JP2023170864A - Resin composition, prepreg, laminate, resin film, printed wiring board, antenna device and antenna module - Google Patents

Abstract

To provide a resin composition that has high relative dielectric constant (Dk) while offering superior fluidity, and a prepreg, a laminate, a resin film, a printed wiring board, an antenna device and an antenna module each of which includes the resin composition.SOLUTION: A resin composition includes (A) thermosetting resins and (B) inorganic fillers, where the (B) inorganic fillers include (B1) a high-dielectric-constant inorganic filler and (B2) a spherical inorganic filler. There are also provided a prepreg, a laminate, a resin film, a printed wiring board, an antenna device and an antenna module each of which includes the resin composition.SELECTED DRAWING: None

Description

The present embodiment relates to a resin composition, a prepreg, a laminate, a resin film, a printed wiring board, an antenna device, and an antenna module.

In recent years, as mobile terminals such as smartphones have become widespread and technological innovations such as IoT (Internet of Things) have progressed, the number of home appliances and electronic devices having wireless communication functions is increasing. There are concerns that this will increase the communication traffic of wireless networks and reduce communication speed and communication quality.
In order to solve this problem, a fifth generation mobile communication system (hereinafter sometimes referred to as "5G") is being developed and is already being used. In 5G, multiple antenna elements are used to perform advanced beamforming and spatial multiplexing, and in addition to the conventionally used 6GHz frequency signals, higher frequency millimeter wave bands of several tens of GHz will be used. use the signal. This is expected to increase communication speed and improve communication quality.
On the other hand, as mobile terminals such as smartphones are required to be smaller, antenna modules must also be made smaller. To achieve smaller antenna modules, it is necessary to increase the dielectric constant (Dk) of the substrate. This is widely known.

As a method for increasing the dielectric constant (Dk) of a substrate, a method of adding a filler having a high dielectric constant (Dk) is used.
Patent Document 1 states that the BET specific surface area measured by the N ₂ adsorption method is within the range of 0.1 to 2.0 m ² /g, and the average particle size measured by the air permeation method is within the range of 0.8 to 100 μm. A ceramic powder made of titanium oxide or titanate is disclosed.

International Publication No. 2010/027074

According to the technology of Patent Document 1, it is possible to provide a ceramic powder that can provide a dielectric composite material that exhibits a sufficiently high dielectric constant and a sufficiently low dielectric loss tangent when composited with a synthetic resin. has been done.

However, according to studies conducted by the present inventors, it has been found that when a high dielectric inorganic filler such as a titanium-based inorganic filler is blended, the fluidity of the resin composition decreases. Since a decrease in the fluidity of the resin composition may cause deterioration in wiring embedding properties, improvement is desired.

In view of the current situation, the present embodiment provides a resin composition that has a high dielectric constant (Dk) and excellent fluidity, a prepreg using the resin composition, a laminate, a resin film, and a printed wiring. An object of the present invention is to provide a board, an antenna device, and an antenna module.

The present inventors conducted studies to solve the above problems, and as a result, they found that the problems could be solved by the present embodiment described below.
That is, the present embodiment relates to the following [1] to [15].
[1] A resin composition containing (A) a thermosetting resin and (B) an inorganic filler,
A resin composition, wherein the (B) inorganic filler contains (B1) a high dielectric constant inorganic filler and (B2) a spherical inorganic filler.
[2] The resin composition according to [1] above, wherein the thermosetting resin (A) is one or more selected from the group consisting of maleimide compounds having one or more N-substituted maleimide groups and derivatives thereof. thing.
[3] The resin composition according to [1] or [2] above, wherein the high dielectric constant inorganic filler (B1) is a titanium-based inorganic filler.
[4] The resin composition according to any one of [1] to [3] above, wherein the high dielectric constant inorganic filler (B1) has an average particle diameter (D ₅₀ ) of 0.1 to 20 μm.
[5] The content of the high dielectric constant inorganic filler (B1) in the resin composition is 10 to 70% by volume based on the total solid content of the resin composition, [1] to [ 4]. The resin composition according to any one of [4].
[6] The resin composition according to any one of [1] to [5] above, wherein the spherical inorganic filler (B2) is silica.
[7] The resin composition according to any one of [1] to [6] above, wherein the spherical inorganic filler (B2) has an average particle diameter (D ₅₀ ) of 10 to 1,500 nm.
[8] The content of the (B2) spherical inorganic filler in the resin composition is 0.1 to 20% by volume based on the total solid content of the resin composition, [1] to [ 7]. The resin composition according to any one of [7].
[9] The resin composition according to any one of [1] to [8] above, which is used for an antenna module.
[10] A prepreg containing the resin composition according to any one of [1] to [9] above or a semi-cured product of the resin composition.
[11] A laminate comprising a cured product of the resin composition according to any one of [1] to [9] above and metal foil.
[12] A resin film containing the resin composition according to any one of [1] to [9] above or a semi-cured product of the resin composition.
[13] A printed wiring board comprising a cured product of the resin composition according to any one of [1] to [9] above.
[14] An antenna device comprising the printed wiring board according to [13] above.
[15] An antenna module comprising the antenna device according to [14] above and a power feeding circuit.

According to the present embodiment, a resin composition having a high dielectric constant (Dk) and excellent fluidity, a prepreg using the resin composition, a laminate, a resin film, a printed wiring board, an antenna device, and An antenna module can be provided.

In this specification, a numerical range indicated using "~" indicates a range that includes the numerical values written before and after "~" as the minimum and maximum values, respectively.
For example, the notation of a numerical range "X to Y" (X and Y are real numbers) means a numerical range that is greater than or equal to X and less than or equal to Y. In this specification, the expression "X or more" means X and a numerical value exceeding X. Moreover, the description "Y or less" in this specification means Y and a numerical value less than Y.
The lower and upper limits of the numerical ranges described herein can be arbitrarily combined with the lower and upper limits of other numerical ranges, respectively.
In the numerical ranges described in this specification, the lower limit or upper limit of the numerical range may be replaced with the values shown in the examples.

Each component and material illustrated in this specification may be used alone or in combination of two or more, unless otherwise specified.
In the present specification, the content of each component in the resin composition refers to the content of each component in the resin composition, unless otherwise specified. means the total amount of
In this specification, the term "resin composition" includes a mixture of each component described below and a semi-cured product of the mixture.

In this specification, "solid content" refers to non-volatile content excluding volatile substances such as solvents, and refers to components that remain without volatilizing when the resin composition is dried, and are liquid at room temperature. , including starch syrup-like and wax-like ones. Here, in this specification, room temperature refers to 25°C.

The mechanism of action described in this specification is speculation, and does not limit the mechanism by which the resin composition according to this embodiment exerts its effects.
This embodiment also includes aspects in which the items described in this specification are arbitrarily combined.

[Resin composition]
The resin composition of this embodiment is a resin composition containing (A) a thermosetting resin and (B) an inorganic filler, wherein the (B) inorganic filler is (B1) a high dielectric This is a resin composition containing a spherical inorganic filler and (B2) a spherical inorganic filler.

In this specification, each component may be abbreviated as (A) component, (B) component, etc., and other components may also be abbreviated in the same manner.
Each component that can be contained in the resin composition of this embodiment will be explained in order below.

<(A) Thermosetting resin>
(A) Thermosetting resins include, for example, epoxy resins, phenol resins, maleimide resins, cyanate resins, isocyanate resins, benzoxazine resins, oxetane resins, amino resins, unsaturated polyester resins, allyl resins, dicyclopentadiene resins, Examples include silicone resin, triazine resin, and melamine resin.
(A) The thermosetting resin may be used alone or in combination of two or more.
Among these, (A) thermosetting resin is preferably one or more selected from the group consisting of epoxy resin, cyanate resin, and maleimide resin, and more preferably maleimide resin, from the viewpoint of heat resistance and conductor adhesion. , maleimide resins having one or more N-substituted maleimide groups, and derivatives of the maleimide resins are more preferred.

In the following description, "one or more selected from the group consisting of a maleimide resin having one or more N-substituted maleimide groups and a derivative of the maleimide resin" may be referred to as a "maleimide resin."

