JP2023134298A - 実装装置、検査装置および半導体装置の製造方法 - Google Patents

実装装置、検査装置および半導体装置の製造方法 Download PDF

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JP2023134298A
JP2023134298A JP2022039755A JP2022039755A JP2023134298A JP 2023134298 A JP2023134298 A JP 2023134298A JP 2022039755 A JP2022039755 A JP 2022039755A JP 2022039755 A JP2022039755 A JP 2022039755A JP 2023134298 A JP2023134298 A JP 2023134298A
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JP2022039755A
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JP2023134298A5 (enExample
Inventor
大輔 内藤
Daisuke Naito
剛 横森
Takeshi Yokomori
健一 高柳
Kenichi Takayanagi
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Fasford Technology Co Ltd
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Fasford Technology Co Ltd
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Priority to JP2022039755A priority Critical patent/JP2023134298A/ja
Priority to CN202310047030.7A priority patent/CN116759329A/zh
Publication of JP2023134298A publication Critical patent/JP2023134298A/ja
Publication of JP2023134298A5 publication Critical patent/JP2023134298A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
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JP2022039755A 2022-03-14 2022-03-14 実装装置、検査装置および半導体装置の製造方法 Pending JP2023134298A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022039755A JP2023134298A (ja) 2022-03-14 2022-03-14 実装装置、検査装置および半導体装置の製造方法
CN202310047030.7A CN116759329A (zh) 2022-03-14 2023-01-31 安装装置、检查装置及半导体器件的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022039755A JP2023134298A (ja) 2022-03-14 2022-03-14 実装装置、検査装置および半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2023134298A true JP2023134298A (ja) 2023-09-27
JP2023134298A5 JP2023134298A5 (enExample) 2025-01-27

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JP2022039755A Pending JP2023134298A (ja) 2022-03-14 2022-03-14 実装装置、検査装置および半導体装置の製造方法

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JP (1) JP2023134298A (enExample)
CN (1) CN116759329A (enExample)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011148975A1 (ja) * 2010-05-27 2011-12-01 株式会社日立ハイテクノロジーズ 画像処理装置、荷電粒子線装置、荷電粒子線装置調整用試料、およびその製造方法
JP2021044466A (ja) * 2019-09-13 2021-03-18 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011148975A1 (ja) * 2010-05-27 2011-12-01 株式会社日立ハイテクノロジーズ 画像処理装置、荷電粒子線装置、荷電粒子線装置調整用試料、およびその製造方法
JP2021044466A (ja) * 2019-09-13 2021-03-18 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法

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Publication number Publication date
CN116759329A (zh) 2023-09-15

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