit represented by general formula (III).

Component (a2) is used in combination with a bisphenol novolac type epoxy resin containing a structural unit represented by the general formula (I) or (II) among the components (a1), especially from the viewpoint of improving resolution. It is preferable.

[Epoxy resin having a structural unit represented by general formula (III)]
As the component (a2), a novolak type epoxy resin having a structural unit represented by the following general formula (III) is preferably mentioned. As a novolak type epoxy resin having such a structural unit, for example, the following general formula ( A novolac type epoxy resin represented by III') can be mentioned.

In general formulas (III) and (III'), R ¹³ represents a hydrogen atom or a methyl group, and Y ³ represents a hydrogen atom or a glycidyl group. Further, in the general formula (III'), n ₁ is a number of 1 or more, a plurality of R ¹³ and Y ³ may be the same or different, and at least one of Y ³ represents a glycidyl group.

R ¹³ is preferably a hydrogen atom from the viewpoint of improving resolution.
In general formula (III'), Y ³ has a molar ratio of Y ³ which is a hydrogen atom and Y ³ which is a glycidyl group from 0/100 to 30/70, or from the viewpoint of improving resolution. It may be selected appropriately from 0/100 to 10/90. As can be seen from this molar ratio, at least one of ^Y3 is a glycidyl group.

n ₁ is a number of 1 or more, and may be appropriately selected from 10 to 200, 30 to 150, or 30 to 100. When _n1 is within the above range, a resist shape with improved linearity of the resist pattern outline can be formed, and adhesive strength, heat resistance, and electrical insulation properties are improved.

Examples of the novolak epoxy resin represented by the general formula (III') include phenol novolak epoxy resins and cresol novolac epoxy resins. These novolak-type epoxy resins can be obtained, for example, by reacting a phenol novolak resin, a cresol novolak resin, and epichlorohydrin by a known method.

In order to promote the reaction between the hydroxyl group and epichlorohydrin, it is preferable to carry out the reaction at a reaction temperature of 50 to 120° C. in the presence of an alkali metal hydroxide in a polar organic solvent such as dimethylformamide, dimethylacetamide, or dimethyl sulfoxide. When the reaction temperature is within the above range, the reaction is less likely to slow down and side reactions can be further suppressed.

Examples of the phenol novolac type epoxy resin or cresol novolac type epoxy resin represented by the general formula (III') include YDCN-701, YDCN-702, YDCN-703, YDCN-704, YDCN-704L, YDPN-638, YDPN-602 (trade name, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.), DEN-431, DEN-439 (trade name, manufactured by Dow Chemical Co., Ltd.), EOCN-120, EOCN-102S, EOCN-103S , EOCN-104S, EOCN-1012, EOCN-1025, EOCN-1027, BREN (product names manufactured by Nippon Kayaku Co., Ltd.), EPN-1138, EPN-1235, EPN-1299 (product names manufactured by BASF) , product name), N-730, N-770, N-865, N-665, N-673, VH-4150, VH-4240 (all products manufactured by DIC Corporation, product name) etc. are commercially available. It is possible.

In addition, the component (a2) may be at least one selected from the above novolak epoxy resins, bisphenol A epoxy resins, bisphenol F epoxy resins, and triphenolmethane epoxy resins.

[Epoxy resin having a structural unit represented by general formula (IV)]
As the bisphenol A type epoxy resin and the bisphenol F type epoxy resin, for example, at least one selected from bisphenol A type epoxy resins having a structural unit represented by the following general formula (IV) and bisphenol F type epoxy resins is preferable. Examples of epoxy resins having such structural units include bisphenol A epoxy resins and bisphenol F epoxy resins represented by the following general formula (IV'), with bisphenol F epoxy resins being preferred.

In general formulas (IV) and (IV'), R ¹⁴ represents a hydrogen atom or a methyl group, and Y ⁴ represents a hydrogen atom or a glycidyl group. Furthermore, a plurality of R ^14s may be the same or different. Furthermore, in the general formula (IV'), n ₂ represents a number of 1 or more, and when n ₂ is 2 or more, a plurality of Y ⁴ may be the same or different, and at least one Y ⁴ is a glycidyl group. be.

^R14 is preferably a hydrogen atom from the viewpoint of preventing undercuts and missing portions of the upper part of the resist from occurring and improving the linearity and resolution of the resist pattern outline.
Further, from the same viewpoint, it is preferable that Y ⁴ is a glycidyl group.

n ₂ represents a number of 1 or more, and may be appropriately selected from 10 to 100, 10 to 80, or 15 to 60. When _n2 is within the above range, a resist shape with improved linearity of the resist pattern outline can be formed, and adhesion with the copper substrate, heat resistance, and electrical insulation properties are improved.

Bisphenol A type epoxy resin or bisphenol F type epoxy resin represented by general formula (IV) and in which Y ⁴ is a glycidyl group, for example, bisphenol A type epoxy resin represented by general formula (IV) and in which Y ⁴ is a hydrogen atom. It can be obtained by reacting the hydroxyl group (-OY ⁴ ) of an epoxy resin or bisphenol F type epoxy resin with epichlorohydrin.

In order to promote the reaction between the hydroxyl group and epichlorohydrin, it is preferable to carry out the reaction at a reaction temperature of 50 to 120° C. in the presence of an alkali metal hydroxide in a polar organic solvent such as dimethylformamide, dimethylacetamide, or dimethyl sulfoxide. When the reaction temperature is within the above range, the reaction is less likely to slow down and side reactions can be further suppressed.

Examples of the bisphenol A epoxy resin or bisphenol F epoxy resin represented by the general formula (IV') include Epicoat 807, 815, 825, 827, 828, 834, 1001, 1004, 1007 and 1009 (the above, Mitsubishi Manufactured by Kagaku Co., Ltd., product name), DER-330, DER-301, DER-361 (manufactured by Dow Chemical Co., Ltd., product name), YD-8125, YDF-170, YDF-170, YDF-175S , YDF-2001, YDF-2004, YDF-8170 (trade names, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.), etc. are commercially available.

[Epoxy resin having a structural unit represented by general formula (V)]
Preferred examples of the triphenolmethane type epoxy resin as the component (a2) include triphenolmethane type epoxy resins having a structural unit represented by the following general formula (V); As the epoxy resin, for example, a triphenolmethane type epoxy resin represented by the following general formula (V') is preferably mentioned.

In formulas (V) and (V'), Y ⁵ represents a hydrogen atom or a glycidyl group, a plurality of Y ⁵ may be the same or different, and at least one Y ⁵ is a glycidyl group. Further, in the general formula (V'), n ₃ represents a number of 1 or more.

^Y5 has a molar ratio of ^Y5 , which is a hydrogen atom, and ^Y5 , which is a glycidyl group, from the viewpoint that undercutting and chipping of the upper part of the resist are less likely to occur, and the linearity and resolution of the resist pattern outline are improved. It may be selected appropriately from 0/100 to 30/70. As can be seen from this molar ratio, at least one of Y ⁵ is a glycidyl group.
n ₃ represents a number of 1 or more, and may be appropriately selected from 10 to 100, 15 to 80, or 15 to 70. When _n3 is within the above range, a resist shape with improved linearity of the resist pattern outline can be formed, and adhesion with the copper substrate, heat resistance, and electrical insulation properties are improved.

As the triphenolmethane type epoxy resin represented by the general formula (V'), for example, FAE-2500, EPPN-501H, EPPN-502H (trade names, manufactured by Nippon Kayaku Co., Ltd.) are commercially available. available at.

From the viewpoint of improving resolution, the components (A1) and (A2) are composed of components (a1) and (a2) (hereinafter sometimes referred to as "component (a)"), and vinyl group-containing components. Resins (A1') and (A2') formed by reacting monocarboxylic acid (b) (hereinafter sometimes referred to as component (b)) (hereinafter collectively referred to as "component (A')") The resin is preferably a resin formed by reacting a saturated or unsaturated group-containing polybasic acid anhydride (c) (hereinafter sometimes referred to as component (c)).