<(A) Maleimide resin>
(A) The maleimide resin is one or more selected from the group consisting of maleimide resins having one or more N-substituted maleimide groups and derivatives of the maleimide resins.
(A) The maleimide resin may be used alone or in combination of two or more.

In the following description, a maleimide resin having one or more N-substituted maleimide groups may be referred to as a "maleimide resin (AX)" or "(AX) component."
Further, a maleimide resin derivative having one or more N-substituted maleimide groups may be referred to as a "maleimide resin derivative (AY)" or "(AY) component."

(Maleimide resin (AX))
The maleimide resin (AX) is not particularly limited as long as it has one or more N-substituted maleimide groups.
From the viewpoint of conductor adhesion and heat resistance, the maleimide resin (AX) is preferably an aromatic maleimide resin having two or more N-substituted maleimide groups, and an aromatic bismaleimide resin having two or more N-substituted maleimide groups. More preferably, it is a resin.

In this specification, the term "aromatic maleimide resin" refers to a compound having an N-substituted maleimide group directly bonded to an aromatic ring. Furthermore, in the present specification, the term "aromatic bismaleimide resin" means a compound having two N-substituted maleimide groups directly bonded to an aromatic ring. Furthermore, in the present specification, the term "aromatic polymaleimide resin" means a compound having three or more N-substituted maleimide groups directly bonded to an aromatic ring. Furthermore, in the present specification, the term "aliphatic maleimide resin" means a compound having an N-substituted maleimide group directly bonded to an aliphatic hydrocarbon.

As the maleimide resin (AX), a maleimide resin represented by the following general formula (A-1) is preferable.

(In the formula, X ^A1 is a divalent organic group.)

X ^A1 in the above general formula (A-1) is a divalent organic group.
The divalent organic ^group represented by A divalent organic group represented by the following general formula (A-4), a divalent organic group represented by the following general formula (A-5), a divalent organic group represented by the following general formula (A-5), the following general formula ( Examples include a divalent organic group represented by A-6) and a divalent organic group represented by the following general formula (A-7).

(In the formula, R ^A1 is an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. n ^A1 is an integer of 0 to 4. * represents a bonding site.)

Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by R ^A1 in the above general formula (A-2) include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, and isobutyl group. Examples include alkyl groups having 1 to 5 carbon atoms such as t-butyl group, n-pentyl group; alkenyl groups having 2 to 5 carbon atoms; and alkynyl groups having 2 to 5 carbon atoms. The aliphatic hydrocarbon group having 1 to 5 carbon atoms may be linear or branched. The aliphatic hydrocarbon group having 1 to 5 carbon atoms is preferably an aliphatic hydrocarbon group having 1 to 3 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms, and even more preferably a methyl group.
Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, and the like.
n ^A1 in the general formula (A-2) is an integer of 0 to 4, preferably an integer of 0 to 2, more preferably 0 or 1, and even more preferably 0 from the viewpoint of availability.
When n ^A1 is an integer of 2 or more, the plurality of R ^A1 's may be the same or different.

(In the formula, R ^A2 and R ^A3 are each independently an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. X ^A2 is an alkylene group having 1 to 5 carbon atoms, An alkylidene group, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, a single bond, or a divalent organic group represented by the following general formula (A-3-1). ^{n A2} and n ^A3 are each independently an integer from 0 to 4. * represents a binding site.)

Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by R ^A2 and R ^A3 in the above general formula (A-3) include methyl group, ethyl group, n-propyl group, isopropyl group, and n-butyl group. Examples include alkyl groups having 1 to 5 carbon atoms, such as isobutyl group, t-butyl group, and n-pentyl group; alkenyl groups having 2 to 5 carbon atoms; and alkynyl groups having 2 to 5 carbon atoms. The aliphatic hydrocarbon group having 1 to 5 carbon atoms may be linear or branched. The aliphatic hydrocarbon group having 1 to 5 carbon atoms is preferably an aliphatic hydrocarbon group having 1 to 3 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms, and even more preferably a methyl group or an ethyl group.
Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, and the like.

Examples of the alkylene ^group having 1 to 5 carbon atoms represented by group, 1,5-pentamethylene group, and the like. The alkylene group having 1 to 5 carbon atoms is preferably an alkylene group having 1 to 3 carbon atoms, more preferably an alkylene group having 1 or 2 carbon atoms, and even more preferably a methylene group.

The ^alkylidene group having 2 to 5 carbon atoms represented by etc. Among these, an alkylidene group having 2 to 4 carbon atoms is preferred, an alkylidene group having 2 or 3 carbon atoms is more preferred, and an isopropylidene group is even more preferred.

n ^A2 and n ^A3 in the above general formula (A-3) are each independently an integer of 0 to 4.
When ^nA2 or ^nA3 is an integer of 2 or more, the plurality of R ^A2s or the plurality of R ^A3s may be the same or different.

The divalent organic group represented by the general formula (A-3-1) represented by X ^A2 in the above general formula (A-3) is as follows.

(In the formula, R ^A4 and R ^A5 are each independently an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. X ^A3 is an alkylene group having 1 to 5 carbon atoms, It is an alkylidene group, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, or a single bond. n ^A4 and n ^A5 are each independently an integer of 0 to 4. * represents a bonding site. )

Examples of the aliphatic hydrocarbon groups having 1 to 5 carbon atoms represented by R ^A4 and R ^A5 in the above general formula (A-3-1) include methyl group, ethyl group, n-propyl group, isopropyl group, n Examples include alkyl groups having 1 to 5 carbon atoms such as -butyl group, isobutyl group, t-butyl group, and n-pentyl group; alkenyl groups having 2 to 5 carbon atoms; and alkynyl groups having 2 to 5 carbon atoms. The aliphatic hydrocarbon group having 1 to 5 carbon atoms may be linear or branched. The aliphatic hydrocarbon group having 1 to 5 carbon atoms is preferably an aliphatic hydrocarbon group having 1 to 3 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms, and even more preferably a methyl group.
Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, and the like.

Examples of the alkylene group having 1 to 5 carbon atoms represented by X ^A3 in the above general formula (A-3-1) include methylene group, 1,2-dimethylene group, 1,3-trimethylene group, Examples include a tetramethylene group and a 1,5-pentamethylene group. The alkylene group having 1 to 5 carbon atoms is preferably an alkylene group having 1 to 3 carbon atoms, more preferably an alkylene group having 1 or 2 carbon atoms, and even more preferably a methylene group.

Examples of the ^alkylidene group having 2 to 5 carbon atoms represented by Examples include lydene group. Among these, an alkylidene group having 2 to 4 carbon atoms is preferred, an alkylidene group having 2 or 3 carbon atoms is more preferred, and an isopropylidene group is even more preferred.

n ^A4 and n ^A5 in the above general formula (A-3-1) are each independently an integer of 0 to 4, and from the viewpoint of availability, both are preferably integers of 0 to 2, more preferably Preferably it is 0 or 1, more preferably 0.
When n ^A4 or n ^A5 is an integer of 2 or more, the plurality of R ^A4s or the plurality of R ^A5s may be the same or different.

Among the above options, X ^A2 in the above general formula (A-3) is an alkylene group having 1 to 5 carbon atoms, an alkylidene group having 2 to 5 carbon atoms, and a group represented by the above general formula (A-3-1). A divalent organic group having 1 to 5 carbon atoms is preferred, an alkylene group having 1 to 5 carbon atoms is more preferred, and a methylene group is even more preferred.

(In the formula, n ^A6 is an integer from 0 to 10. * represents the binding site.)

n ^A6 in the above general formula (A-4) is preferably an integer of 0 to 5, more preferably an integer of 0 to 4, and still more preferably an integer of 0 to 3, from the viewpoint of availability.

(In the formula, n ^A7 is a number from 0 to 5. * represents the binding site.)

(In the formula, R ^A6 and R ^A7 are each independently a hydrogen atom or an aliphatic hydrocarbon group having 1 to 5 carbon atoms. n ^A8 is an integer of 1 to 8. * represents a bonding site. )

Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by R ^A6 and R ^A7 in the above general formula (A-6) include methyl group, ethyl group, n-propyl group, isopropyl group, and n-butyl group. Examples include alkyl groups having 1 to 5 carbon atoms, such as isobutyl group, t-butyl group, and n-pentyl group; alkenyl groups having 2 to 5 carbon atoms; and alkynyl groups having 2 to 5 carbon atoms. The aliphatic hydrocarbon group having 1 to 5 carbon atoms may be linear or branched.
n ^A8 in the above general formula (A-6) is an integer of 1 to 8, preferably an integer of 1 to 5, more preferably an integer of 1 to 3, and even more preferably 1. When n ^A8 is an integer of 2 or more, the plurality of R ^A6s or the plurality of R ^A7s may be the same or different.

(In the formula, R ^A8 is an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, or an aryl group having 6 to 10 carbon atoms. is an aryloxy group, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a mercapto group, and n ^A9 is an integer of 0 to 3. R ^A9 to R ^A11 are each independently an alkyl group having 1 to 10 carbon atoms.R ^A12 is each independently an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, or an alkyl group having 1 to 10 carbon atoms. Alkylthio group, aryl group having 6 to 10 carbon atoms, aryloxy group having 6 to 10 carbon atoms, arylthio group having 6 to 10 carbon atoms, cycloalkyl group having 3 to 10 carbon atoms, halogen atom, nitro group, hydroxyl group, or mercapto (n ^A10 is each independently an integer from 0 to 4, and n ^A11 is a numerical value from 0.95 to 10.0. * represents a binding site.)

Examples of the alkyl group having 1 to 10 carbon atoms represented by R ^A8 in the above general formula (A-7) include methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, Examples include octyl group and decyl group. These alkyl groups may be linear or branched.
The alkyl group contained in the alkyloxy group having 1 to 10 carbon atoms and the alkylthio group having 1 to 10 carbon atoms represented by R ^A8 includes the same alkyl groups as the above-mentioned alkyl groups having 1 to 10 carbon atoms.
Examples of the aryl group having 6 to 10 carbon atoms represented by R ^A8 include phenyl group and naphthyl group.
The aryl group contained in the aryloxy group having 6 to 10 carbon atoms and the arylthio group having 6 to 10 carbon atoms represented by R ^A8 includes the same aryl groups as the above-mentioned aryl group having 6 to 10 carbon atoms.
Examples of the cycloalkyl group having 3 to 10 carbon atoms represented by R ^A8 include cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, cycloheptyl group, cyclooctyl group, cyclodecyl group, and the like.
When n ^A9 in the above general formula (A-7) is an integer of 1 to 3, R ^A8 is an alkyl group having 1 to 4 carbon atoms, or an alkyl group having 3 to 6 carbon atoms, from the viewpoint of solvent solubility and reactivity. A cycloalkyl group having 6 to 10 carbon atoms is preferable, and an alkyl group having 1 to 4 carbon atoms is more preferable.

Examples of the alkyl group having 1 to 10 carbon atoms represented by R ^A9 to R ^A11 include methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, decyl group, etc. Can be mentioned. These alkyl groups may be linear or branched. Among these, R ^A9 to R ^A11 are preferably an alkyl group having 1 to 4 carbon atoms, more preferably a methyl group or an ethyl group, and even more preferably a methyl group.
n ^A9 in the above general formula (A-7) is an integer from 0 to 3, and when n ^A9 is 2 or 3, multiple R ^A8s may be the same or different. Good too.

Among the above, the divalent organic group represented by the above general formula (A-7) is preferred from the viewpoints of compatibility with other resins, solvent solubility, dielectric properties, adhesion with conductors, and ease of manufacture. Therefore, it is preferable that n ^A9 is 0 and R ^A9 to R ^A11 are divalent organic groups, which are methyl groups.

In the above general formula (A-7), the plurality of R ^A8s , the plurality of R ^A12s , the plurality of n ^A9s , and the plurality of n ^A10s may be the same or different. good. Further, when n ^A11 exceeds 1, the plurality of ^RA9s , the plurality of ^RA10s , and the plurality of ^RA11s may be the same or different.

In the above general formula (A-7), R ^A12 represents an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms , an aryloxy group having 6 to 10 carbon atoms, an ^arylthio group having 6 to 10 carbon atoms, and a cycloalkyl group having 3 to 10 carbon atoms. Alkyloxy group having 1 to 10 carbon atoms, alkylthio group having 1 to 10 carbon atoms, aryl group having 6 to 10 carbon atoms, aryloxy group having 6 to 10 carbon atoms, arylthio group having 6 to 10 carbon atoms, 3 to 10 carbon atoms This is the same as the explanation for the cycloalkyl group.
Among these, R ^A12 is selected from the viewpoints of compatibility with other resins, solvent solubility, dielectric properties, adhesion to conductors, and ease of manufacture, including alkyl groups having 1 to 4 carbon atoms, A cycloalkyl group having 6 carbon atoms and an aryl group having 6 to 10 carbon atoms are preferred, and an alkyl group having 1 to 3 carbon atoms is more preferred.
n ^A10 in the above general formula (A-7) is an integer from 0 to 4, and from the viewpoint of compatibility with other resins, solvent solubility, dielectric properties, adhesiveness with conductors, and ease of manufacture. , preferably an integer from 0 to 3, more preferably 0 or 2.
Note that when n ^A10 is 1 or more, the benzene ring and the N-substituted maleimide group have a twisted conformation, which tends to further improve solvent solubility by suppressing intermolecular stacking. From the same viewpoint, when n ^A10 is 1 or more, the substitution position of R ^A12 is preferably the ortho position with respect to the N-substituted maleimide group.
n ^A11 in the above general formula (A-7) is preferably 0.98 to 8.0, from the viewpoint of compatibility with other resins, solvent solubility, melt viscosity, handling property, and heat resistance. It is preferably 1.0 to 7.0, more preferably 1.1 to 6.0.

The divalent organic group represented by the above general formula (A-7) is a divalent organic group represented by the following general formula (A-7-1), and the divalent organic group represented by the following general formula (A-7-2). A divalent organic group represented by the following general formula (A-7-3), a divalent organic group represented by the following general formula (A-7-4), etc. Preferably.

(In the formula, n ^A11 is the same as in the above general formula (A-7). * represents the binding site.)

