JP2024029784A - laminated thermal conductor - Google Patents

Abstract

An object of the present invention is to provide a laminated thermal conductor that has excellent thermal conductivity in various three-dimensional directions and has a large amount of substantial heat transport. A laminated thermal conductor 1 includes a plurality of thermal conductive parts 10 extending in a predetermined direction and a joint part 20 made of a flexible material and joining each of the thermal conductive parts 10. At least a portion of at least two heat conductors 2 overlap each other, and when observed from the stacking direction of the heat conductors 2, the extending directions of the heat conductive parts are non-parallel. A plurality of thermal conductors 2 are stacked like this. The number of laminated layers of the thermal conductor 2 is preferably 2 or more and 10 or less. [Selection diagram] Figure 1

Description

The present invention relates to a laminated thermal conductor.

In recent years, there has been an urgent need to take measures to dissipate heat from heat-generating components such as electronic devices, vehicle headlights, and vehicle batteries. For example, electronic components such as central processing units of computers, processors for image processing, SoCs of smartphones, DSPs and microcomputers of embedded devices, semiconductor elements such as transistors, light emitting bodies such as laser diodes, light emitting diodes, electroluminescence, and liquid crystals. As devices become smaller and more highly integrated, the amount of heat generated tends to increase. Shortened lifespans and malfunctions of devices and systems due to heat generated by these electronic components have become a problem, and demands for heat dissipation measures for electronic components are increasing year by year.

As a countermeasure against such high-temperature members such as heat generating members, for example, Patent Document 1 discloses a heat generating device that includes a plurality of heat conductive parts and a joint part that is made of a flexible material and joins each heat conductive part. A conductor is disclosed.

This thermal conductor is a composite laminate having a plurality of thermal conductive parts and joint parts, and has excellent thermal conductivity in a predetermined direction. Such a thermal conductor is used, for example, by bringing a member to be cooled into contact with the thermal conductor.

In this thermal conductor, the thermal conductivity in the in-plane direction of the thermal conductive part is higher than the thermal conductivity in the lamination direction of the thermal conductive part and the joint part. As a result, the heat conductor can efficiently transfer heat in a predetermined direction, in other words, in the in-plane direction of the heat conduction part, but it can transfer heat in the laminated direction of the heat conduction part and the joint part. Since the conductivity is lower than that in the above direction, the overall substantial amount of heat transport cannot be made sufficiently large.

JP2021-091211A

An object of the present invention is to provide a laminated thermal conductor that has excellent thermal conductivity in various three-dimensional directions and has a large amount of substantial heat transport.

The laminated thermal conductor of the present invention includes a plurality of thermal conductors including a plurality of thermal conductive parts extending in a predetermined direction and a joint part made of a flexible material and joining the respective thermal conductive parts. ,
At least a portion of the at least two thermal conductors overlap each other, and when observed from the stacking direction of the thermal conductors, the extending directions of the thermal conductive parts are non-parallel. It is characterized in that the thermal conductors are laminated.

According to the present invention, it is possible to provide a laminated thermal conductor that has excellent thermal conductivity in various three-dimensional directions and has a large amount of substantial heat transport.

FIG. 1 is a perspective view schematically showing an example of a laminated thermal conductor of the present invention. It is a perspective view which shows typically another example of the laminated thermal conductor of this invention. It is a perspective view which shows typically another example of the laminated thermal conductor of this invention. It is a perspective view which shows typically another example of the laminated thermal conductor of this invention. FIG. 2 is an enlarged cross-sectional view schematically illustrating a stacked thermal conductive part and a joint part in a thermal conductor. FIG. 2 is a plan view schematically showing an example of a heat conduction part that constitutes a heat conductor. FIG. 3 is a schematic partially exploded perspective view showing a plurality of stacked thermally conductive parts. It is a conceptual diagram of an example of the hardened|cured material of the curable resin material which comprises a joint part.

Hereinafter, preferred embodiments of the present invention will be described in detail.
[1] Laminated thermal conductor The laminated thermal conductor of the present invention will be explained.
FIG. 1 is a perspective view schematically showing an example of the laminated thermal conductor of the present invention. FIG. 2 is a perspective view schematically showing another example of the laminated thermal conductor of the present invention. FIG. 3 is a perspective view schematically showing another example of the laminated thermal conductor of the present invention. FIG. 4 is a perspective view schematically showing another example of the laminated thermal conductor of the present invention.

In addition, in the drawings referred to in this specification, some parts may be shown reduced or enlarged in order to make it easier to understand the relationship between each member, and the size of each member shown in the drawings may vary. The ratio does not represent the actual size ratio between each member.

The laminated thermal conductor 1 includes a plurality of thermal conductors 2 each including a plurality of thermal conductive parts 10 extending in a predetermined direction and a joint part 20 that is made of a flexible material and joins each of the thermal conductive parts 10. At least a portion of the at least two thermal conductors 2 overlap each other, and the extending directions of the thermal conductive parts 10 are non-parallel when observed from the stacking direction of the thermal conductors 2. , is characterized in that a plurality of thermal conductors 2 are stacked.

Each thermal conductor 2 has anisotropy in thermal conductivity. That is, the thermal conductor 2 is connected in the in-plane direction of the thermal conductive part 10 (in the in-plane direction of the YZ plane for the upper thermal conductor 2 in FIG. 1, and in the XZ direction for the lower thermal conductor 2 in FIG. Thermal conductivity in the in-plane direction of the plane) is higher in the lamination direction of the thermally conductive part 10 and the joint part 20 (in the X direction for the upper thermal conductor 2 in FIG. 1, and in the lower thermal conductivity in FIG. For the body, the thermal conductivity is higher than that in the Y in-plane direction).

Note that although the drawings referred to in this specification clearly show the interface between the thermally conductive part 10 and the joint part 20, for example, a part of the thermally conductive part 10 may have invaded the joint part 20, etc. Therefore, the interface between the heat conductive part 10 and the joint part 20 may be unclear.

In the laminated thermal conductor 1, a plurality of thermal conductors 2 are laminated. The example shown in FIG. 1 has a two-tiered structure in which two thermal conductors 2 are stacked. The two heat conductors 2 are substantially the same except for their orientations, but the present invention is not limited to this.

In the laminated thermal conductor 1, a plurality of thermal conductors 2 are laminated so that the extending directions of the thermal conductive parts 10 are non-parallel when observed from the lamination direction of the thermal conductors 2.
Thereby, it is possible to provide a laminated thermal conductor 1 that has excellent thermal conductivity in various three-dimensional directions and has a large amount of substantial heat transport. More specifically, the configuration of FIG. 1 has excellent thermal conductivity in all of the X direction, Y direction, and Z direction (the first direction vertically connecting the upper surface and the lower surface of the laminated thermal conductor 1), A laminated thermal conductor 1 with a substantial amount of heat transport can be provided.

Furthermore, by stacking a plurality of thermal conductors 2, the overall thickness of the laminated thermal conductor 1 can be made relatively thick. Thereby, the uniformity of the in-plane temperature can be made higher, and the substantial amount of heat transport can be made larger.

Furthermore, even when the laminated thermal conductor 1 is used under pressure for a long time, the sheet for forming the thermally conductive portion containing a carbon material such as graphite or carbon fiber, which constitutes the thermally conductive portion 10, is prevented from slipping. Thus, it is possible to effectively prevent sagging deformation of the thermal conductor 2 due to slippage of the sheet for forming the thermal conductive portion. As a result, for example, the surface pressure on the members in contact with the laminated thermal conductor 1 decreases over time, resulting in a decrease in adhesion between the laminated thermal conductor 1 and the members in contact, and an increase in thermal resistance. This problem can be effectively prevented from occurring.

In addition, the thermal conduction portion 10 between the plurality of thermal conductors 2 when observed from the arrangement direction of the plurality of thermal conductors 2 laminated in the laminated thermal conductor 1, in other words, the lamination direction of the thermal conductors 2. By changing the angle formed by the extending direction, the direction of heat diffusion in the plane perpendicular to the lamination direction of the heat conductor 2 can be set to a desired direction. In other words, for example, it becomes easier to design a space where heat is difficult to conduct, and the thermal conductivity in each direction of the plane perpendicular to the lamination direction of the thermal conductor 2 can be further improved.

The thickness of the laminated thermal conductor 1, that is, the length indicated by T2 in FIG. More preferably, it is 000 μm or less.
Thereby, the substantial amount of heat transport can be made particularly large. Therefore, for example, when the member to which the laminated thermal conductor 1 is applied is a heat generating element, the heat dissipation performance can be improved.

As shown in FIGS. 2 to 4, the laminated thermal conductor 1 may have a portion where at least two thermal conductors 2 do not overlap.
As a result, the direction of heat diffusion in the in-plane direction of the heat conductor 2 (the in-plane direction in the plane perpendicular to the lamination direction of the heat conductor 2) can be more preferably set in a desired direction, and the substantial thermal conductivity is can be made even better.

As a structure of the laminated thermal conductor 1 having a non-overlapping portion between two thermal conductors 2 in contact, for example, two or more thermal conductors 2 having different shapes or areas when viewed from above are laminated. Examples include a structure in which two or more thermal conductors 2 having the same shape and area in plan view are stacked with their orientations and positions shifted.

In addition, in this specification, "different" and "same" do not necessarily have to mean "different" or "same" in the strict sense, but as long as they can be considered to be substantially "different" or "same". good.
More specifically, as an example of a structure in which two thermal conductors 2 in contact have non-overlapping portions, a laminated thermal conductor 1 (1A) shown in FIG. 2 can be cited.
The laminated thermal conductor 1A as the laminated thermal conductor 1 shown in FIG. 2 has a thermal conductor 2a as the thermal conductor 2 having a rectangular shape and an elongated rectangular shape and has a smaller area than the thermal conductor 2a. It has a thermal conductor 2b as a thermal conductor 2, and the thermal conductor 2b is laminated on the thermal conductor 2a along the edge of the thermal conductor 2a.

The extending direction of the thermally conductive portion 10 in the thermal conductor 2a, in other words, the direction of heat conduction within the plane of the thermal conductor 2a is the X direction in the figure, and the extending direction of the thermally conductive portion 10 in the thermal conductor 2b is The existing direction is the Y direction in the figure.
In such a laminated thermal conductor 1A, for example, a plurality of electronic components 200, which are heat generating members, such as light emitting diodes, are arranged side by side on the upper thermal conductor 2b.

Heat from the heat generating member is first conducted in the in-plane Y direction in the upper heat conductor 2b, and is also conducted to the lower heat conductor 2a, where it is conducted in the in-plane X direction. Heat is dissipated through heat conduction (thermal diffusion). Heat can be efficiently diffused not only from the thermal conductor 2b, which has a smaller area than the thermal conductor 2a, but also by spreading and diffusing through the thermal conductor 2a, which has a larger area than the thermal conductor 2b. , the substantial amount of heat transport can be made larger.

Although FIG. 2 shows a case where the thermal conductor 2b has an elongated rectangular shape, the shape of the thermal conductor 2b is not limited to this.
Furthermore, if the thermal conductor 2b, which has a smaller area than the thermal conductor 2a, is laminated on the thermal conductor 2a, which has a larger area than the thermal conductor 2b, the thermal conductor 2b is laminated on the thermal conductor 2a. The number of thermal conductors 2b may be one, or may be two or more. When two or more heat conductors 2b are arranged on the heat conductor 2a, the heat conductors 2b may be arranged in an island shape, for example.

Further, as another example of a configuration in which two thermal conductors 2 that are in contact have non-overlapping portions, a laminated thermal conductor 1 (1B) shown in FIG. 3 can be cited.
In the laminated thermal conductor 1B as the laminated thermal conductor 1 shown in FIG. 3, when the laminated thermal conductor 1B is viewed from above, the thermal conductors 2c1 and 2c2 as the two thermal conductors 2 have an L-shape. They are arranged in a layered manner. These two thermal conductors 2c1 and 2c2 have a substantially rectangular shape when viewed from above, have the same shape and the same area, and when combined with different orientations, when viewed from above They are arranged in an L-shape.

The extending direction of the heat conduction portion 10 in the lower heat conductor 2c1, in other words, the direction of heat conduction within the plane of the heat conductor 2c1 is the X direction in the figure, and the heat conduction direction in the upper heat conductor 2c2 is The extending direction of the conductive part 10 is the Y direction in the figure. In other words, the extending direction of the heat conductive part 10 in the two heat conductors 2c1 and 2c2 is perpendicular to each other.

By placing a heat-sensitive member, such as the electronic component 210, at the inner corner of the L-shaped laminated thermal conductor 1B, heat can be dissipated in an L-shape along the laminated thermal conductor 1B. It can be conducted in a detour. Thereby, it is possible to prevent unwanted heat conduction, and for example, it is possible to effectively prevent the electronic component 210 from being adversely affected by heat.

The laminated thermal conductor 1 is used, for example, in an electronic device as a heat transfer member for conducting heat from an electronic component that is a heat generating member to a heat dissipation member, for example, a metal heat dissipation plate, and for efficiently dissipating heat from the metal heat dissipation plate. However, the application of the laminated thermal conductor 1 is not limited to this.
For example, the laminated thermal conductor 1 itself can be used as a heat dissipation member, such as a heat sink.

The laminated thermal conductor 1C as the laminated thermal conductor 1 shown in FIG. The thermal conductor 2d and the thermal conductor 2e as the thermal conductor 2 are laminated, and unevenness is formed by recesses 120 and protrusions 130 on at least a part of the surface of the thermal conductor 2e. The unevenness is formed in a comb-teeth shape when viewed in longitudinal section.

By providing unevenness on at least a part of the surface, the surface area of the heat conductor 2e increases, and for example, the area of the part that functions as a heat dissipation part (for example, the part that comes into contact with outside air, cooling water, etc.) is increased. can be done. As a result, the heat dissipation efficiency of the entire laminated thermal conductor 1C can be improved. In addition, at this time, the recesses 120 between the adjacent convex parts 130 become a flow path for a fluid (for example, a gas such as air, or a liquid such as water) as a cooling medium, and convection of the fluid occurs, so that the laminated heat is heated. Heat radiation from the surface of the conductor 1C can be performed more efficiently.

The unevenness can function as a cooling fin, and can have a wing shape, for example.
In the laminated thermal conductor 1C, the shape and size (depth) of the unevenness formed on at least a part of the surface of the thermal conductor 2e are not particularly limited.
Moreover, the formation pattern of the unevenness is not particularly limited, and may be regular or irregular.
The laminated thermal conductor 1 shown in FIG. 4 can be suitably used as a heat sink.

In FIG. 1, the shape of the laminated thermal conductor 1 when the laminated thermal conductor 1 is viewed from above (when observed from the stacking direction of the thermal conductor 2) and the cross-sectional shape of the laminated thermal conductor 1 are rectangular. However, the shape is not limited to this, and examples thereof include a circle, an ellipse, a polygon, and a combination thereof. Further, the longitudinal cross-sectional shape of the laminated thermal conductor 1 may have a constant width in the thickness direction, or may have a portion whose width changes in the thickness direction. good.

When the laminated thermal conductor 1 is viewed from above, and the cross-sectional shape of the laminated thermal conductor 1 is a polygon, for example, a quadrilateral, the maximum length of one side of the quadrilateral is 5 mm or more and 15 cm. It is preferably below, and more preferably 7 mm or more and 10 cm or less.
Thereby, a sufficient area for heat conduction can be secured, and the above-mentioned effects can be exhibited more reliably and more markedly.

Specifically, for example, it is preferable that the laminated thermal conductor 1 has a rectangular shape larger than 5 mm x 5 mm square when viewed from above.
Thereby, the above-mentioned effects can be brought out even more markedly.

Note that the size of the laminated thermal conductor 1 may or may not be constant in the thickness direction. When the laminated thermal conductor 1 has portions with different sizes in the thickness direction, the value of one side of the laminated thermal conductor 1 at the portion where the length of one side is the maximum is a value within the above range. It is preferable.

The thermal conductor 2 constituting the laminated thermal conductor 1 is not limited to a flat sheet-like one, but may also be a block-shaped one, or an irregularly shaped one, for example, a part where the thickness changes midway. It may have a step-like shape when viewed from the side.

[1-1] Thermal Conductor Next, the thermal conductor constituting the laminated thermal conductor of the present invention will be described.
FIG. 5 is an enlarged cross-sectional view schematically showing a portion of a heat conductive part and a joint part laminated in a heat conductor. FIG. 6 is a plan view schematically showing an example of a heat conduction part that constitutes a heat conductor. FIG. 7 is a schematic partially exploded perspective view showing a plurality of stacked heat conductive parts. FIG. 8 is a conceptual diagram of an example of a cured product of a curable resin material constituting the joint portion. Note that in FIG. 5, illustration of resin fibers is omitted.

The thermal conductor 2 has flexibility as a whole, and is made of a material including a plurality of thermal conductive parts 10 and a flexible resin material 21, and has a joint part 20 that joins each of the thermal conductive parts 10. Equipped with.

The thermal conductor 2 only needs to include at least one joint 20, but in the example shown in FIG. Heat conductive parts 10 are arranged at both ends.

The average thickness of the thermal conductor 2, that is, the thickness of the thermal conductor 2 in the stacking direction (the length indicated by T1 in FIG. 1) is preferably 100 μm or more and 10,000 μm or less, and 200 μm or more and 5,000 μm. It is more preferably below, and even more preferably 300 μm or more and 3,000 μm or less.
Thereby, adjacent thermal conductors 2 can be suitably brought into close contact with each other, and substantial thermal conductivity can be made excellent.

[1-1-1] Thermal conduction part The plurality of heat conduction parts 10 are parts that mainly contribute to the thermal conductivity of the entire heat conductor 2, especially to the thermal conductivity in the in-plane direction of the heat conduction part 10. be.

At least some of the plurality of heat conductive parts 10 are provided continuously inside the heat conductor 2, particularly in the first direction vertically connecting the pair of surfaces, and are It is preferable that the conductor 2 be exposed on two different sides.
Thereby, the substantial thermal conductivity in the first direction can be improved.

The thermally conductive part 10 is not particularly limited as long as it has thermal conductivity, and examples of the material constituting the thermally conductive part 10 include ceramic materials such as aluminum nitride, boron nitride, silicon nitride, silicon carbide, and alumina. , carbon materials such as graphite and carbon fiber, and metal materials such as copper and aluminum, etc., but it is preferable that the material is made of a material containing a carbon material, and more preferably that it is made of a material containing graphite. .
Thereby, the manufacturing cost of the thermal conductor 2 can be suppressed while making the substantial thermal conductivity of the thermal conductor 2 more excellent.

Further, when the heat conductive part 10 is made of a material containing graphite, it is possible to suitably make each graphite particle adhere to each other while providing an appropriate space between the graphite particles. This provides an anchor effect when providing a metal layer, which will be described later, and provides particularly excellent adhesion between the metal layer and the heat conductor 2 when joining adjacent heat conductors 2 together. Can be done.

[1-1-1-1] Carbon material In particular, if the heat conductive part 10 is formed of a heat conductive part forming sheet containing a carbon material such as graphite or carbon fiber, in addition to the above-mentioned effects, , Furthermore, the following effects can be obtained. In other words, the flexibility and flexibility of the heat conductor 2 can be improved, for example, the restoring force when the heat conductor 2 is bent, the cushioning properties due to internal voids, and the appropriate deformation. Accordingly, it is possible to further improve the adhesion between the laminated thermal conductor 1 and the member to which it is applied. In particular, such effects are more pronounced when graphite is used as the carbon material.

It is preferable to use flaky graphite as the graphite constituting the thermally conductive part 10.
By using flaky graphite, it is possible to suitably orient the flaky graphite in a predetermined direction (more specifically, in the in-plane direction of the thermally conductive part 10) by a method described below, and the thermally conductive part 10 The thermal conductivity in the in-plane direction can be made particularly excellent. In addition, by using flaky graphite, parts other than the holes 11 (described later) of the heat conducting part 10, especially the central part in the thickness direction of the heat conducting part 10, which is the normal direction of the in-plane direction of the heat conducting part 10. A void 4 as described below can be suitably provided in the vicinity, and effects as described below can be obtained.

It is preferable that the thermally conductive part 10 is substantially composed of a single component.
Thereby, the thermal conductivity of the thermally conductive part 10 can be further improved. Moreover, it is generally advantageous to suppress the manufacturing cost of the thermal conductor 2.
Note that "substantially composed of a single component" means that the proportion of the main component in the target region is 95% by weight or more. The proportion of the main component is preferably 97% by weight or more, more preferably 99% by weight or more.

However, if a gas such as air is included in the heat conduction section 10, the content of the gas is ignored. Further, when the heat conduction part 10 is made of a metal material, an oxide film of the metal constituting the heat conduction part 10, such as a passive film, may be formed on the surface thereof. Even when such an oxide film is formed, it shall be treated as "substantially composed of a single component."

The thermal conductivity in the in-plane direction of the heat conductive portion 10 at 20° C. is preferably 7 W/(m・K) or more and 2500 W/(m・K) or less, and 20 W/(m・K) or more and 1800 W/( m·K) or less is more preferable.
Note that the value of thermal conductivity can be determined by measurement using an unsteady hot wire method based on the laser flash method.

The thickness of the thermally conductive part 10 in the stacking direction indicated by _t10 in FIG. 1 is preferably 5 μm or more and 500 μm or less, more preferably 20 μm or more and 150 μm or less, and 40 μm or more and 120 μm or less More preferred.
As a result, the proportion of the heat conductive portion 10 in the heat conductor 2 can be made sufficiently high, and the flexibility of the heat conductor 2 as a whole can be easily improved, and the above-mentioned effects can be achieved more reliably. can be made more noticeable.
However, here, the thickness of the heat conductive portion 10 refers to the thickness at a portion where the holes 11 described below are not provided.

