JP2024002605A - Curable resin composition, semiconductor encapsulation material, adhesive, adhesive film, prepreg, interlayer insulating material, and printed-wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a curable resin composition capable of forming a cured product causing little warpage after cured because of its low elasticity and low hardness, having excellent crack resistance, and exhibiting excellent dielectric properties even at high frequencies, without significant change in the dielectric properties even after being left at high temperature for a long period.

SOLUTION: The curable resin composition contains: (A) a maleimide compound represented by the general formula (1) in the figure (where each A independently represents a dimer acid- and trimer acid-derived hydrocarbon group; each B independently represents a tetravalent organic group including a cyclic structure; and n is from 1 to 1000); and (B) a catalyst. Regarding A in the formula (1), the dimer acid-derived hydrocarbon groups account for 95 mass% or more of the dimer acid- and trimer acid-derived hydrocarbon groups, and A is a hydrogenated group.

SELECTED DRAWING: None

COPYRIGHT: (C)2024,JPO&INPIT

Description

The present invention relates to a curable resin composition, a semiconductor encapsulant, an adhesive, an adhesive film, a prepreg, an interlayer insulating material, and a printed wiring board.

In recent years, the next generation communication system called 5G (millimeter wave range from 26 GHz to 80 GHz) has become popular, and the development of the next generation communication system called 6G has also begun, realizing higher speed, larger capacity, and lower delay communication than now. Trying to. In order to realize these communication systems, materials for high frequency bands of 3 to 80 GHz are required, and reduction of transmission loss is essential as a noise countermeasure.
Transmission loss is the sum of conductor loss and dielectric loss, and to reduce conductor loss, it is necessary to make the surface of the metal foil used less rough. On the other hand, since dielectric loss is proportional to the product of the square root of the dielectric constant and the dielectric loss tangent, there is a need for the development of insulating materials with excellent dielectric properties (low dielectric constant and low dielectric loss tangent). There is.
Among these, insulating materials with excellent dielectric properties are in demand for substrate applications. Reactive polyphenylene ether resin (PPE) is being used for rigid substrates, and products called liquid crystal polymer (LCP) and modified polyimide (MPI) with improved properties are being used for flexible printed circuit boards (FPC).

On the other hand, it has been reported that a maleimide compound (special maleimide compound) having substantially a dimer diamine skeleton (a skeleton derived from dimer acid) is used as the main resin for the substrate (Patent Documents 1 to 4). Contrary to the properties of general maleimide resins, special maleimide compounds have a low glass transition temperature (Tg) and a high coefficient of thermal expansion (CTE), but they also have excellent dielectric properties, flexible properties, and metallurgical properties. It has many advantages, such as excellent adhesion to materials such as materials, and because it is a thermosetting resin, it can be made into multiple layers (highly), and is being researched and developed over a wide range of areas. However, special maleimide compounds were mainly used alone.
Furthermore, as described above, the dielectric loss is proportional to the product of the square root of the dielectric constant and the dielectric loss tangent, and from this it is more important to lower the dielectric loss tangent.

On the other hand, it has been reported that a resin material using a maleimide compound having a trimer triamine skeleton (a skeleton derived from trimer acid) as the main resin for the substrate has excellent heat resistance, mechanical strength, dielectric properties, etc. (Patent Document 5) , 6).
Generally, dimer acid and trimer acid are a mixture, and are often collectively called dimer acid. The same is true for dimer diamine and trimer triamine derived from dimer acid and trimer acid, and they are collectively called dimer diamine. It is well known that the proportions of trimer triamine and trimer triamine are different (Patent Document 7, Non-Patent Document 1).

Japanese Patent Application Publication No. 2016-131243 Japanese Patent Application Publication No. 2016-131244 International Publication No. 2016/114287 JP 2018-201024 Publication Japanese Patent Application Publication No. 2019-182932 International Publication No. 2020/45408 Japanese Patent Application Publication No. 2017-186551

Journal of the Organic Synthetic Chemistry Society, 1967, 25(2), 180-183

Based on this background, we synthesized and investigated maleimide compounds having structures derived from these trimer triamine skeletons, and found that cured products of compositions containing maleimide compounds having structures derived from trimer triamine skeletons were It was found that warping and cracking are likely to occur due to the high elastic modulus and hardness, the dielectric constant and dielectric loss tangent are large at high frequencies, and the heat resistance is poor because it is greatly affected by heating.
Therefore, the present invention has low elasticity and hardness, so it has little warpage after curing, has excellent crack resistance, shows excellent dielectric properties even at high frequencies, and has excellent dielectric properties even after being left at high temperatures for a long time. The purpose of the present invention is to provide a curable resin composition that results in a cured product with little change, and further to provide semiconductor encapsulants, adhesives, adhesive films, prepregs, interlayer insulating materials, and printed wiring boards containing the same. .

As a result of intensive research to solve the above-mentioned problems, the present inventors discovered that the following resin composition can achieve the above-mentioned objects, and completed the present invention.

（式（１）中、Ａは独立してダイマー酸及びトリマー酸由来の炭化水素基を示し、Ｂは独立して環状構造を含む４価の有機基を示し、ｎは１～１０００である。）
及び
（Ｂ）触媒
を含有する硬化性樹脂組成物であって、
式（１）中のＡは、ダイマー酸及びトリマー酸由来の炭化水素基のうちダイマー酸由来の炭化水素基が占める割合が９５質量％以上であって、かつ水添処理された基である、硬化性樹脂組成物。
［２］
ＪＩＳ Ｋ７２４４－４：１９９９に記載の方法に準じ、２５℃の測定温度で、動的粘弾性測定装置を用いて、周波数１０Ｈｚ、温度範囲－５０℃～２００℃、昇温速度５℃／分で測定した、硬化性樹脂組成物の硬化物の貯蔵弾性率が、１０００ＭＰａ未満である［１］に記載の硬化性樹脂組成物。
［３］
ＪＩＳ Ｋ ６２５３－３：２０１２に記載の方法に準じ、２５℃の測定温度で、デュロメータタイプＤの硬度計を用いて測定した、硬化性樹脂組成物の硬化物の硬度が、Ｄ５０以下である［１］又は［２］に記載の硬化性樹脂組成物。
［４］
（Ｂ）成分の触媒が有機過酸化物、アニオン重合開始剤及び光硬化開始剤から選ばれる少なくとも１種である［１］～［３］のいずれかに記載の硬化性樹脂組成物。
［５］
［１］～［４］のいずれかに記載の硬化性樹脂組成物からなる半導体封止材。
［６］
［１］～［４］のいずれかに記載の硬化性樹脂組成物からなる接着剤。
［７］
［１］～［４］のいずれかに記載の硬化性樹脂組成物からなる接着フィルム。
［８］
［１］～［４］のいずれかに記載の硬化性樹脂組成物と繊維基材からなるプリプレグ。
［９］
［１］～［４］のいずれかに記載の硬化性樹脂組成物からなる層間絶縁材料。
［１０］
［１］～［４］のいずれかに記載の硬化性樹脂組成物の硬化物を有するプリント配線板。 That is, the present invention provides the following curable resin composition.
[1]
(A) Maleimide compound represented by the following general formula (1)