Examples of the maleimide resin (AX) include aromatic bismaleimide resins, aromatic polymaleimide resins, aliphatic maleimide resins, and the like, and among these, aromatic bismaleimide resins are preferred.
Specific examples of maleimide resin (AX) include N,N'-ethylene bismaleimide, N,N'-hexamethylene bismaleimide, N,N'-(1,3-phenylene)bismaleimide, N,N'- [1,3-(2-methylphenylene)]bismaleimide, N,N'-[1,3-(4-methylphenylene)]bismaleimide, N,N'-(1,4-phenylene)bismaleimide, Bis(4-maleimidophenyl)methane, bis(3-methyl-4-maleimidophenyl)methane, 3,3'-dimethyl-5,5'-diethyl-4,4'-diphenylmethanebismaleimide, bis(4-maleimide) phenyl)ether, bis(4-maleimidophenyl)sulfone, bis(4-maleimidophenyl)sulfide, bis(4-maleimidophenyl)ketone, bis(4-maleimidocyclohexyl)methane, 1,4-bis(4-maleimidophenyl) ) Cyclohexane, 1,4-bis(maleimidomethyl)cyclohexane, 1,4-bis(maleimidomethyl)benzene, 1,3-bis(4-maleimidophenoxy)benzene, 1,3-bis(3-maleimidophenoxy)benzene , bis[4-(3-maleimidophenoxy)phenyl]methane, bis[4-(4-maleimidophenoxy)phenyl]methane, 1,1-bis[4-(3-maleimidophenoxy)phenyl]ethane, 1,1 -Bis[4-(4-maleimidophenoxy)phenyl]ethane, 1,2-bis[4-(3-maleimidophenoxy)phenyl]ethane, 1,2-bis[4-(4-maleimidophenoxy)phenyl]ethane , 2,2-bis[4-(3-maleimidophenoxy)phenyl]propane, 2,2-bis[4-(4-maleimidophenoxy)phenyl]propane, 2,2-bis[4-(3-maleimidophenoxy)phenyl]propane ) phenyl]butane, 2,2-bis[4-(4-maleimidophenoxy)phenyl]butane, 2,2-bis[4-(3-maleimidophenoxy)phenyl]-1,1,1,3,3, 3-hexafluoropropane, 2,2-bis[4-(4-maleimidophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, 4,4-bis(3-maleimidophenoxy) Biphenyl, 4,4-bis(4-maleimidophenoxy)biphenyl, bis[4-(3-maleimidophenoxy)phenyl]ketone, bis[4-(4-maleimidophenoxy)phenyl]ketone, bis(4-maleimidophenyl) Disulfide, bis[4-(3-maleimidophenoxy)phenyl]sulfide, bis[4-(4-maleimidophenoxy)phenyl]sulfide, bis[4-(3-maleimidophenoxy)phenyl]sulfoxide, bis[4-(4 -maleimidophenoxy)phenyl] sulfoxide, bis[4-(3-maleimidophenoxy)phenyl]sulfone, bis[4-(4-maleimidophenoxy)phenyl]sulfone, bis[4-(3-maleimidophenoxy)phenyl]ether, Bis[4-(4-maleimidophenoxy)phenyl]ether, 1,4-bis[4-(4-maleimidophenoxy)-α,α-dimethylbenzyl]benzene, 1,3-bis[4-(4-maleimide) phenoxy)-α,α-dimethylbenzyl]benzene, 1,4-bis[4-(3-maleimidophenoxy)-α,α-dimethylbenzyl]benzene, 1,3-bis[4-(3-maleimidophenoxy) -α,α-dimethylbenzyl]benzene, 1,4-bis[4-(4-maleimidophenoxy)-3,5-dimethyl-α,α-dimethylbenzyl]benzene, 1,3-bis[4-(4 -maleimidophenoxy)-3,5-dimethyl-α,α-dimethylbenzyl]benzene, 1,4-bis[4-(3-maleimidophenoxy)-3,5-dimethyl-α,α-dimethylbenzyl]benzene, 1,3-bis[4-(3-maleimidophenoxy)-3,5-dimethyl-α,α-dimethylbenzyl]benzene, polyphenylmethane maleimide, aromatic bismaleimide resin having an indane skeleton, biphenylaralkyl maleimide resin etc. Among these, aromatic bismaleimide resins having an indane skeleton are preferred from the viewpoint of dielectric properties.

(Maleimide resin derivative (AY))
As the maleimide resin derivative (AY), an aminomaleimide resin containing a structural unit derived from the above maleimide resin (AX) and a structural unit derived from a diamine compound is preferable.

As the structural unit derived from the maleimide resin (AX) contained in the aminomaleimide resin, for example, among the N-substituted maleimide groups that the maleimide resin (AX) has, at least one N-substituted maleimide group is an amino group that the diamine compound has. Examples include structural units formed by Michael addition reaction with groups.
The number of structural units derived from the maleimide resin (AX) contained in the aminomaleimide resin may be one type alone, or two or more types may be used.

As the structural unit derived from the diamine compound contained in the aminomaleimide resin, for example, one or both of the two amino groups possessed by the diamine compound are the N-substituted maleimide group possessed by the maleimide resin (AX). Examples include structural units formed by Michael addition reactions.
The number of structural units derived from the diamine compound contained in the aminomaleimide resin may be one type alone, or two or more types may be used.
As the diamine compound, for example, those listed as the curing agent (C) described below can be used.

((A) Content of thermosetting resin)
In the resin composition of the present embodiment, the content of the thermosetting resin (A) is not particularly limited, but is preferably based on the total amount (100% by mass) of the resin components in the resin composition of the present embodiment. The content is 40 to 98% by weight, more preferably 60 to 95% by weight, and even more preferably 80 to 90% by weight.
(A) When the content of the thermosetting resin is at least the above lower limit, heat resistance, moldability, workability, and conductor adhesion tend to be better. Moreover, when the content of the thermosetting resin (A) is below the above upper limit, the dielectric properties tend to be better.

Here, in this specification, the "resin component" means a resin and a compound that forms a resin through a curing reaction.
When the resin composition of the present embodiment contains a resin or a compound that forms a resin through a curing reaction in addition to component (A) as an optional component, these optional components are also included in the resin component. However, the (D) component, (E) component, and (F) component described below are not included in the resin component.

The content of the resin component in the resin composition of this embodiment is not particularly limited, but is preferably 5 to 70% by mass, more preferably 5 to 70% by mass, based on the total solid content (100% by mass) of the resin composition of this embodiment. It is preferably 10 to 50% by weight, more preferably 15 to 30% by weight.
When the content of the resin component is at least the above lower limit, heat resistance, moldability, workability, and conductor adhesion tend to be better. Moreover, when the content of the resin component is below the above-mentioned upper limit, the low thermal expansion property tends to be better.

(A) The content of the maleimide resin in the thermosetting resin is not particularly limited, but is preferably 80 to 100% by mass, more preferably 80 to 100% by mass based on the total amount (100% by mass) of the thermosetting resin (A). It is preferably 90 to 100% by weight, more preferably 95 to 100% by weight.
When the content of the maleimide resin is at least the above lower limit, heat resistance, moldability, processability, and conductor adhesion tend to be better. Furthermore, when the content of the maleimide resin is below the above upper limit, the dielectric properties tend to be better.

<(B) Inorganic filler>
(B) The inorganic filler contains (B1) a high dielectric constant inorganic filler and (B2) a spherical inorganic filler.

((B1) High dielectric constant inorganic filler)
(B1) The high dielectric constant inorganic filler is an inorganic filler that contributes to improving the dielectric constant (Dk) of the cured product of the resin composition.
In addition, in this embodiment, (B1) high dielectric constant inorganic filler means an inorganic filler whose dielectric constant (Dk) at 10 GHz is 10 or more.
(B1) The dielectric constant (Dk) of the high dielectric constant inorganic filler at 10 GHz is preferably 10 to 3,000 from the viewpoint of easy availability and making it easier to increase the dielectric constant (Dk) of the resin composition. , more preferably 13 to 2,500, still more preferably 15 to 2,000.
(B1) The dielectric constant (Dk) of the high dielectric constant inorganic filler at 10 GHz can be measured by the method described in Examples.
(B1) High dielectric constant inorganic fillers may be used alone or in combination of two or more.

(B1) Examples of the high dielectric constant inorganic filler include titanium-based inorganic fillers and zircon-based inorganic fillers.
Examples of titanium-based inorganic fillers include titanium dioxide; alkali metal titanates such as potassium titanate; alkaline earth metal salts of titanates such as calcium titanate, barium titanate, and strontium titanate; lead titanate, etc. Can be mentioned.
Examples of the zircon-based inorganic filler include alkaline earth metal zirconate salts such as calcium zirconate and strontium zirconate.
Among the above options, (B1) high dielectric constant inorganic filler is preferably a titanium-based inorganic filler, more preferably an alkaline earth metal titanate, from the viewpoint of obtaining a high dielectric constant (Dk), and titanium-based inorganic filler is more preferable. More preferred is calcium acid.

(B1) The high dielectric constant inorganic filler may be surface-treated with a coupling agent or the like. Examples of the coupling agent include a silane coupling agent and a titanate coupling agent. Among these, titanate coupling agents are preferred.

(B1) The average particle diameter (D ₅₀ ) of the high dielectric constant inorganic filler is not particularly limited, but is preferably 0.1 to 20 μm, more preferably 0.5 to 15 μm, and even more preferably 0.7 to 10 μm. be.
(B1) If the average particle diameter (D ₅₀ ) of the high dielectric constant inorganic filler is greater than or equal to the above lower limit, the specific surface area of the (B1) high dielectric constant inorganic filler becomes small; Unintended acceleration of the curing reaction of the thermosetting resin (A) by the solid surface of the material tends to be suppressed. Moreover, when the average particle diameter (D ₅₀ ) of the high dielectric constant inorganic filler (B1) is less than or equal to the above upper limit, the homogeneity of the cured product of the resin composition tends to be better.
(B1) The average particle diameter (D ₅₀ ) of the high dielectric constant inorganic filler can be measured by the method described in Examples.

