JP2024019567A - Image heating device and heater used for image heating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an image heating device having a plurality of heating blocks each capable of being controlled independently in a heater longitudinal direction and capable of detecting the temperature on the plurality of heating blocks while preventing an increase in size of the heater.

SOLUTION: The heater includes: a first temperature detection element corresponding to a first heating block; a second temperature detection element corresponding to a second heating block; a first conductor electrically connected to the first temperature detection element; a second conductor electrically connected to the second temperature detection element; and a common conductor electrically connected to the first and second temperature detection elements.

SELECTED DRAWING: Figure 3

COPYRIGHT: (C)2024,JPO&INPIT

Description

The present invention relates to a fixing device installed in an electrophotographic image forming apparatus such as a copying machine or a printer, or a gloss imparting device that improves the glossiness of a toner image by reheating the fixed toner image on a recording material. , etc. The present invention also relates to a heater used in this image heating device.

Some image heating devices include a cylindrical film, a heater that contacts the inner surface of the film, and a roller that forms a nip portion with the heater through the film. When small-sized paper is continuously printed with an image forming apparatus equipped with this image heating device, a phenomenon occurs in which the temperature of the area where the paper does not pass gradually rises in the longitudinal direction of the nip length (temperature rise of non-sheet passing area).
If the temperature of the non-paper passing area becomes too high, it may damage various parts in the device, and if you print on large size paper while the temperature of the non-paper passing area is rising, the non-paper passing area of small size paper may become too hot. There may also be high temperature offset of the toner onto the film in areas corresponding to .

One method to suppress the temperature rise in the non-sheet passing area is to divide the heating resistor on the heater into multiple groups (heating blocks) in the longitudinal direction of the heater, and adjust the heat generation distribution of the heater according to the size of the recording material. A switching device has been proposed (Patent Document 1).

Japanese Patent Application Publication No. 2014-59508

By the way, in consideration of device failure, it is preferable to monitor the temperature of each heat generating block. This is because even if any one of the plurality of heat generation blocks becomes uncontrollable and generates abnormal heat, if the temperature of each heat generation block is monitored, the power supply can be quickly stopped.

However, as the number of heat generating blocks increases, the number of temperature sensing elements for monitoring temperature also increases. Providing a large number of temperature sensing elements within the region of the heater substrate increases the size of the heater.

The present invention for solving the above-mentioned problems includes: a substrate; a first heat generating block formed on the substrate and generating heat upon supply of electric power; and a first heat generating block formed in the longitudinal direction of the substrate. a second heat generating block that is formed at a different position from the first heat generating block and is controlled independently of the first heat generating block; a first temperature sensing element provided at a position corresponding to the first heat generating block; a second temperature sensing element provided at a position corresponding to the second heat generating block; and the first temperature sensing element. It has a first conductor electrically connected to it, a second conductor electrically connected to the second temperature sensing element, and a common conductor electrically connected to the first and second temperature sensing elements. It is characterized by

According to the present invention, it is possible to suppress the increase in size of the heater.

FIG. 1 is a cross-sectional view of an image forming apparatus. FIG. 3 is a cross-sectional view of the image heating device. FIG. 3 is a configuration diagram of a heater in Example 1. FIG. 3 is a heater control circuit diagram of Example 1. 1 is a heater control flowchart of Example 1. FIG. 3 is a configuration diagram of a heater according to a second embodiment. FIG. 3 is a heater control circuit diagram of a second embodiment. 3 is a heater control flowchart of Example 2. The figure which showed the modification of a heater. The figure which showed the modification of a heater. The figure which showed the energization control pattern of a heater.

(Example 1)
FIG. 1 is a cross-sectional view of a laser printer (image forming apparatus) 100 using electrophotographic recording technology. When a print signal is generated, the scanner unit 21 emits a laser beam modulated according to the image information, and scans the photoreceptor 19 charged to a predetermined polarity by the charging roller 16. As a result, an electrostatic latent image is formed on the photoreceptor 19. Toner is supplied from the developing device 17 to this electrostatic latent image, and a toner image corresponding to the image information is formed on the photoreceptor 19. On the other hand, recording materials (recording paper) P loaded in a paper feed cassette 11 are fed one by one by a pickup roller 12 and conveyed by rollers 13 toward registration rollers 14 . Further, the recording material P is conveyed from the registration roller 14 to the transfer position in synchronization with the timing at which the toner image on the photoreceptor 19 reaches the transfer position where the photoreceptor 19 and the transfer roller 20 form. The toner image on the photoreceptor 19 is transferred to the recording material P while the recording material P passes through the transfer position.
Thereafter, the recording material P is heated by an image heating device (fixing device) 200 to heat and fix the toner image onto the recording material P. The recording material P carrying the fixed toner image is discharged to a tray above the laser printer 100 by rollers 26 and 27. Note that 18 is a cleaner for cleaning the photoreceptor 19. 30 is a motor that drives the image heating device 200 and the like. Power is supplied to the image heating apparatus 200 from a control circuit 400 connected to a commercial AC power source 401. The photoreceptor 19, charging roller 16, scanner unit 21, developing device 17, and transfer roller 20 described above constitute an image forming section that forms an unfixed image on the recording material P. Reference numeral 15 indicates a cartridge as a replacement unit. Further, 22 is a light source, 23 is a polygon mirror, and 24 is a reflecting mirror.

The laser printer 100 of this embodiment is compatible with a plurality of recording material sizes. Letter paper (approximately 216 mm x 279 mm) and legal paper (approximately 216 mm x 356 mm) can be set in the paper feed cassette 11. Furthermore, A4 paper (210 mm x 297 mm), Executive paper (approximately 184 mm x 267 mm), JIS B5 paper (182 mm x 257 mm), and A5 paper (148 mm x 210 mm) can be set.

The printer of this example is basically a laser printer that conveys paper vertically (conveys the paper so that the long side is parallel to the conveyance direction). Note that the configuration of this proposal can be similarly applied to printers that feed paper horizontally. Of the standard recording media widths (the widths of recording media listed in the catalog) that the device supports, the largest (widest) recording media are Letter paper and Legal paper, and the width of these is approximately 216 mm. It is. In this embodiment, a recording material P having a paper width smaller than the maximum size supported by the apparatus is defined as small-sized paper.

FIG. 2 is a cross-sectional view of the image heating device 200. The image heating device 200 includes a cylindrical film 202, a heater 300 that contacts the inner surface of the film 202, and a pressure roller (nip forming member) 208 that forms a fixing nip N with the heater 300 via the film 202. , has. The material of the base layer of the film 202 is a heat-resistant resin such as polyimide, or a metal such as stainless steel. Further, the film 202 may be provided with an elastic layer such as heat-resistant rubber. The pressure roller 208 has a core metal 209 made of a material such as iron or aluminum, and an elastic layer 210 made of a material such as silicone rubber. The heater 300 is held by a holding member 201 made of heat-resistant resin such as liquid crystal polymer. The holding member 201 also has a guide function for guiding the rotation of the film 202. Pressure roller 208 receives power from motor 30 and rotates in the direction of the arrow. As the pressure roller 208 rotates, the film 202 is rotated. The recording material P carrying the unfixed toner image is heated and fixed while being nipped and conveyed in the fixing nip N.
In this way, the apparatus 200 includes a cylindrical film 202 and a heater 300 that contacts the inner surface of the film 202, and heats an image formed on a recording material with the heat of the heater 300 via the film 202. .

The heater 300 includes a ceramic substrate 305 and a heating resistor (heating element) (see FIG. 3) that is provided on the substrate 305 and generates heat by supplying electric power. A surface protection layer 308 made of glass is provided on the surface (first surface) of the substrate 305 on the side of the fixing nip portion N in order to ensure the slidability of the film 202. A surface protection layer 307 made of glass is provided on the surface (second surface) of the substrate 305 opposite to the surface on the fixing nip portion N side in order to insulate the heating resistor. An electrode (here, E4 is shown as a representative) is exposed on the second surface, and when the electric contact for power supply (here, C4 is shown as a representative) comes into contact with the electrode, the heating resistor is electrically connected to an AC power source 401. Note that a detailed explanation of the heater 300 will be given later.

Reference numeral 202 designates a protection element 212, such as a thermoswitch or a thermal fuse, which is activated by abnormal heat generation of the heater 300 and cuts off the power supplied to the heater 300. The protective element 212 is placed in contact with the heater 300 or with a slight gap from the heater 300 . A metal stay 204 is used to apply pressure from a spring (not shown) to the holding member 201, and also serves to reinforce the holding member 201 and the heater 300.

3(A) and 3(B) show configuration diagrams of the heater 300 of the first embodiment. FIG. 3(A) shows a cross-sectional view of the heater 300 near the transport reference position X of the recording material P shown in FIG. 3(B). FIG. 3(B) shows a plan view of each layer of the heater 300. FIG. 3(C) is a plan view of the holding member that holds the heater 300.

The printer of this example is a center-based printer that transports the recording material so that the center of the recording material in the width direction (direction perpendicular to the transport direction) is aligned with the transport reference position X.

Next, the configuration of heater 300 will be explained in detail. A combination of a first conductor 301, a second conductor 303, and a heating resistor (heating element) 302 is provided on the back layer 1 of the heater 300, which is the heater surface opposite to the heater surface that contacts the film 202. A plurality of heat generating blocks are provided in the longitudinal direction of the heater 300. The heater 300 of this embodiment has a total of seven heat generating blocks HB1 to HB7. When one of the seven heat generating blocks is defined as a first heat generating block and the other heat generating block is defined as a second heat generating block, the heater 300 has the following configuration. That is, the heater 300 includes a substrate and a first heat generating block that is formed on the substrate and generates heat when supplied with electric power. Furthermore, it has a second heat generating block that is formed at a position different from the position where the first heat generating block is formed in the longitudinal direction of the substrate and is controlled independently of the first heat generating block. The independent control of the heat generating blocks will be described later.

Each heat generating block has a first conductor 301 provided along the longitudinal direction of the substrate, and a first conductor 301 provided along the longitudinal direction of the substrate at different positions in the lateral direction of the substrate. A second conductor 303 is provided. Furthermore, it has a heating resistor 302 that is provided between the first conductor 301 and the second conductor 303 and generates heat by the electric power supplied through the first conductor 301 and the second conductor 303. .

The heat generating resistor 302 of each heat generating block is divided into a heat generating resistor 302a and a heat generating resistor 302b formed at mutually symmetrical positions with respect to the center of the substrate in the lateral direction of the heater 300. Further, the first conductor 301 is divided into a conductor 301a connected to the heat generating resistor 302a and a conductor 301b connected to the heat generating resistor 302b. Since the heating resistor 302a and the heating resistor 302b are formed at mutually symmetrical positions with respect to the center of the substrate, the substrate is less likely to crack even if the heater generates heat and thermal stress is generated on the substrate.

Since the heater 300 has seven heat generating blocks HB1 to HB7, the heat generating resistor 302a is divided into seven blocks 302a-1 to 302a-7. Similarly, the heating resistor 302b is divided into seven parts, 302b-1 to 302b-7. Furthermore, the second conductor 303 is also divided into seven parts, 303-1 to 303-7. Note that the heating resistors 302a-1 to 302a-7 are arranged on the upstream side in the conveying direction of the recording material P within the substrate 305, and the heating resistors 302b-1 to 302b-7 are arranged within the substrate 305 on the upstream side of the recording material P. It is arranged on the downstream side of P in the conveyance direction.

The back layer 2 of the heater 300 is provided with an insulating (glass in this embodiment) surface protection layer 307 that covers the heating resistor 302, the first conductor 301, and the second conductor 303.
However, the surface protection layer 307 does not cover the electrode portions E1 to E7, E8-1, and E8-2 with which the power supply electrical contacts C1 to C7, C8-1, and C8-2 come into contact. Electrodes E1 to E7 are electrodes for supplying power to heat generating blocks HB1 to HB7 via second conductors 303-1 to 303-7, respectively. Electrodes E8-1 and E8-2 are electrodes for supplying power to heat generating blocks HB1 to HB7 via first conductors 301a and 301b.

By the way, since the resistance value of the conductor is not zero, it affects the heat generation distribution in the longitudinal direction of the heater 300. Therefore, the electrodes E8-1 and E8- are provided separately at both ends of the heater 300 in the longitudinal direction.

As shown in FIG. 2, a safety element 212 and electrical contacts C1 to C7, C8-1, and C8-2 are provided in the space between the stay 204 and the holding member 201. As shown in FIG. 3(C), the holding member 201 has holes through which electrical contacts C1 to C7, C8-1, and C8-2 are connected to electrodes E1 to E7, E8-1, and E8-2. HC1 to HC7, HC8-1, and HC8-2 are provided. Further, the holding member 201 is also provided with a hole H212 through which the heat-sensitive portion of the protection element 212 is passed. The electrical contacts C1 to C7, C8-1, and C8-2 are electrically connected to the corresponding electrodes by a method such as spring biasing or welding. The protective element 212 is also biased by the spring, and its heat sensitive portion is in contact with the surface protective layer 307. Each electrical contact is connected to a control circuit 400 of the heater 300, which will be described later, via a conductive member such as a cable or a thin metal plate provided in the space between the stay 204 and the holding member 201.

By providing an electrode on the back surface of the heater 300, there is no need to provide an area on the substrate 305 for wiring that electrically connects to each of the second conductors 303-1 to 303-7. The width in the hand direction can be shortened. Therefore, an increase in the size of the heater can be suppressed. Note that, as shown in FIG. 3(B), the electrodes E2 to E6 are provided in the region where the heating resistor is provided in the longitudinal direction of the substrate.

As will be described later, the heater 300 of this example can form various heat generation distributions by independently controlling a plurality of heat generation blocks. For example, the heat generation distribution can be set according to the size of the recording material. Further, the heating resistor 302 is made of a material having PTC (Positive Temperature Coefficient). By using a material having PTC, it is possible to suppress the temperature increase in the non-sheet passing area even in the case where the edge of the recording material and the boundary of the heat generating block do not match.

A plurality of thermistors (temperature sensing elements) T1-1 to T1-1 to detect the temperature of each heat generating block HB1 to HB7 are provided on the sliding surface layer 1 on the sliding surface (the surface in contact with the film) side of the heater 300. T1-4 and T2-4 to T2-7 are formed. The material of the thermistor may be any material having a positive or negative TCR (Temperature Coefficient of Resistance). In this example, a thermistor was constructed by printing a thin layer of material having NTC (Negative Temperature Coefficient) on a substrate. Since one or more thermistors are provided in correspondence with all of the heat generating blocks HB1 to HB7, the temperature of all the heat generating blocks can be detected.

If one of the thermistors T1-1 to T1-4 is the first temperature detection element and the other one of the thermistors T1-1 to T1-4 is the second temperature detection element, the heater 300 has the following configuration. That is, the heater 300 includes a first temperature sensing element provided at a position corresponding to the first heat generating block, and a second temperature sensing element provided at a position corresponding to the second heat generating block. .

Thermistors T1-1 to T1-4 are electrically connected to conductive patterns ET1-1 to ET1-4 provided on the substrate 305, respectively. If the conductive pattern among the conductive patterns ET1-1 to ET1-4 connected to the first temperature sensing element is referred to as the first conductive pattern, and the conductive pattern connected to the second temperature sensing element is referred to as the second conductive pattern, the heater 300 has the following configuration. That is, the heater 300 has a first conductive pattern electrically connected to the first temperature sensing element and a second conductive pattern electrically connected to the second temperature sensing element. Furthermore, the heater 300 has a common conductive pattern EG1 electrically connected to the first and second temperature sensing elements. Hereinafter, the set of thermistors T1-1 to T1-4, conductive patterns ET1-1 to ET1-4, and common conductive pattern EG1 will be referred to as a thermistor group TG1.

The heater 300 is also provided with a thermistor group TG2 consisting of a set of thermistors T2-4 to T2-7, conductive patterns ET2-4 to ET2-7, and a common conductive pattern EG2. The thermistor groups TG1 and TG2 are formed on the substrate surface of the substrate 305 that is opposite to the substrate surface on which the first and second heat generating blocks are formed.

In this example, at least one corresponding thermistor is arranged for each of all the heat generating blocks HB1 to HB7, but even if only one corresponding thermistor is arranged for at least two heat generating blocks, the device reliability will be improved. However, as in this example, it is preferable to arrange at least one corresponding thermistor for every heat generating block.

If the first and second temperature sensing elements are combined into one set by using the common conductive patterns EG1 and EG2 as in this example, the following effects can be obtained. That is, compared to the case where two conductive patterns are connected to each of the thermistors T1-1 to T1-4 without using a common conductive pattern, the cost of the conductive patterns can be reduced, and the increase in the size of the heater can be suppressed. can.

On the surface of the substrate 305 on the side of the fixing nip portion N (sliding surface layer 2), an insulating surface protection layer 308 (made of glass in this example) is formed by coating in order to ensure the sliding properties of the film 202. has been done. The surface protective layer 308 covers the thermistors T1-1 to T1-4, T2-4 to T2-7, conductive patterns ET1-1 to ET1-4, ET2-4 to ET2-7, and common conductive patterns EG1 and EG2. ing. However, in order to ensure connection with the electrical contacts, as shown in FIG. Parts of the common conductive patterns EG1 and EG2 are exposed.

FIG. 4 is a circuit diagram of a control circuit 400 of the heater 300. 401 is a commercial AC power supply connected to the laser printer 100. Power control of the heater 300 is performed by turning on/off the triacs 411 to 414. Triacs 411-414 operate according to FUSER1-FUSER4 signals from CPU 420, respectively. Note that in FIG. 4, the drive circuits for the triacs 411 to 414 are omitted.

As can be understood from FIGS. 3 and 4, the seven heat generation blocks HB1 to HB7 are divided into four groups (Group 1: HB4, Group 2: HB3 and HB5, Group 3: HB2 and HB6, Group 4: HB1 and HB7). It is divided into The control circuit 400 of the heater 300 has a circuit configuration that can independently control four groups. Triac 411 can control group 1, triac 412 can control group 2, triac 413 can control group 3, and triac 414 can control group 4.

The zero cross detection unit 421 is a circuit that detects the zero cross of the AC power supply 401 and outputs a ZEROX signal to the CPU 420. The ZEROX signal is used as a reference signal for controlling the phase of the triacs 411 to 414.

Next, a method for detecting the temperature of the heater 300 will be explained. First, the thermistor group TG1 will be explained. A signal (Th1-1 to Th1-4) obtained by dividing the voltage Vcc by the resistance value of the thermistor (T1-1 to T1-4) and the resistance value of the resistor (451 to 454) is input to the CPU 420. . For example, the signal Th1-1 is a signal obtained by dividing the voltage Vcc by the resistance value of the thermistor T1-1 and the resistance value of the resistor 451. Since the thermistor T1-1 has a resistance value depending on the temperature, when the temperature of the heat generating block HB1 changes, the level of the signal Th1-1 input to the CPU also changes. The CPU 420 converts the input signal Th1-1 into a temperature corresponding to its level. The processing of the signals Th1-2 to Th1-4 corresponding to the other thermistors T1-2 to T1-4 of the thermistor group TG1 is also similar, so a description thereof will be omitted.

