JP2023159652A - Temperature control device and heating apparatus - Google Patents

Abstract

To provide a technique capable of controlling a temperature distribution of a workpiece surface.SOLUTION: A temperature control device that is used so as to be arranged between a heat source and a workpiece, and can control a temperature transmitted to a workpiece, comprises a heat flow control part. The heat flow control part contains a sheet-like high heat conduction member with an excellent heat conduction rate to a surface direction. The heat flow control part includes: a first region; and a second region. The first region is a region occupying a predetermined range in a front surface of the heat flow control part. The second region is a region provided so as to surround the circumference of the first region. The first and second regions are constructed so that the heat conduction rate in a thickness direction vertical to at least surface direction is different.SELECTED DRAWING: Figure 1

Description

The present disclosure relates to a temperature control device and a heating device.

It is known that various heaters are used to heat workpieces such as semiconductor wafers. Patent Document 1 discloses a film heater having a structure in which heat diffusion material layers made of metal, graphite, etc. are laminated on both sides of a sheet-like heating element.

In recent years, with the miniaturization of circuit wiring in semiconductors, there has been a demand for uniform temperature distribution on the work surface. Here, as a method of making the temperature distribution on the work surface uniform, for example, there is a method of adjusting the surface temperature by partially manipulating the amount of heat generated by the heater to increase or decrease the amount of heat input. Furthermore, for example, there is a method of physically uniformizing the material of the heater and the workpiece by using high heat conductive materials. Furthermore, for example, there is a method of making the temperature uniform by inserting a separate member having high thermal conductivity, such as a heat pipe, inside the workpiece.

Japanese Patent Application Publication No. 2016-110757

However, with the above method, due to the delay in feedback control for temperature changes on the workpiece surface, it is difficult to stabilize the temperature within a small range of change, or it is difficult to control the temperature so that the workpiece has a temperature distribution that satisfies the target value. Therefore, it is difficult to make fine adjustments to the structure, such as arranging the heating element to suit the workpiece and arranging the heat pipe inside the workpiece.

As described above, with the conventional methods, it may not be possible to achieve a sufficiently uniform temperature distribution, so a new method for making the temperature distribution uniform on the workpiece surface is desired.
One aspect of the present disclosure aims to provide a technique capable of controlling temperature distribution on a workpiece surface.

One aspect of the present disclosure is a temperature control device that is used by being placed between a heat source and a workpiece, and is capable of controlling the temperature transmitted to the workpiece, and includes a heat flow control section. The heat flow control section includes a sheet-shaped high thermal conductive material that has excellent thermal conductivity in the planar direction. The heat flow control section has a first region and a second region. The first region is a region occupying a predetermined range on the surface of the heat flow control section. The second area is an area provided to surround the first area. The first region and the second region are configured to have different thermal conductivities at least in the thickness direction perpendicular to the surface direction.

In such a configuration, the first region and the second region in the heat flow control section have different thermal conductivities in the thickness direction. Thereby, the amount of heat passing through the first region and the second region can be controlled. As a result, the temperature transmitted to the work surface changes in each region, making it possible to control the temperature distribution on the work surface. Therefore, it is easy to obtain a uniform temperature distribution in the surface direction.

In one aspect of the present disclosure, the heat flow control section may have a plurality of through holes in the first region that penetrate the heat flow control section in the thickness direction. In such a configuration, a plurality of through holes that penetrate the heat flow control section in the thickness direction are provided in the first region. That is, the first region of the heat flow control section is provided with a portion where no high thermal conductive material exists in the thickness direction. Therefore, the thermal conductivity in the thickness direction of the first region is lower than the thermal conductivity in the thickness direction of the second region. Here, for example, the first region is an inner region in the plane direction of the heat flow control section, and the second region is an outer region surrounding the second region. In such a configuration, for example, even if the temperature at the center of the workpiece surface is high and the temperature at the end surface side of the workpiece surface tends to be low because heat easily escapes from the end surface of the workpiece, the first By controlling the amount of heat transmitted to the region to be reduced and the amount of heat transmitted to the second region which is the outer region to be increased, it is easy to obtain a uniform temperature distribution in the surface direction.

In one aspect of the present disclosure, the heat flow control section may have a plurality of through holes in the second region that penetrate the heat flow control section in the thickness direction. In such a configuration, the second region is provided with a plurality of through holes that penetrate the heat flow control section in the thickness direction. That is, the second region of the heat flow control section is provided with a portion where no high thermal conductive material exists in the thickness direction. Therefore, the thermal conductivity in the thickness direction of the second region is lower than the thermal conductivity in the thickness direction of the first region. Here, for example, the first region is an inner region in the plane direction of the heat flow control section, and the second region is an outer region surrounding the second region. In such a configuration, for example, even if the temperature on the end surface side of the workpiece surface tends to be higher than the temperature on the central portion of the workpiece surface because heat is difficult to escape from the end surface of the workpiece, the second region which is the outer region By controlling the amount of heat transmitted to the first region, which is the inner region, to reduce the amount of heat transmitted to the first region, it is easy to obtain a uniform temperature distribution in the surface direction.

In one aspect of the present disclosure, the plurality of through holes may have at least one of a circular shape, a polygonal shape, and a droplet shape. According to such a configuration, regardless of whether the shape is circular, polygonal, or drop-shaped, the heat flow transmitted to either the inner region or the outer region where the plurality of through holes are provided is transferred to the other region. It is possible to lower it sufficiently.

In one aspect of the present disclosure, the heat flow control unit may include a material in the first region that has a lower thermal conductivity than the second region. In such a configuration, since the first region includes a material having a lower thermal conductivity than the second region, the thermal conductivity of the first region is lower than that of the second region. Here, for example, the first region is an inner region in the plane direction of the heat flow control section, and the second region is an outer region surrounding the second region. In such a configuration, for example, even if the temperature of the central portion of the workpiece surface is high and the temperature of the end surface of the workpiece surface is likely to be low because heat easily escapes from the end surface of the workpiece, the first region which is the inner region A uniform temperature distribution in the surface direction can be easily obtained by controlling the amount of heat transmitted to the second region, which is the outer region, to be increased by reducing the amount of heat transmitted to the second region.

In one aspect of the present disclosure, the heat flow control unit may include a material in the second region that has a lower thermal conductivity than the first region. In such a configuration, since the second region includes a material whose thermal conductivity is lower than that of the first region, the thermal conductivity of the second region is lower than that of the first region. Here, for example, the first region is an inner region in the plane direction of the heat flow control section, and the second region is an outer region surrounding the second region. In such a configuration, for example, even if the temperature of the end surface of the workpiece surface tends to be higher than the temperature of the central portion of the workpiece surface because heat is difficult to escape from the end surface of the workpiece, the temperature of the end surface of the workpiece surface is likely to be higher than the temperature of the central portion of the workpiece surface. A uniform temperature distribution in the surface direction can be easily obtained by controlling the amount of heat transmitted to be reduced and the amount of heat transmitted to the first region, which is the inner region, to be increased.

One aspect of the present disclosure may further include an auxiliary conductive section and a protective section. The auxiliary conductive part includes a sheet-shaped high thermal conductive material having excellent in-plane thermal conductivity, and is laminated on the heat flow control part. The protection part is laminated on the heat flow control part and the auxiliary conduction part, and protects the heat flow control part and the auxiliary conduction part. According to such a configuration, compared to a configuration in which the temperature control device does not include an auxiliary conductive portion, heat can be more easily diffused in the planar direction. Further, by laminating the protective portion on the heat flow control portion and the auxiliary conduction portion, damage to the heat flow control portion and the auxiliary conduction portion can be suppressed.

One aspect of the present disclosure is a heating device including a heat source and the temperature control device described above. The temperature control device described above is placed superimposed on the heat source. According to such a configuration, there is provided a heating device that can control the temperature distribution on the work surface using the heat source and the temperature control device that can control the heat flow rate passing through the inner region and the outer region. be able to.

FIG. 3 is a side cross-sectional view showing a temperature control device having a heat flow control section and an auxiliary conduction section. It is a figure which shows typically the inner area|region and outer area|region in a heat flow control part. FIG. 3 is a plan view showing a circular heat flow control section having a plurality of through holes. FIG. 2 is a side sectional view showing a heating device in which a heat source and a temperature control device are integrated. FIG. 3 is a diagram schematically showing an experimental mode for verifying heat flow control in a heat flow control section. It is a figure which shows the graph which verified the effect of heat flow control in Z direction. It is a figure which shows the graph which verified the effect of heat flow control in an XY direction. FIG. 3 is a plan view showing a rectangular heat flow control section having a plurality of through holes. FIG. 3 is a plan view showing a square-shaped heat flow control section in which an inner region is provided in a square shape. It is a top view which shows the heat flow control part which has several through-holes with a different shape. FIG. 3 is a side cross-sectional view showing a temperature control device having a heat flow control section whose inner region is a low heat conduction part and whose outer region is made of a high heat conduction material. FIG. 2 is a side cross-sectional view showing a temperature control device having a heat flow control section in which a low thermal conductive material is laminated on a central portion of a high thermal conductive material. FIG. 2 is a side cross-sectional view showing a temperature control device having a heat flow control section. FIG. 2 is a side cross-sectional view showing a heating device in which a temperature control device and a heat source are integrated, each having a heat flow control section, an auxiliary conduction section, and a contact thermal resistance reduction section.

Hereinafter, exemplary embodiments of the present disclosure will be described with reference to the drawings.
[1. composition]
<Temperature control device>
The temperature control device 100 shown in FIG. 1 is used by being placed between a workpiece 200 such as a semiconductor wafer, and a heat source 300 for heating the workpiece 200, and can control the temperature distribution on the surface of the workpiece 200. be. Various types of heaters are used for the heat source 300, such as a film heater, an ET600 high-temperature planar heater, a ceramic heater, and a silicon rubber heater. Further, the heat source 300 may include a plate having a built-in sheathed heater, cartridge heater, or the like. Note that since FIG. 1 schematically represents the structure of the temperature control device 100, the exact arrangement, shape, size ratio, etc. may be different from the actual temperature control device. The same applies to FIG. 4 and FIGS. 11 to 14.

The temperature control device 100 includes a heat flow control section 11, an auxiliary conduction section 12, an adhesive section 13, and a protection section 14. The temperature control device 100 is a laminate in which a heat flow control section 11, an auxiliary conduction section 12, an adhesive section 13, and a protection section 14 are stacked. In addition, the adhesive part 13 and the protection part 14 do not need to be laminated|stacked on the temperature control device.

The heat flow control unit 11 is a member made of a sheet-shaped high thermal conductive material that has excellent thermal conductivity in the planar direction. The sheet shape refers to a shape that spreads wide and thin. The plane direction is a direction along the extent of the flat surface of the sheet shape. As the high thermal conductivity material, for example, metals such as copper, aluminum nitride, and aluminum, and materials with high thermal conductivity such as graphite are used. The heat flow control unit 11 has a first surface 111 and a second surface 112 that is a surface opposite to the first surface 111.

The auxiliary conduction section 12 is laminated on the first surface 111 of the heat flow control section 11 . The auxiliary conductive section 12 is bonded to the heat flow control section 11 via the bonding section 13 .
The auxiliary conductive part 12 is a member made of a sheet-shaped high thermally conductive material that has excellent thermal conductivity in the planar direction. As the highly thermally conductive material, for example, metals such as copper, aluminum nitride, and aluminum, graphite, and the like are used.

The adhesive part 13 and the protection part 14 are laminated on the second surface 112 of the heat flow control part 11 in the order that the protection part 14 is the outermost surface. Further, the adhesive part 13 and the protective part 14 are also laminated on the surface of the auxiliary conductive part 12 opposite to the surface facing the heat flow control part 11 in the order that the protective part 14 is the outermost surface.

The protection section 14 is a sheet-shaped member that protects the second surface 112 of the heat flow control section 11 and the surface of the auxiliary conduction section 12 opposite to the surface facing the heat flow control section 11 side. For example, a sheet made of a polyimide material, a mica sheet, or a silicone resin sheet is used for the protection part 14. The protection part 14 is bonded via the adhesive part 13 to the second surface 112 of the heat flow control part 11 and to the surface of the auxiliary conduction part 12 opposite to the surface facing the heat flow control part 11 side.

As shown in FIG. 2, in this embodiment, the heat flow control section 11 is formed in a circular shape. The heat flow control unit 11 has an inner region B, which is an inner region in the plane direction, and an outer region A, which is an outer region surrounding the inner region B. That is, the heat flow control unit 11 is configured to be divided into two regions, an outer region A and an inner region B.

In this embodiment, the inner region B is a circular region centered on the center point C of the heat flow control section 11. The outer region A is an annular region other than the inner region B in the heat flow control section 11 . The outer region A and the inner region B are configured to have different thermal conductivities at least in the thickness direction perpendicular to the surface direction. Note that the XY directions shown in FIG. 2 are the surface directions, and the Z direction shown in FIG. 2 is the thickness direction.

In the present embodiment, as shown in FIG. 3, the heat flow control section 11 is provided in the inner region B by penetrating the heat flow control section 11 in the thickness direction, that is, through the first surface 111 and the second surface 112. It has a plurality of through holes 113. The portion where the plurality of through holes 113 are provided is a portion where no thermally conductive material is present. In this way, by forming a plurality of through holes 113 and providing a portion where no high thermal conductive material is present, if the inner region B is provided with a heat flow reduction structure that reduces the heat flow, the thickness of the inner region B is reduced. The thermal conductivity is lower than that of the outer region A in the thickness direction. Here, for the thermal conductivity of the inner region B in the thickness direction, for example, the average value of the thermal conductivity in the thickness direction of the entire inner region B in the surface direction is used. Thereby, the heat flow rate passing through the inner region B can be made smaller than the heat flow rate from the heat source 300 passing through the outer region A.

In this embodiment, the plurality of through holes 113 have a circular shape. The plurality of through holes 113 are provided in the inner region B such that the distance between adjacent through holes 113 is narrowed so that the region of the portion of the inner region B where the high thermal conductive material exists is small. Thereby, the thermal conductivity in the thickness direction of the inner region B can be lowered compared to a case where the distance between adjacent through holes 113 is wide. As a result, the thermal conductivity ratio in the thickness direction of the outer region A and the inner region B tends to be high. For example, the plurality of through holes 113 are arranged such that the distance to an adjacent through hole 113 is shorter than the longest width of the through hole 113. In this embodiment, the plurality of through holes 113 are arranged in a staggered manner. Note that the arrangement of the plurality of through holes is not limited to this, and for example, the plurality of through holes may be arranged so as to spread radially around the center point C of the heat flow control section 11. In this embodiment, when the adhesive part 13 is laminated on the heat flow control part 11, the adhesive material that is the material forming the adhesive part 13 partially or completely enters inside the plurality of through holes 113. Even in such a case, the thermal conductivity of the inner region B in the thickness direction is lower than that of the outer region A in the thickness direction. In addition, when the adhesive part 13 is laminated|stacked on the heat flow control part 11, the adhesive material does not need to enter into the inside of the several through-hole 113.

<Heating device>
A heating device 400 shown in FIG. 4 is a device in which a heat source 300 and a temperature control device 100 are integrated. The heating device 400 is placed between the two workpieces 200, and can control the temperature transmitted to the surface of the workpieces 200 to have an arbitrary temperature distribution. Heating device 400 includes a heat source 300 and two temperature control devices 100. The heating device 400 is a stacked body in which temperature control devices 100 are stacked on both sides of a heat source 300, respectively. In other words, the heating device 400 has a configuration in which the heat source 300 is sandwiched between two temperature control devices 100.

In heating device 400, temperature control device 100 is stacked on heat source 300 such that heat flow control section 11 is located outside of auxiliary conduction section 12. That is, the temperature control device 100 is stacked on the heat source 300 such that the auxiliary conductive portion 12 is located on the heat source 300 side. That is, the auxiliary conduction section 12 is arranged between the heat source 300 and the heat flow control section 11. The auxiliary conductive part 12 is adhered to the heat source 300 via the adhesive part 13. Specifically, the temperature control device 100 is bonded to the heat source 300 with the adhesive portion 13 on the auxiliary conductive portion 12 side of the temperature control device 100 that does not have the protection portion 14 exposed. Note that, in the heating device 400, the adhesive portion 13 and the protection portion 14 do not need to be laminated on the second surface 112 side of the heat flow control portion 11. Further, the heating device may have a configuration in which the heat flow control section 11 and the auxiliary conduction section 12 are not provided on one surface of the heat source 300. That is, in the heating device, only the adhesive part 13 and the protection part 14 may be laminated on one surface of the heat source 300.

<Verification results of heat flow control in the heat flow control section>
FIG. 5 schematically shows a verification mode for verifying heat flow control in the heat flow control section 11. In this embodiment, the verification results of heat flow control are based on a simulation using CFD (hereinafter referred to as CFD simulation). CFD is an abbreviation for Computational Fluid Dynamics. The CFD simulation was performed under the conditions that the outside air temperature was 21° C., the heater heat amount was 1500 W, the material of the workpiece 200 was SUS304, and the heater temperature adjustment point was at the center of the upper surface of the workpiece 200. Specifically, the heat flow verification section 110 and the auxiliary conduction section 12 having an outer region A and an inner region B are placed between the workpiece 200 and the heat source 300 to simulate the temperature control device 100. It was configured and verified. The heat flow verification section 110 and the auxiliary conduction section 12 are arranged such that the heat flow verification section 110 is located on the workpiece 200 side and the auxiliary conduction section 12 is located on the heat source 300 side. Note that the heat flow verification section 110 has a structure that corresponds to the heat flow control section 11 in FIG. 6, and has a structure that does not correspond to the heat flow control section 11 in FIG.

FIG. 6 is a graph showing the effect on the temperature uniformity of the work surface when the thermal conductivity in the Z direction of the inner region B is changed in the heat flow verification section 110.
For example, in the heat flow verification unit 110, the thermal conductivity of the outer region A and the inner region B in the XY direction is set to the same 500, and the thermal conductivity ratio of the outer region A and the inner region B in the Z direction is changed, and the surface of the workpiece 200 is The temperature difference between the maximum temperature and the minimum temperature in the directions, that is, the XY directions is compared. Specifically, in the heat flow verification unit 110, the thermal conductivity of the outer region A and the inner region B in the XY direction is set to the same 500, the thermal conductivity of the inner region B in the Z direction is set to 0.5, and the thermal conductivity of the outer region A and the inner region B is set to the same 500. A condition in which the thermal conductivity in the Z direction is 3.84 is defined as verification condition T1. Note that under the verification condition T1, the thermal conductivity of the auxiliary conductive section 12 in the XY direction is 500, and the thermal conductivity in the Z direction is 3.84. In addition, under the conditions substantially constituted only by the auxiliary conductive section 12, that is, in the heat flow verification section 110, the thermal conductivity of the outer region A and the inner region B in the XY direction is the same 500, and the outer region A and the inner region B have the same thermal conductivity of 500. A condition in which the thermal conductivity in the Z direction is the same at 3.84 is defined as a comparison condition T2. Then, the verification condition T1 and the comparison condition T2 were compared.

As shown in FIG. 6, the temperature difference under verification condition T1 in which the thermal conductivity in the Z direction of inner region B is lower than that of outer region A in the Z direction is greater than the temperature difference under comparison condition T2. The result was that it was small. The smaller the temperature difference in the XY directions, the more uniform the temperature distribution on the surface of the workpiece 200 becomes. Therefore, it can be seen that in the heat flow control unit 11, it is desirable that the thermal conductivity of the inner region B in the Z direction is lower than the thermal conductivity of the outer region A in the Z direction. In other words, it can be seen that it is desirable for the heat flow control unit 11 to increase the thermal conductivity ratio between the inner region B and the outer region A in the Z direction.

Further, FIG. 7 is a graph showing the influence on the temperature uniformity of the work surface when the thermal conductivity in the XY directions of the inner region B is changed in the heat flow verification section 110.
For example, in the heat flow verification unit 110, the thermal conductivity of the outer region A and the inner region B in the Z direction is set to the same 3.84, and the thermal conductivity ratio of the outer region A and the inner region B in the XY direction is changed. The temperature difference between the maximum temperature and the minimum temperature in the plane direction, that is, the XY direction is compared. Specifically, in the heat flow verification unit 110, the thermal conductivity in the Z direction of the outer region A and the inner region B is set to the same 3.84, the thermal conductivity of the inner region B in the XY direction is set to 340, and the thermal conductivity of the outer region A and the inner region B in the A condition in which the thermal conductivity in the XY directions is 500 is defined as verification condition T3. Note that under verification condition T3, the thermal conductivity of the auxiliary conductive section 12 in the Z direction is 3.84, and the thermal conductivity in the XY directions is 500. In addition, under the conditions substantially configured only by the auxiliary conductive section 12, that is, in the heat flow verification section 110, the thermal conductivity in the Z direction of the outer region A and the inner region B is set to be the same 3.84, and the outer region A and the inner region A condition in which the thermal conductivity of B in the X and Y directions is the same 500 is defined as comparison condition T4. Then, the verification condition T3 and the comparison condition T4 were compared.

As shown in FIG. 7, the temperature difference under comparison condition T4, in which both the outer region A and the inner region B had high thermal conductivities in the XY directions, was smaller than the temperature difference under verification condition T3. That is, if the thermal conductivity in the surface direction in the inner region B is lowered, the uniformity of the temperature distribution on the surface of the workpiece 200 may be reduced.

From the verification results of FIGS. 6 and 7 described above, in the heat flow control unit 11, the thickness of the outer region A and the inner region B can be changed without changing the thermal conductivity ratio in the surface direction of the outer region A and the inner region B. It can be seen that changing the thermal conductivity in the direction is important for improving the uniformity of the temperature distribution on the surface of the workpiece 200.

[2. effect]
According to the embodiment detailed above, the following effects can be obtained.
(2a) In this embodiment, the outer region A and the inner region B of the heat flow control unit 11 are configured to have different thermal conductivities in the thickness direction. Thereby, the amount of heat passing through the outer region A and the inner region B can be controlled. As a result, the temperature transmitted to the surface of the workpiece 200 changes in each area A and B, so the temperature distribution on the surface of the workpiece 200 can be controlled.

Specifically, a plurality of through holes 113 are provided in the inner region B to penetrate the heat flow control section 11 in the thickness direction. That is, the inner region B of the heat flow control section 11 is provided with a portion in which no high thermal conductive material exists in the thickness direction. As a result, the thermal conductivity of the inner region B in the thickness direction is lower than that of the outer region A in the thickness direction. Therefore, the amount of heat transmitted to the inner region B decreases, and the amount of heat transmitted to the outer region A increases. Therefore, for example, even if the temperature of the center part of the work 200 surface is high and the temperature of the end surface of the work 200 tends to be low because heat easily escapes from the end surface of the work 200, the outside part where heat can easily escape is Since the heat flow transmitted to the region A increases, the temperature difference between the center portion and the end surface side of the workpiece 200 surface can be reduced. As a result, the uniformity of temperature distribution on the surface of the workpiece 200 is improved.

(2b) In this embodiment, the temperature control device 100 includes a heat flow control section 11, an auxiliary conduction section 12, an adhesive section 13, and a protection section 14. In this way, the temperature control device 100 includes the auxiliary conduction section 12 in addition to the heat flow control section 11, thereby making it easier to diffuse heat in the planar direction compared to a configuration in which the temperature control device does not include the auxiliary conduction section. be able to. Furthermore, when the temperature control device 100 is disposed on the heat source 300, by arranging the auxiliary conductive section 12 stacked on the heat flow control section 11 on the heat source 300 side, a plurality of through holes in the inner region B of the heat flow control section 11 can be formed. By arranging the holes 113 directly above the heat source 300, a sudden temperature rise that may occur directly below the plurality of through holes 113 is suppressed. As a result, failure of the temperature control device 100 can be suppressed. That is, the temperature control device 100 can also be used for the heat source 300 that is not insulated.

Furthermore, by stacking the protection part 14 on the heat flow control part 11 and the auxiliary conduction part 12, the heat flow control part 11 and the auxiliary conduction part 12 are not exposed in the temperature control device 100. damage can be suppressed. In addition, since the heat flow control section 11 and the auxiliary conduction section 12 are protected when handling the temperature control device 100 alone, the heat flow control section 11 and the auxiliary conduction section 12, etc., which are made of graphite, which is difficult to handle due to its brittle material, are protected. It can be made easier to handle.
Note that in this embodiment, the inner region B corresponds to an example of the first region, and the outer region A corresponds to an example of the second region.

[3. Other embodiments]
Although the embodiments of the present disclosure have been described above, it goes without saying that the present disclosure is not limited to the above embodiments and can take various forms.

(3a) In the above embodiment, the heat flow control section 11 has a circular configuration, but the shape of the heat flow control section is not limited to this. For example, the heat flow control section 11a shown in FIG. 8 may have a rectangular shape. The heat flow control unit 11a has an inner region B that is a circular region, and an outer region A2 that is a region other than the inner region B in a rectangular sheet, that is, an outer region surrounding the inner region B. A plurality of circular through holes 113 are provided in the inner region B of the heat flow control section 11a.

(3b) In the above embodiment, the inner region B of the heat flow control section 11 is a circular region, but the shape of the inner region of the heat flow control section is not limited to this. For example, as in the heat flow control section 11b shown in FIG. 9, the inner region B3 may be a rectangular region. The heat flow control unit 11b has an inner region B3 which is a rectangular region, and an outer region A3 which is a region other than the inner region B3 in the rectangular sheet, that is, an outer region surrounding the inner region B3. A plurality of circular through holes 113 are provided in the inner region B3 of the heat flow control section 11b.

(3c) In the above embodiment, the configuration in which the plurality of through holes 113 are circular is illustrated, but the shape of the plurality of through holes is not limited to this. For example, the plurality of through holes may have a polygonal shape including a triangle, a rhombus, a quadrangle, or the like, or a droplet shape. According to such a configuration, since the plurality of through holes can take various shapes, it is possible to provide a more preferable shape in accordance with the control of the temperature distribution that satisfies the target value. Note that even when a circular shape, a polygonal shape, or a droplet shape is adopted, the amount of heat transmitted to the inner regions B and B3 can be sufficiently lowered than that to the outer regions A to A3. According to the verification results by CFD simulation, in a region where a plurality of through holes are formed, the thermal conductivity in the thickness direction can be lowered, but the thermal conductivity in the planar direction can also be lowered to a considerable extent. Here, when the plurality of through holes have a drop shape or a diamond shape, the thermal conductivity in the thickness direction can be lowered, and the thermal conductivity in the planar direction can be made less likely to decrease compared to other shapes. I can do it. As a result, when the plurality of through holes have a drop shape or a diamond shape, it is possible to easily improve the uniformity of the temperature distribution on the surface of the workpiece 200.

Further, for example, as in the heat flow control unit 11c shown in FIG. 10, the plurality of through holes 113c may have a combination of various shapes such as a polygon including a triangle, a rhombus, a quadrangle, etc., and a drop shape. The heat flow control unit 11c has an inner region B4 that is a circular region, and an outer region A4 that is a region other than the inner region B4 in a rectangular sheet, that is, an outer region surrounding the inner region B4. In the inner region B4 of the heat flow control section 11c, a plurality of through holes 113c of various shapes are provided in an arrangement such that gaps between the through holes 113c are minimized. According to such a configuration, by arranging the through holes 113c of various shapes so as to fill the gaps, it is possible to provide many portions in the inner region B4 where no high thermal conductive material exists, and as a result, the inner region B4 tends to have low thermal conductivity.

(3d) In the above embodiment, a plurality of through holes 113 are provided in the inner region B of the heat flow control section 11 so that the outer region A and the inner region B have different thermal conductivities in the thickness direction. An example of a configuration with a heat flow reduction structure is illustrated. However, the configuration in which the heat flow reducing structure is provided in the inner region of the heat flow control section is not limited to this.

For example, like the temperature control device 100d shown in FIG. 11, the inner region B5 may include a heat flow control section 11d containing a material having a lower thermal conductivity than the outer region A5. In the heat flow control section 11d, the outer region A5 is made of a sheet-shaped high heat conductive material having excellent in-plane thermal conductivity, and the inner region B5 is made of a material having a lower thermal conductivity than the high heat conductive material. That is, the heat flow control section 11d is formed by fitting a sheet-shaped low thermal conductivity section 15 made of a material with a lower thermal conductivity than the high thermal conductivity material into a hollowed-out central portion of the high thermal conductivity material. For example, a resin sheet, a polyimide sheet, a rubber sheet, a silicone sheet, etc. are used as the material having a lower thermal conductivity than the high thermal conductive material. In such a configuration, since the inner region B5 includes a material whose thermal conductivity is lower than that of the outer region A5, the thermal conductivity of the inner region B5 is lower than that of the outer region A5. Therefore, for example, even if the temperature of the central part of the workpiece 200 surface is high and the temperature of the end surface of the workpiece 200 is likely to be low because heat easily escapes from the end surface of the workpiece 200, the amount of heat transmitted to the inner region B5 is reduced and By controlling to increase the amount of heat transmitted to the area A5, it is easy to obtain a uniform temperature distribution in the surface direction.

Further, for example, as in a temperature control device 100e shown in FIG. 12, a heat flow control section 11e configured of a high thermal conductivity material 111e and a low thermal conductivity material 112e laminated only in the central region of the high thermal conductivity material 111e. may be provided. In this way, if the low thermal conductive material 112e is placed only in the center, the central portion of the high thermal conductive material 111e will sink, and the low thermal conductive material 112e will be surrounded by the high thermal conductive material 111e, as in the heat flow control section 11e shown in FIG. It can become a state of being exposed. Note that the heat flow control units 11d and 11e have the same effects as the heat flow control unit 11 of the above embodiment.

(3e) In the above embodiment, the heat flow control section 11 has the heat flow reduction structure in the inner region B, but the region of the heat flow reduction structure provided in the heat flow control section is not limited to the inner region. do not have. For example, the heat flow control section may have a structure in which the inner region does not have a heat flow reduction structure, and the outer region has a heat flow reduction structure. Specifically, for example, the heat flow control section may have a plurality of through holes in the outer region that penetrate the heat flow control section in the thickness direction. Also, for example, the heat flow control section may include a material in the outer region that has a lower thermal conductivity than the inner region. Even in such a configuration, the inner region and the outer region are configured to have different thermal conductivities at least in the thickness direction. In this case, the thermal conductivity in the thickness direction of the outer region is lower than the thermal conductivity in the thickness direction of the inner region. Therefore, the amount of heat transferred to the outer region is reduced and the amount of heat transferred to the inner region is increased. Therefore, for example, even if the temperature on the end surface side of the workpiece 200 is likely to be higher than the temperature at the center portion of the workpiece 200 surface because heat is difficult to escape from the end surface of the workpiece 200, the outside part where heat is difficult to escape is Since the heat flow transmitted to the region is reduced, the temperature difference between the center portion and the end surface side of the workpiece 200 surface can be reduced. As a result, the uniformity of temperature distribution on the surface of the workpiece 200 is improved.

(3f) In the above embodiment, the temperature control device 100 has a configuration in which the auxiliary conduction portion 12 is laminated on the heat flow control portion 11, but the configuration of the temperature control device is not limited to this.
For example, the temperature control device 100f shown in FIG. 13 may have a configuration that does not include the auxiliary conduction section 12. The temperature control device 100f includes a heat flow control section 11 and a protection section 14 bonded to both surfaces of the heat flow control section 11 via an adhesive section 13.

(3g) In the above embodiment, the heating device 400 has a structure in which the temperature control device 100 having the protection portion 14 for suppressing damage to the heat flow control portion 11 is laminated on each of both sides of the heat source 300. However, the configuration of the heating device is not limited to this. For example, like a heating device 400a shown in FIG. 14, a temperature control device 100g having a workpiece contact portion 16 may be stacked on each of both sides of the heat source 300. The workpiece contact portion 16 can reduce the contact thermal resistance between the temperature control device 100g and the workpiece 200, which may adversely affect the temperature distribution on the surface of the workpiece 200. The temperature control device 100g includes a heat flow control section 11, an auxiliary conduction section 12, an adhesive section 13, and a workpiece contact section 16. The work contact portion 16 is bonded to the second surface 112 of the heat flow control portion 11 via the bonding portion 13 so as to be located on the outermost surface of the temperature control device 100g. The workpiece contact portion 16 is a member made of TIM. TIM is an abbreviation for Thermal Interface Material. The TIM is made of silicone resin, graphite, etc., for example. Since the workpiece contacting part 16 is arranged on the outermost surface, when it comes into contact with the workpiece 200, the workpiece contacting part 16 sinks and can absorb the influence of machining on the surface of the workpiece 200. As a result, the workpiece The contact thermal resistance with the 200 surface is reduced. By reducing the contact thermal resistance with the surface of the workpiece 200, it becomes easier to make the temperature distribution on the surface of the workpiece 200 more uniform.

(3h) In the above embodiment, the inner region B is a circular region centered on the center point C of the heat flow control section 11, but the position where the inner region in the heat flow control section is arranged is as follows. It is not limited. For example, the inner region may be located offset from the center point of the heat flow control section. Further, in the above embodiment, the heat flow control section 11 is divided into two regions, the outer region A and the inner region B, but the structure of the heat flow control section is not limited to this. For example, the heat flow control unit may be configured to be divided into three or more regions, such as having a plurality of first regions and a plurality of second regions. The first region is a region occupying a predetermined range on the surface of the heat flow control section. The second area is an area provided to surround the first area. The heat flow control unit may be placed at any position within the range where the plurality of first regions are surrounded by the second regions, for example. Even in the case of such a configuration, either one of the first region and the second region may have a plurality of through holes. Further, the first region may include a material having a lower thermal conductivity than the second region, and the second region may include a material having a lower thermal conductivity than the first region. Further, for example, the first region may be configured to have a temperature gradient from the inside to the outside or from the outside to the inside, or to have a difference in thermal conductivity even within the range of the first region. Further, for example, the heat flow control unit may be configured to include, in addition to the first region and the second region, a third region and a fourth region surrounding the third region. The heat flow control unit is configured to realize a plurality of different heat flow controls so that the third region and the fourth region have a different thermal conductivity difference from the first region and the second region. Good too.

(3i) The function of one component in the above embodiment may be distributed as multiple components, or the functions of multiple components may be integrated into one component. Further, a part of the configuration of the above embodiment may be omitted. Further, at least a part of the configuration of the above embodiment may be added to, replaced with, etc. in the configuration of other embodiments. Note that all aspects included in the technical idea specified from the words in the claims are embodiments of the present disclosure.

[Technical idea disclosed in this specification]
[Item 1]
A temperature control device that is used by being placed between a heat source and a workpiece, and is capable of controlling the temperature transmitted to the workpiece,
Equipped with a heat flow control section containing a sheet-shaped high thermal conductive material with excellent thermal conductivity in the plane direction,
The heat flow control section has a first region occupying a predetermined range on the surface of the heat flow control section, and a second region provided so as to surround the first region,
The first region and the second region are configured to have different thermal conductivities at least in a thickness direction perpendicular to the surface direction.

[Item 2]
The temperature control device according to item 1,
The heat flow control section is a temperature control device, wherein the heat flow control section has a plurality of through holes in the first region that penetrate the heat flow control section in the thickness direction.

[Item 3]
The temperature control device according to item 1,
The heat flow control section is a temperature control device, wherein the heat flow control section has a plurality of through holes in the second region that penetrate the heat flow control section in the thickness direction.

[Item 4]
The temperature control device according to item 2 or item 3,
In the temperature control device, the plurality of through holes have at least one of a circular shape, a polygonal shape, and a droplet shape.

[Item 5]
The temperature control device according to item 1,
The heat flow control unit is a temperature control device, wherein the first region includes a material whose thermal conductivity is lower than that of the second region.

[Item 6]
The temperature control device according to item 1,
The heat flow control unit is a temperature control device, wherein the second region includes a material having a lower thermal conductivity than the first region.

[Item 7]
The temperature control device according to any one of items 1 to 6,
an auxiliary conductive part laminated on the heat flow control part, the auxiliary conductive part including a sheet-shaped high thermal conductive material having excellent thermal conductivity in the in-plane direction;
a protection part that is laminated on the heat flow control part and the auxiliary conduction part and protects the heat flow control part and the auxiliary conduction part;
A temperature control device further comprising:

[Item 8]
A heating device,
heat source and
The temperature control device according to any one of items 1 to 7, which is arranged to overlap the heat source;
A heating device comprising:

11, 11a to 11e... Heat flow control part, 12... Auxiliary conduction part, 13... Adhesive part, 14... Protection part, 15... Low thermal conduction part, 16... Work contact part, 100, 100d to 100g... Temperature control device, 110 ...Heat flow verification section, 111...First surface, 112...Second surface, 113, 113c...Through hole, 200...Workpiece, 300...Heat source, 400, 400a...Heating device, A, A2 to A5...Outer area, B, B3 to B5...Inner region, C...Center point, T1, T3...Verification conditions, T2, T4...Comparison conditions.

Claims (8)

A temperature control device that is used by being placed between a heat source and a workpiece, and is capable of controlling the temperature transmitted to the workpiece,
Equipped with a heat flow control section containing a sheet-shaped high thermal conductive material with excellent thermal conductivity in the plane direction,
The heat flow control section has a first region occupying a predetermined range on the surface of the heat flow control section, and a second region provided so as to surround the first region,
The first region and the second region are configured to have different thermal conductivities at least in a thickness direction perpendicular to the surface direction. The temperature control device according to claim 1,
The heat flow control section is a temperature control device, wherein the heat flow control section has a plurality of through holes in the first region that penetrate the heat flow control section in the thickness direction. The temperature control device according to claim 1,
The heat flow control section is a temperature control device, wherein the heat flow control section has a plurality of through holes in the second region that penetrate the heat flow control section in the thickness direction. The temperature control device according to claim 2 or 3,
In the temperature control device, the plurality of through holes have at least one of a circular shape, a polygonal shape, and a droplet shape. The temperature control device according to claim 1,
The heat flow control unit is a temperature control device, wherein the first region includes a material whose thermal conductivity is lower than that of the second region. The temperature control device according to claim 1,
The heat flow control unit is a temperature control device, wherein the second region includes a material having a lower thermal conductivity than the first region. The temperature control device according to any one of claims 1, 2, 3, 5 and 6,
an auxiliary conductive part laminated on the heat flow control part, the auxiliary conductive part including a sheet-shaped high thermal conductive material having excellent thermal conductivity in the in-plane direction;
a protection part that is laminated on the heat flow control part and the auxiliary conduction part and protects the heat flow control part and the auxiliary conduction part;
A temperature control device further comprising: A heating device,
heat source and
The temperature control device according to any one of claims 1, 2, 3, 5, and 6, which is arranged to overlap the heat source;
A heating device comprising: