JP2024034308A - Positioning device, processing device, shape measuring device, positioning method, and article manufacturing method - Google Patents

Abstract

[Problem] To improve positioning accuracy. A positioning device includes a stage device operable to relatively position a tool and a workpiece in the directions of XYZ axes intersecting each other, and a stage device operable to relatively position a tool and a workpiece in the directions of the XYZ axes at a first position interlocking with the stage device. a first measuring device used to measure one translational amount and an inclination amount around the XYZ axes; and a second measuring device used to measure a second translational amount in the XYZ axis direction at a second position interlocking with the holding part. a second measuring device; a first process for correcting the value of the control amount of the stage device or the value of the first translation amount based on the measured value of the tilt amount and the set correction parameter; and the stage device a second process of setting the correction parameter based on the value of the first translation amount, the value of the second translation amount, and the value of the tilt amount when the is tilted around the XYZ axes. and an information processing unit that can perform the following steps. [Selection diagram] Figure 8

Description

The present disclosure relates to techniques for relatively positioning a tool and a workpiece.

2. Description of the Related Art In machines such as machine tools and measuring machines, tools and workpieces are relatively positioned using a stage device. When positioning is performed using a stage device, the position of a movable stage included in the stage device is measured using a measuring device. If there is a distance between the control point of the tool and the measurement point of the measuring device in the direction perpendicular to the processing direction or measurement direction, positional errors, so-called Abbe errors, may occur in the measurement results of the measuring device due to changes in the posture of the stage device. Occur. Even if measuring instruments, tools, etc. are arranged and designed so that the above distances are eliminated, positional deviations will occur due to assembly errors of machine tools and measuring instruments, so in order to achieve high-precision positioning, the stage It is necessary to reduce Abbe errors due to changes in the posture of the device.

Patent Document 1 discloses that Abbe's method is based on the value of posture change measured from the values of two laser length measuring devices during scanning of the optical probe, and the distance between the measurement point of the laser length measuring device and the measurement point of the optical probe. Calculating errors and correcting measurement results is disclosed.

Furthermore, Patent Document 2 discloses that the wafer surface of an exposure apparatus is tilted by a leveling mechanism, the positional deviation (Abbe error) of an alignment mark on the wafer surface is measured, and a correction coefficient is calculated based on a correlation curve of Abbe error with respect to the amount of tilt. It is disclosed that the information is calculated and used as a database. Patent Document 2 discloses that during positioning, a correction coefficient is determined based on the amount of inclination, and the detection value of the laser length measuring device is corrected.

Patent No. 3604996 Japanese Patent Application Publication No. 5-326364

However, the methods described in Patent Documents 1 and 2 do not provide sufficient positioning accuracy, and further improvement in positioning accuracy is desired.

The present disclosure aims to improve positioning accuracy.

According to a first aspect of the present disclosure, a positioning device includes a holding part that holds a tool, and positions the tool and the workpiece relatively in the directions of a first axis, a second axis, and a third axis that intersect with each other. a stage device operable to a first measuring device used to measure the amount of inclination around the two axes and the third axis; and directions of the first axis, the second axis, and the third axis at a second position interlocking with the holding part. A second measuring device used to measure the second translation amount of the stage device, and a value of the control amount of the stage device or the first translation amount based on the measured value of the tilt amount and the set correction parameter. a first process of correcting the value; and a value of the first translation amount and the second translation amount when the stage device is tilted around the first axis, the second axis, and the third axis. and a second process of setting the correction parameter based on the value of the inclination amount.

According to a second aspect of the present disclosure, the processing device includes a holding part that holds a processing tool, and the processing tool and the workpiece are moved relative to each other in the directions of a first axis, a second axis, and a third axis that intersect with each other. a stage device operable to position the stage device, a first translation amount in the direction of the first axis, the second axis, and the third axis at a first position that is interlocked with the stage device; and the first axis; a first measuring device used to measure the amount of inclination around the second axis and the third axis; and the first axis, the second axis, and the third axis at a second position interlocking with the holding part. a second measuring device used to measure a second translational amount in the direction; and a first measuring device that corrects the value of the control amount of the stage device based on the measured value of the tilt amount and a set correction parameter. processing, and when the stage device is tilted around the first axis, the second axis, and the third axis, the value of the first translation amount, the value of the second translation amount, and the value of the tilt amount. The present invention is characterized by comprising an information processing unit that can selectively execute a second process of setting the correction parameter based on a value.

According to a third aspect of the present disclosure, the shape measuring device includes a holding part that holds a probe, and the probe and the object to be measured are moved relative to each other in the directions of a first axis, a second axis, and a third axis that intersect with each other. a stage device operable to position the stage device; a first translational amount in the direction of the first axis, the second axis, and the third axis at a first position in conjunction with the stage device; and the first axis , a first measuring device used to measure the amount of inclination around the second axis and the third axis, and the first axis, the second axis, and the third axis at a second position interlocking with the holding part. a second measuring device used to measure a second translational amount in the direction of the axis; and a first measuring device that corrects the value of the first translational amount based on the measured value of the tilt amount and a set correction parameter. processing, and when the stage device is tilted around the first axis, the second axis, and the third axis, the value of the first translation amount, the value of the second translation amount, and the value of the tilt amount. The present invention is characterized by comprising an information processing unit that can selectively execute a second process of setting the correction parameter based on a value.

According to a fourth aspect of the present invention, the positioning method includes a holding part that holds a tool, and positions the tool and the workpiece relatively in the directions of a first axis, a second axis, and a third axis that intersect with each other. a stage device operable to a first measuring device used to measure the amount of inclination around the two axes and the third axis; and directions of the first axis, the second axis, and the third axis at a second position interlocking with the holding part. a second measuring device used to measure a second translation amount of the stage device, and when the stage device is tilted around the first axis, the second axis, and the third axis, Setting a correction parameter based on the value of the first translation amount, the value of the second translation amount, and the value of the tilt amount, and controlling the stage device based on the measured value of the tilt amount and the correction parameter. The method is characterized in that the value of the amount or the value of the first translation amount is corrected.

According to the present disclosure, positioning accuracy is improved.

FIG. 1 is an explanatory diagram of a processing device that is an example of a positioning device according to an embodiment. FIG. 2 is a view of the main body of the processing device according to the embodiment as viewed in the X-axis direction. FIG. 3 is an enlarged view of the arrangement location of the laser length measuring device according to the embodiment. FIG. 3 is an explanatory diagram of an Abbe error when the Z stage according to the embodiment changes its posture. FIG. 3 is an explanatory diagram of an Abbe error when the Z stage according to the embodiment changes its posture. FIG. 3 is an explanatory diagram of an Abbe error when the Z stage according to the embodiment changes its posture. FIG. 3 is a control block diagram of control according to the embodiment. FIG. 3 is an explanatory diagram of the processing device when acquiring correction parameters according to the embodiment. 7 is a flowchart of setting processing according to the embodiment. FIG. 3 is an explanatory diagram of a state in which the posture of the stage device according to the embodiment has been changed. FIG. 3 is an explanatory diagram of a state in which the posture of the stage device according to the embodiment has been changed. FIG. 3 is an explanatory diagram of a state in which the posture of the stage device according to the embodiment has been changed.

Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the drawings. FIG. 1 is an explanatory diagram of a processing device 10 that is an example of a positioning device according to an embodiment. The processing apparatus 10 includes an apparatus main body 100, an electrical equipment rack 116, a control computer 117, and a data processing computer 118. FIG. 2 is a diagram of the apparatus main body 100 of the processing apparatus 10 according to the embodiment viewed in the X-axis direction. The direction of the X-axis, the direction of the Y-axis, and the direction of the Z-axis are directions that intersect with each other, and in this embodiment, they are directions that are orthogonal to each other. The X axis is an example of the first axis. The Y-axis is an example of the second axis. The Z axis is an example of the third axis. Hereinafter, the direction of the X axis will be referred to as the X direction, the direction of the Y axis will be referred to as the Y direction, and the direction of the Z axis will be referred to as the Z direction. Furthermore, hereinafter, the three axes, the X axis, the Y axis, and the Z axis, are also referred to as the XYZ axes. Further, hereinafter, the three directions of the X direction, the Y direction, and the Z direction are also referred to as the XYZ directions. The X direction and the Y direction are horizontal directions, and the Z direction is also a vertical direction.

The apparatus main body 100 includes a surface plate 101 and a work table 103 on which a work W to be processed is mounted. The work table 103 is fixedly arranged on the surface plate 101. Further, the apparatus main body 100 includes a stage apparatus 102, a holder 112, and a measuring device 113.

The measuring device 113 is an example of a first measuring device. The measuring device 113 includes a Z length measurement reference mirror 104, a Y length measurement reference mirror 105, and an X length measurement reference mirror 106. The Z length measurement reference mirror 104, the Y length measurement reference mirror 105, and the X length measurement reference mirror 106 are coupled to the surface plate 101 with highly accurate orthogonality.

The stage device 102 includes a stage base 110, an X stage 108, a Y stage 109, and a Z stage 107. Stage surface plate 110 is arranged on surface plate 101. In this embodiment, a Y stage 109 is arranged on the stage base 110, an X stage 108 is arranged on the Y stage 109, and a Z stage 107 is arranged on the X stage 108. Therefore, the Y stage 109 is supported by the stage base 110 so as to be movable in the Y direction with respect to the stage base 110. Further, the X stage 108 is supported by the Y stage 109 so as to be movable in the X direction relative to the Y stage 109. Further, the Z stage 107 is supported by the X stage 108 so as to be movable in the Z direction with respect to the X stage 108. As a result, the X stage 108 moves in the X direction relative to the X length measurement reference mirror 106. Further, the Y stage 109 moves in the Y direction relative to the Y length measurement reference mirror 105. Further, the Z stage 107 moves in the Z direction relative to the Z length measurement reference mirror 104.

A holder 112 is arranged on the Z stage 107. The holder 112 is configured to be able to hold the machining tool 111 and a displacement measurement target 120 (FIG. 8), which will be described later. The processing tool 111 is, for example, a tool such as an end mill or a drill. Holder 112 is an example of a holding section. The processing tool 111 is an example of a tool. The holder 112 and the processing tool 111 are interlocked with the Z stage 107 that moves in the XYZ directions.

With the above configuration, the stage device 102 is operable to position the processing tool 111 relative to the workpiece W in the XYZ-axis directions. Note that the stage device 102 is not limited to the above-described configuration, and may be operable to relatively position the processing tool 111 and the workpiece W in the XYZ-axis directions.

Furthermore, the measuring device 113 includes a plurality of laser length measuring devices 113a to 113f. The laser length measuring devices 113a to 113f are mounted on the top surface of the Z stage 107. The laser length measurement devices 113a to 113f are used to measure the relative position and orientation of the processing tool 111 with respect to the Z length measurement reference mirror 104, the Y length measurement reference mirror 105, and the X length measurement reference mirror 106. The measuring device 113 is isolated from the machining space including the machining tool 111 and the workpiece W, and is placed in a position where chips and machining fluid do not affect position measurement.

The device main body 100 also includes a tilting mechanism 114. The tilt mechanism 114 is a mechanism that tilts the stage device 102 around the XYZ axes. The tilting mechanism 114 can change the attitude of the stage device 102, that is, the Z stage 107, by tilting the stage device 102. The direction of inclination around the X axis, that is, the direction of rotation, is referred to as the θx direction. Further, the direction of inclination around the Y axis, that is, the direction of rotation is referred to as the θy direction. Further, the direction of inclination around the Z axis, that is, the direction of rotation, is referred to as the θz direction.

The tilting mechanism 114 includes air mounts 114a to 114c and air cylinders 115a and 115b. By moving the stage base 110 in the Z direction using the air mounts 114a to 114c, the attitude of the processing tool 111 can be changed in the θx direction and the θy direction. Furthermore, during normal machining of the workpiece W, by placing the air mounts 114a to 114c in a seated state, the posture fluctuation of the machining tool 111 can be made as small as possible. Further, by moving the stage base 110 in the Y direction using the air cylinders 115a and 115b, the attitude of the processing tool 111 can be changed in the θz direction.

The electrical equipment rack 116 has a driver for moving the Z stage 107, the X stage 108, and the Y stage 109.

The control computer 117 is loaded with a program that outputs position commands for the Z stage 107, the X stage 108, the Y stage 109, the air mounts 114a to 114c, and the air cylinders 115a and 115b to each driver. Furthermore, the control computer 117 is also equipped with a program that reads the scales of each stage 107 to 109 and the values of the laser length measuring devices 113a to 113f.

The data processing computer 118 manages each parameter of machining conditions, and is equipped with a program that creates machining procedure data from parameters such as machining shape, machining range, and machining speed, and sends the data to the control computer 117. ing. Further, the data processing computer 118 is equipped with a data import program for importing the scales of each stage 107 to 109 and the values of the laser length measuring devices 113a to 113f from the control computer 117. Furthermore, the data processing computer 118 is equipped with a correction program that corrects the position command values for each stage 107 to 109 using the imported values of the laser length measuring devices 113a to 113f and correction parameters to be described later. are doing.

FIG. 3 is an enlarged view of the arrangement locations of the laser length measuring devices 113a to 113f in the apparatus main body 100 shown in FIG. The laser length measuring devices 113a to 113f are arranged at predetermined portions of the upper surface of the Z stage 107 of the stage device 102. The positions of the measurement points of the laser length measuring devices 113a to 113f change in three-dimensional space in conjunction with changes in the posture of a predetermined portion of the stage device 102 (that is, the Z stage 107) in which the laser length measuring devices 113a to 113f are arranged. do. Each position of the measurement point of the laser length measuring devices 113a to 113c is defined as a position 107a. Each position 107a is an example of a first position. Further, the measurement points of the laser length measuring devices 113a to 113f are, for example, laser light receiving sections.

The laser length measurement device 113c is arranged to face the X length measurement reference mirror 106 in the X direction, and measures the relative distance dx1 of the laser length measurement device 113c in the X direction with respect to the X length measurement reference mirror 106. The laser length measuring device 113b is arranged to face the Y length measurement reference mirror 105 in the Y direction, and measures the relative distance dy1 of the laser length measuring device 113b in the Y direction with respect to the Y length measurement reference mirror 105. The laser length measurement device 113a is arranged to face the Z length measurement reference mirror 104 in the Z direction, and measures the relative distance dz of the laser length measurement device 113a in the Z direction with respect to the Z length measurement reference mirror 104.

The laser length measuring device 113e is arranged at a distance S_θy in the Z direction with respect to the laser length measuring device 113c, and is arranged opposite to the X length measurement reference mirror 106 in the X direction. The relative distance dx2 in the X direction of the laser length measuring device 113e to the distance dx2 is measured. The laser length measuring device 113d is arranged at a distance S_θx in the Z direction with respect to the laser length measuring device 113b, and is arranged opposite to the Y length measurement reference mirror 105 in the Y direction. The relative distance dy2 in the Y direction of the laser length measuring device 113d to the distance dy2 is measured. The laser length measuring device 113f is arranged at a distance S_θz in the Y direction with respect to the laser length measuring device 113c, and is arranged opposite to the X length measurement reference mirror 106 in the X direction. The relative distance dx3 in the X direction of the laser length measuring device 113f to the distance dx3 is measured.

Here, the laser length measuring device 113c is an example of a first laser length measuring device, the laser length measuring device 113b is an example of a second laser length measuring device, and the laser length measuring device 113a is an example of a third laser length measuring device. This is an example. Further, the laser length measuring device 113e is an example of a fourth laser length measuring device, the laser length measuring device 113d is an example of a fifth laser length measuring device, and the laser length measuring device 113f is an example of a sixth laser length measuring device. It is. Further, the X length measurement reference mirror 106 is an example of a first mirror, the Y length measurement reference mirror 105 is an example of a second mirror, and the Z length measurement reference mirror 104 is an example of a third mirror.

In this embodiment, the data processing computer 118 measures the relative position of the control point (processing point) of the processing tool 111 with respect to the mirrors 104 to 106 using the laser length measuring devices 113a to 113c. The control point (processing point) of the processing tool 111 is, for example, the tip of the processing tool 111. The position 111a of the control point of the processing tool 111 changes in conjunction with the change in the attitude of the Z stage 107, that is, the holder 112, in the three-dimensional space. The position 111a of the control point of the processing tool 111 is an example of the second position.

The position 111a of the control point of the processing tool 111 is shifted from the position 107a of the measurement point of each laser length measuring device 113a to 113c in the X, Y, and Z directions. Therefore, when the processing apparatus 10 of FIG. 1 processes the workpiece W, an Abbe error occurs due to a change in the posture of the Z stage 107. Therefore, in this embodiment, the Abbe error caused by the attitude change of the Z stage 107 is measured using the laser length measuring devices 113a to 113c and the laser length measuring devices 113d to 113f. 4, 5, and 6 are explanatory diagrams of Abbe errors that occur due to changes in the posture of the Z stage 107 when the processing apparatus 10 of FIG. 1 processes the workpiece W.

FIG. 4 is an explanatory diagram of the Abbe error when the Z stage 107 changes its posture by a posture change amount Δθx around the X-axis while moving. There is a distance Lz1 in the Z direction between the measurement point of the laser length measuring device 113b and the control point (processing point) of the processing tool 111. Further, there is a distance Ly1 in the Y direction between the measurement point of the laser length measuring device 113a and the control point (processing point) of the processing tool 111. At this time, the attitude change amount Δθx causes an Abbe error Ey1=Lz1·Δθx in the Y direction, and an Abbe error Ez1=Ly1·Δθx in the Z direction. Therefore, the position 107a of the measurement point of the laser length measuring device 113b is shifted from the position 111a of the control point of the processing tool 111 by the Abbe error Ey1. Further, the position 107a of the measurement point of the laser length measuring device 113a is shifted from the position 111a of the control point of the processing tool 111 by an Abbe error Ez1.

FIG. 5 is an explanatory diagram of the Abbe error when the Z stage 107 changes its posture by a posture change amount Δθy around the Y axis while moving. There is a distance Lz2 in the Z direction between the measurement point of the laser length measuring device 113c and the control point (processing point) of the processing tool 111. Further, there is a distance Lx1 in the X direction between the measurement point of the laser length measuring device 113a and the control point (processing point) of the processing tool 111. At this time, the attitude change amount Δθy causes an Abbe error Ex1=Lz2·Δθy in the X direction, and an Abbe error Ez2=Lx1·Δθy in the Z direction. Therefore, the position 107a of the measurement point of the laser length measuring device 113c is shifted from the position 111a of the control point of the processing tool 111 by the Abbe error Ex1. Further, the position 107a of the measurement point of the laser length measuring device 113a is shifted from the position 111a of the control point of the processing tool 111 by an Abbe error Ez2.

FIG. 6 is an explanatory diagram of the Abbe error when the Z stage 107 changes its posture by a posture change amount Δθz around the Z axis while moving. There is a distance Lx2 in the X direction between the measurement point of the laser length measuring device 113b and the control point (processing point) of the processing tool 111. Further, there is a distance Ly2 in the Y direction between the measurement point of the laser length measuring device 113c and the control point (processing point) of the processing tool 111. At this time, an Abbe error Ey2=Lx2·Δθz occurs in the Y direction and an Abbe error Ex2=Ly2·Δθz occurs in the X direction due to the attitude change amount Δθz. Therefore, the position 107a of the measurement point of the laser length measuring device 113b is shifted from the position 111a of the control point of the processing tool 111 by the Abbe error Ey2. Furthermore, the position 107a of the measurement point of the laser length measuring device 113c is shifted from the position 111a of the control point of the processing tool 111 by an Abbe error Ex2.

Let Δdy1 be the amount of change in the output value dy1 of the laser length measuring device 113b, and Δdy2 be the amount of change in the output value dy2 of the laser length measuring device 113d. The data processing computer 118 calculates the attitude change amount Δθx of the Z stage 107 around the X axis, that is, the relative attitude of the processing tool 111 with respect to the Y length measurement reference mirror 105, by calculating Δθx=(Δdy1−Δdy2)/S_θx. Measure the amount of change Δθx.

Further, the amount of change in the output value dx1 of the laser length measuring device 113c is assumed to be Δdx1, and the amount of change in the output value dx2 of the laser length measuring device 113e is assumed to be Δdx2. The data processing computer 118 calculates the attitude change amount Δθy around the Y axis, that is, the attitude change amount Δθy relative to the X length measurement reference mirror 106, by calculating Δθy=(Δdx1−Δdx2)/S_θy. measure.

Further, the amount of change in the output value dx1 of the laser length measuring device 113c is assumed to be Δdx1, and the amount of change in the output value dx3 of the laser length measuring device 113f is assumed to be Δdx3. The data processing computer 118 calculates the attitude change amount Δθz around the Z axis, that is, the relative attitude change amount Δθz of the processing tool 111 with respect to the X length measurement reference mirror 106, by calculating Δθz=(Δdx1−Δdx3)/S_θz. It is being measured.

The above six types of Abbe errors Ex1, Ey1, Ez1, Ex2, Ey2, and Ez2 are summarized as follows.
・Abbe error when the attitude of the stage 107 changes in the θx direction Ey1 = Lz1・Δθx
Ez1 = Ly1・Δθx
・Abbe error when the attitude of the stage 107 changes in the θy direction Ex1 = Lz2・Δθy
Ez2 = Lx1・Δθy
・Abbe error when the attitude of the stage 107 changes in the θz direction Ey2 = Lx2・Δθz
Ex2 = Ly2・Δθz

As described above, by arranging the laser length measuring devices 113a to 113f in the configuration shown in FIG. 3, the attitude change of the stage 107 can be calculated as follows.
Δθx=(Δdy1−Δdy2)/S_θx
Δθy=(Δdx1−Δdx2)/S_θy
Δθz=(Δdx1-Δdx3)/S_θz

Therefore, the Abbe error caused by the attitude change of the stage 107 can be calculated as follows using the changes Δdy1, Δdy2, Δdx1, Δdx2, Δdx3 in the output values of the laser length measuring devices 113b, 113d, 113c, 113e, and 113f. expressed.
Ey1=(Lz1/S_θx)・(Δdy1−Δdy2)
Ez1=(Ly1/S_θx)・(Δdy1−Δdy2)
Ex1=(Lz2/S_θy)・(Δdx1−Δdx2)
Ez2=(Lx1/S_θy)・(Δdx1−Δdx2)
Ey2=(Lx2/S_θz)・(Δdx1−Δdx3)
Ex2=(Ly2/S_θz)・(Δdx1−Δdx3)

From the above formula, by determining (Lz1/S_θx), (Ly1/S_θx), (Lz2/S_θy), (Lx1/S_θy), (Lx2/S_θz), and (Ly2/S_θz) as correction parameters, the laser Abbe error (Ex1, Ex2, Ey1, Ey2, Ez1, Ez2) is determined from the amount of change (Δdx1, Δdx2, Δdx3, Δdy1, Δdy2) of the output values of the length measuring devices 113c, 113e, 113f, 113b, 113d with respect to the reference. be able to. The reference is, for example, the output value of the laser length measuring devices 113c, 113e, 113f, 113b, and 113d at the start of processing (measurement).

FIG. 7 is a control block diagram of control according to the embodiment. The control block shown in FIG. 7 includes a subtracter 705, a subtracter 706, a PID control section 701, a driver 702, a stage 703, and an Abbe correction section 704.

Here, the data processing computer 118 functions as an information processing unit that can selectively execute measurement processing and setting processing. The measurement process is an example of the first process, and the setting process is an example of the second process. The data processing computer 118 (information processing unit) includes a subtracter 705, a subtractor 706, and an Abbe correction unit 704 as functions for executing measurement processing. The setting process will be described later.

The PID control unit 701 is a function of the control computer 117. The driver 702 is mounted on the electrical equipment rack 116. Stage 703 corresponds to Z stage 107, X stage 108, and Y stage 109.

The subtractor 705 updates the XYZ-axis position command value for the stage 703 before the update by subtracting the XYZ-axis correction value, and outputs the updated XYZ-axis position command value to the subtractor 706. The subtracter 706 calculates the difference between the updated XYZ-axis position command values and the output values of the laser length measuring devices 113a, 113b, and 113c. The PID control unit 701 determines the XYZ-axis command values that cancel out the three difference values, and outputs the determined XYZ-axis command values to the driver 702. The driver 702 supplies voltage to the motors of the stage 703 based on the received XYZ-axis command values.

The Abbe correction unit 704 calculates the Abbe error ( Ex1, Ex2, Ey1, Ey2, Ez1, Ez2) are calculated. The correction value corresponding to the X-axis position command value is (Ex1+Ex2), the correction value corresponding to the Y-axis position command value is (Ey1+Ey2), and the correction value corresponding to the Z-axis position command value is , (Ez1+Ez2). In this way, the Abbe correction unit 704 generates correction values for the XYZ axes (Ex1+Ex2, Ey1+Ey2, Ez1+Ez2).

The correction parameters used in the arithmetic processing in the Abbe correction unit 704 use data set in advance in a storage device (not shown), such as the storage of the data processing computer 118.

Here, when calculating the correction parameters using the design values of the distances Lx1, Lx2, Ly1, Ly2, Lz1, Lz2 and the design values of the distances S_θx, S_θy, S_θz, the distances Lx1, Lx2, Ly1, Ly2, Lz1, Lz2 Since the design values of the distances S_θx, S_θy, and S_θz have a large error from the actual values, the accuracy of the obtained correction parameters is low. Therefore, in the present embodiment, the data processing computer 118 functioning as an information processing unit acquires correction parameters with higher precision in the following setting process and sets them in a storage device (not shown).

FIG. 8 is an explanatory diagram of the processing device 10 when acquiring correction parameters according to the embodiment. A measuring device 122 shown in FIG. 8 is placed in place of the processing tool 111, work W, and work table 103 shown in FIG. The measuring device 122 is an example of a second measuring device.

The measurement device 122 includes a displacement measurement target 120 and a plurality of displacement sensors 121a to 121c. The displacement sensors 121a to 121c are mounted on the displacement sensor base 119. The displacement sensor surface plate 119 is mounted on the surface plate 101. The displacement measurement target 120 is an example of a member to be measured, and is attached to the holder 112. The displacement measurement target 120 is detachably held in the holder 112 so that the position of the mark for aligning the measurement points of the displacement sensors 121a to 121c matches the position 111a of the control point. The tip of the displacement measurement target 120 is configured to be measurable by displacement sensors 121a to 121c, such as a reflective mirror provided with alignment marks.

The displacement sensor 121c is used to measure the amount of displacement of the displacement measurement target 120 in the X direction with respect to the reference position. The displacement sensor 121b is used to measure the amount of displacement of the displacement measurement target 120 in the Y direction with respect to the reference position. The displacement sensor 121a is used to measure the amount of displacement of the displacement measurement target 120 with respect to the reference position in the Z direction. The displacement sensor 121c is arranged facing the tip of the displacement measurement target 120 in the X direction. The displacement sensor 121b is arranged facing the tip of the displacement measurement target 120 in the Y direction. The displacement sensor 121a is arranged facing the tip of the displacement measurement target 120 in the Z direction. The displacement sensor 121c is an example of a first displacement sensor, the displacement sensor 121b is an example of a second displacement sensor, and the displacement sensor 121a is an example of a third displacement sensor.

When aligning the displacement sensors 121a to 121c to the displacement measurement target 120, the measurement points of the displacement sensors 121a to 121c are aligned to the alignment marks. In order to obtain correction parameters with high precision, it is preferable that this alignment precision is higher.

Next, a flow for acquiring correction parameters using the processing apparatus 10 shown in FIG. 8 will be described. FIG. 9 is a flowchart of setting processing 900 according to the embodiment. Setting processing 900 represents processing for acquiring correction parameters. 10 to 12 are explanatory diagrams of the state in which the attitude of the stage device 102 according to the embodiment has been changed from the standard attitude to an inclined attitude.

In step S901, the data processing computer 118 supplies air to the air mounts 114a to 114c to change the posture of the stage device 102 by an amount of posture change in the θx direction from the seated posture (reference posture), as shown in FIG. Change only Δθx.

After changing the attitude of the stage device 102 by the attitude change amount Δθx in the θx direction, in step S902, the data processing computer 118 detects changes in the output values of the laser length measuring devices 113b, 113a, and 113d in the Y direction and the Z direction. The values of the amounts Δdy1, Δdz, and Δdy2 and the values of the displacement amounts Δhy and Δhz of the output values of the displacement sensors 121b and 121a are acquired.

The data processing computer 118 then
・Abbe error Ey1=Δdy1−Δhy
・Abbe error Ez1=Δdz−Δhz
・Δdy1−Δdy2
seek.

Here, as shown in FIG. 10, Δdy1 is the amount of change in the output value of the laser length measuring device 113b, Δdy2 is the amount of change in the output value of the laser length measuring device 113d, and Δdz is the change in the output value of the laser length measuring device 113a. Δhy is the amount of change (amount of displacement) in the output value of the displacement sensor 121b, and Δhz is the amount of change (amount of displacement) in the output value of the displacement sensor 121a.

After the measurement, the data processing computer 118 exhausts air from the air mounts 114a to 114c, and returns the posture of the stage device 102 to the sitting posture (reference posture).

Next, in step S903, the data processing computer 118 supplies air to the air mounts 114a to 114c to change the posture of the stage device 102 from the sitting posture (reference posture) to the θy direction, as shown in FIG. Change the amount of change Δθy.

After changing the attitude of the stage device 102 by the attitude change amount Δθy in the θy direction, in step S904, the data processing computer 118 detects changes in the output values of the laser length measuring devices 113c, 113a, and 113e in the X direction and the Z direction. The values of the amounts Δdx1, Δdz, and Δdx2 and the values of the displacement amounts Δhx and Δhz of the output values of the displacement sensors 121c and 121a are acquired.

The data processing computer 118 then
・Abbe error Ex1=Δdx1−Δhx
・Abbe error Ez2=Δdz−Δhz
・Δdx1-Δdx2
seek.

Here, as shown in FIG. 11, Δdx1 is the amount of change in the output value of the laser length measuring device 113c, Δdx2 is the amount of change in the output value of the laser length measuring device 113e, and Δdz is the change in the output value of the laser length measuring device 113a. Δhx is the amount of change (amount of displacement) in the output value of the displacement sensor 121c, and Δhz is the amount of change (amount of displacement) in the output value of the displacement sensor 121a.

After the measurement, the data processing computer 118 exhausts air from the air mounts 114a to 114c, and returns the posture of the stage device 102 to the sitting posture (reference posture).

Next, in step S905, the data processing computer 118 supplies air to the air mounts 114a to 114c to levitate the stage base 110 and drive the air cylinders 115a and 115b in the Y direction, as shown in FIG. , the posture of the stage device 102 is changed from the sitting posture (reference posture) in the θz direction by the posture change amount Δθz.

After changing the attitude of the stage device 102 in the θz direction by the attitude change amount Δθz, in step S906, the data processing computer 118 changes the output values of the laser length measuring devices 113b, 113c, and 113f in the X direction and the Y direction. The values of the amounts Δdy1, Δdx1, and Δdx3 and the values of the displacement amounts Δhx and Δhy of the output values of the displacement sensors 121c and 121b are acquired.

The data processing computer 118 then
・Abbe error Ey2=Δdy1−Δhy
・Abbe error Ex2=Δdx1−Δhx
・Δdx1-Δdx3
seek.

Here, as shown in FIG. 12, Δdx1 is the amount of change in the output value of the laser length measuring device 113c, Δdx3 is the amount of change in the output value of the laser length measuring device 113f, and Δdy1 is the amount of change in the output value of the laser length measuring device 113b. Δhx is the amount of change (amount of displacement) in the output value of the displacement sensor 121c, and Δhy is the amount of change (amount of displacement) in the output value of the displacement sensor 121b.

Next, in step S907, the data processing computer 118 calculates the Abbe errors Ex1, Ex2, Ey1, Ey2, Ez1, Ez2 in the XYZ directions obtained in steps S901 to S906, and the laser length measuring devices 113c, 113e, 113f, 113b, The following six correction parameters are calculated that connect the amount of change in the output value of 113d (Δdx1, Δdx2, Δdx3, Δdy1, Δdy2).
(Lz1/S_θx)=Ey1/(Δdy1−Δdy2)
=(Δdy1-Δhy)/(Δdy1-Δdy2)
(Ly1/S_θx)=Ez1/(Δdy1−Δdy2)
=(Δdz−Δhz)/(Δdy1−Δdy2)
(Lz2/S_θy)=Ex1/(Δdx1−Δdx2)
=(Δdx1-Δhx)/(Δdx1-Δdx2)
(Lx1/S_θy)=Ez2/(Δdx1−Δdx2)
=(Δdz−Δhz)/(Δdx1−Δdx2)
(Lx2/S_θz)=Ey2/(Δdx1−Δdx3)
= (Δdy1-Δhy)/(Δdx1-Δdx3)
(Ly2/S_θz)=Ex2/(Δdx1−Δdx3)
=(Δdx1-Δhx)/(Δdx1-Δdx3)

Note that the correction parameters may be determined after determining the Abbe errors Ex1, Ex2, Ey1, Ey2, Ez1, Ez2, but the values of the amount of change (Δdx1, Δdy1, Δdz) and the amount of displacement (Δhx, Δhy, Δhz) The correction parameters may be determined directly from the values of the values and the slope amounts (Δdx1-Δdx2, Δdy1-Δdy2, Δdx1-Δdx3).