Next, the thermistor group TG2 will be explained. Like TG1, the thermistor group TG2 also provides a signal (Th2-4) to the CPU 420 that is obtained by dividing the voltage Vcc by the resistance values of the thermistors (T2-4 to T2-7) and the resistance values of the resistors (464 to 467). ~Th2-7) is input. The method of conversion to temperature by the CPU 420 is the same as that of thermistor group TG1, so a description thereof will be omitted.

Next, power control to the heater 300 (heater temperature control) will be explained. During the fixing process, each of the heat generating blocks HB1 to HB7 is controlled so that the detected temperature of the thermistor (T1-1 to T1-4) in the thermistor group TG1 is maintained at the set temperature (control target temperature). Specifically, the power supplied to group 1 (heat generating block HB4) is controlled by controlling the drive of triac 411 so that the detected temperature of thermistor T1-4 maintains the set temperature. The power supplied to group 2 (heat generating blocks HB3 and HB5) is controlled by controlling the drive of the triac 412 so that the temperature detected by the thermistor T1-3 is maintained at the set temperature. The power supplied to group 3 (heat generating blocks HB2 and HB6) is controlled by controlling the drive of triac 413 so that the temperature detected by thermistor T1-2 maintains the set temperature. The power supplied to group 4 (heating blocks HB1 and HB7) is controlled by controlling the drive of triac 414 so that the temperature detected by thermistor T1-1 is maintained at the set temperature. In this way, each thermistor in the thermistor group TG1 is used when performing control to maintain each heat generating block at a constant temperature.

The CPU 420 calculates the supplied power, for example, by PI control, based on the set temperature (control target temperature) of each heat generating block and the detected temperature of each thermistor (T1-1 to T1-4) in the thermistor group TG1. Further, the calculated supplied power is converted into control timing such as a corresponding phase angle (phase control) and wave number (wave number control), and the triacs 411 to 414 are controlled using this control timing. Note that the set temperature of each group of the apparatus in this example is 250° C. when fixing the largest size plain paper. When fixing small-sized plain paper, the set temperature for group 1 is set to 250°C, and the set temperatures for the other groups are set lower than 250°C. The set temperature for each group may be appropriately set according to information such as the size, type, surface properties, etc. of the recording material.

Relays 430 and 440 are installed as means for cutting off power to heater 300 when heater 300 becomes overheated due to a device failure or other factors. Next, circuit operations of relays 430 and 440 will be explained.

When the RLON signal output from the CPU 420 goes high, the transistor 433 turns on, the secondary coil of the relay 430 is energized from the DC power supply (voltage Vcc), and the primary contact of the relay 430 turns on. Become. When the RLON signal becomes Low, transistor 433 becomes OFF, current flowing from the power supply (voltage Vcc) to the secondary coil of relay 430 is cut off, and the primary contact of relay 430 becomes OFF. Similarly, when the RLON signal becomes High, the transistor 443 is turned on, the secondary coil of the relay 440 is energized from the power supply (voltage Vcc), and the primary contact of the relay 440 is turned on. When the RLON signal goes low, transistor 443 goes off, current flowing from the power supply (voltage Vcc) to the secondary coil of relay 440 is cut off, and the primary contact of relay 440 goes off.

Next, the operation of the protection circuit (hard circuit not involving the CPU 420) using the relay 430 and the relay 440 will be explained. When the level of any one of the signals Th1-1 to Th1-4 exceeds a predetermined value set inside the comparison section 431, the comparison section 431 operates the latch section 432, and the latch section 432 sets the RLOFF1 signal to Low. Latch in state. When the RLOFF1 signal becomes Low, the transistor 433 is kept in the OFF state even if the CPU 420 makes the RLON signal High, so the relay 430 can be kept in the OFF state (safe state). Note that in the non-latched state, the latch section 432 outputs the RLOFF1 signal in an open state.

Similarly, when the level of any one of the signals Th2-4 to Th2-7 exceeds a predetermined value set inside the comparison section 441, the comparison section 441 operates the latch section 442, and the latch section 442 operates the RLOFF2 Latch the signal in a low state. When the RLOFF2 signal becomes Low, the transistor 443 is kept in the OFF state even if the CPU 420 makes the RLON signal High, so the relay 440 can be kept in the OFF state (safe state). In the non-latched state, the latch section 442 outputs the RLOFF signal in an open state. The predetermined value set inside the comparison section 431 and the predetermined value set inside the comparison section 441 in this example are both values corresponding to 300°C.

Next, a circuit protection operation using two thermistor groups TG1 and TG2 will be explained. As shown in FIGS. 3 and 4, one thermistor of the thermistor group TG1 and one thermistor of the thermistor group TG2 correspond to each of the four groups (groups 1 to 4) described above. It is located. Furthermore, at least one thermistor is arranged corresponding to each of all the heat generating blocks HB1 to HB7.
Specifically, in group 1 (HB4), thermistors T1-4 in thermistor group TG1 and thermistors T2-4 in thermistor group TG2 are arranged in correspondence. In group 2 (HB3 and HB5), thermistors T1-3 in thermistor group TG1 and thermistors T2-5 in thermistor group TG2 are arranged correspondingly. In group 3 (HB2 and HB6), thermistors T1-2 in thermistor group TG1 and thermistors T2-6 in thermistor group TG2 are arranged correspondingly. In group 4 (HB1 and HB7), thermistor T1-1 in thermistor group TG1 and thermistor T2-7 in thermistor group TG2 are arranged correspondingly. Further, at least one thermistor among the eight thermistors is arranged corresponding to each of all the heat generating blocks HB1 to HB7. Such a thermistor layout improves the reliability of the circuit's protective operation in the event of a device failure. This will be explained below.

For example, assume that any one of thermistors T1-1 to T1-4 in thermistor group TG1 fails. Even if the group with the heat generating block corresponding to the failed thermistor becomes uncontrollable due to a thermistor failure, the thermistors (T2-4 to T2-7) in thermistor group TG2 will remain in the group of the heat generating block with the failed thermistor. ) are also placed. Therefore, the protection circuit operates (stops power supply) via the thermistor in thermistor group TG2.

Next, the advantage of the configuration in which at least one thermistor out of the eight thermistors is arranged correspondingly to each of all the heat generating blocks HB1 to HB7 will be explained.

For example, assume that the thermistor T2-5 corresponding to group 2 is arranged not at a position corresponding to heat generating block HB5 but at a position corresponding to heat generating block HB3, which is in the same group 2 as heat generating block HB5. In this case, the thermistor T1-3 of the thermistor group TG1 and thermistor T2-5 of the thermistor group TG2 are arranged at the position corresponding to the heat generating block HB3, and there is no thermistor at the position corresponding to the heat generating block HB5. Even with such a configuration, the temperature of group 2 can be monitored. However, in this configuration, if a contact failure occurs between the electrode E3 and the electrical contact C3, the heat generating block HB3 may not generate heat, but the heat generating block HB5, which is in the same group 2 as the heat generating block HB3, may generate heat. Even if the heat generating block HB5 of group 2 generates abnormal heat, the two thermistors T1-3 and T2-5 corresponding to group 2 cannot monitor this and the protection circuit does not work.

