JP2024018649A - Light-emitting device, optical device, light-emitting module, and method for manufacturing a light-emitting device - Google Patents

Abstract

The present invention provides a light emitting device that can reduce the deviation between the traveling direction of laser light emitted from a semiconductor laser element and the designed traveling direction.
A light emitting device includes a semiconductor laser element that emits laser light, an optical member that changes the traveling direction of the laser light emitted from the semiconductor laser element, and a support that supports the semiconductor laser element and the optical member. Be prepared. The optical member includes a first mirror member having a first reflective surface and a second mirror member having a second reflective surface. The support includes a first support surface that supports the first mirror member such that the first reflection surface reflects the laser beam and changes the traveling direction of the laser beam, and at least a portion of the second reflection surface has the first reflection surface. A second mirror member is supported so as to be located above or below at least a portion of the surface, and the second reflective surface reflects the laser light reflected by the first reflective surface to change the traveling direction of the laser light. and a second support surface that supports the second mirror member in such a manner that the second mirror member is supported.
[Selection diagram] Figure 2A

Description

The present disclosure relates to a light emitting device, an optical device, a light emitting module, and a method for manufacturing a light emitting device.

BACKGROUND ART In recent years, with the increase in the output power of semiconductor laser devices, technologies are being developed that use semiconductor laser devices not as excitation light sources but as light sources of laser light for directly irradiating and processing materials. Such technology is called Direct Diode Laser (DDL) technology.

DDL technology uses a light emitting module that includes a plurality of semiconductor laser elements. The light emitting module combines a plurality of laser beams obtained by emitting laser beams from each of a plurality of semiconductor laser elements, and emits a high-power laser beam. When the traveling directions of a plurality of laser beams are aligned in the same direction as designed, the plurality of laser beams can be effectively combined. Patent Document 1 discloses an example of an optical component that can suppress a deviation between the traveling direction of laser light emitted from a semiconductor laser element and the designed traveling direction.

International Publication No. 2016/051836

A light emitting device capable of reducing the deviation between the traveling direction of laser light emitted from a semiconductor laser element and the designed traveling direction, an optical device used in the light emitting device, a light emitting module including a plurality of light emitting devices, and A method of manufacturing a light emitting device is provided.

In an embodiment, a light emitting device of the present disclosure includes a semiconductor laser element that emits laser light, an optical member that changes the traveling direction of the laser light emitted from the semiconductor laser element, and the semiconductor laser element and the optical member. a support for supporting the member, the optical member having a first mirror member having a first reflective surface, and a second mirror member having a second reflective surface; a first support surface that supports the first mirror member such that the first reflective surface reflects the laser beam and changes the traveling direction of the laser beam; and at least a portion of the second reflective surface The second mirror member is supported so as to be located above or below at least a portion of one reflective surface, and the second reflective surface reflects the laser beam reflected by the first reflective surface to reflect the laser beam. and a second support surface that supports the second mirror member so as to change the traveling direction of the laser beam.

In an embodiment, the optical device of the present disclosure includes a first mirror member having a first reflective surface, a second mirror member having a second reflective surface, and supporting the first mirror member and the second mirror member. a support, the support supports the first mirror member such that the first reflective surface reflects the laser light emitted from the semiconductor laser element and changes the traveling direction of the laser light. the second mirror member is supported such that at least a portion of the first supporting surface and the second reflecting surface are located above or below at least a portion of the first reflecting surface, and the second reflecting surface has a second support surface that supports the second mirror member so as to reflect the laser light reflected by the first reflective surface and change the traveling direction of the laser light.

In an embodiment, the light emitting module of the present disclosure is a support base having a plurality of mounting surfaces arranged in a first direction, wherein the plurality of mounting surfaces are separated from a reference plane parallel to the first direction. A plurality of light emitting devices, the supporting base having a height decreasing stepwise along the first direction, and a corresponding light emitting device disposed on each of the plurality of mounting surfaces, each of the plurality of light emitting devices comprising: The optical member includes a plurality of light emitting devices, which are light emitting devices, and a condensing lens, and the optical member included in each of the plurality of light emitting devices has a third mirror member, and the third mirror member has a third reflecting member. The support body included in each of the plurality of light emitting devices has a surface, and the third reflective surface reflects the laser light reflected by the second reflective surface to change the traveling direction of the laser light. each of the plurality of light emitting devices has a third support surface that supports the third mirror member so as to change the third mirror member; The laser beam is reflected in this order on a reflective surface to change the traveling direction of the laser beam to a second direction intersecting the first direction, and the laser beam reflected on the second reflective surface is reflected on the third reflective surface. and changes the traveling direction of the laser light to the first direction, thereby emitting the laser light in the first direction, and the condenser lens is configured to emit the laser light from each of the plurality of light emitting devices. A plurality of laser beams emitted in the first direction are combined.

In an embodiment, the method for manufacturing a light emitting device of the present disclosure includes: a semiconductor laser element that emits laser light; and an optical member that changes the traveling direction of the laser light emitted from the semiconductor laser element, the first an optical member having a first mirror member having a reflective surface and a second mirror member having a second reflective surface; and a support supporting the semiconductor laser element and the optical member, the support supporting the first mirror member. a step of preparing a support body having a first support surface and a second support surface that supports the second mirror member; a step of arranging the semiconductor laser element on the support body; bonding the first mirror member to the first support surface so as to reflect light and change the traveling direction of the laser beam, and the second reflective surface is reflected by the first reflective surface. The method includes the step of joining the second mirror member to the second support surface so as to reflect the laser light and change the traveling direction of the laser light.

According to an embodiment of the present disclosure, a light emitting device capable of reducing a deviation between a traveling direction of laser light emitted from a semiconductor laser element and a designed traveling direction, an optical device used in the light emitting device, and a plurality of optical devices are provided. A light emitting module including a light emitting device and a method for manufacturing the light emitting device can be realized.

FIG. 1A is a top view schematically illustrating the configuration of a light emitting module according to an exemplary embodiment of the present disclosure. FIG. 1B is a side view schematically showing the configuration of a light emitting module according to an exemplary embodiment of the present disclosure. FIG. 1C is a top view schematically showing the configuration of a modified example of the light emitting module according to the embodiment of the present disclosure. FIG. 2A is a perspective view schematically showing the configuration of a light emitting device according to an exemplary embodiment of the present disclosure. FIG. 2B is a cross-sectional view of the light emitting device shown in FIG. 2A, parallel to the YZ plane. FIG. 2C is a top view of the light emitting device shown in FIG. 2A. FIG. 2D is a perspective view schematically showing the structure of the support shown in FIG. 2A. FIG. 3 is a cross-sectional view parallel to the YZ plane, schematically showing the configuration of a modified example of the light emitting device according to the embodiment of the present disclosure. FIG. 4A is a diagram for explaining an example of a process in a method for manufacturing a light emitting device according to an embodiment of the present disclosure. FIG. 4B is a diagram for explaining an example of a process in a method for manufacturing a light emitting device according to an embodiment of the present disclosure. FIG. 4C is a diagram for explaining an example of a process in a method for manufacturing a light emitting device according to an embodiment of the present disclosure. FIG. 4D is a diagram for explaining an example of a process in a method for manufacturing a light emitting device according to an embodiment of the present disclosure. FIG. 4E is a diagram for explaining an example of a process in a method for manufacturing a light emitting device according to an embodiment of the present disclosure. FIG. 5 is a diagram schematically illustrating the configuration of a DDL device according to an exemplary embodiment of the present disclosure. FIG. 6A is a perspective view schematically showing the configuration of a laser light source. FIG. 6B is a diagram schematically showing the internal plan configuration of the laser light source shown in FIG. 6A. FIG. 6C is an exploded perspective view showing more details of the structure of the laser light source shown in FIG. 6A, with the base, lid, lead terminal, and internal wires omitted. FIG. 6D is a cross-sectional view of the laser light source shown in FIG. 6C, parallel to the YZ plane.

Hereinafter, a light-emitting device, an optical device used in the light-emitting device, a light-emitting module including a plurality of light-emitting devices, and a method for manufacturing the light-emitting device according to embodiments of the present disclosure will be described with reference to the drawings. Parts with the same reference numerals appearing in multiple drawings indicate the same or equivalent parts.

Further, the embodiments described below are exemplified to embody the technical idea of the present invention, and the present invention is not limited to the following. Moreover, the description of the size, material, shape, relative arrangement, etc. of the constituent elements is not intended to limit the scope of the present invention only thereto, but is intended to be illustrative. The sizes and positional relationships of members shown in each drawing may be exaggerated for ease of understanding.

(Embodiment)
[Light-emitting module]
First, a configuration example of a light emitting module according to an embodiment of the present disclosure will be described with reference to FIGS. 1A and 1B. 1A and 1B are top and side views, respectively, schematically illustrating the configuration of a light emitting module according to an exemplary embodiment of the present disclosure. In these figures, for reference, the X-axis, Y-axis, and Z-axis, which are perpendicular to each other, are schematically shown. The direction of the arrow on the X-axis is called the +X direction, and the opposite direction is called the -X direction. When the ±X direction is not distinguished, it is simply referred to as the X direction. The same applies to the Y direction and the Z direction. In this specification, for ease of explanation, the +Y direction will be referred to as "upward" and the -Y direction will be referred to as "downward." This does not limit the orientation of the light emitting module during use, and the orientation of the light emitting module is arbitrary.

The light emitting module 200 shown in FIGS. 1A and 1B includes a support base 40, a condensing lens 50, an optical fiber 60, a support member 62 that supports the optical fiber 60, and a plurality of light emitting devices 100.

The support base 40 is arranged on a reference plane Ref parallel to the XZ plane, as shown in FIG. 1B. The reference plane Ref is a height reference plane in the light emitting module 200. The support base 40 has a plurality of first mounting surfaces 40s1 and a second mounting surface 40s2 arranged in the X direction. The heights of the plurality of first mounting surfaces 40s1 decrease stepwise along the +X direction. A corresponding light emitting device 100 is arranged on each first mounting surface 40s1. A condensing lens 50 is arranged on the second mounting surface 40s2, and an optical fiber 60 is arranged via a support member 62.

In the example shown in FIG. 1B, the height of the second mounting surface 40s2 is greater than the minimum height and smaller than the maximum height of the plurality of first mounting surfaces 40s1. Depending on the size of the condenser lens 50 in the Y direction, the height of the second mounting surface 40s2 may be equal to or smaller than the minimum height of the plurality of first mounting surfaces 40s1. Alternatively, the height of the second mounting surface 40s2 may be equal to or greater than the maximum height of the plurality of first mounting surfaces 40s1.

In the example shown in FIGS. 1A and 1B, the number of light emitting devices 100 is four, and the number of the plurality of first mounting surfaces 40s1 is four, but the number is not limited to these. The number of light emitting devices 100 may be two, three, or five or more. As the number of light emitting devices 100 increases, it becomes possible to obtain higher output laser light. The number of first mounting surfaces 40s1 may be two, three, five or more, and may be equal to or greater than the number of light emitting devices 100.

Support substrate 40 may be formed from a ceramic selected from the group consisting of AlN, SiN, SiC, and alumina, for example. Alternatively, the support base 40 may be formed from at least one metal material selected from the group consisting of, for example, Cu, Al, and Ag. Support substrate 40 may be formed, for example, from a metal matrix composite material in which diamond particles are dispersed in at least one metal material selected from the group consisting of Cu, Al, and Ag. Support base 40 may be an assembly of multiple parts. The plurality of parts may be formed from different materials.

The support base 40 is preferably made of a metal material selected from the group consisting of Cu, Al, and Ag, and is preferably made of a single member. Metal materials have better heat dissipation than ceramics, and are softer and easier to process.

The support base 40 functions as a support base on which the plurality of light emitting devices 100 are arranged, and also functions as a heat sink that transmits heat emitted from the plurality of light emitting devices 100 to the outside to reduce excessive temperature rise of the light emitting devices 100. It is possible. In that case, one or more channels for liquid cooling may be provided inside the support base 40. For example, water can be used as the liquid used for liquid cooling. Further, a fin structure for air cooling may be provided on the surface of the support base 40. Alternatively, when the supporting base 40 is placed on a separately prepared heat sink, the supporting base 40 can also function as a heat spreader that transmits the heat emitted from the plurality of light emitting devices 100 to the heat sink.

Each light emitting device 100 includes a laser light source 10, an optical member 20, and a support 30 that supports the laser light source 10 and the optical member 20, as shown in FIG. 1A. As will be explained in detail later, the optical member 20 is capable of moving the laser beam L emitted from the laser light source 10 regardless of whether the traveling direction of the laser beam L deviates from the +Z direction, which is the designed traveling direction. The traveling direction is directed to +Z direction and then changed to +X direction. As a result, each light emitting device 100 emits laser light L in the +X direction toward the condenser lens 50. The laser light L emitted from each light emitting device 100 is represented by a thick line with three arrows in the example shown in FIG. 1A, and is represented by a thick line with one arrow in the example shown in FIG. 1B. . The reason why the laser beam L is represented by a thick line with three arrows in the example shown in FIG. 1A is to emphasize that the laser beam L has a spread.

The condenser lens 50 includes a fast-axis condenser lens 50a and a slow-axis condenser lens 50b. The fast-axis condensing lens 50a may be, for example, a cylindrical lens having a uniform cross-sectional shape in the Z direction, and the slow-axis condensing lens 50b may be, for example, a cylindrical lens having a uniform cross-sectional shape in the Y direction. . The optical axes of the fast-axis condensing lens 50a and the slow-axis condensing lens 50b are parallel to the X direction. Condenser lens 50 may be formed from at least one translucent material selected from the group consisting of glass, silicon, quartz, synthetic quartz, sapphire, transparent ceramics, silicone resin, and plastic, for example.

The fast-axis condensing lens 50a is arranged so that its focal point substantially coincides with the light incident end 60a of the optical fiber 60. Similarly, the slow axis condensing lens 50b is arranged so that its focal point substantially coincides with the light incident end 60a of the optical fiber 60. The focal length of the fast-axis condenser lens 50a is longer than the focal length of the slow-axis condenser lens 50b. As shown in FIG. 1B, the fast-axis condensing lens 50a directs the plurality of laser beams L obtained by emitting the laser beams L from each of the plurality of light emitting devices 100 on the XY plane to the light input end of the optical fiber 60. Converge to 60a. As shown in FIG. 1A, the slow axis condensing lens 50b converges the laser light L having a spread emitted from each of the plurality of light emitting devices 100 onto the light incident end 60a in the XZ plane. As described above, the plurality of laser beams L can be combined by the condenser lens 50 and made to enter the optical fiber 60.

As a result, the light emitting module 200 emits combined light in which the plurality of laser beams L are combined from the light emitting end 60b of the optical fiber 60. The output of the combined light is approximately equal to the value obtained by multiplying the output of the laser beam L emitted from each light emitting device 100 by the number of light emitting devices 100. Therefore, by increasing the number of light emitting devices 100, the output of combined light can be increased.

Next, a modification of the light emitting module 200 according to the embodiment of the present disclosure will be described with reference to FIG. 1C. FIG. 1C is a top view schematically showing the configuration of a modified example of the light emitting module according to the embodiment of the present disclosure. The light emitting module 210 shown in FIG. 1C differs from the light emitting module 200 shown in FIG. 1A in the following three points. The first point is that the light emitting module 210 includes a support base 42 instead of the support base 40. The shape of the support base 42 is different from the shape of the support base 40. The second point is that the light emitting module 210 further includes a plurality of light emitting devices 100b in addition to the plurality of light emitting devices 100a. The light emitting device 100a has the same configuration as the light emitting device 100 shown in FIG. 1A. The light emitting device 100b has a configuration in which the light emitting device 100a is reversed in the Z direction. The third point is that the light emitting module 210 further includes a mirror 72, a half-wave plate 74, and a polarizing beam splitter 76.

The support base 42 has a plurality of first mounting surfaces 40s1 and a second mounting surface 40s2 arranged in the X direction. The heights of the plurality of first mounting surfaces 40s1 decrease stepwise along the +X direction. A light emitting device 100a and a light emitting device 100b are arranged in this order along the +Z direction on each of the plurality of first mounting surfaces 40s1. The light emitting device 100a emits laser light La in the +X direction, and the light emitting device 100b emits laser light Lb in the +X direction. The polarization directions of laser light La and laser light Lb are parallel to the Z direction. A condensing lens 50 is arranged on the second mounting surface 40s2, and an optical fiber 60 is arranged via a support member 62. A mirror 72, a half-wave plate 74, and a polarizing beam splitter 76 are further arranged on the second mounting surface 40s2.

The mirror 72 changes the traveling direction of the laser beam Lb emitted from each light emitting device 100b in the +X direction to the -Z direction. The half-wave plate 74 changes the polarization direction of the laser beam Lb traveling in the −Z direction from the X direction to the Y direction. The polarizing beam splitter 76 transmits laser light La that travels in the +X direction and has a polarization direction in the Z direction, and reflects laser light Lb that travels in the −Z direction and has a polarization direction in the Y direction. The laser beam La transmitted through the polarizing beam splitter 76 is focused by the condensing lens 50 onto the light incident end 60a of the optical fiber 60. Similarly, the laser beam Lb reflected by the polarizing beam splitter 76 is focused by the condensing lens 50 onto the light incident end 60a of the optical fiber 60.

As a result, the light emitting module 210 emits a combined light in which the plurality of laser beams La and the plurality of laser beams Lb are combined from the light emitting end 60b of the optical fiber 60. In the light emitting module 210, compared to the light emitting module 200, the total number of light emitting devices 100a and the number of light emitting devices 100b is twice the number of light emitting devices 100. Therefore, the output of the combined light can be further increased.

In the light emitting module 200, when the traveling directions of the plurality of laser beams L are aligned in the +X direction as designed, the plurality of laser beams L can be effectively combined by the condenser lens 50 and enter the optical fiber 60. can. The same applies to the case where, in the light emitting module 210, the traveling directions of the plurality of laser beams La and the plurality of laser beams Lb are aligned in the +X direction as designed.

[Light emitting device]
Below, a configuration example of a light emitting device according to an embodiment of the present disclosure will be described with reference to FIGS. 2A to 2D. According to the light emitting device according to the embodiment of the present disclosure, it is possible to reduce the deviation between the traveling direction of the laser light L emitted from the laser light source 10 and the designed traveling direction. In this specification, when it is simply described as "progressing direction" such as "progressing direction of laser light", the "progressing direction" means the actual propagating direction.

FIG. 2A is a perspective view schematically showing the configuration of a light emitting device according to an exemplary embodiment of the present disclosure. The light emitting device 100 shown in FIG. 2A includes a laser light source 10, an optical member 20, and a support 30 that supports the laser light source 10 and the optical member 20. The optical member 20 includes a first mirror member 22a, a second mirror member 22b, a third mirror member 22c, and a slow axis collimating lens 24. Of the two regions surrounded by the broken line shown in FIG. 2A, the first mirror member 22a is shown extracted in one, and the second mirror member 22b is shown extracted in the other. The first mirror member 22a has a first reflective surface 22as, the second mirror member 22b has a second reflective surface 22bs, and the third mirror member 22c has a third reflective surface 22cs. In this specification, a structure that includes at least the optical member 20 and the support 30 and is capable of changing the traveling direction of the laser light L emitted from the laser light source 10 is referred to as an "optical device". . FIG. 2B is a cross-sectional view of the light emitting device 100 shown in FIG. 2A, parallel to the YZ plane. In the area surrounded by the broken line shown in FIG. 2B, the first mirror member 22a, the second mirror member 22b, and their surrounding structures are shown in an enlarged manner. FIG. 2C is a top view of the light emitting device 100 shown in FIG. 2A. FIG. 2D is a perspective view schematically showing the structure of the support body 30 shown in FIG. 2A.

Although the laser light L emitted from the laser light source 10 roughly travels in the +Z direction, the traveling direction of the laser light L may not be completely parallel to the +Z direction, which is the designed traveling direction. In the light emitting device 100 according to the present embodiment, regardless of whether the traveling direction of the laser light L emitted from the laser light source 10 deviates from the +Z direction, as shown in FIG. 2B, the laser light emitted from the laser light source 10 By reflecting the light L on the first reflecting surface 22as and the second reflecting surface 22bs in this order, the traveling direction of the laser beam L can be directed to the +Z direction which is the designed traveling direction. Thereafter, the laser beam L reflected by the second reflecting surface 22bs is reflected by the third reflecting surface 22cs as shown in FIG. 2C, thereby changing the traveling direction of the laser beam L to the +X direction, which is the designed traveling direction. It can be changed. In this way, the light emitting device 100 according to this embodiment can emit the laser beam L in the +X direction toward the condenser lens 50, as shown in FIGS. 1A and 1B. As a result, the plurality of laser beams L emitted from each of the plurality of light emitting devices 100 in the +X direction can be effectively combined, and the light emitting module 200 can output high-power combined light. .

In a configuration where the traveling direction of the laser beam L incident on the third reflective surface 22cs is not parallel to the designed +Z direction, the traveling direction of the laser beam L reflected by the third reflective surface 22cs is the designed +X direction. deviate from The plurality of laser beams L having such a shift in the traveling direction may not be effectively combined, even if the angle of shift is several degrees, and the output of the combined light may be reduced.

On the other hand, in this embodiment, it is possible to reduce the deviation between the traveling direction of the laser beam L reflected by the second reflecting surface 22bs and the +Z direction which is the designed traveling direction. As a result, it is possible to reduce the deviation between the traveling direction of the laser beam L reflected by the third reflecting surface 22cs and the +X direction which is the designed traveling direction. The angle between the traveling direction of the laser beam L and the designed traveling direction is preferably, for example, 1° or less, and more preferably 0.1° or less. In this specification, the angle between two directions has a positive value and does not have a negative value.

In this embodiment, the designed traveling direction of the laser beam L reflected by the second reflecting surface 22bs is parallel to the +Z direction, and the designed traveling direction of the laser beam L reflected by the third reflecting surface 22cs. The direction is parallel to the +X direction. However, the designed direction of travel is not limited to these directions.

In this specification, the direction in which the plurality of first mounting surfaces 40s1 shown in FIG. 1A and FIG. ``Two directions.'' The reference plane Ref shown in FIG. 1B is parallel to the first direction. In this embodiment, the first direction is the +X direction and the second direction is the +Z direction, but the present invention is not limited to these directions. The second direction does not need to be orthogonal to the first direction as long as it intersects with the first direction.

Note that if the light emitting device 100 is not employed in the light emitting module 200 shown in FIGS. 1A and 1B and there is no need to change the traveling direction of the laser beam L reflected by the second reflecting surface 22bs, the third mirror member There is no need to place 22c. In addition, the light emitting device 100 may be adopted as a more general spatially coupled light emitting module.

Each component of the light emitting device 100 will be explained below.

<Laser light source 10>
The laser light source 10 includes an edge-emitting semiconductor laser element and a fast-axis collimating lens inside the package. The semiconductor laser element is sealed with a package. A semiconductor laser element emits laser light from a rectangular end face. When the end surface extends in the X direction and is a plane parallel to the XY plane, the laser light emitted from the semiconductor laser element in the +Z direction spreads relatively quickly in the YZ plane and relatively slowly in the XZ plane. spread. The fast axis direction of the laser beam is parallel to the Y direction, and the slow axis direction is parallel to the X direction. The laser light source 10 emits laser light, which is emitted from a semiconductor laser element and transmitted through a fast-axis collimating lens, to the outside. The traveling direction of the laser beam L emitted to the outside from the laser light source 10 is parallel to the +Z direction. The laser light L emitted to the outside from the laser light source 10 is collimated in the YZ plane, but not in the XZ plane. In this specification, "collimating" means not only turning the laser beam L into parallel light but also reducing the spread angle of the laser beam L. The specific configuration of the laser light source 10 will be described later.

In reality, the traveling direction of the laser light L emitted from the laser light source 10 may deviate from the +Z direction. The angle between the traveling direction of the laser beam L emitted from the laser light source 10 and the +Z direction may be, for example, 10 degrees or less.

<Optical member 20>
The optical member 20 changes the traveling direction of the laser light L emitted from the laser light source 10. The first mirror member 22a and the second mirror member 22b included in the optical member 20 are located outside the space in which the semiconductor laser element is sealed. The same applies to the third mirror member 22c and the slow axis collimating lens 24. Below, the first mirror member 22a, the second mirror member 22b, the third mirror member 22c, and the slow axis collimating lens 24 will be explained in order.

The first mirror member 22a included in the optical member 20 has a uniform cross-sectional shape in the X direction. The cross-sectional shape is trapezoidal. The first mirror member 22a has an upper surface and a lower surface that are planes parallel to each other, and an inclined surface connecting the upper surface and the lower surface. Each of the top and bottom surfaces are parallel to the XZ plane. The normal direction of the slope is a direction parallel to the YZ plane, making an acute angle with the +Y direction, and making an acute angle with the -Z direction. In this specification, the normal direction of a surface means a direction perpendicular to the surface and a direction away from an object having the surface. The angle between the lower surface of the first mirror member 22a and the slope is 45 degrees, but is not limited to this angle, and may be, for example, 30 degrees or more and 60 degrees or less.

The first mirror member 22a has a first reflective surface 22as on an inclined surface. As shown in FIG. 2B, the first reflecting surface 22as reflects the laser beam L emitted from the laser light source 10 and changes the traveling direction of the laser beam L in a direction away from the support body 30.

The second mirror member 22b included in the optical member 20 has a uniform cross-sectional shape in the X direction. The cross-sectional shape is trapezoidal. The second mirror member 22b has an upper surface and a lower surface that are planes parallel to each other, and an inclined surface connecting the upper surface and the lower surface. Each of the top and bottom surfaces are parallel to the XZ plane. The normal direction of the slope is a direction parallel to the YZ plane, making an acute angle with the -Y direction, and making an acute angle with the +Z direction. The angle between the upper surface of the second mirror member 22b and the slope is 45 degrees, but is not limited to this angle, and may be, for example, 30 degrees or more and 60 degrees or less. The angle between the upper surface of the second mirror member 22b and the slope may be equal to or different from the angle between the lower surface of the first mirror member 22a and the slope.

The second mirror member 22b has a second reflective surface 22bs on its slope. At least a portion of the second reflective surface 22bs is located above at least a portion of the first reflective surface 22as. As shown in FIG. 2B, the second reflecting surface 22bs reflects the laser beam L reflected by the first reflecting surface 22as and changes the traveling direction of the laser beam L to the +Z direction. Since the second mirror member 22b is located above the first mirror member 22a, it is easy to arrange the second mirror member 22b in an appropriate position and orientation while holding the second mirror member 22b by the holding device. A method of arranging the second mirror member 22b will be described later.

Unlike this embodiment, even in a configuration in which a wedge is arranged between the laser light source 10 and the slow axis collimating lens 24 without using the first mirror member 22a and the second mirror member 22b, the emitted light from the laser light source 10 The traveling direction of the laser beam L can be directed to the +Z direction. The wedge has a light incident surface and a light reflective surface located on opposite sides. The normal direction of the light incident surface is parallel to the -Z direction, and the normal direction of the light exit surface is parallel to the YZ plane and makes an acute angle with the +Y direction or -Y direction. This is a direction that makes an acute angle with the +Z direction. Due to the light incidence plane and the refraction at the light incidence plane which are not parallel to each other, the wedge can change the traveling direction of the laser light L passing through it. However, in such a configuration, in order to orient the traveling direction of the laser beam L in the +Z direction, a plurality of wedges whose normal directions of the light exit surfaces are different from each other are prepared, and from the plurality of wedges, the normal direction of the light exit surface is It is necessary to select a wedge whose line direction is in the appropriate direction.

In contrast, in the present embodiment, by arranging the second mirror member 22b at an appropriate position and orientation, it is possible to determine whether the traveling direction of the laser beam L emitted from the laser light source 10 is deviated from the +Z direction. Regardless, the traveling direction of the laser beam L reflected by the second reflective surface 22bs can be directed to the +Z direction. In this embodiment, it is not necessary to prepare a plurality of second mirror members 22b whose upper surfaces and slopes have different angles, and to select a second mirror member 22b having an appropriate angle from among the plurality of second mirror members 22b. .

The third mirror member 22c included in the optical member 20 has a rectangular parallelepiped shape, and has a third reflective surface 22cs on its side surface. The side surface connects the upper surface and the lower surface of the third mirror member 22c. Each of the upper surface and the lower surface is parallel to the XZ plane. As shown in FIG. 2C, the third reflecting surface 22cs reflects the laser beam L that has been reflected by the second reflecting surface 22bs and transmitted through the slow-axis collimating lens 24, thereby changing the traveling direction of the laser beam L to the +X direction. .

In this embodiment, the traveling direction of the laser beam L reflected by the second reflecting surface 22bs is parallel to the +Z direction. However, even if the traveling direction is not parallel to the +Z direction, if it is parallel to the XZ plane, the traveling direction of the laser beam L can be adjusted by arranging the third mirror member 22c at an appropriate position and orientation. can be changed in the +X direction.

The slow axis collimating lens 24 included in the optical member 20 is located between the second mirror member 22b and the third mirror member 22c, and is located on the optical path of the laser beam L reflected by the second mirror member 22b. . The slow-axis collimating lens 24 may be, for example, a cylindrical lens having a uniform cross-sectional shape in the Y direction. The slow-axis collimating lens 24 collimates the laser beam L traveling in the +Z direction on the XZ plane, as shown in FIG. 2C.

Note that if the laser light L emitted from the laser light source 10 is collimated not only in the YZ plane but also in the XZ plane, it is not necessary to arrange the slow axis collimating lens 24.

The first mirror member 22a, the second mirror member 22b, and the third mirror member 22c may include, for example, a base having a slope and a reflective surface separately formed on the slope. The base may be formed of at least one selected from the group consisting of glass, quartz, synthetic quartz, sapphire, ceramics, plastic, silicon, metal, silicone resin, and dielectric material, for example. The reflective surface may be formed from a reflective material, such as a dielectric multilayer and a metallic material. These reflective surfaces correspond to the first reflective surface 22as, the second reflective surface 22bs, and the third reflective surface 22cs.

Alternatively, the mirror members 22a to 22c may include, for example, a pedestal having an inclined surface, and the pedestal may be formed from the above-mentioned reflective material. In this case, the slopes of the stand correspond to the first reflective surface 22as, the second reflective surface 22bs, and the third reflective surface 22cs.

Slow-axis collimating lens 24 may be formed from the translucent material described above, for example, similar to condensing lens 50 shown in FIGS. 1A and 1B.

<Support 30>
As shown in FIGS. 2B and 2D, the support body 30 has an upper surface 30us having unevenness and a lower surface 30Ls that is a plane parallel to the XZ plane. The support body 30 has a recess 30c on the upper surface 30us. The support body 30 has a relatively deep first notch 30n1 in the recess 30c through which the laser beam L emitted from the laser light source 10 passes, and a relatively deep notch 30n1 through which the laser beam L reflected by the second reflective surface 22bs passes. It has a shallow second notch 30n2. The support body 30 further has two wall portions 30w located on both sides of the optical path of the laser beam L emitted from the laser light source 10 in the recessed portion 30c.

The support body 30 has a first support surface 30s1 that is at least a part of the bottom surface of the recess 30c. The first support surface 30s1 is parallel to the XZ plane. The first support surface 30s1 supports the first mirror member 22a such that the first reflective surface 22as reflects the laser light L and changes the traveling direction of the laser light L away from the support body 30. A portion of the first mirror member 22a is located between the two wall portions 30w. The lower surface of the first mirror member 22a is joined to the first support surface 30s1. A bonding resin layer 36L1 exists between the first support surface 30s1 and the lower surface of the first mirror member 22a. The thickness (dimension in the Y direction) of the resin layer 36L1 may be, for example, 0.005 mm or more and 0.5 mm or less. Heat generated in the first mirror member 22a by irradiation with the laser beam L can be effectively transmitted to the support body 30 via the first support surface 30s1 that supports the first mirror member 22a. If the thickness (dimension in the Y direction) of the resin layer 36L1 is within the above range, the resin layer 36L1 will not significantly prevent the heat from being transmitted to the support body 30. The same applies to the resin layer described below. Note that an inorganic bonding layer such as a solder material may be used instead of the resin layer 36L1.

The support body 30 has a second support surface 30s2 that is at least a portion of the upper surface of the two wall portions 30w. The second support surface 30s2 is parallel to the XZ plane. The second support surface 30s2 supports the second mirror member 22b such that at least a portion of the second reflective surface 22bs is located above at least a portion of the first reflective surface 22as. The second support surface 30s2 further includes a second mirror member 22b such that the second reflecting surface 22bs reflects the laser beam L reflected by the first reflecting surface 22as and changes the traveling direction of the laser beam L to the +Z direction. support. In the example shown in FIG. 2B, the second support surface 30s2 supports both ends of the second mirror member 22b. When the recess 30c includes only one wall 30w instead of two walls 30w, the second support surface 30s2 supports one end of the second mirror member 22b. A part of the lower surface of the second mirror member 22b, specifically, the lower surface of one end or both ends of the second mirror member 22b is joined to the second support surface 30s2. A bonding resin layer 36L2 exists between the second support surface 30s2 and a part of the lower surface of the second mirror member 22b. A part of the lower surface of the second mirror member 22b is brought into contact with the second support surface 30s2 via the resin before hardening, and the second mirror is moved so that the second reflective surface 22bs changes the traveling direction of the laser beam L to the +Z direction. Member 22b is adjusted to the proper position and orientation. Thereafter, the resin is cured to form the resin layer 36L2. The thickness of the resin layer 36L2 is the same as that of the resin layer 36L2. Heat generated in the second mirror member 22b by irradiation with the laser beam L can be effectively transmitted to the support body 30 via the second support surface 30s2 that supports the second mirror member 22b.

A plane parallel to the XZ plane located on the opposite side of the surface on which the optical member 20 is mounted when viewed from the support body 30 is defined as a reference plane for the height of the light emitting device 100. The reference plane may be, for example, the lower surface 30Ls of the support 30 shown in FIGS. 2B and 2D. The "height" described below is the height from the reference plane. The height of the second support surface 30s2 is greater than the height of the first support surface 30s1. The second mirror member 22b supported by the second support surface 30s2 is located above the optical path of the laser light L emitted from the laser light source 10, and does not hinder the progress of the laser light L.

Unlike this embodiment, in a configuration in which the height of the second support surface 30s2 is equal to the height of the first support surface 30s1, the second mirror is The member 22b is required to have a complicated shape that straddles the optical path of the laser beam L. On the other hand, in this embodiment, since the height of the second support surface 30s2 is greater than the height of the first support surface 30s1, the second mirror member 22b does not need to have such a complicated shape. The second mirror member 22b may have a simple shape with a flat lower surface.

The first support surface 30s1 and the second support surface 30s2 are planes parallel to each other. Therefore, when the angle between the upper surface of the second mirror member 22b and the slope is equal to the angle between the lower surface and the slope of the first mirror member 22a, a part of the lower surface of the second mirror member 22b is attached to the second support surface 30s2. When brought into contact via the resin before hardening, the second reflective surface 22bs becomes substantially parallel to the first reflective surface 22as. Since the position and orientation of the second mirror member 22b can be finely adjusted from this state, it becomes easy to arrange the second mirror member 22b at an appropriate position and orientation.

The first reflective surface 22as and the second reflective surface 22bs are located apart from each other, and gas such as air exists between the first reflective surface 22as and the second reflective surface 22bs. While the laser beam L travels from the first reflective surface 22as to the second reflective surface 22bs, it does not enter the resin layer 36L2 existing between the second mirror member 22b and the second support surface 30s2. 36L2 deterioration can be reduced. The distance in the Z direction from the first reflective surface 22as to the second reflective surface 22bs may be, for example, 0.1 mm or more and 3 mm or less.

The dimension of the second reflective surface 22bs in the X direction is larger than the maximum distance between the two walls 30w, and the dimension of the first reflective surface 22as in the X direction is smaller than the maximum distance. Therefore, the dimension of the second reflective surface 22bs in the X direction is larger than the dimension of the first reflective surface 22as in the X direction. The dimension of the second reflective surface 22bs in the X direction may be, for example, 1.1 times or more and 4 times or less the dimension of the first reflective surface 22as in the X direction. Since the second reflective surface 22bs has such dimensions, the second reflective surface 22bs easily receives the laser beam L whose width in the X direction increases while traveling from the first reflective surface 22as to the second reflective surface 22bs. .

A part of the laser beam L reflected by the first reflecting surface 22as and/or the second reflecting surface 22bs may become stray light, and the stray light may spread as it progresses. Even in that case, if the distance between the two wall portions 30w in the X direction is narrow, stray light can be prevented from entering the laser light source 10 as return light. The distance between the two wall portions 30w in the X direction may be, for example, 0.1 mm or more and 3 mm or less. If the interval is within this range, it is possible to appropriately reduce stray light entering the laser light source 10 as return light. Furthermore, if the height (dimension in the Y direction) of the wall portion 30w is large, the stray light generated at the first reflective surface 22as will enter the resin layer 36L2 existing between the second mirror member 22b and the second support surface 30s2. This can reduce deterioration of the resin layer 36L2. The height of the wall portion 30w may be, for example, 0.1 mm or more and 5 mm or less. If the height is within this range, such stray light can be effectively prevented from entering the resin layer 36L2. Note that since the stray light generated at the second reflective surface 22bs often travels in a direction away from the resin layer 36L2, there is a low possibility that such stray light will enter the resin layer 36L2.

Next, support surfaces other than the first support surface 30s1 and the second support surface 30s2 will be explained. The support body 30 further has a third support surface 30s3 located outside the recess 30c on the upper surface 30us. The third support surface 30s3 is parallel to the XZ plane. The third support surface 30s3 is located in the traveling direction of the laser beam L with respect to the first support surface 30s1 and the second support surface 30s2 as a reference when viewed from above. The third supporting surface 30s3 supports the third mirror member 22c so that the third reflecting surface 22cs reflects the laser beam L reflected by the second reflecting surface 22bs and changes the traveling direction of the laser beam L to the +X direction. do. A bonding resin layer 36L3 exists between the third support surface 30s3 and the lower surface of the third mirror member 22c. The thickness of the resin layer 36L3 is the same as the thickness of the resin layer 36L2. Heat generated in the third mirror member 22c by irradiation with the laser beam L can be effectively transmitted to the support body 30 via the third support surface 30s3 that supports the third mirror member 22c.

The support body 30 further has a fourth support surface 30s4 located outside the recess 30c on the upper surface 30us. The fourth support surface 30s4 is parallel to the XZ plane. The fourth support surface 30s4 is located between the first support surface 30s1 and the third support surface 30s3, and between the second support surface 30s2 and the third support surface 30s3, when viewed from above. The fourth support surface 30s4 supports the slow axis collimating lens 24. A bonding resin layer 36L4 exists between the fourth support surface 30s4 and the lower surface of the slow-axis collimating lens 24. The thickness of the resin layer 36L4 is the same as the thickness of the resin layer 36L2.

The support body 30 further has a fifth support surface 30s5 located outside the recess 30c on the upper surface 30us. The fifth support surface 30s5 is parallel to the XZ plane. The fifth support surface 30s5 is located on the opposite side from the third support surface 30s3 and the fourth support surface 30s4 with respect to the first support surface 30s1 and the second support surface 30s2 as a reference. The fifth support surface 30s5 supports the laser light source 10. An inorganic bonding layer 34L for bonding exists between the fifth support surface 30s5 and the lower surface of the laser light source 10. The thickness of the inorganic bonding layer 34L may be, for example, 0.0001 mm or more and 0.050 mm or less. Heat generated by the laser light source 10 during driving can be effectively transmitted to the support body 30 via the fifth support surface 30s5. Since the height of the fifth support surface 30s5 is smaller than the height of the first support surface 30s1, the laser light source 10 supported by the fifth support surface 30s5 easily allows the laser light L to enter the first reflective surface 22as. Since the height of the fourth support surface 30s4 is greater than the height of the fifth support surface 30s5, the slow axis collimating lens 24 supported by the fourth support surface 30s4 reflects the laser beam L reflected by the second reflection surface 22bs. Easy to accept. Since the height of the third support surface 30s3 is greater than the height of the fifth support surface 30s5, the third reflection surface 22cs of the third mirror member 22c supported by the third support surface 30s3 transmits the light through the slow axis collimating lens 24. easily receives the laser beam L.

The support body 30 further has a first convex portion 30p1 on the upper surface 30us. The first convex portion 30p1 is located between the third support surface 30s3 and the fourth support surface 30s4 when viewed from above. By using the first convex portion 30p1 as a guide, the third support surface 30s3 and the fourth support surface 30s4 can be visually recognized separately, so the third mirror member 22c is arranged on the third support surface 30s3, and the slow axis collimating lens 24 on the fourth support surface 30s4.

The support body 30 further has a second protrusion 30p2 on the upper surface 30us. The second convex portion 30p2 has a roughly U-shape. A portion of the fifth support surface 30s5 is located between the two portions of the U-shape that extend parallel to each other. By using the second convex portion 30p2 having a roughly U-shape as a guide, it is easy to arrange the laser light source 10 on the fifth support surface 30s5.

Support 30 may be formed from the same material as support substrate 40 shown in FIGS. 1A and 1B, for example. In that case, the support body 30 can effectively transmit the heat emitted from the laser light source 10 during driving and the heat generated in the mirror members 22a, 22b, and 22c by irradiation with the laser light L to the support base body 40. The support body 30 may be formed integrally with the support base body 40. In that case, the support body 30 corresponds to a part of the support base body 40.

From the above, according to the present embodiment, the light emitting device 100 and the optical system used therein can reduce the deviation between the traveling direction of the laser beam L emitted from the laser light source 10 and the designed traveling direction. The device can be realized. By employing such a light emitting device 100 in the light emitting module 200 shown in FIGS. 1A and 1B, a plurality of laser beams L obtained by emitting laser beams L from each of the plurality of light emitting devices 100 can be effectively combined. and can be input into the optical fiber 60.

Next, with reference to FIG. 3, a modification of the light emitting device 100 according to the embodiment of the present disclosure will be described, focusing on the differences from the light emitting device 100. FIG. 3 is a cross-sectional view parallel to the YZ plane, schematically showing the configuration of a modified example of the light emitting device 100 according to the embodiment of the present disclosure. In the region surrounded by the broken line shown in FIG. 3, the first mirror member 22a, the second mirror member 22b, and their surrounding structures are shown in an enlarged manner. The light emitting device 110 shown in FIG. 3 differs from the light emitting device 100 shown in FIG. 2B in that the light emitting device 110 includes a support 32 instead of the support 30. The shape of support 32 is different from the shape of support 30. The support body 32 has an upper surface 32us having unevenness and a lower surface 32Ls parallel to the XZ plane. The support body 32 has a recess 32c on the upper surface 32us. The support body 32 has a relatively shallow first notch 32n1 in the recess 32c through which the laser beam L emitted from the laser light source 10 passes, and a relatively shallow notch 32n1 through which the laser beam L reflected by the second reflective surface 22bs passes. It has a second notch portion 32n2 which is relatively deep. The support body 32 further has two wall portions 32w located on both sides of the optical path of the laser beam L reflected by the second reflective surface 22bs in the recessed portion 32c. In FIG. 3, only one wall portion 32w is shown.

The support body 32 has a first support surface 32s1 that is at least a portion of the upper surface of the two wall portions 32w. The first support surface 32s1 supports the first mirror member 22a such that the first reflective surface 22as reflects the laser light L and changes the traveling direction of the laser light L toward the support body 32. In the example shown in FIG. 3, the first support surface 32s1 supports both ends of the first mirror member 22a. When the recess 32c includes only one wall 32w instead of two walls 32w, the first support surface 30s1 supports one end of the first mirror member 22a. A part of the lower surface of the first mirror member 22a, specifically, the lower surface of one end or both ends of the first mirror member 22a is joined to the first support surface 32s1. A bonding resin layer 36L1 exists between the first support surface 30s1 and a part of the lower surface of the first mirror member 22a. With a part of the lower surface of the first mirror member 22a in contact with the first support surface 30s1 via the resin before hardening, the first reflective surface 22as changes the traveling direction of the laser beam L to the +Z direction. The first mirror member 22a is adjusted to an appropriate position and orientation. Thereafter, the resin is cured to form the resin layer 36L1. Heat generated in the first mirror member 22a by irradiation with the laser beam L can be effectively transmitted to the support body 30 via the first support surface 30s1 that supports the first mirror member 22a.

The support body 32 has a second support surface 32s2 that is at least a part of the bottom surface of the recess 32c. The second support surface 32s2 supports the second mirror member 22b such that at least a portion of the second reflective surface 22bs is located below at least a portion of the first reflective surface 22as. The second support surface 30s2 further includes a second mirror member 22b such that the second reflecting surface 22bs reflects the laser beam L reflected by the first reflecting surface 22as and changes the traveling direction of the laser beam L to the +Z direction. support. A bonding resin layer 36L2 exists between the second support surface 30s2 and the lower surface of the second mirror member 22b. Heat generated in the second mirror member 22b by irradiation with the laser beam L can be effectively transmitted to the support body 30 via the second support surface 30s2 that supports the second mirror member 22b.

A plane parallel to the XZ plane located on the opposite side of the surface on which the optical member 20 is mounted when viewed from the support body 32 is defined as a reference plane for the height of the light emitting device 110. The reference plane may be, for example, the lower surface 32Ls of the support body 32 shown in FIG. 3. The "height" described below is the height from the reference plane. In this modification, unlike the light emitting device 100 according to this embodiment, the height of the first support surface 32s1 is greater than the height of the second support surface 32s2. The first mirror member 22a supported by the first support surface 32s1 is located above the optical path of the laser beam L reflected by the second reflective surface 22bs, and does not hinder the progress of the laser beam L. The first mirror member 22a does not need to have a complicated shape that straddles the optical path of the laser beam L, and may have a simple shape with a flat lower surface.

In the light emitting device 110, by arranging the first mirror member 22a at an appropriate position and orientation, the traveling direction of the laser beam L reflected in this order by the first reflecting surface 22as and the second reflecting surface 22bs can be changed to the +Z direction. can be done. Since the first mirror member 22a is located above the second mirror member 22b, it is easy to arrange the first mirror member 22a in an appropriate position and orientation while holding the first mirror member 22a by the holding device.

The dimension of the first reflective surface 22as in the X direction is larger than the maximum distance between the two wall portions 30w. Similarly, the dimension of the second reflective surface 22bs in the X direction is larger than the maximum interval. Since the second reflective surface 22bs has such dimensions, the second reflective surface 22bs easily receives the laser beam L whose width in the X direction increases while traveling from the first reflective surface 22as to the second reflective surface 22bs. . The dimension of the first reflective surface 22as in the X direction may be larger or smaller than the dimension of the second reflective surface 22bs in the X direction, or may be equal to the dimension of the second reflective surface 22bs in the X direction. good.

In this modification, like the light emitting device 100 according to this embodiment, the first support surface 32s1 and the second support surface 32s2 are planes parallel to each other. The first reflective surface 22as and the second reflective surface 22bs are located apart from each other, and gas such as air exists between the first reflective surface 22as and the second reflective surface 22bs.

Similarly to the light emitting device 100 according to the present embodiment, the support body 32 further includes a third support surface 32s3 that supports the third mirror member 22c, a fourth support surface 32s4 that supports the slow axis collimating lens 24, and a laser light source. 10, and a fifth support surface 32s5 that supports 10.

From the above, according to the modified example of the present embodiment, the light emitting device 110 and its The optical device used can be realized.

[Method for manufacturing light emitting device]
Next, an example of a method for manufacturing the light emitting device 100 according to the embodiment of the present disclosure will be described with reference to FIGS. 4A to 4E. 4A to 4E are diagrams for explaining an example of steps in a method for manufacturing a light emitting device according to an embodiment of the present disclosure.

In the first step, the laser light source 10, the optical member 20, and the support 30 are prepared. The optical member 20 includes a first mirror member 22a, a second mirror member 22b, a third mirror member 22c, and a slow axis collimating lens 24.

In the next step, as shown in FIG. 4A, the laser light source 10 is bonded to the fifth support surface 30s5 via the inorganic bonding member 34. Through this step, the semiconductor laser element 12 included in the laser light source 10 is indirectly placed on the support 30. Specifically, the semiconductor laser element 12 is placed on the support 30 via the stage 10b2 and the submount 11. The inorganic bonding member 34 may be, for example, a solder material or a sintered material. When the inorganic bonding member 34 is a solder material, the inorganic bonding layer 34L shown in FIG. 2B is formed by heating and melting the inorganic bonding member 34 and then cooling it. When the inorganic bonding member 34 is a sintered material, the inorganic bonding layer 34L is formed by baking and hardening the inorganic bonding member 34.

In the next step, as shown in FIG. 4B, the first mirror member 22a is joined to the first support surface 30s1. The first mirror member 22a has a first support surface 30s1 such that the first reflective surface 22as reflects the laser light L emitted from the laser light source 10 and changes the traveling direction of the laser light L in a direction away from the support body 30. is joined to. In this step, the resin layer 36L1 shown in FIG. 2B is formed by hardening the resin 36a with the lower surface of the first mirror member 22a in contact with the first support surface 30s1 via the resin 36a before hardening. . The resin 36a may be, for example, a thermosetting resin that is cured by heating, or a photocurable resin that is cured by irradiation with ultraviolet light or visible light. The same applies to the resins described below. In this step, it is not necessary to adjust the position and orientation of the first mirror member 22a as accurately as the position and orientation of the second mirror member 22b. Therefore, an inorganic bonding member such as a solder material may be used instead of the resin 36a.

In the next step, as shown in FIG. 4C, the second mirror member 22b is joined to the second support surface 30s2. The second mirror member 22b is joined to the second support surface 30s2 so that the second reflecting surface 22bs reflects the laser beam L reflected by the first reflecting surface 22as and changes the traveling direction of the laser beam L to the +Z direction. be done. In this step, a part of the lower surface of the second mirror member 22b is brought into contact with the second support surface 30s2 via the uncured resin 36b, and the resin 36b is cured to form the resin layer 36L2 shown in FIG. 2B. It is formed. Before curing the resin 36b, the following active alignment is performed. That is, with the laser light source 10 emitting the laser light L, the position and orientation of the second mirror member 22b are appropriately adjusted so that the second reflective surface 22bs changes the traveling direction of the laser light L in the +Z direction. be done. Such adjustment may be performed while holding the second mirror member 22b by a holding device. This active alignment is performed while the slow axis collimating lens 24 is not fixed to the fourth support surface 30s4 and the optical characteristics of the laser beam collimated to some extent by the slow axis collimating lens 24 are measured by the light receiving device. .