[Vinyl group-containing monocarboxylic acid (b)]
Component (b) includes, for example, acrylic acid, acrylic acid dimer, methacrylic acid, β-furfurylacrylic acid, β-styrylacrylic acid, cinnamic acid, crotonic acid, α-cyanocinnamic acid, etc. Derivatives, half-ester compounds that are the reaction products of hydroxyl group-containing acrylates and dibasic acid anhydrides, vinyl group-containing monoglycidyl ethers, or half-esters that are the reaction products of vinyl group-containing monoglycidyl esters and dibasic acid anhydrides. Preferred examples include compounds.

The half-ester compound can be obtained, for example, by reacting a hydroxyl group-containing acrylate, a vinyl group-containing monoglycidyl ether, or a vinyl group-containing monoglycidyl ester with a dibasic acid anhydride in an equimolar ratio. These (b) components can be used alone or in combination.

Examples of the hydroxyl group-containing acrylate, vinyl group-containing monoglycidyl ether, and vinyl group-containing monoglycidyl ester used in the synthesis of the half-ester compound, which is an example of component (b), include hydroxyethyl acrylate, hydroxyethyl methacrylate, and hydroxypropyl acrylate. , hydroxypropyl methacrylate, hydroxybutyl acrylate, hydroxybutyl methacrylate, polyethylene glycol monoacrylate, polyethylene glycol monomethacrylate, trimethylolpropane diacrylate, trimethylolpropane dimethacrylate, pentaerythritol triacrylate, pentaerythritol trimethacrylate, dipentaerythritol Examples include pentaacrylate, pentaerythritol pentamethacrylate, glycidyl acrylate, and glycidyl methacrylate.

Examples of the dibasic acid anhydride used in the synthesis of the half-ester compound include those containing a saturated group and those containing an unsaturated group. Specific examples of dibasic acid anhydrides include succinic anhydride, maleic anhydride, tetrahydrophthalic anhydride, phthalic anhydride, methyltetrahydrophthalic anhydride, ethyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, and methylhexahydrophthalic anhydride. acid, ethylhexahydrophthalic anhydride, itaconic anhydride, and the like.

In the reaction between component (a) and component (b) above, the reaction may be carried out at a ratio of 0.6 to 1.05 equivalents of component (b) to 1 equivalent of epoxy group in component (a). , the reaction may be carried out at a ratio of 0.8 to 1.0 equivalents. By reacting at such a ratio, photopolymerizability is improved, that is, photosensitivity is increased, and resolution is improved.

Component (a) and component (b) can be dissolved in an organic solvent and reacted.
Examples of organic solvents include ketones such as methyl ethyl ketone and cyclohexanone; aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene; methyl cellosolve, butyl cellosolve, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, and dipropylene. Glycol ethers such as glycol monoethyl ether, dipropylene glycol diethyl ether, and triethylene glycol monoethyl ether; Esters such as ethyl acetate, butyl acetate, butyl cellosolve acetate, and carbitol acetate; Aliphatic hydrocarbons such as octane and decane Preferable examples include petroleum solvents such as petroleum ether, petroleum naphtha, hydrogenated petroleum naphtha, and solvent naphtha.

Furthermore, it is preferable to use a catalyst to promote the reaction between component (a) and component (b). Examples of the catalyst include triethylamine, benzylmethylamine, methyltriethylammonium chloride, benzyltrimethylammonium chloride, benzyltrimethylammonium bromide, benzyltrimethylammonium iodide, triphenylphosphine, and the like.
The amount of the catalyst to be used is 0.01 to 10 parts by weight, 0.05 to 2 parts by weight, or 0.1 to 1 part by weight based on a total of 100 parts by weight of components (a) and (b). You can select as appropriate. When the above usage amount is used, the reaction between component (a) and component (b) is promoted.

Further, it is preferable to use a polymerization inhibitor for the purpose of preventing polymerization during the reaction. Examples of the polymerization inhibitor include hydroquinone, methylhydroquinone, hydroquinone monomethyl ether, catechol, and pyrogallol.
From the viewpoint of improving the storage stability of the composition, the amount of polymerization inhibitor used is 0.01 to 1 part by mass, 0.02 parts by mass, based on the total of 100 parts by mass of components (a) and (b). It may be appropriately selected from 0.8 parts by mass or 0.04 to 0.5 parts by mass.

The reaction temperature of component (a) and component (b) may be appropriately selected from 60 to 150°C, 80 to 120°C, or 90 to 110°C from the viewpoint of productivity.

In this way, component (A') obtained by reacting component (a) and component (b) is formed by a ring-opening addition reaction between the epoxy group of component (a) and the carboxyl group of component (b). It is presumed that it has a hydroxyl group.
By further reacting the component (A') obtained above with the component (c) containing a saturated or unsaturated group, the hydroxyl group of the component (A') (the hydroxyl group originally present in the component (a) is also removed). It is presumed that the acid-modified vinyl group-containing epoxy resin is obtained by half-esterifying the acid anhydride group of component (c) and the acid anhydride group of component (c).

[Polybasic acid anhydride (c)]
As component (c), those containing saturated groups and those containing unsaturated groups can be used. Specific examples of component (c) include succinic anhydride, maleic anhydride, tetrahydrophthalic anhydride, phthalic anhydride, methyltetrahydrophthalic anhydride, ethyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, and methylhexahydrophthalic anhydride. , ethylhexahydrophthalic anhydride, itaconic anhydride, and the like. Among these, from the viewpoint of obtaining a photosensitive resin composition capable of forming a pattern with excellent resolution, tetrahydrophthalic anhydride is preferred.

In the reaction between component (A') and component (c), for example, by reacting 0.1 to 1.0 equivalent of component (c) with respect to 1 equivalent of hydroxyl group in component (A'), acid The acid value of the modified vinyl group-containing epoxy resin can be adjusted.

The acid value of component (A) may be 30 to 150 mgKOH/g, 40 to 120 mgKOH/g, or 50 to 100 mgKOH/g. When the acid value is 30 mgKOH/g or more, the photosensitive resin composition has excellent solubility in a dilute alkaline solution, and when it is 150 mgKOH/g or less, the electrical properties of the cured film are improved.

The reaction temperature of component (A') and component (c) may be appropriately selected from 50 to 150°C, 60 to 120°C, or 70 to 100°C from the viewpoint of productivity.

Further, if necessary, as component (a), for example, a part of hydrogenated bisphenol A epoxy resin can be used in combination. Furthermore, as component (A), a styrene-maleic acid resin such as a hydroxyethyl (meth)acrylate modified product of a styrene-maleic anhydride copolymer can also be used in part.

(Molecular weight of component (A))
The weight average molecular weight of component (A) may be 3,000 to 30,000, 4,000 to 25,000, or 5,000 to 18,000. Within the above range, adhesive strength, heat resistance, and electrical insulation properties are improved. Here, the weight average molecular weight is a weight average molecular weight in terms of polyethylene, which is measured by gel permeation chromatography (GPC) using tetrahydrofuran as a solvent. More specifically, for example, the weight average molecular weight can be determined by measuring with the following GPC measurement device and measurement conditions and converting it using a standard polystyrene calibration curve. In addition, to create a calibration curve, a set of 5 samples ("PStQuick MP-H" and "PStQuick B", manufactured by Tosoh Corporation) is used as standard polystyrene.
(GPC measurement device)
GPC device: High-speed GPC device “HCL-8320GPC”, detector is differential refractometer or UV, manufactured by Tosoh Co., Ltd. Column: Column TSKgel SuperMultipore HZ-H (column length: 15 cm, column inner diameter: 4.6 mm), Tosoh Co., Ltd. Manufactured by Co., Ltd. (measurement conditions)
Solvent: Tetrahydrofuran (THF)
Measurement temperature: 40℃
Flow rate: 0.35ml/min Sample concentration: 10mg/THF5ml
Injection volume: 20μl

(Content of (A) component)
From the viewpoint of improving heat resistance, electrical properties, and chemical resistance, the content of component (A) is 5 to 60% by mass, 10 to 50% by mass, or , 15 to 40% by mass.

(Total content of component (A1) and component (A2) in component (A))
When using a combination of components (A1) and (A2) as component (A), the total content of components (A1) and (A2) in component (A) is From the viewpoint of improving the properties, the content may be appropriately selected from the range of 80 to 100% by mass, 90 to 100% by mass, 95 to 100% by mass, or 100% by mass. Furthermore, when using either the component (A1) or the component (A2) alone, it may be selected as appropriate from the above range.