(In formula (1), A independently represents a hydrocarbon group derived from a dimer acid and a trimer acid, B independently represents a tetravalent organic group containing a cyclic structure, and n is 1 to 1000. )
and (B) a curable resin composition containing a catalyst,
A in formula (1) is a group in which the proportion of hydrocarbon groups derived from dimer acid among the hydrocarbon groups derived from dimer acid and trimer acid is 95% by mass or more, and which has been hydrogenated. Curable resin composition.
[2]
According to the method described in JIS K7244-4:1999, at a measurement temperature of 25°C, using a dynamic viscoelasticity measuring device, at a frequency of 10Hz, a temperature range of -50°C to 200°C, and a heating rate of 5°C/min. The curable resin composition according to [1], wherein the measured storage modulus of a cured product of the curable resin composition is less than 1000 MPa.
[3]
The hardness of the cured product of the curable resin composition is D50 or less, as measured using a durometer type D hardness meter at a measurement temperature of 25 ° C. according to the method described in JIS K 6253-3:2012. 1] or the curable resin composition according to [2].
[4]
The curable resin composition according to any one of [1] to [3], wherein the catalyst as component (B) is at least one selected from organic peroxides, anionic polymerization initiators, and photocuring initiators.
[5]
A semiconductor encapsulant comprising the curable resin composition according to any one of [1] to [4].
[6]
An adhesive comprising the curable resin composition according to any one of [1] to [4].
[7]
An adhesive film comprising the curable resin composition according to any one of [1] to [4].
[8]
A prepreg comprising the curable resin composition according to any one of [1] to [4] and a fiber base material.
[9]
An interlayer insulating material comprising the curable resin composition according to any one of [1] to [4].
[10]
A printed wiring board comprising a cured product of the curable resin composition according to any one of [1] to [4].

The curable resin composition of the present invention has low elasticity and hardness, so it has little warpage after curing, has excellent crack resistance, and exhibits excellent dielectric properties even at high frequencies, even after being placed at high temperatures for a long time. However, it provides a cured product with small changes in dielectric properties. Therefore, the curable resin composition of the present invention is useful as a semiconductor encapsulant, an adhesive, an adhesive film, a prepreg, an interlayer insulating material, and a printed wiring board.

FIG. 2 is a cut end view showing an example of the prepreg of the present invention. FIG. 1 is a cut end view showing an example of a laminate of the present invention. FIG. 1 is a cut end view showing an example of the printed wiring board of the present invention.

The present invention will be explained in more detail below.

式（１）中、Ａは独立してダイマー酸及びトリマー酸由来の炭化水素基を示し、Ｂは独立して環状構造を含む４価の有機基を示し、ｎは１～１０００である。 (A) Maleimide compound represented by the following general formula (1) Component (A) is a maleimide compound represented by the following general formula (1).

In formula (1), A independently represents a hydrocarbon group derived from dimer acid and trimer acid, B independently represents a tetravalent organic group containing a cyclic structure, and n is 1 to 1000.

A in formula (1) is such that the proportion of hydrocarbon groups derived from dimer acid among the hydrocarbon groups derived from dimer acid and trimer acid is 95% by mass or more. Hereinafter, the proportion occupied by the hydrocarbon groups derived from dimer acid among the hydrocarbon groups derived from dimer acid and trimer acid may be simply expressed as "dimer ratio" or expressed as dimer:trimer.
When this dimer proportion is 95% by mass or more, the maleimide compound (A) has advantages such as low viscosity, excellent handling properties of the compound itself, and high moldability when formed into a composition. The dimer proportion is 95% by mass or more, preferably 96% by mass or more, more preferably 97% by mass or more, even more preferably 98% by mass or more, and preferably 99% by mass or more. Particularly preferred.
Moreover, A in formula (1) is a hydrogenated group. That is, as described later, the group corresponding to group A of the amine compound that is the raw material for component (A) may contain a double bond, but it is possible to hydrogenate this to create an amine compound with reduced double bonds. Used as raw material. By reducing the number of double bonds in the group A, oxidation of the double bonds can be suppressed, and thermal deterioration and the resulting deterioration of dielectric properties can be prevented.

In addition, in this specification, the dimer ratio is a value calculated from the peak area ratio of gas chromatography (GC) measurement performed under the following measurement conditions.
Measurement condition:
Equipment: GC-2014 (manufactured by Shimadzu Corporation)
Column: DB-5 30m x 0.25mm x 0.25μm
Vaporization chamber temperature: 280℃
Temperature: 50°C → 10°C/min → 300°C, held for 20 minutes Column flow rate: 1.00mL/min Purge flow rate: 3.00mL/min

As mentioned above, dimer acids and trimer acids are generally a mixture, and are often collectively called dimer acids. The same is true for dimer diamine and trimer triamine derived from dimer acid and trimer acid, and they are collectively called dimer diamine. It is well known that the proportions of triamine and trimer triamine are different.

The dimer acid referred to here is a liquid dibase whose main component is dicarboxylic acid with 36 carbon atoms, which is produced by dimerizing unsaturated fatty acids with 18 carbon atoms from natural products such as vegetable oils and fats. It is an acid, and dimer acid does not have a single skeleton, but has multiple structures, and several types of isomers exist. Typical dimer acids are classified into linear type (a), monocyclic type (b), aromatic ring type (c), and polycyclic type (d).

（式（ｅ）中のＲはエチレン基又はエテニレン基を示す。） In addition, trimer acid is a by-product during the production of dimer acid, and like dimer acid, trimer acid does not have a single structure but multiple structures, and several types of isomers exist. . A typical structure is a structure shown in the following formula (e).

(R in formula (e) represents an ethylene group or an ethenylene group.)

