JP2023152238A - Liquid discharge head and liquid discharge device - Google Patents

Abstract

To suitably achieve both of damper performance and liquid flow rate, and suppress cross talk.SOLUTION: A liquid discharge head comprises: a discharge port row in which discharge ports are arranged; a plurality of pressure chambers which communicate the discharge ports, and respectively correspond to a plurality of discharge ports; an individual supply passage and an individual recovery channel that communicate with the pressure chamber; a common supply passage which communicates with a face of the individual supply passage on a side opposite to a face thereof communicating with the pressure chamber; a common recover channel which communicates with a face of the individual recovery channel on a side opposite to a face thereof communicating with the pressure chamber; and a damper member which forms a wall surface of a part of a channel in the common recovery channel. A wall surface of a part of a passage in the common supply passage is not formed by the dumper member. The common supply passage and the common recovery channel are so formed as to extend in a first direction along the discharge port row, and the common supply passage and the common recovery channel are arranged in a second direction crossing the discharge port row.SELECTED DRAWING: Figure 3

Description

The present disclosure relates to a liquid ejection head and a liquid ejection device.

In a liquid ejection head that ejects liquid, pressure fluctuations occur as the liquid is ejected, and this pressure fluctuation propagates to other pressure chambers via the liquid flow path, causing a phenomenon called crosstalk that affects ejection characteristics. be. Crosstalk can cause fluctuations in ejection speed or amount, which can adversely affect images.

As a method for suppressing such crosstalk, a configuration is known in which pressure is absorbed by providing a damper in the liquid flow path. In order to obtain a sufficient effect of suppressing crosstalk, it is necessary to provide a sufficiently wide damper area. On the other hand, in recent years, liquid ejection heads are required to have higher density ejection ports in order to obtain high image quality. The more densely the discharge ports are arranged, the greater the influence of crosstalk becomes, and a wider damper area is required.

Patent Document 1 describes a liquid ejection head in which ejection ports are arranged in the longitudinal direction of a substrate to form a row of ejection ports. Further, a rectangular pressure chamber is provided corresponding to each discharge port. An individual supply channel and an individual recovery channel are arranged in the pressure chamber, and the individual supply channel and the individual recovery channel communicate with a branch of the common supply channel and a branch of the common recovery channel. . In Patent Document 1, the tributary of the common supply channel and the tributary of the common recovery channel extend in the lateral direction of the substrate. Further, the tributaries of the common supply channel and the tributaries of the common recovery channel are arranged alternately in the longitudinal direction of the substrate where the discharge port array extends. In Patent Document 1, a wall surface of a portion of each of these tributaries acts as a damper to absorb pressure from a pressure chamber and suppress crosstalk.

Japanese Patent Application Publication No. 2019-155909

In the configuration described in Patent Document 1, the length of the damper is defined by the transverse direction of the substrate, so there is a problem that a sufficient damper effect cannot be obtained and the effect of suppressing crosstalk is low. In Patent Document 1, if the tributaries of each common flow path are lengthened to lengthen the width direction of the substrate in order to obtain a damper effect, the pressure loss of the tributaries of each common flow path increases, and there is a risk that ink may not be properly supplied. There is. Furthermore, in Patent Document 1, since the dampers are arranged in both the tributaries of the common supply flow path and the tributaries of the common recovery flow path, the width of each damper is narrow, and a sufficient damper effect cannot be obtained. .

The present disclosure aims to appropriately balance damper performance and liquid flow rate and suppress crosstalk.

A liquid ejection head according to an aspect of the present disclosure includes an ejection port that ejects a liquid, an ejection port row in which a plurality of ejection ports are lined up, and a pressure chamber communicating with the ejection port, and a pressure chamber that communicates with the plurality of ejection ports. a plurality of pressure chambers corresponding to each other, a plurality of individual supply channels communicating with the pressure chambers and respectively corresponding to the plurality of pressure chambers, and an individual recovery channel communicating with the pressure chambers; a plurality of individual recovery channels, each of which corresponds to the plurality of pressure chambers, and a common supply channel that communicates with a surface of the individual supply channels that is opposite to a surface that communicates with the pressure chamber; a common supply channel that communicates with the plurality of individual supply channels; and a common recovery channel that communicates with a surface of the individual recovery channel that is opposite to the surface that communicates with the pressure chamber, A common recovery channel that communicates with the individual recovery channels, and a damper member that forms a part of the wall surface of the channel in the common recovery channel, and the wall surface of the part of the channel in the common supply channel is The common supply channel and the common recovery channel are not formed by a damper member, and are formed to extend in a first direction along the discharge port row, and the common supply channel and the common recovery channel are arranged in a second direction intersecting the ejection port array.

According to the present disclosure, it is possible to appropriately achieve both damper performance and liquid flow rate, and to suppress crosstalk.

FIG. 1 is a diagram schematically showing a recording device. FIG. 3 is a diagram illustrating a liquid ejection head. FIG. 3 is a diagram illustrating a liquid ejection substrate. FIG. 3 is a plan view illustrating a flow path portion of the liquid ejection substrate. FIG. 3 is a diagram showing a cross section near the discharge port. FIG. 3 is a diagram showing a cross section near the discharge port. FIG. 3 is a diagram showing a cross section near the discharge port. FIG. 3 is a diagram showing a cross section near the discharge port. FIG. 3 is a diagram showing a cross section near the discharge port.

Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the subject matter of the present disclosure, and not all combinations of features described in the following embodiments are essential to the solution of the present disclosure.

<<First embodiment>>
Hereinafter, a liquid ejection head and a liquid ejection apparatus according to the present embodiment will be described with reference to the drawings. In this embodiment, a liquid ejection head that ejects ink and an inkjet recording apparatus will be described as an example, but the present invention is not limited to this example. The liquid ejection head and liquid ejection device of the present disclosure are applicable to devices such as printers, copiers, facsimiles with communication systems, word processors with printer sections, and industrial recording devices that are combined with various processing devices. . For example, it can be used for biochip production or electronic circuit printing. Furthermore, the liquid to be ejected is not limited to ink.

<Overview of recording device>
FIG. 1 is a diagram schematically showing a recording apparatus 101, which is an example of a liquid ejection apparatus according to the present embodiment. The recording apparatus 101 in FIG. 1 includes a one-pass type liquid ejection head module 1 (hereinafter referred to as liquid ejection head 1) that moves the print medium 111 at once and records an image on the print medium 111. In the liquid ejection head 1, ejection ports (also referred to as nozzles) are arranged across a side corresponding to the entire width of the recording medium 111. The liquid ejection head 1 of this embodiment is a head that supports four colors: cyan (C), magenta (M), yellow (Y), and black (K). More specifically, the liquid ejection head 1 includes liquid ejection heads 1Ca and 1Cb that are compatible with cyan (C) ink, and liquid ejection heads 1Ma and 1Mb that are compatible with magenta (M) ink. Further, the liquid ejection head 1 includes liquid ejection heads 1Ya and 1Yb corresponding to yellow (Y) ink, and liquid ejection heads 1Ka and 1Kb corresponding to black (K) ink. The recording medium 111 is conveyed in the direction of arrow A by the conveyance section 110, and recording is performed by the liquid ejection head 1. Note that the recording apparatus 101 shown in FIG. 1 is merely an example, and may be configured to be able to mount any type of liquid ejection head 1. For example, the recording apparatus 101 may have only one type of liquid ejection head, or may have many types of liquid ejection heads other than four types.

<Configuration of liquid ejection head>
FIG. 2 is a diagram illustrating the liquid ejection head 1 in this embodiment. FIG. 2A is a perspective view of the liquid ejection head 1 for one arbitrary color among those shown in FIG. The liquid ejection head 1 has a head main body 4 . A plurality of liquid ejection substrates 2 are arranged in the head main body 4 (in this figure, four liquid ejection substrates 2 are arranged). Each liquid discharge substrate 2 is provided with a plurality of discharge ports 3. Ink ejected from the liquid ejection head 1 is supplied from an ink tank (not shown) to the liquid ejection substrate 2 via a common supply port (not shown) of the head main body 4. The liquid ejection substrate 2 is arranged such that the ends of the ejection ports 3 arranged in the X direction overlap in the Y direction. By arranging the liquid ejection substrate 2 in this manner, it is possible to realize recording using a long ejection port array.

FIG. 2(b) is a diagram of the liquid discharge substrate 2 viewed from the discharge port 3 side. FIG. 2(c) is a diagram of the liquid ejection substrate 2 viewed from the side opposite to the ejection port 3 surface. The liquid ejection substrate 2 is configured using a plurality of substrates. As shown in FIG. 2(b), the liquid ejection substrate 2 includes an ejection port forming substrate 201. Discharge ports 3 are formed in the discharge port forming substrate 201, and a plurality of discharge ports 3 are arranged along the longitudinal direction (X direction, first direction) of the liquid discharge substrate 2 (discharge port forming substrate 201). , forming a discharge port array. Further, in the discharge port forming substrate 201, a discharge port array extending in the longitudinal direction of the substrate is arranged in a direction that intersects the direction along the discharge port array, that is, in the transverse direction of the substrate (Y direction, second direction). ) are located in multiple locations. As shown in FIG. 2(c), a channel forming substrate 204 is provided on the surface of the liquid ejection substrate 2 opposite to the surface on which the ejection ports 3 are formed. A plurality of connection channels 15 are formed in the channel forming substrate 204 . The liquid ejection head 1 of this embodiment is configured so that ink circulates. Ink is supplied to the liquid ejection substrate 2 and liquid is collected from the liquid ejection substrate 2 via the connection flow path 15 formed in the flow path forming substrate 204 . The ink supplied to the liquid ejection substrate 2 passes through a flow path inside the substrate, and is ejected from the ejection ports 3 and applied to the recording medium 111 . Further, an electric board (not shown) for supplying power and signals necessary for ejecting the ejection port 3 is arranged in the head main body 4, and the terminal 10 of each liquid ejection board 2 and the wiring ( (not shown). Note that the example described in FIG. 2 is also only an example of the present embodiment, and the liquid ejection head 1 can be configured in any form.

<Configuration of liquid ejection substrate>
FIG. 3 is a diagram illustrating the liquid ejection substrate 2 of this embodiment. FIG. 3(a) is a diagram showing a cross-sectional view taken along line IIIA-IIIA in FIG. 2(b). FIG. 3(b) is an enlarged view of the vicinity of the discharge port in FIG. 3(a).

The liquid ejection substrate 2 of this embodiment is formed of a laminated structure of a plurality of substrates, as shown in FIG. 3(a). Specifically, the liquid ejection substrate 2 includes five substrates: an ejection port forming substrate 201, a vibration substrate 202, a liquid supply substrate 203, a channel forming substrate 204, and a damper substrate 302. The liquid discharge substrate 2 is formed by bonding a damper substrate 302 having a damper member 300 between the flow path forming substrate 204 and the liquid supply substrate 203.

This will be explained in more detail using FIG. 3(b). A pressure chamber 5 communicating with the discharge port 3 is formed in the liquid discharge substrate 2 . Each pressure chamber 5 is formed for each discharge port 3 . Further, a piezoelectric element 6 is provided on a deformable wall surface of each pressure chamber 5, which is made up of a vibrating substrate 202. The piezoelectric element 6 pressurizes the liquid in the pressure chamber 5 by deforming the vibrating substrate 202, thereby allowing ink to be ejected from the ejection port 3.

In the liquid supply substrate 203, individual supply channels 7 and individual recovery channels 8, each communicating with the pressure chambers 5, are formed corresponding to each pressure chamber 5. Ink is supplied to the pressure chamber 5 from the individual supply channel 7 and is discharged from the discharge port 3. Further, some of the ink can flow from the pressure chamber 5 to the individual recovery channel 8 . The plurality of individual supply channels 7 communicate with a first common supply channel 17 formed in the damper substrate 302. The plurality of individual recovery channels 8 communicate with a first common recovery channel 18 formed in the damper substrate 302. A wall surface of the first common recovery channel 18 facing the individual recovery channel 8 is formed by a damper member 300 . A damper region 301 is provided at a position facing the individual recovery channel 8 . The damper region 301 is a region of the wall surface where the damper member 300 is formed, and is a region forming a recessed space provided in the flow path forming substrate 204. When pressure fluctuation occurs, the damper member 300 can absorb the pressure using the recess space provided in the flow path forming substrate 204. The first common supply channel 17 and the first common recovery channel 18 extend in the longitudinal direction of the liquid discharge substrate 2 . In addition, a plurality of first common supply channels 17 and first common recovery channels 18 are formed in the lateral direction of the liquid ejection substrate 2 so as to be arranged alternately.

The first common supply channel 17 communicates with a second common supply channel 27 formed in the channel forming substrate 204. A plurality of connection channels 15 are formed in the second common supply channel 27 . Ink is supplied from the outside of the liquid ejection substrate 2 via this connection channel 15 . The first common recovery channel 18 communicates with a second common recovery channel 28 formed in the channel forming substrate 204. A plurality of connection channels 15 are formed in the second common recovery channel 28 . Ink is collected to the outside of the liquid ejection substrate 2 via this connection channel 15 . The second common supply channel 27 and the second common recovery channel 28 extend in the longitudinal direction of the liquid discharge substrate 2 . Further, a plurality of second common supply channels 27 and second common recovery channels 28 are formed in a plurality of rows in the lateral direction of the liquid ejection substrate 2 so as to be arranged alternately. As shown in FIG. 3, the first common supply channel 17 and the second common supply channel 27 form a common supply channel. Similarly, the first common recovery channel 18 and the second common recovery channel 28 together form a common recovery channel.

The discharge port forming substrate 201, the vibration substrate 202, the liquid supply substrate 203, the flow path forming substrate 204, and the damper substrate 302 can each be formed of a silicon substrate or the like. Furthermore, in this embodiment, an example in which each of the substrates is a separate substrate has been described, but the present invention is not limited to separate substrates. The damper member 300 is made of an elastic material, and may be made of a resin material such as polyimide or polyamide. A method for forming the opening in the damper member 300 includes dry etching. Furthermore, if the damper member is made of photosensitive resin, it may be patterned by exposure.

In this way, the liquid discharge substrate 2 includes a first substrate (discharge port forming substrate 201) forming the discharge ports 3, a second substrate (vibrating substrate 202) forming the pressure chambers 5, and individual supply channels. 7 and a third substrate (liquid supply substrate 203) forming the individual recovery channels 8. Further, a fourth substrate (damper substrate 302) that includes a damper member 300 and forms the first common supply channel 17 and the first common recovery channel 18, and the second common supply channel 27 and the second common recovery channel It has a fifth substrate (channel forming substrate 204) that forms the channel 28. Each substrate includes a first substrate (discharge port forming substrate 201), a second substrate (vibration substrate 202), a third substrate (liquid supply substrate 203), a fourth substrate (damper substrate 302), and a fourth substrate (damper substrate 302). Five substrates (channel forming substrates 204) are stacked in this order.

Further, the flow path forming substrate 204 has a first surface that is laminated on the damper substrate 302, and a second surface that is the opposite surface to the first surface. The flow path forming substrate 204 has a through hole (connection flow path 15 portion) that penetrates the first surface and the second surface. Further, the flow path forming substrate 204 has a recessed portion functioning as a damper region 301 formed on the first surface side. The through holes and the recesses are arranged alternately in the lateral direction (Y direction) of the liquid ejection substrate 2.

<Discharge port arrangement and damper arrangement>
FIG. 4 is a plan view illustrating the flow path portion of the liquid discharge substrate 2. As shown in FIG. FIG. 4(a) is a plan view showing a comparative example. FIG. 4(b) is a plan view in this embodiment. FIG. 4 shows an excerpt of a part of the liquid ejection substrate 2. As shown in FIG. The longitudinal direction of the liquid ejection substrate 2 is the left-right direction (X direction) on the paper surface. The lateral direction of the liquid ejection substrate 2 is the vertical direction (Y direction) on the paper surface. As shown in FIG. 4, a plurality of ejection ports 3 are arranged along the longitudinal direction of the liquid ejection substrate 2, which is the X direction, and form an ejection port array. Further, a plurality of ejection port arrays formed in this manner are provided in the lateral direction (Y direction) of the liquid ejection substrate 2.

FIG. 5 is a diagram showing a cross section near the discharge port 3 in this embodiment. FIG. 5(a) is a plan view showing a comparative example. FIG. 5(b) is a plan view in this embodiment. That is, FIG. 5(a) is a diagram showing a cross section taken along the line VA--VA in FIG. 4(a). FIG. 5(b) is a diagram showing a cross section taken along the line VB-VB in FIG. 4(b). As shown in FIG. 5, a partition 16 formed by the damper substrate 302 is provided between the first common supply channel 17 and the first common recovery channel 18 of the damper substrate 302. The partition wall 16 of the damper substrate 302 is bonded to the liquid supply substrate 203 with an adhesive layer 19.

As shown in FIGS. 4 and 3, the second common supply channel 27 and the second common recovery channel 28 extend in the direction along the discharge port array (that is, in the longitudinal direction of the liquid discharge substrate 2). It is formed. Each individual supply channel 7 communicating with each pressure chamber 5 communicates with a second common supply channel 27 via a first common supply channel 17 . Further, each individual recovery channel 8 communicating with each pressure chamber 5 communicates with a second common recovery channel 28 via a first common recovery channel 18 . Since the second common supply channel 27 and the second common recovery channel 28 are formed to extend in the direction along the discharge port row, the pressure chamber 5 corresponding to each discharge port 3 is The ejection port rows can be formed adjacent to each other in the direction. Therefore, in the liquid ejection substrate 2 of this embodiment, the ejection ports 3 can be arranged with high density.

For example, in both FIGS. 4(a) and 4(b), the length of the pressure chamber 5 in the transverse direction (X direction in the figure) is 110 μm, and the pressure chamber 5 and the discharge port 3 are connected at intervals of 150 dpi. It is arranged as an exit row. By arranging the ejection port arrays in four rows and shifting them in the longitudinal direction of the pressure chamber 5 (the Y direction in the figure), a high ejection port density of 600 dpi can be achieved with respect to the recording medium. In this embodiment, 600 dpi is achieved by arranging four ejection port arrays, but a configuration may be adopted in which eight ejection port arrays are arranged to achieve 1200 dpi.

Here, when the discharge ports 3 are arranged at such a high density, pressure fluctuations in each pressure chamber 5 are transmitted to other pressure chambers 5, which may cause crosstalk that affects the discharge characteristics. Therefore, in this embodiment, a damper is provided on a wall surface extending in the direction along the ejection port array, which is the X direction. More specifically, in the first common recovery channel 18 extending in the longitudinal direction of the liquid discharge substrate 2, a damper region 301 is provided on a wall surface extending in the longitudinal direction. As a result, the damper area 301 can be increased compared to the case where the damper area is provided in the transverse direction of the substrate, and pressure can be sufficiently absorbed. In addition, by arranging the damper region 301 on the wall surface of the first common recovery channel 18 and not disposing the damper region in the first common supply channel 17, it is possible to A sufficient width of the damper can be secured.

<Reason for providing the damper area only in one flow path>
Next, the reason why the damper region 301 is provided only in one side of the common flow path in this embodiment will be explained with reference to comparative examples shown in FIGS. 4(a) and 5(a), and FIGS. 4(b) and 5(b). ) will be explained using an example of this embodiment shown in FIG. The comparative example is an example in which damper regions 301 are provided in both the first common supply channel 17 and the first common recovery channel 18. The example of this embodiment is an example in which the damper region 301 is provided only in one of the first common supply channel 17 and the first common recovery channel 18, for example, only in the first common recovery channel 18.

As shown in the comparative example of FIG. 4(a), when the damper region 301 is arranged in both the first common supply channel 17 and the first common recovery channel 18, the interval between the discharge port arrays is set to 1000 μm. Assume a case. Then, assuming that the width of each damper region 301 in the discharge port row arrangement direction (Y direction in the figure) is approximately 500 μm, and the width of the second common supply channel 27 and the second common recovery channel 28 is approximately 300 μm, each flow A partition wall 16 of 100 μm between the paths can be secured.

On the other hand, as in the example of this embodiment shown in FIG. 4(b), a damper area 301 is provided only in the first common recovery channel 18, and the interval between the discharge port arrays is set to 1000 μm as in FIG. 4(a). Assume that The width of the first common recovery channel 18 is 1200 μm, the width of the damper region 301 in the discharge port array arrangement direction is approximately 800 μm, the width of the second common recovery channel 28 is approximately 300 μm, the first common supply channel 17 and the second The width of the common supply channel 27 is 500 μm. Then, the partition wall between each channel can be ensured to be 100 μm as in FIG. 4(a).

The wider the damper width, the smaller the compliance and the easier it is to bend. Therefore, by widening the damper width as in this embodiment, it is possible to form a damper film (damper region 301) with high damper performance and high reliability by increasing the rigidity of the damper film. Furthermore, the wider the channel width, the smaller the pressure loss, and the more stably the ink can be supplied to the pressure chambers 5. In particular, when the circulating flow rate is large, the influence of pressure loss is large, and it is better to make the channel width of the second common supply channel 27 as wide as possible to stably supply ink to the pressure chamber 5. preferable. In this way, by installing the damper region 301 only in one of the common recovery channel and the common supply channel, it becomes possible to widen the width of the damper region 301 and the width of the common channel. In particular, stable supply of ink to the pressure chambers 5 can be realized by making the width of the common supply channel wider than the width of the common recovery channel.

It should be noted that if an attempt is made to simply widen the damper width and the flow path width, problems such as an increase in the substrate size will occur, which is not preferable. Further, when attaching the damper member 300 to the damper substrate 302 to form the damper region 301, a bonding allowance for bonding the damper substrate 302 and the flow path forming substrate 204 is required for each damper region 301. That is, as the number of damper regions 301 increases, the area for pasting increases, and as a result, there is a possibility that a sufficient damper width and each channel width may not be secured. In this embodiment, by providing the damper region 301 only in the common flow path on one side, the number of damper regions 301 can be reduced, and sufficient damper width and flow path width can be ensured.

In this embodiment, an example in which the damper region 301 is provided in the first common recovery flow path 18 has been described, but a configuration in which the damper region 301 is provided in the first common supply flow path 17 may be adopted. FIG. 8 is a diagram showing an example in which a damper region 301 is provided in the first common supply channel 17. As shown in FIG. 8, even if the damper region 301 is provided only on the common supply channel side, a sufficient damper width can be ensured, so crosstalk can be suppressed. In either case, by providing the damper region 301 only in one common flow path, sufficient damper width and flow path width can be ensured.

In this embodiment, the width of the first common supply channel 17 and the first common recovery channel 18, which communicate with the individual channels, is wider in the first common recovery channel 18. Therefore, the damper region 301 is provided only in the first common recovery channel 18 on the side where the channel width is wide. In addition, in this embodiment, as explained in the example of FIG.4(b) and FIG.5(b), the width of the second common supply channel 27 is wider than the width of the second common recovery channel 28. has been explained, but it is not limited to this. The width of the second common supply channel 27 may be the same as the width of the second common recovery channel 28, or may be narrower than the width of the second common recovery channel 28.

In addition, as shown in FIG. 8, as a modification, the width of the first common supply channel 17 and the first common recovery channel 18 communicating with the individual channels is smaller than that of the first common supply channel 17. may be wide. In this case, the damper region 301 may be provided only in the first common supply channel 17 on the side with a wider channel width. In this case as well, the width of the second common supply channel 27 may be wider than the width of the second common recovery channel 28, may be the same as the second common recovery channel 28, or may be the same as the second common recovery channel 28. It may be narrower than the width of the two common recovery channels 28.

As described above, the liquid ejection head 1 of this embodiment is provided with a plurality of first common supply channels 17 and a plurality of first common recovery channels 18. As described above, in this embodiment, an example has been described in which the damper region 301 is not provided in the common flow path on one side, preferably the first common supply flow path 17. 17 may be provided with a damper region 301. That is, among the plurality of first common supply channels 17 , at least one first common supply channel 17 is not provided with the damper region 301 , and some of the first common supply channels 17 are provided with the damper region 301 . may be provided.

<Reason why it is preferable to provide a damper area in the common recovery channel>
Next, the reason why it is preferable to provide the damper region 301 in the first common recovery channel 18 will be explained. The pressure generated in each pressure chamber 5 is transmitted to the first common supply channel 17 and the first common recovery channel 18 through the individual supply channel 7 and the individual recovery channel 8 to the other pressure chambers 5. There is a risk of crosstalk due to pressure propagation. When ink is circulated from the first common supply channel 17 to the first common recovery channel 18 via the pressure chamber 5 as in the liquid ejection head 1 of this embodiment, the pressure in the first common recovery channel 18 is The pressure is set so that it is lower than the pressure of the first common supply channel 17. Therefore, the pressure from the pressure chamber 5 is more likely to propagate to the recovery channel side where the pressure is lower. Furthermore, as the circulating flow rate increases, the pressure difference between the supply channel and the recovery channel increases, so that the pressure propagates more easily to the recovery channel. Therefore, providing the damper region 301 on the wall surface of the first common recovery channel 18 at a position facing the individual recovery channel 8 is more effective in suppressing crosstalk. Further, even when the damper region 301 is provided only on the common recovery channel side, crosstalk can be sufficiently suppressed.

As described above, according to the present embodiment, it is possible to appropriately achieve both damper performance and liquid flow rate, and to suppress crosstalk.

<<Second embodiment>>
In the first embodiment, an example has been described in which the damper substrate 302 is provided and the first common supply channel 17 and the first common recovery channel 18 are formed in the damper substrate 302. In this embodiment, an example will be described in which the first common supply channel 17 and the first common recovery channel 18 are formed in the liquid supply substrate 203.

FIG. 6 is a diagram showing a cross section near the discharge port 3 of this embodiment. 6 is a diagram showing a cross section taken along the line VB-VB in FIG. 4, similar to FIG. 5(b). As shown in FIG. 6, in this embodiment, the individual supply channels 7 communicate with a first common supply channel 17 formed in the liquid supply substrate 203. The individual recovery channels 8 communicate with a first common recovery channel 18 formed in the liquid supply substrate 203.

Further, in this embodiment, the damper member 300 is formed on the flow path forming substrate 204. The damper member 300 forms a wall surface of the first common recovery channel 18 formed in the liquid supply substrate 203 on the surface facing the individual recovery channel 8 . In this embodiment, by providing the damper member 300 on the flow path forming substrate 204, the damper substrate 302 as described in the first embodiment can be omitted.

In this way, the liquid ejection substrate 2 of this embodiment includes the first substrate (ejection port forming substrate 201) forming the ejection port 3 and the second substrate (vibrating substrate 202) forming the pressure chamber 5. have It also has a third substrate (liquid supply substrate 203) that forms the individual supply channels 7, the individual recovery channels 8, the first common supply channel 17, and the first common recovery channel 18. It also includes a fourth substrate (channel forming substrate 204) having a second common supply channel 27 and a second common recovery channel 28. Each substrate includes a first substrate (discharge port forming substrate 201), a second substrate (vibrating substrate 202), a third substrate (liquid supply substrate 203), and a fourth substrate (flow path forming substrate 204). are stacked in this order.

The liquid ejection substrate 2 is formed by bonding substrates each having a damper member 300. In the first embodiment, a damper substrate 302 having a damper member 300 is bonded to a liquid supply substrate 203 with an adhesive layer 19. On the other hand, in this embodiment, the channel forming substrate 204 having the damper member 300 is bonded to the liquid supply substrate 203. According to this embodiment, it is possible to reduce costs and increase the degree of freedom in design. Hereinafter, a description will be given while comparing with an example of the first embodiment.

In the example of the first embodiment shown in FIG. 5(b), the distance D indicates the distance between the opening of the individual supply channel 7 and the adhesive layer 19. The distance D is required to be long enough so that the adhesive layer 19 does not protrude and block the opening of the individual supply channel 7. Therefore, it is required to design the first common supply channel 17 and the first common recovery channel 18 in consideration of the adhesive layer 19 and its protruding area. On the other hand, when the first common supply channel 17 and the first common recovery channel 18 are formed in the liquid supply substrate 203 as in the present embodiment shown in FIG. There is no risk that the adhesive layer 19 will block the area. Therefore, each individual flow path and each common flow path can be formed with a desired design. Furthermore, by reducing the number of damper substrates 302, the number of substrates to be bonded when forming the liquid ejection substrate 2 is reduced. Cost reduction can be achieved by reducing the number of boards. Furthermore, the adhesive cost required for adhering each substrate can be reduced. Furthermore, as described above, the degree of freedom in design can be improved.

FIG. 7 is a diagram showing a modification of this embodiment. FIG. 7 is a diagram showing a cross section near the discharge port 3, and is a diagram showing a cross section taken along the line VB-VB in FIG. 4(b). As shown in FIG. 7, a pattern in which minute holes are formed in the damper member 300 between the second common supply channel 27 and the first common supply channel 17 can be formed. Thereby, the region of the damper member 300 in which the pattern is formed functions as a filter. Moreover, in the example of FIG. 7, the damper member 300 between the second common supply channel 27 and the first common supply channel 17 is provided with a pattern in which minute holes are formed. Filters may be formed on both the supply side and the recovery side as in the example of FIG. 300 may be formed. Moreover, the modification shown in FIG. 7 is not limited to the second embodiment. The present invention can also be applied to the case where the damper region 301 is formed using the damper substrate 302 as described in the first embodiment. That is, in the embodiment shown in FIG. 5, a pattern may be formed on the damper member 300 between the second common supply flow path 27 and the first common supply flow path 17 to provide a filter function. Similarly, in the embodiment shown in FIG. 5, a pattern may be formed on the damper member 300 between the second common recovery channel 28 and the first common recovery channel 18 to provide a filter function.

Further, in this embodiment, as described in the first embodiment, the damper region 301 may be provided in the first common supply channel 17. FIG. 9 is a diagram showing an example in which a damper region 301 is provided in the first common supply channel 17 in this embodiment. As shown in FIG. 9, even if the damper region 301 is provided only on the common supply channel side, a sufficient damper width can be ensured, so crosstalk can be suppressed.

<<Other embodiments>>
In the above embodiment, the piezoelectric element was used as an example of the pressure generating element that generates pressure in the pressure chamber, but any element may be used as the pressure generating element. For example, a heating element that generates pressure by firing due to heat generation may be used.

The disclosures described in each of the above embodiments include configurations typified by the following example of a liquid ejection head and example of a liquid ejection device.

<Configuration 1>
a discharge port for discharging liquid;
a discharge port row in which a plurality of the discharge ports are lined up;
a plurality of pressure chambers communicating with the discharge ports and corresponding to the plurality of discharge ports, respectively;
a plurality of individual supply channels communicating with the pressure chambers and corresponding to the plurality of pressure chambers, respectively;
a plurality of individual recovery channels communicating with the pressure chambers and corresponding to the plurality of pressure chambers, respectively;
A common supply channel that communicates with a surface of the individual supply channels that is opposite to the surface that communicates with the pressure chamber, and that communicates with the plurality of individual supply channels;
a common recovery channel that communicates with a surface of the individual recovery channels that is opposite to the surface that communicates with the pressure chamber, and that communicates with the plurality of individual recovery channels;
a damper member forming a wall surface of a part of the flow path in the common recovery flow path,
A wall surface of a part of the flow path in the common supply flow path is not formed by a damper member,
The common supply channel and the common recovery channel are formed to extend in a first direction along the discharge port row,
A liquid ejection head characterized in that the common supply flow path and the common recovery flow path are arranged in a second direction intersecting the ejection port array.

<Configuration 2>
a discharge port for discharging liquid;
a discharge port row in which a plurality of the discharge ports are lined up;
a plurality of pressure chambers communicating with the discharge ports and corresponding to the plurality of discharge ports, respectively;
a plurality of individual supply channels communicating with the pressure chambers and corresponding to the plurality of pressure chambers, respectively;
a plurality of individual recovery channels communicating with the pressure chambers and corresponding to the plurality of pressure chambers, respectively;
A common supply channel that communicates with a surface of the individual supply channels that is opposite to the surface that communicates with the pressure chamber, and that communicates with the plurality of individual supply channels;
a common recovery channel that communicates with a surface of the individual recovery channels that is opposite to the surface that communicates with the pressure chamber, and that communicates with the plurality of individual recovery channels;
Equipped with
The common supply channel and the common recovery channel have different widths in a second direction intersecting the first direction along the discharge port,
A liquid ejection head characterized in that a wall surface of a portion of the channel having a wider width in the second direction of the common supply channel and the common recovery channel is formed by a damper member.

<Configuration 3>
The liquid ejection head according to configuration 2, wherein the width of the common recovery channel in the second direction is wider than the width of the common supply channel in the second direction.

<Configuration 4>
A plurality of the ejection port arrays are formed in the second direction,
A plurality of the common supply channels and the common recovery channel are provided and are arranged alternately in the second direction,
4. The liquid ejection head according to any one of configurations 1 to 3, wherein a wall surface of a portion of at least one of the plurality of common supply channels is not formed by a damper member.

<Configuration 5>
According to any one of configurations 1 to 4, the individual supply channel and the individual recovery channel are formed to extend in a direction intersecting the first direction and the second direction. The liquid ejection head described.

<Configuration 6>
6. The liquid ejection head according to any one of configurations 1 to 5, wherein the length of the ejection port array is shorter than the length of the damper member in the first direction.

<Configuration 7>
a first substrate forming the discharge port;
a second substrate forming the pressure chamber;
a third substrate forming the individual supply channel and the individual recovery channel;
a fourth substrate that includes the damper member in a part of the flow path and forms the common supply flow path and the common recovery flow path;
a fifth substrate forming a second common supply channel communicating with the common supply channel and a second common recovery channel communicating with the common recovery channel;
Equipped with
Any of Structures 1 to 5, wherein the substrates are stacked in the order of the first substrate, the second substrate, the third substrate, the fourth substrate, and the fifth substrate. 2. The liquid ejection head according to item 1.

<Configuration 8>
The fifth substrate is
a through hole penetrating a first surface laminated on the fourth substrate and a second surface opposite to the first surface;
a recess formed on the first surface;
8. The liquid ejection head according to configuration 7, wherein the through hole and the recess are aligned in the second direction.

<Configuration 9>
9. The liquid ejection head according to configuration 7 or 8, wherein an adhesive layer is provided between the fourth substrate and the third substrate.

<Configuration 10>
According to configuration 9, the adhesive layer is provided between the third substrate and a partition wall that separates the common supply channel and the common recovery channel in the fourth substrate. Liquid ejection head.

<Configuration 11>
a first substrate forming the discharge port;
a second substrate forming the pressure chamber;
a third substrate forming the individual supply channels, the individual recovery channels, the common supply channel, and the common recovery channel;
a fourth substrate that includes the damper member in a part of the flow path and forms a second common supply flow path communicating with the common supply flow path and a second common recovery flow path communicating with the common recovery flow path; ,
has
The liquid according to any one of configurations 1 to 5, wherein the substrate is laminated in the order of the first substrate, the second substrate, the third substrate, and the fourth substrate. discharge head.

<Configuration 12>
The fourth substrate is
a through hole penetrating a first surface laminated on the third substrate and a second surface opposite to the first surface;
a recess formed on the first surface;
has
12. The liquid ejection head according to configuration 11, wherein the through hole and the recess are lined up in the second direction.

<Configuration 13>
13. The liquid ejection head according to configuration 12, wherein the fourth substrate includes the damper member on the first surface that is laminated on the third substrate.

<Configuration 14>
14. The liquid ejection head according to any one of Structures 11 to 13, wherein an adhesive layer is provided between the third substrate and the fourth substrate.

<Configuration 15>
According to configuration 14, the adhesive layer is provided between the fourth substrate and a partition wall that separates the common supply channel and the common recovery channel in the third substrate. Liquid ejection head.

<Configuration 16>
16. The liquid ejection head according to any one of Structures 1 to 15, wherein the damper member includes a patterned area in which holes are formed.

<Configuration 17>
17. The liquid ejection head according to configuration 16, wherein the pattern area is formed at a position different from the part of the wall surface.

<Configuration 18>
A liquid ejection device configured to be able to mount the liquid ejection head according to any one of Structures 1 to 17.

2 Liquid discharge substrate 5 Pressure chamber 7 Individual supply channel 8 Individual recovery channel 17 First common supply channel 18 First common recovery channel 301 Damper region

Claims (18)

a discharge port for discharging liquid;
a discharge port row in which a plurality of the discharge ports are lined up;
a plurality of pressure chambers communicating with the discharge ports and corresponding to the plurality of discharge ports, respectively;
a plurality of individual supply channels communicating with the pressure chambers and corresponding to the plurality of pressure chambers, respectively;
a plurality of individual recovery channels communicating with the pressure chambers and corresponding to the plurality of pressure chambers, respectively;
A common supply channel that communicates with a surface of the individual supply channels that is opposite to the surface that communicates with the pressure chamber, and that communicates with the plurality of individual supply channels;
a common recovery channel that communicates with a surface of the individual recovery channels that is opposite to the surface that communicates with the pressure chamber, and that communicates with the plurality of individual recovery channels;
a damper member forming a wall surface of a part of the flow path in the common recovery flow path,
A wall surface of a part of the flow path in the common supply flow path is not formed by a damper member,
The common supply channel and the common recovery channel are formed to extend in a first direction along the discharge port row,
A liquid ejection head characterized in that the common supply flow path and the common recovery flow path are arranged in a second direction intersecting the ejection port array. a discharge port for discharging liquid;
a discharge port row in which a plurality of the discharge ports are lined up;
a plurality of pressure chambers communicating with the discharge ports and corresponding to the plurality of discharge ports, respectively;
a plurality of individual supply channels communicating with the pressure chambers and corresponding to the plurality of pressure chambers, respectively;
a plurality of individual recovery channels communicating with the pressure chambers and corresponding to the plurality of pressure chambers, respectively;
A common supply channel that communicates with a surface of the individual supply channels that is opposite to the surface that communicates with the pressure chamber, and that communicates with the plurality of individual supply channels;
a common recovery channel that communicates with a surface of the individual recovery channels that is opposite to the surface that communicates with the pressure chamber, and that communicates with the plurality of individual recovery channels;
Equipped with
The common supply channel and the common recovery channel have different widths in a second direction intersecting the first direction along the discharge port,
A liquid ejection head characterized in that a wall surface of a portion of the channel having a wider width in the second direction of the common supply channel and the common recovery channel is formed by a damper member. The liquid ejection head according to claim 2, wherein the width of the common recovery channel in the second direction is wider than the width of the common supply channel in the second direction. A plurality of the ejection port arrays are formed in the second direction,
A plurality of the common supply channels and the common recovery channel are provided and are arranged alternately in the second direction,
The liquid ejection head according to any one of claims 1 to 3, wherein a wall surface of a part of at least one of the plurality of common supply channels is not formed by a damper member. . 4. The individual supply flow path and the individual recovery flow path are formed to extend in a direction intersecting the first direction and the second direction. The liquid ejection head described in . 4. The liquid ejection head according to claim 1, wherein the length of the ejection port array is shorter than the length of the damper member in the first direction. a first substrate forming the discharge port;
a second substrate forming the pressure chamber;
a third substrate forming the individual supply channel and the individual recovery channel;
a fourth substrate that includes the damper member in a part of the flow path and forms the common supply flow path and the common recovery flow path;
a fifth substrate forming a second common supply channel communicating with the common supply channel and a second common recovery channel communicating with the common recovery channel;
Equipped with
4. The substrate according to claim 1, wherein the substrates are stacked in the order of the first substrate, the second substrate, the third substrate, the fourth substrate, and the fifth substrate. The liquid ejection head according to any one of the items. The fifth substrate is
a through hole penetrating a first surface laminated on the fourth substrate and a second surface opposite to the first surface;
a recess formed on the first surface;
The liquid ejection head according to claim 7, wherein the through hole and the recess are aligned in the second direction. 8. The liquid ejection head according to claim 7, wherein an adhesive layer is provided between the fourth substrate and the third substrate. 10. The adhesive layer is provided between the third substrate and a partition wall separating the common supply channel and the common recovery channel in the fourth substrate. liquid ejection head. a first substrate forming the discharge port;
a second substrate forming the pressure chamber;
a third substrate forming the individual supply channels, the individual recovery channels, the common supply channel, and the common recovery channel;
a fourth substrate that includes the damper member in a part of the flow path and forms a second common supply flow path communicating with the common supply flow path and a second common recovery flow path communicating with the common recovery flow path; ,
has
4. The substrate according to claim 1, wherein the first substrate, the second substrate, the third substrate, and the fourth substrate are stacked in this order. Liquid ejection head. The fourth substrate is
a through hole penetrating a first surface laminated on the third substrate and a second surface opposite to the first surface;
a recess formed on the first surface;
has
The liquid ejection head according to claim 11, wherein the through hole and the recess are aligned in the second direction. 13. The liquid ejection head according to claim 12, wherein the fourth substrate includes the damper member on the first surface that is laminated on the third substrate. 12. The liquid ejection head according to claim 11, wherein an adhesive layer is provided between the third substrate and the fourth substrate. 15. The adhesive layer is provided between the fourth substrate and a partition wall that separates the common supply channel and the common recovery channel in the third substrate. liquid ejection head. 4. The liquid ejection head according to claim 1, wherein the damper member includes a patterned area in which holes are formed. 17. The liquid ejection head according to claim 16, wherein the pattern area is formed at a different position from the part of the wall surface. A liquid ejection device configured to be able to mount the liquid ejection head according to any one of claims 1 to 3.

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