JP2023537427A - Contact modules for contacting optoelectronic chips - Google Patents

Abstract

The invention relates to a contact module and a method for assembling a contact module, comprising an optical module (1) comprising an optical block (1.1) made of glass and an electronic module (2). Said optical block (1.2) is connected to an electronic module (2) via an adhesive connection, or said optical module (1) is connected to a mounting plate (1.2) installed on said electronic module (2). 2), from which the installation plate is repeatedly releasably installed on the electronic module (2) and connected to said optical block (1.1) by an adhesive connection. The adhesive connection is made by at least three cylindrical pins (5), each of which abuts with a first end face (5.1) on said optical block (1.1) by adhesive (9) and on said carrier plate ( 2.1) or the through hole (7) in the installation plate (1.2).

Description

The present invention relates to a contact module for testing optoelectronic chips, as is generally known from US Pat.

The present invention relates to the field of inspecting and testing chips with optoelectronic integrated circuits, known as PICs (optical integrated circuits), at wafer level. In contrast to conventional chips with purely electrical integrated circuits, so-called ICs (Integrated Circuits), PICs integrate optical functions and electrical circuits.

For example, in the manufacture of ICs using CMOS technology, inspections and measurements are performed at various manufacturing steps in order to monitor the process on the one hand and to perform quality control on the other hand. An established test is electrical wafer level test after the wafer is completed. Here, functional and non-functional chips (known good dies (KGD)) are identified and recorded in the wafer map to determine yield. When dividing the wafer into individual chips, non-functional chips are rejected. The inspection equipment required for wafer level inspection is available in the form of wafer probers and wafer testers with associated contact modules (probe cards). The contact module connects the equipment-side interfaces (inputs and outputs) of the wafer tester to the individual interfaces (inputs and outputs) of the wafer chips affixed to the wafer prober. Generally, the contact module is configured so that it contacts only one chip, but it can also be configured so that it contacts several chips at the same time. It is not necessary that the contact tip still be present in the wafer compound. In order to contact several chips of a wafer at the same time or one after the other, the chips simply need to have fixed and defined positions relative to each other. This margin is provided for prior art contact modules and for contact modules according to the present invention.

Test equipment for testing pure electronic chips (semiconductor chips with ICs) has been optimized and diversified over decades to produce large volumes of the most diverse ICs with high productivity for cost optimization. can be tested.

PICs are typically manufactured using the same established semiconductor process, eg, CMOS technology. Initially, as a result of the very low production volume of PICs compared to IC manufacturing, only tests for process characterization were normally performed in semiconductor factories, and functional tests of PICs were not performed. Functional characterization is the responsibility of the final customer and is often performed on cut chips. Separate electrical and optical contact modules were used for the inspection equipment used.

Testing PICs at the wafer level requires coupling and decoupling light to the PIC level, usually by grating couplers integrated as coupling points. A grating coupler can be a functional component in a chip or sacrificial structure on a wafer, eg, in a score lane or on an adjacent chip.

The above-mentioned US Pat. No. 6,200,000 discloses an optoelectronic contact testing chip with electrical and optical inputs and outputs (non-test device--DUT), including a contact plate (probe substrate) and a redistribution plate (redistribution substrate). Discloses modules. The contact module constitutes the interface between the test equipment (automated test equipment - ATE) and the DUT and is designed with electrical contacts (electrical probes), optical terminals (optical probes), optical elements and combinations thereof, from the DUT and It directs signals to the DUT and redistributes these signals to test equipment for interfacing.

The division into contact plates and redistribution plates results in a modular design of the contact module, which allows the contact plates to be replaced if the electrical contacts are damaged, while the redistribution plates are used by the relatively expensive electrical and optical distribution networks. It has the advantage of being able to continue

For optical inputs and outputs (optical interfaces), these are created via optical elements located on the contact plate and/or redistribution plate, and various coupling mechanisms such as free radiation, quasi-free radiation or waveguides. is disclosed to be adapted to Suitable optical elements mentioned above include diffractive elements and refractive elements. It is also stated that the photodetector or light source may be located directly at the interface with the DUT, thereby configuring the optical inputs and outputs on the contact plate.