（上記構造式中の置換基が結合していない結合手は、式（１）において環状イミド構造を形成するカルボニル炭素と結合するものである。） B in formula (1) independently represents a tetravalent organic group having a cyclic structure, and is preferably any of the tetravalent organic groups represented by the following structural formula.

(The bond to which no substituent in the above structural formula is bonded is the one bonded to the carbonyl carbon forming the cyclic imide structure in formula (1).)

n in formula (1) is 1 to 1000, preferably 1 to 100, and more preferably 3 to 50. This range is preferable because the resin composition has high strength even when uncured and also has good solvent solubility.

Component (A) used in the present invention can be produced using a mixture of a dimer diamine derived from the above dimer acid and a trimer triamine derived from the trimer acid (hereinafter referred to as a mixture of dimer diamine and trimer triamine) as a raw material. Note that dimer diamine derived from dimer acid has a structure in which each of the two carboxyl groups of dimer acid is substituted with a primary aminomethyl group, and similarly, trimer triamine derived from trimer acid , has a structure in which each of the three carboxy groups of trimer acid is substituted with a primary aminomethyl group. Therefore, A in formula (1) represents a hydrocarbon group derived from dimer acid and trimer acid. It is meant that the group A is derived from a mixture of dimer diamines derived from these dimer acids and trimer triamines derived from trimer acids.

As the component (A) used in the present invention, commercially available products such as BMI-1500 and BMI-3000 (manufactured by Designer Molecules Inc.) may be used, or those synthesized by the following method may be used.

A specific method for producing component (A) includes, for example, a method in which a mixture of dimer diamine and trimer triamine, a tetracarboxylic dianhydride having a cyclic structure, and maleic anhydride are reacted.
This reaction can be carried out according to a known polyimide synthesis method in which an amic acid is synthesized from a diamine and a carboxylic acid anhydride and the amic acid is subjected to a dehydration reaction. That is, one example of a method is to synthesize an amic acid from a mixture of a dimer diamine and a trimer triamine and a tetracarboxylic dianhydride having a cyclic structure, perform ring-closing dehydration, and then further react with maleic anhydride to synthesize maleamic acid, followed by ring-closing dehydration. It is mentioned as. The reaction for synthesizing (male)amic acid generally proceeds at room temperature (25°C) to 100°C in an organic solvent (eg, a nonpolar solvent or a high-boiling aprotic polar solvent). The subsequent ring-closing dehydration reaction of the amic acid is carried out under conditions of 90 to 120°C, and then proceeds while removing water by-produced by the condensation reaction from the system. An organic solvent (for example, a non-polar solvent, a high-boiling aprotic polar solvent, etc.) or an acid catalyst may be added to promote the ring-closing dehydration reaction. Examples of the organic solvent include toluene, xylene, anisole, biphenyl, naphthalene, N,N-dimethylformamide (DMF), dimethyl sulfoxide (DMSO), and the like. These may be used alone or in combination of two or more. Further, examples of the acid catalyst include sulfuric acid, methanesulfonic acid, trifluoromethanesulfonic acid, and the like. These may be used alone or in combination of two or more.
The molar ratio of the mixture of tetracarboxylic dianhydride having a cyclic structure and the dimer diamine and trimer triamine is as follows: tetracarboxylic dianhydride having a cyclic structure/mixture of dimer diamine and trimer triamine = 0.5 to 0.999/ It is preferable to set it to 1.0.
Further, the maleic anhydride added thereafter is preferably added in an amount such that the mixture of maleic anhydride/dimer diamine and trimer triamine=0.1 to 10.0/1.0.

In the above reaction, the ratio of the raw materials dimer diamine and trimer triamine in the mixture and the presence or absence of hydrogenation treatment are directly reflected in the resulting maleimide compound. It is preferable to use a mixture of trimer triamines having a dimer proportion of 95% by mass or more and hydrogenated. As such a mixture of dimer diamine and trimer triamine, the following commercial products may be mentioned.

Versamine 552 (manufactured by Cognix Japan Co., Ltd.), dimer: trimer = 95:5, hydrogenated Priamine-1075 (manufactured by Croda Japan Co., Ltd.), dimer: trimer = 98:2, hydrogenated

The above-mentioned commercial products or commercial products of mixtures of dimer diamines and trimer triamines other than those mentioned above may be used with a higher proportion of dimer by a purification method such as thin film distillation, or multiple types of dimer diamines with different proportions of dimer may be used. The dimer ratio may be adjusted by combining a mixture of and trimer triamine. Alternatively, a commercially available mixture of dimer diamine and trimer triamine that has not been hydrogenated may be hydrogenated using a catalyst such as Raney nickel.

Commercially available tetracarboxylic anhydrides having a cyclic structure can be used, such as pyromellitic anhydride, maleic anhydride, succinic anhydride, 4,4'-carbonyldiphthalic anhydride, 4,4 '-Diphthalic anhydride, 4,4'-sulfonyldiphthalic anhydride, 4,4'-oxydiphthalic anhydride, 4,4'-(4,4'-isopropylidenediphenoxy)diphthalic anhydride, etc. can be mentioned. These acid anhydrides may be used alone or in combination of two or more depending on the purpose, use, etc. From the viewpoint of electrical properties of maleimide compounds, acid anhydrides include pyromellitic anhydride, 4,4'-oxydiphthalic anhydride, and 4,4'-(4,4'-isopropylidene diphenoxy) diphthalic anhydride. preferable.

Further, in order to reduce warping when the composition of the present invention is cured, the storage modulus of the cured product of the composition at 25° C. is preferably less than 1000 MPa, more preferably 900 MPa or less, and Preferably it is 800 MPa or less. If the storage modulus is 1000 MPa or more, warping may become large after curing when used as an adhesive or film.
The storage modulus was measured using a dynamic viscoelasticity measurement device, such as DMA-Q800 (manufactured by TA Instruments), at a frequency of 10 Hz and a temperature range of -50°C to This value was measured under the measurement conditions of 200°C and a temperature increase rate of 5°C/min.

Further, in order to improve the crack resistance of the cured product of the composition of the present invention, the hardness of the cured product at 25°C is preferably D50 or less, more preferably D40 or less, and still more preferably D30 or less. . If the hardness is greater than D50, crack resistance may deteriorate when used as a semiconductor sealing material. Note that the hardness is a value measured at 25° C. using a durometer type D hardness tester in accordance with the method described in JIS K 6253-3:2012.