In this way, in the setting process, the data processing computer 118 calculates the values of the amount of change (Δdx1, Δdy1, Δdz) and the amount of displacement (Δhx, Δhy, Δhz) when the stage device 102 is tilted around the XYZ axes. The correction parameters (Lz1/S_θx, Ly1/S_θx, Lz2/S_θy, Lx1/S_θy, Lx2/S_θz, Ly2/ S_θz). The amount of change (Δdx1, Δdy1, Δdz) is an example of the first amount of translation, and the amount of displacement (Δhx, Δhy, Δhz) is an example of the second amount of translation.

The correction parameters (Lz1/S_θx, Ly1/S_θx, Lz2/S_θy, Lx1/S_θy, Lx2/S_θz, Ly2/S_θz) obtained by the above calculation are recorded (set) in a storage device (not shown) of the data processing computer 118. ) to be done.

The posture change amounts Δθx, Δθy, and Δθz that are changed in the θx, θy, and θz directions in steps S901, S903, and S905, respectively, are about five times as large as the posture change amount of the Z stage 107 when the stage device 102 is driven during processing. It is preferable to set it to . This makes it possible to magnify the Abbe error and detect it, making it possible to obtain correction parameters with higher accuracy. Therefore, the processing apparatus 10 preferably includes a tilting mechanism 114 that includes air mounts 114a to 114c and air cylinders 115a and 115b that can change the attitude of the stage apparatus 102 by a larger amount.

As explained above, the measuring device 113 measures the amount of change in the direction of the XYZ axes (Δdx1, Δdy1, Δdz) and the amount of inclination around the XYZ axes (Δdx1−Δdx2) at the position 107a of the measurement point of the laser length measuring devices 113a to 113c. , Δdy1-Δdy2, Δdx1-Δdx3).

That is, the data processing computer 118 measures the amount of change Δdx1 based on the measurement result of the laser length measurement device 113c, measures the amount of change Δdy1 based on the measurement result of the laser length measurement device 113b, and measures the amount of change Δdy1 based on the measurement result of the laser length measurement device 113b. Based on the measurement results, the amount of change Δdz is obtained.

Furthermore, the data processing computer 118 obtains the amount of inclination (Δdx1−Δdx2) based on the measurement results of the laser length measuring device 113c and the laser length measuring device 113e, and obtains the inclination amount (Δdx1−Δdx2) of the laser length measuring device 113b and the laser length measuring device The amount of inclination (Δdy1-Δdy2) is obtained based on the measurement results, and the amount of inclination (Δdx1-Δdx3) is obtained based on the measurement results of the laser length measuring device 113c and the laser length measuring device 113f.

In the measurement process, the data processing computer 118 uses the values of the inclination amounts (Δdx1-Δdx2, Δdy1-Δdy2, Δdx1-Δdx3) measured using the measuring device 113 and the set correction parameters (Lz1/S_θx, Ly1/S_θx , Lz2/S_θy, Lx1/S_θy, Lx2/S_θz, Ly2/S_θz), the value of the control amount of the stage device 102, that is, the position command value is corrected.

Furthermore, the measuring device 122 is used to measure the amount of displacement (Δhx, Δhy, Δhz) in the XYZ-axis directions at the position 111a. That is, the data processing computer 118 acquires the values of the displacement amounts (Δhx, Δhy, Δhz) based on the measurement results of the displacement sensors 121c, 121b, and 121a.

In the setting process, the data processing computer 118 calculates the values of the amount of change (Δdx1, Δdy1, Δdz) in the direction of the XYZ axes and the amount of displacement ( The correction parameters for the XYZ axes (Lz1/S_θx, Ly1/S_θx, Lz2 /S_θy, Lx1/S_θy, Lx2/S_θz, Ly2/S_θz).

After completing acquisition of the correction parameters in the processing apparatus 10 shown in FIG. 8, the operator removes the displacement sensor surface plate 119 and the measuring device 122 from the apparatus main body 100. Thereafter, the operator attaches the processing tool 111 to the holder 112, as shown in FIG. The holder 112 is configured to hold the processing tool 111 while accurately positioning the control point of the processing tool 111 to a position 111a. Further, the operator mounts the workpiece W and the workbench 103 on the apparatus main body 100, and prepares to process the workpiece W.

When actually processing the workpiece W with the processing apparatus 10, the Abbe correction unit 704 shown in FIG. 7 uses the set correction parameters to obtain a correction value based on the Abbe error. The data processing computer 118 generates position command values for machining the workpiece into a desired shape. A subtracter 705 updates the position command value by correcting it with a correction value, and a subtracter 706 calculates the difference value between the updated position command value and the output values of the laser length measuring devices 113a to 113c.

The PID control unit 701 performs PID control on the Z stage 107, the X stage 108, and the Y stage 109 based on the difference value. As a result, the control point (machining point) of the machining tool 111 moves to the commanded position.

When each of the stages 107 to 109 moves during processing and the posture of the stage 107 changes in the θx direction, θy direction, and θz direction, an Abbe error occurs. At this time, the data processing computer 118 can calculate Abbe errors occurring in the XYZ directions based on the values obtained from the laser length measuring devices 113b to 113f and the set correction parameters.

The data processing computer 118 reflects the correction value based on the calculated Abbe error in the position command value, thereby positioning the control point (machining point) of the processing tool 111 with high precision at the correct position with the Abbe error corrected. be able to.

That is, in this embodiment, by calculating not only Abbe errors in the X and Y directions caused by attitude changes in the θx and θy directions, but also Abbe errors caused by attitude changes in the θz direction and Abbe errors in the Z direction. , the θx direction, the θy direction, and the θz direction. Can be positioned with precision.

In this way, the positioning accuracy of the control point (machining point) of the machining tool 111 is improved, so the workpiece W can be machined into a desired shape with higher precision. Therefore, the shape accuracy of the article formed by processing the workpiece W is improved.

The present invention is not limited to the embodiments described above, and many modifications can be made within the technical idea of the present invention. Furthermore, the effects described in the embodiments are merely a list of the most preferable effects resulting from the present invention, and the effects of the present invention are not limited to those described in the embodiments.

In the above-described embodiment, the displacement of the control point of the processing tool 111 when the attitude of the stage device 102 is changed by the tilting mechanism 114 is detected by the displacement sensor 121 to identify the Abbe error, but the method for identifying the Abbe error is , but is not limited to this. For example, changes in the machined position and machining depth are detected for the results of machining the test workpiece with the machining device 10 before the posture change and the results of machining the test workpiece with the machining device 10 after the posture change. By doing so, the Abbe error may be specified.

Furthermore, instead of changing the attitude of the stage device 102, a mechanism is provided that simultaneously changes the postures of the Z length measurement reference mirror 104, the Y length measurement reference mirror 105, and the X length measurement reference mirror 106 with respect to the stage device 102. The setting process 900 may be executed by providing the setting process 900. Even with this method, it is possible to obtain correction parameters similarly to the above embodiment.

Further, the stage device 102 may be a mechanism that moves the processing tool 111 and the workpiece W independently. That is, the stage device 102 may include a stage for moving the processing tool 111 and a stage for moving the workpiece W. In such a case, each stage is provided with an orientation change mechanism and a displacement sensor (or orientation sensor) such as a laser length measuring device that can measure the position and orientation of the control point of each object, and the setting process 900 is performed at each stage. By doing so, it is possible to similarly obtain the Abbe error.

Further, in the above-described embodiment, the processing device 10 has been described as a positioning device, but the present invention is not limited to this. The positioning device may be a shape measuring device that measures the shape of an article (object to be measured) formed by processing a workpiece. In this case, the tool is a measuring probe, and the shape of the article is measured by scanning the probe with respect to the article.

In the case of the shape measuring device, the setting process of measuring the Abbe error and setting the correction parameters is similar to the setting process 900 of the above-described embodiment, but the measurement process is different from the measurement process of the above-described embodiment. In the case of a shape measuring device, in the measurement process, the values of the variation amounts Δdx1, Δdy1, and Δdz, which are the shape measurement results, may be corrected using Abbe errors instead of the position command values.

(Other examples)
The present invention provides a system or device with a program that implements one or more functions of the embodiments described above via a network or a storage medium, and one or more processors in a computer of the system or device reads and executes the program. This can also be achieved by processing. It can also be realized by a circuit (for example, ASIC) that realizes one or more functions.

The disclosure of the above embodiments includes the following sections.

(Section 1)
a stage device that has a holding part that holds a tool and is operable to relatively position the tool and the workpiece in directions of a first axis, a second axis, and a third axis that intersect with each other;
A first translational amount in the directions of the first axis, the second axis, and the third axis at a first position interlocked with the stage device, and an inclination around the first axis, the second axis, and the third axis. a first measuring device used to measure the amount;
a second measuring device used to measure a second translational amount in the directions of the first axis, the second axis, and the third axis at a second position interlocking with the holding part;
a first process of correcting the value of the control amount of the stage device or the value of the first translation amount based on the measured value of the tilt amount and the set correction parameter; setting the correction parameter based on the value of the first translation amount, the value of the second translation amount, and the value of the tilt amount when tilting around the second axis and the third axis; 2 processing; and an information processing unit capable of selectively executing
A positioning device comprising:

(Section 2)
further comprising a tilting mechanism that tilts the stage device around the first axis, the second axis, and the third axis;
Item 1. The positioning device according to item 1.

(Section 3)
The first measuring device is
a first mirror and a first laser length measuring device arranged opposite to each other in the direction of the first axis;
a second mirror and a second laser length measuring device arranged opposite to each other in the direction of the second axis;
a third mirror and a third laser length measuring device arranged opposite to each other in the direction of the third axis;
The information processing unit obtains the value of the first translation amount based on the measurement results of the first laser length measurement device, the second laser length measurement device, and the third laser length measurement device.
3. The positioning device according to item 1 or 2, characterized in that:

(Section 4)
The first measuring device is
a fourth laser length measuring device disposed opposite to the first mirror in the direction of the first axis;
a fifth laser length measuring device disposed opposite to the second mirror in the direction of the second axis;
a sixth laser length measuring device disposed opposite to the first mirror in the direction of the first axis;
The information processing unit is based on the measurement results of the first laser length measurement device, the second laser length measurement device, the fourth laser length measurement device, the fifth laser length measurement device, and the sixth laser length measurement device. and obtaining the value of the slope amount.
Item 3. The positioning device according to item 3.

(Section 5)
The first laser length measuring device and the fourth laser length measuring device are arranged with an interval in the direction of the third axis,
Item 5. The positioning device according to item 4.

(Section 6)
The second laser length measuring device and the fifth laser length measuring device are arranged at intervals in the direction of the third axis,
6. The positioning device according to item 4 or 5, characterized in that:

(Section 7)
The first laser length measuring device and the sixth laser length measuring device are arranged at intervals in the direction of the second axis,
7. The positioning device according to any one of items 4 to 6, characterized in that:

(Section 8)
The second measuring device is
a member to be measured that is removably held by the holding portion so as to be positioned at the second position;
a first displacement sensor disposed opposite to the member to be measured in the direction of the first axis;
a second displacement sensor disposed facing the member to be measured in the direction of the second axis;
a third displacement sensor arranged opposite to the member to be measured in the direction of the third axis;
The information processing unit obtains a value of the second translation amount based on measurement results of the first displacement sensor, the second displacement sensor, and the third displacement sensor.
8. The positioning device according to any one of items 1 to 7, characterized in that:

(Section 9)
a stage device that has a holding part that holds a processing tool and is operable to relatively position the processing tool and the workpiece in the directions of a first axis, a second axis, and a third axis that intersect with each other;
A first translational amount in the directions of the first axis, the second axis, and the third axis at a first position interlocked with the stage device, and an inclination around the first axis, the second axis, and the third axis. a first measuring device used to measure the amount;
a second measuring device used to measure a second translational amount in the directions of the first axis, the second axis, and the third axis at a second position interlocking with the holding part;
a first process of correcting the value of the control amount of the stage device based on the measured value of the tilt amount and the set correction parameter; selectively a second process of setting the correction parameter based on the value of the first translation amount, the value of the second translation amount, and the value of the tilt amount when tilting around the axis; an executable information processing unit;
A processing device characterized by comprising:

(Section 10)
a stage device that has a holding part that holds a probe and is operable to relatively position the probe and the object to be measured in directions of a first axis, a second axis, and a third axis that intersect with each other;
a first translational amount in the directions of the first axis, the second axis, and the third axis at a first position interlocking with the stage device, and an inclination around the first axis, the second axis, and the third axis; a first measuring device used to measure the amount;
a second measuring device used to measure a second translational amount in the directions of the first axis, the second axis, and the third axis at a second position interlocking with the holding part;
a first process of correcting the value of the first translation amount based on the measured value of the tilt amount and the set correction parameter; selectively performing a second process of setting the correction parameter based on the value of the first translation amount, the value of the second translation amount, and the value of the tilt amount when the device is tilted toward the periphery; possible information processing unit,
A shape measuring device comprising:

(Section 11)
a stage device that has a holding part that holds a tool and is operable to relatively position the tool and the workpiece in directions of a first axis, a second axis, and a third axis that intersect with each other; Measuring first translational amounts in the directions of the first axis, the second axis, and the third axis, and the amount of inclination around the first axis, the second axis, and the third axis at the interlocking first position. and a second measuring device used to measure a second translational amount in the directions of the first axis, the second axis, and the third axis at a second position interlocking with the holding part. Prepare a measuring device and
When the stage device is tilted around the first axis, the second axis, and the third axis, based on the value of the first translation amount, the value of the second translation amount, and the value of the tilt amount. and set the correction parameters.
correcting the value of the control amount of the stage device or the value of the first translation amount based on the measured value of the tilt amount and the correction parameter;
A positioning method characterized by:

(Section 12)
10. A method for manufacturing an article, comprising processing the workpiece using the processing apparatus according to item 9.

(Section 13)
Processing a workpiece to form an article,
A method for manufacturing an article, characterized in that the shape of the article is measured using the shape measuring device according to item 10.

DESCRIPTION OF SYMBOLS 10... Processing device (positioning device), 102... Stage device, 111... Processing tool (tool), 113... Measuring device (first measuring device), 118... Data processing computer (information processing unit), 122... Measuring device ( 2nd measuring device)

Claims (13)

a stage device that has a holding part that holds a tool and is operable to relatively position the tool and the workpiece in directions of a first axis, a second axis, and a third axis that intersect with each other;
A first translational amount in the directions of the first axis, the second axis, and the third axis at a first position interlocked with the stage device, and an inclination around the first axis, the second axis, and the third axis. a first measuring device used to measure the amount;
a second measuring device used to measure a second translational amount in the directions of the first axis, the second axis, and the third axis at a second position interlocking with the holding part;
a first process of correcting the value of the control amount of the stage device or the value of the first translation amount based on the measured value of the tilt amount and the set correction parameter; setting the correction parameter based on the value of the first translation amount, the value of the second translation amount, and the value of the tilt amount when tilting around the second axis and the third axis; 2 processing; and an information processing unit capable of selectively executing
A positioning device comprising: further comprising a tilting mechanism that tilts the stage device around the first axis, the second axis, and the third axis;
The positioning device according to claim 1, characterized in that: The first measuring device is
a first mirror and a first laser length measuring device arranged opposite to each other in the direction of the first axis;
a second mirror and a second laser length measuring device arranged opposite to each other in the direction of the second axis;
a third mirror and a third laser length measuring device arranged opposite to each other in the direction of the third axis;
The information processing unit obtains the value of the first translation amount based on the measurement results of the first laser length measurement device, the second laser length measurement device, and the third laser length measurement device.
The positioning device according to claim 1, characterized in that: The first measuring device is
a fourth laser length measuring device disposed opposite to the first mirror in the direction of the first axis;
a fifth laser length measuring device disposed opposite to the second mirror in the direction of the second axis;
a sixth laser length measuring device disposed opposite to the first mirror in the direction of the first axis;
The information processing unit is based on the measurement results of the first laser length measurement device, the second laser length measurement device, the fourth laser length measurement device, the fifth laser length measurement device, and the sixth laser length measurement device. and obtaining the value of the slope amount.
The positioning device according to claim 3, characterized in that. The first laser length measuring device and the fourth laser length measuring device are arranged with an interval in the direction of the third axis,
The positioning device according to claim 4, characterized in that: The second laser length measuring device and the fifth laser length measuring device are arranged at intervals in the direction of the third axis,
The positioning device according to claim 4, characterized in that: The first laser length measuring device and the sixth laser length measuring device are arranged at intervals in the direction of the second axis,
The positioning device according to claim 4, characterized in that: The second measuring device is
a member to be measured that is removably held by the holding portion so as to be positioned at the second position;
a first displacement sensor disposed opposite to the member to be measured in the direction of the first axis;
a second displacement sensor disposed facing the member to be measured in the direction of the second axis;
a third displacement sensor arranged opposite to the member to be measured in the direction of the third axis;
The information processing unit obtains a value of the second translation amount based on measurement results of the first displacement sensor, the second displacement sensor, and the third displacement sensor.
The positioning device according to any one of claims 1 to 7, characterized in that: a stage device that has a holding part that holds a processing tool and is operable to relatively position the processing tool and the workpiece in the directions of a first axis, a second axis, and a third axis that intersect with each other;
A first translational amount in the directions of the first axis, the second axis, and the third axis at a first position interlocked with the stage device, and an inclination around the first axis, the second axis, and the third axis. a first measuring device used to measure the amount;
a second measuring device used to measure a second translational amount in the directions of the first axis, the second axis, and the third axis at a second position interlocking with the holding part;
a first process of correcting the value of the control amount of the stage device based on the measured value of the tilt amount and the set correction parameter; selectively a second process of setting the correction parameter based on the value of the first translation amount, the value of the second translation amount, and the value of the tilt amount when tilting around the axis; an executable information processing unit;
A processing device characterized by comprising: a stage device that has a holding part that holds a probe and is operable to relatively position the probe and the object to be measured in directions of a first axis, a second axis, and a third axis that intersect with each other;
a first translational amount in the directions of the first axis, the second axis, and the third axis at a first position interlocking with the stage device, and an inclination around the first axis, the second axis, and the third axis; a first measuring device used to measure the amount;
a second measuring device used to measure a second translational amount in the directions of the first axis, the second axis, and the third axis at a second position interlocking with the holding part;
a first process of correcting the value of the first translation amount based on the measured value of the tilt amount and the set correction parameter; selectively performing a second process of setting the correction parameter based on the value of the first translation amount, the value of the second translation amount, and the value of the tilt amount when the device is tilted toward the periphery; possible information processing unit,
A shape measuring device comprising: a stage device that has a holding part that holds a tool and is operable to relatively position the tool and the workpiece in directions of a first axis, a second axis, and a third axis that intersect with each other; Measuring first translational amounts in the directions of the first axis, the second axis, and the third axis, and the amount of inclination around the first axis, the second axis, and the third axis at the interlocking first position. and a second measuring device used to measure a second translational amount in the directions of the first axis, the second axis, and the third axis at a second position interlocking with the holding part. Prepare a measuring device and
When the stage device is tilted around the first axis, the second axis, and the third axis, based on the value of the first translation amount, the value of the second translation amount, and the value of the tilt amount. and set the correction parameters.
correcting the value of the control amount of the stage device or the value of the first translation amount based on the measured value of the tilt amount and the correction parameter;
A positioning method characterized by: A method for manufacturing an article, comprising processing the work using the processing apparatus according to claim 9. Processing a workpiece to form an article,
A method for manufacturing an article, comprising measuring the shape of the article using the shape measuring device according to claim 10.

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