(B1) The shape of the high dielectric constant inorganic filler is not particularly limited, but from the viewpoint of ease of manufacture, it is preferably non-spherical. Note that "non-spherical" in this embodiment means a shape other than "spherical" which will be described later.
From the viewpoint of ease of manufacture, the non-spherical shape is preferably an irregular shape having a plurality of corners. Examples of the irregular shape having multiple corners include a crushed shape formed by crushing.

The mass-based content of the high dielectric constant inorganic filler (B1) in the resin composition of the present embodiment is not particularly limited, but is preferably 20 to 95% by mass, based on the total solid content of the resin composition. More preferably 40 to 90% by weight, still more preferably 60 to 80% by weight.
The volume-based content of the high dielectric constant inorganic filler (B1) in the resin composition of the present embodiment is not particularly limited, but is preferably 10 to 70% by volume, based on the total solid content of the resin composition. More preferably 20 to 60% by volume, still more preferably 30 to 50% by volume.
(B1) When the content of the high dielectric constant inorganic filler is at least the above lower limit, the relative dielectric constant (Dk) of the resin composition tends to be more easily increased. Moreover, when the content of (B1) high dielectric constant inorganic filler is below the above upper limit, fluidity tends to be better.

<(B2) Spherical inorganic filler>
The resin composition of this embodiment contains (B2) a spherical inorganic filler.
(B2) The spherical inorganic filler is an inorganic filler that contributes to improving the fluidity of the resin composition of this embodiment. (B2) The details of the reason why the fluidity of the resin composition of this embodiment is improved by containing the spherical inorganic filler are not clear, but (B2) is present near the high dielectric constant inorganic filler (B1). ) It is presumed that one reason is that the presence of the spherical inorganic filler suppresses (B1) collisions between the high dielectric constant inorganic fillers or the occurrence of friction due to collisions.
(B2) The spherical inorganic fillers may be used alone or in combination of two or more.
In addition, in this specification, the "spherical shape" of (B2) spherical inorganic filler is a concept that includes true spheres and elliptical spheres, but the aspect ratio (major axis diameter/minor axis diameter) is 1.2 or more. A certain elliptical sphere is not classified as "spherical".
The shape and aspect ratio of the inorganic filler can be confirmed by observing the inorganic filler using, for example, a scanning electron microscope.

(B2) Examples of the material of the spherical inorganic filler include silica, alumina, mica, beryllia, aluminum carbonate, magnesium hydroxide, aluminum hydroxide, aluminum silicate, calcium carbonate, calcium silicate, magnesium silicate, and silicon nitride. , boron nitride, clay, talc, aluminum borate, silicon carbide, and the like. Among these, silica is preferred.

(B2) The spherical inorganic filler may be surface-treated with a coupling agent or the like in order to improve the fluidity of the resin composition. As the coupling agent, those mentioned below as (F) coupling agent can be used.

(B2) The average particle diameter (D ₅₀ ) of the spherical inorganic filler is not particularly limited, but from the viewpoint of improving the fluidity of the resin composition, it is preferably 10 to 1,500 nm, more preferably 20 to 1,500 nm. The wavelength is 1,000 nm, more preferably 30 to 800 nm.
(B2) The average particle diameter (D ₅₀ ) of the spherical inorganic filler can be measured by the method described in Examples.

(B2) The dielectric constant (Dk) of the spherical inorganic filler at 10 GHz is not particularly limited, but from the viewpoint of availability, it is preferably less than 10, more preferably 1 to 8, and even more preferably 2 to 5. It is.
(B2) The dielectric constant (Dk) of the spherical inorganic filler at 10 GHz can be measured by the method described in Examples.

The mass-based content of the (B2) spherical inorganic filler in the resin composition of the present embodiment is not particularly limited, but is preferably 0.1 to 20% by mass, based on the total solid content of the resin composition. More preferably 0.3 to 10% by weight, still more preferably 0.5 to 5% by weight.
The volume-based content of the (B2) spherical inorganic filler in the resin composition of the present embodiment is not particularly limited, but is preferably 0.1 to 20% by volume, based on the total solid content of the resin composition. More preferably 0.3 to 10% by volume, still more preferably 0.5 to 5% by volume.
(B2) When the content of the spherical inorganic filler is at least the above lower limit, the resin composition of this embodiment tends to have better fluidity. Moreover, when the content of the spherical inorganic filler (B2) is below the above upper limit value, it tends to be easier to maintain a high dielectric constant (Dk).

Ratio of the volume-based content of (B1) high dielectric constant inorganic filler to the volume-based content of (B2) spherical inorganic filler in the resin composition of the present embodiment [(B1)/(B2)] is not particularly limited, but is preferably 2 to 500, more preferably 5 to 100, even more preferably 10 to 50.
When the volume-based content ratio [(B1)/(B2)] is within the above range, the resin composition of this embodiment tends to have better fluidity.

The total mass-based content of (B1) the high dielectric constant inorganic filler and (B2) the spherical inorganic filler in the resin composition of the present embodiment is preferably 22 to 22% of the total solid content of the resin composition. The content is 97% by weight, more preferably 42-92% by weight, even more preferably 62-82% by weight.
The total volume-based content of (B1) high dielectric constant inorganic filler and (B2) spherical inorganic filler in the resin composition of the present embodiment is preferably 10 to 10% based on the total solid content of the resin composition. It is 70% by volume, more preferably 20-60% by volume, even more preferably 30-50% by volume.
Although the ratio of the total content of (B1) high dielectric constant inorganic filler and (B2) spherical inorganic filler to the total amount of (B) inorganic filler contained in the resin composition of this embodiment is not particularly limited. , preferably 80 to 100% by weight, more preferably 90 to 100% by weight, even more preferably 95 to 100% by weight.

<(C) Curing agent>
It is preferable that the resin composition of this embodiment further contains (C) a curing agent.
The resin composition of this embodiment tends to have more improved curability by containing the curing agent (C).
(C) The curing agent may be used alone or in combination of two or more.

(C) The curing agent includes, for example, a phenolic curing agent, an amine curing agent, an acid anhydride curing agent, etc., and is preferably selected as appropriate depending on the type of (A) thermosetting resin. .

When the resin composition of this embodiment contains a maleimide resin as (A) a thermosetting resin, the resin composition of this embodiment may contain an amine curing agent as (C) a curing agent. is preferred.
As the amine curing agent, diamine compounds are preferably mentioned.
Examples of diamine compounds include 4,4'-diaminodiphenylmethane, 3,3'-dimethyl-4,4'-diaminodiphenylmethane, 3,3'-diethyl-4,4'-diaminodiphenylmethane, and 4,4'-diaminodiphenylmethane. Diaminodiphenyl ether, 4,4'-diaminodiphenylsulfone, 3,3'-diaminodiphenylsulfone, 4,4'-diaminodiphenyl ketone, 4,4'-diaminobiphenyl, 3,3'-dimethyl-4,4'- Diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dihydroxybenzidine, 2,2-bis(3-amino-4-hydroxyphenyl)propane, 3,3'-dimethyl- 5,5'-diethyl-4,4'-diaminodiphenylmethane, 2,2-bis(4-aminophenyl)propane, 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 1,3- Bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4'-bis(4-aminophenoxy)biphenyl, 1 ,3-bis[1-[4-(4-aminophenoxy)phenyl]-1-methylethyl]benzene, 1,4-bis[1-[4-(4-aminophenoxy)phenyl]-1-methylethyl ]Benzene, 4,4'-[1,3-phenylenebis(1-methylethylidene)]bisaniline, 4,4'-[1,4-phenylenebis(1-methylethylidene)]bisaniline, 3,3'- [1,3-phenylenebis(1-methylethylidene)]bisaniline, bis[4-(4-aminophenoxy)phenyl]sulfone, bis[4-(3-aminophenoxy)phenyl]sulfone, 9,9-bis( Examples include aromatic diamine compounds such as 4-aminophenyl)fluorene; and silicone compounds having two primary amino groups.
In this specification, the term "aromatic diamine compound" means a compound having two amino groups directly bonded to an aromatic ring.
Among these, 4,4'-[1,3-phenylenebis(1-methylethylidene)]bisaniline is preferred.