Component (A) may be used alone or in combination of two or more.
Further, the content of component (A) in the curable resin composition of the present invention is preferably 30 to 99% by mass, more preferably 60 to 95% by mass.

(B) Catalyst Component (B) used in the present invention is a catalyst. The catalyst in the present invention is one that initiates or accelerates the reaction of the maleimide group of component (A) and/or the group that can react with the maleimide group described below. Component (B) is not particularly limited as long as it initiates or accelerates the reaction of the maleimide group of component (A) and/or a group that can react with the maleimide group described below, but organic peroxide At least one selected from polymerization initiators, anionic polymerization initiators, and photocuring initiators is preferably used.

Examples of organic peroxides include dicumyl peroxide, t-butyl peroxybenzoate, t-amyl peroxybenzoate, dibenzoyl peroxide, diuraloyl peroxide, 2,5-dimethyl-2,5-di Examples include (t-butylperoxy)hexane, 1,1-di(t-butylperoxy)cyclohexane, di-t-butylperoxide, and dibenzoylperoxide.

Examples of anionic polymerization initiators include imidazole, 2-methylimidazole, 2-ethylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-undecylimidazole, -Phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2- Imidazole compounds such as undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole; tributylphosphine, tri(p- Organic phosphorus compounds such as methylphenyl)phosphine, tri(nonylphenyl)phosphine, triphenylphosphine, triphenylphosphine oxide, triphenylphosphine/triphenylborane, tetraphenylphosphine/tetraphenylborate; triethylamine, benzyldimethylamine, α- Examples include tertiary amine compounds such as methylbenzyldimethylamine, 1,8-diazabicyclo[5.4.0]undecene, and tris(dimethylaminomethyl)phenol.

The photocuring initiator is not particularly limited as long as it initiates the reaction with light; for example, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1,2,2 -dimethoxy-1,2-diphenylethan-1-one, 1-hydroxy-cyclohexyl-phenyl-ketone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropanone-1,2,4 - Aromatic ketones such as diethylthioxanthone, 2-ethylanthraquinone, and phenanthrenequinone; benzyl derivatives such as benzyl dimethyl ketal; 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer, 2-(o-chlorophenyl )-4,5-di(m-methoxyphenyl)imidazole dimer, 2-(o-fluorophenyl)-4,5-diphenylimidazole dimer, 2-(o-methoxyphenyl)-4,5- diphenylimidazole dimer, 2-(p-methoxyphenyl)-4,5-diphenylimidazole dimer, 2,4-di(p-methoxyphenyl)-5-phenylimidazole dimer, and 2-(2 ,4-dimethoxyphenyl)-4,5-diphenylimidazole dimer; 9-phenylacridine, and 1,7-bis(9,9'-acridinyl) Acridine derivatives such as heptane; bisacylphosphine oxides such as bis(2,6-dimethoxybenzoyl)-2,4,4-trimethyl-pentylphosphine oxide and bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide ;1-Hydroxy-cyclohexyl-phenyl-ketone, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1,2-(dimethylamino)-2-[(4-methylphenyl)methyl ]-1-[4-(4-morpholinyl)phenyl]-1-butanone and other alkylphenone compounds; 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide and other acylphosphine oxide compounds; benzophenone compounds, etc. Can be mentioned.

The blending amount of component (B) is preferably 0.1 to 5.0 parts by mass, more preferably 0.2 to 4.5 parts by mass, and even more preferably is 0.5 to 4.0 parts by mass.
In addition, when the composition of the present invention contains a curable resin having a reactive group capable of reacting with a maleimide group other than the component (A) described below, a reactive group capable of reacting with the component (A) and a maleimide group. The amount of component (B) is preferably 0.1 to 7.0 parts by mass, more preferably 0.1 to 7.0 parts by mass based on 100 parts by mass of the curable resin component. is 0.2 to 6.0 parts by weight, more preferably 0.5 to 5.0 parts by weight.
If the amount of component (B) added to 100 parts by weight of component (A) is less than 0.1 part by weight, the progress of curing may be slow, and if it is more than 5.0 parts by weight, the product will lack storage stability. It may be stored away.
Component (B) may be used alone or in combination of two or more.

Other Additives The curable resin composition of the present invention may further contain various additives as necessary within a range that does not impair the effects of the present invention. Other additives are illustrated below.

Curable resin having a reactive group capable of reacting with a maleimide group In the present invention, a curable resin having a reactive group capable of reacting with a maleimide group may be further added.
The type of curable resin is not limited, and examples include epoxy resins, phenol resins, melamine resins, silicone resins, cyclic imide resins including maleimide compounds other than component (A), urea resins, and thermosetting resins. Examples include various resins other than component (A), such as polyimide resins, modified polyphenylene ether resins, (meth)acrylic resins, and epoxy-silicone hybrid resins. In addition, examples of reactive groups that can react with maleimide groups include epoxy groups, maleimide groups, hydroxyl groups, acid anhydride groups, alkenyl groups such as allyl groups and vinyl groups, (meth)acrylic groups, and thiol groups. .

From the viewpoint of reactivity, the reactive group of the curable resin is preferably selected from an epoxy group, a maleimide group, a hydroxyl group, and an alkenyl group, and from the viewpoint of dielectric properties, an alkenyl group or a (meth) ) Acrylic group is more preferred.
However, the amount of the curable resin having a reactive group capable of reacting with the maleimide group is 0 to 80% by mass based on the total amount of the curable resin.

Inorganic filler In the present invention, an inorganic filler may be further added as necessary. The inorganic filler is blended for the purpose of increasing the strength and rigidity of the cured product of the curable resin composition of the present invention, and adjusting the coefficient of thermal expansion and dimensional stability of the cured product. As the inorganic filler, those commonly added to epoxy resin compositions and silicone resin compositions can be used. For example, silicas such as spherical silica, fused silica and crystalline silica, alumina, silicon nitride, aluminum nitride, boron nitride, barium sulfate, talc, clay, aluminum hydroxide, magnesium hydroxide, calcium carbonate, glass fibers and glass particles. etc. Furthermore, fluorine-containing resins, coating fillers, and/or hollow particles may be used to improve dielectric properties, and conductive materials such as metal particles, metal-coated inorganic particles, carbon fibers, and carbon nanotubes may be used to impart conductivity. Fillers may also be added. The inorganic fillers may be used alone or in combination of two or more. The amount of the inorganic filler added may be 0 to 300 parts by weight, preferably 30 to 300 parts by weight, per 100 parts by weight of component (A).

Although the average particle size and shape of the inorganic filler are not particularly limited, spherical silica having an average particle size of 0.5 to 5 μm is particularly preferably used when forming a film or a substrate. Note that the average particle diameter is a value determined as a mass average value D ₅₀ (or median diameter) in particle size distribution measurement using a laser light diffraction method.

Further, in order to improve the properties of the inorganic filler, it is preferable that the surface of the inorganic filler is treated with a silane coupling agent having an organic group capable of reacting with a maleimide group. Examples of such silane coupling agents include epoxy group-containing alkoxysilanes, amino group-containing alkoxysilanes, (meth)acrylic group-containing alkoxysilanes, and alkenyl group-containing alkoxysilanes.
As the silane coupling agent, an alkoxysilane containing a (meth)acrylic group and/or an amino group is preferably used, and specifically, 3-methacryloxypropyltrimethoxysilane, 3-acryloxypropyltrimethoxysilane, Examples include N-phenyl-3-aminopropyltrimethoxysilane, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, and 3-aminopropyltrimethoxysilane.

The amount of the silane coupling agent to be blended is not particularly limited, but may be 0 to 5 parts by weight, preferably 0.2 to 2 parts by weight, per 100 parts by weight of the inorganic filler.

Others In addition to the above, non-functional silicone oil, reactive diluent, thermoplastic resin, thermoplastic elastomer, organic synthetic rubber, photosensitizer, light stabilizer, polymerization inhibitor, antioxidant, flame retardant, pigment, dye , an adhesion aid, an ion trapping material, etc. may be added.
In addition, silane coupling agents such as epoxy group-containing alkoxysilanes, amino group-containing alkoxysilanes, (meth)acrylic group-containing alkoxysilanes, and alkenyl group-containing alkoxysilanes for surface treatment of the above-mentioned inorganic fillers are separately used for the curing of the present invention. It may be blended into the synthetic resin composition, and specific examples thereof include those mentioned above.

The curable resin composition of the present invention can also be treated as a varnish by dissolving it in an organic solvent. By forming the composition into a varnish, it becomes easier to form a film, and it also becomes easier to apply and impregnate fiber substrates such as glass cloth made of E glass, low dielectric glass, quartz glass, etc. As for the organic solvent, it can be used without any restriction as long as it dissolves the curable resin having a reactive group capable of reacting with component (A), component (B), and other maleimide groups as additives. Examples include anisole, tetralin, mesitylene, xylene, toluene, tetrahydrofuran (THF), dimethylformamide (DMF), dimethyl sulfoxide (DMSO), and acetonitrile. These may be used alone or in combination of two or more.

[Production method]
As a method for producing the curable resin composition of the present invention, components (A) and (B) and other additives added as necessary are mixed using a planetary mixer (manufactured by Inoue Seisakusho Co., Ltd.). Alternatively, there is a method of mixing using a stirrer THINKY CONDITIONING MIXER (manufactured by THINKY Co., Ltd.).

[Uncured resin film/cured resin film]
The curable resin composition of the present invention can be made into an uncured resin sheet or film by coating the above-mentioned varnish on a base material and volatilizing the organic solvent, or can be made into a cured resin sheet by further curing it. Or it can be made into a cured resin film. Examples of methods for manufacturing sheets and films are shown below, but the method is not limited thereto.

For example, after applying a curable resin composition (varnish) dissolved in an organic solvent to a substrate, the organic solvent is removed by heating at a temperature of usually 80°C or higher, preferably 100°C or higher for 0.5 to 20 minutes. However, by further heating at a temperature of 130° C. or higher, preferably 150° C. or higher for 0.5 to 10 hours, a hard resin cured film with a flat surface can be formed.
Although the temperature in the drying step for removing the organic solvent and the subsequent heat curing step may be constant, it is preferable to increase the temperature in steps. Thereby, the organic solvent can be efficiently removed from the composition, and the curing reaction of the resin can proceed efficiently.
Examples of the varnish coating method include a spin coater, slit coater, spray, dip coater, bar coater, etc., but there is no particular limitation.

As the base material, general resin base materials can be used, such as polyolefin resins such as polyethylene (PE) resin, polypropylene (PP) resin, and polystyrene (PS) resin, polyethylene terephthalate (PET) resin, and polybutylene terephthalate. (PBT) resin, polyester resin such as polycarbonate (PC) resin, and the like. The surface of the base material may be subjected to mold release treatment. Further, the thickness of the coating layer is not particularly limited, but the thickness after distilling off the solvent is in the range of 1 to 100 μm, preferably 3 to 80 μm. Furthermore, a cover film may be used on the coating layer.

Alternatively, an uncured resin film or a cured resin film may be produced by premixing each component in advance and extruding it into a sheet or film using a melt kneader.

The cured film obtained by curing the curable resin composition of the present invention has excellent heat resistance, mechanical properties, electrical properties, adhesion to substrates, and solvent resistance, and has a low dielectric constant. ing. Therefore, for example, in addition to semiconductor devices, specifically passivation films and protective films on the surface of semiconductor elements, junction protective films at junctions of diodes and transistors, α-ray shielding films for VLSI, interlayer insulating films, ion implantation masks, etc. It can be applied to conformal coats for printed circuit boards, alignment films for liquid crystal surface elements, protective films for glass fibers, and surface protective films for solar cells. Furthermore, it can be applied to a wide range of paste compositions, such as a printing paste composition in which an inorganic filler is blended with the curable resin composition, and a conductive paste composition in which a conductive filler is blended. Among these, adhesive applications are preferred.

In addition, it can be made into a film or sheet in an uncured state, has self-adhesive properties, and has excellent dielectric properties, so it can be used as a bonding film for flexible printed circuit boards (FPC) and as an interlayer insulation material for rigid substrates. It can be suitably used for. Moreover, the cured resin film can also be used as a coverlay film.

In addition, prepregs can be made by impregnating a varnished curable resin composition into a fiber base material such as glass cloth made of E glass, low dielectric glass, quartz glass, etc., removing the organic solvent and semi-curing it. It can also be used as Moreover, by laminating the prepreg, copper foil, etc., it is possible to produce a laminate board or printed wiring board including a highly multi-layered board.

[Prepreg]
FIG. 1 shows a schematic end view of a prepreg according to an embodiment of the present invention. The prepreg 1 includes a curable resin composition 2 and a fiber base material 3. The curable resin composition 2 is the curable resin composition or a semi-cured product of the resin composition.
Note that the semi-cured product is a state in which the resin composition is partially cured to the extent that it can be further cured. That is, the semi-cured product is a resin composition in a semi-cured state, so-called B stage. On the other hand, the uncured state is sometimes called A stage.
That is, the curable resin composition 2 may be the curable resin composition in an A-stage state, or may be the curable resin composition in a B-stage state.

As mentioned above, the fiber base material 3 includes E glass, low dielectric glass, quartz glass, S glass, T glass, etc., and the type of glass used does not matter, but from the viewpoint of taking advantage of the characteristics of the curable resin composition. A quartz glass cloth having low dielectric properties is preferred. Note that the thickness of the commonly used fiber base material is, for example, 0.01 mm or more and 0.3 mm or less.

When manufacturing the prepreg 1, the curable resin composition 2 is preferably a resin varnish prepared in the form of a varnish in order to impregnate the fiber base material 3, which is a base material for forming the prepreg. . Such a varnish-like resin composition (resin varnish) is prepared, for example, as follows.
First, the components of the resin composition that can be dissolved in an organic solvent are added to the organic solvent and dissolved therein. At this time, heating may be performed if necessary. After that, components that do not dissolve in organic solvents, such as inorganic fillers, are added as needed, and the mixture is dispersed using a ball mill, bead mill, planetary mixer, roll mill, etc. until a predetermined dispersion state is reached. A varnish-like resin composition (resin varnish) is prepared. The organic solvent used here is not particularly limited as long as it does not inhibit the curing reaction. Specific examples include toluene, methyl ethyl ketone (MEK), xylene, and anisole.

Examples of the method for manufacturing the prepreg 1 include a method in which the fiber base material 3 is impregnated with the curable resin composition 2, for example, the curable resin composition 2 prepared in the form of a varnish, and then dried. The curable resin composition 2 is impregnated into the fiber base material 3 by dipping, coating, or the like. It is also possible to repeat the impregnation multiple times if necessary. Further, at this time, by repeating impregnation using a plurality of resin compositions having different compositions and concentrations, it is also possible to finally adjust the desired composition and impregnated amount. The fiber base material 3 impregnated with the curable resin composition (resin varnish) 2 is heated under desired heating conditions, for example, at 80° C. or higher and 180° C. or lower for 1 minute or more and 20 minutes or less. By heating, a prepreg 1 comprising the curable resin composition 2 in a pre-cured (A stage) or semi-cured state (B stage) is obtained. In addition, by the heating, the organic solvent can be volatilized from the resin varnish, and the organic solvent can be reduced or removed.

[Laminated board]
A laminate according to an embodiment of the present invention includes an insulating layer containing a cured product of the curable resin composition or an insulating layer consisting of a cured product of the curable resin composition, and a layer other than the insulating layer. It is something. A generally well-known laminate is a metal-clad laminate, a schematic end view of which is shown in FIG. The metal-clad laminate 11 includes an insulating layer 12 containing or consisting of a cured product of the curable resin composition, and metal foils 13 on both sides of the insulating layer 12. Although FIG. 2 shows a double-sided metal-clad laminate with metal foil 13 on both sides of the insulating layer 12, a single-sided metal-clad laminate with metal foil 13 on only one side of the insulating layer 12 may be used.
Further, the insulating layer 12 may be made of a cured product of the curable resin composition, or may be made of a cured product of the prepreg described above, or may be made of a plurality of cured products of the prepreg 1. It may be a layered structure. Further, the thickness of the metal foil 13 is not particularly limited and varies depending on the performance required of the ultimately obtained wiring board. The thickness of the metal foil 13 can be set as appropriate depending on the desired purpose, and is preferably 1 to 70 μm, for example. Further, examples of the metal foil 13 include copper foil and aluminum foil, and when the metal foil is thin, it may be a carrier-attached copper foil provided with a release layer and a carrier to improve handling properties. Good too.
The method for manufacturing such a laminate is not particularly limited as long as it is a general method. For example, when using prepreg, one or more sheets of prepreg 1 (Fig. 1) are stacked, and then metal foil 13 such as copper foil is stacked on both or one side of the top and bottom, and the stack is integrated by heating and pressure forming. Examples include a method of manufacturing a laminate by doing so.

[Printed wiring board]
A printed wiring board according to an embodiment of the present invention includes a cured product of the curable resin composition, and is manufactured using the laminate, particularly the metal-clad laminate shown in FIG. Figure 3 shows a schematic end view of the printed wiring board. As mentioned above, the insulating layer 12 of the metal-clad laminate used for manufacturing the printed wiring board may be manufactured using the prepreg described above. The printed wiring board 21 can be manufactured by performing circuit forming processing such as hole drilling, metal plating, etching of metal foil, and multilayer adhesive processing using known methods.

[Semiconductor encapsulant]
When using the curable resin composition of the present invention as a semiconductor encapsulant, component (A), component (B), and other components as necessary are blended in a predetermined composition ratio, and thoroughly mixed with a mixer or the like. After uniformly mixing, the mixture may be melt-mixed using a hot roll, kneader, extruder, etc., then cooled and solidified, and pulverized to an appropriate size. The obtained resin composition can be used as a sealing material.

Common molding methods for semiconductor encapsulating materials include transfer molding and compression molding. In the transfer molding method, a transfer molding machine is used at a molding pressure of 5 to 20 N/mm ² , a molding temperature of 120 to 190°C, and a molding time of 30 to 500 seconds, preferably a molding temperature of 150 to 185°C, and a molding time of 30 to 180 seconds. conduct. In the compression molding method, a compression molding machine is used at a molding temperature of 120 to 190°C for a molding time of 30 to 600 seconds, preferably a molding temperature of 130 to 160°C and a molding time of 120 to 300 seconds. Furthermore, in any molding method, post-curing may be performed at 150 to 225°C for 0.5 to 20 hours.

EXAMPLES Hereinafter, the present invention will be specifically explained with reference to Examples and Comparative Examples, but the present invention is not limited to the Examples below.

