JP2023137544A - Plate spring device and power conversion device - Google Patents

Abstract

To make an exhibited spring constant higher when a displacement is small and lower when the displacement is large in a process of increasing a push-in load applied in a first direction.SOLUTION: A plate spring device 1 includes a first plate spring portion 11 and a second plate spring portion 12 which are provided on top of the other in a first direction Z between a first pressed body 102 and a second pressed body 101 that oppose each other in the first direction. The first plate spring portion supported by the first pressed body and the second plate spring portion supported by the second pressed body are bent so as to have an apex portion protruding in the first direction. The first plate spring portion has a lower spring constant in the first direction than that of the second plate spring portion. A pushing load in the first direction applied to the plate spring device required to push the first plate spring portion and deform it in the first direction is larger than a pushing load in the first direction applied to the plate spring device required to push the second plate spring portion and deform it in the first direction.SELECTED DRAWING: Figure 2C

Description

The present invention relates to a leaf spring device and a power conversion device.

Conventionally, as shown in Patent Document 1 below, for example, a first pressed body and a second pressed body are placed between a first pressed body and a second pressed body that face each other in a first direction, 2. Description of the Related Art Leaf springs are known that are provided so as to be pressable in directions that are separated from each other in a first direction, and that are curved so as to protrude in the first direction.

Japanese Patent Application Publication No. 2014-011936

However, in the conventional leaf spring, in the process of increasing the applied indentation load in the first direction, it is difficult to increase the spring constant when the displacement is small and to decrease it when the displacement is large. there were.

This invention was made in consideration of such circumstances, and in the process of increasing the applied indentation load in the first direction, the spring constant that is developed is made high when the displacement is small and low when the displacement is large. An object of the present invention is to provide a leaf spring device and a power conversion device that can perform the following steps.

In order to solve the above-mentioned problems and achieve such an object, the leaf spring device of the present invention has the above-mentioned first pressed body between a first pressed body and a second pressed body that face each other in a first direction. A first leaf spring part and a second leaf spring part are provided so as to be stacked in one direction, and the first leaf spring part is supported by the first pressed body and the second leaf spring part is supported by the second pressed body. The second leaf spring part is curved to have a protruding top part in the first direction, and the first leaf spring part has a lower spring constant in the first direction than the second leaf spring part, and the first leaf spring part has a lower spring constant in the first direction than the second leaf spring part. The pushing load in the first direction applied to the leaf spring device, which is required to push and deform the first leaf spring part in the first direction, pushes and deforms the second leaf spring part in the first direction. In other words, it is larger than the pushing load in the first direction that is applied to this leaf spring device.

comprising a first leaf spring part and a second leaf spring part stacked in a first direction, a spring constant of the first leaf spring part in the first direction is lower than a spring constant of the second leaf spring part in the first direction; The pushing load in the first direction applied to this leaf spring device, which is required to push and deform the first leaf spring part in the first direction, is applied to this leaf spring device, which is required to push and deform the second leaf spring part in the first direction. This is larger than the pushing load in the first direction applied to the spring device.
Therefore, in the process of increasing the pushing load in the first direction applied to the leaf spring device, the second leaf spring part having a high spring constant in the first direction is first deformed, and then the second leaf spring part having a low spring constant in the first direction is deformed. The first plate spring portion begins to be pushed and deformed. Thereby, in the process of increasing the pushing load in the first direction applied to the leaf spring device, the spring constant that is developed can be increased when the displacement is small and decreased when the displacement is large.
From the above, even if both the pushing load and pushing amount applied to the leaf spring device are kept low when assembling the leaf spring device between the first pressed body and the second pressed body, the first pressed body and It is possible to easily apply a necessary and sufficient load to the second pressed body in a direction that causes them to move away from each other in the first direction.
In other words, when using the first leaf spring portion having a low spring constant in the first direction alone, when trying to apply the above-mentioned load of necessary and sufficient magnitude to the first pressed body and the second pressed body, the leaf spring When assembling the device, it is necessary to significantly push and deform the first leaf spring portion to generate a high reaction force in the first leaf spring portion, which makes this assembly difficult.
Further, for example, when using the leaf spring device with the second leaf spring part having a high spring constant in the first direction pushed in in the first direction to the extent that it does not deform, the first pressed object When the second pressed body moves relatively close to each other in the first direction, a low spring constant of the first plate spring portion is developed, and the second pressed body is applied to the first pressed body and the second pressed body. Load fluctuations in one direction can be made gentler.

The device may include a holding member that holds the first leaf spring portion in a state where a pushing load is applied to push the first leaf spring portion in the first direction.

Since the first leaf spring unit is equipped with a holding member that holds the first leaf spring in a state where a push load is applied, in the process of increasing the push load in the first direction applied to the leaf spring device, first, the spring constant in the first direction is increased. When the high second plate spring part is pushed and deformed, and then a pushing load greater than the pushing load applied in advance by the holding member is applied to the first plate spring part, the first plate with a lower spring constant in the first direction The spring part begins to be pushed and deformed. As a result, in the process of increasing the pushing load in the first direction applied to the leaf spring device, it is possible to reliably achieve a spring constant that is high when the displacement is small and low when the displacement is large.

When the second leaf spring part is pushed in the first direction, a regulating part may be provided that restricts further pushing deformation of the second leaf spring part in the first direction.

When the second leaf spring part is pushed and deformed in the first direction, it is provided with a regulating part that restricts further pushing deformation of the second leaf spring part in the first direction. In the process of increasing the pushing load in the direction, first, the second leaf spring part having a high spring constant in the first direction is pushed and deformed, and then further pushing deformation of the second leaf spring part is regulated by the regulating part. In this state, the first plate spring portion having a low spring constant in the first direction begins to be deformed. As a result, in the process of increasing the pushing load in the first direction applied to the leaf spring device, it is possible to reliably achieve a spring constant that is high when the displacement is small and low when the displacement is large.

When the regulating portion restricts further pushing deformation of the second leaf spring portion in the first direction, the pushing load applied to the leaf spring device in the first direction is applied to the first leaf spring portion. may be greater than or equal to the pushing load in the first direction applied to the leaf spring device when it starts to be pushed into deformation in the first direction.

As a result, in the process of increasing the pushing load applied to the leaf spring device in the first direction, the pushing deformation of the leaf spring device in the first direction is not restricted, and the spring constant in the first direction that the leaf spring device develops is can be switched smoothly.

The first leaf spring part and the second leaf spring part are curved in opposite directions to each other in the first direction, and are provided so that their top parts overlap in the first direction, and the second leaf spring part is curved in opposite directions to each other in the first direction. The restriction portion may be provided between the top portion and the second pressed body.

The first leaf spring part and the second leaf spring part are curved in opposite directions to each other in the first direction, and the respective top parts are provided so as to overlap each other in the first direction. It becomes possible to easily secure a wide space between the top portion and the second pressed body, and it is possible to make it difficult to impose restrictions on the size of the restriction portion provided in this portion. Therefore, when the regulating portion restricts further pushing deformation of the second leaf spring portion in the first direction, it is possible to easily set the pushing load to be applied to the leaf spring device in the first direction.

The holding member includes a seat plate provided between the first leaf spring portion and the first pressed body, and a connecting portion connecting the regulating portion and the seat plate in the first direction. You may prepare.

Since the holding member includes a connecting portion that connects the regulating portion and the seat plate, the number of parts can be reduced and, for example, there is no need to provide a locking portion of the holding member on the first pressed body. The first pressed body can be used as is without changing the design.
The connecting portion includes a seat plate provided between the first leaf spring portion and the first pressed body, and a restriction portion provided between the top of the second leaf spring portion and the second pressed body. , so that the holding member and the regulating part also serve as a connecting member that connects the first leaf spring part and the second leaf spring part to each other in the first direction, and the first leaf spring part and the second leaf spring part Relative displacement of the leaf spring portion in the direction intersecting the first direction is suppressed, and the characteristics exhibited by the leaf spring device against the pushing load in the first direction applied to the leaf spring device can be stabilized.

A connecting member may be provided that connects the first leaf spring part and the second leaf spring part to each other in the first direction.

Since the connecting member that connects the first leaf spring part and the second leaf spring part to each other in the first direction is provided, the movement of the first leaf spring part and the second leaf spring part in the direction crossing the first direction is provided. It becomes possible to suppress relative displacement, and the characteristics exhibited by the leaf spring device against the pushing load in the first direction applied to the leaf spring device can be stabilized.

A power conversion device of the present invention is a power conversion device in which a semiconductor laminated unit and a leaf spring device of the present invention are housed in a housing in a state where they are arranged in the first direction, wherein the semiconductor laminated unit comprises at least one semiconductor module and one cooling pipe arranged alternately in the first direction, and one of the first pressed body and the second pressed body serves as the casing. In addition, the other one is the semiconductor stacked unit.

When the first leaf spring portion having a low spring constant in the first direction is used alone to control both the pushing load and pushing amount applied to the leaf spring device when the leaf spring device is assembled between the casing and the semiconductor stacked unit. Even if the load is kept low compared to , it is possible to easily apply a necessary and sufficient load to the casing and the semiconductor stacked unit in a direction that causes them to move away from each other in the first direction.
In addition, for example, when using a leaf spring device with the second leaf spring part having a high spring constant in the first direction pushed in in the first direction to the extent that it does not deform, the housing and the semiconductor stack When the unit moves relatively close to each other in the first direction, a low spring constant of the first plate spring portion is developed, and it is possible to moderate the load fluctuations in the first direction that occur on the casing and the semiconductor stacked unit. can.

According to this invention, in the process of increasing the pushing load in the first direction applied to the leaf spring device, the spring constant that is developed can be made high when the displacement is small and low when the displacement is large.

FIG. 1 is a longitudinal cross-sectional view of a power conversion device according to an embodiment. FIG. 2 is a longitudinal cross-sectional view of the leaf spring device of the first embodiment. FIG. 2B is a sectional view taken along the line IIB-IIB in FIG. 2A. FIG. 2A is a diagram showing a state in which the restriction portion restricts further pushing deformation of the second leaf spring portion in the first direction; FIG. 2A is a diagram illustrating a state in which the first leaf spring portion is pushed and deformed in a first direction in FIG. 2A. It is a longitudinal cross-sectional view of a leaf spring device of a 2nd embodiment. It is a longitudinal cross-sectional view of a leaf spring device of a 3rd embodiment. 4A is a sectional view taken along the line IVB-IVB in FIG. 4A. FIG. It is a longitudinal cross-sectional view of a leaf spring device of a 4th embodiment. FIG. 5A is a sectional view taken along the line VB-VB in FIG. 5A. It is a longitudinal cross-sectional view of the leaf spring device of a 5th embodiment.

Hereinafter, one embodiment of the leaf spring device 1 and the power conversion device 10 will be described with reference to FIG. 1 and FIGS. 2A to 2D.
The power conversion device 10 is configured such that a semiconductor laminated unit 101 and a leaf spring device 1 are housed in a housing 102 in a state in which they are arranged in a first direction Z. Generates a drive current to In the illustrated example, a flat contact plate 106 is provided between the semiconductor stacked unit 101 and the leaf spring device 1.

The semiconductor stack unit 101 includes a plurality of semiconductor modules 103 and a plurality of cooling pipes 104 arranged alternately in the first direction Z. Note that the semiconductor module 103 and the cooling pipe 104 may be provided one each, or may be provided in different quantities.

The semiconductor module 103 includes a pair of heat sinks spaced apart in the first direction Z, an IGBT element for power supply, a flywheel diode element for smoothly driving the travel motor, and a sealing material. , is equipped with. Note that the semiconductor module 103 may be modified as appropriate.
The IGBT element and the flywheel diode element are provided between a pair of heat sinks. The sealing material is made of a resin material, connects the pair of heat sinks with the heat sink exposed, and seals the IGBT element and the flywheel diode element.
In the illustrated example, a plurality of semiconductor modules 103 are provided between cooling pipes 104 adjacent to each other in the first direction Z at intervals in the second direction X perpendicular to the first direction Z.

The cooling pipe 104 is formed in a flat shape that is collapsed in the first direction Z. A refrigerant flows within the cooling pipe 104 . The insides of the plurality of cooling pipes 104 communicate with each other through a connecting pipe 105 extending in the first direction Z. A plurality of connecting pipes 105 are provided at intervals in the second direction X. Refrigerant is supplied from the supply section to one of the plurality of connecting pipes 105, and refrigerant is discharged from the other one toward the supply section. The cooling pipe 104 is pressed against the heat sink of the semiconductor module 103 by a pressing load from the leaf spring device 1 in the first direction Z.

One leaf spring device 1 is provided between the semiconductor stacked unit 101 and the inner surface of the casing 102, which face each other in the first direction Z. Note that a plurality of leaf spring devices 1 may be provided at intervals in the second direction X.
The leaf spring device 1 includes a first leaf spring part 11 and a second leaf spring part 12 which are provided to be stacked in the first direction Z. The first leaf spring part 11 and the second leaf spring part 12 are curved so as to have apexes that protrude in the first direction Z.

In the illustrated example, the first leaf spring part 11 and the second leaf spring part 12 have short sides extending in the third direction Y orthogonal to the second direction X when viewed from the first direction Z, and It is a plate having a rectangular shape with long sides extending in the direction X. The apex portion is formed at the center of each of the first leaf spring portion 11 and the second leaf spring portion 12 in the second direction X.

In addition, the said top part may be formed in the position away from the center part of the 2nd direction X of the 1st leaf spring part 11 and the 2nd leaf spring part 12 in the 2nd direction X, respectively. When viewed from the first direction Z, the directions in which the long sides of the first leaf spring part 11 and the second leaf spring part 12 extend may be different from each other.

The first leaf spring portion 11 and the second leaf spring portion 12 are curved in opposite directions to each other in the first direction Z, and are provided so that the top portions overlap each other in the first direction Z.

Note that the respective top portions of the first leaf spring portion 11 and the second leaf spring portion 12 may be fixed by welding, adhesion, or the like.
Further, the respective top portions of the first leaf spring portion 11 and the second leaf spring portion 12 are connected to each other in the third direction Y at the top portion of either one of the first leaf spring portion 11 and the second leaf spring portion 12. Both ends may be wound and fixed to both ends of the other top in the third direction Y.
Further, the surfaces of the top portions of the first leaf spring portion 11 and the second leaf spring portion 12 that come into contact with each other may be formed flat.

In the illustrated example, the first leaf spring section 11 is supported by the casing (first pressed body) 102 via a seat plate 14, which will be described later, and the second leaf spring section 12 is supported via a contact plate 106. It is supported by a semiconductor stack unit (second pressed body) 101. The top portion of the first leaf spring portion 11 bulges toward the semiconductor stacked unit 101 side along the first direction Z, and the top portion of the second leaf spring portion 12 bulges toward the housing 102 side along the first direction Z. It's bulging towards. Both end portions of the first leaf spring portion 11 in the second direction X are slidably in contact with a seat plate 14, which will be described later. Both ends of the second leaf spring portion 12 in the second direction X are slidably abutted on the abutment plate 106.

The spring constant of the first leaf spring part 11 in the first direction Z is lower than the spring constant of the second leaf spring part 12 in the first direction Z.
Before being assembled into the power conversion device 10 as shown in FIGS. 2A and 2B, the first direction applied to the leaf spring device 1 is required to push and deform the first leaf spring portion 11 in the first direction Z. The pushing load in Z is larger than the pushing load in the first direction Z that is applied to the leaf spring device 1 and is required to push and deform the second leaf spring portion 12 in the first direction Z.
When the first leaf spring part 11 and the second leaf spring part 12 are pushed and deformed in the first direction Z, they extend in the second direction X and are elastically deformed in a direction in which they contract in the first direction Z, that is, in a direction in which they become flat. .

In this embodiment, when the second leaf spring part 12 is pushed in the first direction Z, a regulating part 13 is provided that restricts further pushing deformation of the second leaf spring part 12 in the first direction Z. .

The regulating portion 13 is provided between the top portion of the second leaf spring portion 12 and the contact plate 106 (semiconductor stacked unit 101). The regulating portion 13 is attached to the top portion of the second leaf spring portion 12 . As shown in FIGS. 1 and 2C, the regulating portion 13 is in contact with or close to the contact plate 106. Before the leaf spring device 1 is assembled to the power converter 10, the regulating portion 13 is positioned in the first direction relative to both ends of the second leaf spring portion 12 in the second direction X, as shown in FIGS. 2A and 2B. It is located on the casing 102 side along Z, that is, at a position away from the contact plate 106 in the first direction Z. The regulating portion 13 is formed into a plate shape with front and back surfaces facing in the first direction Z. The regulating portion 13 is sandwiched and abutted on the top of the second leaf spring portion 12 and the contact plate 106 in the first direction Z, thereby preventing the second leaf spring portion 12 from being pushed further in the first direction Z. Deformation is regulated.

As shown in FIG. 2C, when the regulating part 13 restricts the further pushing deformation of the second leaf spring part 12 in the first direction Z, the pushing force applied to the leaf spring device 1 in the first direction Z The load is greater than or equal to the pushing load in the first direction Z that is applied to the leaf spring device 1 when the first leaf spring portion 11 starts to be pushed and deformed in the first direction Z.
In this embodiment, the former indentation load is the same as the latter indentation load.

A holding member 16 is provided that holds the first leaf spring portion 11 in a state where a pushing load is applied to the first leaf spring portion 11 in the first direction Z before the leaf spring device 1 is assembled to the power conversion device 10. In the illustrated example, the holding member 16 includes a seat plate 14 and a connecting portion 15.

The seat plate 14 is a flat plate whose front and back surfaces face in the first direction Z, and is provided between the first leaf spring section 11 and the housing 102. The seat plate 14 slidably supports both ends of the first plate spring portion 11 in the second direction X.
The connecting portion 15 connects the regulating portion 13 and the seat plate 14 in the first direction Z. The connecting portion 15 integrally penetrates the first leaf spring portion 11 and the second leaf spring portion 12 in the first direction Z. The first leaf spring part 11 and the second leaf spring part 12 are provided in the connecting part 15 so as to be movable in the first direction Z.

A tensile force in the first direction Z is applied to the connecting portion 15 . As a result, a pushing load in the first direction Z is applied to the first leaf spring part 11, and with both ends of the first leaf spring part 11 in the second direction X in pressure contact with the seat plate 14, the first leaf spring part 11 extends in the second direction X and is elastically deformed in the direction of contracting in the first direction Z. In other words, the first plate spring portion 11 is held in a state in which it is pushed and deformed in the first direction Z. By changing the tensile force in the first direction Z applied to the connecting portion 15, the pushing force applied to the leaf spring device 1 in the first direction Z when the first leaf spring portion 11 starts to be pushed and deformed in the first direction Z. Load can be adjusted.

In the illustrated example, a recess is formed in the surface of the seat plate 14 facing the housing 102 along the first direction Z. A flat plate 14a is accommodated within the recess. The connecting portion 15 penetrates the seat plate 14 in the first direction Z and enters the recess, and is connected to the flat plate 14a. Note that the flat plate 14a may be formed integrally with the seat plate 14.
The connecting portion 15 has a tensile strength capable of maintaining a state in which an indentation load in the first direction Z is applied to the first leaf spring portion 11, and increases the indentation load in the first direction Z applied to the leaf spring device 1. In the process of deformation, the first leaf spring part 11 and the second leaf spring part 12 are made of, for example, a wire or the like that is easily deformed and does not affect the pushing deformation of the first leaf spring part 11 and the second leaf spring part 12.
Note that a rigid pin or the like that is difficult to deform may be used as the connecting portion, and a recessed portion into which the connecting portion and the flat plate 14a can enter in the first direction Z may be provided in the housing 102.

The connecting portion 15 is a restriction portion provided between the seat plate 14 provided between the first leaf spring portion 11 and the housing 102 and the abutment plate 106 and the top of the second leaf spring portion 12. 13, so that the holding member 16 and the regulating part 13 connect the respective top parts of the first leaf spring part 11 and the second leaf spring part 12 to each other in the first direction Z. It also serves as
Note that a plurality of connecting members 17 (holding members 16 and regulating portions 13) may be provided at intervals in the third direction Y, for example.

Before the leaf spring device 1 is assembled into the power conversion device 10 as shown in FIGS. 2A and 2B, in the process of increasing the pushing load in the first direction Z applied to the leaf spring device 1, the leaf spring device 1 first The second plate spring portion 12 having a high spring constant in the first direction Z, to which no indentation load in one direction Z is initially applied, is indented and deformed, and then the indentation load in the first direction Z is applied by the holding member 16 from the beginning. The added first plate spring portion 11 having a low spring constant in the first direction Z begins to be pushed and deformed.

At this time, in this embodiment, as shown in FIG. 2C, the regulating section 13 is configured to act on the leaf spring device 1 when regulating further pushing deformation of the second leaf spring section 12 in the first direction Z. The applied indentation load in the first direction Z becomes the same as the indentation load in the first direction Z applied to the leaf spring device 1 when the first leaf spring portion 11 starts to be deformed in the first direction Z. ing. Therefore, almost at the same time that the regulating part 13 restricts the further pushing deformation of the second leaf spring part 12, the first leaf spring part 11 is pushed by a pushing load greater than the pushing load applied in advance by the holding member 16. As a load is applied, the first plate spring portion 11 begins to be pushed and deformed. As the first plate spring portion 11 is pushed into shape, the connecting portion 15 is deformed as shown in FIG. 2D.

As shown in FIGS. 1 and 2C, when the leaf spring device 1 is assembled to the power conversion device 10, the second leaf spring portion 12 is pushed in the first direction Z, so that the restriction portion 13 is While in contact with or close to the contact plate 106, no load other than the pushing load applied in advance by the holding member 16 is applied to the first leaf spring part 11.
Note that in a state where the leaf spring device 1 is assembled to the power conversion device 10, the regulating portion 13 may be separated from the contact plate 106 in the first direction Z.

As explained above, the leaf spring device 1 according to the present embodiment includes the first leaf spring part 11 and the second leaf spring part 12 stacked in the first direction Z, and This leaf spring device 1 has a spring constant in one direction Z that is lower than a spring constant of the second leaf spring part 12 in the first direction Z, and is required to push and deform the first leaf spring part 11 in the first direction Z. The pushing load applied in the first direction Z is larger than the pushing load applied to the leaf spring device 1 in the first direction Z, which is required to push and deform the second leaf spring portion 12 in the first direction Z.

Therefore, before the leaf spring device 1 is assembled into the power conversion device 10 as shown in FIGS. 2A and 2B (hereinafter referred to as a single leaf spring device 1), the first direction Z added to the leaf spring device 1 is In the process of increasing the pushing load of It begins to transform. Thereby, in the process of increasing the pushing load in the first direction Z applied to the leaf spring device 1, the spring constant that is developed can be increased when the displacement is small and decreased when the displacement is large.

From the above, when assembling the leaf spring device 1 between the casing 102 and the semiconductor stacked unit 101, both the pushing load and pushing amount applied to the leaf spring device 1 are set to the first spring with the lower spring constant in the first direction Z. Even if the leaf spring portion 11 is kept low compared to the case where it is used alone, it is possible to easily apply a necessary and sufficient load to the housing 102 and the semiconductor stacked unit 101 in the direction of separating them from each other in the first direction Z. can.
That is, when the first leaf spring portion 11 having a low spring constant in the first direction Z is used alone, if an attempt is made to apply the above-mentioned load of a necessary and sufficient magnitude to the housing 102 and the semiconductor stacked unit 101, the leaf spring device 1, it is necessary to push and deform the first leaf spring part 11 significantly to generate a high reaction force in the first leaf spring part 11, which makes this assembly difficult.

Further, for example, when the leaf spring device 1 is used with the second leaf spring part 12 having a high spring constant in the first direction Z pushed in in the first direction Z to the extent that it does not deform, the casing When the body 102 and the semiconductor stacked unit 101 move relatively toward each other in the first direction Z due to, for example, thermal expansion of the semiconductor module 103, a low spring constant of the first plate spring portion 11 is developed. Therefore, the load fluctuation in the first direction Z that occurs in the housing 102 and the semiconductor stacked unit 101 can be made gentler.

Since the holding member 16 is provided to hold the first leaf spring portion 11 in a state where a pushing load is applied, the process of increasing the pushing load in the first direction Z applied to the leaf spring device 1 in the leaf spring device 1 alone is , first, the second leaf spring part 12 having a high spring constant in the first direction Z is deformed, and then an indentation load greater than the indentation load applied in advance by the holding member 16 is applied to the first leaf spring part 11. When the force is applied, the first plate spring portion 11 having a low spring constant in the first direction Z starts to be pushed and deformed. Thereby, in the process of increasing the indentation load in the first direction Z applied to the leaf spring device 1, it is possible to reliably achieve a spring constant that is high when the displacement is small and low when the displacement is large. .

When the second leaf spring part 12 is pushed and deformed in the first direction Z, the leaf spring device 1, in the process of increasing the pushing load in the first direction Z applied to the leaf spring device 1, the second leaf spring part 12 having a high spring constant in the first direction Z is first deformed by pushing, and then no more In a state where the pushing deformation of the second leaf spring part 12 is regulated by the regulating part 13, the first leaf spring part 11 having a low spring constant in the first direction Z starts to be pushed into deformation. Thereby, in the process of increasing the indentation load in the first direction Z applied to the leaf spring device 1, it is possible to reliably achieve a spring constant that is high when the displacement is small and low when the displacement is large. .

When the regulating part 13 restricts further pushing deformation of the second leaf spring part 12 in the first direction Z, the pushing load in the first direction Z applied to the leaf spring device 1 is applied to the first leaf spring part 1. 11 is greater than the indentation load in the first direction Z applied to the leaf spring device 1 when it starts to be indented and deformed in the first direction Z.
Therefore, in the process of increasing the pushing load in the first direction Z applied to the leaf spring device 1 alone, the pushing deformation of the leaf spring device 1 in the first direction Z is not restricted, and the leaf spring The spring constant in the first direction Z exerted by the device 1 can be smoothly switched.

The first leaf spring part 11 and the second leaf spring part 12 are curved in opposite directions in the first direction Z, and are provided so that their respective top parts overlap in the first direction Z. A wide space can be easily secured between the top of the spring part 12 and the contact plate 106 (semiconductor stacked unit 101), and the size of the regulating part 13 provided in this part is not restricted. It can be made difficult. Therefore, when the regulating section 13 restricts further pushing deformation of the second leaf spring section 12 in the first direction Z, it is possible to easily set the pushing load to be applied to the leaf spring device 1 in the first direction Z. I can do it.

Since the holding member 16 includes the connecting portion 15 that connects the regulating portion 13 and the seat plate 14, the number of parts can be reduced and, for example, it is not necessary to provide a locking portion of the holding member 16 on the housing 102. Therefore, the housing 102 can be used as is without any design changes.

The connecting portion 15 is a restriction portion provided between the seat plate 14 provided between the first leaf spring portion 11 and the housing 102 and the abutment plate 106 and the top of the second leaf spring portion 12. 13, the holding member 16 and the regulating part 13 also serve as the connecting member 17 that connects the first leaf spring part 11 and the second leaf spring part 12 to each other in the first direction Z, The relative displacement of the first leaf spring part 11 and the second leaf spring part 12 in the direction intersecting the first direction Z is suppressed, and the plate The characteristics exhibited by the spring device 1 can be stabilized.

Next, a leaf spring device 2 according to a second embodiment of the present invention will be described with reference to FIG. 3.
In addition, in this 2nd embodiment, the same code|symbol is attached|subjected to the same component as the component in 1st Embodiment, the description is abbreviate|omitted, and only a different point will be described.

In the leaf spring device 2 of this embodiment, when the second leaf spring part 12 is pushed in the first direction Z, the regulating part restricts further pushing deformation of the second leaf spring part 12 in the first direction Z. 23 extends integrally through the first leaf spring portion 11 and the second leaf spring portion 12 in the first direction Z. The regulating portion 23 sandwiches the respective top portions of the first leaf spring portion 11 and the second leaf spring portion 12 in the first direction Z. The regulating portion 23 also serves as a connecting member 17 that connects the first leaf spring portion 11 and the second leaf spring portion 12 to each other in the first direction Z. The regulating portion 23 is a rivet.

As explained above, according to the leaf spring device 2 according to the present embodiment, similarly to the leaf spring device 1 according to the first embodiment, the spring developed in the process of increasing the applied pushing load in the first direction Z The constant can be high for small displacements and low for large displacements, etc.

Next, a leaf spring device 3 according to a third embodiment of the present invention will be described with reference to FIGS. 4A and 4B.
In addition, in this 3rd embodiment, the same code|symbol is attached|subjected to the same component as the component in 2nd Embodiment, the description is abbreviate|omitted, and only a different point will be described.

In the leaf spring device 3 of this embodiment, the holding member 36 that holds the first leaf spring part 11 in a state where a pushing load is applied to push it in the first direction Z includes the seat plate 14 and the locking part 36a. , the connecting portion 15 and the flat plate 14a are not provided.

Both end portions of the first leaf spring portion 11 in the third direction Y protrude outward in the third direction Y than both end portions of the second leaf spring portion 12 in the third direction Y.
The locking portion 36a extends from each portion of the seat plate 14 that is located outside the first leaf spring portion 11 and the second leaf spring portion 12 in the third direction Y toward the semiconductor stacked unit 101 side along the first direction Z. The first plate spring portion 11 protrudes and locks both ends of the top portion of the first plate spring portion 11 in the third direction Y, respectively. The locking portion 36a is formed integrally with the seat plate 14. The tip portion 36b of the locking portion 36a on the side of the semiconductor stacked unit 101 along the first direction Z protrudes inward in the third direction Y, and the tip portion 36b of the locking portion 36a on the side of the semiconductor stacked unit 101 along the first direction Z protrudes inward in the third direction Y, and It is in contact with the surface facing the stacked unit 101 side. The distance between the tip portions 36b of the pair of locking portions 36a facing each other in the third direction Y is larger than the size of the semiconductor stack unit 101 in the third direction Y. As the semiconductor stacked unit 101 moves in the first direction Z, it is provided so as to move forward and backward with respect to the space between the tip ends 36b of the pair of locking portions 36a.

Note that the sizes of the first leaf spring part 11 and the second leaf spring part 12 in the third direction Y are the same, and the centers of the first leaf spring part 11 and the second leaf spring part 12 in the third direction Y are the same. The positions of the parts may be made to match.
The tip portion 36b of the locking portion 36a may be brought into contact with the surface of the top portion of the second leaf spring portion 12 facing the semiconductor stacked unit 101 side along the first direction Z.
The locking portion 36a may be separate from the seat plate 14.

As explained above, according to the leaf spring device 3 according to the present embodiment, similarly to the leaf spring device 1 according to the first embodiment, the spring developed in the process of increasing the applied pushing load in the first direction Z The constant can be high for small displacements and low for large displacements, etc.

Next, a leaf spring device 4 according to a fourth embodiment of the present invention will be described with reference to FIGS. 5A and 5B.
In addition, in this 4th embodiment, the same code|symbol is attached|subjected to the same component as the component in 1st Embodiment, the description is abbreviate|omitted, and only a different point will be described.

In the leaf spring device 4 of this embodiment, the second leaf spring part 42 bulges toward the semiconductor stacked unit 101 side along the first direction Z, and the first leaf spring part 11 and the second leaf spring part 42 They are curved in the same direction of the first direction Z. When viewed from the third direction Y, the radius of curvature of the first leaf spring portion 11 is larger than the radius of curvature of the second leaf spring portion 42. The top portion of the first leaf spring portion 11 faces the top portion of the second leaf spring portion 12 in the first direction Z. Both end portions of the second leaf spring portion 42 in the second direction X are slidably in contact with the surface of the first leaf spring portion 11 facing the semiconductor stacked unit 101 side along the first direction Z. The top portion of the second leaf spring portion 42 is supported by the semiconductor stack unit 101 via the contact plate 106 .

The regulating portion 13 is provided between the top portion of the first leaf spring portion 11 and the top portion of the second leaf spring portion 42 . The regulating portion 13 is attached to the top portion of the first leaf spring portion 11 . The regulating portion 13 is separated from the top portion of the second leaf spring portion 12 in the first direction Z before the leaf spring device 1 is assembled to the power conversion device 10 . When the second leaf spring part 42 is pushed in the first direction Z and the regulating part 13 comes into contact with the top part of the second leaf spring part 42, the second leaf spring part 12 is pushed in the first direction Z further. Indentation deformation is regulated.

Connecting members 47 that connect the first leaf spring part 11 and the second leaf spring part 42 to each other in the first direction Z are provided on both sides of the regulating part 13 in the third direction Y.
The connecting member 47 includes a first flat plate 47a provided on a surface of the first leaf spring portion 11 facing the housing 102 side along the first direction Z, and a first flat plate 47a provided on a surface of the second leaf spring portion 42 facing the casing 102 side along the first direction Z. The second flat plate 47b is provided on the front surface side facing the semiconductor stacked unit 101 along the direction Z, and the connecting portion 47c connects the first flat plate 47a and the second flat plate 47b to each other in the first direction Z.

A recessed portion in which the second flat plate 47b is accommodated is formed in the surface of the second leaf spring portion 42 facing the semiconductor stacked unit 101 side along the first direction Z.
The connecting portion 47c penetrates the top portions of the first leaf spring portion 11 and the second leaf spring portion 42 in the first direction Z. The connecting portion 47c is made of, for example, a wire that is deformable. The first leaf spring part 11 and the second leaf spring part 42 are provided in the connecting part 47c so as to be movable in the first direction Z. No tensile force in the first direction Z is applied to the connecting portion 47c, and the connecting member 47 does not push the second plate spring portion 42 in the first direction Z to deform it.

Note that the connecting member 47 is provided at the center of the leaf spring device 4 in the third direction Y, does not have the first flat plate 47a, and the connecting part 47c connects the second flat plate 47b and the regulating part 13 in the first direction Z. A configuration in which the two are connected may also be adopted.
The connecting member 47 may not be provided.

As explained above, according to the leaf spring device 4 according to the present embodiment, similar to the leaf spring device 1 according to the first embodiment, the spring developed in the process of increasing the applied pushing load in the first direction Z The constant can be high for small displacements and low for large displacements, etc.

Next, a leaf spring device 5 according to a fifth embodiment of the present invention will be described with reference to FIG. 6.
In addition, in this 5th embodiment, the same code|symbol is attached|subjected to the same component as the component in 4th Embodiment, the description is abbreviate|omitted, and only a different point will be described.

In the leaf spring device 5 of this embodiment, the connecting member 47 is not provided, and when the second leaf spring part 52 is pushed in the first direction Z, the regulating part A recessed portion 52a into which 13 enters is formed. The recessed portion 52a penetrates the second leaf spring portion 52 in the first direction Z. Note that the recessed portion 52a does not need to penetrate the second leaf spring portion 52 in the first direction Z.
When the second leaf spring portion 52 is pushed in the first direction Z, the restriction portion 13 enters the recess 52a, and the second leaf spring portion 52 By contacting both of the top portions, further pushing deformation of the second plate spring portion 52 in the first direction Z is restricted.

Note that when the second leaf spring part 52 is pushed in the first direction Z, the regulating part 13 enters the recess 52a and comes into contact with the contact plate 106, so that the second leaf spring part 52 A configuration may be adopted in which pushing deformation in the first direction Z is restricted.

As explained above, according to the leaf spring device 5 according to the present embodiment, similarly to the leaf spring device 1 according to the first embodiment, the spring developed in the process of increasing the applied pushing load in the first direction Z The constant can be high for small displacements and low for large displacements, etc.

Note that the technical scope of the present invention is not limited to the embodiments described above, and various changes can be made without departing from the spirit of the present invention.

For example, the leaf spring devices 1 to 5 may be applied not only to the power conversion device 10 but also to other devices.
The first leaf spring portion 11 may be supported by the semiconductor stacked unit 101 via the contact plate 106, and the second leaf spring portions 12, 42, and 52 may be supported by the casing 102.

When the regulating portions 13 and 23 restrict further pushing deformation of the second leaf spring portions 12, 42, and 52 in the first direction Z, and when the first leaf spring portion 11 restricts further pushing deformation in the first direction Z. The pushing load in the first direction Z that is applied to the leaf spring devices 1 to 5 at the beginning and at the beginning may be different from each other.
That is, when the regulating parts 13 and 23 regulate further pushing deformation of the second leaf spring parts 12, 42, and 52 in the first direction Z, the first direction Z applied to the leaf spring devices 1 to 5 is The pushing load may be larger or smaller than the pushing load in the first direction Z applied to the leaf spring devices 1 to 5 when the first leaf spring portion 11 starts to be pushed and deformed in the first direction Z. You may.
If the pushing load of the former is larger than the pushing load of the latter, in the process of increasing the pushing load in the first direction Z applied to the single leaf spring devices 1 to 5 before assembly, the pushing load of the leaf spring devices 1 to 5 is increased. The spring constants of the second leaf spring parts 12, 42, 52 and the spring constants of the first leaf spring parts 11 and the second leaf spring parts 12, 42, 52 are not restricted in the first direction Z. A lower spring constant and a spring constant of the first plate spring portion 11 are developed in this order.

In addition, it is possible to appropriately replace the components in the embodiments with well-known components without departing from the spirit of the present invention, and the embodiments and modifications described above may be combined as appropriate.

1, 2, 3, 4, 5 leaf spring device 10 power converter 11 first leaf spring part 12, 42, 52 second leaf spring part 13, 23 regulating part 14 seat plate 15 connecting part 16, 36 holding member 17, 47 Connecting member 101 Semiconductor laminated unit (second pressed body)
102 Housing (first pressed body)
103 semiconductor module 104 cooling pipe Z first direction

Claims (8)

A first leaf spring part and a second leaf spring part are provided to be stacked in the first direction between a first pressed body and a second pressed body facing each other in the first direction,
The first leaf spring part supported by the first pressed body and the second leaf spring part supported by the second pressed body are curved so as to have an apex that protrudes in the first direction. death,
The first leaf spring part has a lower spring constant in the first direction than the second leaf spring part,
The pushing load in the first direction applied to the leaf spring device required to push and deform the first leaf spring part in the first direction is
A leaf spring device that is larger than a pushing load in the first direction that is applied to the leaf spring device to push and deform the second leaf spring portion in the first direction. The leaf spring device according to claim 1, further comprising a holding member that holds the first leaf spring portion in a state where a pushing load is applied to push the first leaf spring portion in the first direction. According to claim 2, further comprising a regulating portion that restricts further pushing deformation of the second leaf spring portion in the first direction when the second leaf spring portion is pushed in the first direction. leaf spring device. When the regulating portion restricts further pushing deformation of the second leaf spring portion in the first direction, the pushing load applied to the leaf spring device in the first direction is:
4. The leaf spring device according to claim 3, wherein the first leaf spring portion has a pushing load in the first direction applied to the leaf spring device when the first leaf spring starts to be pushed in the first direction. The first leaf spring part and the second leaf spring part are curved in opposite directions to each other in the first direction, and are provided so that the top parts overlap each other in the first direction,
The leaf spring device according to claim 3 or 4, wherein the restriction portion is provided between the top portion of the second leaf spring portion and the second pressed body. The holding member is
a seat plate provided between the first leaf spring portion and the first pressed body;
The leaf spring device according to any one of claims 3 to 5, further comprising a connecting portion that connects the regulating portion and the seat plate in the first direction. The leaf spring device according to any one of claims 1 to 6, further comprising a connecting member that connects the first leaf spring part and the second leaf spring part to each other in the first direction. A power conversion device in which a semiconductor stacked unit and a leaf spring device according to any one of claims 1 to 7 are housed in a housing in a state where they are arranged in the first direction,
The semiconductor stack unit includes at least one semiconductor module and one cooling pipe arranged alternately in the first direction,
In the power conversion device, one of the first pressed body and the second pressed body serves as the casing, and the other serves as the semiconductor laminated unit.

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