When the resin composition of the present embodiment contains (C) a curing agent, the content thereof is preferably 2 to 40 parts by mass, more preferably 5 to 40 parts by mass, based on 100 parts by mass of (A) thermosetting resin. The amount is 30 parts by weight, more preferably 10 to 20 parts by weight.
(C) When the content of the curing agent is within the above range, the curability of the resin composition tends to be better.

<(D) Curing accelerator>
The resin composition of the present embodiment preferably further contains (D) a curing accelerator from the viewpoint of accelerating the curing reaction of the resin composition.
(D) The curing accelerator may be used alone or in combination of two or more.

(D) Curing accelerators include, for example, acidic catalysts such as p-toluenesulfonic acid; amine compounds such as triethylamine, pyridine, tributylamine, and dicyandiamide; Imidazole compounds; Isocyanate mask imidazole compounds such as addition reaction products of hexamethylene diisocyanate resin and 2-ethyl-4-methylimidazole; Tertiary amine compounds; Quaternary ammonium compounds; Phosphorus compounds such as triphenylphosphine; Dicumyl Peroxide, 2,5-dimethyl-2,5-bis(t-butylperoxy)hexane-3,2,5-dimethyl-2,5-bis(t-butylperoxy)hexane, t-butylperoxy Organic peroxides such as isopropyl monocarbonate and α,α'-bis(t-butylperoxy)diisopropylbenzene; carboxylic acid salts of manganese, cobalt, zinc, etc., and the like. Among these, isocyanate mask imidazole compounds are preferred from the viewpoint of curing accelerating effect and storage stability.

When the resin composition of the present embodiment contains (D) a curing accelerator, the content is preferably 0.1 to 10 parts by mass, more preferably 0.1 to 10 parts by mass, based on 100 parts by mass of (A) thermosetting resin. is 0.5 to 7 parts by weight, more preferably 1 to 5 parts by weight.
(D) When the content of the curing accelerator is at least the above lower limit, a sufficient curing accelerating effect tends to be easily obtained. Moreover, when the content of the curing accelerator (D) is below the above upper limit, storage stability tends to be better.

<(E) Flame retardant>
It is preferable that the resin composition of this embodiment further contains (E) a flame retardant.
The flame retardance of the resin composition of this embodiment tends to be further improved by containing the flame retardant (E).
(E) Flame retardants may be used alone or in combination of two or more.

(E) Examples of the flame retardant include phosphorus flame retardants, metal hydrates, halogen flame retardants, and the like.
The phosphorus flame retardant may be an inorganic phosphorus flame retardant or an organic phosphorus flame retardant.
Examples of inorganic phosphorus flame retardants include red phosphorus; ammonium phosphates such as monoammonium phosphate, diammonium phosphate, triammonium phosphate, and ammonium polyphosphate; inorganic nitrogen-containing phosphorus compounds such as phosphoric acid amide; ; phosphoric acid; phosphine oxide and the like.
Examples of organic phosphorus flame retardants include aromatic phosphate ester compounds, monosubstituted phosphonic acid diester compounds, 2-substituted phosphinic ester compounds, metal salts of 2-substituted phosphinic acids, organic nitrogen-containing phosphorus compounds, and cyclic organic phosphoric acid ester compounds. Examples include phosphorus compounds. Among these, aromatic phosphoric acid ester compounds and metal salts of disubstituted phosphinic acids are preferred.
Examples of the metal hydrate include aluminum hydroxide hydrate, magnesium hydroxide hydrate, and the like.
Examples of the halogen flame retardant include chlorine flame retardants, bromine flame retardants, and the like.

When the resin composition of this embodiment contains (E) a flame retardant, the content of the (E) flame retardant is not particularly limited, but the total amount of the resin components in the resin composition of this embodiment is 100 parts by mass. On the other hand, it is preferably 20 to 70 parts by weight, more preferably 30 to 60 parts by weight, and even more preferably 40 to 50 parts by weight.
(E) When the content of the flame retardant is at least the above lower limit, the flame retardance tends to be better. Moreover, when the content of the flame retardant (E) is below the above upper limit, the dielectric properties, moldability, and conductor adhesiveness tend to be better.

<(F) Coupling agent>
It is preferable that the resin composition of this embodiment further contains (F) a coupling agent.
The resin composition of this embodiment tends to have improved fluidity by containing the coupling agent (F).
(F) The coupling agent may be used alone or in combination of two or more.

(F) Examples of the coupling agent include silane coupling agents, titanate coupling agents, etc. Among these, silane coupling agents are preferred.
Examples of the silane coupling agent include epoxysilane coupling agents, aminosilane coupling agents, phenylsilane coupling agents, alkylsilane coupling agents, alkenylsilane coupling agents, alkynylsilane coupling agents, Haloalkylsilane coupling agent, (meth)acrylic silane coupling agent, isocyanurate silane coupling agent, ureidosilane coupling agent, mercaptosilane coupling agent, sulfide silane coupling agent, isocyanate silane cup Examples include ring agents, silazane coupling agents, and the like. Among these, alkenylsilane coupling agents are preferred. As the alkenylsilane coupling agent, a vinylsilane coupling agent is preferable.

When the resin composition of the present embodiment contains (F) a coupling agent, the content of the coupling agent (F) is not particularly limited, but the total solid content (100% by mass) of the resin composition of the present embodiment is ), preferably 0.1 to 7 parts by weight, more preferably 0.5 to 5 parts by weight, and even more preferably 1 to 3 parts by weight.
(F) When the content of the coupling agent is within the above range, the resin composition tends to have better fluidity.

<Other ingredients>
In addition to the above-mentioned components, the resin composition of the present embodiment may or may not contain other components as necessary.
Examples of other components include resins other than the thermosetting resin (A), organic solvents, and other additives.
Each of these may be used alone or in combination of two or more.

(A) Examples of resins other than thermosetting resins include thermoplastic resins.
Examples of thermoplastic resins include polyphenylene ether resin; styrene thermoplastic elastomer, olefin thermoplastic elastomer, urethane thermoplastic elastomer, polyester thermoplastic elastomer, polyamide thermoplastic elastomer, acrylic thermoplastic elastomer, and silicone. Examples include thermoplastic elastomers such as thermoplastic elastomers and derivatives thereof.

Examples of organic solvents include acetone, methyl ethyl ketone, toluene, xylene, cyclohexanone, 4-methyl-2-pentanone, ethyl acetate, ethylene glycol monoethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, and tripropylene glycol. Examples include monomethyl ether, N,N-dimethylformamide, and N,N-dimethylacetamide.

Other additives include, for example, ultraviolet absorbers such as benzotriazole type; antioxidants such as hindered phenol type antioxidants and styrenated phenol type antioxidants; Examples include polymerization initiators; fluorescent brighteners such as stilbene derivatives; adhesion improvers such as urea compounds and silane coupling agents; crosslinking agents such as cyanamide crosslinking agents.

The content of other components is not particularly limited, and may be used as necessary within a range that does not impede the effects of this embodiment.

<Method for manufacturing resin composition>
The resin composition of this embodiment can be manufactured by mixing the above components.
When mixing each component, each component may be dissolved or dispersed while stirring. Further, conditions such as the order of mixing the raw materials, mixing temperature, and mixing time are not particularly limited, and may be arbitrarily set depending on the types of raw materials and the like.

<Specific dielectric constant (Dk) of cured product>
The dielectric constant (Dk) at 10 GHz of the cured product of the resin composition of this embodiment is not particularly limited, but is preferably 5 to 40, more preferably 7 to 20, and even more preferably 10 to 15.
When the dielectric constant (Dk) of the cured product at 10 GHz is equal to or greater than the above lower limit, it tends to be easier to downsize the antenna module. Further, when the dielectric constant (Dk) of the cured product at 10 GHz is less than or equal to the above upper limit value, it tends to be easy to maintain a good balance with other physical properties.
The dielectric constant (Dk) at 10 GHz of the cured product of the resin composition of this embodiment can be measured by the method described in Examples.

<Applications of resin composition>
The resin composition of this embodiment is a resin composition with excellent fluidity while having a high dielectric constant (Dk), and therefore is suitable as a resin composition for an antenna module.

[Prepreg]
The prepreg of this embodiment is a prepreg containing the resin composition of this embodiment or a semi-cured product of the resin composition.
The prepreg of this embodiment is suitable as a prepreg for an antenna module.

The prepreg of this embodiment contains, for example, the resin composition of this embodiment or a semi-cured product of the resin composition, and a sheet-like fiber base material.

As the sheet-like fiber base material contained in the prepreg of the present embodiment, for example, known sheet-like fiber base materials used in various laminates for electrically insulating materials can be used.
Examples of the material of the sheet-like fiber base material include inorganic fibers such as E glass, D glass, S glass, and Q glass; organic fibers such as polyimide, polyester, and tetrafluoroethylene; and mixtures thereof. These sheet-like fiber base materials have shapes such as woven fabrics, nonwoven fabrics, raw binders, chopped strand mats, and surfacing mats.

The prepreg of this embodiment can be produced, for example, by impregnating or applying the resin composition of this embodiment onto a sheet-like fiber base material, and then heating and drying it to B-stage it.
The heating drying temperature and time are not particularly limited, but from the viewpoint of productivity and appropriately B-staging the resin composition of this embodiment, it may be, for example, 50 to 200 ° C. for 1 to 30 minutes. can.

The solid content concentration derived from the resin composition in the prepreg of this embodiment is not particularly limited, but from the viewpoint of easily obtaining better moldability when formed into a laminate, it is preferably 20 to 90% by mass, More preferably 25 to 80% by weight, still more preferably 30 to 75% by weight.

[Resin film]
The resin film of this embodiment is a resin film containing the resin composition of this embodiment or a semi-cured product of the resin composition.
The resin film of this embodiment is suitable as a resin film for an antenna module.

The resin film of this embodiment can be produced, for example, by applying the resin composition of this embodiment containing an organic solvent, that is, a resin varnish, to a support and then drying it by heating.
Examples of the support include a plastic film, metal foil, and release paper.
The temperature and time of heat drying are not particularly limited, but from the viewpoint of productivity and appropriately B-staging the resin composition of the present embodiment, it can be set to 50 to 200° C. for 1 to 30 minutes.

The resin film of this embodiment is preferably used to form an insulating layer when manufacturing a printed wiring board.

[Laminated board]
The laminate of this embodiment is a laminate that includes a cured product of the resin composition of this embodiment or a cured product of prepreg of this embodiment, and metal foil.
The laminate of this embodiment is suitable as a laminate for an antenna module.
Note that a laminate having metal foil is sometimes referred to as a metal-clad laminate.

The metal of the metal foil is not particularly limited, and examples include copper, gold, silver, nickel, platinum, molybdenum, ruthenium, aluminum, tungsten, iron, titanium, chromium, alloys containing one or more of these metal elements, etc. can be mentioned.

The laminate of this embodiment can be manufactured, for example, by arranging metal foil on one or both sides of the prepreg of this embodiment and then heat-pressing the prepreg.
Usually, the B-staged prepreg is cured by this heating and pressure molding to obtain the laminate of this embodiment.
When hot-pressing molding, only one sheet of prepreg may be used, or two or more sheets of prepreg may be laminated.
For heating and pressure molding, for example, a multistage press, a multistage vacuum press, a continuous molding machine, an autoclave molding machine, etc. can be used.
The conditions for heating and pressure molding are not particularly limited, but may be, for example, a temperature of 100 to 300°C, a time of 10 to 300 minutes, and a pressure of 1.5 to 5 MPa.

[Printed wiring board]
The printed wiring board of the present embodiment includes one or more selected from the group consisting of a cured product of the resin composition of the present embodiment, a cured product of the prepreg of the present embodiment, and a laminate of the present embodiment. It is a board.
The printed wiring board of this embodiment is suitable as a printed wiring board for an antenna module.

The printed wiring board of this embodiment can be produced by, for example, using a known method for one or more selected from the group consisting of the cured prepreg of this embodiment, the cured resin film of this embodiment, and a laminate. , it can be manufactured by forming a conductor circuit. Moreover, a multilayer printed wiring board can also be manufactured by further performing multilayer adhesive processing as necessary. The conductor circuit can be formed by, for example, appropriately performing drilling, metal plating, etching of metal foil, and the like.

[Antenna device]
The antenna device of this embodiment is an antenna device having the printed wiring board of this embodiment.
The antenna device of this embodiment can be manufactured, for example, by mounting an antenna element on the printed wiring board of this embodiment.
Although there is no particular restriction on the method of installing the antenna elements, it is preferable to arrange them in a two-dimensional array, for example. The configuration of the antenna device is not particularly limited, and for example, Japanese Patent No. 6777273 can be referred to.

[Antenna module]
The antenna module of this embodiment is an antenna module that includes the antenna device of this embodiment and a power feeding circuit.
The antenna module of this embodiment can be manufactured, for example, by a method that includes installing a power feeding circuit and the antenna device of this embodiment.
The power supply circuit is not particularly limited, but an RFIC (Radio Frequency Integrated Circuit) or the like can be used. The RFIC includes a switch, a power amplifier, a low-noise amplifier, an attenuator, a phase shifter, a signal combiner/brancher, a mixer, an amplifier circuit, and the like.
The high frequency signal supplied from the RFIC is transmitted to the power feeding point of the power feeding conductor via a shorting conductor formed in a via of the antenna module laminate.
The configuration of the antenna module is not particularly limited, and for example, Japanese Patent No. 6777273 can be referred to.

Hereinafter, this embodiment will be specifically described with reference to Examples. However, this embodiment is not limited to the following examples.

(Method for measuring number average molecular weight (Mn))
The number average molecular weight (Mn) was calculated by gel permeation chromatography (GPC) from a calibration curve using standard polystyrene. The calibration curve is based on standard polystyrene: TSK standard POLYSTYRENE (Type; A-2500, A-5000, F-1, F-2, F-4, F-10, F-20, F-40) [manufactured by Tosoh Corporation, Product name] was approximated by a cubic equation. GPC measurement conditions are shown below.
[GPC measurement conditions]
Equipment: High-speed GPC equipment HLC-8320GPC
Detector: Ultraviolet absorption detector UV-8320 [manufactured by Tosoh Corporation]
Column: Guard column; TSK Guardcolumn SuperHZ-L+ column; TSKgel SuperHZM-N+TSKgel SuperHZM-M+TSKgel SuperH-RC (all manufactured by Tosoh Corporation, product names)
Column size: 4.6 x 20 mm (guard column), 4.6 x 150 mm (column), 6.0 x 150 mm (reference column)
Eluent: Tetrahydrofuran Sample concentration: 10mg/5mL
Injection volume: 25μL
Flow rate: 1.00mL/min Measurement temperature: 40℃

(Method for measuring average particle diameter (D ₅₀ ) of inorganic filler)
The average particle diameter (D ₅₀ ) of the inorganic filler is determined by diluting 0.1 g of the inorganic filler to be measured with 20 g of a solvent (type: methyl ethyl ketone) and then vibrating it for 5 to 20 minutes with a 100 W ultrasonic homogenizer. The dispersed material was used as a measurement sample.
Inject 1 to 2 drops of the above measurement sample into the measurement cell, and use a particle size distribution measuring device (manufactured by Microtrac Bell Co., Ltd., product name: Microtrac MT3000) to measure the temperature at 25°C in accordance with the international standard ISO13321. The particle size distribution was measured at a refractive index of 1.38. The particle diameter corresponding to an integrated value of 50% (volume basis) in the obtained particle diameter distribution was defined as the average particle diameter (D ₅₀ ).

(Method for measuring relative dielectric constant (Dk) of inorganic filler at 10 GHz)
The dielectric constant (Dk) of the inorganic filler at 10 GHz was measured using the following procedure.
The inorganic filler and polyphenylene ether resin to be measured were mixed in a ratio of 20% by volume of the inorganic filler and 80% by volume of the polyphenylene ether resin. The obtained mixture was press-molded under the conditions of 230° C., 30 minutes, and 3 MPa to form a test piece of dielectric constant (Dk) into a size of 50 mm width x 130 mm length x 0.5 mm thickness.
Next, using the test piece obtained above, the dielectric constant (Dk) was measured by the cavity resonator perturbation method under the conditions of a frequency of 10 GHz and 25° C. using the following apparatus and program.
・Measuring instrument: Vector network analyzer “N5227A” manufactured by Agilent Technologies
・Cavity resonator: "CP129" (10GHz band resonator) manufactured by Kanto Electronics Applied Development Co., Ltd.
・Measurement program: “CPMA-V2” manufactured by Kanto Denshi Applied Development Co., Ltd.
The dielectric constant (Dk) of the test piece measured above is Dk1, and the dielectric constant (Dk) of the polyphenylene ether resin alone measured in advance under the above measurement conditions is Dk2. Based on the following formula, the inorganic filler alone is The relative dielectric constant (Dk) was determined.
Relative permittivity (Dk) = (Dk1-Dk2×0.8)/0.2

[Manufacture of resin composition]
Examples 1 to 3, Comparative Examples 1 to 3
The components listed in Table 1 are blended according to the composition listed in Table 1, and stirred and mixed together with toluene as necessary at room temperature (25°C) to produce a resin composition with a solid content concentration of 70% by mass. did. Note that the unit of the numerical value described in the formulation in Table 1 is parts by mass, and in the case of a solution, it means parts by mass in terms of solid content.

[Manufacture of resin plate with double-sided copper foil]
The resin composition obtained above was applied to a PET film (manufactured by Teijin Ltd., product name: G2-38) with a thickness of 38 μm, and then heated and dried at 170°C for 5 minutes to form a B-stage resin. A film was produced. After the resin film was peeled from the PET film, it was pulverized to obtain a B-stage resin powder.
The resin powder obtained above was poured into a Teflon (registered trademark) sheet cut into a size of 0.5 mm thick x 50 mm long x 35 mm wide, and 18 μm thick low profile copper foil (Mitsui Kinzoku) was placed above and below it. (manufactured by Mining Co., Ltd., trade name: 3EC-VLP-18) was placed. Note that the low profile copper foil was placed with the M side facing the resin powder side. Subsequently, this laminate before heat and pressure molding is heat and pressure molded under the conditions of temperature 230°C, pressure 2.0 MPa, and time 120 minutes, and by curing the resin powder while molding it into a resin plate, both sides of the laminate are cured. A resin plate with copper foil was produced. The thickness of the resin plate portion of the obtained resin plate with copper foil on both sides was 0.5 mm.

[Measurement and evaluation method]
Using the resin compositions and double-sided copper foil-covered resin plates obtained in the above Examples and Comparative Examples, various measurements and evaluations were performed according to the following methods. The results are shown in Table 1.

(1. Measurement of relative dielectric constant (Dk))
After removing the outer layer copper foil of the resin plate with double-sided copper foil obtained above by immersing it in a copper etching solution (10% by mass solution of ammonium persulfate, manufactured by Mitsubishi Gas Chemical Co., Ltd.), A piece cut out to a size of 0.5 mm was used as a test piece for dielectric constant (Dk). Using the test piece, the dielectric constant (Dk) was measured by the cavity resonator perturbation method using the following apparatus and program under conditions of a frequency of 10 GHz and 25°C.
・Measuring instrument: Vector network analyzer “N5227A” manufactured by Agilent Technologies
・Cavity resonator: "CP129" (10GHz band resonator) manufactured by Kanto Electronics Applied Development Co., Ltd.
・Measurement program: “CPMA-V2” manufactured by Kanto Denshi Applied Development Co., Ltd.

(2. Evaluation of melt viscosity)
Approximately 0.6 g of the resin powder obtained by the method described in [Manufacture of resin plate with double-sided copper foil] was weighed and molded into a disc-shaped tablet with a diameter of 20 mm using a tablet molding machine. Next, using this tablet as a measurement sample, a rheometer (manufactured by Rheometric Co., Ltd., product name: ARES-2K STD-FCO-STD) was used at a heating rate of 3°C/min, a load of 0.2N, and a measurement temperature range of 50°C. The viscosity was measured at a temperature of ~200°C, and the lowest melt viscosity was defined as the melt viscosity.

The details of each component shown in Table 1 are as follows.
[(A) Component]
・Maleimide resin: Aromatic bismaleimide resin with an indane skeleton

[(B1) component]
- Calcium titanate: manufactured by Kyoritsu Materials Co., Ltd., product name "CT-3", average particle diameter (D ₅₀ ): 2 μm, relative dielectric constant (Dk) at 10 GHz: 175

[(B2) component]
- Spherical silica 1: Fused spherical silica surface-treated with aminosilane coupling agent, manufactured by Admatex Co., Ltd., trade name "SO-C2", average particle diameter (D ₅₀ ) 500 nm, dispersion medium: methyl isobutyl ketone, solid content concentration 70% by mass, relative dielectric constant at 10GHz: 3.8
- Spherical silica 2: Synthetic spherical silica surface-treated with an aminosilane coupling agent, manufactured by Admatex Co., Ltd., product name "YA050C", average particle diameter (D ₅₀ ) 50 nm, dispersion medium: methyl isobutyl ketone, solid content concentration 50 mass %, relative dielectric constant at 10GHz: 3.8

[(C) Component]
・Diamine compound: 4,4'-[1,3-phenylenebis(1-methylethylidene)]bisaniline

[(D) Component]
・Curing accelerator: Isocyanate mask imidazole, manufactured by Daiichi Kogyo Seiyaku Co., Ltd., product name "G-8009L"

[(E) component]
・Flame retardant: 4,4'-biphenylene-tetrakis(2,6-dimethylphenyl) phosphate ester

[(F) component]
・Coupling agent: Vinyltrimethoxysilane

Table 1 shows that the resin compositions of Examples 1 to 3 of the present embodiment have sufficiently high dielectric constants (Dk), low melt viscosity, and excellent fluidity.
On the other hand, the resin composition of Comparative Example 1 in which component (B2) was not blended had high melt viscosity and poor fluidity. Further, the resin compositions of Comparative Examples 2 and 3 in which the component (B1) was not blended had low dielectric constants (Dk).

Claims (15)

A resin composition containing (A) a thermosetting resin and (B) an inorganic filler,
A resin composition, wherein the (B) inorganic filler contains (B1) a high dielectric constant inorganic filler and (B2) a spherical inorganic filler. The resin composition according to claim 1, wherein the thermosetting resin (A) is one or more selected from the group consisting of maleimide compounds having one or more N-substituted maleimide groups and derivatives thereof. The resin composition according to claim 1 or 2, wherein the high dielectric constant inorganic filler (B1) is a titanium-based inorganic filler. The resin composition according to claim 1 or 2, wherein the high dielectric constant inorganic filler (B1) has an average particle diameter (D ₅₀ ) of 0.1 to 20 μm. The resin according to claim 1 or 2, wherein the content of the high dielectric constant inorganic filler (B1) in the resin composition is 10 to 70% by volume based on the total solid content of the resin composition. Composition. The resin composition according to claim 1 or 2, wherein the (B2) spherical inorganic filler is silica. The resin composition according to claim 1 or 2, wherein the (B2) spherical inorganic filler has an average particle diameter (D ₅₀ ) of 10 to 1,500 nm. The resin according to claim 1 or 2, wherein the content of the (B2) spherical inorganic filler in the resin composition is 0.1 to 20% by volume based on the total solid content of the resin composition. Composition. The resin composition according to claim 1 or 2, which is used for an antenna module. A prepreg containing the resin composition according to claim 1 or 2 or a semi-cured product of the resin composition. A laminate comprising a cured product of the resin composition according to claim 1 or 2 and a metal foil. A resin film containing the resin composition according to claim 1 or 2 or a semi-cured product of the resin composition. A printed wiring board comprising a cured product of the resin composition according to claim 1 or 2. An antenna device comprising the printed wiring board according to claim 13. An antenna module comprising the antenna device according to claim 14 and a power feeding circuit.