JP2023163783A - Control apparatus, three-dimensional molding device, three-dimensional molding method, and temperature control device - Google Patents

Abstract

To provide a control apparatus capable of suppressing a molding material at a temperature detection position from solidifying in an amorphous state.SOLUTION: A control apparatus controls a three-dimensional molding device including: a stage; a discharge part that discharges a molding material containing crystalline resin material onto the stage; a moving part that moves the stage and the discharge part relative to each other; a heating part that heats a target area containing the molding material discharged by the discharge part; and a temperature detection part that detects at least a temperature at a predetermined temperature detection position among the positions within the target area, and includes a control part that performs molding control that causes the three-dimensional molding device to mold a three-dimensional molded object by laminating the molding material on the stage. The molding control includes first temperature control that controls the heating part based on a detected temperature detected by the temperature detection part as the temperature of the molding material at the temperature detection position. The first temperature control is a control that reduces a cooling rate of the molding material at the temperature detection position.SELECTED DRAWING: Figure 5

Description

The present invention relates to a control device, a three-dimensional printing device, a three-dimensional printing method, and a temperature control device.

2. Description of the Related Art Research and development are being conducted on three-dimensional modeling devices that create three-dimensional objects by laminating modeling materials that are at least partially molten.

In this regard, a three-dimensional modeling apparatus is known that builds a three-dimensional object by laminating modeling materials containing a crystalline resin material such as polyester (see Patent Document 1).

Special table 2016-532579 publication

Here, the amorphous resin material crystallizes as the temperature decreases. However, if the cooling rate of the amorphous resin material is too fast, the amorphous resin material may solidify in an amorphous state. For this reason, the three-dimensional modeling apparatus described in Patent Document 1 sometimes solidifies the stacked modeling materials in an amorphous state. This is not desirable because it leads to a decrease in the interlayer strength of the laminated building material, a decrease in the mechanical properties of the building material, and the like.

In order to solve the above problems, one aspect of the present invention provides a stage, a discharge section that discharges a modeling material containing a crystalline resin material onto the stage, and a movement that relatively moves the stage and the discharge section. a heating unit that heats a target area containing the modeling material discharged by the discharge unit; and a temperature detection unit that detects at least a temperature at a predetermined temperature detection position among positions within the target area. a control unit that controls a three-dimensional printing apparatus comprising: a controller that controls a three-dimensional printing apparatus to stack the building materials on the stage and cause the three-dimensional printing apparatus to print a three-dimensional object; The first temperature control includes a first temperature control for controlling the heating unit based on a detected temperature detected by the temperature detection unit as the temperature of the modeling material at the temperature detection position, and the first temperature control includes This is a control device that controls to reduce the cooling rate of.

Further, one aspect of the present invention includes a stage, a discharge section that discharges a modeling material containing a crystalline resin material onto the stage, a moving section that relatively moves the stage and the discharge section, and a a heating unit that heats a target area including the modeling material discharged by the unit; a temperature detection unit that detects at least a temperature at a predetermined temperature detection position among positions within the target area; , a control device that controls the moving unit and the heating unit and performs modeling control to stack the modeling material on the stage to form a three-dimensional object, and the modeling control is performed by controlling the temperature. The first temperature control includes a first temperature control for controlling the heating unit based on a detected temperature detected by the temperature detection unit as the temperature of the modeling material at the temperature detection position, and the first temperature control includes This is a three-dimensional printing device that is controlled to reduce the cooling rate of the three-dimensional printer.

Further, one aspect of the present invention includes a stage, a discharge section that discharges a modeling material containing a crystalline resin material onto the stage, a moving section that relatively moves the stage and the discharge section, and a a heating section that heats a target region containing the modeling material discharged by the section; and a temperature detection section that detects at least a temperature at a predetermined temperature detection position among the positions in the target region. A three-dimensional printing method that controls a device, and performs printing control in which the three-dimensional printing device builds a three-dimensional object by stacking the building materials on the stage, the building control including controlling the temperature detection position. includes first temperature control for controlling the heating section based on a detected temperature detected by the temperature detection section as the temperature of the modeling material at the temperature detection position, and the first temperature control includes cooling of the modeling material at the temperature detection position. This is a three-dimensional printing method that controls speed.

1 is a diagram showing an example of the configuration of a three-dimensional modeling apparatus 1. FIG. It is a figure which shows an example of the modeling material X laminated|stacked on the modeling surface 21 as a three-dimensional structure OB. 5 is a diagram showing an example of a change in the temperature of the modeling material X at each of five positions P1 to P5 in the process of the three-dimensional modeling apparatus 1 modeling the three-dimensional object OB through modeling control. FIG. 6 is a diagram showing an example of a hardware configuration of a control device 60. FIG. 6 is a diagram showing an example of a functional configuration of a control device 60. FIG. It is a figure which shows an example of the flow of the process in which the control apparatus 60 performs modeling control. 6 is a diagram illustrating an example of the flow of processing in which the control device 60 performs first temperature control. FIG. It is a figure which shows an example of the flow of the process of annealing a three-dimensional structure.

<Embodiment>
Embodiments of the present invention will be described below with reference to the drawings.

<Overview of 3D printing equipment>
First, an overview of the three-dimensional printing apparatus according to the embodiment will be explained.

The three-dimensional modeling apparatus according to the embodiment includes a stage, a discharge section, a moving section, a heating section, a temperature detection section, and a control device. The discharge unit discharges the modeling material containing the crystalline resin material onto the stage. The moving section relatively moves the stage and the discharge section. The heating section heats the target area containing the modeling material discharged by the discharge section. The temperature detection unit detects at least the temperature at a predetermined temperature detection position among the positions within the target area. The control device controls the discharge section, the moving section, and the heating section, and performs modeling control to form a three-dimensional object by stacking the modeling materials on the stage. The modeling control includes first temperature control that controls the heating unit based on the detected temperature detected by the temperature detection unit as the temperature of the modeling material at the temperature detection position. The first temperature control is a control that reduces the cooling rate of the modeling material at the temperature detection position. Thereby, the three-dimensional modeling apparatus can suppress the modeling material at the temperature detection position from solidifying in an amorphous state.

Below, the configuration of the three-dimensional printing apparatus according to the embodiment, the configuration of the control device included in the three-dimensional printing apparatus, and the processing performed by the control device will be described in detail.

<Configuration of three-dimensional printing device>
Hereinafter, the configuration of the three-dimensional printing apparatus according to the embodiment will be described using the three-dimensional printing apparatus 1 as an example.

FIG. 1 is a diagram showing an example of the configuration of a three-dimensional printing apparatus 1. As shown in FIG.

Here, the three-dimensional coordinate system TC is a three-dimensional orthogonal coordinate system that indicates the direction in the drawing in which the three-dimensional coordinate system TC is drawn. In the following, for convenience of explanation, the X-axis in the three-dimensional coordinate system TC will be simply referred to as the X-axis. Furthermore, for convenience of explanation, the Y-axis in the three-dimensional coordinate system TC will be simply referred to as the Y-axis. Further, for convenience of explanation, the Z axis in the three-dimensional coordinate system TC will be simply referred to as the Z axis in the following description. Further, below, as an example, a case will be described in which the negative direction of the Z axis coincides with the direction of gravity. Therefore, in the following description, for convenience of explanation, the positive direction of the Z-axis will be referred to as an upward direction or simply "up", and the negative direction of the Z-axis will be referred to as a downward direction or simply "down".