On the other hand, in this example, the thermistor T1-3 of the thermistor group TG1 is arranged at the position corresponding to the heat generating block HB3, and the thermistor T2-5 of the thermistor group TG2 is arranged at the position corresponding to the heat generating block HB5. There is. Therefore, even if there is a poor contact between the electrode E3 and the electrical contact C3 and only the heat generating block HB5 of group 2 generates heat, this temperature can be monitored by the thermistor T2-5 and the protection circuit can be operated. In this way, at least one thermistor out of eight thermistors is arranged correspondingly to each of all the heat generating blocks HB1 to HB7, thereby improving the reliability of the device.

FIG. 5 is a flowchart illustrating a control sequence of the control circuit 400 by the CPU 420. When a print request occurs in S100, relays 430 and 440 are turned on in S101.

In S102, the triac 414 is PI-controlled and the power supplied to the heat generating blocks HB1 and HB7 is controlled so that the temperature detected by the thermistor T1-1 (signal Th1-1) reaches the control target temperature.

In S103, the triac 413 is PI-controlled and the power supplied to the heat generating blocks HB2 and HB6 is controlled so that the temperature detected by the thermistor T1-2 (signal Th1-2) reaches the control target temperature.

In S104, the triac 412 is PI-controlled and the power supplied to the heat generating blocks HB3 and HB5 is controlled so that the temperature detected by the thermistor T1-3 (signal Th1-3) reaches the control target temperature.

In S105, the triac 411 is PI-controlled and the power supplied to the heat generating block HB4 is controlled so that the temperature detected by the thermistor T1-4 (signal Th1-4) reaches the control target temperature.

As described above, the control target temperature of each heat generating block is set according to the recording material size information. In the apparatus of this example, the control target temperature of the heat generating block HB4 including the transport reference X is set to the same temperature regardless of the recording material size, and the control target temperatures of the other heat generating blocks are changed depending on the recording material size. The smaller the size of the recording material, the lower the control target temperature of the heat generating blocks other than the heat generating block HB4.

In S106, it is determined whether the temperature increase in the non-sheet passing portion of the heater 300 is equal to or lower than a predetermined threshold temperature (allowable temperature) Tmax. In this example, Tmax is set to 280° C., which is higher than the control target temperature of 250° C. for the heat generating block HB4 and lower than the predetermined value of 300° C. set in the comparing section 431 and the comparing section 441. Further, the positional relationship between the thermistors in the thermistor group TG1 and the reference X and the positional relationship between the thermistors in the thermistor group TG2 and the reference X are different. The thermistors of the thermistor group TG2 are arranged on the outer side of the heater 300 in the longitudinal direction from the transport reference position X in each heat generating block compared to the thermistors of the thermistor group TG1. As shown in FIG. 3(B), if we compare the distance from the reference X of the thermistor T1-4 corresponding to the heat generating block HB4 and the distance from the reference X of the thermistor T2-4 corresponding to the heat generating block HB4, This relationship is easy to understand. With such a layout, even if the temperature of the non-sheet passing portion increases in one heat generating block, it can be detected by the thermistor of the thermistor group TG2.

If the temperature of the thermistors T2-4 to T2 to T7 is equal to or lower than the threshold temperature Tmax in S106, the process advances to S108, and the control in S102 to S106 is repeated until the end of the print job is detected in S108.

If the temperature of the thermistors T2-4 to T2 to T2 exceeds the threshold temperature Tmax in S106, the image forming process speed of the image forming apparatus 100 is reduced and the thermistors T1-1 to T1-4 are controlled in S107. Fixing processing is performed with the target temperature lowered. By lowering the process speed of image formation, fixing performance can be ensured even at a lower temperature than when the image is formed at full speed, so it is also possible to suppress the temperature rise in the non-sheet passing area.

The above process is repeated, and when the end of the print job is detected in S108, the relays 430 and 440 are turned off in S109, and the image forming control sequence is ended in S110.

(Example 2)
Next, a second embodiment will be described in which the heater 300 and heater control circuit 400 described in the first embodiment are replaced with a heater 600 and a control circuit 700. The same symbols are used for the same configurations as in the first embodiment, and the description thereof will be omitted. The heater 600 of Example 2 differs from the heater 300 in the configuration of the sliding surface layer 1. The control circuit 700 is configured to be able to independently control all of the heat generating blocks HB1 to HB7.

FIG. 6 shows a configuration diagram of a heater 600 according to the second embodiment. The configuration other than the sliding surface layer 1 is the same as that of the heater 300, so a description thereof will be omitted.

The sliding surface layer 1 of the heater 600 includes thermistors T3-1a to T3-4a, T3-1b to T3-3b, T4-4a to T4-7a, for detecting the temperatures of the heat generating blocks HB1 to HB7, respectively. T4-5b to T4-7b and T5 are arranged. Since two or more thermistors are associated with all of the heat generating blocks HB1 to HB7, the configuration is such that even if one thermistor fails, the temperature of all the heat generating blocks can be detected.

Thermistor group TG3 has seven thermistors T3-1a to T3-4a and T3-1b to T3-3b, conductive patterns ET3-1a to ET3-4a, ET3-3b, ET3-12b, and a common conductive pattern EG3. .

Similarly, the thermistor group TG4 includes seven thermistors T4-4a to T4-7a and thermistors T4-5b to T4-7b, conductive patterns ET4-4a to ET4-7a, ET4-5b, ET4-67b, and a common conductor. It has pattern EG4.

First, the thermistor group TG3 will be explained. Thermistor T3-1b and thermistor T3-2b are thermistors for detecting the temperature of heat generating blocks HB1 and HB2, and the two thermistors are connected in parallel between conductive pattern ET3-12b and common conductive pattern EG3. It becomes. Even if the temperature of one of the heat generating blocks HB1 and HB2 rises, the resistance value of either thermistor T3-1b or thermistor T3-2b decreases significantly. Therefore, the temperature of both the heat generating blocks HB1 and HB2 can be detected by one conductive pattern ET3-12b for detecting the resistance value of the thermistor. Therefore, compared to the case where a conductive pattern is connected and wired to each of the thermistor T3-1b and thermistor T3-2b, the cost of forming the wiring of the conductive pattern can be reduced. Furthermore, the width of the substrate 305 in the lateral direction can be reduced. Similarly, thermistor T4-6b and thermistor T4-7b are also connected in parallel.

The common conductive patterns EG3 and EG4 are connected on the substrate 305 by a conductive pattern EG34, and are used for disconnection detection described in FIG. 7. By detecting disconnection, it is possible to improve safety in the event of a disconnection failure.

Two thermistors T3-3a and T3-3b are installed for one heat generating block HB3, and conductive patterns ET3-3a and ET3-3b for resistance value detection, and common conductive pattern EG3, respectively. It has a configuration that allows temperature detection.

In the range of the heat generating block HB3, the thermistor T3-3b located far from the transport reference position X is a thermistor for detecting the end temperature, and the thermistor T3-3a located near the transport reference position is a temperature control thermistor. If necessary, one heat generating block may be provided with a plurality of thermistors.

The description of thermistor group TG4 is the same as that of thermistor group TG3, so the description will be omitted.

Thermistor T5 is a single thermistor formed between conductive patterns ET5 and EG5 for resistance value detection. If desired, a single thermistor may be used in combination with a thermistor group.

FIG. 7 shows a circuit diagram of a control circuit 700 of the heater 600 according to the second embodiment. The power of the heater 600 is controlled by turning on/off the triacs 711 to 717. Triacs 711-717 operate according to FUSER1-FUSER7 signals from CPU 420, respectively. The control circuit 700 of the heater 600 has a circuit configuration that allows seven triacs 711 to 717 to independently control seven heat generation blocks HB1 to HB7.

Next, a method of detecting the temperature of the heater 600 will be explained. The CPU 420 receives a signal (Th3-1a-Th3 -4a, Th3-3b, Th3-12b) are input. Similarly, a signal obtained by dividing the voltage Vcc by the resistance values of thermistors T4-4a to T4-7a and T4-5b to T4-7b of thermistor group TG4 and the resistance values of resistors 771 to 776 is input to the CPU 420. do. These signals are shown as Th4-4a to Th4-7a, Th4-5b, and Th4-67b. Similarly, a signal (Th5) that is voltage-divided by the resistance value of the thermistor T5 and the resistance value of the resistor 761 is input to the CPU. The CPU 420 converts each input signal into a temperature corresponding to its level.

The CPU 420 calculates the supplied power, for example, by PI control, based on the set temperature (control target temperature) of each heat generating block and the detected temperature of each thermistor. Further, the calculated power supply is converted into control timing such as a corresponding phase angle (phase control) and wave number (wave number control), and the triacs 711 to 717 are controlled using this control timing.

Next, the operation of the protection circuit using relay 430 and relay 440 will be explained. Based on the Th3-1a to Th3-4a signals of thermistor group TG3 and the Th4-5b and Th4-67b signals of thermistor group TG4, if any one of the detected temperatures exceeds the respective set predetermined value, the comparator 431 operates the latch section 432.

Similarly, if any one of the detected temperatures exceeds the respective set predetermined value based on the Th4-4a to Th4-7a signals of thermistor group TG4 and the Th3-3b and Th3-12b signals of thermistor group TG3, The comparison section 441 operates the latch section 442.

Next, the disconnection detection circuit 780 will be explained. The disconnection detection circuit 780 is a circuit used to increase safety when the common conductive patterns EG3 and EG4 are disconnected.

The circuit operation of the disconnection detection circuit 780 will be explained. When the connection between the common conductive patterns EG3 and EG4 is broken, the resistance 781 and the resistor 782 pull up the connection to the power supply voltage Vcc, so the breakage detection signal ThSafe becomes a High state. Note that the resistor 781 and the resistor 782 are two resistors arranged in consideration of a short-circuit failure of the resistors. When the disconnection detection signal ThSafe becomes High, the latch section 432 and the latch section 442 are operated.

Next, the effects of the disconnection detection circuit 780 and the conductive pattern EG34 will be explained. First, a case will be described in which both the conductive pattern EG34 and the disconnection detection circuit 780 are not included, and the common conductive pattern EG3 and the common conductive pattern EG4 are each connected to GND, as in the configuration of the first embodiment. In this case, if the common conductive pattern EG3 is disconnected, all of the thermistors in the thermistor group TG3 stop working, so the protection circuit that stops power supply to the heat generating blocks HB1 to HB3 stops working. Similarly, when the common conductive pattern EG4 is disconnected, all of the thermistors in the thermistor group TG4 cease to operate, and the protection circuit that stops power supply to the heat generating blocks HB5 to HB7 ceases to function.

Next, although it has a conductive pattern EG34 that connects the common conductive patterns EG3 and EG4, it does not have the disconnection detection circuit 780, and as in the configuration of the first embodiment, the common conductive patterns EG3 and EG4 are connected to each other. The case where it is connected to GND will be explained. In this case, due to the effect of the conductive pattern EG34, even if one of the common conductive patterns EG3 and EG4 is disconnected, it is connected to GND via the conductive pattern EG34. Therefore, temperature detection by the thermistor groups TG3 and TG4 becomes possible. However, if the unillustrated connector that connects the conductive patterns (ET3-1a to ET3-4a, ET3-12b, ET3-3b, and EG3) of thermistor group TG3 and the control circuit 700 is disconnected, the thermistor of thermistor group TG3 Everything stops working. Therefore, the protection circuit that stops power supply to the heat generating blocks HB1 to HB3 does not work. Similarly, if the connector connecting the conductive patterns (ET4-4a to ET4-7a, ET4-67b, ET4-5b, EG4) of thermistor group TG4 and the control circuit 700 is disconnected, all thermistors of thermistor group TG4 operate. I won't. Therefore, the protection circuit that stops power supply to the heat generating blocks HB5 to HB7 does not work.

In contrast, the device of this example includes a conductive pattern body EG34 and a disconnection detection circuit 780. With this, it is possible to detect both failure states, such as a failure in which the common conductive patterns EG3 and EG4 are disconnected, and a failure in which the connector connecting the thermistor groups TG3 and TG4 and the control circuit 700 is disconnected.

FIG. 8 is a flowchart illustrating the control sequence of the control circuit 700 by the CPU 420. The same symbols are used for the same configuration as in FIG. 5, and the description thereof will be omitted.

In S201, the triac 711 is subjected to PI control and the power supplied to the heat generating block HB1 is controlled so that the temperature detected by the thermistor T3-1a (signal Th3-1a) reaches a predetermined target temperature.

In S202, the triac 712 is subjected to PI control and the power supplied to the heat generating block HB2 is controlled so that the temperature detected by the thermistor T3-2a (signal Th3-2a) reaches a predetermined target temperature.

In S203, the triac 713 is subjected to PI control and the power supplied to the heat generating block HB3 is controlled so that the temperature detected by the thermistor T3-3a (signal Th3-3a) reaches a predetermined target temperature.

In S204, the triac 714 is PI-controlled and the power supplied to the heat generating block HB4 is controlled so that the temperature detected by the thermistor T5 (signal Th5) reaches a predetermined target temperature.

In S205, the triac 715 is PI-controlled and the power supplied to the heat generating block HB5 is controlled so that the temperature detected by the thermistor T4-5a (signal Th4-5a) reaches a predetermined target temperature.

In S206, the triac 716 is subjected to PI control and the power supplied to the heat generating block HB6 is controlled so that the temperature detected by the thermistor T4-6a (signal Th4-6a) reaches a predetermined target temperature.

In S207, the triac 717 is subjected to PI control and the power supplied to the heat generating block HB7 is controlled so that the temperature detected by the thermistor T4-7a (signal Th4-7a) reaches a predetermined target temperature.

In S208, it is determined whether the temperature increase in the non-sheet passing portion of the heater 300 is equal to or lower than a predetermined threshold temperature (allowable temperature) Tmax.

If the temperatures of thermistors T3-4a, T4-4a, T3-3b, and T4-5b are equal to or lower than the threshold temperature Tmax in S208, the process advances to S108, and the controls in S201 to S208 are continued until the end of the print job is detected in S108. repeat.

(Example 3)
The heater 800 in FIG. 9 is an example in which the heating resistor 802 is disposed on the side of the fixing nip N, and the thermistor group TG6 is disposed on the opposite side of the fixing nip N. The same symbols are used for the same configurations as in the first embodiment, and the description thereof will be omitted.

FIG. 9(A) shows a cross-sectional view of the central portion of the heater 800 (near the transport reference position X). Only a conductive pattern is formed on the back layer 1, and a chip thermistor T6-2 is bonded thereon. 810 and 811 are electrodes of the chip thermistor T6-2. A conductive pattern EG6 and a conductive pattern ET6-2 are connected to the chip thermistor T6-2 via an electrode 810 and an electrode 811. By arranging the thermistor group TG6 on the opposite side of the fixing nip N as in the heater 800, flatness required for the sliding surface layer is not required, and a thick chip thermistor T6-2 can be installed.

The thermistor group TG6 provided on the back layer 1 of the heater 800 includes three chip thermistors T6-1 to T6-3, conductive patterns ET6-1 to ET6-3 for detecting the resistance values of the thermistors, and a common conductive pattern EG6. have.

The sliding surface layer 1 of the heater 800 is provided with three heat generating blocks HB1 to HB3. The heating resistor 802 is divided into three parts 802-1 to 802-3, and receives electric power through the first conductor 801 and the second conductor 803-1 to 803-3, which are divided into three parts. Supplied. The second conductors 803-1 to 803-3 are connected to the electrodes E1 to E3, and the first conductor 801 is connected to the electrode E8. By using the electrode E8 as a common electrode and providing switch elements such as triacs on the electrodes E1 to E3, the three heat generating blocks HB1 to HB3 can be independently controlled. Glass having sliding properties and insulation properties is provided as a protective layer 808 on the sliding surface layer 2 of the heater 800 .

By the way, in the heater 800, in order to supply power to the heat generating blocks HB1 to HB3, it is necessary to wire the first conductor 801 and the second conductor 803 at both ends of the heater in the short direction. Therefore, especially when the number of heat generating blocks increases, the area for wiring the first conductor 801 and the second conductor 803 increases, resulting in an increase in the size of the heater.

When the electrodes E2 to E6 are provided in the heat generating area as in the heater 300 described in the first embodiment and the heater 600 described in the second embodiment, the wiring required for the first conductor 301 and the second conductor 303 is Since a large area is not required, the number of heat generating blocks can be increased without increasing the size of the heater. In the configuration in which the electrodes E2 to E6 are provided within the heat generating region, it is necessary to provide the electrodes E2 to E6 on the opposite side of the fixing nip portion N in order to connect the electrical contacts C2 to C6. Therefore, a configuration in which the heat generating blocks (HB1 to HB7) are formed on the side opposite to the fixing nip N and the thermistor groups (TG1, TG2, TG3, TG4) are formed on the side of the fixing nip N is effective.

When the number of heat generating blocks is small, a method of arranging a thermistor group TG6 using a plurality of chip thermistors on the opposite side of the fixing nip N, like the heater 800 described in this embodiment, can be applied.

(Example 4)
Embodiment 4 shown in FIG. 10 differs from the heaters of Embodiments 1 and 2 in the shape of the heating resistor. The heating resistors 902a and 902b of the heater 900 shown in FIG. 10(A) are continuous (not divided) in the longitudinal direction.

FIG. 10(A) is a plan view of the back layer 1 of the heater 900. Since the conductor 303 is divided into seven parts in the longitudinal direction, the temperature of the heating elements 902a and 902b can be controlled independently in the regions of the heating blocks HB1 to HB7. In the heater 900, the heating elements 902a and 902b are not divided, so even in the divided gap region of the conductor 303, heat is generated continuously in the longitudinal direction, and there is no region where the amount of heat generation becomes 0 (zero). The heater can generate heat more uniformly in the longitudinal direction.

In a heater 1000 shown in FIG. 10(B), heat generating resistors 1002a and 1002b are further divided into a plurality of heat generating resistors connected in parallel.

FIG. 10(B) is a plan view of the back layer 1 of the heater 1000. The heating resistor 1002a is divided into a plurality of parts, and is connected in parallel between the conductor 303 and the conductor 301a. Similarly, the heating resistor 1002b is divided into a plurality of parts and connected in parallel between the conductor 303 and the conductor 301a.

The divided heat generating resistors 1002a and 1002b are arranged obliquely with respect to the longitudinal direction and the lateral direction of the heater 1000, and overlap in the longitudinal direction of the heater 1000. As a result, the influence of the gaps between the plurality of divided heating resistors can be reduced, and the uniformity of the heat generation distribution in the longitudinal direction of the heater 1000 can be improved. In addition, in the heater 1000, also in the gap between the heat generating blocks, the divided heat generating resistors at the ends of the adjacent heat generating blocks overlap in the longitudinal direction, so that the heat generation distribution in the longitudinal direction of the heater 1000 is can be made more uniform. The heat generating resistors at the extreme ends of adjacent heat generating blocks are, for example, the heat generating resistor at the right end of heat generating block HB1 and the heat generating resistor at the left end of heat generating block HB2.

Further, the heat distribution of the heat generating resistors 1002a and 1002b can be controlled by adjusting the width, length, interval, inclination, etc. of the divided heat generating resistors. By employing the configuration of the heater 900 or the heater 1000, temperature unevenness in the gap between the plurality of heat generating blocks can be suppressed.

(Example 5)
FIG. 11 shows the waveform of the current flowing to each heat generating block in the control circuit 400 shown in the first embodiment. FIG. 11A shows a drive pattern for the triac 411 (a table of current waveforms flowing through the heat generating block HB4), which is set for each duty ratio of the power supplied to the heater 300. Similarly, FIG. 11(B) is a drive pattern for the triacs 412 to 414 (a table of current waveforms flowing through the heat generating blocks HB1 to HB3 and HB5 to HB7).

When the CPU 420 calculates the level (duty ratio) of power supplied to the heater for each control cycle, the CPU 420 selects a waveform corresponding to the duty ratio for each heat generating block to be supplied. In the control method of this embodiment, the power supplied to the heater 300 is controlled by setting the energization control pattern for each triac using four half waves as one control period.

An example of the energization control pattern of the triac 411 when the duty ratio is 25% will be described below. In the energization control pattern A of the triac 411 shown in FIG. 11(A), 50% of the power is supplied by controlling the 1st half wave to the 2nd half wave at a phase angle of 90°, and the 3rd half wave to the 4th half wave is turned off. are doing. Therefore, 25% of the power is supplied to the heat generating block HB4 of the heater 300 on average. The energization control pattern A is an energization pattern that performs phase control from one half wave to two half waves.

Furthermore, in the energization control pattern of the triacs 412 to 414 shown in FIG. The waves are turned off. Therefore, on average, 25% of the power is supplied to the heat generating blocks HB1 to HB3 and HB5 to HB7 of the heater 300. The energization control pattern B is an energization pattern that performs phase control on 3rd to 4th half waves.

Since the heat generating block HB4 of the heater 300 has a lower resistance value than the other heat generating blocks, the amount of current fluctuation during phase control is larger than that of the other heat generating blocks. Therefore, in this example, the timing at which the phase control current flows to the heat generating block HB4 (1st half wave to 2nd half wave) and the timing at which the phase control current flows to the other heat generating blocks HB1 to HB3 and HB5 to HB7 (3rd half wave) Waves to 4 and a half waves) are shifted. Thereby, the fluctuation value of the phase control current flowing throughout the heater 300 can be suppressed. The same holds true for duty ratios other than 25%.

As shown in FIG. 11, in this example, the harmonic current of the image heating device 200 can be reduced by synchronizing the control timings of a plurality of triacs (synchronous control of a plurality of triacs). FIG. 11 is an example of synchronous control. For example, synchronous control of multiple triacs may be performed to reduce flicker.

Note that synchronous control of a plurality of triacs 711 to 717 of the control circuit 700 can be performed using the same method.

The advantages of synchronous control of multiple triacs are that harmonic current and flicker can be reduced, and even if the total resistance value of the heater 300 is set low, standards for harmonic current and flicker can be satisfied. If the resistance value of heater 300 can be set low, the maximum power that can be supplied from AC power supply 401 to heater 300 can be increased.

The plurality of embodiments described above have been described using a center-based printer that transports the recording material so that the center of the recording material in the width direction is aligned with the transport reference position X. However, the present invention can also be applied to a one-sided reference printer in which one longitudinal end of the heater is set as the transport reference position and one widthwise end of the recording material is transported in alignment with the transport reference position.

200 Image heating device 300 Heater 301 First conductor 302 Heat generating resistor 303 Second conductor 305 Substrate E1 to E7, E8-1, E8-2 Electrode HB1 to HB7 Heat generating block

The present invention for solving the above-mentioned problems includes a cylindrical film, a heater provided in an internal space of the film, a substrate, and a heater provided in the substrate that generates heat when supplied with electric power. a heater having one heat generating block and a second heat generating block that is provided at a position different from the position where the first heat generating block is provided in the longitudinal direction of the substrate and generates heat by supplying electric power; a roller that contacts the outer circumferential surface of the film and forms a nip portion between which the film is sandwiched between the roller and the heater and the recording material is pinched and conveyed therebetween; and the first heat generating block. a first switch element for controlling power supplied to the second heat generating block, and a second switch element for controlling power supplied to the second heat generating block, and the recording material is held in the nip portion. In a fixing device that heats and fixes a toner image formed on a recording material while conveying the recording material, a plurality of temperature sensors are provided in the region where the first heat generating block is provided in the longitudinal direction, and The plurality of temperature sensors include a first sensor, a second sensor, and a third sensor, the first sensor being provided near the reference conveyance position of the recording material in the longitudinal direction, and the second sensor being The third sensor is provided at one end position in the region where the first heat generating block is provided in the longitudinal direction, and the third sensor is located at one end position within the region where the first heat generating block is provided in the longitudinal direction. It is characterized in that it is provided at the other end position .

Claims (4)

a substrate; a first heat generating block that is formed on the substrate and generates heat when power is supplied;
a second heat generating block that is formed at a position different from the position where the first heat generating block is formed in the longitudinal direction of the substrate and is controlled independently of the first heat generating block;
In a heater used in an image heating device having
The heater further includes a first temperature sensing element provided at a position corresponding to the first heat generating block, and a second temperature sensing element provided at a position corresponding to the second heat generating block.
a first conductive pattern that is electrically connected to the first temperature sensing element; a second conductive pattern that is electrically connected to the second temperature sensing element; and a second conductive pattern that is electrically connected to the first and second temperature sensing elements. A heater characterized by having a common conductive pattern that is connected to each other. The first and second heat generating blocks each include a first conductor provided along the longitudinal direction, and a first conductor disposed along the longitudinal direction at different positions in the transverse direction of the substrate. a second conductor provided along the direction; and a second conductor provided between the first conductor and the second conductor and connected through the first conductor and the second conductor. 2. The heater according to claim 1, further comprising a heating element that generates heat using electric power supplied by the heater. the first temperature sensing element, the second temperature sensing element, the first conductive pattern,
The second conductive pattern and the common conductive pattern are formed on a surface of the substrate opposite to the substrate surface on which the first and second heat generating blocks are formed. The heater according to claim 1. An image heating device that has a cylindrical film and a heater that contacts an inner surface of the film, and heats an image formed on a recording material with the heat of the heater via the film,
An image heating apparatus characterized in that the heater is the heater according to any one of claims 1 to 3.

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