By changing the position of the second mirror member 22b in the Z direction, the height of the optical axis of the laser beam L can be adjusted. By shifting the second mirror member 22b along the +Z direction, the height of the optical axis of the laser beam L is reduced, and by shifting the second mirror member 22b along the -Z direction, the height of the optical axis of the laser beam L is reduced. The height of the optical axis can be increased. As used herein, "the optical axis of the laser beam" means an axis passing through the center of the far-field pattern of the laser beam. Laser light traveling on the optical axis exhibits a peak intensity in the light intensity distribution of the far field pattern.

Furthermore, the traveling direction of the laser beam L can be adjusted by rotating the second mirror member 22b using the X-axis or the Y-axis as the rotation axis and changing its direction. By rotating the second mirror member 22b about the X-axis as the rotation axis, the traveling direction of the laser beam L can be changed up and down. By rotating the second mirror member 22b with the Y-axis as the rotation axis, the traveling direction of the laser beam L can be changed from side to side, with the traveling direction of the laser beam L being set as the front direction.

In the next step, as shown in FIG. 4D, the slow axis collimating lens 24 is bonded to the fourth support surface 30s4. The slow axis collimating lens 24 is joined to the fourth support surface 30s4 so as to collimate the laser beam L reflected by the second reflecting surface 22bs in the XZ plane. In this step, the resin layer 36L4 shown in FIG. 2B is formed by hardening the resin 36c with the lower surface of the slow-axis collimating lens 24 in contact with the fourth support surface 30s4 via the unhardened resin 36c. . Before curing the resin 36c, the following active alignment is performed. That is, the position and orientation of the slow axis collimating lens 24 are appropriately adjusted so that the slow axis collimating lens 24 collimates the laser beam L in the XZ plane while the laser light source 10 is emitting the laser beam L. Such adjustments may be made while the slow-axis collimating lens 24 is held by a holding device. Whether or not the laser beam L is collimated can be checked by measuring the spread angle of the laser beam L transmitted through the slow-axis collimating lens 24 using a light receiving device.

In the next step, as shown in FIG. 4E, the third mirror member 22c is joined to the third support surface 30s3. In the third mirror member 22c, the third reflecting surface 22cs reflects the laser beam L that has been reflected by the second reflecting surface 22bs and transmitted through the slow-axis collimating lens 24, thereby changing the traveling direction of the laser beam L to the +X direction. It is joined to the third support surface 30s3 in this manner. In this step, the resin layer 36L3 shown in FIG. 2B is formed by curing the resin 36d with the lower surface of the third mirror member 22c in contact with the third support surface 30s3 via the uncured resin 36d. . Before curing the resin 36d, the following active alignment is performed. That is, with the laser light source 10 emitting the laser light L, the position and orientation of the third mirror member 22c are appropriately adjusted so that the third reflective surface 22cs changes the traveling direction of the laser light L in the +X direction. be done. Such adjustment may be performed while holding the third mirror member 22c by a holding device. By rotating the third mirror member 22c with the Y-axis as the rotation axis, the traveling direction of the laser beam L can be changed from side to side with the traveling direction of the laser beam L being the front direction.

From the above, according to the present embodiment, the light emitting device 100 can reduce the deviation between the traveling direction of the laser light L emitted from the laser light source 10 and the designed traveling direction through the above steps. can be manufactured. When the light emitting device 100 is employed in the light emitting module 200 shown in FIGS. 1A and 1B, the manufacturing method according to the present embodiment is performed after the support body 30 is placed on the first mounting surface 40s1 of the support base body 40.

[DDL device]
Next, a configuration example of a DDL device according to an embodiment of the present disclosure will be described with reference to FIG. 5. FIG. 5 is a diagram schematically illustrating the configuration of a DDL device according to an exemplary embodiment of the present disclosure. A DDL device 1000 shown in FIG. 5 includes a plurality of light emitting modules 200, a processing head 300, and an optical transmission fiber 250 connecting the light emitting modules 200 to the processing head 300. In the example shown in FIG. 5, the number of the plurality of light emitting modules 200 is four, but is not limited to this number. The number of the plurality of light emitting modules 200 may be one or more.

The number of light emitting devices 100 included in each light emitting module 200 is determined depending on the required light output or irradiance. The wavelength of the laser light emitted from the light emitting device 100 can also be selected depending on the material to be processed. For example, when processing metals such as copper, brass, and aluminum, a semiconductor laser element with a center wavelength in the range of 350 nm or more and 550 nm or less can be suitably employed. The wavelengths of the laser beams emitted from each light emitting device 100 do not need to be the same, and laser beams with different center wavelengths may be superimposed. Further, even when using a laser beam whose center wavelength is outside the range of 350 nm or more and 550 nm or less, it is possible to obtain the effects of the present invention.

In the example shown in FIG. 5, an optical fiber 60 extends from each of the plurality of light emitting modules 200. A plurality of optical fibers 60 thus obtained are coupled to an optical transmission fiber 250 by an optical multiplexer 230. The optical multiplexer 230 may be, for example, a TFB (Tapered Fiber Bundle). The processing head 300 converges and irradiates the object 400 with laser light emitted from the light emitting end of the optical fiber 60 . In the case where one DDL device 1000 includes M light emitting modules 200 and each light emitting module 200 includes N light emitting devices 100, if the light output of one light emitting device 100 is P watts, the maximum A laser beam with an optical power of P×N×M watts can be focused onto the object 400. Here, N is an integer of 2 or more, and M is a positive integer. For example, if P=20 watts, N=22, and M=12, a light output of more than 5 kilowatts can be achieved.

[Specific configuration of laser light source 10]
Next, an example of a specific configuration of the laser light source 10 will be described with reference to FIGS. 6A to 6D. FIG. 6A is a perspective view schematically showing the configuration of the laser light source 10. The laser light source 10 shown in FIG. 6A includes a semiconductor laser device and a base portion 10b that accommodates the semiconductor laser device. The base 10b includes a light-transmitting window 10t that transmits the laser light emitted from the semiconductor laser element. The laser light source 10 further includes two lead terminals 15 that supply power to the semiconductor laser element, a lead holding member 10h that holds the two lead terminals 15, and a lid 10L fixed to the base 10b. The lid 10L, together with the base 10b, forms a sealed space that seals the semiconductor laser element. Preferably, the seal is a hermetic seal. The effect of hermetic sealing becomes higher as the wavelength of the laser light emitted from the semiconductor laser element becomes shorter. In a configuration where the emission surface of the semiconductor laser element is not hermetically sealed and is in contact with the outside air, the shorter the wavelength of the laser light, the more likely the emission surface will deteriorate during operation due to dust collection. It is.

FIG. 6B is a diagram schematically showing the internal planar configuration of the laser light source 10 shown in FIG. 6A. In FIG. 6B, the lid 10L shown in FIG. 6A is omitted. The base 10b includes a bottom plate 10b1, a stage 10b2 provided on the bottom plate 10b1, and a side wall 10b3 surrounding the stage 10b2. The side wall 10b3 is provided with a light-transmitting window 10t shown in FIG. 6A. It can also be said that the side wall 10b3 includes the light-transmitting window 10t. The laser light source 10 includes, inside the base 10b, a submount 11 supported by a stage 10b2, a semiconductor laser element 12 and a lens support member 13 supported by the submount 11, and a fast axis supported by the lens support member 13. A collimating lens 14 is provided. The semiconductor laser element 12 is supported by a support 30 shown in FIG. 2A via a bottom plate 10b1, a stage 10b2, and a submount 11. The semiconductor laser element 12 emits laser light toward the fast-axis collimating lens 14 .

Of the base portion 10b, the bottom plate 10b1 and the stage 10b2 may be formed from a metal material containing at least one selected from the group consisting of Cu, Al, Ag, Fe, Ni, Mo, Cu, and W, for example. Examples of such metallic materials include alloys such as CuMo. Since the bottom plate 10b1 and the stage 10b2 made of such metal materials have high thermal conductivity, the heat emitted from the semiconductor laser element 12 during driving can be effectively transmitted to the outside. The side wall 10b3 of the base portion 10b may be made of kovar, for example. Kovar is an alloy made by adding nickel and cobalt to the main component iron.

The laser light source 10 further includes a plurality of wires 15w inside the base 10b. Among the plurality of wires 15w, some of the wires 15w are electrically connected to the semiconductor laser element 12 via the submount 11 and electrically connected to one lead terminal 15. The remaining wire 15w is electrically connected directly to the semiconductor laser element 12 and to the other lead terminal 15. The plurality of wires 15w are used to supply power from the two lead terminals 15 to the semiconductor laser element 12. The two lead terminals 15 are electrically connected to an external circuit that adjusts the emission timing and output of laser light emitted from the semiconductor laser element 12.

FIG. 6C is an exploded perspective view showing more details of the configuration of the laser light source 10 shown in FIG. 6A with the base 10b, lid 10L, lead terminal 15, and internal wire 15w omitted. A laser light source 10A shown in FIG. 6C includes a submount 11, an edge-emitting semiconductor laser element 12, a lens support member 13, and a fast-axis collimating lens 14. Although the lens support member 13 and the fast-axis collimating lens 14 are shown separated from each other in FIG. 6C, they are actually joined to each other. FIG. 6D is a cross-sectional view of the laser light source 10A shown in FIG. 6C, parallel to the YZ plane.

As shown in FIG. 6C, the submount 11 has an upper surface 11us and a lower surface 11Ls that are parallel to the XZ plane. A metal film is provided on each of the upper surface 11us and the lower surface 11Ls. The metal film provided on the upper surface 11us improves the bonding strength when the semiconductor laser element 12 and the lens support member 13 are bonded to the upper surface 11us of the submount 11 using an inorganic bonding member. The metal film provided on the upper surface 11us may be used to supply power to the semiconductor laser element 12. The metal film provided on the lower surface 11Ls improves the bonding strength when the laser light source 10A is bonded to the upper surface of the stage 10b2 using an inorganic bonding member. The metal films provided on each of the upper surface 11us and the lower surface 11Ls also serve to transmit the heat generated by the semiconductor laser element 12 during driving to the stage 10b2 shown in FIG. 6B via the submount 11. Submount 11 may be formed from the aforementioned ceramics, metal materials, or metal matrix composites, for example, similar to support substrate 40 shown in FIGS. 1A and 1B.

The semiconductor laser element 12 is supported by the upper surface 11us of the submount 11, as shown in FIG. 6C. The semiconductor laser element 12 has an emission surface 12e on one of two end faces intersecting in the Z direction, and emits laser light in the +Z direction from the emission surface 12e. The laser beam spreads at different speeds in the YZ plane and the XZ plane as it travels in the +Z direction. Laser light spreads relatively quickly in the YZ plane and spreads relatively slowly in the XZ plane. When not collimated, the laser beam spot has an elliptical shape in the far field, with the Y direction being the long axis and the X direction being the short axis in the XY plane.

The semiconductor laser element 12 can emit violet, blue, green, or red laser light in the visible region, or infrared or ultraviolet laser light in the invisible region. The emission peak wavelength of the violet light is preferably within the range of 400 nm or more and 420 nm or less, and more preferably within the range of 400 nm or more and 415 nm or less. The emission peak wavelength of blue light is preferably in a range of greater than 420 nm and less than 495 nm, more preferably in a range of greater than or equal to 440 nm and less than 475 nm. The emission peak wavelength of green light is preferably in a range of greater than 495 nm and less than 570 nm, more preferably in a range of greater than or equal to 510 nm and less than or equal to 550 nm. The emission peak wavelength of red light is preferably in the range of 605 nm or more and 750 nm or less, and more preferably in the range of 610 nm or more and 700 nm or less.

As the semiconductor laser element 12 that emits purple, blue, and green laser light, a laser diode containing a nitride semiconductor material can be mentioned. As the nitride semiconductor material, for example, GaN, InGaN, and AlGaN can be used. Examples of the semiconductor laser element 12 that emits red laser light include laser diodes containing InAlGaP-based, GaInP-based, GaAs-based, and AlGaAs-based semiconductor materials.

The lens support member 13 is supported by the upper surface 11us of the submount 11, as shown in FIG. 6C. The lens support member 13 has two columnar parts 13a and a connecting part 13b located between the two columnar parts 13a and connecting the two columnar parts 13a. The two columnar parts 13a are located on both sides of the semiconductor laser element 12, and the connecting part 13b is located above the emission surface 12e of the semiconductor laser element 12. The lens support member 13 supports the fast axis collimating lens 14 by the end surfaces 13as of the two columnar portions 13a. The lens support member 13 is positioned so as to straddle the semiconductor laser device 12 and does not prevent the laser light emitted from the semiconductor laser device 12 from entering the fast-axis collimating lens 14 .

The lens support member 13 may be formed from the aforementioned ceramics, for example, similar to the support base 40 shown in FIGS. 1A and 1B. The lens support member 13 may be formed from the above-mentioned light-transmitting material, for example, similar to the condenser lens 50 shown in FIGS. 1A and 1B. Lens support member 13 may be formed from at least one alloy selected from the group consisting of Kovar and CuW, for example. The lens support member 13 may be made of Si, for example.

The fast-axis collimating lens 14 may be, for example, a cylindrical lens having a uniform cross-sectional shape in the X direction, as shown in FIG. 6C. The fast-axis collimating lens 14 has a flat surface on the light incidence side and a convex curved surface on the light exit side. The convex curved surface has a curvature in the YZ plane. The focal point of the fast-axis collimating lens 14 substantially coincides with the center of the light emitting point of the emission surface 12e of the semiconductor laser element 12. As shown in FIG. 6D, the fast-axis collimating lens 14 collimates the laser light emitted from the emission surface 12e of the semiconductor laser element 12 in the +Z direction in the YZ plane. The region surrounded by the broken line shown in FIG. 6D represents a region where the intensity of the laser light is 1/e ² times or more of its peak intensity. e is the base of natural logarithm. Fast-axis collimating lens 14 may be formed from the translucent material described above, for example, similar to condenser lens 50 shown in FIGS. 1A and 1B.

Since the fast-axis collimating lens 14 is disposed inside the sealed space, it is possible to collimate the laser beam before it widely spreads. Therefore, it is possible to make the fast axis collimating lens 14 smaller.

In the example shown in FIG. 2A, the fast-axis collimating lens 14 inside the laser light source 10 is located between the semiconductor laser element 12 and the first mirror member 22a, and is located on the optical path of the laser light. In the example shown in FIG. 2A, if the laser light source 10 is at a position further shifted along the −Z direction, the fast axis collimating lens 14 is located not inside the laser light source 10 but between the laser light source 10 and the first mirror member 22a. It may be located between the two and on the optical path of the laser beam L. If the fast-axis collimating lens 14 is so outside the laser light source 10, the fast-axis collimating lens 14 may be treated as part of the optical member 20.

More details of the laser light source 10 are disclosed in, for example, Japanese Patent Application Publication No. 2021-106247. All of the disclosure content of JP 2021-106247A is incorporated herein by reference.

The present disclosure includes a light emitting device, an optical device, a light emitting module, and a method for manufacturing a light emitting device described in the following items.
[Item 1]
a semiconductor laser element that emits laser light;
an optical member that changes the traveling direction of the laser light emitted from the semiconductor laser element;
a support that supports the semiconductor laser element and the optical member;
Equipped with
The optical member is
a first mirror member having a first reflective surface;
a second mirror member having a second reflective surface;
has
The support is
a first support surface that supports the first mirror member such that the first reflective surface reflects the laser light and changes the traveling direction of the laser light;
The second mirror member is supported such that at least a portion of the second reflective surface is located above or below at least a portion of the first reflective surface, and the second reflective surface is located above or below the first reflective surface. a second support surface that supports the second mirror member so as to change the traveling direction of the laser beam by reflecting the laser beam reflected by the second mirror member;
A light emitting device having:
[Item 2]
A portion of the lower surface of the second mirror member is joined to the second support surface,
The light emitting device according to item 1, wherein the second mirror member is located above the optical path of the laser light emitted from the semiconductor laser element.
[Item 3]
The light emitting device according to item 2, wherein a resin layer is present between the second support surface and a part of the lower surface of the second mirror member.
[Item 4]
A portion of the lower surface of the first mirror member is joined to the first support surface,
The light emitting device according to item 1, wherein the first mirror member is located above the optical path of the laser beam reflected by the second reflective surface.
[Item 5]
The light emitting device according to item 4, wherein a resin layer is present between the first support surface and a part of the lower surface of the first mirror member.
[Item 6]
The semiconductor laser device is an edge-emitting type,
Any one of items 1 to 3, wherein the dimension of the second reflective surface in the slow axis direction of the laser light emitted from the semiconductor laser element is larger than the dimension of the first reflective surface in the slow axis direction. The light emitting device described in .
[Item 7]
The height of the second support surface is greater than the height of the first support surface, with a plane located on the opposite side of the surface on which the optical member is mounted as viewed from the support body as a height reference plane. ,
The light emitting device according to any one of items 1 to 3, wherein the second support surface supports one end or both ends of the second mirror member.
[Item 8]
The support has two walls located on both sides of the optical path of the laser light emitted from the semiconductor laser element,
The light emitting device according to any one of items 1 to 3, wherein the second support surface is at least a part of the upper surface of the wall.
[Item 9]
9. The light emitting device according to any one of items 1 to 8, wherein the first and second support surfaces are flat and parallel to each other.
[Item 10]
Any of items 1 to 9, wherein the first reflective surface and the second reflective surface are located apart from each other, and a gas is present between the first reflective surface and the second reflective surface. 2. The light emitting device according to item 1.
[Item 11]
The optical member has a third mirror member, the third mirror member has a third reflective surface,
The support body is a third support that supports the third mirror member such that the third reflection surface reflects the laser light reflected by the second reflection surface and changes the traveling direction of the laser light. The light emitting device according to any one of items 1 to 10, having a surface.
[Item 12]
The optical member has a slow axis collimating lens,
The light emitting device according to item 11, wherein the slow axis collimating lens is located between the second mirror member and the third mirror member and on the optical path of the laser beam.
[Item 13]
The light emitting device according to any one of items 1 to 12, comprising a fast-axis collimating lens located between the semiconductor laser element and the first mirror member and located on the optical path of the laser beam.
[Item 14]
a first mirror member having a first reflective surface;
a second mirror member having a second reflective surface;
a support body that supports the first mirror member and the second mirror member;
Equipped with
The support is
a first support surface that supports the first mirror member so that the first reflective surface reflects the laser light emitted from the semiconductor laser element and changes the traveling direction of the laser light;
The second mirror member is supported such that at least a portion of the second reflective surface is located above or below at least a portion of the first reflective surface, and the second reflective surface is located above or below the first reflective surface. a second support surface that supports the second mirror member so as to change the traveling direction of the laser beam by reflecting the laser beam reflected by the second mirror member;
An optical device having:
[Item 15]
The height of the second support surface is determined by the height of the second support surface, with a plane located on the opposite side of the surface on which the first mirror member and the second mirror member are mounted as viewed from the support body being a height reference plane. greater than the height of the supporting surface,
The optical device according to item 14, wherein the second support surface supports one end or both ends of the second mirror member.
[Item 16]
A support base having a plurality of mounting surfaces arranged in a first direction, wherein the height of the plurality of mounting surfaces from a reference plane parallel to the first direction is stepwise along the first direction. a supporting substrate, which is reduced to;
A plurality of light emitting devices, each of which is a light emitting device according to any one of claims 1 to 10, wherein a corresponding light emitting device is arranged on each of the plurality of mounting surfaces. a device;
a condensing lens,
Equipped with
The optical member included in each of the plurality of light emitting devices has a third mirror member, and the third mirror member has a third reflective surface,
The support body included in each of the plurality of light emitting devices is configured such that the third reflective surface reflects the laser light reflected by the second reflective surface to change the traveling direction of the laser light. having a third support surface that supports a third mirror member;
Each of the plurality of light emitting devices reflects the laser light emitted from the semiconductor laser element on the first reflecting surface and the second reflecting surface in this order to change the traveling direction of the laser light in the first direction. by changing the traveling direction of the laser beam to the first direction by reflecting the laser beam reflected by the second reflecting surface on the third mirror reflecting surface. , emitting the laser beam in the first direction;
A light emitting module, wherein the condenser lens combines a plurality of laser beams obtained by emitting the laser beams in the first direction from each of the plurality of light emitting devices.
[Item 17]
A semiconductor laser element that emits laser light; and an optical member that changes the traveling direction of the laser light that is emitted from the semiconductor laser element, the optical member having a first mirror member having a first reflective surface and a second reflective surface. an optical member having a second mirror member; a support that supports the semiconductor laser element and the optical member; a first support surface that supports the first mirror member; and a second support surface that supports the second mirror member; a step of providing a support having a support surface;
arranging the semiconductor laser element on the support;
bonding the first mirror member to the first support surface so that the first reflective surface reflects the laser light and changes the traveling direction of the laser light;
bonding the second mirror member to the second support surface so that the second reflective surface reflects the laser light reflected by the first reflective surface and changes the traveling direction of the laser light; and,
A method of manufacturing a light emitting device, including:
[Item 18]
The height of the second support surface is greater than the height of the first support surface, with a plane located on the opposite side of the optical member viewed from the support body as a height reference plane,
The step of joining the second mirror member to the second support surface includes:
bringing a lower surface of the second mirror member into contact with the second support surface via a pre-cured resin;
With the semiconductor laser element emitting the laser beam, the second reflecting surface reflects the laser beam reflected by the first reflecting surface to change the traveling direction of the laser beam, adjusting the position and orientation of the second mirror member;
curing the resin;
The method for manufacturing a light emitting device according to item 17, comprising:

The light emitting device of the present disclosure can be used particularly to combine a plurality of laser beams to realize high-output laser beams. Further, the light emitting device of the present disclosure can be used, for example, in industrial fields where a high-power laser light source is required, such as cutting of various materials, drilling, local heat treatment, surface treatment, metal welding, and 3D printing. .

10, 10A: Laser light source 10L: Lid 10b: Base 10b1: Bottom plate 10b2: Stage 10b3: Side wall 10h: Lead holding member 10t: Transparent window 11: Submount 11Ls: Bottom surface 11us: Top surface 12: Semiconductor laser element 12e: Emission Surface 13: Lens support member 13a: Columnar portion 13as: End surface of columnar portion 13b: Connecting portion 14: Fast axis collimating lens 15: Lead terminal 15w: Wire 20: Optical member 22a: First mirror member 22as: First reflective surface 22b : Second mirror member 22bs: Second reflective surface 22c: Third mirror member 22cs: Third reflective surface 24: Slow axis collimating lens 30, 32: Support body 30us, 32us: Upper surface 30Ls, 32Ls: Lower surface 30c, 32c: Recessed part 30w, 32w: Wall portion 30n1, 32n1: First notch portion 30n2, 32n2: Second notch portion 30p1: First convex portion 30p2: Second convex portion 30s1, 32s1: First support surface 30s2, 32s2: Second Support surface 30s3, 32s3: Third support surface 30s4, 32s4: Fourth support surface 30s5, 32s5: Fifth support surface 34: Inorganic bonding member 34L: Inorganic bonding layer 36a, 36b, 36c, 36d: Resin 36L1, 36L2, 36L3 , 36L4: Resin layer 40, 42: Support base 40s1: First mounting surface 40s2: Second mounting surface 50: Condensing lens 50a: Fast axis condensing lens 50b: Slow axis condensing lens 60: Optical fiber 60a: Light input end 60b: Light output end 62: Support member 72: Mirror 74: 1/2 wavelength plate 76: Polarizing beam splitter 100, 100a, 100b, 110: Light emitting device 200, 210: Light emitting module 230: Optical multiplexer 250: Optical transmission fiber 300: Processing head 400: Target object 1000: DDL device L, La, Lb: Laser light Ref: Reference plane

Claims (18)

a semiconductor laser element that emits laser light;
an optical member that changes the traveling direction of the laser light emitted from the semiconductor laser element;
a support that supports the semiconductor laser element and the optical member;
Equipped with
The optical member is
a first mirror member having a first reflective surface;
a second mirror member having a second reflective surface;
has
The support is
a first support surface that supports the first mirror member such that the first reflective surface reflects the laser light and changes the traveling direction of the laser light;
The second mirror member is supported such that at least a portion of the second reflective surface is located above or below at least a portion of the first reflective surface, and the second reflective surface is located above or below the first reflective surface. a second support surface that supports the second mirror member so as to change the traveling direction of the laser beam by reflecting the laser beam reflected by the second mirror member;
A light emitting device having: A portion of the lower surface of the second mirror member is joined to the second support surface,
The light emitting device according to claim 1, wherein the second mirror member is located above the optical path of the laser light emitted from the semiconductor laser element. The light emitting device according to claim 2, wherein a resin layer is present between the second support surface and a part of the lower surface of the second mirror member. A portion of the lower surface of the first mirror member is joined to the first support surface,
The light emitting device according to claim 1, wherein the first mirror member is located above the optical path of the laser beam reflected by the second reflective surface. The light emitting device according to claim 4, wherein a resin layer is present between the first support surface and a part of the lower surface of the first mirror member. The semiconductor laser device is an edge-emitting type,
Any one of claims 1 to 3, wherein a dimension of the second reflective surface in the slow axis direction of the laser beam emitted from the semiconductor laser element is larger than a dimension of the first reflective surface in the slow axis direction. The light-emitting device described in . The height of the second support surface is greater than the height of the first support surface, with a plane located on the opposite side of the surface on which the optical member is mounted as viewed from the support body as a height reference plane. ,
The light emitting device according to any one of claims 1 to 3, wherein the second support surface supports one end or both ends of the second mirror member. The support has two walls located on both sides of the optical path of the laser light emitted from the semiconductor laser element,
The light emitting device according to any one of claims 1 to 3, wherein the second support surface is at least a part of the upper surface of the wall. The light emitting device according to any one of claims 1 to 5, wherein the first and second support surfaces are flat and parallel to each other. The first reflective surface and the second reflective surface are located apart from each other, and a gas is present between the first reflective surface and the second reflective surface. The light emitting device according to any one of the items. The optical member has a third mirror member, the third mirror member has a third reflective surface,
The support body is a third support that supports the third mirror member such that the third reflective surface reflects the laser light reflected by the second reflective surface and changes the traveling direction of the laser light. The light emitting device according to any one of claims 1 to 5, having a surface. The optical member has a slow axis collimating lens,
The light emitting device according to claim 11, wherein the slow axis collimating lens is located between the second mirror member and the third mirror member and on the optical path of the laser beam. The light emitting device according to any one of claims 1 to 5, comprising a fast axis collimating lens located between the semiconductor laser element and the first mirror member and located on the optical path of the laser light. . a first mirror member having a first reflective surface;
a second mirror member having a second reflective surface;
a support body that supports the first mirror member and the second mirror member;
Equipped with
The support is
a first support surface that supports the first mirror member so that the first reflective surface reflects the laser light emitted from the semiconductor laser element and changes the traveling direction of the laser light;
The second mirror member is supported such that at least a portion of the second reflective surface is located above or below at least a portion of the first reflective surface, and the second reflective surface is located above or below the first reflective surface. a second support surface that supports the second mirror member so as to change the traveling direction of the laser beam by reflecting the laser beam reflected by the second mirror member;
An optical device having: The height of the second support surface is determined by the height of the second support surface, with a plane located on the opposite side of the surface on which the first mirror member and the second mirror member are mounted as viewed from the support body being a height reference plane. greater than the height of the supporting surface,
The optical device according to claim 14, wherein the second support surface supports one end or both ends of the second mirror member. A support base having a plurality of mounting surfaces arranged in a first direction, wherein the height of the plurality of mounting surfaces from a reference plane parallel to the first direction is stepwise along the first direction. a supporting substrate, which is reduced to;
A plurality of light emitting devices, each of which is a light emitting device according to any one of claims 1 to 5, wherein a corresponding light emitting device is arranged on each of the plurality of mounting surfaces. a device;
a condensing lens,
Equipped with
The optical member included in each of the plurality of light emitting devices has a third mirror member, and the third mirror member has a third reflective surface,
The support body included in each of the plurality of light emitting devices is configured such that the third reflective surface reflects the laser light reflected by the second reflective surface to change the traveling direction of the laser light. having a third support surface that supports a third mirror member;
Each of the plurality of light emitting devices reflects the laser light emitted from the semiconductor laser element on the first reflecting surface and the second reflecting surface in this order to change the traveling direction of the laser light in the first direction. by changing the traveling direction of the laser beam to the first direction by reflecting the laser beam reflected by the second reflecting surface on the third reflecting surface, emitting the laser beam in the first direction;
A light emitting module, wherein the condenser lens combines a plurality of laser beams obtained by emitting the laser beams in the first direction from each of the plurality of light emitting devices. A semiconductor laser element that emits laser light; and an optical member that changes the traveling direction of the laser light that is emitted from the semiconductor laser element, the optical member having a first mirror member having a first reflective surface and a second reflective surface. an optical member having a second mirror member; a support that supports the semiconductor laser element and the optical member; a first support surface that supports the first mirror member; and a second support surface that supports the second mirror member; a step of providing a support having a support surface;
arranging the semiconductor laser element on the support;
bonding the first mirror member to the first support surface so that the first reflective surface reflects the laser light and changes the traveling direction of the laser light;
bonding the second mirror member to the second support surface so that the second reflective surface reflects the laser light reflected by the first reflective surface and changes the traveling direction of the laser light; and,
A method for manufacturing a light emitting device, including: The height of the second support surface is greater than the height of the first support surface, with a plane located on the opposite side of the optical member viewed from the support body as a height reference plane,
The step of joining the second mirror member to the second support surface includes:
bringing a lower surface of the second mirror member into contact with the second support surface via a pre-cured resin;
With the semiconductor laser element emitting the laser beam, the second reflecting surface reflects the laser beam reflected by the first reflecting surface to change the traveling direction of the laser beam, adjusting the position and orientation of the second mirror member;
curing the resin;
The method for manufacturing a light emitting device according to claim 17, comprising: