JP2024032547A - IC tag molded body and its manufacturing method - Google Patents

Abstract

An object of the present invention is to prevent deterioration of an IC tag regardless of the environment in which it is used. [Solution] An IC tag molded body 1 has an IC tag inlet 2, and a first resin part 10 and a second resin part 20 that sandwich the IC tag inlet and cover the periphery thereof, and the first resin part is , a first support part, a first recess that surrounds the first support part and is located at a lower position with respect to the first support part, and a second convex part that surrounds the first recess and projects with respect to the first recess. The second resin part has a second support part and a third protrusion that faces and abuts the first recess, surrounds the outer periphery of the second support part, and projects with respect to the second support part. and a third recess that faces and abuts the second protrusion, surrounds the third protrusion, and is located at a lower position than the third protrusion. [Selection diagram] Figure 1

Description

The present disclosure relates to a molded IC tag and a method for manufacturing the same.

In recent years, various technologies using non-contact IC tags using IC chips with antennas have been studied, and various methods of processing the IC tags themselves have been studied depending on their uses. For example, Patent Document 1 discloses a method of inserting an IC tag into a mold and performing in-mold molding with resin.

Japanese Patent Application Publication No. 2002-355847

As the uses of IC tags expand, it can be assumed that IC tags will be used under harsh conditions such as hot and humid environments. However, the IC tag molded bodies that have been considered so far are not intended to be used under harsh conditions, and there is a possibility that the IC tags will deteriorate quickly.

The present disclosure has been made in view of the above, and aims to provide a technology that can prevent deterioration of IC tags regardless of the usage environment.

In order to achieve the above object, an IC tag molded body according to an embodiment of the present disclosure includes an IC tag inlet, and a first resin part and a second resin part that sandwich the IC tag inlet and cover the periphery thereof. The first resin part includes a first support part that supports one main surface of the IC tag inlet, and is provided so as to surround the first support part, and is provided with respect to the first support part. The second resin part has a first recess located at a low position, and a second protrusion that is provided so as to surround the first recess and protrudes with respect to the first recess. a second support portion that supports the other main surface of the IC tag inlet opposite to the one main surface; a third protrusion that is provided and projects with respect to the second support part; a third protrusion that is provided to face and abut the second protrusion and surround the third protrusion; and a third recess located at a lower position than the third protrusion.

According to the above IC tag molded body, the pair of main surfaces of the IC tag inlet are covered by the first resin part and the second resin part, and the periphery of the IC tag inlet is covered by the first resin part and the second resin part. Irregularities are formed from the inside to the outside. In this way, since the interface between the first resin part and the second resin part is formed by concavities and convexities, it is possible to prevent foreign substances such as water, steam, and gas from entering from the outside, which would affect the function of the IC tag. be able to. Therefore, according to the above-mentioned IC tag molded body, it is possible to prevent the IC tag from deteriorating regardless of the usage environment.

The IC tag inlet may include a film-like base material, an antenna provided on the base material, and an IC chip provided on the base material and connected to the antenna. By using an IC tag inlet in which an antenna and an IC chip are provided on a film-like base material, it is possible to miniaturize the IC tag molded body, and the flexibility of the base material allows it to be It is possible to prevent the base material from being damaged due to the applied stress.

The IC tag inlet may include a second film that covers the antenna and the IC chip. By having the second film as described above, damage to the antenna and IC chip can be further prevented.

A first adhesive layer may be provided between the first support portion and the IC tag inlet. As described above, by providing the first adhesive layer between the first support part and the IC tag inlet, the adhesion between the first resin part and the IC tag inlet is increased, and deterioration of the IC tag is prevented. be able to.

A second adhesive layer may be provided between the second support portion and the IC tag inlet. As described above, by providing the second adhesive layer between the second support part and the IC tag inlet, the adhesion between the second resin part and the IC tag inlet is increased, and deterioration of the IC tag is prevented. be able to.

a first protrusion provided between the first support part and the first recess, and protruding with respect to the first support part; As described above, the first protrusion and By further providing the second recess, it is possible to further prevent foreign matter from entering from the outside, thereby further preventing deterioration of the IC tag.

A method for manufacturing an IC tag molded body according to one embodiment of the present disclosure includes fixing an IC tag inlet to a first mold, introducing a resin into the first mold, and solidifying the IC tag inlet. a first support part that supports one main surface of the first support part, a first recess part provided to surround the first support part and located at a lower position with respect to the first support part, and the first recess part. and a second protrusion that is provided so as to surround the periphery of the IC tag inlet and that protrudes from the first recess. Then, by fixing the first molded body to a second mold and introducing a resin into the second mold and solidifying it, the one main surface of the IC tag inlet is a second support part that supports the other main surface; and a second support part that faces and abuts the first recess, is provided so as to surround the outer periphery of the second support part, and protrudes with respect to the second support part. a third convex portion that faces and abuts the second convex portion, is provided so as to surround the third convex portion, and is located at a lower position than the third convex portion; and integrating a second resin part having the above and the first molded body.

According to the above method for manufacturing an IC tag molded body, the pair of main surfaces of the IC tag inlet are covered with the first resin part and the second resin part, and the periphery of the IC tag inlet is covered with the first resin part and the second resin part. The resin portion forms unevenness from the inside to the outside. In this way, since the interface between the first resin part and the second resin part is formed by concavities and convexities, it is possible to prevent foreign substances such as water, water vapor, and gas from entering from the outside that would affect the function of the IC tag. It can be prevented. Therefore, according to the above method for manufacturing an IC tag molded body, it is possible to manufacture an IC tag molded body in which deterioration of the IC tag is prevented regardless of the usage environment.

The IC tag inlet may be in the form of a film, and in molding the first molded body, the IC tag inlet may be fixed to the first mold by suction. With such a configuration, it is possible to suppress the generation of wrinkles when the film-shaped IC tag is integrated with the first resin part.

A first adhesive layer may be provided on a surface of the IC tag inlet that faces the first support section. With the above configuration, since the first adhesive layer is provided between the first support part and the IC tag inlet, the adhesion between the first resin part and the IC tag inlet increases, leading to deterioration of the IC tag. can be prevented.

A second adhesive layer may be provided on a surface of the IC tag inlet that faces the second support section. With the above configuration, since the second adhesive layer is provided between the second support part and the IC tag inlet, the adhesion between the second resin part and the IC tag inlet increases, leading to deterioration of the IC tag. can be prevented.

The IC tag molded body manufactured by the above-described manufacturing method includes a first protrusion that is provided between the first support part and the first recess, and that protrudes with respect to the first support part; A second recess that faces and abuts the convex part, is provided between the second support part and the third convex part, and is located at a position lower than the second support part. As described above, an IC tag molded body that further has a first convex portion and a second concave portion can further prevent foreign matter from entering from the outside, and therefore can further prevent deterioration of the IC tag. It becomes possible.

In integrating the second resin part and the first molded body, after the resin introduced into the second mold fills the first recess of the first molded body, The liquid may flow over the first convex portion to cover the surface of the IC tag inlet. With such a configuration, the flow rate of the resin can be adjusted so as to prevent the IC tag inlet from moving due to the resin.

According to the present disclosure, a technique is provided that can prevent deterioration of an IC tag regardless of the usage environment.

FIGS. 1(a) and 1(b) are diagrams for explaining the shape of the IC tag molded body, and FIG. 1(b) is an Ib-Ib arrow view and an Ic-Ic arrow view in FIG. Corresponds to the visual view. FIGS. 2(a) and 2(b) are diagrams illustrating the shape of the IC tag molded body. FIG. 3 is a flow diagram illustrating a method for manufacturing an IC tag molded body. FIGS. 4(a) to 4(f) are diagrams schematically showing a method for manufacturing an IC tag molded body. FIGS. 5(a) to 5(f) are diagrams schematically showing a method for manufacturing an IC tag molded body. FIG. 6 is a diagram illustrating the configuration of a molded IC tag according to a modification.

Hereinafter, embodiments for carrying out the present disclosure will be described in detail with reference to the accompanying drawings. In addition, in the description of the drawings, the same elements are denoted by the same reference numerals, and redundant description will be omitted. Note that for the sake of explanation, FIGS. 1 and 2 show an XYZ orthogonal coordinate system.

[IC tag molded body]
FIG. 1 is a diagram illustrating the shape of a molded IC tag. As shown in FIGS. 1A and 1B, the IC tag molded body 1 includes an IC tag inlet 2, a first resin part 10, and a second resin part 20.

IC tags are used in RFID (Radio Frequency Identification). An IC tag is configured to include an IC chip and an antenna. For example, when a radio wave is transmitted from the antenna of an RFID reader, the IC chip is driven by the antenna of the IC tag receiving the radio wave. Then, the information in the IC chip is transmitted as a signal from the antenna, and the RFID reader receives this, thereby passing the information in the IC chip to the RFID reader. Similarly, by transmitting and receiving information via an antenna, it is also possible to rewrite information held in an IC chip by an RFID writer. In this way, IC tags can be used as a medium for holding information in RFID. The IC tag molded body 1 is a molded body that functions as an IC tag. The IC tag molded body 1 has a flat plate shape with a thickness of approximately 1 mm to 5 mm. In this embodiment, a case will be described in which the IC tag molded body 1 has a rectangular main surface measuring 90 mm in the longitudinal direction (X direction) x 50 mm in the transverse direction (Y direction). However, this shape is just an example and is not particularly limited.

The IC tag inlet 2 (IC tag inlay) has a pair of main surfaces 2a and 2b, and as shown in FIG. 1(a), an antenna 2c and an IC chip 2d are connected on a film-like base material 2e. It is what was done. As the base material of the IC tag inlet 2, for example, polyethylene terephthalate (PET) is used. Specifically, an antenna 2c and an IC (integrated circuit) are fixed as an IC chip 2d on the surface of the base material 2e, and the IC tag inlet 2 is formed by connecting these. The IC tag inlet 2 is, for example, a thin film with a thickness of about 0.1 mm, and the base material 2e may be a flexible film. In this embodiment, a case will be described in which the pair of main surfaces 2a and 2b of the IC tag inlet 2 are rectangular with a length of 57 mm (X direction) x a width of 25 mm (Y direction). Note that the size of the IC tag inlet 2 is not particularly limited.

The first resin part 10 and the second resin part 20 are configured to sandwich the pair of main surfaces 2a and 2b of the IC tag inlet 2. The first resin part 10 is provided to cover the main surface 2a side in the upper direction in the figure (Z-axis positive direction), and the second resin part 20 is provided to cover the main surface 2b side in the lower direction in the figure (Z-axis negative direction). established in That is, the first resin part 10 and the second resin part 20 are arranged facing each other with the IC tag inlet 2 in between. As shown in FIG. 1A, the IC tag inlet 2 is sealed inside the first resin part 10 and the second resin part 20.

The first resin portion 10 will be explained with reference to FIG. 1(b) and FIG. 2(a). FIG. 2(a) is a diagram showing a state in which the second resin part 20 is removed from the IC tag molded body 1. The first resin portion 10 is a plate-shaped member with a rectangular main surface. Of the pair of main surfaces, the upper main surface 10a in the drawing is a flat surface. On the other hand, a first support portion 11, a first convex portion 12, a first recess 13, and a second convex portion 14 are formed on the main surface opposite to the main surface 10a.

The first support portion 11 is provided so as to face the main surface 2a of the IC tag inlet 2. The first support portion 11 has the same shape as the main surface 2a. The first support portion 11 extends along the XY plane similarly to the main surface 10a. The XY plane corresponds to the extending direction of the main surface 10a of the first resin section 10 and the main surface 20a of the second resin section 20, which are the pair of main surfaces of the IC tag molded body 1.

The first convex portion 12 is provided outside the first support portion 11 and is formed in an annular shape so as to surround the entire circumference of the first support portion 11 . The first convex portion 12 is provided at a position that protrudes downward (in the negative Z-axis direction) with respect to the first support portion 11, and extends along the XY plane. A side wall surface 19a is formed between the first support portion 11 and the first convex portion 12.

The first recess 13 is provided outside the first protrusion 12 and is formed in an annular shape so as to surround the entire circumference of the first protrusion 12 . The height position of the first recess 13 is above the first convex portion 12 and the second convex portion 14 on the outer circumferential side (positive direction of the Z axis), that is, the height position is higher than the first convex portion 12 and the second convex portion 14 on the outer peripheral side. A groove is formed between the two. The first recess 13 serving as a groove extends along the XY plane. A side wall surface 19b is formed between the first protrusion 12 and the first recess 13.

The second convex portion 14 is provided outside the first concave portion 13 and is formed in an annular shape so as to surround the entire circumference of the first concave portion 13 . The second convex portion 14 is provided at a position protruding downward (in the Z-axis negative direction) with respect to the first concave portion 13, and extends along the XY plane. A side wall surface 19c is formed between the first recess 13 and the second protrusion 14. The second convex portion 14 is provided at the outermost periphery of the first resin portion 10 , and the outer edge of the second convex portion 14 coincides with the outer edge of the first resin portion 10 .

As described above, the first resin part 10 has an annular first convex part 12, a first concave part 13, and a second convex part 14 extending from the inner circumference so as to surround the first support part 11 in contact with the IC tag inlet 2. They are arranged in this order toward the outer periphery. Note that the side wall surfaces 19a to 19c may extend in a direction perpendicular to the XY plane in which the first support portion 11 and the like extend, but the side wall surfaces 19a to 19c may extend slightly (for example, It may be inclined (about several degrees to 20 degrees). As an example, each of the side wall surfaces 19a to 19c may be formed at an angle of 10 degrees with respect to the XY plane.

The resin constituting the first resin part 10 and the second resin part 20 described above is not particularly limited, and general resin materials can be used. However, as in the manufacturing method described below, the IC tag molded body 1 is manufactured by insert molding in which the IC tag inlet 2 is fixed inside a mold. Therefore, a resin is selected that can be molded at a temperature (for example, 260° C. or lower) that will not damage the IC tag inlet 2 itself.

Furthermore, as the resin constituting the first resin part 10 and the second resin part 20, materials with high impact resistance, heat resistance, rigidity, etc. are selected for the purpose of preventing damage to the IC tag molded body 1. It is possible that Furthermore, in the case where the IC tag molded body 1 is installed outdoors, a material that is less susceptible to deterioration due to ultraviolet rays or the like may be selected. As an example, block polypropylene resin can be used as the first resin part 10 and the second resin part 20 of the IC tag molded body 1. Note that the first resin part 10 and the second resin part 20 may be made of different resin materials, but if the same type of resin material is used, the first resin part 10 and the second resin part 20 may be made of different resin materials. It is thought that the adhesion of

Next, the second resin part 20 will be explained with reference to FIGS. 1(b) and 2(b). FIG. 2(b) is a diagram showing a state in which the first resin part 10 is removed from the IC tag molded body 1. The second resin portion 20 is a plate-shaped member with a rectangular main surface. Of the pair of main surfaces, the lower main surface 20a in the drawing is a flat surface. On the other hand, a second support portion 21, a second recess 22, a third protrusion 23, and a third recess 24 are formed on the main surface opposite to the main surface 20a.

The second support portion 21 is provided so as to face the main surface 2a of the IC tag inlet 2. The second support portion 21 has the same shape as the main surface 2a. That is, the second support part 21 and the first support part 11 have the same shape.

The second recess 22 is provided outside the second support portion 21 and is formed in an annular shape so as to surround the entire circumference of the second support portion 21 . The second recess 22 is located below (in the negative Z-axis direction) with respect to the second support portion 21 and is configured to expand along the XY plane. The width of the second concave portion 22 is the same as that of the first convex portion 12 . A side wall surface 29a is formed between the second support portion 21 and the second recess 22.

The third convex portion 23 is provided outside the second concave portion 22 and is formed in an annular shape so as to surround the entire circumference of the second concave portion 22 . The third convex portion 23 is configured to protrude upward (in the Z-axis positive direction) with respect to the second concave portion 22 . The width of the third convex portion 23 is the same as that of the first concave portion 13 . A side wall surface 29b is formed between the second recess 22 and the third protrusion 23.

The third recess 24 is provided outside the third protrusion 23 and is formed in an annular shape so as to surround the entire circumference of the third protrusion 23 . The third recess 24 is located below (in the negative Z-axis direction) with respect to the third protrusion 23 and is configured to expand along the XY plane. The width of the third concave portion 24 is the same as that of the second convex portion 14 . A side wall surface 29c is formed between the third protrusion 23 and the third recess 24.
The third recess 24 is provided at the outermost periphery of the second resin part 20 , and the outer edge of the third recess 24 coincides with the outer edge of the second resin part 20 .

As described above, the second resin part 20 has an annular second recess 22, a third protrusion 23, and a third recess 24 extending from the inner circumference to the outer circumference so as to surround the second support part 21 in contact with the IC tag inlet 2. They are arranged in this order towards. Since the side wall surfaces 29a to 29c are in contact with the side wall surfaces 19a to 19c, respectively, in the IC tag molded body 1, they have the same inclination angle as the side wall surfaces 19a to 19c.

As the IC tag molded body 1, a first resin part 10 and a second resin part 20 are integrated with the IC tag inlet 2 sandwiched therebetween. At this time, as shown in FIG. 1(b) etc., the first convex portion 12 and the second concave portion 22 are in contact with each other, the first concave portion 13 and the third convex portion 23 are in contact with each other, and the second The convex portion 14 and the third recess 24 are in contact with each other. As shown in FIG. 1(b), the position where the first convex portion 12 and the second concave portion 22 face each other is below the IC tag inlet 2 in the figure (in the negative direction of the Z axis), and the first concave portion 13 on the outer periphery thereof is lower than the IC tag inlet 2. The position where the third convex portion 23 and the third convex portion 23 are opposed to each other is above the IC tag inlet 2 in the drawing (in the positive Z-axis direction). Further, the position where the second convex portion 14 and the third concave portion 24 on the outer periphery thereof face each other is below the IC tag inlet 2 in the drawing (in the negative Z-axis direction). In this way, the height position of the surface where the first resin part 10 and the second resin part 20 are in direct contact with each other changes from the periphery of the IC tag inlet 2 toward the outer periphery to the position where the IC tag inlet 2 is held. In contrast, it changes in the vertical direction. Therefore, the structure is such that foreign matter such as moisture or gas is difficult to enter through the interface between the first resin part 10 and the second resin part 20.

[Method for manufacturing IC tag molded body]
Next, a method for manufacturing the IC tag molded body 1 will be described with reference to FIGS. 3 to 5. FIG. 3 is a flow diagram illustrating a method for manufacturing the IC tag molded body 1. The IC tag molded body 1 is manufactured by performing two steps of insert molding in which the resin part is molded with the IC tag inlet 2 housed in a mold. 4 and 5 are diagrams showing the state in the middle of the manufacturing process. Note that FIGS. 4A and 4B show a cross-sectional view and a top view of the mold at the same timing. Similarly, FIG. 4(c) and FIG. 4(d), FIG. 4(e) and FIG. 4(f), FIG. 5(a) and FIG. 5(b), FIG. 5(c) and FIG. 5(d) , FIG. 5(e), and FIG. 5(f) are diagrams showing the same timing, respectively.

In the manufacturing method shown in FIG. 3, steps S01 to S03 are steps related to the first stage of insert molding using the first mold. First, in step S01, a first mold 91 is prepared, and the IC tag inlet 2 is fixed to the first mold 91. As shown in FIG. 4A, the first mold 91 includes, for example, a lower mold 92 and an upper mold 93. In addition, the lower mold 92 has a flat portion 92a, a third concave portion, and a convex portion corresponding to the second supporting portion 21, the second recessed portion 22, the third convex portion 23, and the third recessed portion 24 of the second resin portion 20. A first groove portion 92b, a first protrusion portion 92c, and a second groove portion 92d are formed. As shown in FIG. 4B, the first groove portion 92b, the first protrusion portion 92c, and the second groove portion 92d are each formed in an annular shape similarly to the second resin portion 20. As shown in FIG. Further, a lower mold 92 is arranged around the second groove part 92d so as to correspond to the outer shape of the first resin part 10, but a part of it is cut out to introduce resin into the inside. An inlet 94 is formed. The introduction port 94 is formed by cutting out a part of the outer circumferential side of the second groove portion 92d, that is, a part of the side surface of the lower mold 92. Note that the number of introduction ports 94 may be one or more. When providing a plurality of inlets 94, they may be provided so as to be distributed around the lower mold 92, that is, so as to surround the first resin portion 10 after molding.

A suction hole 92f for suctioning and fixing the IC tag inlet 2 is provided in the flat portion 92a. A suction device (not shown) is connected to the suction hole 92f. The suction hole 92f may be arranged to stably fix the thin film IC tag inlet 2 at a predetermined position inside the first mold 91, for example, in a plan view (see FIG. 4(b)). ) may be placed near the four vertices of the rectangular IC tag inlet 2. Further, depending on the size of the IC tag inlet 2, for example, a plurality of (for example, about 2 to 5) suction holes 92f may be arranged in the longitudinal direction.

