JP2023183761A - Inspection device, inspection method and program - Google Patents

Abstract

To easily confirm the propriety of adjustment of a defect detection condition.SOLUTION: In an inspection device 1, a plurality of trial inspection images 431 showing a partial object in one production lot and a confirmation image set 432 showing a plurality of defects to be detected for the object are stored in a storage unit 43. An auxiliary inspection unit 42 detects a defect by executing inspection processing using a defect detection condition to the image showing the object. A trial inspection control unit 41 causes a display unit 35 to display a result of a trial inspection by causing the auxiliary inspection unit 42 to execute the inspection processing using the defect detection condition before adjustment to the plurality of trial inspection images 431 as a trial inspection, causes the auxiliary inspection unit 42 to execute the inspection processing using the defect detection condition after adjustment to the confirmation image set 432 as the confirmation inspection after an input unit 36 receives an input of adjustment of the defect detection condition and causes the display unit 35 to display the result of the confirmation inspection, and thereby the propriety of adjustment of the defect detection condition can be easily confirmed.SELECTED DRAWING: Figure 1

Description

The present invention relates to a technique for inspecting an image of a target object.

2. Description of the Related Art Conventionally, an inspection apparatus has been used that captures an image of a substrate on which a pattern is formed and detects defects using the image (see, for example, Patent Document 1). In the inspection apparatus, adjustment of defect detection conditions (that is, adjustment of various parameters related to defect detection) is performed in order to reduce oversight of true defects and false alarms. For example, in manufacturing the same type of substrates, when inspecting substrates of a new production lot, a trial inspection is performed using some of the substrates of the production lot, and defect detection conditions are adjusted. Thereafter, all the substrates of the production lot are inspected using the adjusted defect detection conditions. This makes it possible to reduce false information specific to the production lot.

Japanese Patent Application Publication No. 2002-310928

Incidentally, from the viewpoint of inspection stability, even when using defect detection conditions adjusted to suit a new production lot, true defects that were detected under the defect detection conditions before adjustment need to be detectable. Therefore, there is a need for a method for easily checking whether such true defects can be detected, that is, whether the defect detection conditions are appropriately adjusted.

The present invention has been made in view of the above problems, and an object of the present invention is to easily confirm whether adjustment of defect detection conditions is appropriate.

Aspect 1 of the present invention is an inspection device that inspects images taken of objects, and includes a plurality of trial inspection images showing some objects of one manufacturing lot, and a detection method for the objects. a storage unit that stores a confirmation image set showing a plurality of defects to be detected; an inspection unit that detects defects by executing an inspection process using defect detection conditions on images showing the target object; a display unit that displays results; an input unit that receives input for adjusting the defect detection conditions; and a display unit that causes the inspection unit to perform the inspection processing using the defect detection conditions before adjustment on the plurality of trial inspection images. After the trial inspection is performed as a trial inspection, the result of the trial inspection is displayed on the display unit, and the input unit receives an input for adjusting the defect detection conditions, the adjusted defect detection conditions are applied to the confirmation image set. and a trial test control section that causes the inspection section to execute the inspection process using the above as a confirmation inspection, and causes the display section to display the result of the confirmation inspection.

A second aspect of the present invention is the inspection apparatus according to aspect 1, in which the trial inspection control section displays the plurality of defects indicated by the confirmation image set when displaying the results of the confirmation inspection on the display section. Among them, the presence of defects that were not detected by the confirmation inspection is displayed.

Aspect 3 of the present invention is the inspection apparatus according to aspect 1 (or aspect 1 or 2), in which one defect displayed on the display section as a result of the trial inspection is a true defect. When the input section receives the input, the trial inspection control section adds the image of the defect to the confirmation image set.

Aspect 4 of the present invention is the inspection apparatus of aspect 1 (which may be any one of aspects 1 to 3), in which the confirmation image set is an image set of a first defect type, and and an image set of a second defect type different from the first defect type.

Aspect 5 of the present invention is the inspection apparatus according to any one of aspects 1 to 4, further comprising an imaging unit that acquires a plurality of inspection images showing a plurality of objects included in the manufacturing lot, The trial inspection image and the confirmation image set are images acquired by the imaging unit, and the inspection unit performs the inspection process using the adjusted defect detection condition on the plurality of inspection images. is carried out as a mass production inspection.

A sixth aspect of the present invention is the inspection apparatus according to aspect 5, in which when the input section receives an input indicating that one defect detected in the mass production inspection is a true defect, the trial inspection control section An image of the defect is added to the confirmation image set.

Aspect 7 of the present invention is the inspection apparatus according to aspect 5 (which may be aspect 5 or 6), in which the inspection section includes a first inspection section that executes the trial inspection and the confirmation inspection; a second inspection section that performs mass production inspection; an apparatus main body that includes the imaging section and the second inspection section; the storage section, the first inspection section, the display section, the input section, and the trial inspection control; An auxiliary unit including a section is separately provided.