According to the exemplary embodiment of the above-mentioned US Pat. No. 6,300,000, the optical and electrical signal lines (optical and electrical distribution networks) are embodied in separate redistribution plates. It has been proposed to guide the electrical signals from the DUT to the edge regions of the contact plate so that at a first redistribution plate on the contact plate the electrical signals are coupled over the edge regions. This makes it possible to form apertures in the first redistribution plate, where only electrical signals are redistributed, and optical signals via said apertures into a separate second redistribution above the first redistribution plate. guided to the board.

In summary, the above-mentioned US Pat. It shows several ideas as to what could be additionally equipped. This ignores the possible tolerances of the mechanical contacts of the electrical inputs and outputs of the contact module to the DUT, which cannot be transferred to the optical inputs and outputs.

On a contact module with contact plates (contact pads) present on the DUT, in which constant electrical signal transmission via the electrical interface can be guaranteed within relatively large positional tolerances of a few μm in all three spatial directions. While requiring the mechanical contact of the stylus to be present at the point, the quality of the optical signal transmission is already affected by deviations in the sub-micron range from its target position to a much smaller extent.

A contact module that is insensitive to positional tolerances of the optical interface is known from US Pat. Like the contact module according to the invention and like the contact modules known from the prior art, the contact module described therein comprises a wafer platform, e.g. a wafer prober, on which the wafer with the optoelectronic chip under test is fixed, It is placed between an inspection device that generates and evaluates optical and electrical signals. The contact module establishes signal-related connections between the respective optical and electrical interfaces of the optoelectronic chip under test and the defined device-related optical and electrical interfaces of the test equipment. The interfaces are respectively electrical or optical input and output, to or from which electrical or optical signals are input or output, respectively, and transmitted to or from the optoelectronic chip under test via electrical or optical signal lines, respectively. be done.

Each electrical interface on the contact module 1 is formed by the tip of a contact needle, each contact needle is in mechanical contact with one electrical interface of the optoelectronic chip under test to transmit electrical signals, and the Each is formed with electrical contact pads. As detailed in prior art specifications, the tolerance limits required for reliable electrical contact are greater than those required for optical contact.

It is also known from the above-mentioned US Pat. No. 5,400,002 that the contact module comprises an electronic module, in which the electrical interfaces are arranged, and an optical module, in which the optical interfaces are arranged. The optical module is attached to the electronic module in a defined manner via a mechanical interface, and the electrical interface device has a defined relative position to the optical interface device.

An advantage over monolithic contact modules is, inter alia, that electrical and optical signal lines can be manufactured independently of each other in different manufacturing processes and in or on substrates made of different materials. The optical block is aligned and fixed to the electronic block to ensure that all interfaces, whether optical or electrical, form a common device that can be aligned to the optoelectronic chip under test. .

In an advantageous embodiment of the contact module, the optical block is advantageously embodied in its dimensions and shape including breakthroughs and/or apertures, so that all contact needles on the electronic module are passed past the optical block. , around it and/or possibly through an opening formed therein.

In one example embodiment of the contact module described in the above-mentioned US Pat. It includes a printed circuit board, a device of contact needles, embodied here as cantilever needles as an example, and a carrier plate on which the mechanical interface with the inspection device is mounted. Electrical contact is established through the electronic module by physical contact of the contact needles with the electrical contact pads of the chip.

The optical module consists of an optical block, each having optical signal lines in the form of waveguides and integral mirrors placed in front of each waveguide, a fiber holder with V-grooves, and fiberglass and single-fiber or multi-fiber connectors. Consists of connectors. The waveguides are manufactured by direct laser writing and the mirrors by laser etching. Thus, a waveguide is formed as a result of laser energy input by a locally confined modified substrate material, which is characterized in particular by a local refractive index modification compared to the refractive index of the substrate material. be done. The mirror is formed by an interface of etched recesses in the substrate material. The substrate material of the optical block is glass, preferably borated float glass, and has a thickness ranging from a few hundred μm to several millimeters, preferably 0.5 to 1 mm. Optical contact occurs without direct contact with the chip over the distance between the chip and the contact module. The methods used to manufacture the mirrors and waveguides allow the optical interfaces in particular to be manufactured with high precision to each other and to the mechanical interfaces on the optical block. Furthermore, it allows free positioning of the mirrors and waveguides within the substrate material.

