JP2023142156A - Coil component and electronic circuit - Google Patents

Abstract

To provide a coil component whose impedance characteristics change little even when molded with resin after being mounted on a substrate.SOLUTION: A coil component includes: a core having a winding core and a pair of flanges provided at both ends of the winding core; a pair of terminal electrodes provided corresponding to the pair of flanges; a wire having a winding portion wound around the winding core, and wire end portions connected to the terminal electrodes; and a protection resin portion at least a portion of which is provided on a flange end face that is an outer surface of the flange in the winding axis direction, and in which a maximum thickness along the winding axis direction from the flange end face is in the range of 0.1 times or more the thickness of the flange in the winding axis direction.SELECTED DRAWING: Figure 1

Description

The present invention relates to coil components and electronic circuits.

For coil components mounted on a board, a technique has been proposed in which a resin mold is formed to cover the board and the coil component. By forming such a resin coating, it is expected to improve the moisture-proof properties of the coil component and the substrate, and to improve the mechanical strength of the entire member including the substrate and the coil component.

On the other hand, a technique has also been proposed in which a portion of a coil component such as a wire or a core, excluding a portion where a terminal electrode is mounted, is covered with an exterior body made of resin. However, coil parts that cover the entire wire and core with an exterior body made of resin have a problem in terms of miniaturization because the overall shape is large, and there is also the problem of high costs because the exterior body is molded with a mold. There is.

JP2004-203931A Japanese Patent Application Publication No. 2011-9338

The inventors of the present application have found that when a conventional coil part mounted on a board is molded with resin, the impedance characteristics of the coil component deteriorate, resulting in a problem that the desired characteristics cannot be obtained.

Therefore, the present invention provides a coil component whose impedance characteristics change little even when it is molded with resin after being mounted on a board.

In order to achieve the above object, the coil component according to the present invention includes:
A core having a winding core and a pair of flanges provided at both ends of the winding core;
at least a pair of terminal electrodes provided corresponding to the pair of collar portions;
a wire having a winding part wound around the winding core part and a wire end part connected to the terminal electrode;
At least a portion is provided on a flange end face that is an outer surface of the flange in the winding axis direction, and a maximum thickness along the winding axis direction from the collar end face is such that the maximum thickness of the flange in the winding axis direction is and a protective resin portion that is 0.1 times or more thicker than the protective resin portion.

The inventors of the present invention believe that changes in impedance characteristics of a coil component before and after resin molding in a board-mounted state can be suppressed by reducing stress from the circuit protection resin portion acting in the winding axis direction of the coil component. We obtained the following knowledge. That is, in the coil component according to the present invention, a protective resin part having a predetermined thickness or more is formed at both ends of the core, so that this protective resin part can be used as a resin (circuit protection resin part) that covers the entire body after mounting. The propagation of stress in the direction of the winding axis from the winding can be alleviated. Therefore, even when such a coil component is molded with resin after being mounted on a board, changes in impedance characteristics before and after resin molding can be reduced.

Further, for example, at least a portion of the wire end portion may be exposed from the protective resin portion.

By exposing at least a portion of the wire end, the range covered by the protective resin becomes narrower, which is advantageous from the standpoint of miniaturization. Furthermore, even if the wire ends are exposed, the effect is small in terms of alleviation of stress acting in the direction of the winding axis.

Further, for example, it may further include a connecting core that is provided substantially parallel to the winding axis direction of the winding core and that connects the pair of the flanges,
A half or more of the top surface of the connection core, which is a surface opposite to the mounting direction of the connection core, may be exposed from the protective resin portion.

By exposing the top surface of the connection core, an appropriate suction surface for the transfer arm during surface mounting is ensured. Further, since the area covered by the protective resin is narrowed, this is advantageous from the viewpoint of miniaturization, and the exposure of the upper surface of the connection core has a small effect from the viewpoint of alleviating stress acting in the direction of the winding axis.

An electronic circuit according to the present invention includes the above coil component,
a substrate having a plurality of land patterns corresponding to the terminal electrodes of the coil component and mounting the coil component;
A circuit protection resin portion that covers the coil component and a portion around the mounting position of the coil component on the board.

In such electronic circuits, the circuit protection resin part protects the coil parts and the board from moisture and impact, and also prevents stress from the circuit protection resin part from acting on the core in the direction of the winding axis. This can prevent the problem of component impedance deterioration.

Further, for example, the protective resin portion may be made of silicone resin, urethane resin, or epoxy resin, and the circuit protection resin portion may be made of epoxy resin.

The circuit protection resin portion can strongly protect the board and the coil components. In addition, the protective resin part provided on the end face of the flange is more flexible than the circuit protection resin part (for example, has a smaller Young's modulus), which prevents the propagation of stress from the circuit protection resin part and protects the internal coil components. Impedance deterioration can be suitably prevented.

FIG. 1 is a front view of a coil component according to a first embodiment. FIG. 2 is a bottom view of the coil component shown in FIG. 1. FIG. 3 is a left side view of the coil component shown in FIG. 1. FIG. 4 is a top view of the coil component shown in FIG. 1. FIG. 5 is a cross-sectional view of the coil component shown in FIG. 1. FIG. 6 is a front view of the coil component according to the second embodiment. FIG. 7 is a bottom view of the coil component shown in FIG. 6. FIG. 8 is a top view of the coil component shown in FIG. 6. FIG. 9 is a cross-sectional view of the coil component shown in FIG. 6. FIG. 10 is a side view of a coil component according to a third embodiment. FIG. 11 is a sectional view showing an electronic circuit in which the coil component shown in FIG. 1 is mounted. FIG. 12 is a graph comparing the impedance before and after forming the circuit protection resin portion in the coil component according to the example. FIG. 13 is a graph comparing the impedance before and after forming the circuit protection resin portion in the coil component according to the comparative example.

The present invention will be described below based on embodiments shown in the drawings.

First Embodiment FIG. 1 is a front view showing a coil component 10 according to a first embodiment. As shown in FIG. 1, the coil component 10 includes a core 20, a terminal electrode 30, a wire 40, a protective resin portion 50, and a connection core 60.

The core 20 is an integral drum-shaped core made of a magnetic material such as metal or ferrite. The core 20 has a winding core 22 and a pair of flanges 24 provided at both ends of the winding core 22 . In the description of the coil component 10, the winding axis direction of the wire 40 wound around the winding core part 22 is referred to as the X-axis direction, the direction perpendicular to the mounting surface where the terminal mounting part 32 is arranged is referred to as the Z-axis direction, and the X-axis direction The direction perpendicular to this direction and the Z-axis direction is the Y-axis direction.

FIG. 5 is a cross-sectional view of the coil component 10 shown in FIG. As shown in FIG. 5, the core 20 in the coil component 10 has a portion covered with the protective resin portion 50 and a portion exposed from the protective resin portion 50. The protective resin portion 50 will be described in detail later.

2 is a bottom view of the coil component 10, FIG. 3 is a left side view of the coil component 10, and FIG. 4 is a top view of the coil component 10. As can be understood from FIGS. 1 to 5, the coil component 10 has a substantially rectangular parallelepiped shape. Moreover, both the winding core part 22 and the collar part 24 in the core 20 have a substantially rectangular parallelepiped shape. However, as shown in FIG. 3 and the like, a step is formed on the lower surface side (Z-axis negative direction side) of the flange portion 24.

As shown in FIG. 1, the coil component 10 has a connection core 60 in the shape of a substantially rectangular flat plate. The connecting core 60 is provided above the core 20 (on the Z-axis positive direction side) so that its longitudinal direction is parallel to the X-axis direction, which is the winding axis direction, and connects the pair of flanges 24 of the core 20. . That is, one end of the connection core 60 along the winding axis direction (the end on the X-axis negative direction side) is connected to the flange upper surface 27 of one flange 24 (the flange 24 on the X-axis negative direction side). However, the other end of the connection core 60 (the flange 24 on the positive side of the X-axis) is connected to the upper surface 27 of the flange 24 of the other flange 24 (the flange 24 on the negative side of the Y-axis).

Like the core 20, the connection core 60 is made of a magnetic material such as metal or ferrite. The connecting core 60 and the core 20 may be made of the same material or may be made of different materials. For example, the core 20 may be made of ferrite and the connection core 60 may be made of metal, or the core 20 may be made of metal and the connection core 60 may be made of ferrite. However, the connection core 60 and the core 20 are not limited to being made of magnetic material, and one or both may be made of a non-magnetic material.

As shown in FIG. 1, the coil component 10 has at least one pair of terminal electrodes 30 provided corresponding to the pair of collar portions 24. As shown in FIG. 2, which is a bottom view, the coil component 10 has two terminal electrodes 30 provided on one flange 24 (the flange 24 on the negative side of the X-axis), and the other flange 24 ( Two terminal electrodes 30 are provided on the collar portion 24) on the positive side of the X-axis, and have a total of four (two pairs) connection terminals. However, one terminal electrode 30 may be provided on each collar portion 24, or three or more terminal electrodes 30 may be provided on each collar portion 24.

As shown in FIGS. 1 to 3, the terminal electrode 30 includes a flange end surface 25 that is the outer surface of the flange 24 in the winding axis direction, and a lower flange surface that faces the mounting direction (Z-axis negative direction) of the flange 24. 28 and the flange step surface 29. That is, the terminal electrode 30 has a terminal mounting part 32 and a terminal connecting part 34. The terminal electrode 30 can be formed, for example, by processing a metal plate or the like. However, the terminal electrode 30 can also be formed by other methods such as applying metal paste or forming metal plating.

The terminal mounting portion 32 is provided on the lower flange surface 28 located at the lowest position in the flange portion 24 . As shown in FIG. 2, the terminal mounting portion 32 is exposed downward from the protective resin portion 50, and when mounted on a board 470 or the like (see FIG. 11), it is attached to the land pattern 472 of the board 470 via solder or the like. electrically and physically connected to the

As shown in FIG. 3, the terminal connecting portion 34 is provided on the flange stepped surface 29. As shown in FIG. The flange stepped surface 29 is a surface facing the mounting direction, and is recessed upward with respect to the lower flange surface 28 to form a stepped surface. As shown in FIG. 2, the terminal connecting portion 34 of the terminal electrode 30 and the connecting portion 44b of the wire end portion 44 are arranged on the flange step surface 29.

As shown in FIGS. 1 and 4, a portion of the terminal connecting portion 34 of the terminal electrode 30 protrudes outward from the flange end surface 25 (in the direction away from the center of the coil component 10); , is covered with a protective resin part 50. That is, as shown in FIG. 2 and the like, in the coil component 10, the terminal electrode 30 is covered with the protective resin part 50 except for the terminal mounting part 32.

As shown in FIG. 1, the coil component 10 has a wire 40 that is a conductive wire. The wire 40 has a winding part 42 wound around the winding core part 22 and a wire end part 44 connected to the terminal electrode 30. The wire 40 is composed of, for example, a covered conductor.

As shown in FIG. 2, the coil component 10 has two mutually insulated wires 40, each wire end 44 of the two wires 40 being connected to a separate terminal electrode 30. There is. Such a coil component 10 can be suitably used as, for example, a common mode filter. However, the number of wires 40 included in the coil component 10 is not particularly limited, and the coil component 10 may be used as an electronic component other than a common mode filter.

Further, as shown in FIG. 5, the winding part 42 of each wire 40 formed on the winding core part 22 is a single layer winding, but the winding part 42 may be a multilayer winding of two or more layers. . As shown in FIG. 2, the wire end portion 44 has a connecting portion 44b that connects to the terminal electrode 30, and a lead-out portion 44a that connects the connecting portion 44b and the winding portion 42.

As shown in FIG. 2, the winding portion 42 and wire end portion 44 of the wire 40 are covered with a protective resin portion 50. As shown in FIG. However, as in the coil component 210 according to the second embodiment shown in FIGS. 6 to 9, at least a portion of the winding portion 42 and the wire end portion 44 may not be covered with the protective resin portion 50.

As shown in FIG. 1, at least a portion of the protective resin portion 50 of the coil component 10 is provided on the flange end surface 25, which is the outer surface of the flange 24 in the winding axis direction. That is, the protective resin portion 50 has a pair of end face protection portions 52 disposed on both end faces of the coil component 10 in the winding axis direction (X-axis direction).

As shown in FIG. 5, the end face protection portion 52 of the protective resin portion 50 is disposed straddling the connecting core end face 65, which is the end face in the winding axis direction of the connecting core 60, and the flange end face 25 of the flange portion 24. There is. As will be described later, in the end face protection portion 52 of the protective resin part 50, the maximum thickness T1 from the flange end face 25 along the winding axis direction is 0.1 times or more the thickness T2 of the collar part 24 in the winding axis direction. This is preferable from the viewpoint of preventing the stress of the circuit protection resin portion 480 from being transmitted to the core 20. It is also preferable for the same reason that the maximum thickness T1 from the flange end surface 25 along the winding axis direction is 0.4 times or more the thickness T2 of the collar part 24 in the winding axis direction.

Note that the end face protection portion 52 has a curved surface and has a maximum thickness on the outer side of the flange end face 25 in the winding axis direction. However, the shape of the end face protection portion 52 is not limited to this, and may have a substantially constant thickness in the vertical direction. Further, when the thickness T2 of the flange 24 changes depending on the cross section, the maximum thickness is used as the thickness T2 of the flange 24 in the winding axis direction.

Further, in the end face protection portion 52 of the protective resin portion 50, the maximum thickness T1 from the flange end face 25 along the winding axis direction is 1.5 times or less than the thickness T2 of the collar part 24 in the winding axis direction. This is preferable from the viewpoint of reducing the size of the coil component 10. It is also preferable for the same reason that the maximum thickness T1 from the flange end face 25 along the winding axis direction is 1.0 times or less the thickness T2 of the collar part 24 in the winding axis direction.

As shown in FIG. 1, the flange side end surface 26 and the connection core side end surface 66, which are both end surfaces of the flange 24 and the connection core 60 in the direction orthogonal to the winding axis direction and the mounting direction, are exposed from the protective resin section 50. This is preferable from the viewpoint of downsizing the coil component 10. Further, as shown in FIG. 4 , a top surface 67 of the connection core 67 , which is the surface of the connection core 60 on the opposite side to the mounting direction (the surface on the Z-axis positive direction side), is exposed from the protective resin portion 50 .

As shown in FIG. 4, in the coil component 10, the entire connecting core upper surface 67 (100%) is exposed from the protective resin part 50, but more than 1/2 of the connecting core upper surface 67 is exposed from the protective resin part 50. It is preferable to do so. By exposing 1/2 or more of the upper surface 67 of the connection core from the protective resin portion 50, a suction surface to the transfer arm during surface mounting of the coil component 10 is appropriately secured.

As shown in FIGS. 1 and 2, the protective resin portion 50 covers the wire 40, the winding core portion 22, and the terminal electrode 30 in addition to the flange end surface 25. It is preferable to cover these portions with the protective resin portion 50 from the viewpoint of preventing the propagation of stress from the circuit protective resin portion 480 (see FIG. 11). However, from the viewpoint of reducing the change in impedance characteristics before and after forming the circuit protection resin portion 480, the contribution of portions other than the end face protection portion 52 is small. Therefore, if the propagation of stress from the circuit protection resin part 480 (see FIG. 11) is within an allowable range, at least a portion of the wire 40, the winding core part 22, and the terminal electrode 30 are exposed from the protection resin part 50, and the coil component 10 may be downsized (see second embodiment).

Examples of the material for the protective resin part 50 include silicone resin and epoxy resin, but forming the protective resin part 50 with a relatively flexible silicone resin is preferable for the circuit protection resin part 480 (see FIG. 11). ) is preferable from the viewpoint of preventing the propagation of stress from. The protective resin portion 50 can be formed, for example, by applying unhardened resin to the flange end face 25 or by dipping the core 20 in unhardened resin.

In the coil component 10 shown in FIGS. 1 to 5, protective resin portions 50 (end surface protection portions 52) having a predetermined thickness or more are formed on the flange end surfaces 25, which are both ends of the core 20. Such a protective resin part 50 can alleviate the propagation of stress in the winding axis direction from the resin (circuit protective resin part 480, see FIG. 11) that covers the entire circuit after mounting. Therefore, even when the coil component 10 is molded with resin after being mounted on the board 470, the change in impedance characteristics before and after the resin molding can be reduced.

Second Embodiment FIG. 6 is a front view of a coil component 210 according to a second embodiment, FIG. 7 is a bottom view of the coil component 210, FIG. 8 is a top view of the coil component 210, and FIG. 9 is a top view of the coil component 210. FIG. As shown in FIGS. 6 to 9, the coil component 210 according to the second embodiment is different from the coil component 10 according to the first embodiment in the shape of the protective resin part 250, but in other respects, the coil component 210 according to the second embodiment is different from the coil component 10 according to the first embodiment. ~It is similar to the coil component 10 shown in FIG. The description of the coil component 210 according to the second embodiment will focus on the differences from the coil component 10 according to the first embodiment, and the same reference numerals will be given to the common features, and the description will be omitted.

As shown in FIGS. 6 to 9, the coil component 210 differs from the coil component 10 shown in FIG. 1 etc. in the shape and formation position of the protective resin part 250. That is, the protective resin portion 250 is comprised only of a portion corresponding to an end surface protection portion disposed straddling the connecting core end surface 65 of the connecting core 60 and the flange end surface 25 of the flange portion 24. Therefore, in the coil component 210 , most of the parts, such as the terminal electrode 30 and the wire end 44 , except for the collar end face 25 and the connecting core end face 65 are not covered with the protective resin part 250 .

For example, as shown in FIG. 7, in the coil component 210, at least a portion of the wire end portion 44 is exposed from the protective resin portion 250. In such a coil component 210, the terminal mounting portion 32 adjacent to the wire end portion 44 can be easily exposed from the protective resin portion 250, and manufacturing is easy. Note that even if the wire end portion 44 is exposed from the protective resin portion 250, the effect is small from the viewpoint of alleviating the stress acting in the winding axis direction of the core 20 that propagates from the circuit protective resin portion 480.

As shown in FIG. 9, in the coil component 210, the core portion 22 and the winding portion 42 are also not covered with the protective resin portion 250 and are exposed from the protective resin portion 250. However, similar to the protective resin part 50 of the coil component 10 shown in FIG. A protective resin portion 250 is formed.

The coil component 210 according to the second embodiment also has the same effects as the coil component 10 in terms of common points with the coil component 10 according to the first embodiment.

Third Embodiment FIG. 10 is a front view of a coil component 310 according to a third embodiment. The coil component 310 according to the third embodiment differs from the coil component 210 according to the second embodiment in the shape of the terminal electrode 330, the connection position between the terminal electrode 330 and the wire end 344, and the like. However, the coil component 310 is configured only of a portion where the protective resin portion 350 is disposed astride the connecting core end surface 365 of the connecting core 360 and the flange end surface 325 of the flange portion 324. This is similar to 210. The description of the coil component 310 will focus on the differences from the coil component 210, and the description of the common features will be omitted.

Like the coil component 210 shown in FIG. 6, the coil component 310 has a drum-shaped core 320 and a flat connecting core 360. The upper surface 327 is connected. Further, the coil component 210 has at least one pair of terminal electrodes 330 provided corresponding to the pair of flanges 324 of the core 320.

The terminal electrode 330 has a terminal connecting portion 334 disposed on a flange step surface 329 formed on the flange upper surface 327 side, and a terminal mounting portion 332 disposed on the flange lower surface 328. The wire 340 has a winding part 342 wound around the winding core part 322 of the core 320 and a wire end part 344 connected to the terminal connecting part 334. Unlike the coil component 210 shown in FIG. 6, the wire end portion 344 of the wire 340 is pulled out from the winding portion 342 upward (towards the positive Z-axis direction) and connected to the terminal connecting portion 334.

Like the coil component 210 shown in FIG. 6, the coil component 310 has a protective resin portion 350 disposed on the flange end surface 325 of the flange portion 324. The material, maximum thickness, etc. of the protective resin portion 350 are the same as those of the coil component 210 shown in FIG. 9 and the coil component 10 shown in FIG. 5.

The coil component 310 according to the third embodiment also has a protective resin portion having a thickness of 0.1 times or more the thickness of the flange 24 in the winding axis direction (X-axis direction) on the flange end surfaces 325 that are both ends of the core 320. 350 is formed. Similarly to the coil component 210 according to the second embodiment, the coil component 310 according to the third embodiment also absorbs stress in the winding axis direction from the resin (circuit protection resin part 480, see FIG. 11) that covers the entire body after mounting. It can reduce propagation and reduce changes in impedance characteristics before and after resin molding.

Fourth Embodiment FIG. 11 is a schematic cross-sectional view of an electronic circuit 490 according to a fourth embodiment. The electronic circuit 490 includes the coil component 10 shown in FIGS. 1 to 5, a substrate 470 on which the coil component 10 is mounted, and a circuit protection resin portion 480 that covers the coil component 19 and the peripheral portion 473 of the mounting position of the coil component 10 on the substrate 470. has. In addition, since the structure of the coil component 10 was explained in the first embodiment, the explanation will be omitted here.

As shown in FIG. 11, the substrate 470 has a plurality of land patterns 472 corresponding to the terminal electrodes 30 of the coil component 10. Coil component 10 is mounted on substrate 470 via solder or the like, for example. The terminal electrode 30 of the coil component 10 is fixed to the land pattern 472 via solder or the like.

The circuit protection resin portion 480 is formed by mounting the coil component 10 on the board 470, pouring uncured resin into the mounting position peripheral portion 473 so as to cover the coil component 10, and curing the resin. The circuit protection resin portion 480 is made of, for example, epoxy resin. Note that the circuit protection resin portion 480 may be a moisture-proof coating for protecting the board 470 and the coil component 10 from a humid environment, dew condensation, etc., and is performed for the purpose of protection from the external environment and improvement of mechanical strength. Potting resin may be used, and the purpose of forming the circuit protection resin portion 480 is not particularly limited.

In the electronic circuit 490 shown in FIG. 11, the flange end face 25 is covered with the protective resin part 50 having a predetermined thickness, so that stress in the axial direction of the circuit protective resin part 480 is transmitted to the core 20 of the coil component 10. This will be prevented. Therefore, the electronic circuit 490 can prevent the problem of the impedance characteristics of the mounted coil component 10 changing before and after the formation of the circuit protection resin part 480, and can exhibit the intended electrical characteristics.

Hereinafter, the coil component 10 and the electronic circuit 490 will be described in detail by showing examples and comparative examples. However, the present invention is not limited in any way by these Examples.

Example FIG. 12 is a graph showing the results of measuring the impedance of the coil component 10 (example) before and after forming the circuit protection resin portion 480 shown in FIG. 11 in the range of 0.1 to 1000 MHz. In FIG. 12, the dotted line shows the characteristics of the coil component 10 before forming the circuit protection resin part 480, and the solid line shows the characteristics of the coil part 10 after forming and curing the circuit protection resin part 480. . Note that the impedance of the coil component 10 was measured while it was mounted on the board 470.

As shown in FIG. 12, in the coil component 10 having the protective resin portion 50, almost no change in impedance characteristics was observed before and after forming the circuit protective resin portion 480.

Comparative Example In a comparative example, the same impedance measurement as in the example was performed using the same coil components except that the protective resin part 50 was not included. In FIG. 13, the dotted line indicates the characteristics of the coil component according to the comparative example before forming the circuit protection resin portion 480, and the solid line indicates the characteristics of the coil component according to the comparative example after forming and curing the circuit protection resin portion 480. It shows the characteristics of

As shown in FIG. 13, in the coil component without the protective resin part 50, deterioration in impedance characteristics was observed after the circuit protective resin part 480 was formed. In particular, in the frequency range of 1 MHz to 200 MHz, the decrease in impedance was remarkable. It can be seen that in a coil component that does not have the protective resin part 50, the impedance characteristics change greatly before and after the circuit protective resin part 480 is formed, making it difficult to obtain an electronic circuit with the desired characteristics.

A comparison between the example (FIG. 12) and the comparative example (FIG. 13) shows that the coil component 10 having the protective resin part 50 with a predetermined thickness can prevent the problem of impedance characteristics changing before and after the formation of the circuit protective resin part 480. was confirmed. Note that when comparing the impedance characteristics before forming the circuit protection resin portion 480 between the example and the comparative example (the dotted line in FIG. 12 and the dotted line in FIG. 13), there is almost no difference in impedance characteristics. Unlike the formation of the circuit protection resin part 480 shown in FIG. 11, it is thought that in the formation of the protective resin part 50 shown in FIG. 1, stress that would affect the impedance characteristics of the coil component 10 is not generated.

Although the embodiments and examples have been described above, the present invention is not limited to the above-described embodiments and examples, and various changes can be made without departing from the gist of the present invention. It goes without saying that it is included within the scope of the present invention.

For example, in the above embodiment, the case where the coil component is a common mode filter is described as an example, but the scope of the present invention is not limited to this, and it is also possible to apply to other types of coil components. It is.

10, 210, 310... Coil component 20, 320... Core 22, 322... Winding core 24, 324... Flange 25, 325... Flange end surface T2... Thickness 26... Flange side end surface 27, 327... Flange top surface 28 , 328... Flange lower surface 29, 329... Flange step surface 30, 330... Terminal electrode 32, 332... Terminal mounting part 34, 334... Terminal connecting part 40, 340... Wire 42, 342... Winding part 44, 344 ... Wire end portion 44a... Drawer portion 44b... Connection portion 50, 250, 350... Protective resin portion 52... End face protection portion T1... Maximum thickness 60, 360... Connection core 65, 365... Connection core end surface 66... Connection core side end surface 67 ...Connection core top surface 470...Board 472...Land pattern 473...Mounting position periphery 480...Circuit protection resin part 490...Electronic circuit

Claims (5)

A core having a winding core and a pair of flanges provided at both ends of the winding core;
at least a pair of terminal electrodes provided corresponding to the pair of collar portions;
a wire having a winding part wound around the winding core part and a wire end part connected to the terminal electrode;
At least a portion is provided on a flange end face that is an outer surface of the flange in the winding axis direction, and a maximum thickness along the winding axis direction from the collar end face is such that the maximum thickness of the flange in the winding axis direction is a protective resin portion that is 0.1 times or more thicker than the
Coil parts with. The coil component according to claim 1, wherein at least a portion of the wire end portion is exposed from the protective resin portion. The winding core further includes a connecting core that is provided substantially parallel to the winding axis direction of the winding core and connects the pair of flanges,
2. The coil component according to claim 1, wherein more than half of the top surface of the connection core, which is the surface opposite to the mounting direction of the connection core, is exposed from the protective resin portion. The coil component according to claim 1;
a substrate having a plurality of land patterns corresponding to the terminal electrodes of the coil component and mounting the coil component;
An electronic circuit comprising: a circuit protection resin portion that covers the coil component and a portion around the mounting position of the coil component on the substrate. 5. The electronic circuit according to claim 4, wherein the protective resin part is made of silicone resin, urethane resin, or epoxy resin, and the circuit protection resin part is made of epoxy resin.

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