The three-dimensional modeling apparatus 1 includes a discharge section 10 having a nozzle Nz, a stage 20 having a modeling surface 21 on which a three-dimensional object is modeled, a moving section 30, a heating section 40, a temperature detection section 50, and a control section 10. A device 60 and a data generation device 70 are provided. Note that in the three-dimensional modeling apparatus 1, the control device 60 may be configured integrally with the data generation device 70. Furthermore, the three-dimensional modeling apparatus 1 may be configured without the data generation device 70. In this case, the data generation device 70 is connected to the control device 60 of the three-dimensional modeling device 1 in a communicable manner from the outside. Furthermore, the three-dimensional modeling apparatus 1 may have a configuration that does not include the control device 60 and the data generation device 70. In this case, the control device 60 is connected to the three-dimensional modeling device 1 in a communicable manner from the outside. Furthermore, in this case, the data generation device 70 is connected to the control device 60 so as to be communicable from the outside.

The three-dimensional modeling apparatus 1 changes the relative position of the discharge part 10 and the stage 20 while discharging a modeling material X (not shown) from the discharge part 10 onto the modeling surface 21 of the stage 20 . Thereby, the three-dimensional printing apparatus 1 stacks the N slice layers L to form one three-dimensional structure having a predetermined shape. Here, N may be any integer as long as it is 1 or more. In this case, the first slice layer L counting from the bottom among the N slice layers L is stacked on the modeling surface 21. Further, each of the N slice layers L stacked on the modeling surface 21 is the modeling material X discharged along a modeling path parallel to the modeling surface 21. Further, the modeling path is a scanning path of the nozzle Nz, which moves while discharging the modeling material X, with respect to the stage 20. That is, the three-dimensional modeling apparatus 1 discharges the modeling material Laminated on top of the first slice layer L. Note that n is any integer greater than or equal to 1 and less than or equal to N. Further, each of the N slice layers L may be formed of a single layer or may be formed of a plurality of laminated layers. Here, the modeling path of a certain slice layer L includes an outline, which is the scanning path of the nozzle Nz along the contour of the slice layer L, and an infill, which is the scanning path of the nozzle Nz within the area surrounded by the outline. It is included. That is, a certain slice layer L is constituted by the modeling material X discharged along the outline of the slice layer L and the modeling material X discharged along the infill of the slice layer L.

The three-dimensional printing apparatus 1 performs printing control for printing such a three-dimensional object based on three-dimensional printing data. Here, the three-dimensional printing apparatus 1 generates three-dimensional printing data according to the received operation. The three-dimensional printing data is data for causing the three-dimensional printing apparatus 1 to stack N slice layers L as a three-dimensional structure having a predetermined shape. The three-dimensional modeling apparatus 1 stores shape data indicating the shape. The shape data may be any data as long as it indicates the shape, for example, STL (Stereolithography) data. Based on the received operation and the shape data, the three-dimensional modeling apparatus 1 creates a virtual object having the shape indicated by the shape data, and a virtual support added to the object to support the object. Object data indicating a virtual object including at least a shaped body among the bodies is generated. The shaped object is a portion that is separated from the N slice layers L as one three-dimensional structure among the portions of the N slice layers L that are stacked. Further, the support body is a portion that supports the shaped object among the portions of the N stacked slice layers L.

After generating the object data, the three-dimensional modeling apparatus 1 stores the generated object data. After storing the object data, the three-dimensional modeling apparatus 1 virtually slices the object into N slice layers VL based on the slice condition information. Each of the N slice layers VL in which the object is virtually sliced by the three-dimensional modeling apparatus 1 in this manner corresponds to each of the N slice layers L described above. Therefore, in the following, for convenience of explanation, the n-th slice layer VL among these N slice layers VL is referred to as a slice layer VLn, and the n-th slice layer L among the N slice layers L described above is This will be described as a slice layer Ln. In this case, for example, the first slice layer VL1 corresponds to the first slice layer L1. Here, the slicing condition information is information indicating slicing conditions for virtually slicing the object indicated by the object data stored in the three-dimensional modeling apparatus 1 into N slice layers VL. The slice condition information includes information indicating the number of N slice layers VL, information indicating the thickness of each of the N slice layers VL, and the like as information indicating the slice condition.

After virtually slicing the object, the three-dimensional modeling apparatus 1 generates a modeling pass for the slice layer VL for each of the N sliced layers VL based on the modeling path generation condition information. As described above, the modeling path is the scanning path of the nozzle Nz, which moves while discharging the modeling material X, with respect to the stage 20. Therefore, the modeling material X discharged along the modeling path of the n-th slice layer VLn is the actual slice layer Ln corresponding to the slice layer VLn.

Here, the n-th slice layer VLn is one of the slice layers in which at least one of the shaped body and the support included in the object is sliced. Therefore, the n-th slice layer VLn includes at least one of a sliced portion of the shaped object and a sliced portion of the support. That is, the n-th slice layer VLn includes at least one of a layer in which the shaped object is sliced and a layer in which the support is sliced. The layers into which the shaped object is sliced are classified into two types: a first solid layer and a shaped layer. The first solid layer is a solid layer of the shaped object. The shaped body is composed of a first solid layer and a shaped layer laminated between the first solid layers. That is, the modeled object is modeled by laminating the first solid layer and the model layer. Further, the layers obtained by slicing the support are classified into three types: a second solid layer, a support layer, and a raft layer. The second solid layer refers to the solid layer of the support. The raft layer is a layer that serves as a base on which each of the first solid layer, modeling layer, second solid layer, and support layer is laminated. The support body includes a second solid layer, a support layer laminated between the second solid layers, and a raft layer. That is, the support body is shaped by laminating the second solid layer, the support layer, and the raft layer. For example, when a certain shaped object has an overhang, the overhang part of the part of the shaped object is supported by such a support. From the above, the type of the n-th slice layer VLn is classified according to the layers included in the n-th slice layer VLn. For example, when the n-th slice layer VLn includes only the first solid layer, the type of the n-th slice layer VLn is the first solid layer. Further, for example, when the n-th slice layer VLn includes a first solid layer and a second solid layer, the type of the n-th slice layer VLn is determined from among the layers included in the n-th slice layer VLn. A combination of the type of layer into which the body is sliced and the type of layer into which the support is sliced among the layers included in the n-th support slice layer VLn, that is, a combination of the first solid layer and the second solid layer. Represented by The type of the n-th slice layer VLn is also the type of the n-th slice layer Ln. Therefore, the three-dimensional modeling apparatus 1 can specify the type of the n-th slice layer VLn based on the slice condition information, and can also specify the type of the slice layer Ln.

After generating the modeling passes for each of the N slice layers VL, the three-dimensional printing apparatus 1 generates three-dimensional printing data including printing path information indicating the printing path for each of the N slice layers VL. Here, the modeling pass generation condition information is information indicating modeling pass generation conditions for generating modeling passes for each of the N slice layers VL. The printing path generation condition information includes information indicating the shape of the printing path for each type of each of the N slice layers VL, information indicating the width of the printing path for each type of each of the N slice layers VL, and information indicating the width of the printing path for each type of each of the N slice layers VL. Information such as information indicating the moving speed of the nozzle Nz when discharging the modeling material X along the modeling path for each type of layer VL is included as information indicating the modeling path generation conditions. In addition, the printing path information indicating a certain printing path includes other information such as information indicating the width of the printing path and information indicating the moving speed of the nozzle Nz when discharging the printing material X along the printing path. include.

In the three-dimensional modeling apparatus 1, the slice condition information described above includes (n-1)th slice layer type information indicating the type of the (n-1)th slice layer VLn-1 among the N slice layers VL; Nth slice layer type information indicating the type of the nth slice layer VLn stacked on the n-1th slice layer VLn-1 among the N slice layers VL may be included. It doesn't have to be.

Here, the slice layer L of the raft layer among the N slice layers L is a layer formed between the modeling surface 21 and the other layer as a base of the slice layer L of the other layer, and is a layer formed between the modeling surface 21 and the other layer. This is a layer filled with material X. The other layers are individual slice layers L laminated on the raft layer among the N slice layers L, and specifically, the first solid layer, the modeling layer, the second solid layer, This refers to a slice layer L that is part or all of the support layer. When the other layer is laminated on the modeling surface 21 so as to be in contact with the modeling surface 21, it may become difficult to peel off from the modeling surface 21. Further, in this case, the other layer may not be fixed accurately. Further, in this case, residual stress may remain in the other layer. A layer laminated between the other layer and the modeling surface 21 in order to solve these problems is the slice layer L of the raft layer. Furthermore, each slice layer L of the solid layer, modeling layer, and support layer is discharged into an outline, which is the modeling material X, discharged along the outline of a predetermined external shape, and into a region surrounded by the outline. It is formed by the infill which is the modeling material X. The slice layer L of the solid layer is a layer in which the area surrounded by the outline of the slice layer L of the solid layer is filled with infill almost without gaps. In other words, the sliced layer L of the solid layer is a layer in which the infill filling rate in the region is 100%. Note that the slice layer L of the first solid layer can also be expressed as one or more layers containing the modeling material X that forms the surface of the shaped object. Moreover, the slice layer L of the modeling layer is one or more layers containing the modeling material X that forms the inside of the modeling object. Furthermore, the slice layer L of the second solid layer can also be said to be one or more layers containing the modeling material X forming the surface of the support. On the other hand, the slice layer L of the modeling layer is a layer in which infill is included in a region surrounded by the outline of the modeling layer, and in which there is a region not filled with infill. In other words, the slice layer L of the modeling layer is a layer in which the infill filling rate in the region is less than 100%. Moreover, the slice layer L of the modeling layer can also be said to be one or more layers containing the modeling material X that forms the inside of the modeling object. Further, the sliced layer L of the support layer is a layer in which infill is included in a region surrounded by the outline of the support layer, and in which there is a region not filled with infill. In other words, the sliced layer L of the support layer is a layer in which the infill filling rate in the region is less than 100%. Moreover, the slice layer Ln of the support layer can also be said to be one or more layers containing the modeling material X that forms the inside of the support body.

The three-dimensional printing apparatus 1 performs printing control for printing a three-dimensional object based on the three-dimensional printing data generated as described above. In addition, when the three-dimensional printing apparatus 1 laminates N slice layers L on the printing surface 21 during printing control, one of the raft layer, the first solid layer, the printing layer, the second solid layer, and the support layer is used. As the slice layer L of the type represented by part or whole, each of the N slice layers L is discharged onto the modeling surface 21 by the discharge unit 10, and the N slice layers L are stacked to form one three-dimensional piece. Create a model.

The discharge unit 10 is a discharge device that discharges the modeling material X onto the modeling surface 21 . More specifically, the discharge section 10 includes a material melting section that melts one or more types of materials to form the modeling material X, and a material supply section, along with the above-mentioned nozzle Nz. Here, in the discharge section 10, the material supply section and the material melting section are connected by a supply path. Further, the material melting section and the nozzle Nz are connected through a communication hole. Therefore, the nozzle Nz is communicated with the material melting section. The nozzle Nz discharges the modeling material X supplied from the material melting section through the communication hole from its tip.

Here, when stacking the n-th slice layer Ln on the n-1-th slice layer Ln-1, the three-dimensional printing apparatus 1 laminates the top surface of the n-1-th slice layer Ln-1 and the nozzle Nz. By changing the distance from the tip, the width of the modeling material X discharged onto the upper surface of the n-1th slice layer Ln-1 is changed. However, the maximum value of the width of the modeling material X discharged onto the upper surface of the n-th slice layer Ln by the three-dimensional modeling apparatus 1 is the outer diameter of the tip of the nozzle Nz. This means that when the distance between the top surface of the n-1th slice layer Ln-1 and the tip of the nozzle Nz is made shorter than the inner diameter of the tip of the nozzle Nz, the modeling material This is because the liquid is ejected onto the upper surface of the n-1th modeling layer while being crushed by the tip of Nz.

The material supply section stores one or more types of materials in the form of pellets, powder, etc. Below, as an example, a case will be described in which the material accommodated in the material supply section includes a pellet-shaped crystalline resin material. A crystalline resin material is a resin material that crystallizes as the temperature decreases, and includes, for example, polyester. The material supply section is configured by, for example, a hopper. The material accommodated in the material supply section is supplied to the material melting section via a supply path provided below the material supply section.

The material melting section includes a screw case, a flat screw housed in the screw case, a drive motor for driving the flat screw, and a barrel fixed below the flat screw in the screw case.

A flat screw has a flat cylindrical shape, and a spiral groove extending from the outer periphery of the cylinder toward the central axis of the cylinder is formed on the bottom surface of the cylinder.

The barrel is provided with the aforementioned communication hole. The barrel also has a built-in heater. The temperature of the heater is controlled by a controller 60.

The material supplied between the rotating flat screw and the barrel is at least partially melted by the rotation of the flat screw and heating by the heater built into the barrel, and becomes a fluid paste. will be the modeling material X. Therefore, the modeling material X contains a crystalline resin material. The modeling material X is supplied to the nozzle Nz through a communication hole provided in the barrel by rotation of the flat screw. The modeling material X supplied to the nozzle Nz is then discharged toward the stage 20 from the tip of the nozzle Nz.

The moving unit 30 changes the relative position between the nozzle Nz of the discharge unit 10 and the stage 20. More specifically, the moving unit 30 changes the relative position between the nozzle Nz of the ejection unit 10 and the stage 20 by moving either or both of the ejection unit 10 and the stage 20. Below, as an example, a case will be described in which the moving unit 30 changes the relative position between the nozzle Nz of the discharge unit 10 and the stage 20 by moving the stage 20. For example, the moving unit 30 includes a first moving mechanism unit 31 that moves the discharge unit 10 along the Z-axis, and a second moving mechanism unit that moves the stage 20 relative to the discharge unit 10 along the X-axis and the Y-axis. It is equipped with 32. In the present embodiment, the first moving mechanism section 31 shown in FIG. have. The second moving mechanism section 32 shown in FIGS. 1 and 2 is composed of a horizontal transport device that moves the stage 20 along the X-axis and the Y-axis, and includes a motor for moving the stage 20 along the X-axis, It also has a motor for moving the stage 20 along the Y axis. The first moving mechanism section 31 and the second moving mechanism section 32 are controlled by a control device 60.

The heating unit 40 heats the target area containing the modeling material X discharged by the discharge unit 10. Here, the target area refers to the entirety of N slice layers L when N slice layers L are stacked on the modeling surface 21 as one three-dimensional object among the areas on the modeling surface 21. This refers to the area that contains the area. The heating unit 40 may have any configuration as long as it can heat the target area. In the example shown in FIG. 1, the heating unit 40 is a flat panel heater that has a surface facing the upper surface of the stage 20, that is, the modeling surface 21, and heats the target area. In this case, the heating section 40 heats the region sandwiched between the lower surface of the flat heating section 40 and the modeling surface 21 as a target region. Note that the heating section 40 is controlled by a control device 60. Furthermore, in the example shown in FIG. 1, the heating section 40 is provided with a through hole through which the aforementioned nozzle Nz is inserted. For this reason, the heating unit 40 is provided around the nozzle Nz and moves together with the nozzle Nz. Note that instead of the panel heater, the heating unit 40 may be a chamber-type heater that sends warm air, a cartridge heater, or any other type of heater that can heat the target area. It's okay.

The temperature detection unit 50 is a temperature sensor that detects at least the temperature at a predetermined temperature detection position. Here, the temperature detection position may be any position as long as it is a position that is predetermined as a position on the surface of the three-dimensional structure formed within the target area. That is, when N slice layers L are stacked, the modeling material X is located at the temperature detection position. Therefore, for convenience of explanation, the modeling material X located at the temperature detection position will be hereinafter referred to as the modeling material X at the temperature detection position. Further, in the following, as an example, in addition to the temperature at the temperature detection position, the temperature detection unit 50 measures the temperature of the building material X stacked on the stage 20 when viewed in a predetermined first direction. A case will be described in which the temperature of the surface of X is detected. In this case, the temperature detection unit 50 is, for example, a thermographer installed so as to be able to image the modeling material X in the first direction; temperature sensor. In the example shown in FIG. 1, the temperature detection section 50 is provided on the lower surface of the heating section 40. The temperature detection unit 50 then outputs temperature map information indicating a temperature map based on the captured image to the control device 60. This temperature map information is an example of information indicating the temperature of the surface of the modeling material X layered within the target area. In the following, as an example, a case will be described in which the control device 60 has been previously calibrated to associate positions on the temperature map with actual positions. Furthermore, among the directions in which the optical axis of the temperature detection unit 50 can be directed, the first direction refers to the surface including the temperature detection position among the surfaces of the modeling material X stacked on the stage 20. The direction may be any direction as long as the direction can be imaged. In the example shown in FIG. 1, the first direction is a direction in which the modeling material X is looked down diagonally from above toward the positive direction of the X axis. Therefore, in this example, the temperature detection position is included in the surface of the modeling material X on the negative side of the X axis.

The control device 60 controls the entire three-dimensional modeling device 1. The control device 60 acquires the three-dimensional printing data generated by the data generation device 70 via a network or a recording medium. The control device 60 performs three-dimensional printing by executing a three-dimensional printing program stored in advance to perform printing control that controls the operations of the discharge section 10 and the moving section 30 according to the three-dimensional printing data. Create a model. Note that the control device 60 may be configured not by a computer but by a combination of a plurality of circuits.

The above-mentioned modeling control refers to control regarding the discharge section 10 and the moving section 30. More specifically, the modeling control is control for stacking N slice layers L on the modeling surface 21 to create one three-dimensional object having a predetermined shape. Here, the nth slice layer Ln of the N slice layers L is stacked on the (n-1)th slice layer Ln-1. At this time, when the n-th slice layer Ln is stacked on the n-1-th slice layer Ln, a part of the n-1-th slice layer Ln-1 is removed by the heat of the n-th slice layer Ln. Melt. Therefore, the nth slice layer Ln is joined to the (n-1)th slice layer Ln-1. As a result, on the modeling surface 21, the N slice layers L are stacked as one three-dimensional model. Therefore, in the embodiment, the 0th slice layer L0 means the modeling surface 21. That is, in the embodiment, the first slice layer L1 is stacked on the 0th slice layer L0, that is, on the modeling surface 21.

When layering the n-th slice layer Ln on the n-1-th slice layer Ln-1 by modeling control, the control device 60 controls the discharge section 10 and the moving section 30 to stack the n-th slice layer Ln on the n-th slice layer Ln. The discharge unit 10 discharges the modeling material X along the modeling path of the corresponding n-th slice layer VLn. Thereby, the control device 60 can stack the n-th slice layer Ln on the (n-1)th slice layer Ln-1. By performing the above control as modeling control, the control device 60 sequentially discharges the modeling material X, stacks N slice layers L on the modeling surface 21, and creates one three-dimensional model. to form.

Furthermore, the modeling control includes first temperature control that controls the heating unit 40 based on the detected temperature detected by the temperature detection unit 50 as the temperature of the modeling material X at the temperature detection position. The first temperature control is a control that promotes the growth of crystals of the building material X at the temperature detection position described above, and specifically, it is a control that reduces the cooling rate of the building material be. The modeling material X layered on the modeling surface 21 in the three-dimensional modeling apparatus 1 contains a crystalline resin material, as described above. In this case, the temperature of the modeling material X after being discharged onto the modeling surface 21 decreases over time and crystallizes. However, if the cooling rate of the modeling material X is too fast, the modeling material X may solidify in an amorphous state. This is not desirable because it leads to a decrease in the interlayer strength of the laminated building material X, a decrease in the mechanical properties of the building material X, and the like.

Here, FIG. 2 is a diagram showing an example of the modeling material X laminated on the modeling surface 21 as the three-dimensional structure OB. In the example shown in FIG. 2, the three-dimensional structure OB has a dumbbell shape that is tapered near the center in the vertical direction. Each of the five positions P1 to P5 shown in FIG. 2 is an example of a position located on the surface of the three-dimensional structure OB. Positions P1 to P5 are arranged in the order of position P1, position P2, position P3, position P4, and position P5 from bottom to top when looking at the three-dimensional object OB in the negative direction of the X-axis. They are lined up. FIG. 3 is a diagram showing an example of changes in the temperature of the building material X at each of the five positions P1 to P5 in the process of the three-dimensional modeling apparatus 1 modeling the three-dimensional object OB through the modeling control. be. The vertical axis of the graph shown in FIG. 3 indicates temperature. Further, the horizontal axis of the graph indicates elapsed time. Further, a curve F1 plotted on the graph indicates a temporal change in the temperature of the modeling material X at the position P1. Further, a curve F2 plotted on the graph indicates a temporal change in the temperature of the modeling material X at the position P2. Further, a curve F3 plotted on the graph indicates a temporal change in the temperature of the modeling material X at the position P3. Further, a curve F4 plotted on the graph indicates a temporal change in the temperature of the modeling material X at the position P4. Further, a curve F5 plotted on the graph indicates a temporal change in the temperature of the modeling material X at the position P5.

The longer the temperature of the building material X monotonically decreases within the range between the temperature T1 and the temperature T2 shown in FIG. 3, the more the crystallization of the building material X is promoted. That is, the more the temperature of the building material X oscillates within the range, or the shorter the time period during which the temperature of the building material There is a high possibility that it will get lost. For example, when comparing the curve F1 and the curve F3, it can be seen that the cooling rate of the building material X at the position P3 is faster than the cooling rate of the building material X at the position P1 within the range. In this case, the modeling material X at position P3 is likely to solidify in an amorphous state. In the example shown in FIG. 2, the position P3 is a position where the three-dimensional structure OB is thinner than the position P1. That is, if the modeling material X at position P3 solidifies in an amorphous state, the strength at position P3, which is structurally weak, will become even weaker.

Therefore, for example, the control device 60 performs modeling control including the first temperature control described above with position P3 as the temperature detection position, and cools the modeling material A three-dimensional object OB is formed while reducing the speed. Thereby, the control device 60 can promote the growth of crystals of the modeling material X at the position P3. As a result, the control device 60 can prevent the modeling material X at the position P3 from solidifying in an amorphous state. In other words, the control device 60 can prevent the modeling material X at the temperature detection position from solidifying in an amorphous state.

Note that the control device 60 may be configured to acquire temperature detection position information indicating a position desired by the user among the positions within the target area as the temperature detection position, in response to an operation received from the user. Further, the control device 60 may be configured to acquire three-dimensional printing data including the temperature detection position information from the data generation device 70. In this case, the temperature detection position information is generated by the data generation device 70. Further, the control device 60 may be configured to acquire the temperature detection position information using any other method. Further, the control device 60 is configured to identify a region of the three-dimensional structure that is estimated to be likely to solidify in an amorphous state, and select the position of the identified region as a temperature detection position. It may be. Here, among the parts of the three-dimensional structure, the parts that are estimated to have a high possibility of being solidified in an amorphous state are parts that satisfy predetermined conditions. The predetermined condition is, for example, that the portion has a ratio of surface area to volume that is larger than a predetermined threshold. A region whose surface area to volume ratio is larger than a predetermined threshold value is, for example, a region whose thickness is thinner than a predetermined threshold value, a region whose volume is smaller than a predetermined threshold value, and the like. This is because the larger the ratio of surface area to volume of a certain part is than a predetermined threshold, the faster the cooling rate of that part tends to be. In addition, among the parts of the three-dimensional model, the parts that are estimated to have a high possibility of solidifying in an amorphous state are the building material X, which is estimated to have a high possibility of solidifying in an amorphous state. May be translated.

Further, there may be a plurality of temperature detection positions. In this case, the control device 60 performs the first temperature control for each of the plurality of temperature detection positions. In this embodiment, in order to simplify the explanation, a case where there is one temperature detection position will be described as an example.

Further, the control device 60 may be able to perform modeling control without performing the first temperature control according to the operation received from the user, and may be capable of performing the first temperature control according to the operation received from the user. It may be impossible to perform modeling control without performing.

FIG. 4 is a diagram showing an example of the hardware configuration of the control device 60.

The control device 60 includes a processor 61 , a storage section 62 , an input reception section 63 , a communication section 64 , and a display section 65 . Note that the control device 60 may be an information processing device configured separately from the three-dimensional modeling device 1, as described above. In this case, the three-dimensional modeling device 1 is communicably connected to this information processing device and is controlled by this information processing device.

The processor 61 is, for example, a CPU (Central Processing Unit). Note that the processor 61 may be another processor such as an FPGA (Field Programmable Gate Array). Further, the processor 61 may be composed of a plurality of processors. The processor 61 implements various functions of the control device 60 by executing various programs, various instructions, etc. stored in the storage unit 62.

The storage unit 62 includes a HDD (Hard Disk Drive), an SSD (Solid State Drive), an EEPROM (Electrically Erasable Programmable Read Only Memory), a ROM (Read Only Memory), a RAM (Random Access Memory), and the like. Note that instead of being built into the control device 60, the storage unit 62 may be an external storage device connected through a digital input/output port such as a USB (Universal Serial Bus). The storage unit 62 stores various programs, various commands, various information, etc. processed by the control device 60. For example, the storage unit 62 stores three-dimensional modeling data and the like.

The input accepting unit 63 accepts operations performed by the user while viewing the image displayed on the display unit 65. The input receiving unit 63 is an input device including, for example, a keyboard, a mouse, a touch pad, and the like. Note that the input receiving section 63 may be a touch panel configured integrally with the display section 65.

The communication unit 64 includes, for example, a digital input/output port such as a USB, an Ethernet (registered trademark) port, and the like.

The display unit 65 displays images. The display unit 65 is a display device included in the control device 60, and includes, for example, a liquid crystal display panel, an organic EL (Electro Luminescence) display panel, and the like.

FIG. 5 is a diagram showing an example of the functional configuration of the control device 60.

The control device 60 includes a storage section 62, an input reception section 63, a communication section 64, a display section 65, and a control section 66.

The control unit 66 controls the entire control device 60. The control section 66 includes a device control section 661. These functional units included in the control unit 66 are realized, for example, by the processor 61 executing various programs stored in the storage unit 62. Further, part or all of the functional units may be a hardware functional unit such as an LSI (Large Scale Integration) or an ASIC (Application Specific Integrated Circuit).

The device control unit 661 controls the entire three-dimensional modeling device 1. For example, the device control unit 661 controls each of the discharge unit 10, the moving unit 30, and the heating unit 40.

The data generation device 70 is a device that generates three-dimensional modeling data used by the three-dimensional modeling device 1 to model a three-dimensional object. The data generation device 70 generates three-dimensional printing data using the method in which the three-dimensional printing apparatus 1 generates three-dimensional printing data as described above. Therefore, a description of the method will be omitted here. Further, the data generation device 70 stores the above-mentioned shape data according to the received operation. Note that the data generation device 70 may be able to generate shape data or may not be able to generate shape data. If the data generation device 70 is unable to generate shape data, the data generation device 70 acquires shape data from another device via a network or a storage medium. Further, the data generation device 70 stores the above-mentioned slice condition information and modeling path generation condition information according to the received operation.

The data generation device 70 is, for example, an information processing device such as a workstation, a desktop PC (Personal Computer), a notebook PC, a tablet PC, a multifunctional mobile phone terminal (smartphone), a mobile phone terminal, a PDA (Personal Digital Assistant), etc. However, it is not limited to these. More specifically, the data generation device 70 is configured by a computer including one or more processors, a memory, and an input/output interface that inputs and outputs signals to and from the outside.

<Processing in which the control device performs modeling control>
Hereinafter, with reference to FIG. 6, a process in which the control device 60 performs modeling control will be described. FIG. 6 is a diagram showing an example of the flow of processing in which the control device 60 performs modeling control. In the following, as an example, a case will be described in which three-dimensional modeling data is stored in the storage unit 62 at a timing before the process of step S110 shown in FIG. 6 is performed. Moreover, below, as an example, a case will be described in which the control device 60 receives an operation for causing the control device 60 to start modeling control at the timing. Moreover, below, as an example, a case will be described in which the three-dimensional modeling data stored in advance in the storage unit 62 includes temperature detection position information indicating the temperature detection position.

After the control device 60 receives an operation for causing the control device 60 to start modeling control, the device control section 661 reads out the three-dimensional modeling data stored in advance in the storage section 62 from the storage section 62 (step S110).

Next, the device control unit 661 adjusts the orientation of the N slice layers VL based on the three-dimensional printing data read out in step S110 (step S120). Specifically, in step S120, the device control unit 661 places a support between the temperature detection position indicated by the temperature detection position information included in the three-dimensional modeling data read out in step S110 and the temperature detection unit 50. The orientations of the N slice layers VL are adjusted so that the N slice layers VL are not placed in the same position. This adjustment method may be a known method or a method to be developed in the future. For example, the device control unit 661 controls the N slice layers L so that when the N slice layers L are stacked on the modeling surface 21, the support body is not located between the temperature detection position and the temperature detection unit 50. The N slice layers VL are rotated around a virtual axis passing through the center of gravity of the N slice layers VL in the stacking direction of the layers VL. Thereby, when stacking the modeling material X on the stage 20 in the modeling control, the control device 60 stacks the modeling material Laminated on. As a result, the control device 60 can prevent detection of the temperature of the modeling material X at the temperature detection position from being obstructed by the support. Note that when such processing is performed in step S120, the control device 60 stores, for example, information indicating the relative position of the temperature detection unit 50 with respect to the stage 20. Furthermore, in the flowchart shown in FIG. 6, the process of step S120 may be omitted.

Next, the device control unit 661 selects the slice layers VL from the bottom one by one from among the N slice layers VL based on the three-dimensional printing data, and selects the slice layers VL from the bottom one by one from the N slice layers VL, and for each selected slice layer VL, step S140 The process is repeated (step S130).

The control device 60 stacks the slice layer L corresponding to the slice layer VL on the modeling surface 21 based on the modeling path of the slice layer VL selected in step S130 (step S140). The control device 60 then proceeds to step S130 and selects the next slice layer VL. Note that, if there is no unselected slice layer VL in step S130, the control device 60 ends the repeated processing of steps S130 to S140, and ends the processing of the flowchart shown in FIG. 6.

Here, in the repeating process of steps S130 to S140 described above, the control device 60 further performs the process of the flowchart shown in FIG. 7 in parallel as the process of performing the above-described first temperature control.

FIG. 7 is a diagram showing an example of the flow of processing in which the control device 60 performs the first temperature control. In the following, as an example, a case will be described in which the process of step S210 shown in FIG. 7 is started in accordance with the timing at which the repeated process of steps S130 to S140 shown in FIG. 6 is started. Furthermore, as an example, a case will be described below in which the control device 60 repeatedly performs the process of the flowchart shown in FIG. 7 while the repetitive process is being performed. Moreover, below, as an example, a case will be described in which the control device 60 causes the heating unit 40 to start heating the target region at the timing.

After the repeated processing of steps S130 to S140 shown in FIG. 6 is started, the device control unit 661 acquires temperature map information from the temperature detection unit 50 (step S210). Here, the temperature detection unit 50 generates the above-mentioned temperature map every time a predetermined sampling period elapses, and continues to output temperature map information indicating the generated temperature map to the control device 60, for example. In this case, the control device 60 acquires the temperature map information acquired from the temperature detection unit 50 at the timing when the process of step S210 is performed. Note that the temperature detection unit 50 may output the temperature map information using any other method. Further, the method by which the device control unit 661 acquires the temperature map information from the temperature detection unit 50 may be any other method.

Next, the device control unit 661 determines whether the highest temperature in the temperature map indicated by the temperature map information acquired in step S210 is equal to or lower than the first threshold (step S220). That is, in step S220, the device control unit 661 determines whether the temperature of the surface of the modeling material X on the temperature map exceeds the first threshold value. Here, the first threshold is, for example, the glass transition temperature of the modeling material X, but is not limited thereto.

When the device control unit 661 determines that the highest temperature in the temperature map indicated by the temperature map information acquired in step S210 exceeds the first threshold (step S220-NO), the device control unit 661 controls the heating unit 40 to 40 is stopped (step S260). Thereby, when the glass transition temperature of the modeling material X is the first threshold value, the control device 60 can maintain the temperature in the target area at or below the glass transition temperature. As a result, the control device 60 can prevent the strength of the three-dimensional structure in which the N slice layers L are stacked from decreasing due to an excessive rise in temperature within the target region. After the process of step S260 is performed, the device control unit 661 moves to step S210 and acquires temperature map information from the temperature detection unit 50 again.

On the other hand, if the device control unit 661 determines that the highest temperature in the temperature map indicated by the temperature map information acquired in step S210 is equal to or lower than the first threshold (step S220-YES), the heating unit 40 heats the target area. It is determined whether or not it is stopped (step S230).

When the device control unit 661 determines that the heating of the target area by the heating unit 40 is not stopped (step S230-NO), the device control unit 661 determines that the heating of the target area by the heating unit 40 is not stopped (step S230-NO), It is determined whether the modeling material X has already been discharged to the temperature detection position indicated by the temperature detection position information (step S240). In FIG. 7, the process of step S240 is indicated by "Is there modeling material X at the temperature detection position?"

If the device control unit 661 determines that the modeling material X has not already been discharged to the temperature detection position (step S240-NO), the process moves to step S210 and acquires temperature map information from the temperature detection unit 50 again.

On the other hand, when the device control unit 661 determines that the modeling material X has already been discharged to the temperature detection position (step S240-YES), it calculates the cooling rate of the modeling material X at the temperature detection position (step S250). Here, in step S250, the device control unit 661 acquires temperature map information from the temperature detection unit 50 multiple times within a predetermined detection time, and determines the temperature based on the acquired plurality of temperature map information. The amount of decrease in temperature of the modeling material X at the detection position per unit time is calculated as the cooling rate. Here, the detection time is, for example, about 1 second, but may be shorter than 1 second or longer than 1 second. Further, the unit time is, for example, 1 second, but may be any other time that can be used as the unit time.

Next, the device control unit 661 determines whether the cooling rate calculated in step S250 is equal to or higher than a predetermined second threshold (step S260). The second threshold value may be any value as long as it is determined based on the graph shown in FIG. 3 to prevent the modeling material X from solidifying in an amorphous state.

If the device control unit 661 determines that the cooling rate is less than the second threshold (step S260-NO), the process proceeds to step S210 and acquires temperature map information from the temperature detection unit 50 again.

On the other hand, when the device control unit 661 determines that the cooling rate is equal to or higher than the second threshold (step S260-YES), the device control unit 661 controls the heating unit 40 to increase the temperature of the heating unit 40 (step S290). That is, the device control unit 661 increases the temperature in the target region by increasing the temperature of the heating unit 40 in step S290. Thereby, the control device 60 can reduce the cooling rate of the modeling material X at the temperature detection position. Here, the device control unit 661 increases the temperature of the heating unit 40 by increasing the amount of current flowing to the heating unit 40, for example. Note that the device control unit 661 may be configured to increase the temperature of the heating unit 40 using another method. After the process of step S290 is performed, the device control unit 661 moves to step S210 and acquires temperature map information from the temperature detection unit 50 again.

On the other hand, if the device control unit 661 determines that the heating of the target area by the heating unit 40 is stopped (step S230-YES), the device control unit 661 controls the heating unit 40 and causes the heating unit 40 to resume heating the target area. (Step S280). After the process of step S280 is performed, the device control unit 661 moves to step S240, and the temperature detection position information included in the three-dimensional printing data read out in step S110 shown in FIG. It is determined whether the modeling material X has already been discharged to the temperature detection position.

As described above, the control device 60 performs the first temperature control to reduce the cooling rate of the modeling material X at the temperature detection position while performing the modeling control. Thereby, the control device 60 can suppress the modeling material X at the temperature detection position from solidifying in an amorphous state.

Here, the user of the 3D printing apparatus 1 can reduce the residual stress of the 3D structure by annealing the 3D structure formed by the processes shown in the flowcharts shown in FIGS. 6 and 7. can. In the following, for convenience of explanation, the user of the three-dimensional printing apparatus 1 will be simply referred to as a user. For example, the user anneals the three-dimensional structure according to the steps in the flowchart shown in FIG.

FIG. 8 is a diagram showing an example of the flow of the process of annealing a three-dimensional structure. Below, as an example, a case will be described in which the three-dimensional structure OB2 is modeled by the three-dimensional model 1 at a timing before the process of step S310 shown in FIG. 8 is performed.

The user places the three-dimensional structure OB2, which has been modeled in advance by the three-dimensional modeling apparatus 1, in an oven for annealing the three-dimensional structure (step S310).

Next, the user starts heating the oven in which the three-dimensional structure OB2 is placed in step S310, and anneals the three-dimensional structure OB2 (step S320). Here, the method of annealing the three-dimensional structure OB2 in step S320 may be a known method or a method to be developed in the future.

Next, the user takes out the three-dimensional structure OB2 that has been annealed in step S320 from the oven (step S330), and ends the process of the flowchart shown in FIG. 8.

As described above, the user can anneal the three-dimensional structure OB2. Thereby, the user can reduce the residual stress of the three-dimensional structure OB2.

Note that the contents described above may be combined in any manner.

Further, the three-dimensional modeling apparatus 1 described above may have a configuration in which the position of the temperature detection section 50 can be changed. In this case, the three-dimensional modeling apparatus 1 includes, for example, a temperature detection unit position changing unit that changes the position of the temperature detection unit 50.

Further, the control device 60 described above may include two devices: a first device that performs modeling control and a second device that performs first temperature control. In this case, the second device is thus a temperature control device.

As described above, the control device according to the embodiment includes a stage, a discharge section that discharges a modeling material containing a crystalline resin material onto the stage, and a moving section that relatively moves the stage and the discharge section. A three-dimensional modeling apparatus comprising: a heating section that heats a target area containing modeling material discharged by a discharge section; and a temperature detection section that detects at least a temperature at a predetermined temperature detection position among positions within the target area. The controller is equipped with a control unit that performs printing control that controls the temperature of the printing material at the temperature detection position, and controls the temperature of the printing material at the temperature detection position. The first temperature control includes a first temperature control that controls the heating section based on the detected temperature, and the first temperature control is a control that reduces the cooling rate of the modeling material at the temperature detection position. Thereby, the control device can suppress the modeling material at the temperature detection position from solidifying in an amorphous state. Here, in the example described above, the control device 60 is an example of the control device. Furthermore, in the example described above, the stage 20 is an example of the stage. Furthermore, in the example described above, polyester is an example of the crystalline resin material. Moreover, in the example explained above, the modeling material X is an example of the said modeling material. Further, in the example described above, the discharge section 10 is an example of the discharge section. Furthermore, in the example described above, the moving unit 30 is an example of the moving unit. Furthermore, in the example described above, the heating section 40 is an example of the heating section. Furthermore, in the example described above, the temperature detection section 50 is an example of the temperature detection section. Furthermore, in the example described above, the three-dimensional printing apparatus 1 is an example of the three-dimensional printing apparatus. Further, in the example described above, the control unit 66 is an example of the control unit.

In addition, in the control device, when stacking the printing materials on the stage in the printing control, the control unit stacks the printing materials on the stage so that the support is not located between the temperature detection position and the temperature detection unit. , configuration may be used.

Further, in the control device, a configuration may be used in which the modeling material at the temperature detection position is a modeling material that satisfies predetermined conditions.

Further, the control device may employ a configuration in which the predetermined condition is that the ratio of surface area to volume is larger than a predetermined threshold value.

Further, in the control device, a configuration may be used in which the temperature detection section is a thermography.

In addition, in the control device, the heating section is a flat panel heater that has a surface facing the top surface of the stage and heats the target area, and the temperature detection section detects the temperature at the temperature detection position as well as the temperature at the stage. A second temperature control that detects the temperature of the surface of the building material to be laminated, and controls the heating section so that the temperature of the surface detected by the temperature detection section does not exceed the glass transition temperature of the building material. Configurations may be used, including:

Further, the three-dimensional printing apparatus according to the embodiment includes a stage, a discharge section that discharges a modeling material containing a crystalline resin material onto the stage, a moving section that relatively moves the stage and the discharge section, and a discharge section. a heating unit that heats a target area containing the modeling material discharged by the heating unit; a temperature detection unit that detects at least a temperature at a predetermined temperature detection position among positions within the target area; a discharge unit; and a moving unit. , a heating unit, and a control device that performs printing control to stack the printing materials on the stage to form a three-dimensional object, and the printing control detects temperature as the temperature of the printing material at the temperature detection position. The first temperature control includes first temperature control for controlling the heating section based on the detected temperature detected by the section, and the first temperature control is control for reducing the cooling rate of the modeling material at the temperature detection position. Thereby, the three-dimensional modeling apparatus can suppress the modeling material at the temperature detection position from solidifying in an amorphous state.

Further, the three-dimensional modeling method according to the embodiment includes a stage, a discharge part that discharges a modeling material containing a crystalline resin material onto the stage, a moving part that relatively moves the stage and the discharge part, and a discharge part. controls a three-dimensional printing apparatus including a heating unit that heats a target area containing modeling material discharged by the apparatus; and a temperature detection unit that detects at least a temperature at a predetermined temperature detection position among positions within the target area. This is a 3D printing method that performs printing control by stacking printing materials on a stage and printing a 3D object by a 3D printing device.The printing control includes temperature detection as the temperature of the printing material at a temperature detection position The first temperature control includes first temperature control for controlling the heating section based on the detected temperature detected by the section, and the first temperature control is control for reducing the cooling rate of the modeling material at the temperature detection position. Thereby, the three-dimensional modeling method can suppress the modeling material at the temperature detection position from solidifying in an amorphous state.

Further, the three-dimensional printing method may employ a configuration in which a three-dimensional model is caused to model a three-dimensional model by modeling control, and then the three-dimensional model produced by the three-dimensional model is annealed.

Further, the temperature control device according to the embodiment includes a stage, a discharge section that discharges a modeling material containing a crystalline resin material onto the stage, a moving section that relatively moves the stage and the discharge section, and a discharge section. 3D printing using a 3D printing apparatus that includes a heating unit that heats a target area containing discharged modeling material, and a temperature detection unit that detects at least the temperature at a predetermined temperature detection position among positions within the target area. In the modeling of the modeled object, first temperature control is performed to control the heating section based on the detected temperature detected by the temperature detection unit as the temperature of the modeling material at the temperature detection position, and the first temperature control is performed during the modeling at the temperature detection position. This is a control that reduces the cooling rate of the material. Thereby, the temperature control device can suppress the modeling material at the temperature detection position from solidifying in an amorphous state.

Although the embodiments of this invention have been described above in detail with reference to the drawings, the specific configuration is not limited to this embodiment, and modifications, substitutions, deletions, etc. may be made without departing from the gist of this invention. may be done.

Furthermore, a program for realizing the functions of arbitrary components in the apparatus described above may be recorded on a computer-readable recording medium, and the program may be read and executed by a computer system. Here, the device is, for example, the three-dimensional modeling device 1, the control device 60, the data generation device 70, etc. Note that the "computer system" herein includes hardware such as an OS (Operating System) and peripheral devices. Furthermore, "computer-readable recording media" refers to portable media such as flexible disks, magneto-optical disks, ROMs, and CD (Compact Disk)-ROMs, and storage devices such as hard disks built into computer systems. . Furthermore, "computer-readable recording media" refers to volatile memory inside a computer system that serves as a server or client when a program is transmitted via a network such as the Internet or a communication line such as a telephone line. This also includes those that hold time programs.

Further, the above program may be transmitted from a computer system storing the program in a storage device or the like to another computer system via a transmission medium or by a transmission wave in a transmission medium. Here, the "transmission medium" that transmits the program refers to a medium that has a function of transmitting information, such as a network such as the Internet or a communication line such as a telephone line.
Moreover, the above-mentioned program may be for realizing a part of the above-mentioned functions. Furthermore, the above-mentioned program may be a so-called difference file or difference program that can realize the above-described functions in combination with a program already recorded in the computer system.

DESCRIPTION OF SYMBOLS 1... Three-dimensional modeling apparatus, 10... Discharge part, 20... Stage, 21... Modeling surface, 30... Moving part, 31... First moving mechanism part, 32... Second moving mechanism part, 40... Heating part, 50... Temperature Detection unit, 60...Control device, 61...Processor, 62...Storage unit, 63...Input reception unit, 64...Communication unit, 65...Display unit, 66...Control unit, 70...Data generation device, 661...Device control unit, Nz...Nozzle, OB...Three-dimensional object, OB2...Three-dimensional object, TC...Three-dimensional coordinate system, X...Building material

Claims (10)

a stage, a discharge part that discharges a modeling material containing a crystalline resin material onto the stage, a moving part that relatively moves the stage and the discharge part, and a discharge part that discharges the modeling material discharged by the discharge part. controlling a three-dimensional modeling apparatus including a heating section that heats a target region including a heating section, and a temperature detecting section that detects at least a temperature at a predetermined temperature detection position among positions within the target region, comprising a control unit that performs modeling control to cause the three-dimensional printing device to model a three-dimensional model by stacking it on the stage,
The modeling control includes first temperature control that controls the heating unit based on the detected temperature detected by the temperature detection unit as the temperature of the modeling material at the temperature detection position,
The first temperature control is a control that reduces the cooling rate of the modeling material at the temperature detection position.
Control device. When stacking the modeling material on the stage in the modeling control, the control unit controls the modeling material to be stacked on the stage so that no support is located between the temperature detection position and the temperature detection unit. Laminate,
The control device according to claim 1. The modeling material at the temperature detection position is the modeling material that satisfies a predetermined condition.
The control device according to claim 1 or 2. The condition is that the ratio of surface area to volume is greater than a predetermined threshold;
The control device according to claim 3. The temperature detection unit is a thermography,
The control device according to claim 1 or 2. The heating unit is a flat panel heater that has a surface facing the upper surface of the stage and heats the target area,
The temperature detection unit detects the temperature of the surface of the modeling material stacked on the stage in addition to the temperature at the temperature detection position,
The modeling control includes second temperature control that controls the heating unit so that the temperature of the surface detected by the temperature detection unit does not exceed the glass transition temperature of the modeling material.
The control device according to claim 1 or 2. stage and
a discharge unit that discharges a modeling material containing a crystalline resin material onto the stage;
a moving unit that relatively moves the stage and the discharge unit;
a heating unit that heats a target area containing the modeling material discharged by the discharge unit;
a temperature detection unit that detects at least a temperature at a predetermined temperature detection position among the positions in the target area;
a control device that controls the discharge section, the moving section, and the heating section, and performs modeling control to stack the modeling material on the stage to form a three-dimensional object;
Equipped with
The modeling control includes first temperature control that controls the heating unit based on the detected temperature detected by the temperature detection unit as the temperature of the modeling material at the temperature detection position,
The first temperature control is a control that reduces the cooling rate of the modeling material at the temperature detection position,
Three-dimensional printing equipment. a stage, a discharge part that discharges a modeling material containing a crystalline resin material onto the stage, a moving part that relatively moves the stage and the discharge part, and a discharge part that discharges the modeling material discharged by the discharge part. controlling a three-dimensional modeling apparatus including a heating section that heats a target region including a heating section, and a temperature detecting section that detects at least a temperature at a predetermined temperature detection position among positions within the target region, A three-dimensional printing method that performs modeling control to cause the three-dimensional printing device to build three-dimensional objects by stacking them on the stage, the method comprising:
The modeling control includes first temperature control that controls the heating unit based on the detected temperature detected by the temperature detection unit as the temperature of the modeling material at the temperature detection position,
The first temperature control is a control that reduces the cooling rate of the modeling material at the temperature detection position.
Three-dimensional modeling method. After causing the three-dimensional model to model the three-dimensional model by the modeling control, annealing the three-dimensional model to model the three-dimensional model by the three-dimensional model.
The three-dimensional modeling method according to claim 8. a stage, a discharge part that discharges a modeling material containing a crystalline resin material onto the stage, a moving part that relatively moves the stage and the discharge part, and a discharge part that discharges the modeling material discharged by the discharge part. In the modeling of a three-dimensional object by a three-dimensional modeling apparatus, which includes a heating section that heats a target region including a heating section, and a temperature detection section that detects at least the temperature of a predetermined temperature detection position among the positions within the target region. , performing first temperature control to control the heating unit based on the detected temperature detected by the temperature detection unit as the temperature of the modeling material at the temperature detection position,
The first temperature control is a control that reduces the cooling rate of the modeling material at the temperature detection position.
Temperature control device.

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