Each component used in Examples and Comparative Examples is shown below. In the following, the number average molecular weight (Mn) is measured under the following measurement conditions using polystyrene as a reference.
[Measurement condition]
Developing solvent: Tetrahydrofuran (THF)
Flow rate: 0.35mL/min
Detector: Differential refractive index detector (RI)
Column:TSK Guardcolumn SuperHL-L
TSKgel SuperHZ4000 (4.6mm I.D. x 15cm x 1)
TSKgel SuperHZ3000 (4.6mm I.D. x 15cm x 1)
TSKgel SuperHZ2000 (4.6mm I.D. x 15cm x 2)
(Both manufactured by Tosoh Corporation)
Column temperature: 40℃
Sample injection amount: 5 μL (THF solution with a concentration of 0.2% by mass)

Further, the dimer ratio (mass ratio of dimer: trimer) was calculated from the peak area ratio of gas chromatography (GC) measurement performed under the following measurement conditions.
[Measurement condition]
Equipment: GC-2014 (manufactured by Shimadzu Corporation)
Column: DB-5 30m x 0.25mm x 0.25μm
Vaporization chamber temperature: 280℃
Temperature: 50°C → 10°C/min → 300°C, held for 20 minutes Column flow rate: 1.00mL/min Purge flow rate: 3.00mL/min

Amine Compound In the synthesis example, an amine compound obtained by the following operation or a commercially available amine compound was used.
[Amine compound 1]
Priamine-1075 (manufactured by Croda Japan Co., Ltd., hydrogenated, dimer:trimer≒98:2)
[Amine compound 2]
Priamine-1074 (manufactured by Croda Japan Co., Ltd., hydrogenated, dimer:trimer≒95:5)
[Amine compound 3]
300 g of Priamine-1075 was subjected to thin film distillation at 200° C. for 60 minutes to obtain amine compound 3. The main chain of amine compound 3 was hydrogenated, and the ratio of dimer:trimer was approximately 99.2:0.8.
[Amine compound 4]
A mixture of 80 g of Priamine-1075 and 161 g of Priamine-1074 was obtained as amine compound 4. The main chain of amine compound 4 was hydrogenated, and the ratio of dimer:trimer was approximately 96:4.
[Amine compound 1' (for comparative example)]
Priamine-1073 (manufactured by Croda Japan Co., Ltd., no hydrogenation treatment, dimer:trimer≒95:5)
[Amine compound 2' (for comparative example)]
Priamine-1071 (manufactured by Croda Japan Co., Ltd., no hydrogenation treatment, dimer:trimer≒80:20)
[Amine compound 3' (for comparative example)]
300 g of Priamine-1071 was subjected to thin film distillation at 180° C. for 60 minutes, and then hydrogenated with Raney nickel to obtain amine compound 3'. The main chain of the amine compound 3' was hydrogenated, and the ratio of dimer:trimer was approximately 93:7.

(A) Maleimide compound A maleimide compound was synthesized using the above amine compound as a raw material by the following operation. In addition, in the maleimide compound obtained in each synthesis example, A in formula (1) is a hydrocarbon group derived from dimer acid and trimer acid, and has the dimer ratio shown in Table 1, and the hydrogenation of group A The presence or absence of treatment is also as shown in Table 1, and B in formula (1) is a tetravalent organic group having a cyclic structure derived from the tetracarboxylic anhydride of each synthesis example.

[Synthesis example 1]
In a 1L glass four-neck flask equipped with a stirrer, Dean-Stark tube, cooling condenser, and thermometer, 241 g (0.45 mol) of amine compound 1, 87 g (0.4 mol) of pyromellitic anhydride, and methanesulfone were added. 20 g of acid and 300 g of toluene were added, the temperature was raised to 110° C., and the mixture was stirred for 24 hours while distilling off by-produced water. After the reaction, 97 g (0.99 mol) of maleic anhydride was added, and the mixture was stirred at 110° C. for 6 hours while distilling by-product water off, and the reaction solution was washed five times with 200 g of ion-exchanged water. Thereafter, 300 g of the target product (A-1) as a yellow solid was obtained by reprecipitation in hexane (yield 90%, Mn=5000, n=7 in formula (1)).

[Synthesis example 2]
Into a 1 L glass four-necked flask equipped with a stirrer, Dean-Stark tube, cooling condenser, and thermometer, 428 g (0.8 mol) of amine compound 1 and 186 g (0.6 mol) of 4,4'-oxydiphthalic anhydride were added. ), 20 g of methanesulfonic acid, and 200 g of toluene were added, the temperature was raised to 110° C., and the mixture was stirred for 24 hours while distilling off by-produced water. After the reaction, 97.2 g (0.99 mol) of maleic anhydride was added, and the mixture was stirred at 110° C. for 6 hours while distilling off the by-product water, and the reaction solution was washed 5 times with 200 g of ion-exchanged water. . Thereafter, 540 g (yield 87%, Mn=3000, n=3 in formula (1)) of the target product (A-2) as a brown solid was obtained at room temperature using a vacuum strip at 80°C.

[Synthesis example 3]
By changing the amine compound 1 of Synthesis Example 1 to an equimolar amount of the amine compound 2 and otherwise performing the same procedure, 290 g of the target compound (A-3) as a yellow solid (yield 88%, Mn= 5300, n=7 in formula (1)) was obtained.

[Synthesis example 4]
By changing the amine compound 1 of Synthesis Example 1 to an equimolar amount of the amine compound 3 and otherwise performing the same procedure, 280 g of the target compound (A-4) as a yellow solid (yield 85%, Mn= 4500, n=6 in formula (1)) was obtained.

[Synthesis example 5]
By simply changing 241 g of amine compound 1 in Synthesis Example 1 to 241 g of amine compound 4, and otherwise performing the same procedure, 290 g of yellow solid target compound (A-5) (yield 88%, Mn = 5000, n=7) in formula (1) was obtained.

[Synthesis example 6]
By changing the amine compound 1 of Synthesis Example 2 to an equimolar amount of the amine compound 3 and otherwise performing the same procedure, 530 g of the brown solid target product (A-6) (yield 86%, Mn= 3000, n=3 in formula (1)) was obtained.

[Comparative synthesis example 1]
By changing the amine compound 1 of Synthesis Example 1 to an equimolar amount of the amine compound 1' and performing the same procedure, 290 g of the target compound (A'-1) as a yellow solid was obtained (yield 88%, Mn=6000, n=8 in formula (1), for comparative example) was obtained.

[Comparative synthesis example 2]
By changing the amine compound 1 of Synthesis Example 1 to an equimolar amount of the amine compound 2' and otherwise performing the same procedure, 300 g of the target compound (A'-2) as a yellow solid (yield 90%, Mn=7000, n=9 in formula (1), for comparative example) was obtained.

[Comparative synthesis example 3]
By changing the amine compound 1 of Synthesis Example 1 to an equimolar amount of the amine compound 3' and otherwise performing the same procedure, 290 g of the target compound (A'-3) as a yellow solid (yield 88%, Mn=7000, n=9 in formula (1), for comparative example) was obtained.

[Comparative synthesis example 4]
By changing the amine compound 1 of Synthesis Example 2 to an equimolar amount of the amine compound 2' and otherwise performing the same procedure, 530 g of the target product (A'-4) as a brown solid was obtained (yield 86%, Mn=4000, n=4 in formula (1), for comparative example) was obtained.

(B) Catalyst (B-1): 2,5-dimethyl-2,5-di(t-butylperoxy)hexane (trade name: Trigonox 101, manufactured by Kayaku Nourion Co., Ltd.)

<Sample preparation>
Each component was placed in a plastic container at the mixing ratio shown in Table 2, and mixed using a Thinky mixer (manufactured by Thinky Co., Ltd., product name: Awatori Rentaro ARE-310) to prepare each resin composition.

<Storage modulus>
A frame of 50 mm x 50 mm and 1 mm thickness was prepared, each resin composition was sandwiched between two 50 μm thick release-treated PET films (E7006, manufactured by Toyobo), and a vacuum press machine (manufactured by Nikko Materials) was used. A cured product was produced by molding at 160° C. for 5 minutes. The prepared cured product was cut into pieces 20 mm long x 5 mm wide x 1 mm thick, and measured using a dynamic viscoelasticity measuring device DMA-Q800 (manufactured by TA Instruments) at a temperature range of -50°C to 200°C, a frequency of 10 Hz, and a heating rate of 5. Storage modulus at 25°C was measured at °C/min.

<Hardness>
Each resin composition prepared was poured into an aluminum Petri dish with a diameter of 50 mm and a thickness of 10 mm, and molded at 160° C. for 5 minutes to produce a cured product. The hardness of the obtained cured product was measured at 25° C. using a durometer type D hardness meter in accordance with the method described in JIS K 6253-3:2012.

<Warp characteristics>
Each of the prepared resin compositions was coated into a film having a size of 350 mm x 350 mm and a thickness of 100 μm. The coated film was laminated onto a silicon wafer with a diameter of 300 mm and a thickness of 750 μm using a film laminator V-100 (manufactured by Nikko Materials), and the cured product was formed on the silicon wafer by heating at 160°C for 5 minutes. was created. After cooling the prepared cured product to 25 ° C., fix one end of the silicon wafer to a desk, measure the distance (height) of the other end of the unfixed silicon wafer from the desk, and check that the height is 5 mm or less. If it was larger than 5 mm, it was considered bad.

<Crack resistance>
A 32 mm x 32 mm, 1.6 mm thick glass epoxy printed wiring board with a 10 mm x 10 mm, 0.75 mm thick silicon chip mounted was prepared, and the temperature was 160°C, 6.9 N/mm ² , and curing time was 5 minutes. Transfer molding was performed under the following conditions to produce a semiconductor device with a curable resin molding size of 28 x 28 mm and a molding thickness of 1.2 mm. Thermal cycle tests (TCT) of 1,000 cycles at -40°C/30 minutes and 150°C/30 minutes were performed on 20 manufactured semiconductor devices, and the number of semiconductor devices with cracks in the curable resin was counted. did.

<Dielectric properties and heat resistance>
A frame of 70 mm x 70 mm and 200 μm thick was prepared, each resin composition was sandwiched between two 50 μm thick release-treated PET films (E7006, manufactured by Toyobo), and a vacuum press machine (manufactured by Nikko Materials) was used. A cured product (molded film) was produced by molding at 160° C. for 5 minutes. The formed film was post-cured at 180°C for 1 hour to obtain a cured resin film, and then the cured resin film was used to connect a network analyzer (manufactured by Keysight, product name: E5063-2D5) and a strip line (manufactured by Keycom Co., Ltd.). ) was connected, and the relative dielectric constant and dielectric loss tangent of the cured resin film at frequencies of 10 GHz and 28 GHz were measured.
Further, this cured resin film was left at 150° C. for 48 hours, and the dielectric constant and dielectric loss tangent of the cured resin film at frequencies of 10 GHz and 28 GHz were similarly measured.

From the above, the cured product of the composition of the present invention has low elasticity and hardness, so it has little warpage after curing, has excellent crack resistance, exhibits excellent dielectric properties even at high frequencies, and can be kept under high temperatures for a long time. It was found that there was little change in dielectric properties even after

1 Prepreg 2 Curable resin composition 3 Fiber base material 11 Metal-clad laminate 12 Insulating layer 13 Metal foil 21 Printed wiring board 22 Wiring layer

Claims (10)

(A) Maleimide compound represented by the following general formula (1)

(In formula (1), A independently represents a hydrocarbon group derived from a dimer acid and a trimer acid, B independently represents a tetravalent organic group containing a cyclic structure, and n is 1 to 1000. )
and (B) a curable resin composition containing a catalyst,
A in formula (1) is a group in which the proportion of hydrocarbon groups derived from dimer acid among the hydrocarbon groups derived from dimer acid and trimer acid is 95% by mass or more, and which has been hydrogenated. Curable resin composition. According to the method described in JIS K7244-4:1999, at a measurement temperature of 25°C, using a dynamic viscoelasticity measuring device, at a frequency of 10Hz, a temperature range of -50°C to 200°C, and a heating rate of 5°C/min. The curable resin composition according to claim 1, wherein the measured storage modulus of a cured product of the curable resin composition is less than 1000 MPa. A claim that the hardness of the cured product of the curable resin composition is D50 or less, as measured using a durometer type D hardness meter at a measurement temperature of 25°C according to the method described in JIS K 6253-3:2012. Item 1. The curable resin composition according to item 1. The curable resin composition according to claim 1, wherein the catalyst as component (B) is at least one selected from organic peroxides, anionic polymerization initiators, and photocuring initiators. A semiconductor encapsulant comprising the curable resin composition according to any one of claims 1 to 4. An adhesive comprising the curable resin composition according to any one of claims 1 to 4. An adhesive film comprising the curable resin composition according to any one of claims 1 to 4. A prepreg comprising the curable resin composition according to any one of claims 1 to 4 and a fiber base material. An interlayer insulating material comprising the curable resin composition according to any one of claims 1 to 4. A printed wiring board comprising a cured product of the curable resin composition according to any one of claims 1 to 4.