The upper mold 93 is provided at a position corresponding to the main surface 10a of the first resin portion 10. By arranging the upper mold 93 above the lower mold 92 while the IC tag inlet 2 is suctioned and fixed to the flat part 92a, a space is formed inside that has a shape corresponding to the first resin part 10. Note that although FIG. 4A shows the upper mold 93, the upper mold 93 is omitted in subsequent drawings. Note that, depending on the molding method, the upper mold 93 may not be used and the molding may be performed only with the lower mold 92.

As shown in FIG. 4(a), when the IC tag inlet 2 is placed on the flat part 92a, the air inside the lower mold 92 is sucked by the suction device, so that the IC tag inlet on the flat part 92a is removed. 2 can be suctioned and fixed to the flat portion 92a. Suction and fixation of the IC tag inlet 2 by the suction device is continued until molding using the first mold 91 is completed.

Next, in step S02, resin for forming the first resin part 10 is introduced into the first mold 91. As shown in FIG. 4(a), resin R is poured from the inlet 94. At this time, as shown in FIG. 4(b), the resin R moves to fill the annular second groove 92d on the outer circumferential side, and after filling the recess of the second groove 92d with the resin R, It spreads over the protrusion 92c. Next, the resin R spreads so as to fill the first annular groove 92b provided inside the first annular protrusion 92c. Thereafter, after filling the concave portion of the first groove portion 92b, the resin R fills the upper surface of the IC tag inlet 2 suction-fixed onto the flat portion 92a, as shown in FIGS. 4(c) and 4(d). It spreads like that. When the resin R spreads inward after filling the recess of the first groove 92b, the resin R spreads from the entire outer circumference of the IC tag inlet 2 toward the center, as shown in FIG. 4(d). Finally, as shown in FIGS. 4(e) and 4(f), the entire area above the IC tag inlet 2 is covered with the resin R. In this way, by controlling the viscosity of the resin R so that the resin R spreads evenly from the periphery of the IC tag inlet 2 toward the center of the IC tag inlet 2, as the resin R moves, the IC tag inlet It is possible to reduce the possibility that a part of 2 will move or deform.

Next, in step S03, as shown in FIGS. 4(e) and 4(f), after the area corresponding to the first resin part 10 is filled with the resin R introduced into the lower mold 92, Harden resin R. Thereafter, as shown in FIG. 4(f), by cutting the resin R in the inlet 94 and the resin R in the lower mold 92 with a cutter 99, the first resin part 10 and the IC tag inlet 2 are separated. A first molded body 1' is obtained. The first molded body 1' has a shape in which the second resin part 20 is removed from the IC tag molded body 1, as shown in FIG. 2(a).

Next, a second stage of insert molding is performed using a second mold as shown in steps S04 to S06. First, in step S04, the second mold 95 is prepared, and the first molded body 1' is fixed to the second mold 95. As shown in FIG. 5A, the second mold 95 includes, for example, a lower mold 96 and an upper mold 97. Further, the lower mold 96 has a recess 96a that can accommodate the first molded body 1'.

A suction hole 96f for suctioning and fixing the first molded body 1' is provided at the bottom of the recess 96a. A suction device (not shown) is connected to the suction hole 96f. The suction hole 96f may be arranged to stably fix the thin film-like IC tag inlet 2 of the second mold, and for example, in a plan view (see FIG. 5(b)), They may be placed near the four vertices of the body 1'. This point is similar to the suction hole 92f in the lower mold 92 of the first mold 91.

The upper mold 97 is provided at a position corresponding to the main surface 20a of the second resin portion 20. By arranging the upper mold 97 above the lower mold 96 with the first molded body 1' suctioned and fixed in the recess 96a, the interior becomes a space having a shape corresponding to the second resin part 20. Note that although FIG. 5A shows the upper mold 97, the upper mold 97 is omitted in subsequent drawings. Furthermore, depending on the molding method, the upper mold 97 may not be used and the molding may be performed using only the lower mold 96.

As shown in FIG. 5(a), with the first molded body 1' accommodated in the recess 96a, the air inside the lower mold 96 is sucked by the suction device, thereby forming the first molded body in the recess 96a. The body 1' can be suctioned and fixed to the recess 96a. Suction and fixation of the first molded body 1' by the suction device is continued until molding using the second mold 95 is completed.

Next, in step S05, a resin for forming the second resin portion 20 is introduced into the second mold 95. As shown in FIG. 5(a), resin R is poured from the inlet 98. At this time, the resin R passes over the annular second convex portion on the outer peripheral side of the first molded body 1' and enters the first concave portion 13, as shown in FIG. 5(b). The resin R moves so as to fill the first recess 13, and after filling the first recess 13 with the resin R, it climbs over the inner first protrusion 12 and spreads so as to fill the upper surface of the IC tag inlet 2. When the resin R spreads inward after filling the recess of the first groove 92b, the resin R spreads over the IC located on the upper surface of the first molded body 1', as shown in FIGS. It spreads out from the entire circumference of the tag inlet 2 toward the center, and finally, as shown in FIGS. 5(e) and 5(f), a third The upper surface of 1 molded object 1' is covered with resin R. In this way, by controlling the viscosity of the resin R so that the resin R spreads evenly from the periphery of the IC tag inlet 2 toward the center of the IC tag inlet 2, as the resin R moves, the IC tag inlet The possibility that a part of 2 will move or deform can be reduced.