Aspect 8 of the present invention is an inspection method of inspecting an image of a target object using an inspection device, the method comprising: a) a plurality of trial inspection images showing some of the objects of one manufacturing lot; b) preparing a confirmation image set showing a plurality of defects to be detected for the object; b) in the inspection device, performing an inspection process using defect detection conditions on the image showing the object; c) displaying the results of the trial inspection on a display unit; , d) receiving an input for adjusting the defect detection conditions; e) executing the inspection process using the adjusted defect detection conditions on the confirmation image set as a confirmation inspection; and f) the and displaying the results of the confirmation test on the display section.

Aspect 9 of the present invention is the inspection method according to aspect 8, in which, in the step f), when displaying the results of the confirmation inspection on the display unit, one of the plurality of defects indicated by the confirmation image set is , the presence of defects not detected by the confirmation inspection is displayed.

Aspect 10 of the present invention is the inspection method according to aspect 8 (which may be aspect 8 or 9), wherein in the step c), one defect displayed on the display section as a result of the trial inspection. If an input indicating that the defect is a true defect is received, the image of the defect is added to the confirmation image set.

Aspect 11 of the present invention is the inspection method according to aspect 8 (which may be any one of aspects 8 to 10), in which the confirmation image set is an image set of a first defect type, and and an image set of a second defect type different from the first defect type.

A twelfth aspect of the present invention is the inspection method according to any one of aspects 8 to 11, comprising: g) acquiring a plurality of inspection images showing a plurality of objects included in the manufacturing lot by an imaging unit; and h ) executing the inspection process using the adjusted defect detection conditions on the plurality of inspection images as a mass production inspection, wherein the plurality of trial inspection images and the confirmation image set are This is an image acquired by the imaging unit.

A thirteenth aspect of the present invention is the inspection method according to the twelfth aspect, in which when an input indicating that one defect detected in the mass production inspection is a true defect is received, an image of the defect is added to the confirmation image set. will be added.

A fourteenth aspect of the present invention is a program that causes a computer to inspect an image taken of a target object, and execution of the program by the computer causes the computer to: a) preparing a trial inspection image of the target object and a confirmation image set showing a plurality of defects to be detected for the target object; b) using the computer to apply defect detection conditions to the image representing the target object; c) performing the inspection process using predetermined defect detection conditions on the plurality of trial inspection images as a trial inspection; c) performing the trial inspection; d) receiving input for adjusting the defect detection conditions; and e) performing a confirmation inspection on the confirmation image set using the adjusted defect detection conditions. and f) displaying the results of the confirmation test on the display unit.

According to the present invention, it is possible to easily confirm whether adjustment of defect detection conditions is appropriate.

It is a figure showing the composition of an inspection device. FIG. 2 is a diagram showing the configuration of a computer. FIG. 3 is a diagram showing a captured image of a printed circuit board. It is a figure showing the flow of inspection of a printed circuit board by an inspection device. It is a figure showing the flow of inspection of a printed circuit board by an inspection device. It is a figure which shows the defect displayed on a display part. It is a figure which shows the result of the confirmation test displayed on a display part. It is a figure showing other examples of inspection of a printed circuit board by an inspection device. FIG. 3 is a diagram showing the configuration of a confirmation image set.

FIG. 1 is a diagram showing the configuration of an inspection device 1 according to one embodiment of the present invention. The inspection device 1 inspects an image taken of a printed circuit board as a target object. The inspection device 1 includes a device main body 2 and an auxiliary unit 4. The device main body 2 and the auxiliary unit 4 are communicably connected via a network 8 such as a LAN or the Internet.

The apparatus main body 2 includes an imaging section 21, a moving mechanism 22, a main body inspection section 23, and a main body control section 24. The imaging unit 21 includes an imaging element such as a CCD sensor or a CMOS sensor, and images the printed circuit board. In this processing example, the captured image acquired by the imaging unit 21 is a color image. The captured image may be a grayscale image. The moving mechanism 22 includes, for example, a motor, a ball screw, etc., and moves the printed circuit board relative to the imaging section 21. The main body inspection unit 23 performs inspection processing using defect detection conditions on the captured image output from the imaging unit 21, and detects defects from the captured image. The defect detection conditions include information such as the range of colors that are determined to be normal in various areas of the printed circuit board. The main body control section 24 is responsible for overall control of the apparatus main body 2. The main body inspection section 23 and the main body control section 24 are realized by, for example, a computer and/or an electric circuit.

The auxiliary unit 4 is realized by the computer 3. FIG. 2 is a diagram showing the configuration of the computer 3. The computer 3 includes a general CPU 31, a ROM 32, a RAM 33, a fixed disk 34, a display section 35, an input section 36, a reading device 37, a communication section 38, a GPU 39, and a bus 30. It has a typical computer system configuration. The CPU 31 performs various calculation processes. The GPU 39 performs various calculation processes related to image processing. The ROM 32 stores a basic program. The RAM 33 and fixed disk 34 store various information. The display unit 35 displays various information such as images. The input unit 36 includes a keyboard 36a and a mouse 36b that accept input from an operator. The reading device 37 reads information from a computer-readable recording medium 81 such as an optical disk, a magnetic disk, a magneto-optical disk, or a memory card. The communication unit 38 transmits and receives signals to and from the device main body 2 and the like. The bus 30 is a signal circuit that connects the CPU 31, GPU 39, ROM 32, RAM 33, fixed disk 34, display section 35, input section 36, reading device 37, and communication section 38. The computer 3 may be provided with a touch panel, and the input section 36 and the display section 35 may be realized by the touch panel.

In the computer 3, a program 811 is read out from the recording medium 81 via the reading device 37 and stored in the fixed disk 34 in advance. Program 811 may be stored on fixed disk 34 via network 8 . The CPU 31 and the GPU 39 execute arithmetic processing using the RAM 33 and fixed disk 34 according to a program 811. The CPU 31 and the GPU 39 function as a calculation unit in the computer 3. In addition to the CPU 31 and the GPU 39, other configurations that function as a calculation unit may be employed.

In the inspection apparatus 1, the functional configuration shown in FIG. 1 is realized by the computer 3 executing arithmetic processing and the like according to the program 811. That is, the CPU 31, GPU 39, ROM 32, RAM 33, fixed disk 34, and their peripheral components of the computer 3 realize the auxiliary unit 4. All or part of the functions of the auxiliary unit 4 may be realized by a dedicated electric circuit, or each function may be realized by an individual program. Further, the auxiliary unit 4 may be realized by a plurality of computers. In this processing example, the auxiliary inspection section 42, which will be described later, includes a dedicated image processing circuit (image processing board).

The auxiliary unit 4 includes a trial inspection control section 41, an auxiliary inspection section 42, a storage section 43, a display section 35, and an input section 36. Similar to the main body inspection section 23, the auxiliary inspection section 42 performs inspection processing using defect detection conditions on an image showing a printed circuit board, and detects defects from the image. The trial inspection control section 41 controls the auxiliary inspection section 42 to perform a trial inspection and a confirmation inspection, which will be described later. The trial inspection control section 41 also takes overall control of the auxiliary unit 4. The storage unit 43 stores a trial test image (data) 431 used in a trial test, and a confirmation image set (data) 432 used in a confirmation test.

Here, an example of the inspection process in the auxiliary inspection section 42 will be explained. As described above, similar inspection processing is performed in the main body inspection section 23 as well. FIG. 3 is a diagram showing a multi-tone image obtained by imaging a part of the printed circuit board by the imaging unit 21. As shown in FIG. As described above, the captured image in this processing example is a color image. A plurality of types of areas are provided on the main surface of the printed circuit board. Specifically, plating areas plated with metal such as copper, solder resist areas with solder resist on the surface (hereinafter also referred to as "SR areas"), characters and symbols printed on the solder resist, etc. A silk region, which is the opening of the through hole, a through hole region, which is the opening of the through hole, etc. are provided. Further, the SR region can be distinguished into a first SR region in which the lower layer of the solder resist is copper foil, and a second SR region in which the lower layer of the solder resist is the base material of the printed circuit board, and the two have different colors. As described above, each position on the main surface of the printed circuit board belongs to any one of a plurality of area types including a plating area, a first SR area, a second SR area, a silk area, and the like.

The example in FIG. 3 includes a region 61 indicating a plating region and a region 62 indicating an SR region, and the region 62 includes a region 621 indicating a first SR region and a region 622 indicating a second SR region. In the following description, the regions 61, 62, 621, and 622 are similarly referred to as "plated region 61," "SR region 62," "first SR region 621," and "second SR region 622." Regarding other types of areas on the printed circuit board, corresponding areas in the captured image are also referred to by the same name.

The auxiliary inspection unit 42 specifies the area type to which each position in the captured image belongs, for example, by referring to design data (CAM data, etc.). Furthermore, a normal range of gradation values for each color component is set for each region type. In other words, the threshold values between the abnormal range and the normal range of the gradation values of each color component are stored as defect detection conditions. In the captured image, the gradation value at each position is compared with the threshold value for each color component, and a set of pixels falling within the abnormal range is detected as a defective area. In the example of FIG. 3, there is a region 71 on the first SR region 621 that is darker than the surrounding area, and this region 71 is detected as a defect.

As described above, the auxiliary inspection unit 42 detects defects by executing inspection processing using the defect detection conditions indicating the threshold values. The auxiliary inspection unit 42 may perform other inspection processes, and the defect detection conditions may include values other than the threshold values of the gradation values of each color component. For example, the defect detection conditions may include the minimum distance between two adjacent plated areas (pads), the minimum width of a plated area (land) in which a through hole is formed, and the like. Further, the defect detection condition may include a value other than the defect detection threshold, and for example, when a mask area or the like is set in detecting a defect, the defect detection condition may include a value such as the size of the mask area.

By the way, printed circuit boards are usually manufactured sequentially in units of manufacturing lots. A manufacturing lot is a collection of a plurality of printed circuit boards manufactured under the same conditions. In multiple manufacturing lots, unique changes may occur for each manufacturing lot due to variations in materials used for manufacturing between lots, the effects of temperature and humidity, and the like. For example, due to variations in solder resist and silk ink, the colors of the SR region and silk region may vary from production lot to production lot. Furthermore, the size of the exposed plating area may vary from production lot to production lot due to the influence of temperature and humidity during the formation of the solder resist layer. In this way, when unique changes occur for each manufacturing lot, there is a possibility that false alarms (false defects detected) will increase in the inspection process, so it is necessary to adjust defect detection conditions according to the unique changes for each manufacturing lot. is preferred. Hereinafter, a process of inspecting printed circuit boards while adjusting defect detection conditions for each manufacturing lot will be described.

4A and 4B are diagrams showing the flow of testing printed circuit boards by the testing device 1. FIG. Here, a large number of printed circuit boards of the same type are sequentially manufactured in multiple manufacturing lots, and the second and subsequent manufacturing lots are inspected to inspect the relevant manufacturing lots (hereinafter referred to as "target manufacturing lots"). The process of inspecting the included printed circuit board will be explained.

In the inspection apparatus 1 of FIG. 1, some printed circuit boards (for example, 10 to 30 printed circuit boards) included in a target production lot are carried into the apparatus main body 2, and a plurality of captured images showing the part of the printed circuit boards are generated. is acquired by the imaging unit 21. Each captured image in this processing example is an image showing the entire printed circuit board (both sides or one side), but may be an image showing a part of the printed circuit board. As will be described later, each of the plurality of captured images is for a trial inspection, and therefore is hereinafter referred to as a "trial inspection image." The plurality of trial inspection images are transmitted from the apparatus main body 2 to the auxiliary unit 4 via the network 8 and stored in the storage section 43. In FIG. 1, only one trial inspection image 431 is shown as a block, but in reality, a plurality of trial inspection images 431 are stored.

Further, the storage unit 43 stores a confirmation image set 432. The confirmation image set 432 is a set of images that were identified as true defects by an operator during the inspection of a production lot prior to the target production lot. Each image of the confirmation image set 432 in this processing example is an image showing the true defect (an image showing a part of the printed circuit board), but may be an image showing the entire printed circuit board. As described above, in the inspection of the printed circuit board of the target production lot, a plurality of trial inspection images 431 and confirmation image set 432 are stored and prepared in the storage unit 43 (step S11).

Subsequently, under the control of the trial inspection control unit 41, the auxiliary inspection unit 42 executes inspection processing on the plurality of trial inspection images 431 as a trial inspection (step S12). The auxiliary inspection section 42 stores defect detection conditions (defect detection conditions in mass production inspection described later) for the same type of printed circuit board inspected immediately before the target production lot, and in the trial inspection, The defect detection conditions are used. In step S16, which will be described later, the defect detection conditions are adjusted, so the defect detection conditions in the trial inspection are the defect detection conditions before adjustment. When the trial inspection on the plurality of trial inspection images 431 is completed, the results of the trial inspection are displayed on the display unit 35 (step S13).

FIG. 5 is a diagram showing defects displayed on the display section 35. The results of the trial inspection include, for example, images of defects detected by the trial inspection. In the example of FIG. 5, the area including the detected defect (encircled by the white line rectangle 51 in FIG. 5) is displayed on the left, and the area in the master image that is the same as the area (i.e., The master image area) is displayed on the right. The master image is, for example, an image generated using images of a plurality of printed circuit boards during inspection of the first production lot, and is an image that does not include defects or has fewer defects. As a result of the trial inspection, the number of defects detected for each printed circuit board, etc. may be displayed.

The result of the trial test displayed on the display unit 35 is confirmed by the operator. Among the defects displayed on the display unit 35, if there is a defect that the operator determines to be a true defect, the operator performs an input via the input unit 36 indicating that the defect is a true defect. (Step S14). For example, the worker can easily register the defect as a true defect by selecting the defect on the display unit 35, right-clicking the mouse 36b, and selecting "Register true defect" from the displayed menu. becomes possible. In this way, when the input unit 36 receives an input indicating that one defect is a true defect, the trial inspection control unit 41 adds the image of the defect (true defect) to the confirmation image set 432, and the confirmation image The set 432 is updated (step S15). If there is no defect that the operator determines to be a true defect, the input unit 36 does not receive the input, so the confirmation image set 432 is not updated (step S14).

If the operator determines that the defect detection conditions need to be adjusted, the operator adjusts the defect detection conditions via the input unit 36 (step S16). For example, if most of the defects displayed on the display unit 35 are in the SR area and are false alarms, the threshold value of the tone value of each color component in the SR area is changed in the defect detection conditions. Ru. Then, the inspection process for the plurality of trial inspection images 431 is executed again using the changed defect detection conditions, and the results of the inspection process are displayed on the display unit 35. In the result of the inspection process, if false alarms are not sufficiently reduced, the defect detection conditions are further changed, and the results of the inspection process performed using the changed defect detection conditions are obtained.

As described above, by repeating changing the defect detection conditions and executing the inspection process as necessary, the defect detection conditions are adjusted, and adjusted defect detection conditions that can reduce false alarms are obtained. In other words, input for adjusting the defect detection conditions is accepted by the input unit 36, and the adjusted defect detection conditions are obtained. Note that when adjusting the defect detection conditions, the processes in steps S14 and S15 described above may be performed and the defect image may be added to the confirmation image set 432. On the other hand, if the operator determines that there is no need to adjust the defect detection conditions (step S16), the defect detection conditions are not adjusted and the process proceeds to step S21, which will be described later.

When the defect detection conditions are adjusted and the adjusted defect detection conditions are acquired, the auxiliary inspection unit 42 executes inspection processing on the confirmation image set 432 as a confirmation inspection under the control of the trial inspection control unit 41. (Step S17). In the confirmation inspection, the adjusted defect detection conditions are used. When the confirmation test for the confirmation image set 432 is completed, the result of the confirmation test is displayed on the display unit 35 (step S18).

FIG. 6 is a diagram showing the results of the confirmation test displayed on the display unit 35. In the example of FIG. 6, a plurality of images 56 of true defects indicated by the confirmation image set 432 are displayed in an array. Further, a master image area 57 corresponding to each true defect is arranged adjacent to the right side of the image 56 of the true defect. At this time, if there is a true defect that is not detected as a defect in the confirmation inspection (hereinafter referred to as "undetected true defect") among the plurality of true defects indicated by the confirmation image set 432 (step S19), The presence of a true defect is displayed on the display unit 35 and reported to the operator. In the example of FIG. 6, the presence of the undetected true defect is emphasized by surrounding the image 56 of the undetected true defect and the corresponding master image area 57 with a bold rectangle 52. In step S18, the presence of the undetected true defect may be displayed, such as by displaying only the image 56 of the undetected true defect on the display unit 35.

If there is an undetected true defect, the operator readjusts the defect detection conditions via the input unit 36 (step S20). In readjusting the defect detection conditions, the defect detection conditions are changed by the operator via the input unit 36 (that is, the defect detection conditions are changed from the above-mentioned adjusted defect detection conditions). Then, the inspection process for the confirmation image set 432 is executed again using the changed defect detection conditions, and the results of the inspection process are displayed on the display unit 35. In the result of the inspection process, if an undetected true defect exists, the defect detection conditions are further changed, and the result of the inspection process performed using the changed defect detection conditions is obtained.

As described above, by repeating changing the defect detection conditions and executing the inspection process as necessary, the defect detection conditions are readjusted and readjusted so that all true defects shown in the confirmation image set 432 can be detected. Subsequent defect detection conditions are acquired. In other words, the input unit 36 receives an input for readjusting the defect detection conditions, and the defect detection conditions after the readjustment are acquired. The defect detection conditions after readjustment become the defect detection conditions for mass production inspection, which will be described later, for the target production lot. Note that the defect detection conditions after readjustment are stricter than the above-mentioned adjusted defect detection conditions used in the confirmation inspection, since the above-mentioned undetected true defects can be detected.

On the other hand, if the result of the confirmation inspection is that there are no undetected true defects (step S19), the defect detection conditions are not readjusted, and the defect detection conditions after the above adjustment are used for the mass production inspection for the target production lot. This is the defect detection condition for

The defect detection conditions for mass production inspection are transmitted to the apparatus main body 2 in FIG. 1 and stored in the main body inspection section 23. In the apparatus main body 2, a plurality of inspection images showing a plurality of printed circuit boards included in the target manufacturing lot are sequentially acquired by the imaging unit 21 (step S21). Among the plurality of printed circuit boards included in the target manufacturing lot, for the printed circuit boards for which the trial inspection image has been acquired in step S11, the trial inspection image may be treated as the inspection image.

Furthermore, under the control of the main body control section 24, the main body inspection section 23 executes inspection processing for a plurality of inspection images as a mass production inspection (step S22). In mass production inspection, the defect detection conditions for mass production inspection described above are used. Preferably, the mass production inspection is performed in parallel with the acquisition of a plurality of inspection images. The results of the mass production inspection are stored in the main body inspection section 23. The mass production inspection result includes information on defects detected by the mass production inspection. The defect information includes, for example, an image of the defect, identification information of the printed circuit board including the defect, position information on the printed circuit board of the defect, and the like. The mass production inspection results may include the number of defects detected for each printed circuit board. Note that the plurality of inspection images may be deleted after the inspection processing.

With the above steps, the inspection of the printed circuit board by the inspection device 1 is completed. Information on defects detected by mass production inspection may be output to, for example, an external defect confirmation device. The defect confirmation device refers to the information about the defect, images the area of the defect on the printed circuit board, and displays the image on the display unit. By checking the defect included in the displayed image, the operator determines whether the defect is a true defect or a false report (false defect).

As explained above, the inspection apparatus 1 of FIG. 1 displays a plurality of trial inspection images 431 showing some printed circuit boards of one manufacturing lot, and a plurality of images 431 showing a plurality of defects to be detected on the printed circuit boards. A confirmation image set 432 is stored in the storage unit 43. The auxiliary inspection unit 42 detects defects by performing inspection processing using defect detection conditions on an image showing a printed circuit board. The trial inspection control unit 41 causes the auxiliary inspection unit 42 to execute an inspection process using the pre-adjustment defect detection conditions on the plurality of trial inspection images 431 as a trial inspection, and displays the results of the trial inspection on the display unit 35. let Thereafter, the input unit 36 receives an input for adjusting the defect detection conditions. In the inspection apparatus 1, by adjusting the defect detection conditions based on the results of the trial inspection, it is possible to suppress an increase in false alarms due to specific changes occurring in each manufacturing lot.

Further, after receiving the input for adjusting the defect detection conditions, the trial inspection control unit 41 causes the auxiliary inspection unit 42 to perform an inspection process using the adjusted defect detection conditions on the confirmation image set 432 as a confirmation inspection. and display the results of the confirmation test on the display section 35. Here, if the confirmation image set 432 is not prepared, in order to confirm whether or not true defects can be detected using the adjusted defect detection conditions, true defects may be detected among trial inspection images from past manufacturing lots. It is necessary for the operator to memorize or record an image in which the defects exist, and to execute an inspection process on the image using the adjusted defect detection conditions. It is also conceivable to perform inspection processing on all trial inspection images in past production lots, but this would require a large number of man-hours. On the other hand, in the inspection apparatus 1, by preparing the confirmation image set 432, it is possible to easily confirm whether true defects can be detected by the adjusted defect detection conditions, that is, whether or not the adjustment of the defect detection conditions is appropriate. can. As a result, work efficiency related to adjustment of defect detection conditions can be improved. Further, since the large-capacity storage unit 43 for storing all trial inspection images in past production lots is not required, it is possible to reduce the manufacturing cost of the inspection device 1.

Preferably, when the trial inspection control unit 41 causes the display unit 35 to display the results of the confirmation inspection, it displays the presence of defects that were not detected by the confirmation inspection among the plurality of defects indicated by the confirmation image set 432. . This allows workers to easily and more reliably recognize the existence of undetected true defects, readjust defect detection conditions, and obtain appropriate defect detection conditions for mass production inspection. be able to.

Preferably, when the input unit 36 receives an input indicating that one defect displayed on the display unit 35 as a result of a trial inspection is a true defect, the trial inspection control unit 41 sets the image of the defect to the confirmation image set. Add to 432. Thereby, true defects detected in the trial inspection can be easily added to the confirmation image set 432, and a preferable confirmation image set 432 can be created (prepared).

Preferably, the inspection apparatus 1 further includes an imaging unit 21 that acquires a plurality of inspection images showing a plurality of printed circuit boards included in the manufacturing lot. In the main body inspection section 23, inspection processing using the adjusted defect detection conditions is performed on the plurality of inspection images as a mass production inspection. Thereby, mass production inspection can be appropriately performed using defect detection conditions that can reduce false alarms while detecting true defects. In addition, since the plurality of trial inspection images 431 and confirmation image set 432 described above are images acquired by the imaging section 21, in the trial inspection, confirmation inspection, and mass production inspection, there are no errors caused by the imaging section. It becomes possible to suppress differences in inspection conditions.

FIG. 7 is a diagram showing another example of the inspection of a printed circuit board by the inspection apparatus 1, and shows the flow of processing performed after step S22 of FIG. 4B. In the example of FIG. 7, the results of the mass production inspection in step S22 are transmitted to the auxiliary unit 4 of FIG. 1 and displayed on the display section 35 (step S23). The results of the mass production inspection displayed on the display unit 35 are confirmed by the operator. If there is a defect that the operator determines to be a true defect among the defects displayed on the display unit 35, the operator inputs an input indicating that the defect is a true defect to the input unit, similarly to step S14. 36 (step S24). As a result, the image of the defect (true defect) is added to the confirmation image set 432 by the trial inspection control unit 41, and the confirmation image set 432 is updated (step S25). If there is no defect that the operator determines to be a true defect, the input unit 36 does not receive the input, and the confirmation image set 432 is not updated (step S24).

As described above, in the processing example shown in FIG. 7, when the input unit 36 receives an input indicating that one defect detected in mass production inspection is a true defect, the trial inspection control unit 41 checks the image of the defect. image set 432. Thereby, true defects detected in mass production inspection can be easily added to the confirmation image set 432, and a preferable confirmation image set 432 can be created (prepared).

In the inspection apparatus 1 of FIG. 1, the apparatus main body 2 and the auxiliary unit 4 are separately provided, but the trial inspection control section 41, the auxiliary inspection section 42, and the storage section 43 of the auxiliary unit 4 are connected to a computer included in the apparatus main body 2. It may be realized by In this case, the main body inspection section 23 and the auxiliary inspection section 42 are realized by one inspection section. In other words, in the inspection device 1 of FIG. 1 in which the device main body 2 and the auxiliary unit 4 are separately provided, the inspection section includes a first inspection section (auxiliary inspection section 42) that performs trial inspection and confirmation inspection, and a mass production inspection section. It can be said that it has a second inspection section (main body inspection section 23) that executes.

As in the above example, the apparatus main body 2 includes the imaging section 21 and the second inspection section, and the auxiliary unit 4 includes the storage section 43, the first inspection section, the display section 35, the input section 36, and the trial inspection control section 41. If these are provided separately, it becomes possible to perform mass production inspection of other types of printed circuit boards in the apparatus main body 2 in parallel with the processing of steps S12 to S20 described above in the auxiliary unit 4. As a result, the operating rate of the apparatus main body 2 can be improved, and the efficiency of inspecting printed circuit boards can be improved.

In the above processing example, the confirmation image set 432 includes images of various types of defects, but the confirmation image set 432 includes an image set of a first defect type and a second defect different from the first defect type. It may be included separately from image sets of different types. In the example of FIG. 8, the confirmation image set 432 includes a plating area defect image set 433 and an SR area defect image set 434. The plating region defect image set 433 includes images of a plurality of plating region defects that are true defects, with the defects present in the plating region 61 being defined as "plating region defects." Moreover, the defect existing in the SR area 62 is defined as an "SR area defect", and the SR area defect image set 434 includes images of a plurality of SR area defects that are true defects. Plating area defects are highly important defects because they have a relatively large effect on the operation of the printed circuit board. The SR region defect is a defect of low importance because it has a relatively small effect on the operation of the printed circuit board.

In step S14 of FIG. 4A, when the input unit 36 receives an input indicating that one defect displayed on the display unit 35 as a result of the trial inspection is a true defect, the trial inspection control unit 41 determines that the defect is plated. When the defect is a region defect, the image of the defect is added to the plating region defect image set 433 (step S15). On the other hand, when the defect is an SR region defect, the image of the defect is not added to the SR region defect image set 434. The same applies to steps S24 and S25 in FIG. As described above, by not adding defects of low importance to the confirmation image set 432, the number of images included in the confirmation image set 432 may be excessively increased, that is, the size of the confirmation image set 432 may be excessively increased. The increase can be suppressed. The first and second defect types may be other than plating area defects and SR area defects, and the confirmation image set 432 may include image sets of three or more defect types.

Various modifications can be made to the above-mentioned inspection device 1 and inspection method.

The images included in the confirmation image set 432 may be images of defects to be detected in printed circuit boards, and may be images of true defects in other types of printed circuit boards.

The object to be inspected by the inspection apparatus 1 may be a substrate such as a semiconductor substrate or a glass substrate in addition to a printed circuit board. Furthermore, defects in objects other than the board, such as mechanical parts, may be detected by the inspection device 1.

The configurations of the above embodiment and each modification may be combined as appropriate unless mutually contradictory.