As shown in FIG. 5, each heat conduction part 10 constituting the heat conductor 2 may be provided with a recess in the thickness direction thereof.
Thereby, the bonding strength between the heat conductive portion 10 and the bonding portion 20 can be improved.

In particular, in each of the heat conduction parts 10 shown in FIG. 5, the recesses are holes 11 that penetrate in the thickness direction of the heat conduction part 10.
Thereby, the above-mentioned effects are more prominently exhibited.

In the configuration shown in FIG. 6, the plurality of holes 11 provided in the single heat conduction part 10 are arranged in a staggered manner, but the plurality of holes 11 provided in the single heat conduction part 10 are arranged in a staggered manner. The arrangement pattern of the holes 11 is not limited to this, and may be any pattern, for example, may be randomly provided.

The resin material 21 has entered at least a portion of the hole 11 . In other words, the cured product of the curable resin material enters through the recess into the heat conductive part 10 provided with the recess.
In particular, since the resin material 21 enters the hole 11 provided in the heat conduction part 10, the bond between the heat conduction part 10 and the joint part 20 can be made stronger, and the laminated heat conductor 1 The conformability to the surface shape of a member to which this is applied, for example, a heat generating member or a heat radiating member, and the durability of the heat conductor 2 can be improved.

As shown in FIG. 7, when the thermally conductive portions 10 are observed from the stacking direction with the joint portions 20, it is preferable that holes 11 that do not overlap exist in the plurality of thermally conductive portions 10.
This prevents the resin material 21 of the joint portion 20 that has entered the hole portion 11 from slipping through, thereby making it possible to further strengthen the joint between the heat conductive portions 10.

In addition, in FIG. 7, only the heat conductive part 10 is extracted and shown, and the joint part 20 is omitted.
The shape of the hole 11 is not particularly limited, and the shape of the hole 11 when the heat conduction part 10 is viewed from above and the cross-sectional shape of the hole 11 of the heat conduction part 10 may be, for example, circular. , ellipse, polygon, etc. Further, the longitudinal cross-sectional shape of the heat conductive portion 10 may be, for example, a shape having a constant width in the depth direction of the hole 11, or a portion whose width changes in the depth direction of the hole 11. It may also have the following.

When the shape of the hole 11 when the heat conduction part 10 is viewed from above, and the cross-sectional shape of the hole 11 of the heat conduction part 10 is circular, the diameter of the hole 11 is 20 μm or more and 300 μm or less. is preferable, and more preferably 30 μm or more and 200 μm or less.
Thereby, the above-mentioned effects can be more prominently exhibited.

The proportion of the heat conductive part 10 in the heat conductor 2 (the real part excluding the void part 4) is preferably 15 volume % or more and 80 volume % or less, and 20 volume % or more and 60 volume % or less. It is more preferable that the amount is 30 volume % or more and 50 volume % or less.
Thereby, the above-mentioned effects can be more prominently exhibited.

[1-1-1-2] Other components The thermally conductive portion 10 may contain components other than the components described above. Hereinafter, such components will be referred to as other components in this section.
However, the content of other components in the heat conductive part 10 is preferably 5% by weight or less, more preferably 1% by weight or less.

[1-1-2] Joint part The joint part 20 is disposed between two adjacent heat conductive parts 10 to join the heat conductive parts 10 to each other, and includes a flexible resin material 21. Consists of.
By including the flexible resin material 21 in the joint portion 20, the laminated thermal conductor 1 has better adhesion to the member to which it is applied, and better ability to follow the expansion and contraction of the member due to temperature changes. . The thermal conductor 2 has better conformability to the surface shape of the member to which the laminated thermal conductor 1 is applied. Further, since the joint portion 20 includes the resin material 21 having flexibility, it is possible to suitably prevent the thermal conductor 2 from being damaged when the thermal conductor 2 is deformed.

[1-1-2-1] Resin material The resin material 21 constituting the joint portion 20 is not particularly limited as long as it has flexibility, and includes, for example, flexible epoxy resin, rubber resin, and urethane resin. , silicone resin, fluororesin, acrylic resin, thermoplastic elastomer, etc. As shown in FIG. 51 in a skewered manner, a polyrotaxane 50 having blocking groups 53 provided near both ends of the first polymer 52, and a second polymer 60, Therefore, it is preferable that the polyrotaxane 50 and the second polymer 60 are bonded together.
Thereby, the bonding strength between the heat conductive part 10 and the joint part 20 in the heat conductor 2 can be made more excellent, and the durability of the heat conductor 2 can be made more excellent. Moreover, the flexibility, heat resistance, etc. of the thermal conductor 2 can be made particularly excellent.

In particular, when stress in the direction of the arrow is applied to the resin material 21 in the state shown in FIG. 8(A), the resin material 21 can take a form as shown in FIG. 8(B). That is, in the resin material 21, since the annular molecules 51 can move along the first polymer 52, that is, the first polymer 52 can move within the annular molecules 51, the stress of deformation is transferred to the resin material. It can be efficiently absorbed within 21 hours. Therefore, even if a large external force such as a twisting deformation force is applied, it is effectively prevented that the joint 20 is destroyed or the joint between the heat conductive parts 10 is destroyed. Furthermore, the adhesion to the member to which the laminated thermal conductor 1 is applied and the ability to follow the expansion and contraction of the member due to temperature changes are further improved.

The resin material 21 containing the polyrotaxane 50 and the second polymer 60 will be described in detail below.
The cyclic molecule 51 constituting the polyrotaxane 50 may be one that can move along the first polymer 52, but is preferably an optionally substituted cyclodextrin molecule, and the cyclodextrin molecule is α- Particularly preferred is one selected from the group consisting of cyclodextrin, β-cyclodextrin and γ-cyclodextrin, and derivatives thereof.

At least a portion of the cyclic molecules 51 in the polyrotaxane 50 are bonded to at least a portion of the second polymer 60, as described above.
Examples of the functional groups possessed by the cyclic molecule 51 (functional groups bonded to the second polymer 60) include -OH group, -NH ₂ group, -COOH group, epoxy group, vinyl group, thiol group, and photocrosslinking group. etc. In addition, examples of the photocrosslinking group include cinnamic acid, coumarin, chalcone, anthracene, styrylpyridine, styrylpyridinium salt, styrylquinolium salt, and the like.

When the cyclic molecule 51 is included in a skewered shape by the first polymer 52, if the maximum amount of the cyclic molecule 51 to be included is 1, then the cyclic molecule 51 is included in the first polymer 52 in a skewered shape. The amount of the cyclic molecules 51 present is preferably 0.001 or more and 0.6 or less, more preferably 0.05 or more and 0.4 or less. Note that two or more different types of cyclic molecules 51 may be used.

Examples of the first polymer 52 constituting the polyrotaxane 50 include polyvinyl alcohol, polyvinylpyrrolidone, poly(meth)acrylic acid, cellulose resins such as carboxymethyl cellulose, hydroxyethyl cellulose, and hydroxypropyl cellulose, polyacrylamide, polyethylene oxide, and polyethylene. Glycol, polypropylene glycol, polyvinyl acetal resin, polyvinyl methyl ether, polyamine, polyethyleneimine, casein, gelatin, starch, etc. and/or their copolymers, polyethylene, polypropylene, and copolymer resins with other olefin monomers Polyolefin resins such as polyester resins, polyvinyl chloride resins, polystyrene resins such as polystyrene and acrylonitrile-styrene copolymer resins, polymethyl methacrylate and (meth)acrylic acid ester copolymers, acrylonitrile-methyl acrylate copolymer resins, etc. Acrylic resins, polycarbonate resins, polyurethane resins, vinyl chloride-vinyl acetate copolymer resins, polyvinyl butyral resins, etc.; and derivatives or modified products thereof, polyisobutylene, polytetrahydrofuran, polyaniline, acrylonitrile-butadiene-styrene copolymers, Polyamides such as nylon, polyimides, polydienes such as polyisoprene and polybutadiene, polysiloxanes such as polydimethylsiloxane, polysulfones, polyimines, polyacetic anhydrides, polyureas, polysulfides, polyphosphazenes, Examples include polyketones, polyphenylenes, polyhaloolefins, and derivatives thereof, with polyethylene glycol being particularly preferred.

The weight average molecular weight of the first polymer 52 is preferably 10,000 or more, more preferably 35,000 or more. Note that two or more different types of first polymers 52 may be used.
As for the combination of the cyclic molecule 51 and the first polymer 52, it is preferable that the cyclic molecule 51 is an optionally substituted α-cyclodextrin and the first polymer 52 is polyethylene glycol.

The blocking group 53 constituting the polyrotaxane 50 is not particularly limited as long as it has the function of preventing the cyclic molecule 51 from being detached from the first polymer 52, but includes, for example, dinitrophenyl groups, cyclodextrins, Adamantane groups, trityl groups, fluoresceins, pyrenes, substituted benzenes (Substituents include alkyl, alkyloxy, hydroxy, halogen, cyano, sulfonyl, carboxyl, amino, phenyl, etc.) Only one substituent or a plurality of them may exist), optionally substituted polynuclear aromatics, steroids, and the like.

Examples of the substituents constituting the substituted benzenes and substituted polynuclear aromatics include alkyl, alkyloxy, hydroxy, halogen, cyano, sulfonyl, carboxyl, amino, and phenyl. One or more substituents may be present. Note that two or more different blocking groups 53 may be used.

In the resin material 21, at least a portion of the polyrotaxane 50 is bonded to the second polymer 60 via the cyclic molecule 51, but in the resin material 21, it is not bonded to the second polymer 60. Polyrotaxane 50 may be included, or polyrotaxane 50 may be bonded to each other.

The second polymer 60 is bonded to the polyrotaxane 50 via the cyclic molecule 51. Examples of the functional group bonded to the cyclic molecule 51 that the second polymer 60 has include a -OH group, -NH ₂ group, -COOH group, epoxy group, vinyl group, thiol group, photocrosslinking group, and the like. In addition, examples of the photocrosslinking group include cinnamic acid, coumarin, chalcone, anthracene, styrylpyridine, styrylpyridinium salt, styrylquinolium salt, and the like.

Examples of the second polymer 60 include polyvinyl alcohol, polyvinylpyrrolidone, poly(meth)acrylic acid, cellulose resins such as carboxymethyl cellulose, hydroxyethyl cellulose, and hydroxypropyl cellulose, polyacrylamide, polyethylene oxide, polyethylene glycol, polypropylene glycol, Polyolefin resins such as polyvinyl acetal resins, polyvinyl methyl ether, polyamines, polyethylene imine, casein, gelatin, starch, etc. and/or copolymers thereof, polyethylene, polypropylene, and copolymer resins with other olefin monomers. , polyester resins, polyvinyl chloride resins, polystyrene resins such as polystyrene and acrylonitrile-styrene copolymer resins, acrylic resins such as polymethyl methacrylate, (meth)acrylic acid ester copolymers, acrylonitrile-methyl acrylate copolymer resins, Polycarbonate resin, polyurethane resin, vinyl chloride-vinyl acetate copolymer resin, polyvinyl butyral resin, etc.; and derivatives or modified products thereof, polyamides such as polyisobutylene, polytetrahydrofuran, polyaniline, acrylonitrile-butadiene-styrene copolymer, nylon, etc. , polyimides, polydienes such as polyisoprene and polybutadiene, polysiloxanes such as polydimethylsiloxane, polysulfones, polyimines, polyacetic anhydrides, polyureas, polysulfides, polyphosphazenes, polyketones, polyphenylenes , those having the skeleton of various resins such as polyhaloolefins and having the above-mentioned functional groups can be mentioned.

The content of the resin material 21 in the joint portion 20 is preferably 5% by volume or more and 90% by volume or less, more preferably 25% by volume or more and 75% by volume or less.
This makes the bonding strength of the heat conductive part 10 by the bonded portion 20 more excellent, and when the bonded portion 20 includes resin fibers 22, the content rate of the resin fibers 22 in the bonded portion 20 is sufficiently ensured. Therefore, the effect of including the resin fibers 22 can be fully exhibited.

[1-1-2-2] Resin Fiber The joint portion 20 may include resin fibers 22 in addition to the resin material 21 as described above.
As a result, even when the laminated thermal conductor 1 is used for a long time, it is possible to effectively prevent the thermal conductor 2 from sagging and deform, and to ensure that the laminated thermal conductor 1 is in close contact with the member to which it is applied. It is possible to effectively prevent the occurrence of problems such as a decrease in performance and an increase in thermal resistance.

The thickness of the resin fibers 22 contained in the joint portion 20 is preferably 1.0 μm or more and 30 μm or less, more preferably 2.0 μm or more and 25 μm or less, and 3.0 μm or more and 20 μm or less. More preferably, it is 4.0 μm or more and 15 μm or less.
Thereby, the above-mentioned effects are more prominently exhibited.

The resin fibers 22 may be mainly composed of a resin material, and examples of the resin materials constituting the resin fibers 22 include polyolefins such as polyethylene and polypropylene, polyesters such as polyethylene terephthalate and polybutylene terephthalate, polyamides, Examples include ethylene vinyl acetate resin, polyvinyl alcohol, etc., but the resin fiber 22 is preferably made of polyester, and more preferably made of polyethylene terephthalate.
As a result, the strength of the resin fiber 22 itself can be improved, and the effect of including the resin fiber 22 in the joint portion 20 as described above can be more effectively exhibited. The adhesion between the fibers 22 and the resin material 21 can be improved, and the durability and reliability of the thermal conductor 2 can be improved.

The content of the resin fibers 22 in the joint 20 is preferably 2 volume% or more and 70 volume% or less, more preferably 4 volume% or more and 50 volume% or less, and 6 volume% or more and 30 volume% or less. It is more preferable that
As a result, the effect of including the resin fibers 22 described above can be more clearly exhibited, and a sufficient content rate of the resin material 21 in the joint 20 can be ensured, allowing heat conduction by the joint 20. The bonding strength of the portion 10 can be made sufficiently excellent.

[1-1-2-3] Other components The joint portion 20 may contain components other than those described above.
Such components include, for example, metal particles, ceramic particles, plasticizers, colorants, antioxidants, ultraviolet absorbers, light stabilizers, softeners, modifiers, rust preventives, fillers, ferrites, etc. Electromagnetic wave absorbers, surface lubricants, corrosion inhibitors, heat stabilizers, lubricants, primers, antistatic agents, polymerization inhibitors, crosslinking agents, catalysts, leveling agents, thickeners, dispersants, anti-aging agents, flame retardants, Examples include hydrolysis inhibitors.
However, the content of these components in the joint portion 20 is preferably 5% by weight or less, more preferably 1% by weight or less.

In FIG. 1, the thickness of the joint part ₂₀ in the lamination direction of the heat conductive part 10 and the joint part 20, indicated by t20, is preferably 0.1 μm or more and 1000 μm or less, and 5.0 μm or more and 100 μm or less. It is more preferable.
Thereby, the above-mentioned effects can be more prominently exhibited.
However, here, the thickness of the joint portion 20 refers to the thickness at a portion where the hole portion 11 is not provided in the contacting heat conductive portion 10 .

The proportion of the joint portion 20 in the thermal conductor 2 (substantive portion excluding the void portion 4) is preferably 15 volume% or more and 70 volume% or less, and 16 volume% or more and 60 volume% or less. is more preferable, and even more preferably 18 volume % or more and 50 volume % or less.
Thereby, the above-mentioned effects can be more prominently exhibited.

[1-1-3] Void portion In the illustrated configuration, the thermal conductor 2 has, in addition to the heat conduction portion 10 and the joint portion 20, a void portion 4 in which the heat conduction portion 10 and the joint portion 20 are not present. are doing.
The void portion 4 is a portion of the thermal conductor 2 where the thermal conductive portion 10 and the joint portion 20 are not present. The void portion 4 normally contains gas such as air or gas generated when the resin material 21 forming the joint portion 20 is cured.
By having such a void portion 4, it becomes possible to impart suitable flexibility to the thermal conductor 2, and the adhesion between the laminated thermal conductor 1 and the member to which the laminated thermal conductor 1 is applied is improved. It is possible to achieve excellent adhesion and substantial thermal conductivity between the member and the laminated thermal conductor 1.

The proportion of the voids 4 in the thermal conductor 2 (proportion in the natural state; the same applies hereinafter) is preferably 5 volume% or more and 65 volume% or less, and 5 volume% or more and 50 volume% or less. is more preferable, more preferably 6 vol.% or more and 40 vol.% or less, and most preferably 7 vol.% or more and 32 vol.% or less.
Thereby, the above-mentioned effects can be more prominently exhibited.

The density of the thermal conductor 2 in a natural state is preferably 0.6 g/cm ³ or more and 2.5 g/cm ³ or less, more preferably 0.9 g/cm ³ or more and 2.0 g/cm ³ or less. preferable.

By using the above-mentioned materials as materials constituting the heat conduction part 10 and the joint part 20 in the heat conductor 2, the overall density can be lowered.
Thereby, the heat conductor 2 can be made particularly lightweight. Furthermore, when an electronic device having the heat conductor 2 is mounted on an electronic device, weight reduction of the electronic device, etc. is not hindered. That is, electronic devices and the like can be made lighter.

[1-2] Details of the form of lamination of thermal conductors In the present invention, at least a portion of at least two thermal conductors among the plurality of thermal conductors constituting the laminated thermal conductor overlap, In addition, when observed from the stacking direction of the thermal conductors, it is sufficient that the extending directions of the thermal conductive parts are non-parallel; The angle formed by the extending direction of the heat conductive part when observed from the stacking direction of the conductor is preferably 20° or more and 90° or less (90° or more and 160° or less), and 40° or more and 90° or less (90° It is more preferable that the angle is 60° or more and 90° or less (90° or more and 120° or less). It is preferable that the extending directions of the conductive parts 10 are perpendicular to each other.
Thereby, the effects of the present invention described above are more significantly exhibited.
When the number of laminated thermal conductors 2 in the laminated thermal conductor 1 is three or more, the overlapping angles in the extending direction of the thermal conductive parts 10 may be different from each other, and the influence of electronic components etc. placed around the thermal conductive parts 10 may be different. In consideration of this, the laminated thermal conductors 1 can be combined so that the heat is most uniform.

Note that in this specification, "orthogonal" does not mean strictly "orthogonal" in a mathematical sense, but rather allows for some deviation. Specifically, for example, they may intersect within a range of 85° or more and 90° or less (90° or more and 95° or less).

Although FIGS. 1 to 4 show an example in which two thermal conductors 2 are stacked, the number of thermal conductors 2 to be stacked is not particularly limited. The number of stacked thermal conductors 2 may be, for example, three or more layers.
However, when the number of laminated thermal conductors 2 is large, the number of interfaces between adjacent thermal conductors 2 increases, which increases the overall interfacial thermal resistance, and the actual This will reduce thermal conductivity.

Therefore, the number of laminated thermal conductors 2 in the laminated thermal conductor 1 is preferably 2 or more and 10 or less, more preferably 2 or more and 8 or less, and even more preferably 2 or more and 5 or less.
Thereby, the increase in interfacial thermal resistance can be more effectively suppressed, and the above-described effects of the present invention can be more significantly exhibited.
In addition, in this specification, the number of laminated layers of the thermal conductor 2 means the number of laminated layers in the thickness direction of the laminated thermal conductor 1, in other words, the first direction (Z direction) connecting the upper surface and the lower surface. do.

In the laminated thermal conductor 1, it is preferable that the thermal conductors 2 adjacent in the lamination direction are in close contact with each other, and it is more preferable that they are joined.
Thereby, the above-mentioned effects can be more prominently exhibited. For example, the interfacial thermal resistance between adjacent thermal conductors 2 can be suppressed to a lower level, and the substantial thermal conductivity of the laminated thermal conductor 1 can be further increased.
In addition, it is possible to ensure good adhesion between the adjacent thermal conductors 2 without applying surface pressure, and at least one of the adjacent thermal conductors 2 is difficult to apply surface pressure to. The laminated thermal conductor 1 can be constructed even if the

Moreover, the strength of the laminated thermal conductor 1 can be made excellent. More specifically, for example, unwanted separation at the interface between adjacent thermal conductors 2 is prevented. For example, when making a hole penetrating the heat conductor 2 in the thickness direction (the lamination direction of the heat conductors 2 in the laminated heat conductor 1) for the purpose of screwing, etc., the heat conductor 10 By stacking and bonding a plurality of thermal conductors 2 so that the extending directions of 10 and the joint portion 20 are suitably prevented from peeling or coming off, and the strength of the laminated thermal conductor 1 as a whole can be increased.

In addition, in the present invention, the form of a laminated thermal conductor in which adjacent thermal conductors are joined in the stacking direction of a plurality of thermal conductors includes, for example, the entire opposing portions of two adjacent thermal conductors. In addition to the configuration in which they are joined, it also includes a configuration in which only part of the opposing parts are joined, and in a configuration in which three or more thermal conductors are laminated, other thermal conductors are used as described above. In addition to a thermal conductor joined to the body, a configuration including a thermal conductor that is not joined to other thermal conductors is also included.

For example, by pressing the laminated thermal conductor 1 in the lamination direction of the thermal conductors 2, adjacent thermal conductors 2 can be brought into close contact with each other.

In addition, examples of means for joining the thermal conductors 2 adjacent in the stacking direction include fusion, welding, adhesion, and joining using an adhesive, and one or a combination of two or more selected from these methods may be used. Can be used.
For example, by pressing or heating a plurality of heat conductors 2 in a stacked state, adjacent heat conductors 2 can be joined by fusion or welding.

Further, when adjacent thermal conductors 2 in the stacking direction are joined, at least a portion of the surface of the thermal conductors 2 is provided with a metal layer by, for example, wet plating, dry plating, paste baking, thermal spraying, etc. You can leave it there.
Thereby, for example, when adjoining thermal conductors 2 are joined by soldering, the bonding strength between the thermal conductors 2 can be improved.

Examples of the material constituting the metal layer include gold, silver, nickel, copper, zinc, tin, etc., and at least one of gold and nickel is preferable.

Gold has relatively high ductility among metal materials, and can suitably follow the deformation of the thermal conductor 2. In other words, the flexibility of the thermal conductor 2 is not hindered. It also has excellent thermal conductivity. Moreover, the adhesion between the metal layer and the thermal conductor 2 (especially the thermal conductive part 10 made of a material containing graphite as described later) can be made even more excellent.

The thickness of the metal layer is preferably 0.1 μm or more and 20 μm or less, more preferably 0.5 μm or more and 15 μm or less, and even more preferably 1.0 μm or more and 10 μm or less.
Thereby, the effect mentioned above can be made more suitable.

When the metal layer is provided on at least a portion of the surface of the thermal conductor 2, it is preferable that a portion of the metal layer penetrates into the interior of the thermal conductor 2.
Here, "a part of the metal layer penetrates into the inside of the thermal conductor 2" means minute irregularities on the surface of the thermal conductor 2 or thermal conductive parts 10 exposed on the surface of the thermal conductor 2. This means that a portion of the metal layer has entered into the fine gaps of the joint portion 20.
Thereby, the adhesion between the thermal conductor 2 and the metal layer becomes more excellent due to the anchor effect, and the above-mentioned effects are more clearly exhibited. In addition, peeling of the metal layer from the thermal conductor 2 due to deformation of the laminated thermal conductor 1 is suitably prevented, and the durability of the laminated thermal conductor 1 can be improved. . Such an anchor effect is more prominently exhibited when the thermally conductive portion 10 is made of a material containing graphite as described above.

When the heat conductor 2 is provided with the metal layer, the metal layer is selectively provided on the surface of the heat conduction part 10, in other words, the metal layer is provided on the surface of the joint part 20. Preferably, it is not substantially provided.
Thereby, the flexibility of the laminated thermal conductor 1 can be made more suitable.
Moreover, since the metal layer is selectively provided on the surface of the heat conduction part 10, when the laminated heat conductor 1 is deformed, the metal layer is pulled and peeled off from the heat conductor 2. This can be suitably prevented, and the durability of the laminated thermal conductor 1 can be improved.

Further, the metal layer constituting the laminated thermal conductor 1 is selectively provided on the surface of the thermal conductive part 10, thereby improving thermal conductivity between the laminated thermal conductors 2. can be taken as a thing.

The method for selectively forming the metal layer on the surface of the thermally conductive part 10 is not particularly limited, but for example, by forming the metal layer by electrolytic plating, the metal layer has excellent conductivity. It will preferentially adhere to the heat conductive portion 10. Thereby, the metal layer can be selectively formed on the surface of the thermally conductive part 10. Further, in the case where the joint portion 20 is made of a material as described below, even if the metal layer is formed by electroless plating, the metal layer is preferentially formed on the surface of the thermally conductive portion 10. can be formed.

If the area ratio of the heat conductive part 10 is large when the heat conductor 2 is viewed from above (when observed from the stacking direction of the heat conductors 2 in the laminated heat conductor 1), the surface of the heat conductive part 10 is coated by electrolytic plating. The area of the selectively formed metal layer can also be made larger. Thereby, the above-mentioned effects can be more prominently exhibited.

In addition, in this specification, the term "selectively provided on the surface of the thermally conductive part 10" with respect to the metal layer means that the coverage of the metal layer on the surface of the thermally conductive part 10 is higher than that of the surface of the joint part 20. This refers to a state in which the coverage rate of the metal layer is higher than that in .
That is, the metal layer is not limited to being provided only on the surface of the heat conduction part 10, but may be provided on the surface of the joint part 20 in addition to the surface of the heat conduction part 10, and the metal layer may be provided on the surface of the joint part 20, If the coverage rate of the metal layer on the surface of the heat conductive portion 10 is higher than the coverage rate of the metal layer on the surface of the joint portion 20, it can be said that the metal layer is selectively provided on the surface of the heat conduction portion 10.

Soldering is a welding method that uses solder, which has a melting point lower than that of the members (base materials) to be joined, as a type of adhesive. For example, low-temperature solder can be used as the solder.

Here, "low-temperature solder" is a general Sn-37Pb solder that is based on tin (Sn) or lead (Pb) and is blended with cadmium (Cd), bismuth (Bi), indium (In), etc. A solder with a melting point lower than that of eutectic solder (melting point: 183°C). From the viewpoint of preventing environmental pollution, it is preferable to use a lead-free low-temperature solder that is based on tin (Sn) and contains bismuth (Bi) and indium (In).

The melting point of the low-temperature solder is preferably 110°C or more and 160°C or less.
As the low-temperature solder, it is preferable to select and use one with good thermal conductivity.
Examples of such lead-free low-temperature solder include Sn-58Bi eutectic solder (melting point 138°C) and Sn-52In alloy solder (melting point 118°C).
By using such low-temperature solder, it is possible to improve the bonding strength between adjacent thermal conductors 2, and to prevent damage to the thermal conductors 2 when they are bonded together. It can be prevented.

Further, examples of adhesives used for joining adjacent thermal conductors 2 include acrylic adhesives, synthetic rubber adhesives, urethane adhesives, silicone adhesives, PCM (Phase Change Material), and the like. It will be done.

[2] Method for manufacturing the laminated thermal conductor Next, a method for manufacturing the laminated thermal conductor 1 will be described.
The laminated thermal conductor 1 can be manufactured by laminating a plurality of thermal conductors 2 such that the extending directions of the thermal conductive parts 10 are non-parallel.

[2-1] Manufacture of thermal conductor Next, the thermal conductor 2 constituting the laminated thermal conductor 1 can be manufactured, for example, as follows.
That is, the thermal conductor 2 is made of, for example, a thermally conductive part forming sheet (thermal conductive part forming sheet used for forming the thermally conductive part 10) that has been provided with a joint part forming composition used to form the joint part 20 on at least one surface. By winding the conductive part forming member) around the circumferential surface of a take-up roll, the heat conductive parts 10 and the joint parts 20 can be suitably manufactured by alternately stacking them.

The method for manufacturing the thermal conductor 2 includes, for example, applying a composition for forming a joint portion, which is a composition containing a curable resin material, and applying heat used to form the thermal conductive portion 10 in which the recessed portion (hole) 11 is formed. A winding step in which a sheet for forming a conductive portion is wound around the circumferential surface of a take-up roll to obtain a cylindrical wound body; and a winding process in which the wound body is cut in a direction non-perpendicular to the axial direction of the roll. The method includes an incision step for obtaining a body, and a curing step for curing the curable resin material contained in the cut body to form the joint portion 20.

By winding the heat conductive part forming sheet to which the joint part forming composition has been applied around the circumferential surface of a take-up roll, for example, compared to the case where a single sheet-like raw material is used, it is possible to 2 can be efficiently produced. Further, by curing the curable resin material after cutting the wound body, the cutting can be performed in a softer state than the joint portion 20 including the resin material 21. Therefore, the strain caused by winding can be suitably corrected, and when forming a cut body with higher flatness than a rolled body, the sheet for forming a heat conductive part, which is a part corresponding to the heat conductive part 10, is used. It is possible to effectively prevent peeling or deterioration of adhesion between the bonded portion 20 and the bonded portion forming composition corresponding to the bonded portion 20. As a result, the strain in the finally obtained thermal conductor 2 is suitably removed, as well as peeling between the thermal conductive part 10 and the joint part 20, deterioration of adhesion, destruction of the joint part 20, and heat Breakage of the joint between the conductive parts 10 and the like can be effectively prevented, and the heat conductive part 10 and the joint part 20 can be firmly attached.

When the thermal conductor 2 to be manufactured is in the form of a sheet, after the above-mentioned curing process, a cutting process is performed in which the thermal conductive part 10 and the joint part 20 are cut into a sheet shape on both sides.
Thereby, for example, a sheet-like thermal conductor 2 having a desired thickness can be obtained.

In addition, in the method for manufacturing the thermal conductor 2, for example, prior to the winding process, a composition for forming a joint part is applied to a sheet for forming a heat conductive part provided with recesses (holes) 11. It may also include a composition application step.

In addition, in the above explanation, the method of manufacturing the thermal conductor 2 by winding the sheet for forming a thermally conductive part to which the composition for forming a joint part is applied to form a wound body and cutting the wound body is described. As described above, the thermal conductor 2 may be manufactured by, for example, a method in which sheet heat conductive part forming members to which the joint part forming composition is attached are laminated to form a laminate. good.

[2-2] Lamination of thermal conductors As a method of laminating a plurality of thermal conductors 2 so that the extending directions of the thermal conductive parts 10 are non-parallel, for example, An example of a method is to laminate the thermal conductors 2 arranged so that the X direction is within the plane and the thermal conductors 2 arranged so that the extending direction of the heat conductive part 10 is the Y direction within the plane.

Further, for example, by pressing the laminated thermal conductor 1 in the lamination direction of the thermal conductors 2, adjacent thermal conductors 2 may be brought into close contact with each other.

Furthermore, it is preferable to join adjacent thermal conductors 2 in the stacking direction of the plurality of thermal conductors 2.
Examples of means for joining adjacent thermal conductors 2 in the stacking direction include those described in [1-2] above.

When pressing is applied when joining adjacent thermal conductors 2, pressure is applied in the stacking direction of the thermal conductors 2 in a state in which a plurality of thermal conductors 2 are stacked.
The pressure at this time is preferably 0.5 MPa or more and 2.0 MPa or less, more preferably 0.6 MPa or more and 1.5 MPa or less, and even more preferably 0.8 MPa or more and 1.2 MPa or less.
Thereby, adjacent thermal conductors 2 can be joined more suitably.

In the case of heating when joining adjacent thermal conductors 2, the stacked body of thermal conductors 2 is heated in a state in which a plurality of thermal conductors 2 are stacked.
The heating temperature at this time is preferably 80°C or more and 300°C or less, more preferably 100°C or more and 280°C or less, and even more preferably 150°C or more and 250°C or less.
Thereby, adjacent thermal conductors 2 can be joined more suitably.

The processing time for bonding by heating and pressing is preferably 1 minute or more and 60 minutes or less, more preferably 1 minute or more and 30 minutes or less, and even more preferably 1 minute or more and 10 minutes or less.

When performing soldering using low-temperature solder, for example, a low-temperature solder paste is printed on the joint surface of the metal layer provided on the thermal conductor 2 and then reflowed, or a low-temperature solder ball or ribbon-shaped solder paste is used. One method is to mount low-temperature solder and then reflow it.

The low-temperature solder paste or the low-temperature solder balls melts and becomes ready for physical bonding with the metal layer provided on the thermal conductor 2. Then, as the low-temperature solder solidifies, the metal layers provided on adjacent thermal conductors 2 are joined to each other via the low-temperature solder.

Furthermore, during reflow, a plurality of thermal conductors 2 provided with the metal layers may be stacked and pressed in the stacking direction of the thermal conductors 2 provided with the metal layers. The pressing conditions may be the same as those described above.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto.

For example, in the above description, the case where the heat conduction part 10 and the joint part 20 constituting the heat conductor 2 are planar has been mainly explained; At least a portion of the joint portion 20 may have a non-planar shape, for example, a curved surface, a bent surface, or the like.

Furthermore, in the above description, the case where the holes 11 are provided in each of the heat conductive parts 10 constituting the heat conductor 2 has been representatively explained, but the plurality of heat conductive parts constituting the heat conductor 2 Some of the holes 10 do not need to be provided with the holes 11.

In addition, instead of or in addition to the hole 11 described above, the heat conduction part 10 is provided with a recess that does not penetrate in the thickness direction of the heat conduction part 10, that is, a recess with a bottom. Good too. Moreover, the heat conduction part 10 does not need to be provided with a recess.

Further, the thermal conductor 2 may have a configuration other than the thermal conductive part 10, the joint part 20, and the gap part 4 described above.

Further, the thermal conductor 2 and the laminated thermal conductor 1 are not limited to those manufactured by the method described above. For example, in the method for manufacturing the thermal conductor 2 or the method for manufacturing the laminated thermal conductor 1, in addition to the steps described above, other steps (pre-treatment step, intermediate treatment step, post-treatment step, etc.) may be further included. Good too.

1: Laminated thermal conductor 1A: Laminated thermal conductor 1B: Laminated thermal conductor 1C: Laminated thermal conductor 2: Thermal conductor 2a: Thermal conductor 2b: Thermal conductor 2c1: Thermal conductor 2c2: Thermal conductor 2d : Thermal conductor 2e : Thermal conductor 4 : Gap part 10 : Thermal conductor part 11 : Hole part (recessed part)
20: Joint portion 21: Resin material 22: Resin fiber 50: Polyrotaxane 51: Cyclic molecule 52: First polymer 53: Blocking group 60: Second polymer 120: Concave portion 130: Convex portion 200: Electronic component 210: Electronic component T1: Thickness T2: Length _t10 : Thickness _t20 : Thickness

Claims (10)

A plurality of heat conductors each having a plurality of heat conduction parts extending in a predetermined direction and a joint part made of a flexible material and joining each of the heat conduction parts;
At least a portion of the at least two thermal conductors overlap each other, and when observed from the lamination direction of the thermal conductors, the extending directions of the thermal conductive parts are non-parallel. A laminated thermal conductor, characterized in that the thermal conductors are laminated. The laminated thermal conductor according to claim 1, wherein the number of laminated layers of the thermal conductor in the laminated thermal conductor is 2 or more and 10 or less. The laminated thermal conductor according to claim 1 or 2, wherein the average thickness of the thermal conductor is 100 μm or more and 10,000 μm or less. The laminated thermal conductor according to claim 1 or 2, wherein the thickness of the laminated thermal conductor is 200 μm or more and 30,000 μm or less. The laminated thermal conductor according to claim 1 or 2, having a non-overlapping portion between at least two of the thermal conductors. 3. The laminated thermal conductor includes a plurality of thermal conductors in which the extending directions of the thermal conductive parts are perpendicular to each other when observed from the lamination direction of the thermal conductors. Laminated thermal conductor. The laminated thermal conductor according to claim 1 or 2, wherein the thermal conductive portion is made of a material containing flaky graphite oriented in a predetermined direction. The laminated thermal conductor according to claim 1 or 2, wherein the proportion of the thermally conductive portion in the thermal conductor is 15% by volume or more and 80% by volume or less. The laminated thermal conductor according to claim 1 or 2, wherein the proportion of the joint portion in the thermal conductor is 15% by volume or more and 70% by volume or less. The laminated thermal conductor according to claim 1 or 2, wherein adjacent thermal conductors in the stacking direction of the plurality of thermal conductors are joined.

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