As shown in FIGS. 5(e) and 5(f), after the resin R is introduced into the lower mold 96 and the area corresponding to the second resin part 20 is filled with the resin R, the resin R is Let it harden. Thereafter, as shown in FIG. 6(f), by cutting the resin R in the inlet 98 and the resin R in the lower mold 96 with a cutter 99, a second An IC tag molded body 1 with an integrated resin part 20 is obtained.

[Effect]
According to the above-described IC tag molded body 1 and its manufacturing method, the pair of main surfaces 2a and 2b of the IC tag inlet 2 are covered with the first resin part 10 and the second resin part 20. Further, around the IC tag inlet 2, unevenness is formed from the inside to the outside by the first resin part 10 and the second resin part 20. In this way, since the interface between the first resin part 10 and the second resin part 20 is formed by concavities and convexities, it is possible to prevent foreign substances such as water, steam, and gas from entering from the outside that would affect the function of the IC tag. It can be prevented. Therefore, according to the above-mentioned IC tag molded body, it is possible to prevent the IC tag from deteriorating regardless of the usage environment.

Furthermore, in the case of the IC tag molded body 1 described in the above embodiment, information is transmitted and received to and from an external device (reader or writer) via the first resin part 10 or the second resin part 20. The IC tag molded body 1 described in this embodiment can reduce the possibility that substances that affect communication, such as metal and water, are present between the IC tag and an external device. It is not limited to use in short-distance communication such as the UHF band (e.g., several cm to several tens of cm), but can also be used in relatively long-distance communication such as the UHF band (e.g., several cm to several meters). is also possible.

Moreover, the IC tag molded body 1 can be used for a long period of time, for example, as long as the internal IC tag inlet 2 is not damaged. Furthermore, since the IC tag inlet 2 is covered by the first resin part 10 and the second resin part 20, it is possible to reduce the possibility that the IC tag inlet 2 itself is exposed to a high temperature or low temperature environment. Therefore, the IC tag can be used even in harsher environments.

Moreover, by using an opaque material for the first resin part 10 and the second resin part 20, the IC tag molded body 1 can be used to visually determine whether or not the IC tag inlet 2 is introduced or not, and where the IC tag inlet 2 is installed. It is not possible to specify whether tag inlet 2 is installed. Therefore, the possibility that the IC tag inlet 2 will be taken out by a malicious third party can be reduced. Conventional components in which IC tags are encapsulated are often designed to make it easy to see where the IC tags are encapsulated, so there have been cases where IC tags have been stolen. On the other hand, according to the above-mentioned IC tag molded body 1, the possibility that the IC tag inlet 2 is taken out can be reduced.

The IC tag inlet 2 may include a film-like base material 2e, an antenna 2c provided on the base material 2e, and an IC chip 2d provided on the base material 2e and connected to the antenna 2c. . By using an IC tag inlet 2 in which an antenna 2c and an IC chip 2d are provided on a film-like base material 2e, it is possible to miniaturize the IC tag molded body 1. Furthermore, since the base material 2e has flexibility, it is possible to prevent the base material from being damaged due to external stress.

In addition, in the method for manufacturing the IC tag molded body 1 described above, in order to form the annular convex portions and concave portions, a mold (the first mold 91 or the second mold 95) that forms the outer periphery of the IC tag molded body 1 is ) is designed so that the resin R is introduced from the outer periphery of the IC tag inlet 2 and reaches the upper surface of the central IC tag inlet 2 while the resin rides over the unevenness corresponding to the uneven shape in the first resin part 10 and the second resin part 20. There is. On the other hand, the IC tag inlet 2 or the first molded body 1' integrated with the IC tag inlet 2 is suctioned and fixed to the mold, and in this state, the resin R is introduced into the mold. Therefore, since the resin R having fluidity is prevented from deforming the IC tag inlet 2, the yield of the IC tag molded body 1 can also be improved.

[Modified example]
The IC tag molded body according to the present disclosure is not limited to the configuration described above, and various changes can be made.

An IC tag molded body 1X according to a modified example will be explained with reference to FIG. The IC tag molded body 1X differs from the IC tag molded body 1 in that an adhesive layer is formed between the IC tag inlet 2 and the resin portion. In the IC tag molded body 1X, a first adhesive layer 31 is provided between the first resin part 10 and the main surface 2a of the IC tag inlet 2, and a first adhesive layer 31 is provided between the second resin part 20 and the main surface 2b of the IC tag inlet. A second adhesive layer 32 is provided between the two. As the first adhesive layer 31 and the second adhesive layer 32, for example, an adhesive layer made of unstretched polypropylene (CPP) can be used. In addition, when providing the first adhesive layer 31 and the second adhesive layer 32, for example, by laminating the adhesive layer on the surface of the IC tag inlet 2 in advance, the IC tag inlet 2 and the first resin part 10 or the An adhesive layer can be formed between the two resin parts 20. As an example, an adhesive layer can be formed on the surface of the IC tag inlet 2 by using a two-component curable urethane adhesive and bonding an adhesive layer made of CPP to the surface of the IC tag inlet 2.

Further, as the first adhesive layer 31 and the second adhesive layer 32, an adhesive layer made of a thermoplastic resin such as an olefin resin, which can be thermally welded to the first resin part 10 or the second resin part 20, is used. be able to. As an example, an adhesive layer can be formed on the surface of the IC tag inlet 2 by preparing a coating liquid in which an olefin resin is dissolved or dispersed, applying it to the surface of the IC tag inlet 2, and then drying it. . The method for forming the first adhesive layer 31 and the second adhesive layer 32 is not limited to the above methods, and examples include wet coating, extruder, hot melt coating, dry lamination, spray coating, curtain coating, etc. Can be mentioned.

When the structure includes the first adhesive layer 31 or the second adhesive layer 32 like the above IC tag molded body 1X, the space between the IC tag inlet 2 and the first resin part 10 or between the IC tag inlet 2 Adhesion between the second resin part 20 and the second resin part 20 can be further improved. Note that only one of the first adhesive layer 31 and the second adhesive layer 32 may be provided, and in that case, it is preferable to provide the first adhesive layer 31. Further, it is preferable that the first adhesive layer 31 has a stronger adhesive strength with the IC tag inlet 2 than with the first resin part 10. This makes it difficult to take out the antenna 2c and IC chip 2d from the IC tag inlet 2 while maintaining their shapes, and it is possible to prevent the IC tag inlet 2 from being illegally reused.

Further, the IC tag inlet 2 may have a configuration different from the above configuration. For example, in the above embodiment, the antenna 2c and the IC chip 2d are stacked on the film-like base material 2e. ) may be used to protect the antenna 2c and the IC chip 2d. Further, the arrangement of the antenna 2c and the IC chip 2d, etc. can be changed as appropriate.

The shape of the unevenness formed on the first resin part 10 and the second resin part 20 of the IC tag molded body 1 can be changed as appropriate. For example, focusing on the first resin part 10, the first convex part 12, the first concave part 13, and the second convex part 14 are each formed in an annular shape. The shape may be such that a part of the two convex portions 14 is cut out. Furthermore, the first recess 13 does not have to be at a low position to the same depth over the entire circumference, and may have irregularities along the circumferential direction. In this case, the shapes of the second concave portion 22, the third convex portion 23, and the third concave portion 24 of the second resin portion 20 facing each other are the same as those of the first convex portion 12, the first concave portion 13, and the second concave portion 24 of the first resin portion 10. It is changed depending on the shape of the convex portion 14. Further, the first convex portion 12 and the second concave portion 22 may not be provided.

Note that, as explained in the method for manufacturing the IC tag molded body 1 above, when forming the second resin part 20, the resin R moves along the unevenness of the first resin part 10. Therefore, when the resin R is introduced into the second mold 95, the first resin part It is thought that by designing the shape 10, the yield of the IC tag molded body 1 is improved. From the above viewpoint, by providing the first convex portion 12 and the second concave portion 22 so that the periphery of the IC tag inlet 2 is surrounded by the first convex portion 12, movement or deformation of the IC tag inlet 2 due to the flow of the resin R is possible. is prevented.

Furthermore, the number of depressions and depressions formed on the outer periphery of the IC tag inlet 2 by the first resin part 10 and the second resin part 20 of the IC tag molded body 1 may be increased. By increasing the number of concave and convex portions formed by alternately providing concave portions and convex portions, entry of foreign matter from the outside can be further suppressed.

[Additional notes]
This disclosure includes the following configurations.
[1] IC tag inlet,
a first resin part and a second resin part that sandwich the IC tag inlet and cover the periphery thereof;
has
The first resin part is
a first support part that supports one main surface of the IC tag inlet;
a first recess provided to surround the first support and located at a lower position relative to the first support;
a second convex portion provided to surround the first concave portion and protrude with respect to the first concave portion;
has
The second resin part is
a second support part that supports the other main surface of the IC tag inlet opposite to the one main surface;
a third convex portion that faces and abuts the first recess, is provided so as to surround the outer periphery of the second support portion, and protrudes with respect to the second support portion;
a third recess that faces and abuts the second protrusion, is provided so as to surround the third protrusion, and is located at a lower position than the third protrusion;
An IC tag molded body having the following.
[2] The IC tag inlet includes a film-like base material, an antenna provided on the base material, and an IC chip provided on the base material and connected to the antenna, [1] The IC tag molded body described in .
[3] The IC tag molded body according to claim 2, wherein the IC tag inlet has a second film that covers the antenna and the IC chip.
[4] The IC tag molded article according to any one of [1] to [3], which has a first adhesive layer between the first support part and the IC tag inlet.
[5] The IC tag molded article according to any one of [1] to [4], which has a second adhesive layer between the second support portion and the IC tag inlet.
[6] a first convex portion provided between the first support portion and the first recess and protruding with respect to the first support portion;
a second recess that faces and abuts the first protrusion, is provided between the second support part and the third protrusion, and is located at a lower position than the second support part;
The IC tag molded article according to any one of [1] to [5], which has the following.
[7] A first support part that supports one main surface of the IC tag inlet by fixing the IC tag inlet to a first mold and introducing a resin into the first mold and solidifying it. , a first recess provided to surround the first support part and located at a lower position with respect to the first support part; and a first recess provided to surround the first recess and the first molding a first molded body in which a first resin portion having a second convex portion protruding with respect to the concave portion and the IC tag inlet are integrated;
By fixing the first molded body to a second mold and introducing a resin into the second mold and solidifying it, the other main surface of the IC tag inlet is a second support part that supports the main surface; and a second support part that faces and abuts the first recess, is provided so as to surround the outer periphery of the second support part, and protrudes with respect to the second support part. a third convex portion, a third concave portion that faces and abuts the second convex portion, is provided so as to surround the third convex portion, and is located at a lower position than the third convex portion; integrating a second resin part having the above and the first molded body;
A method for manufacturing an IC tag molded body, comprising:
[8] The IC tag inlet is film-like,
The method for manufacturing an IC tag molded body according to [7], wherein in molding the first molded body, the IC tag inlet is suctioned and fixed to the first mold.
[9] The method for manufacturing an IC tag molded body according to [7] or [8], wherein a first adhesive layer is provided on a surface of the IC tag inlet facing the first support portion.
[10] The method for manufacturing an IC tag molded body according to any one of [7] to [9], wherein a second adhesive layer is provided on a surface of the IC tag inlet facing the second support portion.
[11] The first resin part is provided between the first support part and the first recess, and has a first convex part that projects with respect to the first support part,
The second resin portion faces and abuts the first convex portion, is provided between the second support portion and the third convex portion, and is located at a position lower than the second support portion. The method for producing an IC tag molded body according to any one of [7] to [10], which has a certain second recess.
[12] In integrating the second resin part and the first molded body, the resin introduced into the second mold fills the first recess of the first molded body. The method for manufacturing an IC tag molded body according to [11], wherein the flow is then allowed to flow over the first convex portion and cover the surface of the IC tag inlet.

1, 1X... IC tag molded body, 1'... First molded body, 2... IC tag inlet (IC tag inlay), 2c... Antenna, 2d... IC chip, 2e... Base material, 10... First resin part, 11 ...first support part, 12...first convex part, 13...first concave part, 14...second convex part, 20...second resin part, 21...second support part, 22...second concave part, 23...third Convex portion, 24... Third recess, 31... First adhesive layer, 32... Second adhesive layer, 91... First mold, 92, 96... Lower mold, 93, 97... Upper mold, 95... Second Mold.

Claims (12)

IC tag inlet and
a first resin part and a second resin part that sandwich the IC tag inlet and cover the periphery thereof;
has
The first resin part is
a first support part that supports one main surface of the IC tag inlet;
a first recess provided to surround the first support and located at a lower position relative to the first support;
a second convex portion provided to surround the first concave portion and protrude with respect to the first concave portion;
has
The second resin part is
a second support part that supports the other main surface of the IC tag inlet opposite to the one main surface;
a third convex portion that faces and abuts the first recess, is provided so as to surround the second support portion, and protrudes with respect to the second support portion;
a third recess that faces and abuts the second protrusion, is provided so as to surround the third protrusion, and is located at a lower position than the third protrusion;
An IC tag molded body having the following. The IC tag inlet includes a film-like base material, an antenna provided on the base material, and an IC chip provided on the base material and connected to the antenna. IC tag molded body. The IC tag molded body according to claim 2, wherein the IC tag inlet has a second film that covers the antenna and the IC chip. The IC tag molded article according to any one of claims 1 to 3, further comprising a first adhesive layer between the first support portion and the IC tag inlet. The IC tag molded article according to any one of claims 1 to 3, further comprising a second adhesive layer between the second support portion and the IC tag inlet. a first convex portion provided between the first support portion and the first recess and protruding with respect to the first support portion;
a second recess that faces and abuts the first protrusion, is provided between the second support part and the third protrusion, and is located at a lower position than the second support part;
The IC tag molded body according to any one of claims 1 to 3, having the following. A first support part that supports one main surface of the IC tag inlet by fixing the IC tag inlet to a first mold and introducing and solidifying a resin into the first mold; a first recess provided to surround the periphery of the first support part and located at a lower position with respect to the first support part; molding a first molded body in which a first resin part and the IC tag inlet having a second convex part protruding from the other body are integrated;
By fixing the first molded body to a second mold and introducing a resin into the second mold and solidifying it, the other main surface of the IC tag inlet is a second support part that supports the main surface; and a second support part that faces and abuts the first recess, is provided so as to surround the second support part, and protrudes with respect to the second support part. a third convex portion, a third concave portion that faces and abuts the second convex portion, is provided so as to surround the third convex portion, and is located at a lower position than the third convex portion; integrating a second resin part having the above and the first molded body;
A method for manufacturing an IC tag molded body, comprising: The IC tag inlet is film-like,
8. The method for manufacturing an IC tag molded body according to claim 7, wherein in molding the first molded body, the IC tag inlet is suctioned and fixed to the first mold. 9. The method for manufacturing an IC tag molded body according to claim 7, wherein a first adhesive layer is provided on a surface of the IC tag inlet that faces the first support part. 9. The method for manufacturing an IC tag molded body according to claim 7, wherein a second adhesive layer is provided on a surface of the IC tag inlet that faces the second support part. The first resin part is provided between the first support part and the first recess, and has a first convex part that projects with respect to the first support part,
The second resin portion faces and abuts the first convex portion, is provided between the second support portion and the third convex portion, and is located at a position lower than the second support portion. The method for manufacturing an IC tag molded body according to claim 7 or 8, wherein the IC tag molded body has a certain second recess. In integrating the second resin part and the first molded body, after the resin introduced into the second mold fills the first recess of the first molded body, 12. The method for manufacturing an IC tag molded body according to claim 11, wherein the flow is caused to flow over the first convex portion and cover the surface of the IC tag inlet.

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