1 inspection device 2 main body 3 computer 4 auxiliary unit 21 imaging section 23 main inspection section 35 display section 36 input section 41 trial inspection control section 42 auxiliary inspection section 43 storage section 431 trial inspection image 432 confirmation image set 433 plating area defect Image set 434 SR area defect image set 811 Program S11 to S25 Steps

Claims (14)

An inspection device that inspects an image taken of a target object,
a storage unit that stores a plurality of trial inspection images showing some objects of one manufacturing lot and a confirmation image set showing a plurality of defects to be detected in the objects;
an inspection unit that detects defects by performing inspection processing using defect detection conditions on an image showing the target object;
a display unit that displays the results of the inspection process;
an input unit that receives input for adjusting the defect detection conditions;
causing the inspection unit to execute the inspection process using the defect detection conditions before adjustment on the plurality of trial inspection images as a trial inspection, displaying the results of the trial inspection on the display unit, and causing the input unit to After receiving the input for adjusting the defect detection conditions, causes the inspection section to execute the inspection process using the adjusted defect detection conditions on the confirmation image set as a confirmation inspection, and performs the confirmation inspection. a trial test control unit that displays the results on the display unit;
An inspection device comprising: The inspection device according to claim 1,
The trial inspection control unit, when displaying the results of the confirmation inspection on the display unit, displays the presence of defects that were not detected by the confirmation inspection among the plurality of defects indicated by the confirmation image set. An inspection device characterized by: The inspection device according to claim 1,
When the input unit receives an input indicating that one defect displayed on the display unit as a result of the trial inspection is a true defect, the trial inspection control unit adds the image of the defect to the confirmation image set. An inspection device characterized by adding: The inspection device according to claim 1,
An inspection apparatus characterized in that the confirmation image set includes an image set of a first defect type and an image set of a second defect type different from the first defect type. The inspection device according to any one of claims 1 to 4,
further comprising an imaging unit that acquires a plurality of inspection images showing a plurality of objects included in the manufacturing lot,
The plurality of trial inspection images and the confirmation image set are images acquired by the imaging unit,
An inspection apparatus characterized in that the inspection unit executes the inspection process using the adjusted defect detection conditions on the plurality of inspection images as a mass production inspection. The inspection device according to claim 5,
When the input unit receives an input indicating that one defect detected in the mass production inspection is a true defect, the trial inspection control unit adds an image of the defect to the confirmation image set. Inspection equipment. The inspection device according to claim 5,
The inspection department,
a first inspection unit that executes the trial inspection and the confirmation inspection;
a second inspection section that executes the mass production inspection;
Equipped with
A device main body including the imaging section and the second inspection section, and an auxiliary unit including the storage section, the first inspection section, the display section, the input section, and the trial inspection control section are provided separately. An inspection device featuring: An inspection method for inspecting an image taken of a target object using an inspection device,
a) preparing a plurality of trial inspection images showing some objects of one manufacturing lot and a confirmation image set showing a plurality of defects to be detected in the objects;
b) In the inspection device, defects can be detected by executing an inspection process using defect detection conditions on images showing the object, and the predetermined defect detection conditions are applied to the plurality of trial inspection images. a step of executing the used inspection process as a trial inspection;
c) displaying the results of the trial test on a display unit;
d) receiving input for adjusting the defect detection conditions;
e) performing the inspection process on the confirmation image set using the adjusted defect detection conditions as a confirmation inspection;
f) displaying the results of the confirmation test on the display section;
An inspection method comprising: The testing method according to claim 8,
In the step f), when displaying the results of the confirmation inspection on the display section, the presence of defects that were not detected by the confirmation inspection among the plurality of defects indicated by the confirmation image set is displayed. An inspection method characterized by: The testing method according to claim 8,
In the step c), when an input indicating that one defect displayed on the display unit as a result of the trial inspection is a true defect is received, an image of the defect is added to the confirmation image set. An inspection method characterized by: The testing method according to claim 8,
An inspection method characterized in that the confirmation image set includes an image set of a first defect type and an image set of a second defect type different from the first defect type. The inspection method according to any one of claims 8 to 11,
g) acquiring a plurality of inspection images showing a plurality of objects included in the manufacturing lot using an imaging unit;
h) performing the inspection process on the plurality of inspection images using the adjusted defect detection conditions as a mass production inspection;
Furthermore,
An inspection method characterized in that the plurality of trial inspection images and the confirmation image set are images acquired by the imaging unit. The inspection method according to claim 12,
An inspection method characterized in that when an input indicating that one defect detected in the mass production inspection is a true defect is received, an image of the defect is added to the confirmation image set. A program that causes a computer to inspect an image taken of a target object, wherein execution of the program by the computer causes the computer to:
a) preparing a plurality of trial inspection images showing some objects of one manufacturing lot and a confirmation image set showing a plurality of defects to be detected in the objects;
b) In the computer, a defect can be detected by executing an inspection process using defect detection conditions on an image showing the object, and using a predetermined defect detection condition on the plurality of trial inspection images. a step of executing the inspection process as a trial inspection;
c) displaying the results of the trial test on a display unit;
d) receiving input for adjusting the defect detection conditions;
e) performing the inspection process on the confirmation image set using the adjusted defect detection conditions as a confirmation inspection;
f) displaying the results of the confirmation test on the display section;
A program characterized by executing.

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