JP2023136705A - Photosensitive resin composition, cured film and touch panel - Google Patents

Abstract

To provide a photosensitive resin composition which enables formation of a cured film that has a high refractive index and high smoothness of a film surface, and can suppress increase in a resistance value of an ITO electrode formed on the cured film.SOLUTION: A photosensitive resin composition contains (A) an alkali-soluble resin (B) composite metal compound particles of at least one metallic compound particles selected from the group consisting of titanium compound particles, zirconium compound particles, tin compound particles and aluminum compound particles, or at least one metallic compound selected from the group consisting of a titanium compound, a zirconium compound, a tin compound and an aluminum compound, and a silicon compound, (C) a photopolymerization initiator which contains a ketoxime ester group, and has an absorption peak at a wavelength of 325-340 nm, and (D) an ultraviolet absorber which has an absorption peak at a wavelength of 330-345 nm, and has a radical polymerizable group.SELECTED DRAWING: None

Description

The present invention relates to a photosensitive resin composition, a cured film, and a touch panel member.

Capacitive touch panels, liquid crystal display devices, organic EL devices, and the like generally use a transparent conductive substrate in which a transparent electrode made of tin-doped indium oxide (ITO) or the like is formed on the substrate. The refractive index of transparent electrodes formed from ITO changes greatly depending on the temperature of the substrate on which the film is formed, so the color difference becomes large between areas with and without ITO electrodes, and a phenomenon in which the ITO electrode pattern is visually recognized (pattern visibility) occurs. It becomes a challenge. Therefore, as a technique for suppressing pattern visibility, a technique has been developed in which a thin film of Nb ₂ O ₅ and SiO ₂ is provided as an undercoat layer or a topcoat layer (see, for example, Patent Documents 1 and 2).

In recent years, in order to further improve the visibility of displays, there has been an increasing need for technology that suppresses the visibility of patterns not only in ITO electrodes but also in insulating films. There is a need for a photosensitive material having a high
Therefore, as photosensitive materials having a high refractive index and excellent chemical resistance and adhesion, for example, oxide fine particles, alkali-soluble resins, specific fluorene skeleton compounds or thermosetting resins, and functional groups of 4 or more are used. A resin composition containing a polyfunctional monomer having the following has been proposed (see, for example, Patent Document 3).

In addition, as a photosensitive material with a high refractive index and excellent patterning properties and heat resistance, we also use alkali-soluble resins with a specific structure, photopolymerizable monomers with at least one ethylenically unsaturated bond, photopolymerization initiation A resin composition containing a surfactant, a metal oxide particle, a surfactant, and a silane compound has been proposed (for example, see Patent Document 4).

Japanese Patent Application Publication No. 2010-152809 Japanese Patent Application Publication No. 2010-086684 Japanese Patent Application Publication No. 2014-91790 Japanese Patent Application Publication No. 2016-71359

Although it is possible to obtain a cured film with excellent chemical resistance, heat resistance, and substrate adhesion using the techniques described in Patent Documents 3 and 4, the smoothness of the film surface is insufficient and the cured film is formed as an insulating film. There was a problem that the resistance value of the ITO electrode on the cured film increased.
The present invention was devised in view of the problems of the prior art, and it is possible to form a cured film having a high refractive index and a highly smooth surface, and to reduce the resistance value of the ITO electrode formed on the cured film. It is an object of the present invention to provide a photosensitive resin composition capable of suppressing the increase.

The object of the present invention is achieved by the following configuration. That is, (A) an alkali-soluble resin, (B) at least one metal compound particle selected from the group consisting of titanium compound particles, zirconium compound particles, tin compound particles, and aluminum compound particles, or a titanium compound, a zirconium compound, and a tin compound. and composite metal compound particles of at least one metal compound selected from the group consisting of aluminum compounds and a silicon compound; (C) light containing a ketoxime ester group and having an absorption peak in the wavelength range of 325 to 340 nm; This is a photosensitive resin composition containing a polymerization initiator and (D) an ultraviolet absorber having an absorption peak in the wavelength range of 330 to 345 nm and having a radically polymerizable group.

According to the photosensitive resin composition of the present invention, a cured film having a high refractive index and a highly smooth film surface can be formed, and an increase in the resistance value of an ITO electrode formed on the cured film can be suppressed. is possible.

The present invention will be explained in more detail below.
The photosensitive resin composition of the present invention is a photosensitive resin composition containing the following (A) to (D).
(A) Alkali-soluble resin, (B) at least one metal compound particle selected from the group consisting of titanium compound particles, zirconium compound particles, tin compound particles, and aluminum compound particles, or titanium compound, zirconium compound, tin compound, and aluminum Composite metal compound particles of at least one metal compound selected from the group consisting of compounds and a silicon compound, (C) photopolymerization initiation containing a ketoxime ester group and having an absorption peak in the wavelength range of 325 to 340 nm. (D) a UV absorber having an absorption peak in the wavelength range of 330 to 345 nm and having a radically polymerizable group.

In the present invention, (A) an alkali-soluble resin, (B) at least one metal compound particle selected from the group consisting of titanium compound particles, zirconium compound particles, tin compound particles, and aluminum compound particles, or a titanium compound, a zirconium compound, Composite metal compound particles of at least one metal compound selected from the group consisting of tin compounds and aluminum compounds and a silicon compound (hereinafter sometimes abbreviated as (B) metal compound particles or composite metal compound particles); By containing, a cured film having a high refractive index can be formed.

(C) By containing a photopolymerization initiator, the non-irradiated area exhibits negative photosensitivity that can be removed by a developer, making it possible to perform negative pattern processing. In addition, a photopolymerization initiator containing a ketoxime ester group has high photoreactivity and is less susceptible to oxygen inhibition, and therefore has excellent surface curability and can form a cured film with high surface smoothness. Furthermore, a photopolymerization initiator containing a ketoxime ester group and having an absorption peak in the wavelength range of 325 to 340 nm has low absorbance in the wavelength range of 400 nm or more and has high transparency, resulting in a cure with excellent transparency. A membrane is obtained.

(D) By containing an ultraviolet absorber, curing of unexposed areas due to diffracted light can be suppressed and resolution can be improved. Furthermore, since it has a radically polymerizable group, it can be crosslinked with a resin or monomer during exposure or baking, thereby suppressing bleed-out and improving the transparency and surface smoothness of the cured film. Furthermore, by using an ultraviolet absorber having an absorption peak in the wavelength range of 330 to 345 nm, it is possible to form a cured film with low absorbance in the wavelength range of 400 nm or more and high transparency.

In order to suppress an increase in the resistance value of the ITO electrode formed on the insulating film, it is necessary to increase the smoothness of the surface of the cured film formed as the insulating film. However, if photosensitive resin compositions containing metal compound particles are insufficiently photocured upon exposure, excessive resin components that are highly soluble in an alkaline developer will be washed away during the development process. Metal compound particles with low solubility in the liquid remain excessively on the surface of the cured film, reducing the smoothness of the surface of the cured film. Therefore, by exposing to short-wavelength light that is less susceptible to oxygen inhibition and has high surface hardening properties, the crosslinking density on the surface of the cured film is increased, thereby preventing excess resin components from being washed into the alkaline developer during the development process. It is necessary to suppress the occurrence of drying and increase the smoothness of the surface of the cured film. On the other hand, it has been difficult for photosensitive resin compositions containing metal compound particles to utilize a short wavelength region of 300 nm or less due to light scattering by the metal compound particles. Therefore, the photosensitive resin composition of the present invention contains (C) a photopolymerization initiator having an absorption peak in the wavelength range of 325 to 340 nm, and (D) an ultraviolet absorber having an absorption peak in the wavelength range of 330 to 345 nm. Through this combination, light with a wavelength of 310 to 350 nm, which is shorter than the i-line (365 nm), is selectively used for radical reactions during exposure, and by increasing the crosslinking density on the surface of the cured film, it is possible to use an alkaline developer in the development process. It has been found that by suppressing excessive flow of the resin component and increasing the smoothness of the surface of the cured film, it is possible to suppress an increase in the resistance value of the ITO electrode formed on the cured film.

The photosensitive resin composition of the present invention contains (A) an alkali-soluble resin. (A) The alkali-soluble resin refers to a resin having one or more alkali-soluble groups. Examples of alkali-soluble groups include carboxyl groups, phenolic hydroxyl groups, sulfonic acid groups, and thiol groups. Among these, carboxyl groups are more preferred because of their high solubility in alkalis. (A) Examples of the alkali-soluble resin include siloxane resin, acrylic resin, vinyl ether resin, polyhydroxystyrene, novolac resin, polyimide, polyamide, and cardo resin. Two or more types of these may be contained. (A) The alkali-soluble resin preferably has ethylenically unsaturated double bonds at least in part, and can improve the hardness of the cured film obtained from the photosensitive resin composition. As the alkali-soluble resin (A), among the above-mentioned polymers, siloxane resins, acrylic resins, and cardo-based resins are more preferable from the viewpoint of ease of introducing ethylenically unsaturated double bonds. Cardo-based resins are more preferred and can improve the chemical resistance and refractive index of the cured film.

(A) The solid content acid value of the alkali-soluble resin is preferably 30 KOHmg/g or more and 200 KOHmg/g or less. Having an acid value within this range makes it possible to form good patterns under various development conditions.

The siloxane resin is preferably a hydrolysis/condensation reaction product of a trifunctional alkoxysilane compound. Examples of trifunctional alkoxysilane compounds include methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, hexyltrimethoxysilane, octadecyltrimethoxysilane, phenyltrimethoxysilane, and phenyltriethoxysilane. , naphthyltrimethoxysilane, anthracenyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, 3-(N,N-diglycidyl)aminopropyltrimethoxy Silane, 3-glycidoxycypropyltrimethoxysilane, glycidoxymethyltrimethoxysilane, glycidoxymethyltriethoxysilane, α-glycidoxyethyltrimethoxysilane, α-glycidoxyethyltriethoxysilane, β- Glycidoxyethyltrimethoxysilane, β-glycidoxyethyltriethoxysilane, α-glycidoxypropyltrimethoxysilane, α-glycidoxypropyltriethoxysilane, β-glycidoxypropyltrimethoxysilane, β- Glycidoxypropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, γ-glycidoxypropyltripropoxysilane, γ-glycidoxypropyltriisopropoxysilane , γ-glycidoxypropyltributoxysilane, α-glycidoxybutyltrimethoxysilane, α-glycidoxybutyltriethoxysilane, β-glycidoxybutyltrimethoxysilane, β-glycidoxybutyltriethoxysilane , γ-glycidoxybutyltrimethoxysilane, γ-glycidoxybutyltriethoxysilane, δ-glycidoxybutyltrimethoxysilane, δ-glycidoxybutyltriethoxysilane, (3,4-epoxycyclohexyl)methyl Trimethoxysilane, (3,4-epoxycyclohexyl)methyltriethoxysilane, (3,4-epoxycyclohexyl)methyltrimethoxysilane, (3,4-epoxycyclohexyl)methyltriethoxysilane, 2-(3,4- Epoxycyclohexyl)ethyltripropoxysilane, 2-(3,4-epoxycyclohexyl)ethyltributoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltributoxysilane Ethoxysilane, 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, 3-(3,4-epoxycyclohexyl)propyltriethoxysilane, 4-(3,4-epoxycyclohexyl)butyltrimethoxysilane, 4- (3,4-epoxycyclohexyl)butyltriethoxysilane, trifluoromethyltrimethoxysilane, trifluoromethyltriethoxysilane, trifluoropropyltrimethoxysilane, trifluoropropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, 3 -Ureidopropyltriethoxysilane, 3-isocyanatepropyltriethoxysilane, p-slytyltrimethoxysilane, 3-(tert-butylcarbamoyl)-6-(trimethoxysilyl)hexanoic acid, 2-(2-(tert-butylcarbamoyl)-6-(trimethoxysilyl)hexanoic acid, -butylamino)-2-oxoethyl)-5-(trimethoxysilyl)pentanoic acid, 3-(isopropylcarbamoyl)-6-(trimethoxysilyl)hexanoic acid, 2-(2-(isopropylamino)-2- oxoethyl)-5-(trimethoxysilyl)pentanoic acid, 3-(isobutylcarbamoyl)-6-(trimethoxysilyl)hexanoic acid, 2-(2-(isobutylamino)-2-oxoethyl)-5-( Trimethoxysilyl)pentanoic acid, 3-(tert-pentylcarbamoyl)-6-(trimethoxysilyl)hexanoic acid, 2-(2-(tert-pentylamino)-2-oxoethyl)-5-(trimethoxysilyl) ) Pentanoic acid, 3-(tert-butylcarbamoyl)-6-(triethoxysilyl)hexanoic acid, 2-(2-(tert-butylamino)-2-oxoethyl)-5-(triethoxysilyl)pentanoic acid , 3-(tert-butylcarbamoyl)-6-(trimethoxysilyl)pentanoic acid, 2-(2-(tert-butylamino)-2-oxoethyl)-5-(trimethoxysilyl)butanoic acid, 2-( tert-butylcarbamoyl)-4-(2-(trimethoxysilyl)ethyl)cyclohexanecarboxylic acid, 2-(tert-butylcarbamoyl)-5-(2-(trimethoxysilyl)ethyl)cyclohexanecarboxylic acid, 3-tri Methoxysilylpropylsuccinic anhydride, 3-triethoxysilylpropylsuccinic anhydride, 4-(2-trimethoxysilylethyl)cyclohexyl-1,2-dicarboxylic anhydride, 4-(2-triethoxysilylethyl) ) Cyclohexyl-1,2-dicarboxylic anhydride, 3-(3-trimethoxysilylpropyl)cyclohexyl-1,2-dicarboxylic anhydride, 3-(3-triethoxysilylpropyl)cyclohexyl-1,2-dicarboxylic Acid anhydride, 4-(2-trimethoxysilylethyl) phthalic anhydride, 4-(2-triethoxysilylethyl) phthalic anhydride, 3-(3-trimethoxysilylpropyl) phthalic anhydride, etc. Can be mentioned.

As the acrylic resin, one having a carboxyl group is preferable, and a copolymer of an unsaturated carboxylic acid and an ethylenically unsaturated compound is more preferable.
Examples of unsaturated carboxylic acids include monocarboxylic acids such as acrylic acid, methacrylic acid, crotonic acid, and vinyl acetic acid, dicarboxylic acids such as itaconic acid, maleic acid, and fumaric acid, or their acid anhydrides, and phthalic acid mono(2- (meth)acryloyloxyethyl) and other polyhydric carboxylic acid monoesters.

Examples of ethylenically unsaturated compounds include methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-propyl acrylate, isopropyl acrylate, n-propyl methacrylate, isopropyl methacrylate, and n-acrylate. Butyl, n-butyl methacrylate, sec-butyl acrylate, sec-butyl methacrylate, iso-butyl acrylate, iso-butyl methacrylate, tert-butyl acrylate, tert-butyl methacrylate, n-pentyl acrylate, Unsaturated carboxylic acid alkyl esters such as n-pentyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, benzyl acrylate, benzyl methacrylate, styrene, p-methylstyrene, o-methylstyrene, m-methylstyrene, α - Aromatic vinyl compounds such as methylstyrene, (crosslinked) cyclic hydrocarbon groups such as tricyclodecanyl (meth)acrylate, unsaturated carboxylic acid aminoalkyl esters such as aminoethyl acrylate, glycidyl acrylate, glycidyl methacrylate, etc. Carboxylic acid vinyl esters such as saturated carboxylic acid glycidyl esters, vinyl acetate and vinyl propionate, cyanide vinyl compounds such as acrylonitrile, methacrylonitrile and α-chloroacrylonitrile, aliphatic conjugated dienes such as 1,3-butadiene and isoprene, Examples include polystyrene, polymethyl acrylate, polymethyl methacrylate, polybutyl acrylate, polybutyl methacrylate, and the like having an acryloyl group or methacryloyl group at the end.

The acrylic resin is preferably one having a structural unit derived from (meth)acrylic acid, and more preferably one obtained by reacting a carboxyl group with a compound having an ethylenically unsaturated group and an epoxy group, which improves sensitivity. be able to. As the ethylenically unsaturated group, an acrylic group and a methacryl group are preferable.
The cardo-based resin preferably has two or more structures represented by the following formula (1-1) or (1-2) as repeating units, and contains an ethylenically unsaturated group and a carboxyl group.

In the above general formula (1-2), x is an integer of 1 to 2, and Y ¹ is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 20 carbon atoms, or the adjacent Y This is a group in which the ring formed by ^two members becomes an aromatic ring. Y ² represents an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 20 carbon atoms, or a hydrogen atom. q is an integer from 0 to 2. The cardo resin having the structure (1-2) preferably has the structure (1-3) from the viewpoint of ease of synthesis.

Examples of cardo-based resins include Oguzol CR-TR, Oguzol CR-TR2, Oguzol CR-TR3, Oguzol CR-TR4, Oguzol CR-TR5, and Oguzol CR-TR6 manufactured by Osaka Gas Chemical Co., Ltd., and Nippon Steel & Sumikin Chemical Co., Ltd. Examples include V-259ME manufactured by Co., Ltd. and WR-301 manufactured by ADEKA Co., Ltd.
The content of the alkali-soluble resin (A) in the photosensitive resin composition of the present invention can be arbitrarily selected depending on the desired film thickness and application, and is 10 to 70% by weight based on 100% by weight of the solid content of the photosensitive resin composition. % is preferred.

The photosensitive resin composition of the present invention comprises (B) at least one metal compound particle selected from the group consisting of titanium compound particles, zirconium compound particles, tin compound particles and aluminum compound particles, or a titanium compound, a zirconium compound , a tin compound, and an aluminum compound.

Examples of composite metal compound particles of a metal compound and a silicon compound include silicon oxide-metal compound composite particles in which metal particles are synthesized in the presence of a silicon oxide compound, and silane surface-coated metal compound particles in which metal particles are reacted with a silane coupling agent. etc. Among these, titanium compound particles, zirconium compound particles, or composite particles of a titanium compound or a zirconium compound and a silicon compound are preferable. Further, two or more kinds of these may be contained. By containing the metal compound particles as described above, a high refractive index can be provided to the cured product. If the cured product has a high refractive index, a cured film using the cured product can have a high refractive index.

(B) Examples of composite metal compound particles include "Nano Youth" (registered trademark) OT-RB300M7-20, which is a composite particle of tin oxide, titanium oxide, and silicon oxide, tin oxide, titanium oxide, zirconium oxide, "Nano Youth" OT-RA-305M7-20 (both manufactured by Nissan Chemical Co., Ltd.), which is a composite particle of silicon, "Optorake" (registered trademark) TR-502, which is a composite particle of tin oxide and titanium oxide, Optorake "TR-504", titanium oxide and silicon oxide composite particles "Optorake" TR-503, "Optorake" TR-513, "Optorake" TR-520, "Optorake" TR-527, "Optorake" "TR-528," "Opto Lake" TR-529, "Opto Lake" TR-543, "Opto Lake" TR-544, "Opto Lake" TR-550, titanium oxide particles "Opto Lake" TR-505 (all "Nano Youth" OZ-S30M (manufactured by Nissan Chemical Co., Ltd.), which is a zirconium oxide particle, DLZ-003W (manufactured by Daiken Chemical Industry Co., Ltd.), ZR-010 (manufactured by Daiken Chemical Industry Co., Ltd.) ) manufactured by Solar), SZR-M (manufactured by Sakai Chemical Industry Co., Ltd.), and the like. Two or more types of these may be contained.

(B) The composite metal compound particles are preferably surface-treated. Surface treatment refers to a treatment in which a compound such as a coupling agent that can react with the hydroxyl groups present on the surface of the fine particles is bonded. Examples of the coupling agent include a silane coupling agent and a titanium coupling agent. Examples of the silane coupling agent include (meth)acryloxysilanes such as 3-(meth)acryloxypropyltrimethoxysilane and 3-(meth)acryloxypropylmethyldimethoxysilane; 3-glycidoxypropyltrimethoxysilane; Epoxysilanes such as silane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane; vinyltrimethoxysilane, vinyltrimethoxysilane, etc. Vinylsilanes such as ethoxysilane, vinyltris(β-methoxyethoxy)silane, dimethylvinylmethoxysilane, vinyltrichlorosilane, dimethylvinylchlorosilane; N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyl Aminosilanes such as trimethoxysilane, N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane; Examples include quaternary ammonium salts; p-styryltrimethoxysilane; phenyltrimethoxysilane. Examples of the titanium coupling agent include titanates such as isopropyl dimethacrylisostearoyl titanate and isopropyl diacryl isostearoyl titanate. Two or more types of these may be used. Among these, (meth)acryloxysilanes are particularly preferred. Because it has a radically polymerizable group, it can be crosslinked with resins and monomers by exposure to light, suppressing phase separation between composite metal compound particles and resins and monomers, and not only improving transparency but also increasing the crosslinking density on the surface of the cured film. further increases, the smoothness of the surface of the cured film can be increased.

(B) The D50 value in the particle size distribution of the composite metal compound particles is preferably 1 nm or more from the viewpoint of improving dispersion stability. Further, from the viewpoint of improving the smoothness of the film surface and suppressing light scattering in the cured film to improve transparency, the thickness is preferably 70 nm or less, more preferably 50 nm or less. Here, the D50 value in the particle size distribution of composite metal compound particles can be determined by a method such as a gas adsorption method, a dynamic light scattering method, a small-angle X-ray scattering method, or a method of directly measuring the particle diameter using a transmission electron microscope or a scanning electron microscope. can be measured. In the present invention, it refers to a value measured by a dynamic light scattering method. The equipment used is not particularly limited, but examples include dynamic light scattering altimeter DLS-8000 (manufactured by Otsuka Electronics Co., Ltd.).

In the photosensitive composition of the present invention, the (B) composite metal compound particles preferably account for 10 parts by mass or more, more preferably 15 parts by mass or more, based on the solid content from the viewpoint of the refractive index of the cured film. Further, from the viewpoint of adhesion to the base material, it is preferably 70 parts by mass or less in the solid content, and more preferably 65 parts by mass or less.

The photosensitive resin composition of the present invention contains (C) a photopolymerization initiator that contains a ketoxime ester group and has an absorption peak in a wavelength range of 325 to 340 nm. The photopolymerization initiator in the present invention refers to one that decomposes and/or reacts with light (including ultraviolet rays and electron beams) to generate radicals. (C) As a photopolymerization initiator containing a ketoxime ester group and having an absorption peak in the wavelength range of 325 to 340 nm, 1-[4-(phenylthio)phenyl]octane-1,2-dione 2-( 0-benzoyloxime) and the like. Commercially available radical initiators include "Irgacure" (registered trademark) OXE01; "ADEKA Arkles" (registered trademark) NCI-930 (manufactured by ADEKA Corporation); TR-PBG-305, TR-PBG-3057 (and above); , manufactured by Tronly); and the like. Two or more types of these may be contained.

The absorption peak of the photoradical polymerization initiator can be determined by the following method. First, a photoradical polymerization initiator is diluted to a concentration of 0.001% by mass using propylene glycol monomethyl ether acetate (hereinafter referred to as "PGMEA"). The absorbance of the obtained diluted solution can be measured using an ultraviolet-visible spectrophotometer UV-2600 (manufactured by Shimadzu Corporation), and the absorption peak wavelength can be determined from the obtained absorbance spectrum.

The content of the (C) radical photopolymerization initiator in the photosensitive resin composition of the present invention is determined to sufficiently promote radical curing, increase the smoothness and pencil hardness of the cured film surface, and improve the hardness during electrode and wiring processing. From the viewpoint of further suppressing the generation of outgas, the content in the solid content is preferably 0.1% by mass or more, more preferably 1% by mass or more, and even more preferably 2% by mass or more. On the other hand, from the viewpoint of further improving chemical resistance by suppressing the residual of (C) photo-radical polymerization initiator and further improving resolution by suppressing excessive radical generation, the inclusion of (C) photo-radical polymerization initiator The amount is preferably 20% by mass or less, more preferably 15% by mass or less, and even more preferably 12% by mass or less based on the solid content.

The photosensitive resin composition of the present invention may further contain a photoradical polymerization initiator other than (C) the photoradical polymerization initiator, such as an alkylphenone-based photoradical polymerization initiator, an acylphosphine oxide-based photoradical Polymerization initiator, oxime ester-based radical photopolymerization initiator, benzophenone-based radical photopolymerization initiator, oxanthone-based radical photopolymerization initiator, imidazole-based radical photopolymerization initiator, benzothiazole-based radical photopolymerization initiator, benzoxazole-based photoinitiator Radical polymerization initiators, carbazole-based radical photopolymerization initiators, triazine-based radical photopolymerization initiators, benzoic acid ester-based radical photopolymerization initiators, phosphorus-based radical photopolymerization initiators, inorganic radical photopolymerization initiators such as titanates, etc. can be mentioned. Two or more types of these may be contained.

The photosensitive resin composition of the present invention contains (D) an ultraviolet absorber having an absorption peak in a wavelength range of 330 to 345 nm and having a radically polymerizable group. (D) The ultraviolet absorber having an absorption peak in the wavelength range of 335 to 345 nm and having a radically polymerizable group is 2-[2-hydroxy-5-[2-(methacryloyloxy)ethyl]phenyl]- Examples include 2H-benzotriazole and the like. Commercially available ultraviolet absorbers include RUVA-93 (manufactured by Otsuka Chemical Co., Ltd.).

The absorption peak of the ultraviolet absorber can be determined by the following method. First, the ultraviolet absorber is diluted to a concentration of 0.001% by mass using PGMEA. The absorbance of the obtained diluted solution can be measured using an ultraviolet-visible spectrophotometer UV-2600 (manufactured by Shimadzu Corporation), and the absorption peak wavelength can be determined from the obtained absorbance spectrum.

The content of the ultraviolet absorber (D) in the photosensitive resin composition of the present invention selectively utilizes light with a wavelength of 310 nm to 350 nm, which is shorter than the i-line (365 nm), and increases the smoothness of the cured film surface. At the same time, from the viewpoint of improving the resolution of the photosensitive resin composition, the solid content is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and even more preferably 1% by mass or more. On the other hand, from the viewpoint of suppressing the residual amount of the (D) ultraviolet absorber and improving chemical resistance, as well as improving the adhesion to the base material such as glass that is the base of the cured film, the use of (D) the ultraviolet absorber The content is preferably 20% by mass or less in the solid content, more preferably 15% by mass or less, and even more preferably 12% by mass or less.

The photosensitive resin composition of the present invention may further contain (D) an ultraviolet absorber other than the ultraviolet absorber. For example, as the ultraviolet absorber, benzotriazole-based compounds, benzophenone compounds, triazine compounds, and the like. Two or more types of these may be contained.

The photosensitive resin composition of the present invention preferably contains a monomer having a radically polymerizable group. As the radically polymerizable group, a (meth)acryloyl group is more preferable. The monomer having a radically polymerizable group contains a polyfunctional monomer from the viewpoint of increasing the crosslinking density of the cured film surface to increase smoothness and suppressing an increase in the resistance value of the ITO electrode formed on the cured film. It is preferable. Further, from the viewpoint of improving chemical resistance by increasing the hydrophobicity of the cured film, it is preferable that the monomer having a radically polymerizable group contains a monomer having an aromatic ring and/or an alicyclic carbon ring.

The polyfunctional monomer refers to a compound having two or more radically polymerizable groups, and preferably has two or more (meth)acryloyl groups. Examples of compounds having two (meth)acryloyl groups include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, glycerin di(meth)acrylate, and tripropylene glycol di(meth)acrylate. (meth)acrylate, 1,3-butanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, Examples include 1,9-nonanediol di(meth)acrylate and 1,10-decanediol di(meth)acrylate. Examples of compounds having three or more (meth)acryloyl groups include glycerin tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, and pentaerythritol tri(meth)acrylate. Erythritol tetra(meth)acrylate, ethoxylated pentaerythritol tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, tripentaerythritol hepta(meth)acrylate, tripentaerythritol octa(meth)acrylate, tetrapentaerythritol nona(meth)acrylate ) acrylate, tetrapentaerythritol deca(meth)acrylate, pentapentaerythritol undeca(meth)acrylate, pentapentaerythritol dodeca(meth)acrylate, and the like. Two or more types of these may be contained.

Examples of monomers having an aromatic ring and/or alicyclic carbon ring include 2,2-[9H-fluorene-9,9-diylbis(1,4-phenylene)bisoxy]diethanol di(meth)acrylate, Examples include acrylic esters such as methylol tricyclodecane di(meth)acrylate and ethoxylated bisphenol A di(meth)acrylate. Two or more types of these may be contained.

The total content of monomers having a radically polymerizable group in the photosensitive resin composition of the present invention is determined from the viewpoint of increasing the smoothness of the cured film surface and suppressing an increase in the resistance value of the ITO electrode formed on the insulating film. , is preferably 5% by mass or more, more preferably 10% by mass or more in solid content.

The photosensitive resin composition of the present invention may contain a crosslinking agent. Crosslinking of the resin can be promoted or facilitated. Examples of the crosslinking agent include nitrogen-containing organic substances, silicone resin curing agents, metal alkoxides, metal chelates, isocyanate compounds and polymers thereof, epoxy compounds and polymers thereof, methylolated melamine derivatives, methylolated urea derivatives, and the like. Two or more types of these may be contained.

Among these, metal chelate compounds and epoxy compounds are preferably used in view of the reactivity of the crosslinking agent and the chemical resistance of the obtained cured film. From the viewpoint of improving the chemical resistance of the cured film, the content of the crosslinking agent is preferably 0.1% by mass or more in the solid content, more preferably 0.5% by mass or more, and even more preferably 1% by mass or more. On the other hand, from the viewpoint of improving the resolution of the photosensitive resin composition, the content of the crosslinking agent in the solid content is preferably 10% by mass or less, more preferably 8% by mass or less, and even more preferably 6% by mass or less.

The photosensitive resin composition of the present invention may contain an adhesion improver. By containing the adhesion improver, the adhesion to the base material is improved and a highly reliable cured film can be obtained. Examples of the adhesion improver include alicyclic epoxy compounds and silane coupling agents. Examples of the alicyclic epoxy compound include 3',4'-epoxycyclohexymethyl-3,4-epoxycyclohexanecarboxylate, 1,2-epoxy of 2,2-bis(hydroxymethyl)-1-butanol, 4-(2-oxiranyl)cyclohexane adduct, ε-caprolactone modified 3',4'-epoxycyclohexylmethyl 3',4'-epoxycyclohexanecarboxylate, 1,2-epoxy-4-vinylcyclohexane, butanetetracarboxylic acid Tetra(3,4-epoxycyclohexylmethyl) modified ε-caprolactone, 3,4-epoxycyclohexylmethyl methacrylate, hydrogenated bisphenol A diglycidyl ether, hydrogenated bisphenol F diglycidyl ether, hydrogenated bisphenol E diglycidyl ether, water Examples include hydrogenated bisphenol A bis(propylene glycol glycidyl ether) ether, hydrogenated bisphenol A bis(ethylene glycol glycidyl ether) ether, diglycidyl 1,4-cyclohexanedicarboxylate, and 1,4-cyclohexanedimethanol diglycidyl ether. Two or more types of these may be contained. Examples of the silane coupling agent include (3,4-epoxycyclohexyl)methyltrimethoxysilane, (3,4-epoxycyclohexyl)methyltriethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltripropoxysilane, 2-(3,4-epoxycyclohexyl)ethyltributoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltriethoxysilane, 2-(3, 4-Epoxycyclohexyl)ethyltriphenoxysilane, 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, 3-(3,4-epoxycyclohexyl)propyltriethoxysilane, 4-(3,4-epoxycyclohexyl) Examples include butyltrimethoxysilane, 4-(3,4-epoxycyclohexyl)butyltriethoxysilane, and a compound represented by the following general formula (2).

In the above general formula (2), each R ¹ may be the same or different, and represents an alkyl group having 1 to 6 carbon atoms. The alkyl group may further have a substituent. n represents 0 or 1. R ² represents a trivalent organic group having 3 to 30 carbon atoms. Each R ³ may be the same or different and represents an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a phenyl group, a hydroxyl group, and a phenoxy group. Note that among these groups of R ³ , those other than the hydroxyl group may further have a substituent. Examples of the compound represented by the above general formula (2) include 3-(tert-butylcarbamoyl)-6-(trimethoxysilyl)hexanoic acid, 2-(2-(tert-butylamino)-2-oxoethyl )-5-(trimethoxysilyl)pentanoic acid, 3-(isopropylcarbamoyl)-6-(trimethoxysilyl)hexanoic acid, 2-(2-(isopropylamino)-2-oxoethyl)-5-(trimethoxysilyl) ) Pentanoic acid, 3-(isobutylcarbamoyl)-6-(trimethoxysilyl)hexanoic acid, 3-(tert-pentylcarbamoyl)-6-(trimethoxysilyl)hexanoic acid, 2-(2-(tert-pentylamino) )-2-oxoethyl)-5-(trimethoxysilyl)pentanoic acid, 6-(dimethoxymethylsilyl)-3-(tert-butylcarbamoyl)hexanoic acid, 5-(dimethoxy(methyl)silyl)-2-(2- (tert-butylamino)-2-oxoethyl)pentanoic acid, 3-(tert-butylcarbamoyl)-6-(trimethoxysilyl)pentanoic acid, 2-(2-(tert-butylamino)-2-oxoethyl)- 5-(trimethoxysilyl)butanoic acid, 2-(tert-butylcarbamoyl)-4-(2-(trimethoxysilyl)ethyl)cyclohexanecarboxylic acid, 2-(tert-butylcarbamoyl)-5-(2-( (trimethoxysilyl)ethyl)cyclohexanecarboxylic acid and the like.Two or more types of these may be contained.Among these, from the viewpoint of improving adhesion to the base material, those represented by the above general formula (2) A compound is preferably used.The content of the adhesion improver is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and 1% by mass based on the solid content, from the viewpoint of improving the adhesion with the base material. % or more.On the other hand, from the viewpoint of suppressing color change due to heating, the content of the adhesion improver is preferably 10% by mass or less in the solid content, more preferably 8% by mass or less, and further preferably 6% by mass or less. preferable.

The photosensitive resin composition of the present invention may contain a solvent. By containing a solvent, each component can be uniformly dissolved. Examples of the solvent include aliphatic hydrocarbons, carboxylic acid esters, ketones, ethers, and alcohols. Two or more types of these may be contained. From the viewpoint of uniformly dissolving each component and improving the transparency of the resulting coating film, compounds having an alcoholic hydroxyl group and cyclic compounds having a carbonyl group are preferred.

Examples of compounds having an alcoholic hydroxyl group include acetol, 3-hydroxy-3-methyl-2-butanone, 4-hydroxy-3-methyl-2-butanone, 5-hydroxy-2-pentanone, 4-hydroxy-4 -Methyl-2-pentanone (diacetone alcohol), ethyl lactate, butyl lactate, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-propyl ether, propylene glycol mono-n-butyl ether, propylene glycol mono-t-butyl ether , 3-methoxy-1-butanol, 3-methyl-3-methoxy-1-butanol, tetrahydrofurfuryl alcohol and the like.

Specific examples of the cyclic compound having a carbonyl group include γ-butyrolactone, γ-valerolactone, δ-valerolactone, propylene carbonate, N-methylpyrrolidone, cyclohexanone, cycloheptanone, and the like. Among these, γ-butyrolactone is particularly preferably used.
Examples of aliphatic hydrocarbons include xylene, ethylbenzene, and solvent naphtha.
Examples of carboxylic acid esters include benzyl acetate, ethyl benzoate, γ-butyrolactone, methyl benzoate, diethyl malonate, 2-ethylhexyl acetate, 2-butoxyethyl acetate, 3-methoxy-3-methyl-butyl acetate, diethyl oxalate. , ethyl acetoacetate, cyclohexyl acetate, 3-methoxy-butyl acetate, methyl acetoacetate, ethyl-3-ethoxypropionate, 2-ethylbutyl acetate, isopentyl propionate, propylene glycol monomethyl ether propionate, propylene glycol Examples include monoethyl ether acetate, ethyl acetate, butyl acetate, isopentyl acetate, pentyl acetate, propylene glycol monomethyl ether acetate, and the like.

Examples of the ketone include cyclopentanone and cyclohexanone.
Examples of the ether include aliphatic ethers such as propylene glycol derivatives such as propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol tertiary butyl ether, and dipropylene glycol monomethyl ether.

Among these, diacetone alcohol and tetrahydrofurfuryl alcohol are preferred from the viewpoint of storage stability, and propylene glycol monomethyl ether acetate is preferred from the viewpoint of step coverage.

The content of the solvent in the photosensitive resin composition of the present invention can be adjusted depending on the coating method and the like. For example, when applying by spin coating, the amount is generally 50 to 95% by mass of the entire photosensitive resin composition.

The photosensitive resin composition of the present invention may contain a surfactant. By containing a surfactant, flowability during application can be improved. Examples of the surfactant include fluorine-based surfactants; silicone-based surfactants; fluorine-containing thermally decomposable surfactants; polyether-modified siloxane-based surfactants; polyalkylene oxide-based surfactants; poly(meth) Acrylate surfactants; Anionic surfactants such as ammonium lauryl sulfate and polyoxyethylene alkyl ether sulfate triethanolamine; Cationic surfactants such as stearylamine acetate and lauryl trimethylammonium chloride; Lauryl dimethylamine oxide and lauryl carboxymethyl Examples include amphoteric surfactants such as hydroxyethylimidazolium betaine; nonionic surfactants such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, and sorbitan monostearate. Two or more types of these may be contained.

Commercially available fluorosurfactants include, for example, "Megafac" (registered trademark) F142D, F172, F173, F183, F445, F470, F475, and F477 (all of which are manufactured by DIC Corporation). (manufactured by NEOS Co., Ltd.), NBX-15, FTX-218 (manufactured by NEOS Co., Ltd.). Examples of commercially available silicone surfactants include "BYK" (registered trademark)-333, BYK-301, BYK-331, BYK-345, BYK-307 (manufactured by BYK Chemie Japan Co., Ltd.). It will be done. Examples of commercially available fluorine-containing thermally decomposable surfactants include "Megafac" (registered trademark) DS-21 (manufactured by DIC Corporation). Commercially available polyether-modified siloxane surfactants include, for example, "BYK" (registered trademark)-345, BYK-346, BYK-347, BYK-348, BYK-349 (all manufactured by BYK-Chemie Japan Co., Ltd.). ), "Silface" (registered trademark) SAG002, SAG005, SAG0503A, and SAG008 (all manufactured by Nissin Chemical Industry Co., Ltd.).

The photosensitive resin composition of the present invention may contain a dispersant. Examples of the dispersant include polyacrylic acid dispersants, polycarboxylic acid dispersants, phosphoric acid dispersants, silicone dispersants, and the like.

The method for producing a cured film using the photosensitive resin composition of the present invention will be explained by giving examples. The method for producing a cured film of the present invention preferably includes a step of curing with light and/or heat without the step of removing all the alkali-soluble resin component (A) by baking or treatment with a stripping solution. Specifically, a method in which the photosensitive resin composition of the present invention is applied, exposed and developed, and heated is preferred.

In the step of applying the photosensitive resin composition of the present invention, it is preferred that the photosensitive resin composition of the present invention is applied onto a base substrate and prebaked. Examples of the coating method include microgravure coating, spin coating, dip coating, curtain flow coating, roll coating, spray coating, and slit coating. Examples of the heating device used for pre-baking include a hot plate and an oven. The heating temperature for pre-baking is preferably 50 to 150°C, and the heating time is preferably 30 seconds to 30 minutes. The film thickness after prebaking is preferably 0.03 to 15 μm.

After prebaking, it is preferable to perform pattern processing by exposure and development. Examples of the exposure device include a mask aligner (LA) and a mirror projection mask aligner (MPA). The exposure intensity is preferably about 10 to 4000 J/m ² (converted to the exposure amount at a wavelength of 365 nm). In order to form a pattern, it is preferable to expose to light through a desired mask, but when curing the entire surface, exposure may be performed without using a mask. A high-pressure mercury lamp is generally used as the exposure light source, and its main wavelengths include 302 nm, 312 nm, 334 nm, 365 nm, and 405 nm.

Next, the unexposed areas are dissolved by development to obtain a negative pattern. Examples of the developing method include methods of immersing the film in a developer using methods such as showering, dipping, and paddling. The development time is preferably 5 seconds to 10 minutes. Examples of the developer include known alkaline developers, and specific examples include inorganic alkalis such as alkali metal hydroxides, carbonates, phosphates, silicates, and borates, 2-diethylaminoethanol, Examples include aqueous solutions containing one or more of amines such as monoethanolamine and diethanolamine, and quaternary ammonium salts such as tetramethylammonium hydroxide and choline. After development, it is preferable to rinse with water, followed by dry baking at a temperature in the range of 50 to 150°C.

It is preferable to heat the film after exposure and development using the above-mentioned heating device. The heating temperature is preferably 150 to 450°C, and the heating time is preferably 20 minutes to 1 hour.

The cured film of the present invention can be applied to, for example, various protective films such as a protective film for touch panels and protective films for metal wiring, various insulating films such as insulating films for touch panels, insulating films for TFTs, and interlayer insulating films, various hard coat materials, and TFTs. It is used as a flattening film for color filters, an overcoat for color filters, a passivation film, an antireflection film, an optical filter, a photo spacer for color filters, and a microlens. Because it has negative photosensitivity, it is suitably used for flattening films for TFTs in liquid crystal and organic EL displays, insulating films, antireflection films, overcoats for color filters, pillar materials, and the like. Among these, since it has particularly high substrate adhesion, it can be suitably used as an insulating film for touch panels and a metal wiring protective film. Examples of the metal wiring include copper, silver, aluminum, chromium, molybdenum, titanium, ITO, IZO (indium zinc oxide), AZO (aluminum-doped zinc oxide), and ZnO2.

Hereinafter, the present invention will be explained in more detail using Examples and Comparative Examples, but the present invention is not limited to the following Examples.

In addition, in the evaluation method, if there is no description of the number of evaluation n, the evaluation is n=1, and if the temperature is not specified in each condition of evaluation, synthesis, etc., it is performed at room temperature.

<Evaluation method>
"Particle size distribution D50 value"
After diluting the dispersion liquid of composite metal oxide fine particles 150 times with methyl ethyl ketone (MEK), the particle size distribution D50 value was measured by a dynamic light scattering method.
Measuring equipment: Nikkiso dynamic light scattering particle size distribution analyzer Analysis conditions:
Particle size standard Volume dispersed particle refractive index Zirconium oxide: 2.17, titanium oxide: 2.62
Solvent refractive index Methyl ethyl ketone: 1.38.

"Absorption peak wavelength"
The photopolymerization initiator and ultraviolet absorber used in each Example and Comparative Example were diluted with PGMEA to a concentration of 0.001% by mass. The absorbance of the obtained diluted solution at a wavelength of 300 to 400 nm was measured using an ultraviolet-visible spectrophotometer UV-2600 (manufactured by Shimadzu Corporation). The absorption peak wavelength was determined from the obtained absorbance spectrum.

"Refractive index"
The photosensitive resin compositions obtained in each of the Examples and Comparative Examples were spin-coated onto a silicon wafer substrate using a spin coater (MS-A150, manufactured by Mikasa Co., Ltd.). The silicon wafer substrate coated with the photosensitive resin composition was prebaked at 100° C. for 2 minutes using a hot plate (HHP-230SQ manufactured by As One Corporation) to produce a prebaked film with a thickness of 0.7 μm. After exposing the entire surface of the obtained prebaked film with an ultra-high pressure mercury lamp at an exposure amount of 200 mJ/cm2, using an automatic developing device (AD-1200 manufactured by Takizawa Sangyo Co., Ltd.), 2.38% by mass TMAH was used. Shower development was performed for 60 seconds, followed by a 30 second rinse with water. Finally, it was cured in air at 230° C. for 30 minutes using an oven (DHS-42 manufactured by ESPEC Co., Ltd.) to produce a cured film with a thickness of 0.5 μm. For each cured film, the refractive index at 550 nm was measured using a spectroscopic ellipsometer FE5000 manufactured by Otsuka Electronics Co., Ltd.

"Transmittance"
The photosensitive resin compositions obtained in each example and comparative example were spin-coated onto a Tempax glass substrate (manufactured by AGC Techno Glass Co., Ltd.) using a spin coater (MS-A150, manufactured by Mikasa Co., Ltd.). did. A Tempax glass substrate coated with the photosensitive resin composition was prebaked at 100° C. for 2 minutes using a hot plate (HHP-230SQ manufactured by As One Co., Ltd.) to produce a prebaked film with a thickness of 1.7 μm. After exposing the entire surface of the obtained prebaked film with an ultra-high pressure mercury lamp at an exposure amount of 200 mJ/cm ² , using an automatic developing device (AD-1200 manufactured by Takizawa Sangyo Co., Ltd.), 2.38% by mass TMAH was used. Shower development was performed for 60 seconds, followed by rinsing with water for 30 seconds. Finally, it was cured in air at 230° C. for 30 minutes using an oven (DHS-42 manufactured by ESPEC Co., Ltd.) to produce a cured film with a thickness of 1.5 μm.
Using a UV-visible photodiode array spectrophotometer MultiSpec-1500 (manufactured by Shimadzu Corporation), the UV-visible absorption spectrum of only the Tempax glass substrate was measured, and this was used as a reference. Next, the ultraviolet-visible absorption spectrum of the resulting laminate of the cured film and Tempax glass was measured with a single beam, the light transmittance at 400 nm was determined, and the difference from the reference was taken as the transmittance of the cured film. From the viewpoint of industrial use, A and B were judged to be acceptable.
A: Transmittance of 96% or more and less than 100% B: Transmittance of 93% or more and less than 96% C: Transmittance of 90% or more and less than 93% D: Transmittance of less than 90%.

"resolution"
A substrate (hereinafter referred to as an ITO substrate) was prepared by forming an ITO film on a non-alkali glass substrate (glass thickness: 0.7 mm) to have a film thickness of 20 nanometers and a resistance value of 100 Ω/□. The photosensitive resin compositions obtained in each of the Examples and Comparative Examples were spin-coated onto an ITO substrate using a spin coater (MS-A150, manufactured by Mikasa Co., Ltd.). The alkali-free glass substrate coated with the photosensitive resin composition was prebaked at 100° C. for 2 minutes using a hot plate (HHP-230SQ manufactured by As One Co., Ltd.) to produce a prebaked film with a thickness of 1.7 μm. Using a mask aligner (LA-610 manufactured by San-ei Denki Seisakusho Co., Ltd.) and using an ultra-high pressure mercury lamp as a light source, the obtained pre-baked film was coated in a one-on-one matrix with a width of 5, 10, 20, 30, 40, and 50 μm. Exposure was carried out using a wide mask with a mask gap of 200 μm. Thereafter, using an automatic developing device (AD-1200 manufactured by Takizawa Sangyo Co., Ltd.), shower development was performed using a 2.38% by mass TMAH aqueous solution for 60 seconds, and then rinsed with water for 30 seconds. After exposure and development, the optimum exposure amount was determined to form a 50 μm line-and-space pattern with a width of 1:1. The exposure amount was measured with an i-ray luminometer. The minimum pattern size after development at the optimum exposure amount was measured, and this was taken as the resolution. From the viewpoint of industrial use, A and B were judged to be acceptable.
A: Resolution 5μm or 10μm
B: Resolution 20μm or 30μm
C: Resolution of 40 μm or more.

"Membrane surface roughness quantitative value Ra"
The photosensitive resin compositions obtained in each of the Examples and Comparative Examples were spin-coated onto a non-alkali glass substrate (glass thickness: 0.7 mm) using a spin coater (MS-A150, manufactured by Mikasa Co., Ltd.). The alkali-free glass substrate coated with the photosensitive resin composition was prebaked at 100° C. for 2 minutes using a hot plate (HHP-230SQ manufactured by As One Co., Ltd.) to produce a prebaked film with a thickness of 1.7 μm. After exposing the entire surface of the obtained prebaked film to an ultra-high pressure mercury lamp at an optimum exposure amount (an exposure amount that forms a 50 μm line-and-space pattern with a 1:1 width), an automatic developing device (AD manufactured by Takizawa Sangyo Co., Ltd.) was used. -1200), shower development was performed using 2.38% by mass TMAH for 60 seconds, and then rinsed with water for 30 seconds. Finally, it was cured in air at 230° C. for 30 minutes using an oven (DHS-42 manufactured by ESPEC Co., Ltd.) to produce a cured film with a thickness of 1.5 μm.

The quantitative roughness value Ra (arithmetic mean roughness) of the cured film surface was measured using a scanning probe microscope NanoScope V Dimension Icon (manufactured by BrukerAXS).
[Measurement condition]
Tip: Silicon cantilever Scanning mode: Tapping mode Scanning range: 3μm□
Scanning speed: 0.3Hz
Measurement environment: room temperature, atmosphere From the viewpoint of industrial use, A and B were passed.
A: Ra of 0.1 nm or more and less than 3 nm B: Ra of 3 nm or more and less than 5 nm C: Ra of 5 nm or more and less than 10 nm D: Ra of 10 nm or more.

"ITO resistance increase rate"
The photosensitive resin compositions obtained in each of the Examples and Comparative Examples were spin-coated onto a non-alkali glass substrate (glass thickness: 0.7 mm) using a spin coater (MS-A150, manufactured by Mikasa Co., Ltd.). The alkali-free glass substrate coated with the photosensitive resin composition was prebaked at 100° C. for 2 minutes using a hot plate (HHP-230SQ manufactured by As One Co., Ltd.) to produce a prebaked film with a thickness of 1.7 μm. After exposing the entire surface of the obtained prebaked film to an ultra-high pressure mercury lamp at an optimum exposure amount (an exposure amount that forms a 50 μm line-and-space pattern with a 1:1 width), an automatic developing device (AD manufactured by Takizawa Sangyo Co., Ltd.) was used. -1200), shower development was performed using 2.38% by mass TMAH for 60 seconds, and then rinsed with water for 30 seconds. Finally, it was cured in air at 230° C. for 30 minutes using an oven (DHS-42 manufactured by ESPEC Co., Ltd.) to produce a cured film with a thickness of 1.5 μm.
ITO was formed into a film having a thickness of 20 nanometers on the obtained cured film, and the ITO resistance value was measured. Using a resistance value of 100 Ω/□ when ITO was formed as a film thickness of 20 nanometers on a non-alkali glass substrate as a reference, the rate of increase in ITO resistance value with respect to the reference was calculated. From the viewpoint of industrial use, A and B were judged to be acceptable.
A: ITO resistance increase rate of 0.1% or more and less than 5% B: ITO resistance increase rate of 5% or more and less than 10% C: ITO resistance increase rate of 10% or more and less than 15% D: ITO resistance increase rate of 15% that's all.

[Synthesis example 1]
“WR-301 (trade name)” (manufactured by ADEKA Corporation), which is a PGMEA solution of cardo-based resin containing an ethylenically unsaturated group and a carboxyl group, was prepared. The solid content concentration of "WR-301" is 45% by mass, the solid content acid value is 100 KOHmg/g, and the mass average molecular weight (Mw) in terms of polystyrene measured by GPC method is 5500. 100 g of "WR-301" was weighed, and 12.5 g of PGMEA was added and stirred to obtain a cardo-based resin solution (P-1) with a solid content concentration of 40% by mass.

[Synthesis example 2]
A 500 ml flask was charged with 1.0 g of 2,2'-azobis(isobutyronitrile) and 100 g of PGMEA. After purging the inside of the flask with nitrogen, the flask was heated to 120° C., and a mixture of 5.2 g of styrene, 35.5 g of glycidyl methacrylate, and 41.0 g of dicyclopentanyl methacrylate was added dropwise from a dropping tube over 2.5 hours. Next, the inside of the flask was purged with air, and 0.3 g of trisdimethylaminomethylphenol and 0.3 g of hydroquinone were added to 17.0 g of acrylic acid, and the mixture was heated and stirred at 120° C. for 5 hours. Further, 30.4 g of tetrahydrophthalic anhydride and 0.5 g of triethylamine were added and heated and stirred at 120° C. for 4 hours, and then PGMEA was added to obtain an acrylic resin solution (PA-1) with a solid content concentration of 40% by mass. The Mw of the acrylic resin was 14,000, and the acid value was 140 mgKOH/g.

[Synthesis example 3]
A 500 ml flask was charged with 1.1 g of 2,2'-azobis(isobutyronitrile) and 100 g of cyclohexanone. After purging the inside of the flask with nitrogen, it was heated to 80°C, and 37.2 g of n-butyl methacrylate, 12.9 g of 2-hydroxyethyl methacrylate, 12.0 g of methacrylic acid, paracumylphenol ethylene oxide-modified acrylate (Toagosei Co., Ltd.) A mixture of 20.7 g of "Aronix (registered trademark) M-110" manufactured by Co., Ltd.) was added dropwise over 2 hours. After the dropwise addition was completed, the solution was further heated and stirred for 3 hours, and then PGMEA was added to obtain an acrylic resin solution (PA-2) with a solid content concentration of 40% by mass. The Mw of the acrylic resin was 25,000, and the acid value was 90 mgKOH/g. [Synthesis example 4]
Add 41.97 g (0.16 mol) of 3-trimethoxysilylpropylsuccinic anhydride and 11.70 g (0.16 mol) of t-butylamine to 200 g of PGMEA, stir at room temperature for a while, and then stir at 40°C for 2 hours. did. Thereafter, the temperature was raised to 80°C, and the mixture was heated and stirred for 6 hours. PGMEA was added to the obtained solution so that the solid content concentration was 20% by mass, and 3-(tert-butylcarbamoyl)-6-(trimethoxysilyl)hexanoic acid, 2-(2-(tert-butyl) A silane coupling agent (G-1) solution, which is a mixed solution of amino)-2-oxoethyl)-5-(trimethoxysilyl)pentanoic acid, was obtained.

[Example 1]
Under a yellow light, 25.04 g of a 30% by mass dispersion of zirconia nanoparticles in MEK (“ZR-010” manufactured by Solar Corporation (hereinafter referred to as ZR-010)) was mixed with diacetone alcohol (hereinafter referred to as DAA). 42.50 g of PGMEA was dissolved in 18.13 g of PGMEA. And 1,2-octanedione, 1-[4-(phenylthio)-2-(O-benzoyloxime)] (“Irgacure” (registered trademark) OXE01 manufactured by BASF (hereinafter referred to as OXE-01). )) 0.67 g, 2-[2-hydroxy-5-[2-(methacryloyloxy)ethyl]phenyl]-2H-benzotriazole (Otsuka Chemical Co., Ltd. "RUVA-93" (hereinafter referred to as RUVA-93) )) 0.54 g, 4.65 g of cardo-based resin solution (P-1) obtained in Synthesis Example 1, dipentaerythritol hexaacrylate (“Kayalad” (registered trademark) DPHA (trade name)” Japan) 1.42 g (manufactured by Kayaku Co., Ltd.), 50% by mass solution of 9,9-bis[4-(2-acryloyloxyethoxy)phenyl]fluorene in PGMEA (Oxol (registered trademark), manufactured by Osaka Gas Chemical Co., Ltd.) 5.39 g of ``EA-0250P'' (hereinafter referred to as EA-0250P), 1.35 g of the silane coupling agent (G-1) solution obtained in Synthesis Example 4, ``BYK'' which is a silicone surfactant. 0.30 g of a 10% by mass solution of PGMEA (registered trademark)-333 (manufactured by BIC Chemie Japan Co., Ltd.) was added and stirred. Next, filtration was performed using a 0.2 μm filter to obtain a photosensitive resin composition (A-1). A cured film of the obtained photosensitive resin composition (A-1) was prepared by the method described above, and evaluated by the method described above.

[Example 2]
Under yellow light, 30.07 g of ZR-010 was dissolved in 42.50 g of DAA and 15.73 g of PGMEA. Then, 0.74 g of OXE-01, 0.60 g of RUVA-93, 3.84 g of (P-1), 0.74 g of DPHA, 4.14 g of EA-0250P, and (G-1) solution 1. 34g of “BYK” (registered trademark)-333 in a 10% by weight PGMEA solution 0.30g were added and stirred. Next, filtration was performed using a 0.2 μm filter to obtain a photosensitive resin composition (A-2). A cured film of the obtained photosensitive resin composition (A-2) was prepared by the method described above, and evaluated by the method described above.

[Example 3]
Under a yellow light, 9.80 g of ZR-010 was dissolved in 42.50 g of DAA and 27.24 g of PGMEA. Then, 0.80 g of OXE-01, 0.53 g of RUVA-93, 6.68 g of (P-1), 4.70 g of DPHA, 6.09 g of EA-0250P, and (G-1) solution 1. 34g of “BYK” (registered trademark)-333 in a 10% by weight PGMEA solution 0.30g were added and stirred. Next, filtration was performed using a 0.2 μm filter to obtain a photosensitive resin composition (A-3). A cured film of the obtained photosensitive resin composition (A-3) was prepared by the method described above, and evaluated by the method described above.

[Example 4]
A photosensitive resin composition (A-4) was prepared in the same manner as in Example 1, except that "ADEKA CRUISE" (registered trademark) NCI-930 (manufactured by ADEKA Corporation) was used instead of OXE-01. Evaluation was performed in the same manner as in Example 1 using the obtained photosensitive resin composition (A-4).

[Example 5]
A photosensitive resin composition (A-5) was prepared in the same manner as in Example 1, except that TR-PBG-305 (manufactured by TRONLY) was used instead of OXE-01. Evaluation was performed in the same manner as in Example 1 using the obtained photosensitive resin composition (A-5).

[Example 6]
A photosensitive resin composition (A-6) was prepared in the same manner as in Example 1, except that TR-PBG-3057 (manufactured by TRONLY) was used instead of OXE-01. Evaluation was performed in the same manner as in Example 1 using the obtained photosensitive resin composition (A-6).

[Example 7]
A photosensitive resin composition (A-7) was prepared in the same manner as in Example 1 except that SPI-03 (manufactured by Samyang) was used instead of OXE-01. Evaluation was performed in the same manner as in Example 1 using the obtained photosensitive resin composition (A-7).

[Example 8]
A photosensitive resin composition (A-8) was prepared in the same manner as in Example 1 except that TPM-DT7 (manufactured by TAKOMA) was used instead of OXE-01. Evaluation was performed in the same manner as in Example 1 using the obtained photosensitive resin composition (A-8).

[Example 9]
Under a yellow light, 24.53 g of ZR-010 was dissolved in 42.50 g of DAA and 19.19 g of PGMEA. Then, 1.14g of OXE-01, 0.89g of RUVA-93, 3.81g of cardo-based resin solution (P-1), 1.23g of DPHA, 5.15g of EA-0250P, (G-1 ) solution and 0.30 g of a 10% by mass PGMEA solution of "BYK" (registered trademark)-333 were added and stirred. Next, filtration was performed using a 0.2 μm filter to obtain a photosensitive resin composition (A-9). A cured film of the obtained photosensitive resin composition (A-9) was prepared by the method described above, and evaluated by the method described above.

[Example 10]
Under a yellow light, 10.03 g of ZR-010 was dissolved in 42.50 g of DAA and 26.43 g of PGMEA. Then, 0.42g of OXE-01, 0.28g of RUVA-93, 7.52g of cardo-based resin solution (P-1), 4.83g of DPHA, 6.30g of EA-0250P, (G-1 ) solution and 0.30 g of a 10% by mass PGMEA solution of "BYK" (registered trademark)-333 were added and stirred. Next, filtration was performed using a 0.2 μm filter to obtain a photosensitive resin composition (A-10). A cured film of the obtained photosensitive resin composition (A-10) was prepared by the method described above, and evaluated by the method described above.

[Example 11]
Under a yellow light, 24.52 g of ZR-010 was dissolved in 42.50 g of DAA and 18.94 g of PGMEA. Then, 0.77g of OXE-01, 1.03g of RUVA-93, 4.19g of cardo-based resin solution (P-1), 1.29g of DPHA, 5.16g of EA-0250P, (G-1 ) solution and 0.30 g of a 10% by mass PGMEA solution of "BYK" (registered trademark)-333 were added and stirred. Next, filtration was performed using a 0.2 μm filter to obtain a photosensitive resin composition (A-11). A cured film of the obtained photosensitive resin composition (A-11) was prepared by the method described above, and evaluated by the method described above.

[Example 12]
Under a yellow light, 25.64 g of ZR-010 was dissolved in 42.50 g of DAA and 17.56 g of PGMEA. Then, 0.69g of OXE-01, 0.27g of RUVA-93, 4.64g of cardo-based resin solution (P-1), 1.44g of DPHA, 5.49g of EA-0250P, (G-1 ) solution and 0.30 g of a 10% by mass PGMEA solution of "BYK" (registered trademark)-333 were added and stirred. Next, filtration was performed using a 0.2 μm filter to obtain a photosensitive resin composition (A-12). A cured film of the obtained photosensitive resin composition (A-12) was prepared by the method described above, and evaluated by the method described above.

[Example 13]
Under a yellow light, 24.33 g of ZR-010 was dissolved in 42.50 g of DAA and 19.49 g of PGMEA. Then, 1.36g of OXE-01, 0.99g of RUVA-93, 3.77g of cardo-based resin solution (P-1), 1.11g of DPHA, 4.90g of EA-0250P, (G-1 ) solution and 0.30 g of a 10% by mass PGMEA solution of "BYK" (registered trademark)-333 were added and stirred. Next, filtration was performed using a 0.2 μm filter to obtain a photosensitive resin composition (A-13). A cured film of the obtained photosensitive resin composition (A-13) was prepared by the method described above, and evaluated by the method described above.

[Example 14]
Under a yellow light, 10.22 g of ZR-010 was dissolved in 42.50 g of DAA and 26.10 g of PGMEA. Then, 0.29g of OXE-01, 0.14g of RUVA-93, 7.66g of cardo-based resin solution (P-1), 4.89g of DPHA, 6.47g of EA-0250P, (G-1 ) solution and 0.30 g of a 10% by mass PGMEA solution of "BYK" (registered trademark)-333 were added and stirred. Next, filtration was performed using a 0.2 μm filter to obtain a photosensitive resin composition (A-14). A cured film of the obtained photosensitive resin composition (A-14) was prepared by the method described above, and evaluated by the method described above.

[Example 15]
Under a yellow light, 24.32 g of ZR-010 was dissolved in 42.50 g of DAA and 19.28 g of PGMEA. Then, 0.76g of OXE-01, 1.27g of RUVA-93, 3.96g of cardo-based resin solution (P-1), 1.27g of DPHA, 5.07g of EA-0250P, (G-1 ) solution and 0.30 g of a 10% by mass PGMEA solution of "BYK" (registered trademark)-333 were added and stirred. Next, filtration was performed using a 0.2 μm filter to obtain a photosensitive resin composition (A-15). A cured film of the obtained photosensitive resin composition (A-15) was prepared by the method described above, and evaluated by the method described above.

[Example 16]
Under a yellow light, 25.64 g of ZR-010 was dissolved in 42.50 g of DAA and 17.52 g of PGMEA. Then, 0.69g of OXE-01, 0.14g of RUVA-93, 4.68g of cardo-based resin solution (P-1), 1.46g of DPHA, 5.68g of EA-0250P, (G-1 ) solution and 0.30 g of a 10% by mass PGMEA solution of "BYK" (registered trademark)-333 were added and stirred. Next, filtration was performed using a 0.2 μm filter to obtain a photosensitive resin composition (A-16). A cured film of the obtained photosensitive resin composition (A-16) was prepared by the method described above, and evaluated by the method described above.

[Example 17]
A photosensitive resin composition (A-17 ) was prepared. Evaluation was performed in the same manner as in Example 1 using the obtained photosensitive resin composition (A-17).

[Example 18]
A photosensitive resin composition (A- 18) was prepared. Evaluation was performed in the same manner as in Example 1 using the obtained photosensitive resin composition (A-18).

[Example 19]
A photosensitive resin composition (A- 19) was prepared. Evaluation was performed in the same manner as in Example 1 using the obtained photosensitive resin composition (A-19).

[Example 20]
A photosensitive resin composition (A-20 ) was prepared. Evaluation was performed in the same manner as in Example 1 using the obtained photosensitive resin composition (A-20).

[Comparative example 1]
A photosensitive resin composition (A-21) was prepared in the same manner as in Example 1, except that "Irgacure" (registered trademark) OXE02 (manufactured by BASF) was used instead of OXE-01. Evaluation was performed in the same manner as in Example 1 using the obtained photosensitive resin composition (A-21).

[Comparative example 2]
A photosensitive resin composition (A-22) was prepared in the same manner as in Example 1, except that "ADEKA CRUISE" (registered trademark) N-1919 (manufactured by ADEKA Corporation) was used instead of OXE-01. Evaluation was performed in the same manner as in Example 1 using the obtained photosensitive resin composition (A-22).

[Comparative example 3]
A photosensitive resin composition (A-23) was prepared in the same manner as in Example 1, except that "Irgacure" (registered trademark) 819 (manufactured by BASF) was used instead of OXE-01. Evaluation was performed in the same manner as in Example 1 using the obtained photosensitive resin composition (A-23).

[Comparative example 4]
A photosensitive resin composition (A-24) was prepared in the same manner as in Example 1, except that TR-PBG-304 (manufactured by TRONLY) was used instead of OXE-01. Evaluation was performed in the same manner as in Example 1 using the obtained photosensitive resin composition (A-24).

[Comparative example 5]
A photosensitive resin composition (A-25) was prepared in the same manner as in Example 1 except that TR-PBG-345 (manufactured by TRONLY) was used instead of OXE-01. Evaluation was performed in the same manner as in Example 1 using the obtained photosensitive resin composition (A-25).

[Comparative example 6]
A photosensitive resin composition (A-26) was prepared in the same manner as in Example 1, except that "Irgacure" (registered trademark) 379 (manufactured by Ciba Specialty Chemical Co., Ltd.) was used instead of OXE-01. Evaluation was performed in the same manner as in Example 1 using the obtained photosensitive resin composition (A-26).

[Comparative example 7]
A photosensitive resin composition (A-27) was prepared in the same manner as in Example 1, except that "Tinuvin" (registered trademark) PS (manufactured by BASF) was used instead of RUVA-93. Evaluation was performed in the same manner as in Example 1 using the obtained photosensitive resin composition (A-27).

[Comparative example 8]
A photosensitive resin composition (A-28) was prepared in the same manner as in Example 1, except that "Tinuvin" (registered trademark) 384-2 (manufactured by BASF) was used instead of RUVA-93. Evaluation was performed in the same manner as in Example 1 using the obtained photosensitive resin composition (A-28).

[Comparative example 9]
A photosensitive resin composition (A-29) was prepared in the same manner as in Example 1 except that "Tinuvin" (registered trademark) 405 (manufactured by BASF) was used instead of RUVA-93. Evaluation was performed in the same manner as in Example 1 using the obtained photosensitive resin composition (A-29).

[Comparative Example 10]
Under a yellow light, 25.98 g of ZR-010 was dissolved in 42.50 g of DAA and 17.27 g of PGMEA. Then, 0.70 g of OXE-01, 4.65 g of cardo resin solution (P-1), 1.47 g of DPHA, 5.74 g of EA-0250P, 1.40 g of (G-1) solution, “BYK 0.30 g of a 10% by mass solution of PGMEA (registered trademark)-333 was added and stirred. Next, filtration was performed using a 0.2 μm filter to obtain a photosensitive resin composition (A-30). A cured film of the obtained photosensitive resin composition (A-30) was prepared by the method described above, and evaluated by the method described above.

[Comparative Example 11]
A photosensitive resin composition (A-31) was prepared in the same manner as in Comparative Example 10, except that the acrylic resin solution (PA-1) obtained in Synthesis Example 2 was used instead of the cardo-based resin solution (P-1). Prepared. Evaluation was performed in the same manner as in Example 1 using the obtained photosensitive resin composition (A-31).

[Comparative example 12]
Under a yellow light, 41.27 g of a 20% by mass dispersion of zirconia nanoparticles in water ("ZR-20AS" manufactured by Nissan Chemical Co., Ltd.) was dissolved in 42.50 g of DAA and 3.13 g of PGMEA. Then, 0.28 g of OXE-01, 10.14 g of acrylic resin solution (PA-1), 1.68 g of 10-functional urethane acrylate ("KUA-10H" manufactured by KSM Co., Ltd.), and silane coupling agent " 0.70 g of "KBM-403" (trade name) (manufactured by Shin-Etsu Chemical Co., Ltd.) and 0.30 g of a 10% by mass solution of "BYK" (registered trademark)-333 in PGMEA were added and stirred. Next, filtration was performed using a 0.2 μm filter to obtain a photosensitive resin composition (A-32). A cured film of the obtained photosensitive resin composition (A-32) was prepared by the method described above, and evaluated by the method described above.

[Comparative example 13]
A photosensitive resin composition (A-33) was prepared in the same manner as in Comparative Example 12, except that the acrylic resin solution (PA-2) obtained in Synthesis Example 3 was used instead of the acrylic resin solution (PA-1). did. Evaluation was performed in the same manner as in Example 1 using the obtained photosensitive resin composition (A-33).

The compositions of the resin compositions in each example and comparative example are shown in Tables 1 and 2, and the evaluation results are shown in Table 3.
According to the photosensitive resin composition prepared in the examples, a cured film having a high refractive index and a highly smooth film surface can be formed, and an increase in the resistance value of the ITO electrode formed on the cured film can be suppressed. can do.

According to the photosensitive resin composition of the present invention, a cured film having a high refractive index and a highly smooth film surface can be formed, and an increase in the resistance value of an ITO electrode formed on the cured film can be suppressed. Therefore, it can be suitably used as various protective films such as a protective film for touch panels and protective films for metal wiring, and various insulating films such as insulating films for touch panels, insulating films for TFTs, and interlayer insulating films.

Claims (8)

(A) Alkali-soluble resin, (B) at least one metal compound particle selected from the group consisting of titanium compound particles, zirconium compound particles, tin compound particles, and aluminum compound particles, or titanium compound, zirconium compound, tin compound, and aluminum Composite metal compound particles of at least one metal compound selected from the group consisting of compounds and a silicon compound, (C) photopolymerization initiation containing a ketoxime ester group and having an absorption peak in the wavelength range of 325 to 340 nm. (D) an ultraviolet absorber having an absorption peak in the wavelength range of 330 to 345 nm and having a radically polymerizable group. The content of the alkali-soluble resin (A) in the photosensitive resin composition is a mass%, the content of the photopolymerization initiator (C) is c mass%, and the content of the ultraviolet absorber (D) is d mass. The photosensitive resin composition according to claim 1, wherein c/a is 0.10 to 0.80 and d/c is 0.3 to 1.5 when expressed as %. The photosensitive resin composition according to claim 1 or 2, wherein the D50 value in the particle size distribution of the composite metal compound particles (B) measured by a dynamic light scattering method is 1 nm or more and 40 nm or less. The photosensitive resin composition according to any one of claims 1 to 3, wherein the (B) metal compound particles are surface-treated with (meth)acrylic silane. The photosensitive resin composition according to any one of claims 1 to 4, which contains at least a compound represented by general formula (2) as an adhesion improver.

(Each R ¹ may be the same or different and represents an alkyl group having 1 to 6 carbon atoms. The alkyl group may further have a substituent. n represents 0 or 1. R ² represents a carbon Represents a trivalent organic group having a number of 3 to 30. R ³ may be the same or different, and may include an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a phenyl group, a hydroxyl group, and a phenoxy group. represents a group. Note that among these groups of ^R3 , those other than the hydroxyl group may further have a substituent.) A cured film obtained by curing the photosensitive resin composition according to any one of claims 1 to 5. A touch panel having a cured film formed by curing the photosensitive resin composition according to claim 6. The refractive index at a wavelength of 550 nm is 1.60 or more and 1.75 or less, the transmittance at a wavelength of 400 nm is 90% or more, and the transmittance at a wavelength of 330 nm is 40% or less of the transmittance at a wavelength of 400 nm, and the cured film surface A touch panel having a cured film having a quantitative roughness value Ra of 0.1 nm or more and 5.0 nm or less.