(Mass ratio of component (A1) to component (A2))
When using a combination of components (A1) and (A2) as component (A), the mass ratio (A1/A2) is 30/70 to 90/2 from the viewpoint of improving resolution and heat resistance. 10, 40/60 to 80/20, or 50/50 to 80/20.

<(B) Photopolymerizable compound>
Component (B) is not particularly limited as long as it is a photopolymerizable compound or a photocrosslinkable compound; for example, a functional group exhibiting photopolymerizability, such as a vinyl group, an allyl group, a propargyl group, a butenyl group, or an ethynyl group. Preferred examples include compounds having a functional group having an ethylenically unsaturated bond such as phenylethynyl group, maleimide group, nadimide group, and (meth)acryloyl group.

From the viewpoint of photosensitivity, the component (B) is preferably a compound having a molecular weight of 1000 or less, such as hydroxyalkyl (meth)acrylates such as 2-hydroxyethyl (meth)acrylate and 2-hydroxypropyl (meth)acrylate. ; Mono- or di(meth)acrylates of glycol such as ethylene glycol, methoxytetraethylene glycol, and polyethylene glycol; (meth)acrylamides such as N,N-dimethyl(meth)acrylamide and N-methylol(meth)acrylamide; N , aminoalkyl (meth)acrylates such as N-dimethylaminoethyl (meth)acrylate; polyhydric alcohols such as hexanediol, trimethylolpropane, pentaerythritol, ditrimethylolpropane, dipentaerythritol, tris-hydroxyethyl isocyanurate; Polyvalent (meth)acrylates of these ethylene oxide or propylene oxide adducts; (meth)acrylates of ethylene oxide or propylene oxide adducts of phenols such as phenoxyethyl (meth)acrylate and polyethoxydi(meth)acrylate of bisphenol A; Preferred examples include (meth)acrylates of glycidyl ethers such as glycerin diglycidyl ether, trimethylolpropane triglycidyl ether, and triglycidyl isocyanurate; and melamine (meth)acrylate. These (B) components can be used alone or in combination.
From the viewpoint of improving sensitivity, polyhydric (meth)acrylates of the polyhydric alcohols or their ethylene oxide or propylene oxide adducts may be included.

Further, in order to increase the crosslinking density by photocuring and improve heat resistance and electrical reliability, a compound having three or more ethylenically unsaturated bonds in the molecule can be selected as the component (B). Such compounds include the aforementioned polyvalent (meth)acrylates, and dipentaerythritol tri(meth)acrylate can be selected from the viewpoint of improving sensitivity.

(Content of component (B))
The content of component (B) may be appropriately selected from 2 to 50% by mass, 3 to 20% by mass, or 3 to 10% by mass, based on the total solid content in the photosensitive resin composition. When the content of component (B) is 2% by mass or more, the photosensitivity is improved and exposed areas tend to be difficult to dissolve during development, and when the content is 50% by mass or less, heat resistance is improved.

<(C) Photopolymerization initiator>
Component (C) used in this embodiment is not particularly limited as long as it can polymerize component (B), and can be appropriately selected from commonly used photopolymerization initiators.
Component (C) includes, for example, benzoins such as benzoin, benzoin methyl ether, and benzoin isopropyl ether; acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 1,1 -dichloroacetophenone, 1-hydroxycyclohexylphenylketone, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1, 2-methyl-1-[4-(methylthio)phenyl]-2- Acetophenones such as morpholino-1-propanone and N,N-dimethylaminoacetophenone; 2-methylanthraquinone, 2-ethylanthraquinone, 2-tert-butylanthraquinone, 1-chloroanthraquinone, 2-amylanthraquinone, 2-aminoanthraquinone, etc. anthraquinones; thioxanthones such as 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, and 2,4-diisopropylthioxanthone; ketals such as acetophenone dimethyl ketal and benzyl dimethyl ketal; benzophenone, methylbenzophenone , 4,4'-dichlorobenzophenone, 4,4'-bis(diethylamino)benzophenone, Michler's ketone, 4-benzoyl-4'-methyldiphenyl sulfide, and other benzophenones; 9-phenylacridine, 1,7-bis(9, Acridines such as 9'-acridinyl)heptane; Acylphosphine oxides such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide; 1,2-octanedione-1-[4-(phenylthio)phenyl]-2-( O-benzoyloxime), 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone 1-(O-acetyloxime), 1-phenyl-1,2-propanedione Examples include oxime esters such as -2-[O-(ethoxycarbonyl)oxime]. These (C) components can be used alone or in combination of two or more.

Among these, from the viewpoint of improving the curing properties of the bottom part by photobleaching, it may be selected as appropriate from the above-mentioned acylphosphine oxides, and from the above-mentioned acetophenones, from the viewpoint of being less volatile and less likely to be generated as outgas. Bye.

(Content of component (C))
The content of component (C) is appropriately selected from 0.2 to 15% by mass, 0.4 to 5% by mass, or 0.6 to 1% by mass based on the total solid content of the photosensitive resin composition. do it. When the content of component (C) is 0.2% by mass or more, exposed areas tend to be difficult to dissolve during development, and when the content is 15.0% by mass or less, heat resistance is improved.

In addition to the above component (C), three compounds such as N,N-dimethylaminobenzoic acid ethyl ester, N,N-dimethylaminobenzoic acid isoamyl ester, pentyl-4-dimethylaminobenzoate, triethylamine, triethanolamine, etc. (C') photopolymerization initiation aids such as grade amines can be used alone or in combination.

<(D) Inorganic filler>
The photosensitive resin composition of this embodiment contains component (D) mainly for the purpose of further improving various properties such as adhesive strength and coating film hardness.
Component (D) includes, for example, silica (SiO ₂ ), alumina (Al ₂ O ₃ ), titania (TiO ₂ ), tantalum oxide (Ta ₂ O ₅ ), zirconia (ZrO ₂ ), silicon nitride (Si ₃ N ₄ ), barium titanate (BaO・TiO ₂ ), barium carbonate (BaCO ₃ ), magnesium carbonate (MgCO ₃ ), aluminum hydroxide (Al(OH) ₃ ), magnesium hydroxide (Mg(OH) ₂ ), titanium Lead acid (PbO・TiO ₂ ), lead zirconate titanate (PZT), lanthanum lead zirconate titanate (PLZT), gallium oxide (Ga ₂ O ₃ ), spinel (MgO・Al ₂ O ₃ ), mullite (3Al Contains _2O3.2SiO2 ), cordierite ( _{2MgO.2Al2O3 / 5SiO2} ), talc ( _{3MgO.4SiO2.H2O} ), _{aluminum titanate} ( _TiO2.Al2O3 ), _{and yttria .} Zirconia ( _{Y2O3 ・ ZrO2} ), barium silicate (BaO・_8SiO2 ), boron nitride (BN), calcium carbonate (CaCO3), barium sulfate ( _{BaSO4 )} , calcium sulfate ( _CaSO4 ), zinc oxide (ZnO), magnesium titanate (MgO.TiO ₂ ), hydrotalcite, mica, calcined kaolin, carbon (C), etc. can be used. These inorganic fillers can be used alone or in combination.

The average particle diameter of component (D) may be appropriately selected from 0.01 to 5 μm, 0.1 to 3 μm, or 0.1 to 2 μm from the viewpoint of resolution. Here, the average particle size of component (D) is the average particle size of the inorganic filler in a state dispersed in the photosensitive resin composition, and is a value obtained by measurement as follows. First, the photosensitive resin composition is diluted (or dissolved) 1,000 times with methyl ethyl ketone, and then using a submicron particle analyzer (manufactured by Beckman Coulter, Inc., trade name: N5), it is compliant with the international standard ISO13321. The particles dispersed in the solvent are measured with a refractive index of 1.38, and the particle diameter at an integrated value of 50% (volume basis) in the particle size distribution is defined as the average particle diameter. In addition, component (D) contained in the photosensitive layer provided on the carrier film or the cured film of the photosensitive resin composition is also diluted (or dissolved) 1000 times (volume ratio) using a solvent as described above. After that, the particles can be measured using the above-mentioned submicron particle analyzer.

Among the components (D), silica may be included from the viewpoint of improving heat resistance, barium sulfate may be included from the viewpoint of improving heat resistance and adhesive strength, or a combination of silica and barium sulfate may be included. . Further, from the viewpoint of improving the dispersibility of the inorganic filler in the resin composition due to the agglomeration prevention effect, the inorganic filler may be appropriately selected from one whose surface has been previously treated with alumina or an organic silane compound.

The elemental composition of aluminum on the surface of the inorganic filler surface-treated with alumina or an organic silane compound may be 0.5 to 10 atomic %, 1 to 5 atomic %, or 1.5 to 3.5 atomic % as appropriate. Just choose. Further, the elemental composition of silicon on the surface of the inorganic filler may be appropriately selected from 0.5 to 10 atomic %, 1 to 5 atomic %, or 1.5 to 3.5 atomic %. Further, the elemental composition of carbon on the surface of the inorganic filler may be appropriately selected from 10 to 30 atomic %, 15 to 25 atomic %, or 18 to 23 atomic %. These elemental compositions can be measured using XPS.

Examples of inorganic fillers surface-treated with alumina or organic silane compounds include barium sulfate whose surface is treated with alumina or organic silane compounds, such as NanoFine BFN40DC (manufactured by Nippon Solvay Co., Ltd., trade name). Commercially available.

(Content of component (D))
The content of component (D) is 10 to 80% by mass based on the total solid content of the photosensitive resin composition. Further, the content of component (D) may be appropriately selected from 12 to 70% by mass, 15 to 65% by mass, or 18 to 60% by mass. When the content of component (D) is within the above range, the strength, heat resistance, resolution, etc. of the cured product of the photosensitive resin composition can be improved.

When using silica as component (D), the content of silica is from 5 to 60% by mass, from 10 to 55% by mass, or from 15 to 50% by mass based on the total solid content of the photosensitive resin composition. You can select it as appropriate. Further, when barium sulfate is used as component (D), the content of barium sulfate is 5 to 30% by mass, 5 to 25% by mass, or 10 to 25% by mass, based on the total solid content of the photosensitive resin composition. It may be appropriately selected from 20% by mass. When the content of silica and barium sulfate is within the above range, low coefficient of thermal expansion, soldering heat resistance, and adhesive strength can be improved.

<(E)> Silane compound (E) Components include alkylsilane, alkoxysilane, vinylsilane, epoxysilane, aminosilane, acrylicsilane, methacrylsilane, mercaptosilane, sulfidosilane, isocyanatesilane, sulfursilane, styrylsilane, and alkylchlorosilane. At least one type of organic silane compound selected from:

More specifically, component (E) includes, for example, methyltrimethoxysilane, dimethyldimethoxysilane, trimethylmethoxysilane, methyltriethoxysilane, methyltriphenoxysilane, ethyltrimethoxysilane, n-propyltrimethoxysilane, Diisopropyldimethoxysilane, isobutyltrimethoxysilane, diisobutyldimethoxysilane, isobutyltriethoxysilane, n-hexyltrimethoxysilane, n-hexyltriethoxysilane, cyclohexylmethyldimethoxysilane, n-octyltriethoxysilane, n-dodecylmethoxysilane, Phenyltrimethoxysilane, diphenyldimethoxysilane, tetraethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-(2-aminoethyl)aminopropyltrimethoxysilane, 3-(2-aminoethyl) ) Aminopropylmethyldimethoxysilane, 3-phenylaminopropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycid Xypropylmethyldiethoxysilane, bis(3-(triethoxysilyl)propyl)disulfide, bis(3-(triethoxysilyl)propyl)tetrasulfide, vinyltriacetoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyl Triisopropoxysilane, allyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropylmethyl Examples include silane compounds such as dimethoxysilane, 3-mercaptopropyltriethoxysilane, and N-(1,3-dimethylbutylidene)-3-aminopropyltriethoxysilane.

The component (E) preferably has a functional group that can react with the component (A). Examples of functional groups that can react with component (A) include epoxy groups, amino groups, mercapto groups, and isocyanate groups. Among them, an epoxy group can be selected from the viewpoint of improving the stability of the photosensitive resin composition, a glycidyl ether group can be selected from the viewpoint of improving resolution, and an epoxysilane having at least one glycidyl ether group can be selected. can.

(Content of (E) component)
The content of component (E) may be appropriately selected from 0.5 to 30% by mass or 1 to 10% by mass based on the total solid content of the photosensitive resin composition. When the content of component (E) is within the above range, adhesion to chip components such as silicon wafers can be improved while maintaining resolution.

<(F) Pigment>
The photosensitive resin composition of this embodiment may further contain component (F) depending on the desired color in order to improve the appearance, such as hiding the conductor pattern. As component (F), a colorant that develops a desired color may be selected and used, such as phthalocyanine blue, phthalocyanine green, iodine green, diazo yellow, crystal violet, titanium oxide, carbon black, Preferred examples include known colorants such as naphthalene black.

(Content of (F) component)
The content of component (F) is 0.01 to 5% by mass, 0.01% to 5% by mass, based on the total solid content in the photosensitive resin composition, from the viewpoint of making it easier to identify the manufacturing equipment and further concealing the conductor pattern. It may be appropriately selected from .03 to 3% by mass or 0.05 to 2% by mass.

<(G) Curing agent>
The photosensitive resin composition of this embodiment may further contain component (G). Component (G) is a compound that itself cures with heat, ultraviolet light, etc., or a compound that cures by reacting with the carboxyl group or hydroxyl group of the acid-modified vinyl group-containing epoxy resin (A) with heat, ultraviolet light, etc. Can be mentioned. By using component (G), heat resistance, adhesive strength, chemical resistance, etc. can be further improved.

Examples of component (G) include thermosetting compounds such as epoxy compounds, melamine compounds, urea compounds, oxazoline compounds, and block isocyanates.
Examples of epoxy compounds include bisphenol A epoxy resin, bisphenol F epoxy resin, hydrogenated bisphenol A epoxy resin, brominated bisphenol A epoxy resin, novolak epoxy resin, bisphenol S epoxy resin, and biphenyl epoxy resin. , heterocyclic epoxy resins such as triglycidyl isocyanurate, bixylenol type epoxy resins, and the like. Examples of the melamine compound include triaminotriazine, hexamethoxymelamine, hexabutoxylated melamine, and the like. Further, examples of the urea compound include dimethylol urea and the like.

From the viewpoint of further improving heat resistance, component (G) preferably contains at least one selected from epoxy compounds (epoxy resins) and block isocyanates.

As the blocked isocyanate, an addition reaction product of a polyisocyanate compound and an isocyanate blocking agent is used. Examples of the polyisocyanate compound include tolylene diisocyanate, xylylene diisocyanate, phenylene diisocyanate, naphthylene diisocyanate, bis(isocyanatemethyl)cyclohexane, tetramethylene diisocyanate, hexamethylene diisocyanate, methylene diisocyanate, trimethylhexamethylene diisocyanate, isophorone diisocyanate, and the like. Polyisocyanate compounds, as well as their adducts, biurets, isocyanurates, and the like.

(Content of (G) component)
Component (G) may be used alone or in combination. (G) When using a curing agent, its content should be appropriately selected from 2 to 40% by mass, 3 to 30% by mass, or 5 to 20% by mass based on the total solid content of the photosensitive resin composition. Bye. By controlling the content of component (G) within the above range, the heat resistance of the cured film to be formed can be further improved while maintaining good developability.

<(H) Elastomer>
The photosensitive resin composition of this embodiment may further contain component (H). Component (H) can be suitably used especially when the photosensitive resin composition of this embodiment is used for a semiconductor package substrate. By adding component (H) to the photosensitive resin composition of this embodiment, flexibility and adhesive strength are reduced due to distortion (internal stress) inside the cured product due to curing shrinkage of component (A). can be suppressed. That is, the flexibility, adhesive strength, etc. of the cured film formed from the photosensitive resin composition can be improved.

Examples of the component (H) include styrene elastomers, olefin elastomers, urethane elastomers, polyester elastomers, polyamide elastomers, acrylic elastomers, and silicone elastomers. These elastomers are composed of hard segment components and soft segment components, with the former generally contributing to heat resistance and strength, and the latter contributing to flexibility and toughness.

Examples of the styrene elastomer include styrene-butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer, styrene-ethylene-butylene-styrene block copolymer, styrene-ethylene-propylene-styrene block copolymer, and the like.

Olefin elastomers are copolymers of α-olefins having 2 to 20 carbon atoms, such as ethylene, propylene, 1-butene, 1-hexene, and 4-methyl-pentene. Specific examples include ethylene-propylene copolymer (EPR), ethylene-propylene-diene copolymer (EPDM), dicyclopentadiene, 1,4-hexadiene, cyclooctadiene, methylene norbornene, ethylidene norbornene, butadiene, Examples include a copolymer of a nonconjugated diene having 2 to 20 carbon atoms such as isoprene with an α-olefin, and a carboxy-modified NBR obtained by copolymerizing methacrylic acid with a butadiene-acrylonitrile copolymer. More specifically, ethylene-α-olefin copolymer rubber, ethylene-α-olefin-nonconjugated diene copolymer rubber, propylene-α-olefin copolymer rubber, and butene-α-olefin copolymer rubber are used. Can be mentioned. More specifically, Milastomer (manufactured by Mitsui Chemicals, Inc.), EXACT (manufactured by Exxon Chemical), ENGAGE (manufactured by Dow Chemical), hydrogenated styrene-butadiene rubber "DYNABON HSBR" (manufactured by JSR Corporation), butadiene- Acrylonitrile copolymer "NBR series" (manufactured by JSR Corporation), or butadiene-acrylonitrile copolymer "XER series" (manufactured by JSR Corporation) modified with carboxyl groups at both ends, epoxy made by partially epoxidizing polybutadiene. Polybutadiene BF-1000 (manufactured by Nippon Soda Co., Ltd.), PB-4700, PB-3600 (manufactured by Daicel Corporation), etc. can be used.

Examples of polyester elastomers include those obtained by polycondensing dicarboxylic acids or derivatives thereof and diol compounds or derivatives thereof.

Specific examples of dicarboxylic acids include aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, and naphthalene dicarboxylic acid, and aromatic dicarboxylic acids in which the hydrogen atoms of these aromatic nuclei are substituted with methyl groups, ethyl groups, phenyl groups, etc. Examples include aliphatic dicarboxylic acids having 2 to 20 carbon atoms such as adipic acid, sebacic acid and dodecanedicarboxylic acid, and alicyclic dicarboxylic acids such as cyclohexanedicarboxylic acid. These compounds can be used alone or in combination of two or more.

Specific examples of diol compounds include aliphatic diols such as ethylene glycol, 1,3-propanediol, 1,4-butanediol, 1,6-hexanediol, 1,10-decanediol, and 1,4-cyclohexanediol. and alicyclic diols. These compounds can be used alone or in combination of two or more.

Furthermore, in addition to the above-mentioned elastomers, rubber-modified epoxy resins can also be used as elastomers. Rubber-modified epoxy resins include, for example, bisphenol F-type epoxy resins, bisphenol A-type epoxy resins, salicylaldehyde-type epoxy resins, phenol novolac-type epoxy resins, and cresol novolak-type epoxy resins in which both part or all of the epoxy groups are combined. It can be obtained by modification with terminal carboxylic acid-modified butadiene-acrylonitrile rubber, terminal amino-modified silicone rubber, etc. Among these elastomers, Espel (manufactured by Hitachi Chemical Co., Ltd., Espel 1108, 1612, 1620), which is a polyester elastomer having a carboxyl group-modified butadiene-acrylonitrile copolymer and a hydroxyl group on both terminals, has a high shear adhesive strength. etc. are preferred. Further, elastomers that are liquid at room temperature are particularly preferred.

(Content of (H) component)
When using component (H), its content is appropriately selected from 1 to 20 parts by mass, 2 to 15 parts by mass, or 3 to 10 parts by mass based on 100 parts by mass of component (A) (solid content). do it. By setting it within the above range, thermal shock resistance and adhesive strength can be further improved while maintaining good developability. Furthermore, when used in a thin film substrate, the warpage of the thin film substrate can be reduced.

<(I) Epoxy resin curing agent>
Component (I) can also be added to the photosensitive resin composition of this embodiment for the purpose of further improving various properties such as heat resistance, adhesive strength, and chemical resistance.
Examples of such component (I) include 2-methylimidazole, 2-ethyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methyl-5- Imidazole derivatives such as hydroxymethylimidazole; Guanamines such as acetoguanamine and benzoguanamine; Polyamines such as diaminodiphenylmethane, m-phenylenediamine, m-xylenediamine, diaminodiphenylsulfone, dicyandiamide, urea, urea derivatives, melamine, and polybasic hydrazide. ; these organic acid salts or epoxy adducts; amine complexes of boron trifluoride; ethyldiamino-S-triazine, 2,4-diamino-S-triazine, 2,4-diamino-6-xylyl-S-triazine, etc. Examples include triazine derivatives.

((I) Content of component)
Component (I) can be used alone or in combination of multiple types, and when using component (I), the content is determined from the viewpoint of further suppressing the influence on the photosensitive properties of the photosensitive resin composition. The amount may be appropriately selected from 0.01 to 20% by mass, 0.1 to 10% by mass, or 0.1 to 3% by mass, based on the total solid content of .

<(J) Thermoplastic resin>
Component (J) can also be added to the photosensitive resin composition of this embodiment for the purpose of further improving the flexibility of the cured film. Examples of the component (J) include acrylic resins and urethane resins.

(Content of (J) component)
Component (J) can be used alone or in combination of multiple types, and when using component (J), its content is determined from the viewpoint of improving the flexibility of the cured film in the photosensitive resin composition. The amount may be appropriately selected from 1 to 30% by mass or 5 to 20% by mass based on the total solid content of .

<Diluent>
A diluent can be used in the photosensitive resin composition of this embodiment, if necessary. As the diluent, for example, an organic solvent can be used. Examples of organic solvents include ketones such as methyl ethyl ketone and cyclohexanone; aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene; methyl cellosolve, butyl cellosolve, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, and dipropylene. Glycol ethers such as glycol monoethyl ether, dipropylene glycol diethyl ether, and triethylene glycol monoethyl ether; Esters such as ethyl acetate, butyl acetate, butyl cellosolve acetate, and carbitol acetate; Aliphatic hydrocarbons such as octane and decane ; Examples include petroleum solvents such as petroleum ether, petroleum naphtha, hydrogenated petroleum naphtha, and solvent naphtha. These diluents can be used alone or in combination.

The amount of the diluent used may be appropriately selected from the amount such that the total solid content in the photosensitive resin composition is 50 to 90% by mass, 60 to 80% by mass, or 65 to 75% by mass. That is, when a diluent is used, the content of the diluent in the photosensitive resin composition may be appropriately selected from 10 to 50% by mass, 20 to 40% by mass, or 25 to 35% by mass. By controlling the amount of the diluent used within the above range, the coatability of the photosensitive resin composition improves, and it becomes possible to form a pattern with higher definition.

<Other additives>
The photosensitive resin composition of the present embodiment may optionally contain polymerization inhibitors such as hydroquinone, methylhydroquinone, hydroquinone monomethyl ether, catechol, and pyrogallol, thickeners such as bentone and montmorillonite, silicone-based, fluorine-based, Various known and commonly used additives such as vinyl resin antifoaming agents and silane coupling agents can be used. Furthermore, flame retardants such as brominated epoxy compounds, acid-modified brominated epoxy compounds, antimony compounds, phosphate compounds of phosphorous compounds, aromatic condensed phosphoric esters, halogen-containing condensed phosphoric esters, etc. can be used.

The photosensitive resin composition of this embodiment can be obtained by uniformly kneading and mixing the ingredients using a roll mill, bead mill, etc.

[Dry film]
The dry film of this embodiment has a carrier film and a photosensitive layer using the photosensitive resin composition of this embodiment.
The thickness of the photosensitive layer may be appropriately selected from 10 to 50 μm, 15 to 40 μm, or 20 to 30 μm.

The dry film of this embodiment can be produced by, for example, applying and drying the photosensitive resin composition of this embodiment onto a carrier film by a known method such as reverse roll coating, gravure roll coating, comma coating, curtain coating, etc. , a photosensitive layer can be formed and manufactured.
Examples of the carrier film include polyesters such as polyethylene terephthalate and polybutylene terephthalate, and polyolefins such as polypropylene and polyethylene. The thickness of the carrier film may be appropriately selected from the range of 5 to 100 μm. Further, in the dry film of the present embodiment, a protective layer can be laminated on the surface of the photosensitive layer opposite to the surface in contact with the carrier film. As the protective layer, for example, a polymer film such as polyethylene or polypropylene may be used. Further, a polymer film similar to the carrier film described above may be used, or a different polymer film may be used.
The coating film can be dried using hot air drying, a dryer using far infrared rays, or near infrared rays, and the drying temperature ranges from 60 to 120°C, 70 to 110°C, or 80 to 100°C. You can select it as appropriate. Further, the drying time may be appropriately selected from 1 to 60 minutes, 2 to 30 minutes, or 5 to 20 minutes.

[Printed wiring board]
The printed wiring board of this embodiment includes at least one of a surface protection film and an interlayer insulating film formed from the photosensitive resin composition of this embodiment.
Since the printed wiring board of this embodiment includes at least one of a surface protective film and an interlayer insulating film formed from the photosensitive resin composition of this embodiment, it has excellent adhesive strength with plated copper and excellent heat resistance. It has a pattern with excellent properties, low coefficient of thermal expansion, excellent resolution, and excellent adhesion to chip components. In addition, this pattern has excellent stability in forming hole diameters and pitches between holes, which have become finer due to recent miniaturization and higher performance of electronic devices.

[Manufacturing method of printed wiring board]
The method for manufacturing a printed wiring board of this embodiment includes a step of providing a photosensitive layer on a substrate using the photosensitive resin composition of this embodiment or a dry film of this embodiment, and forming a resin pattern using the photosensitive layer. and a step of curing the resin pattern to form at least one of a surface protective film and an interlayer insulating film.
Specifically, for example, it can be manufactured as follows.
First, a film of 10 to 200 μm, 15 to 150 μm, or 20 to 100 μm is coated on a metal-clad laminate such as a copper-clad laminate using a method such as screen printing, spraying, roll coating, curtain coating, or electrostatic coating. Alternatively, the photosensitive resin composition is coated with a film thickness appropriately selected from 23 to 50 μm, and then the coated film is dried at 60 to 110° C., or the dry film of this embodiment with the protective layer peeled off is used as described above. A photosensitive layer is provided on the substrate by thermally laminating the substrate using a laminator.
Next, a negative film is brought into direct contact with the photosensitive layer (or without contact via a transparent film such as a carrier film), and active light is applied at 10 to 2,000 mJ/cm ² or 100 to 1,500 mJ/cm. ² or 300 to 1,000 mJ/cm ² , and then the unexposed areas are dissolved and removed (developed) with a dilute alkaline aqueous solution to form a pattern. Examples of the active light used include electron beams, ultraviolet rays, and X-rays, with ultraviolet rays being preferred. Further, as a light source, a low pressure mercury lamp, a high pressure mercury lamp, an ultra-high pressure mercury lamp, a halogen lamp, etc. can be used.
Next, the exposed portion of the photosensitive layer is sufficiently cured by at least one of post-exposure (ultraviolet light exposure) and post-heating to form at least one of a surface protective film and an interlayer insulating film.
The exposure amount for post-exposure may be appropriately selected from 100 to 5,000 mJ/cm ² , 500 to 2,000 mJ/cm ² , or 700 to 1,500 J/cm ² .
The heating temperature for post-heating may be appropriately selected from 100 to 200°C, 120 to 180°C, or 135 to 165°C.
The heating time for post-heating may be appropriately selected from 5 minutes to 12 hours, 10 minutes to 6 hours, or 30 minutes to 2 hours.
Thereafter, a conductive pattern is formed by etching, and a printed wiring board is produced.

Moreover, a multilayer printed wiring board can also be manufactured using the photosensitive resin composition of this embodiment or the dry film of this embodiment. FIG. 1 is a schematic diagram showing one aspect of the manufacturing process of a multilayer printed wiring board using the cured product of the photosensitive resin composition of this embodiment as at least one of a surface protective film and an interlayer insulating film. A multilayer printed wiring board 100A shown in FIG. 1(f) includes a plurality of conductor patterns 107 in layers on a substrate having a conductor pattern 102 on the surface, an interlayer insulating film 103 between each layer, and a substrate having a conductor pattern 102 on the surface. The conductive pattern 102 is connected to the interlayer insulating film 103 and the conductive pattern 107 provided in the opening 104 , and a surface protective film 108 is provided on the surface of the conductive pattern 102 . At least one of them is formed using the photosensitive resin composition of this embodiment or the dry film of this embodiment. The multilayer printed wiring board 100A is obtained by, for example, laminating a copper clad laminate, an interlayer insulating material, a metal foil, etc., and forming a conductive pattern as appropriate by an etching method or a semi-additive method. Hereinafter, a method for manufacturing the multilayer printed wiring board 100A will be briefly explained based on FIG. 1.

First, interlayer insulating layers 103 are formed on both surfaces of a copper-clad laminate 101 having conductor patterns 102 on both surfaces (see FIG. 1(a)). The interlayer insulating film 103 is formed by applying the photosensitive resin composition of the present embodiment or thermally laminating the dry film of the present embodiment using a laminator, using the method described in the method for manufacturing a printed wiring board. A layer is formed, a negative film is used on the photosensitive layer, and areas other than those that need to be electrically connected to the outside (conductor patterns on other layers) are exposed and cured, and the unexposed areas are further exposed. (See FIG. 1(b)). This interlayer insulating film 103 is a film having an opening 104. Here, the smear (residue) existing around the opening 104 may be removed by desmear processing.

Next, the conductor pattern 107 is formed, for example, by forming a thin metal layer (seed layer), forming a resin pattern (plating resist), and then forming the conductor pattern 107 by electrolytic plating. It can be formed by a semi-additive method in which the resin pattern is removed and the seed layer is removed by etching. Specifically, a seed layer 105 is formed on the interlayer insulating film 103 and on the conductor pattern 102 in the opening 104 by electroless plating (see FIG. 1C). This seed layer 105 can be formed of plated copper, for example, by electroless copper plating. A photosensitive layer is formed on this seed layer 105 using a semi-additive photosensitive resin composition, a negative film is used for the photosensitive layer, and predetermined areas are exposed and developed to form a resin having a predetermined pattern. A pattern 106 is formed (see FIG. 1(d)). Next, a conductor pattern 107 is formed by electrolytic plating on a portion of the seed layer 105 where the resin pattern 106 is not formed, the resin pattern 106 is removed using a stripping solution, and the seed layer 105 is removed by etching (Fig. 1(e)). The operations shown in FIGS. 1(b) to 1(e) are repeated to form a conductive pattern 107 according to the desired number of layers, and a conductive pattern 107 is formed on the outermost surface by the cured product of the photosensitive resin composition according to the present embodiment. A surface protective film (permanent mask resist) 108 is formed, and a multilayer printed wiring board 100A can be manufactured (see FIG. 1(f)). Here, as the semi-additive photosensitive resin composition, for example, the photosensitive resin composition according to the present embodiment can be used.

In the thus obtained multilayer printed wiring board 100A, semiconductor elements are mounted at corresponding locations, and it is possible to ensure electrical connection.

Since the printed wiring board according to the present embodiment uses the photosensitive resin composition according to the present embodiment for at least one of the surface protection film and the interlayer insulating film, the features of the photosensitive resin composition, namely It enjoys excellent adhesive strength with plated copper, excellent resolution, and adhesion with chip components. In addition, with the trend toward smaller size and higher performance of electronic devices, there is a remarkable trend towards higher density due to narrower pitch of conductor patterns in semiconductor chips. Although the flip-chip connection method for bonding to a substrate has become mainstream, several problems have conventionally occurred as described below.
This flip-chip connection method is a semiconductor mounting method using a reflow method in which solder balls are placed between a substrate and a semiconductor chip, and the whole is heated and melted and bonded. Therefore, during solder reflow, the board itself is exposed to a high-temperature environment, and due to thermal contraction of the board, large stress is generated in the solder balls that connect the board and semiconductor, resulting in poor connection of conductor patterns, cracks in the surface protective film or underfill, etc. Cracks) may occur. Furthermore, when the substrate is exposed to a high-temperature environment, large stress is generated at the connection interface due to thermal expansion of the resin composition forming the surface protective film etc. provided on the substrate, sometimes resulting in connection failure. The photosensitive resin composition according to this embodiment has excellent adhesive strength with plated copper, excellent resolution, and adhesion with chip components, as well as excellent heat resistance and low coefficient of thermal expansion. , which has sufficient performance to solve these problems. Therefore, the printed wiring board according to this embodiment has high quality and is less likely to suffer from poor connection of conductor patterns, cracks in the surface protective film, etc.

Hereinafter, the objects and advantages of this embodiment will be explained in more detail based on Examples and Comparative Examples, but this embodiment is not limited to the following Examples.

(Synthesis Example 1; Synthesis of acid-modified vinyl group-containing epoxy resin (A1))
Bisphenol F novolac type epoxy resin (a) (EXA-7376, manufactured by DIC Corporation, bisphenol F novolac type epoxy containing a structural unit of general formula (II) in which Y ² is a glycidyl group and R ¹² is a hydrogen atom) 350 parts by mass of resin), 70 parts by mass of acrylic acid (b), 0.5 parts by mass of methylhydroquinone, and 120 parts by mass of carbitol acetate were heated to 90°C and stirred to react, and the mixture was completely dissolved. did. Next, the obtained solution was cooled to 60°C, 2 parts by mass of triphenylphosphine was added, and the mixture was heated to 100°C and reacted until the acid value of the solution became 1 mgKOH/g. 98 parts by mass of tetrahydrophthalic anhydride (THPAC) (c) and 850 parts by mass of carbitol acetate were added to the solution after the reaction, heated to 80° C., and reacted for 6 hours. Thereafter, the mixture was cooled to room temperature to obtain a THPAC-modified bisphenol F novolac type epoxy acrylate (epoxy resin (1)) as component (A1) having a solid content concentration of 73% by mass.

(Examples 1 to 6, Comparative Examples 1 to 5)
A composition was blended according to the formulation shown in Table 1 and kneaded in a three-roll mill to prepare a photosensitive resin composition. Carbitol acetate was added so that the solid content concentration was 60% by mass to obtain a photosensitive resin composition.

Details of each material in Table 1 are as follows.
- The epoxy resin (1) is the acid-modified vinyl group-containing epoxy resin (A1) obtained in Synthesis Example 1.
- The epoxy resin (2) is a novolac type epoxy resin ("UE-EXP-3165", manufactured by DIC Corporation, trade name) in which R ¹³ is a hydrogen atom and Y ³ is a glycidyl group in the general formula (III). This is an acid-modified vinyl group-containing epoxy resin (A2) in which glycidyl groups are acrylated and hydroxyl groups are modified with tetrahydrophthalic anhydride (THPAC) (weight average molecular weight: 3300, acid value: 42.4 mg/KOH).
・Aronix M402: Dipentaerythritol hexaacrylate (manufactured by Toagosei Co., Ltd., trade name)
・Irgacure 819: Bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide (manufactured by BASF, trade name)
・Irgacure 907: 2-methyl-[4-(methylthio)phenyl]morpholino-1-propanone (manufactured by BASF, trade name)
・SC2050-LNF: Silica particles (manufactured by Admatex Co., Ltd., trade name, average particle size: 0.5 μm)
・ASA: Barium sulfate particles (manufactured by Nippon Solvay Co., Ltd., trade name, average particle size: 1.0 μm)
・KBM-403: 3-glycidoxypropyltrimethoxysilane (manufactured by Shin-Etsu Silicone Co., Ltd., trade name)
・X-12-984S: Multifunctional epoxy silane (manufactured by Shin-Etsu Silicone Co., Ltd., trade name)
・Phthalocyanine pigment: Phthalocyanine pigment (manufactured by Sanyo Shiki Co., Ltd.)
・YSLV-80XY: Tetramethylbisphenol F type epoxy resin (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., trade name)
・RE-306: Novolak type polyfunctional epoxy resin (manufactured by Nippon Kayaku Co., Ltd., trade name)
・PB-3600: Epoxidized polybutadiene (manufactured by Daicel Corporation, product name)
・SP1108: Polyester resin (ESPEL 1108, manufactured by Hitachi Chemical Co., Ltd.)
・Melamine: Manufactured by Nissan Chemical Industries, Ltd.

Next, each evaluation was performed under the conditions shown below using the photosensitive resin composition obtained above. The evaluation results are shown in Table 2.

[Production of dry film]
A polyethylene terephthalate film (G2-16, manufactured by Teijin Ltd., trade name) with a thickness of 16 μm was used as a carrier film, and the photosensitive resin compositions of Examples and Comparative Examples were applied onto the carrier film so that the film thickness after drying was It was applied uniformly to a thickness of 25 μm and dried at 75° C. for 30 minutes using a hot air convection dryer to form a photosensitive layer. Next, a polyethylene film (NF-15, manufactured by Tamapoly Co., Ltd., trade name) (protective layer) was laminated on the surface of the photosensitive layer opposite to the side in contact with the carrier film, and a dry film was attached. Created.

[Evaluation of resolution]
A copper-clad laminate substrate (MCL-E-67, manufactured by Hitachi Chemical Co., Ltd.) with a thickness of 1.0 mm was coated with a continuous press vacuum laminator (MVLP-500, ( (manufactured by Meiki Seisakusho Co., Ltd., product number) under the specified laminating conditions (pressing pressure: 0.4 MPa, press hot plate temperature: 80 ° C., vacuuming time: 40 seconds, laminating press time: 20 seconds, atmospheric pressure: 4 kPa or less) to obtain a laminate having a photosensitive layer.
Next, a negative mask having a via pattern of a predetermined size (opening diameter size: 10, 20, 30, 40, 50, 60, 70, 80, 90, 100, 110, 120, 130, 140, 150, and 200 μmφ) is used. Exposure was carried out using an i-line exposure device (UX-2240SM-XJ-01, manufactured by Ushio Co., Ltd., product number) while changing the amount of light in 50 mJ/cm ² steps in the range of 100 to 500 mJ/cm ² . Thereafter, a 1% by mass sodium carbonate aqueous solution was sprayed at a pressure of 1.765 x 10 ⁵ Pa for a time equivalent to twice the shortest development time (minimum time for removing the unexposed areas of the photosensitive layer) at 30°C. It was developed, and the unexposed areas were developed by dissolving. Next, the cured product of the photosensitive resin composition was formed on the copper-clad laminate board in a via pattern of a predetermined size by exposing it to an exposure amount of 2000 mJ/cm ² using an ultraviolet exposure device and heating it at 170°C for 1 hour. A test piece having the following properties was prepared.
The above test piece was observed using a metallurgical microscope and evaluated based on the following criteria. The evaluation results are shown in Table 2.
A: The minimum diameter of the opening was 50 μm or less.
B: The minimum diameter of the opening exceeded 50 μm and was 100 μm or less.
C: The minimum diameter of the opening exceeded 100 μm.

[Evaluation of adhesive strength with plated copper]
A laminate having the photosensitive layer prepared in the above [Evaluation of resolution] was produced, and the laminate was exposed to 500 mJ/ The entire surface was exposed to light at 2000 mJ/cm ² using ^an ultraviolet exposure device, and heated at 170° C. for 1 hour to obtain a copper-clad laminate having a cured film of the photosensitive resin composition. . In order to chemically roughen the cured film, a swelling solution (diethylene glycol monobutyl ether: 200 ml/L, sodium hydroxide: 5 g/L aqueous solution) was prepared, heated to 70° C., and immersed for 10 minutes. Next, a roughening solution (potassium permanganate: 60 g/L, sodium hydroxide: 40 g/L aqueous solution) was prepared, heated to 70° C., and immersed for 15 minutes. Subsequently, an aqueous solution of neutralizing solution (tin chloride (SnCl ₂ ): 30 g/L, hydrogen chloride: 300 ml/L) was prepared, heated to 40°C and immersed for 5 minutes to reduce potassium permanganate. The cured film was then chemically roughened.
Next, an electroless plating catalyst (Activator Neogant 834, manufactured by Atotech Japan Co., Ltd., trade name) containing lead chloride (PdCl ₂ ) was heated to 35°C and immersed for 5 minutes to form electroless copper. It was immersed in a plating solution (Print Gant MSK-DK, manufactured by Atotech Japan Co., Ltd., trade name) for 15 minutes at room temperature, and further subjected to copper sulfate electrolytic plating. Thereafter, annealing treatment was performed at 180° C. for 60 minutes to form a conductor layer with a thickness of 35 μm, and a test piece was obtained. A region with a width of 10 mm and a length of 50 mm was formed on the conductor layer by treatment with a sulfuric acid/hydrogen etchant, and 10 mm of one end of this region was peeled off at the interface between the conductor layer (copper layer) and the cured resin film. Next, the peeled resin film was grasped with a grip, and the load (peel strength) when peeled off at room temperature at a pulling speed of 50 mm/min in the thickness direction (vertical direction) of the test piece was measured. The evaluation results are shown in Table 2. Here, in this specification, room temperature refers to 25°C.

[Evaluation of adhesion]
A laminate having a photosensitive layer was obtained in the same manner as described in [Evaluation of resolution] except that the copper-clad laminate substrate was replaced with a 6-inch silicon wafer (manufactured by Electronics End Materials Corporation). . The entire surface of the laminate was exposed to light at 500 mJ/cm ² using an i-line exposure device (UX-2240SM-XJ-01, manufactured by Ushio Co., Ltd., product number), and then exposed at 2000 mJ/cm ² using an ultraviolet exposure device. A silicon wafer having a cured film of the photosensitive resin composition was obtained by exposing to light at a certain amount and heating at 170° C. for 1 hour. After that, an Al stud (adhesive part diameter: 2.7 mm, P/N 901106, manufactured by Phototechnica Co., Ltd., trade name) with epoxy adhesive was placed vertically on the cured film, and heated in an oven at 150°C for 1 hour. A test piece was obtained by heat treatment for a period of time. The stud on the test piece was fixed to the chuck of a thin film adhesion strength measuring device (manufactured by Phototechnica Co., Ltd.), a force was applied perpendicularly to the cured film, and the subsequent state was evaluated based on the following criteria. The evaluation results are shown in Table 2.
A: The epoxy adhesive suffered cohesive failure.
B: Peeling occurred at the interface between the cured film and the silicon wafer.

[Measurement of thermal expansion coefficient and glass transition point]
The dry film prepared above was exposed on the entire surface at 500 mJ/cm ² using an i-line exposure device (UX-2240SM-XJ-01, manufactured by Ushio Co., Ltd., product number), and left to stand at room temperature (25°C) for 1 hour. After that, the polyethylene film was peeled off and spray-developed with a 1% by mass aqueous sodium carbonate solution at 30°C. Thereafter, ultraviolet irradiation was performed at 2 J/cm ² using an ultraviolet irradiation device (manufactured by Oak Seisakusho Co., Ltd.), and further heat treatment was performed at 170° C. for 60 minutes. Next, after cutting out a piece with a width of 3 mm and a length of 30 mm using a cutter knife, the polyethylene terephthalate film (carrier film) was peeled off to obtain a cured product for evaluating the coefficient of thermal expansion.
The thermal expansion coefficient in tensile mode was measured using a TMA device (SS6000, manufactured by Seiko Instruments Co., Ltd., product number). The tensile load was 5 g, the span (distance between chucks) was 15 mm, and the temperature increase rate was 10° C./min. First, a test piece was attached to the apparatus, heated from room temperature (25°C) to 160°C, and left for 15 minutes. Thereafter, it was cooled to -60°C and measured at a heating rate of 10°C/min from -60°C to 250°C to calculate the coefficient of thermal expansion and glass transition point. Table 2 shows the coefficient of thermal expansion and glass transition point.

From Table 2, the photosensitive resin compositions of the present embodiments of Examples 1 to 6 exhibit excellent performance in resolution, adhesive strength, and adhesion, and are particularly effective for surface protection films and interlayers in printed wiring boards. It was confirmed that the composition can be suitably used as an insulating film, a surface protective film in contact with a silicon material, and the like. On the other hand, the resin compositions of Comparative Examples 1 to 5 did not provide sufficient effects in terms of resolution, adhesive strength, and adhesion. Furthermore, from the results of the coefficient of thermal expansion and glass transition point, it was confirmed that the photosensitive resin composition of this embodiment has excellent heat resistance and a low coefficient of thermal expansion.

100A. Multilayer printed wiring board 102. Conductor pattern 103. Interlayer insulation film 104. Opening 105. Seed layer 106. Resin pattern 107. Conductor pattern 108. surface protective film

Claims (12)

(A) an acid-modified vinyl group-containing epoxy resin, (B) a photopolymerizable compound, (C) a photopolymerization initiator, (D) an inorganic filler, and (E) a silane compound; The content is 10 to 80% by mass based on the total solid content in the photosensitive resin composition,
The photopolymerizable compound (B) includes a compound having three or more ethylenically unsaturated bonds in the molecule,
The photopolymerization initiator (C) contains at least one selected from acetophenones and acylphosphine oxides,
The silane compound (E) is at least one selected from alkylsilane, alkoxysilane, vinylsilane, epoxysilane, aminosilane, acrylicsilane, methacrylsilane, mercaptosilane, sulfidesilane, isocyanatesilane, sulfursilane, styrylsilane, and alkylchlorosilane. be,
Photosensitive resin composition. The component (A) comprises at least one acid-modified vinyl group-containing epoxy resin (A1) formed using a bisphenol novolac type epoxy resin (a1), and an epoxy resin (a2) different from the epoxy resin (a1). The photosensitive resin composition according to claim 1, which contains at least one acid-modified vinyl group-containing epoxy resin (A2). The photosensitive resin composition according to claim 2, wherein the epoxy resin (a2) is at least one selected from a novolac type epoxy resin, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, and a triphenolmethane type epoxy resin. thing. The acid-modified vinyl group-containing epoxy resins (A1) and (A2) are resins (A1') obtained by reacting the epoxy resins (a1) and (a2) with a vinyl group-containing monocarboxylic acid (b), respectively. The photosensitive resin composition according to claim 2 or 3, which is a resin obtained by reacting (A2') with a saturated or unsaturated group-containing polybasic acid anhydride (c). Any one of claims 2 to 4, wherein the bisphenol novolac type epoxy resin (a1) has a structural unit represented by the following general formula (I) or a structural unit represented by the following general formula (II). The photosensitive resin composition according to item 1.

[In formula (I), R ¹¹ represents a hydrogen atom or a methyl group, and Y ¹ each independently represents a hydrogen atom or a glycidyl group. A plurality of R ^11s may be the same or different, and at least one of Y ^1s represents a glycidyl group. ]

[In formula (II), R ¹² represents a hydrogen atom or a methyl group, and Y ² each independently represents a hydrogen atom or a glycidyl group. A plurality of R ^12s may be the same or different, and at least one of Y ² represents a glycidyl group. ] The bisphenol novolac type epoxy resin (a1) has a structural unit represented by the general formula (I), and the epoxy resin (a2) has a structural unit represented by the following general formula (III). The photosensitive resin composition according to any one of claims 2 to 5, which contains a novolac type epoxy resin.

[In formula (III), R ¹³ represents a hydrogen atom or a methyl group, and Y ³ represents a hydrogen atom or a glycidyl group. ] The content of the (A) acid-modified vinyl group-containing epoxy resin, (B) photopolymerizable compound, (C) photopolymerization initiator, (D) inorganic filler, and (E) silane compound is based on the photosensitive resin composition. Claim 1: 5 to 60% by mass, 0.2 to 15% by mass, 0.1 to 10% by mass, 20 to 60% by mass, and 0.5 to 30% by mass, respectively, based on the total solid content in the solid content. The photosensitive resin composition according to any one of items 1 to 6. The photosensitive resin composition according to any one of claims 1 to 7, further comprising (F) a pigment. The photosensitive resin composition according to any one of claims 1 to 8, wherein the photopolymerization initiator (C) contains acetophenones and acylphosphine oxides. A dry film comprising a carrier film and a photosensitive layer using the photosensitive resin composition according to any one of claims 1 to 9. A printed wiring board comprising at least one of a surface protective film and an interlayer insulating film formed from the photosensitive resin composition according to any one of claims 1 to 9. A step of providing a photosensitive layer on a substrate using the photosensitive resin composition according to any one of claims 1 to 9 or the dry film according to claim 10, and forming a resin pattern using the photosensitive layer. and curing the resin pattern to form at least one of a surface protection film and an interlayer insulation film.