Preferably, the optical module is connected to the electronic module by being glued to a carrier plate (support plate) in the electronic module, for example via three fixing points. For example, when manufacturing an electronic module with a cantilevered stylus as the contact stylus, the Z-height of the stylus usually refers to the clamping position of the contact module with a fixed reference to the wafer platform. Using a metal frame as a carrier plate, these reference points are positioned on the metal frame into which the fixing points for the optical modules are integrated with high precision. Thus, the optical module can be precisely and precisely placed in a plane parallel to the reference plane of the tip of the contact stylus by positionally precise bonding to a fixed position in the Z direction. The parallel plane installation of the optical module with respect to the electronic module also prevents the optical module from contacting the chip during operation due to the small working distance. As an alternative to fixing to the carrier plate, the optics block can also be mounted directly to the printed circuit board.

The above-mentioned US Pat. No. 6,200,000 only discloses and suggests connecting the mechanical interface between the optical block and the electronic module via an adhesive. No further details are given as to why it is obvious here that the adhesive is inserted between the flat mechanical interfaces.

WO2019/029765A1 US2006/0109015A1

An object of the present invention is a contact module with a novel and cost-effective design of the mechanical interface between the optical block and the electronic module or between the optical block and the mounting plate connected to the electronic block, whereby the optical To provide a contact module in which the block can be freely positioned in all six degrees of freedom with respect to the electronic module in the adjustment position and thus can be permanently fixed precisely in this adjustment position.

A further object of the present invention is a method of installing an optical block adjustable in all six degrees of freedom to an electronic module or to a mounting plate connected to the electronic block, wherein the optical block can be adjusted with high precision and ease. It is to provide a method that can be fixed in position.

With respect to the contact module, the object is an optical module comprising an optical block made of glass, having an optical interface arrangement in the optical interface plane, a carrier plate, a printed circuit board and a printed circuit board, which form the electrical interface arrangement in the electrical interface plane. and an electronic module including a needle carrier (needle carrier) having a contact needle device with a needle tip, wherein the optical interface device and the electrical interface device are aligned with respect to each other in all six degrees of freedom in a Cartesian coordinate system. It is achieved by a contact module in which the optical module and the electronic module are arranged relative to each other so as to have a defined adjustment position. For the invention, according to a first option, the optical block is permanently connected to the carrier plate via at least three cylindrical pins, or according to a second option, the optical module comprises at least It is essential to have the mounting plate permanently connected via three cylindrical pins. Each cylindrical pin contacts the optical block at the first end face via adhesive. The carrier plate or the mounting plate has a plurality of through-holes arranged parallel to each other in which the cylindrical pins are respectively connected to the carrier plate or to the mounting plate via an adhesive.

Advantageous embodiments are indicated in the dependent claims 2-6 below.

With respect to the method, the object is an optical module comprising an optical block made of glass, having an optical interface arrangement in the optical interface plane, and a carrier plate, a printed circuit board and a needle forming the electrical interface arrangement in the electrical interface plane. and an electronic module including a needle carrier having a tipped contact needle arrangement, wherein the optical interface arrangement and the electrical interface arrangement have defined adjusted positions relative to each other. , the optical module and the electronic module are arranged with respect to each other.

According to a first option, first the optical interface arrangement is aligned with respect to the electrical interface arrangement and then the optical block is permanently connected to the carrier plate by means of an adhesive connection according to the invention.

According to a second option, first the mounting plate is connected to the carrier plate via a detachable connection in a repeatable relative position, then the arrangement of the optical interface is adjusted with respect to the arrangement of the electrical interface, then the optical A block is permanently connected to the mounting plate by an adhesive connection according to the invention.

For the present invention, pre-drilling at least three through-holes parallel to each other in the carrier plate or in the mounting plate, inserting each of the at least three through-holes through one of the through-holes until contact with the optical block, It is essential that an adhesive connection is created for both options mentioned above. Adhesive is first applied to the first end faces of the cylindrical pins facing the optical block so that they adhere to the optical block. The cylindrical pins are glued to the carrier plate or mounting plate during or after passing through the through holes.

The invention is explained in more detail below with reference to exemplary embodiments and drawings.

FIG. 4 shows a contact module according to the first option, in which the optical block of the optical module is connected via an adhesive connection to the carrier plate of the electronic module (plan view); FIG. 4 shows a contact module according to the first option, in which the optical block of the optical module is connected via an adhesive connection to the carrier plate of the electronic module (section view); FIG. 10 shows a contact module according to the second option, in which the optical block is connected via an adhesive connection to the mounting plate of the optical module (plan view); Fig. 10 shows a contact module according to the second option, in which the optical block is connected to the mounting plate of the optical module via an adhesive connection (section view); 1 shows a first embodiment of an adhesive connection according to the invention; FIG. Fig. 3 shows a second embodiment of an adhesive connection according to the invention; Fig. 3 shows a contact module according to a second option with a first embodiment of removable connection; Fig. 3 shows a contact module according to a second option with a first embodiment of removable connection;

As shown in FIGS. 1a and 1b, the contact module according to the _invention comprises an _optical module 1 comprising an optical block 1.1 made of glass and an electrical a needle carrier 2.3 with a carrier plate 2.1, a printed circuit board 2.2 and an arrangement of contact needles 2.3.1 with needle tips, forming the arrangement of the electrical interface S _ele in the interface plane E _ele ; It has an electronic module 2 comprising: Carrier plate 2.1 and needle carrier 2.3 are rigidly connected to each other or form a monolithic unit. The optical module 1 and the electronic module 2 are arranged relative to each other such that the device of the optical interface S _opt and the device of the electrical interface S _ele have defined adjustment positions relative to each other with respect to all six degrees of freedom of the Cartesian coordinate system. It is The optics block 1.1 is fixed in the adjustment position via an adhesive connection. According to a first option of the contact module according to the invention, the adjustment layer is fixed by an adhesive connection according to the invention directly between the optics block 1.1 and the electronic module 2, of which the carrier plate 2.1 forms the mechanical basis. (cf. FIGS. 1a and 1b) or according to a second option it is between the optical block 1.1 and the mounting plate 1.2 optionally encompassed by the optical module 1 via an adhesive connection according to the invention. The adhesive connection is connected to the electronic module 2, more precisely to the carrier plate 2.1, via a reproducible removable connection (cf. FIGS. 2a and 2b).

According to the invention, the adhesive connection between the optics block 1.1 and the mounting plate 1.2 or between the optics block 1.1 and the carrier plate 2.1 is made indirectly via at least three cylindrical pins 5. essential for As can be seen more clearly in FIGS. 3a and 3b, the cylindrical pins 5 each have a first end face 5.1 which contacts the optical block 1.1 via adhesive 9. As shown in FIG. The carrier plate 2.1 or the mounting plate 1.2 has a plurality of through-holes 7 in which the cylindrical pins 5 are attached via adhesive 9 to the carrier plate 2.1 or to the mounting plate 1.2 respectively. Fixed.

In one embodiment, the cylindrical pin 5 and the through hole 7 are dimensioned to match each other such that the respective second end face 5.2 protrudes beyond the through hole 7, so that this is optical during assembly. It can be held in place until it abuts against block 1.1. In this case, adhesive 9 is applied to each protruding peripheral surface of cylindrical pin 5 (see FIG. 3a).

In another embodiment shown in FIG. 3b, the second end face 5.2 of each of the cylindrical pins 5 is located inside one of the through-holes 7 and any remaining over it in the through-hole 7 The free volume is also filled with adhesive 9 .

If the optics block 1.1 is glued to the mounting plate 1.2 according to the invention, the mounting plate 1.2 is preferably connected to the carrier plate 2.1 via a repeatedly removable connection. Said detachable connection ensures the repeated creation of the adjustment position of the device of the optical interface S _opt with respect to the device of the electrical interface S _ele .

A first embodiment of a removable connection is shown in Figures 4a and 4b, but an adhesive connection according to the invention is not shown here. On one end face 1.2.1 of the mounting plate there are three projections 1.2.1.1 defining the mounting plane, which are located on the mounting surface 2.1.1 of the carrier plate 2.1. abut. The relative position of the mounting plate 1.2 in the z-direction about the x- and y-directions of the Cartesian coordinate system to the carrier plate 2.1 is fixed. At the periphery of the mounting plate 1.2.2 are three dowel pins 2.1.2 aligned parallel to the mounting plane. These two are aligned at right angles to each other and each abut a respective stop pin 1.2.2.1 provided on the carrier plate 2.1. This determines the relative position of the mounting plate 1.2 to the carrier plate 2.1 in the x- and y-directions. The third dowel pin 2.1.2 abuts another stop pin 1.2.2.1 present on the carrier plate 2.1 and thus the carrier plate 2 of the mounting plate 1.2 around the z-direction. .1 to fix the relative position. Even if the mounting plate 1.2 is repeatedly mounted on the carrier plate 2.1, the mounting plate 1.2 assumes the same relative position with respect to the carrier plate 2.1. In order to position the stop pin 1.2.2.1 against the dowel pin 2.1.2, for example a contact pressure unit 8 can be temporarily arranged on the carrier plate 2.1. In order to fix the relative position, the mounting plate 1.2 is connected via at least one screw connection 2.1.3 to the carrier plate 2.1.

A second embodiment of a removable connection is shown in Figures 2a and 2b.

Again, the relative position of the mounting plate 1.2 to the carrier plate 2.1 in the x- and y-directions and around the z-direction is determined by three-point support, as in the first embodiment. In contrast to the first embodiment, the mounting plate 1.2 has two bending structures 4, for example formed by galvanic corrosion, which pass through the mounting plate 1.2. Two clamping pins 3 are mounted on the carrier plate 2.1, vertically aligned with the mounting surface 2.1.1 and firmly connected to the carrier plate 2.1. The pins can be directly or indirectly connected to the carrier plate, for example at the needle carrier 2.3, which is preferably made of ceramic. For the detachable connection of the mounting plate 1.2 to the carrier plate 2.1, two clamping pins 3 are each clamped into one of the bending structures 4. FIG. In the first of the two bending structures 4, the first of the two clamping pins 3 is clamped circumferentially over its lateral surfaces and thus the carrier plate 2.1 of the mounting plate 1.2 in the x- and y-directions. It has a fixed position relative to Advantageously, the first of the two bending structures 4 has the shape of a pipe clamp. In the second configuration of the two bending configurations 4, the second of the two clamping pins 3 is clamped tangentially via its lateral surfaces and thus the mounting plate 1.2 relative to the carrier plate 2.1 around the z-direction. Fixed relative position. In order to clamp the bending structures 4 respectively to one of the clamping pins 3, stress-free, they have openings smaller than the cross-section of the clamping pins 3, so that they are clamped before or by the insertion of the clamping pins 3, clamping It can be dimensioned to clamp the pin 3 .

Advantageously, the bending structures 4 are dimensioned so that they have openings larger than the cross-section of the clamping pin 3 . Only after the clamping pin 3 has been inserted is the bending structure 4 tensioned to clamp the clamping pin 3 . This can advantageously be done via a set screw 6 as shown.

Advantageously, the mounting plate 1.2 is connected to the carrier plate 2.1 via at least one screw connection 2.1.3 in order to ensure a fixed relative position.

A method according to the invention for assembling a contact module according to the invention is described in more detail below. As in the prior art, at the end of adjustment and assembly, the optical module 1 is arranged such that the device of the optical interface _{S_opt} and the device of the electrical interface _{S_ele} have a defined adjusted position with respect to each other in all six degrees of freedom. and the electronic module 2 are arranged with respect to each other.

A method according to the invention is used to assemble a contact module comprising an optical module 1 and an electronic module 2 . The optical module 1 comprises an optical block 1.1 made of glass, which has an arrangement of optical interfaces S _opt in an optical interface plane E _opt . The electronic module 2 comprises a carrier plate 2.1, a printed circuit board 2.2 and a needle carrier 2.3 with an arrangement of contact needles 2.3.1 with needle tips. They form the device of the electrical interface S _ele in the electrical interface plane E _ele . The optical module 1 and the electronic module 2 are arranged relative to each other such that the device of the optical interface S _opt and the device of the electrical interface S _ele have a defined adjustment position relative to each other.

The method can be used either in the first option of the assembly of the contact module described above, in which the optical module 1 is fixedly connected to the electronic module 2 via an adhesive connection, or in which the optical module 1 is repeatedly detachably connected to the electronic module 2. can optionally be used in the second option of assembly of the contact module described above. For the second option, the light module 1 further comprises a mounting plate 1.2. The mounting plate 1.2 is arranged with an optical block 1.1 firmly connected thereto by an adhesive connection, the mounting plate 1.2 and thus the optical module 1 being detachably connected to the electronic module 2 .

In the case of the first option, the arrangement of the optical interface _{S_opt} is adjusted to the arrangement of the electrical interface _{S_ele} , and then the optical block 1.1 is permanently connected to the carrier plate 2.1 by an adhesive connection.

In the case of the second option, the mounting plate 1.2 of the optical module 1 is first connected to the carrier plate 2.1 of the electronic module 2 via a detachable connection in a repeatable relative position. The arrangement of the optical interface _{S_opt} is then adjusted to the arrangement of the electrical interface _{S_ele} , and the optical block 1.1 is then permanently connected to the carrier plate 2.1 by an adhesive connection.

The embodiment of the adhesive connection is essential to the invention.

In order to create an adhesive connection according to the invention, at least three through-holes 7 parallel to each other are previously made in the carrier plate 2.1 or in the mounting plate 1.2. In the case of just three through-holes 7, these are arranged forming a triangle with respect to each other. The through-holes 7 are used later to accommodate the cylindrical pins 5 through which the adhesive connection is made as an indirect adhesive connection.

The optics block so that the arrangement of the optical interface S _opt is adjusted with respect to the arrangement of the electrical interface S _ele before the adhesive connection between the optics block 1.1 and the carrier plate 2.1 or the mounting plate 1.2 is made. 1.1 are aligned. This creates a relative position of the optics block 1.1 to the carrier plate 2.1 or the mounting plate 1.2 and is fixed in all six degrees of freedom by adhesive connections.

At least three cylindrical pins 5 are each guided through one of the through holes 7, after which they each come into contact with the optics block 1.1. An adhesive 9 has previously been applied to the first end faces 5.1 of the cylindrical pins 5, each facing the optical block 1.1, whereby the cylindrical pins 5 are joined to the optical block 1.1. The cylindrical pin 5 is joined to the carrier plate 2.1 or to the mounting plate 1.2 during or after passage through the through-hole 7. FIG.

In order to bond the cylindrical pins 5 as they are guided through the through-holes 7, an adhesive 9 is previously applied to their peripheral surface facing the second end face 5.2 or to the through-holes 7. FIG.

A defined joint surface for the cylindrical pin 5 is advantageously obtained by dimensioning the cylindrical pin 5 and the through hole 7 so that the second end face 5.1 lies within the through hole 7. FIG. The remaining free volume in through hole 7 is filled with adhesive 9 .

When the optical block 1.1 and the carrier plate 2.1 or the mounting plate 1.2 are aligned parallel to each other in the adjusted relative position, all the cylindrical pins 5 are glued to the through holes 7 with equal depth. This does not change for different relative positions in the x-direction, y-direction, z-direction or around the z-direction. Tilting around the x-direction or around the y-direction is compensated by placing the cylindrical pin 5 more or less deeply into the through hole located in the optical block. Unlike many glued connections known from the prior art, the tilt need not be compensated by the amount of glue 9 . An equal amount of adhesive at all locations where connections are made has the advantage that the behavior of the adhesive 9, e.g. shrinkage during solidification, is the same everywhere, thus fixing the adjusted relative position with high precision. can do.

1 Optical module 1.1 Optical block 1.2 Mounting plate 1.2.1 End face of mounting plate 1.2.1.1 Protrusion 1.2.2 Perimeter of mounting plate 1.2.2.1 Stopper pin 2 Electronic module 2.1 carrier plate 2.1.1 mounting surface 2.1.2 dowel pin 2.2 printed circuit board 2.3 needle carrier 2.3.1. contact needle 3 clamping pin 4 bending structure 5 cylindrical pin 5.1 first end face of cylindrical pin 5.2 second end face of cylindrical pin 6 setting screw 7 through hole 8 contact pressure unit 9 adhesive S _opt optical interface S _ele electrical interface E _opt Optical interface plane (of contact module) E _ele Electrical interface plane (of contact module)

Claims (7)

An optical module ( ₁ ) comprising an optical block (1.1) made of glass with an arrangement of optical interfaces (S _opt ) in the optical interface plane (E _opt ) and an electrical interface ( A needle carrier (2.3) comprising a carrier plate (2.1), a printed circuit board (2.2) and an arrangement of contact needles (2.3.1) with needle tips forming the arrangement of S _ele ) ) and an electronic module (2) containing
said optical module (1) such that the device of the optical interface (S _opt ) and the device of the electrical interface (S _ele ) have defined adjustment positions relative to each other with respect to all six degrees of freedom of a Cartesian coordinate system. and in a contact module, wherein said electronic modules (2) are arranged with respect to each other,
The optical block (1.1) is permanently connected to the carrier plate (2.1) via at least three cylindrical pins (5) or the optical module (1) is connected to the optical block having a mounting plate (1.2) to which (1.1) is permanently connected via at least three cylindrical pins (5);
Each of said cylindrical pins (5) contacts said optical block (1.1) at a first end face (5.1) of said cylindrical pin via an adhesive (9) and said carrier plate (2.1) or in said mounting plate (1.2) there are through-holes (7) arranged parallel to each other in which said cylindrical pins (5) are each connected to said carrier plate (2 .1) or to said mounting plate (1.2). The second end face (5.2) of said cylindrical pin is located inside one of said through-holes (7) and any remaining free volume above it in said through-holes (7) is an adhesive. Contact module according to claim 1, characterized in that it is filled with (9). Said mounting plate (1.2) is connected to said carrier plate (2.1) via a repetitively removable connection, said removable connection connecting said _optical 3. Touch module according to claim 1 or 2, characterized in that it ensures repeated creation of the adjustment position of the device of the interface (S _opt ). On one end face (1.2.1) of said mounting plate there are three projections (1.2.1.1) defining a mounting plane, said projections of said carrier plate (2.1) abutting the mounting surface (2.1.1) and thereby the mounting plate (1.2) relative to the carrier plate (2.1) in the z-direction around the x-direction and around the y-direction of the Cartesian coordinate system The relative position is fixed and there are three dowel pins (2.1.2) aligned parallel to the mounting plane on the outer periphery of the mounting plate (1.2.2), these two Aligned at right angles, they respectively abut respective stop pins (1.2.2.1) provided on said carrier plate (2.1), so that said mounting plate (1. 2) relative to said carrier plate (2.1), the third said dowel pin (2.1.2) is a further stop present on said carrier plate (2.1). characterized in that it abuts on a pin (1.2.2.1) so that the relative position of said mounting plate (1.2) to said carrier plate (2.1) around the z-direction is fixed. Contact module according to claim 3. On one end face (1.2.1) of said mounting plate there are three projections (1.2.1.1) defining a mounting plane, said projections of said carrier plate (2.1) The relative position of said mounting plate (1.2) to said carrier plate (2.1) in the z-direction, abutting the mounting surface (2.1.1), about the x-direction and about the y-direction of a Cartesian coordinate system. is fixed, said installation plate (1.2) has two bending structures (4) penetrating said installation plate (1.2), and in the first structure of said two bending structures (4) , a first clamping pin (3) attached to said carrier plate (2.1) is circumferentially clamped over its lateral surface, thus fixing the relative position of said mounting plate (1.2) in the x- and y-directions. and in a second configuration of said bending configuration (4) a second clamping pin (3) attached to said carrier plate (2.1) is clamped tangentially via its lateral surface and thus z 4. Contact module according to claim 3, characterized in that the relative position of the mounting plate (1.2) to the carrier plate (2.1) around the direction is fixed. 6. Contact module according to claim 5, characterized in that said first bending structure (4) has the shape of a pipe clamp in which said first clamping pin (3) is self-aligning and clamped. An optical module ( ₁ ) comprising an optical block (1.1) made of glass with an arrangement of optical interfaces (S _opt ) in the optical interface plane (E _opt ) and an electrical interface ( A needle carrier (2.3) comprising a carrier plate (2.1), a printed circuit board (2.2) and an arrangement of contact needles (2.3.1) with needle tips forming the arrangement of S _ele ) ) and an electronic module (2) containing
of the contact module, wherein the optical module (1) and the electronic module (2) are arranged with respect to each other such that the optical interface device and the electrical interface device have a defined adjustment position with respect to each other In the assembly method,
First the device of the optical interface (S _opt ) is aligned with the device of the electrical interface (S _ele ) and then the optical block (1.1) is permanently attached to the carrier plate (2.1) by an adhesive connection. connected and
Alternatively, first said mounting plate (1.2) is connected to said carrier plate (2.1) via a removable connection in a repeatable relative position, and then said device of optical interface (S _opt ) is connected to said adjusted to the arrangement of the electrical interface (S _ele ), then said optical block (1.1) is permanently connected to said mounting plate (1.2) by means of an adhesive connection,
The adhesive connection for both options mentioned above is created by first making at least three through-holes (7) parallel to each other in the carrier plate (2.1) or in the mounting plate (1.2). is,
At least three cylindrical pins (5) are each guided through one of said through-holes (7) until they come into contact with said optical block (1.1) and an adhesive (9) is applied to each said optical block (1.1). 1) is previously applied to the first end face (5.1) of said cylindrical pin facing 1) and said cylindrical pin (5) is glued during or after passage through said through hole (7). An assembly method characterized by

Images