JP2023127160A - Electronic instrument - Google Patents

Abstract

To provide a thin type electronic instrument that has an excellent radiation performance while suppressing a thickness of a duct.SOLUTION: An electronic instrument 1 has a duct 300 where a fluid flows inside. The electronic instrument has: a substrate 4 that has a first electronic component 400 packaged; a duct formation member 701 that forms a part on a substrate side of the duct; and a first heat transfer member 702 that has a first heat reception part S1 thermally connected to the first electronic component, and a first radiation part S radiating heat transferred from the first heat reception part. The first heat transfer member penetrates the duct formation member from the outside of the duct having the first heat reception part disposed to extend inside the duct, so that the first radiation part is disposed inside the duct. The first radiation part has an inclination with respect to a flow direction F1 of the fluid in the inside of the duct.SELECTED DRAWING: Figure 9

Description

The present invention relates to an electronic device equipped with a heat dissipation structure for electronic components.

Electronic devices such as imaging devices are provided with heat dissipation structures for electronic components that generate heat. Patent Document 1 discloses an electronic device including a heat dissipation structure in which a heat conductive member is sandwiched between two laminated circuit boards. In this electronic device, heat from electronic components mounted on one circuit board is transmitted to the exterior member via an intermediate member such as a heat conductive member and the other circuit board, and is radiated.

Further, Patent Document 2 discloses an electronic device having a heat pipe and a duct as a heat dissipation structure. In this electronic device, heat is transferred from the heat source to the duct using a heat pipe, and the heat source is cooled by supplying airflow from a fan into the duct.

Japanese Patent Application Publication No. 2014-187083 Japanese Patent Application Publication No. 11-87961

In the electronic device of Patent Document 1, heat dissipation performance is limited depending on the heat transfer efficiency and heat resistance of the intermediate member. In addition, heat is transferred to the exterior member via the intermediate member, thereby increasing the temperature of the exterior member.

Further, in the electronic device of Patent Document 2, since the heat pipe is disposed within the duct, the thickness of the duct must be large enough to accommodate the heat pipe, and as a result, it becomes difficult to make the electronic device thinner.

The present invention provides a thin electronic device that has good heat dissipation performance while suppressing the thickness of the duct.

An electronic device according to one aspect of the present invention includes a duct through which a fluid flows. The electronic device includes a board on which a first electronic component is mounted, a duct forming member forming a part of the duct on the board side, a first heat receiving part thermally connected to the first electronic component, and and a first heat transfer member having a first heat radiating part that radiates heat transmitted from the first heat receiving part. The first heat transfer member extends from the outside of the duct in which the first heat receiving part is arranged, through the duct forming member, and into the duct, so that the first heat radiating part is arranged inside the duct. The first heat dissipation section is arranged inside the duct so as to be inclined with respect to the fluid flow direction.

An electronic device according to another aspect of the present invention includes a duct through which a fluid flows. The electronic device includes a substrate on which a first electronic component is mounted, a duct forming member forming a portion of the duct on the substrate side, a heat receiving part thermally connected to the first electronic component, and the heat receiving part. and a heat transfer member having a heat dissipation part that dissipates heat transmitted from the heat transfer member. The heat transfer member has a bent part between the heat receiving part and the heat radiating part. The heat transfer member is characterized in that the bent portion extends from the outside of the duct in which the heat receiving portion is disposed, penetrating the duct and extending into the inside of the duct, so that the heat dissipation portion is disposed inside the duct.

According to the present invention, it is possible to provide a thin electronic device that has good heat dissipation performance while suppressing the thickness of the duct.

1 is a perspective view of an imaging device of Example 1. FIG. 1 is a bottom perspective view of the imaging device of Example 1. FIG. FIG. 2 is a perspective view showing the imaging device of Example 1 with a fan accessory attached. 4 is a cross-sectional view of the imaging device of FIG. 3. FIG. 1 is an exploded perspective view of the imaging device of Example 1. FIG. FIG. 3 is an exploded view of a part of the back cover of the imaging device according to the first embodiment. FIG. 2 is a cross-sectional view and an exploded perspective view of a heat dissipation unit of the imaging device according to the first embodiment. FIG. 8 is a perspective view of the heat dissipation unit and the substrate shown in FIG. 7; 1 is a rear view and a sectional view of the imaging device of Example 1. FIG. FIG. 3 is a bottom view and a cross-sectional view of a duct of the imaging device of Example 1. FIG. 6 is an exploded view of a part of the back cover of the imaging device according to the second embodiment. FIG. 7 is a perspective view and a cross-sectional view of a heat dissipation unit of an imaging device according to a second embodiment. FIG. 7 is a front view and a cross-sectional view of a back cover of an imaging device according to a second embodiment. FIG. 3 is a perspective view of a heat transfer section and a substrate in Example 2. FIG. 7 is a bottom view and a cross-sectional view of a duct of an imaging device according to a second embodiment. FIG. 2 is a vertical cross-sectional view of an imaging device according to a second embodiment. FIG. 7 is a perspective view of a heat transfer section and a substrate as a modification of the second embodiment.

Embodiments of the present invention will be described below with reference to the drawings.

FIGS. 1A and 1B show the external appearance of a camera body 1 as an imaging device that is an electronic device according to a first embodiment of the present invention. FIG. 1(a) shows the camera body 1 as seen diagonally from the front side, and FIG. 1(b) shows the camera body 1 as seen diagonally from the rear side.

The monitor 101 serving as a display unit is a movable monitor provided on the back surface of the camera body 1 so as to be horizontally and vertically rotatable, and displays images and various information. The monitor 101 has a touch sensor mounted on its display surface, and can detect a user's touch operation on the display surface.

The outside viewfinder display section 102 is provided on the top surface of the camera body 1 and displays various setting values related to imaging, such as shutter speed and aperture value. The shutter button 103 is an operation member operated by the user to issue an imaging instruction. The mode changeover switch 104 is an operation member operated by the user to switch between various modes related to imaging.

The terminal cover 105 is a cover that protects a connector (not shown) to which a cable for connecting an external device and the camera body 1 is connected.

The main electronic dial 106 is an operating member that is rotated by the user to change various setting values such as shutter speed and aperture. The power switch 107 is an operation member operated by the user to turn on and off the power of the camera body 1.

The sub-electronic dial 108 is an operation member operated by the user to instruct selection of a photometry frame and an AF (autofocus) frame, image forwarding, and the like.

A multi-controller 109 and a back electronic dial 110 are provided on the back of the camera body 1. In the multi-controller 109, the user can perform input by tilting the key tops in addition to pressing the key tops. It can be tilted in eight directions, including up, down, left and right, as well as four diagonal directions. By operating the key tops, it is possible to select the photometry frame and the AF frame, and to make selections in each menu. The rear electronic dial 110 is also an operating member that is rotated by the user to instruct selection of the photometry frame and AF frame, image forwarding, and the like. A SET button 111 is provided at the center of the back electronic dial 110. The SET button 111 is an operation member operated by the user mainly to enter decisions on selection items and the like. In addition, on the back of the camera body 1, there are a group of buttons 113 and 114 operated by the user to set AF, exposure, and display settings, as well as buttons 113 and 114 for switching between imaging mode and playback mode, erasing recorded images, etc. A button group 115 operated by the user is arranged. Furthermore, a button group 116 is also arranged for instructing display of a menu screen on the monitor 101 and instructing rating (ranking) of reproduced images.

A video button 112 is provided on the top surface of the camera body 1. The video button 112 is an operation member operated by the user to instruct start/stop of video imaging (recording).

A lens unit (interchangeable lens) (not shown) is removably attached to the mount section 122 provided on the front surface of the camera body 1. The communication terminal 117 is provided inside the mount portion 122 to enable communication between the camera body 1 and the lens unit.

Finder 118 is an eyepiece in an electronic viewfinder. When the user looks into the finder 118, he or she can visually recognize the image displayed inside.

A sensor is provided in the eye-approach detection window 119 to detect that the user's eye is close to the finder 118 . The eyepiece cover 123 comes into contact with the periphery of the user's eye when looking at the finder 118 .

The grip portion 120 is a portion that the user grips with his right hand when holding the camera body 1. The grip portion 120 is provided with a front rubber 121 as a non-slip member.

The card lid 200 is a lid for protecting a slot for storing a memory card as a recording medium.

FIG. 2 shows the camera body 1 viewed from the bottom side. As shown in FIG. 1B, the upper part of the back cover 600 is provided with heat exhaust openings 611 and 612 that open toward the back side (rearward). These openings 611 and 612 are arranged on the left and right sides of the finder 118, respectively, when viewed from the back side (backward). Further, the opening 611 is provided between the button group 116 and the finder 118 and at a position lower than the convex surface of the key top of the button group 116. The opening 612 is provided between the multi-controller 109 and the finder 118 and at a position lower than the convex surface of the key top of the multi-controller 109.

As shown in FIG. 2, the bottom surface of the back cover 600 is provided with a heat dissipation opening 603 that opens downward. The opening 603 is provided in the right half of the back cover 600 when viewed from the back side, in the vicinity of the storage section for the monitor 101 (hereinafter referred to as the monitor storage section) in the camera body 1.

Openings 604 and 605 that open toward the left are provided on the left side of the back cover 600 when viewed from the back side. The openings 604 and 605 are provided in the upper half of the camera body 1 near the monitor storage section when viewed from the back side. The opening 605 is arranged under a hinge cover 606 that covers a hinge that horizontally rotatably supports the monitor 101.

FIG. 3 shows a state in which the fan accessory 500 is attached to the bottom surface of the camera body 1. FIG. 4 shows a cross section of the fan accessory 500 and the camera body 1 equipped with the fan accessory 500, taken along the optical axis. Fan accessory 500 has a fan 501 mounted therein. An air inlet 502 is provided on the front surface of the fan accessory 500, and an air outlet 503 connected to the opening 603 of the camera body 1 is provided on the upper surface. The fan accessory 500 holds a tripod screw member 504, and by rotating the tripod screw member 504 and screwing it into the tripod seat provided on the bottom of the camera body 1, the positions of the air outlet 503 and the opening 603 can be adjusted. It is fixed to the camera body 1 so as not to shift. An elastic frame member 506 is arranged around the opening 603 on the top surface of the fan accessory 500, so that the air sent out from the air outlet 503 flows into the opening 603 without leaking.

The fan accessory 500 also includes a power source (not shown), and can drive the fan 501 without using the power of the camera body 1.

When the fan 501 rotates, external air is taken in from the intake port 502, and the taken air is sent to the ventilation port 503 through the fan 501. Air sent out from the air outlet 503 flows into the rear duct (hereinafter simply referred to as duct) 300 of the camera body 1 through the opening 603. The air that has flowed into the rear duct 300 flows through the duct 300 while receiving the heat inside the camera body 1, and is discharged to the outside of the camera body 1 through the openings 604 and 605 shown in FIG. Note that FIG. 4 is a diagram for explaining the connection between the fan accessory 500 and the camera body 1, and illustrations of heat transfer members and the like to be described later are omitted.

FIG. 5 shows the camera body 1 disassembled. In this figure, the back cover 600 and card cover 200 of the camera body 1 are removed. A main board 4 is arranged inside the camera body 1.

An image processing element 400 as a first electronic component is mounted on the main board 4, and a DRAM 403 is further mounted near the image processing element 400. The image processing element 400 is an IC, MPU, CPU, etc. dedicated to image processing. The DRAM 403 temporarily stores data necessary for image processing. Further, the main board 4 is provided with wiring connection parts 404a, 404b, 404c, 404d, 404e, and 404f such as connectors.

Further, a first card slot (second electronic component) 401 and a second card slot 402 are fixed to the main board 4 on the back side and front side of the grip section side with respect to the image processing element 400, respectively. Memory cards of different types are removably inserted into the first and second card slots 401 and 402.

The image processing element 400 is a main heat source among the electronic components mounted on the main board 4, and consumes a large amount of power and performs high-speed processing especially when capturing a video with a high number of pixels or a high frame rate. As a result, the amount of heat generated increases and the temperature becomes high.

FIG. 6 shows the configuration around the duct 300 inside the back cover 600. In FIG. 6, the exhaust direction is indicated by an arrow W. The duct 300 is integrally formed with the back cover 600, and specifically, it is formed so as to be surrounded by the partition wall 601 of the monitor housing portion of the back cover 600 and the wall portions 607 around it (four sides). The wall portion 607 is a portion that forms the thickness in the optical axis direction of the duct 300 between the partition wall 601 of the back cover 600 and a base member of a heat dissipation unit to be described later.

The projected size of the duct 300 with respect to the camera body 1 (rear cover 600) is set to be as wide as possible in order to reduce ventilation resistance and secure heat dissipation space. The size is set. The size of the space within the duct 300 does not need to be the maximum size depending on the ventilation resistance and the position of the heat source, and can be changed depending on the balance of exhaust heat. The wall portion 607 is provided with openings 603, 604, 605 and openings 611, 612.

The heat dissipation unit 700 includes a base member 701 as a duct forming member, a thin heat dissipation component 702 as a first heat transfer member, a card slot heat dissipation plate 703 as a second heat transfer member, and the like. The heat dissipation unit 700 in which these are combined with each other is assembled to the back cover 600 so that the base member 701 covers the opening of the duct 300. The base member 701 forms a portion of the duct 300 on the main board side. The attachment of the thin heat dissipating component 702 and the card slot heat dissipating plate 703 to the base member 701 will be described later.

The outer peripheral portion of the base member 701 is provided with a stepped portion (701d in FIG. 7(b)), which will be described later. The base member 701 is positioned with respect to the back cover 600 by fitting the stepped portion 701d into the inner peripheral surface of the wall portion 607.

The base member 701 is fixed to the back cover 600 by pasting the outer peripheral portion of the base member 701 outside the step portion 701d to the front end surface of the wall portion 607 with a double-sided tape 610 having a rectangular frame shape. The double-sided tape 610 is made of a urethane base material that can be elastically deformed, and by elastically deforming the double-sided tape 610 to follow the front end surface of the wall 607, a gap is formed between the base member 701 and the wall 607. It can be fixed to the back cover 600 without having to do so. By sealing the gap between the base member 701 and the wall portion 607, air can flow efficiently within the duct 300, and water and dust can be prevented from entering the inside of the camera body 1. .

7(a) shows a cross section of the heat radiation unit 700, and FIG. 7(b) shows the heat radiation unit 700 disassembled. The exhaust direction is indicated by an arrow W. As shown in FIG. 7(b), an opening 701a is formed in the base member 701. As shown in FIG. 7(a), the thin heat dissipating component 702 is arranged to extend obliquely to the base member 701 through the opening 701a. A portion on one end side of the thin heat radiating component 702 becomes a heat receiving portion (first heat receiving portion) S1, and a portion on the other end side becomes a heat radiating portion (first heat radiating portion) S2.

The base member 701 has a sloped portion 701b, and a portion of the thin heat dissipating component 702 passing through the opening 701a on the heat receiving portion S1 side is attached to the sloped portion 701b with double-sided tape 704. A vapor chamber is used as the thin heat dissipation component 702 so that heat can be efficiently diffused. A vapor chamber is a structure in which a cooling liquid is sealed inside thin metal foils stacked on top of each other, and the liquid that receives heat from a heat source turns into vapor and diffuses into the vapor chamber, dissipating heat. After the heat is released, the steam becomes liquid again and returns to the heat source.

A heat sink 708 is attached to the duct side surface of the base member 701 using double-sided tape 709 . The heat sink 708 is disposed between the base member 701 and the heat radiating portion S2 of the thin heat radiating component 702, and is thermally connected to (contacts) them. Note that heat transfer efficiency may be increased by applying thermal conductive grease between the heat sink 708 and the thin heat dissipating component 702.

The heat sink 708 is provided to improve the heat radiation efficiency of the thin heat radiation component 702.
Since the thin heat dissipating component 702 is arranged obliquely with respect to the exhaust direction W of the air flowing in the duct 300, there is a surface on the thin heat dissipating component 702 that is not directly hit by the air flow. In the thin heat dissipating component 702, the heat dissipation efficiency is lower on the surface that is not directly hit by the air flow than on the surface that is directly hit by the air flow. Therefore, the heat radiation efficiency of the thin heat radiating component 702 is improved by directly applying the air flow to the heat sink 708 which is thermally connected to the surface of the thin heat radiating component 702 that is not directly hit by the air flow.

Although the present embodiment describes the case where the heat sink 708 is provided, the heat dissipation efficiency may be increased by extending the heat dissipation section S2 and adding an opening or a bent shape to change the air flow.

A gap around the thin heat dissipating component 702 inside the opening 701 a of the base member 701 is sealed by a first sealing member 705 and a second sealing member 706 . The first sealing member 705 and the second sealing member 706 are cushioning materials for drip-proofing, and the reliability of drip-proofing can be further improved by using water-repellent coated or closed-cell type cushioning materials. can. Further, the first sealing member 705 and the second sealing member 706 have lower thermal conductivity than the thin heat dissipating component 702.

The first sealing member 705 has an adhesive surface on one side, and the adhesive surface is attached to the base member 701 near the opening 501a. Thereafter, when the thin heat dissipating component 702 is inserted into the opening 701a and attached to the slope portion 701b, a portion of the first sealing member 705 becomes crushed. This partially closes the gap. Further, the second sealing member 706 has an adhesive surface on one side, and the adhesive surface is attached to the sheet metal 707. The sheet metal 707 is fixed to the base member 701 with screws. When the sheet metal 707 is fixed to the base member 701, the second sealing member 706 is elastically deformed to close the remaining part of the gap. The second sealing member 706 is disposed so as to partially cover the first sealing member 705 and is also attached to the first sealing member 705, thereby more reliably closing the gap.

A card slot heat sink 703 is also assembled to the base member 701. Aluminum, which has high thermal conductivity, is used as the material for the card slot heat sink 703 to reduce weight. However, other materials with high thermal conductivity, such as copper, may also be used. The card slot heat dissipation plate 703 is inserted into a horizontal hole 701e connected to a space 701c formed on the back surface 701g side of the slope portion 701b, and fixed to the base member 701 with double-sided tape (not shown) or the like.

FIG. 8A shows the positional relationship between the heat dissipation unit 700 and the main board 4 inside the camera body 1. The exhaust direction is indicated by an arrow W. FIG. 8(b) shows the image processing element 400, the first thermally conductive sheet 710, the first card slot 401, and the second thermally conductive sheet 711 on the main board 4 when the heat dissipation unit 700 is removed from FIG. 8(a). It shows the positional relationship of

As shown in FIG. 8(a), the duct-side surface of the heat dissipation unit 700 includes a heat dissipation section S2 of the thin heat dissipation component 702 and a heat dissipation section (second heat dissipation section) 703a on one end side of the card slot heat dissipation plate 703. is exposed. The heat receiving part S1 of the thin heat dissipating component 702 is thermally connected to the image processing element 400 on the main board 4, and the card slot heat dissipating plate 703 connects to the first card slot in the heat receiving part (second heat receiving part) 703b on the other end side. 401.

As shown in FIG. 8(b), a first heat conductive sheet 710 is provided between the upper surface of the image processing element 400 and the heat receiving portion S1 of the thin heat dissipating component 702. Since the first heat conductive sheet 710 closely contacts the heat receiving portion S1 of the thin heat dissipating component 702 assembled diagonally to the base member 701, its thickness gradually decreases before being placed on the upper surface of the image processing element 400. It's been crushed like that.

A second heat conductive sheet 711 is attached to the upper surface of the first card slot 401, and the second heat conductive sheet 711 is in close contact with the back surface of the heat receiving portion 703b of the card slot heat sink 703. Heat is stably transferred from the first card slot 401 to the card slot heat sink 703 via the second heat conductive sheet 711.

FIG. 9A shows the back side of the camera body 1 having the heat dissipation unit 700. FIG. 9(b) shows a cross section of the camera body 1 taken along the line AA in FIG. It shows. The exhaust direction is indicated by an arrow W.

As shown in FIG. 9B, the main board 4 is disposed within the camera body 1 on the opposite side (front side) from the back cover 600 with the heat dissipation unit 700 interposed therebetween. On the front side of the main board 4, electronic components such as an image sensor (not shown) are arranged. The thin heat dissipation component 702 is arranged so as to be inclined with respect to the duct 300 formed along the back cover 600 from the image processing element 400 on the main board 4 toward the inside of the duct 300 . As a result, the heat radiating portion S2 of the thin heat radiating component 702 is also arranged at an angle with respect to the air flow direction F1 inside the duct 300. The inclination of the heat dissipation section S2 referred to here means an inclination that occurs obliquely with respect to the air flow, in other words, an inclination in the thickness direction (optical axis direction) of the duct 300 with respect to the flow direction F1. The heat radiation part S2 is separated from the duct side surface of the base member 701. By arranging the thin heat dissipating component 702 in this manner, the heat generated from the image processing element 400 and received by the heat receiving section S1 is transmitted to the heat dissipating section S2 and radiated into the duct 300. It is received by the flowing air and discharged to the outside together with the air.

Note that when performing air cooling by flowing air within the duct 300, it is better to reduce the thermal resistance of the thin heat dissipation component 702. In this embodiment, by using a vapor chamber as the thin heat dissipating component 702, the thermal resistance of the thin heat dissipating component 702 is reduced.

Further, the heat generated from the first card slot 401 is transmitted to the card slot heat sink 703 via the second heat conductive sheet 711, and is radiated into the duct 300 and discharged together with the air that received the heat. The main heat generation location in the first card slot 401 is a location corresponding to the IC section in the memory card inserted into the first card slot 401, and the heat from there is transferred to the metal housing that forms the first card slot 401. The heat transmitted to the metal housing is transmitted to the card slot heat sink 703 via the second heat conductive sheet 711.

FIG. 10(a) shows the bottom surface of the camera body 1 having the heat dissipation unit 700. FIG. 10(b) shows a cross section of the camera body 1 taken along the line BB in FIG. It shows the positional relationship with

In FIG. 10(b), air flowing into the opening (inflow port) 603 from the fan accessory 500 basically flows inside the duct 300 in the direction indicated by arrow F1, and exits from the openings (outflow port) 604 and 605. Flow out (exhaust). When the opening 603 side is defined as the upstream side and the openings 604 and 605 sides are defined as the downstream side, the heat dissipation section 703a of the card slot heat dissipation plate 703 is provided upstream of the heat dissipation section S2 of the thin heat dissipation component 702. Specifically, the heat dissipation part 703a of the card slot heat dissipation plate 703 is arranged near the opening 603 on the upstream side, and is spaced downstream from the heat dissipation part S2 of the thin heat dissipation component 702 arranged near the opening 605 on the downstream side. (keeping a safe distance). This is so that when the fan of the fan accessory 500 is stopped or when the fan accessory 500 is not attached to the camera body 1, natural convection air escapes to the outside from the upper openings 611 and 612 due to heat radiation only from the heat radiation parts S2 and 703a. This is to make it happen. As a result, even when no air is sent from the fan accessory 500, a certain degree of cooling effect can be obtained for the image processing element and the first card slot 401.

As described above, the heat sink 708 is installed in a direction perpendicular to the air flow direction (F1) with respect to the thin heat dissipating component 702 (FIG. It is provided over a wide range in the vertical direction (in (b)). This makes it easier for the airflow to directly hit the heat sink 708, making it possible to further enhance the heat dissipation effect of the thin heat dissipation component 702. The heat sink 708 is provided with a plurality of slits 708a to increase the surface area and improve heat dissipation efficiency.

The base member 701 is provided with two ribs (guides) 701f also shown in FIGS. 7(a) and 7(b). These ribs 701f guide a portion of the air flowing inside the duct 300 toward the heat radiating portion S2 of the thin heat radiating component 702.

Air that has received heat from the thin heat dissipation component 702 and the heat sink 708 flows out through the openings 604 and 605. The thin heat dissipating component 702 efficiently receives heat from the image processing element 400 and easily becomes high temperature, and the temperature of the air that receives the heat also increases. It is desirable to arrange it near 604 and 605. That is, it is desirable that one of the heat dissipating parts S2 and 703a, which has a smaller heat dissipation amount, the heat dissipating part 703a, is arranged at a position closer to the opening (inflow port) 603 than the other heat dissipating part S2.

As explained above, in this embodiment, in the thin camera body 1 in which the duct 300 is provided on the back cover 600, heat from the image processing element 400 is efficiently transferred via the thin heat dissipation component 702, that is, with a small number of intervening members. It can be transmitted well to the air inside the duct 300. Further, by exposing the heat radiating portion S2 of the thin heat radiating component 702 in the duct 300 in accordance with the air flow path in the duct 300, the heat from the image processing element 400 can be efficiently radiated.

Note that the main board 4 and the image processing element 400 may be arranged obliquely with respect to the duct 300 in accordance with the thin heat dissipation component 702.

FIG. 11 shows the configuration around a duct 1300 inside a back cover 1600 of a camera body according to the second embodiment. In this example, the same reference numerals as in Example 1 are given to the same components as in Example 1, and the description thereof will be omitted.

The duct 1300 is integrally formed with the back cover 1600, and specifically, it is formed so as to be surrounded by the partition wall 1601 of the monitor housing portion of the back cover 1600 and the wall portions 1607 around it (four sides).

In this embodiment as well, the projected size of the duct 1300 with respect to the camera body (back cover 1600) is set to be as wide as possible in order to reduce ventilation resistance and secure heat dissipation space. Specifically, the projected size of the monitor 101 is is set to the same size. The size of the space within the duct 1300 does not need to be the maximum size depending on the ventilation resistance and the position of the heat source, and can be changed depending on the balance of exhaust heat. The wall portion 1607 is provided with openings 1603, 1604, 1605 and openings 1611, 1612.

The heat dissipation unit 1700 is composed of a base member 1701, a thin heat dissipation component 1702, and the like, and is assembled to the camera body so as to cover the duct 1300 in the combined state. The attachment of the thin heat dissipating component 1702 to the base member 1701 will be described later.

A stepped portion 1701d (see FIG. 12(b) and FIG. 14) is provided on the outer peripheral portion of the base member 1701. The base member 1701 is positioned with respect to the back cover 1600 by fitting the stepped portion 1701d into the inner peripheral surface of the wall portion 1607.

The base member 1701 is fixed to the back cover 1600 by pasting the outer peripheral portion of the base member 1701 outside the step portion 1701d to the front end surface of the wall portion 1607 with a C-shaped double-sided tape 1610. The double-sided tape 1610 is made of an elastically deformable urethane base material, and the double-sided tape 1610 elastically deforms to follow the front end surface of the wall portion 1607, thereby forming a gap between the base member 1701 and the wall portion 1607. It can be fixed to the back cover 1600 without having to do so.

Note that a recess 1609 that extends laterally and is recessed toward the rear is formed in the upper wall 1607 of the back cover 1600, and a cushioning material 1613 is placed inside this recess 1609 and is secured with double-sided tape (not shown). Fixed. The C-shaped double-sided tape 1610 has both ends 1610a cut to match the length of the cushion material 1613.

12(a) shows the heat radiating unit 1700, and FIG. 12(b) shows a cross section of the heat radiating unit 1700 when the heat radiating unit 1700 is cut along the line HH in FIG. 12(a).

As shown in FIG. 12(b) (and FIG. 11), the base member 1701 is provided with ribs 1701a. When the thin heat radiating component 1702 is assembled to the base member 1701, the rib 1701a and the thin heat radiating component 1702 come into contact. The base member 1701 is formed with a convex portion 1701b that serves as a receiving portion for the thin heat dissipating component 1702. The convex portion 1701b is a portion that receives the pressing force from the third heat conductive sheet 1710 via the thin heat radiating component 1702 after the thin heat radiating component 1702 is assembled to the base member 1701.

In this embodiment, the thin heat radiating component 1702 includes a heat receiving part S11, a heat radiating part S12, and a U-bent part 1702a between them. The thin heat radiating component 1702 is assembled to the base member 1701 such that the heat receiving part S11 is located on the main board side and the heat radiating part S12 is located on the duct side.

FIG. 16 shows a cross section of the camera body shown in FIG. 15(a) along line GG. In FIG. 16, a heat dissipation unit 1700 is assembled to a back cover 1600, and the main board 4 is further arranged on the opposite side (front side) of the back cover 1600 with the heat dissipation unit 1700 in between. The U-bent portion 1702a of the thin heat dissipation component 1702 passes through the inside of the recess 1609 formed in the upper wall portion 1607 of the back cover 1600. Thereby, the heat receiving part S11 of the thin heat radiating component 1702 is arranged to face the image processing element 400 mounted on the main board 4, and the heat radiating part S12 is arranged inside the duct 1300.

A third heat conductive sheet 1710 is arranged between the heat receiving section S11 and the image processing element 400 to thermally connect them. The third thermally conductive sheet 1710 is pressed against the image processing element 400, and the convex portion 1701b of the base member 1701 receives the pressing force as a reaction force via the heat receiving portion S11.

FIG. 13A shows the back cover 1600 and the heat dissipation unit 1700 assembled thereto as seen from the main board side. The exhaust direction is indicated by an arrow W. FIG. 13(b) shows a cross section taken along line BB in FIG. 13(a). As shown in FIGS. 13(b) and 16, before the heat dissipation unit 1700 is assembled to the back cover 1600, a cushion material 1613 is fixed in a recess 1609 formed in the upper wall 1607 of the back cover 1600. This cushion material 1613 fills the gap between the back cover 1600 and the thin heat dissipating component 1702 (bent portion 1702a) leading to the inside of the duct 1300. Slopes 1609a are formed at both ends of the recess 1609, so that both ends 1610a of the C-shaped double-sided tape 1610 stick to the slopes 1609a without any gaps. By sealing the duct 1300 without any gaps in this manner, air can flow efficiently within the duct 1300, and water and dust can also be prevented from entering the camera body 1.

Note that the gap created at the contact portion between the thin heat dissipating component 1702 and the base member 1701 may be sealed with an adhesive or the like.

FIG. 14 shows the positional relationship between the heat dissipation unit 1700 and the main board 4. The heat dissipating portion S12 of the thin heat dissipating component 1702 is substantially parallel to the surface 1701c on the back side of the base member 1701 so as to be less likely to create resistance to the air flowing in the duct 1300. By fitting the convex portion 1701e provided on the surface 1701c of the base member 1701 into the hole 1702d provided in the thin heat radiating component 1702, the thin heat radiating component 1702 is positioned in the in-plane direction of the surface 1701c. .

FIG. 15(a) shows the camera body 1 seen from the bottom side, and FIG. 15(b) shows a cross section of the camera body 1 taken along the line CC in FIG. 15(a). FIG. 16 shows a cross section of the camera body 1 taken along line GG in FIG. 15(a).

Air flowing into opening 1603 from a fan accessory (not shown) basically flows within duct 1300 in the direction shown by arrow F2, and flows out (exhausts) from openings 1604 and 1605. The thin heat dissipating component 1702 is arranged near the opening 1603 with an interval (distance) Dx, Dy from the wall portion 1607 forming the duct 1300. By creating an air layer with a width of the intervals Dx and Dy, heat is prevented from being easily transmitted from the heat radiating portion S12 of the thin heat radiating component 1702 to the back cover 1600. Note that if there is a concern that the thin heat dissipating component 1702 may be deformed or come into contact with the wall portion 1607 due to vibration or impact, a heat insulating member with low thermal conductivity may be interposed between the intervals Dx and Dy.

As shown in FIG. 16, the heat radiation part S12 of the thin heat radiation component 1702 is separated from the partition wall 1601 and the wall part 1607. Therefore, the air flowing through the opening 1603 and flowing inside the duct 1300 can flow along the front and back surfaces of the thin heat dissipating component 1702.

Heat generated from the image processing element 400 on the main board 4 is transmitted to the heat receiving part S11 of the thin heat dissipating component 1702, the U-bent part 1702a, and the heat dissipating part S12 in this order via the third heat conductive sheet 1710, and is transferred to the surface of the heat dissipating part S12. Heat is radiated from the back side to the air.

FIG. 17 shows a thin heat dissipating component 1801 as a modification of the thin heat dissipating component 1702. As shown in FIG. 15(b), a space remains on the downstream side of the duct 1300, and the size of the thin heat dissipation component 1702 can be expanded. FIG. 17 shows a modification that effectively utilizes the above space.

The thin heat dissipation component 1801, like the thin heat dissipation component 1702, has a heat receiving part S21, a U-bend part 1801g, and a heat dissipation part S22. Furthermore, the thin heat dissipation component 1801 has extension parts 1801a and 1801b extending downstream from the heat dissipation part S22.

When there are a plurality of openings 1604 and 1605 as outflow ports, heat radiation efficiency can be increased by providing extending portions 1801a and 1801b in the thin heat dissipation component 1801 depending on the positions of these outflow ports. Furthermore, by bending the bent portions 1801c to 1801f at the tips of the extending portions 1801a and 1801b so as to be inclined with respect to the air flow direction (so as to occur vertically diagonally), air flow is created in the extending portions 1801a and 1801b. It becomes easier to hit, and heat dissipation efficiency can be increased.

As described above, in this embodiment, in the thin camera body 1 in which the duct 1300 is provided on the back cover 1600, the heat from the image processing element 400 is transmitted through the thin heat dissipation component 1702 (or 1802), that is, with little intervention. With this member, the air inside the duct 1300 can be efficiently transmitted. Furthermore, by exposing the heat radiating portion S12 of the thin heat radiating component 1702 into the duct 1300 in accordance with the air flow path within the duct 1300, heat from the image processing element 400 can be efficiently radiated.

According to each of the embodiments described above, it is possible to provide a thin camera body having good heat dissipation performance while suppressing the thickness of the duct.

Note that in Examples 1 and 2 above, air was used as the cooling medium, but other fluids may be used.

Further, the configuration similar to the first and second embodiments described above can be used for various electronic devices other than the imaging device. That is, embodiments of the present invention are not limited to imaging devices, but include various electronic devices.

The embodiments described above are merely representative examples, and various modifications and changes can be made to each embodiment when implementing the present invention.

1 Camera body 4 Main board 300,1300 Duct 400 Image processing element 600,1600 Rear cover 701,1701 Base member 702,1702 Thin heat dissipation component

Claims (14)

An electronic device having a duct through which a fluid flows,
a board on which a first electronic component is mounted;
a duct forming member forming a portion of the duct on the substrate side;
a first heat transfer member having a first heat receiving part thermally connected to the first electronic component and a first heat radiating part that radiates heat transmitted from the first heat receiving part;
The first heat transfer member extends from the outside of the duct in which the first heat receiving part is arranged, through the duct forming member and into the inside of the duct, so that the first heat radiating part is connected to the duct. It is located inside,
The electronic device is characterized in that the first heat dissipation section is arranged inside the duct so as to be inclined with respect to the flow direction of the fluid. 2. The electronic device according to claim 1, wherein the first heat dissipation section is disposed apart from a duct-side surface of the duct forming member. The first heat transfer member passes through an opening provided in the duct forming member and extends from the outside to the inside of the duct,
Claim 1, wherein a gap around the first heat transfer member inside the opening is sealed with a sealing member having a lower thermal conductivity than the first heat transfer member. or the electronic device described in 2. The duct has an inlet through which the fluid flows and an outlet through which the fluid flows out from the duct,
The electronic device according to any one of claims 1 to 3, wherein the first heat radiating section is located closer to the outlet than the inlet. The electronic device according to any one of claims 1 to 4, wherein the first heat transfer member is a vapor chamber. a second electronic component mounted on the substrate;
The device further includes a second heat transfer member having a second heat receiving portion thermally connected to the second electronic component and a second heat radiating portion that radiates heat transmitted from the second heat receiving portion. ,
The second heat transfer member extends from the outside of the duct in which the second heat receiving part is arranged to the inside of the duct, and the second heat radiating part is arranged inside the duct,
The first heat transfer member and the second heat transfer member are arranged apart from each other in the flow direction inside the duct, according to any one of claims 1 to 5. electronic equipment. The duct has an inlet through which the fluid flows and an outlet through which the fluid flows out from the duct,
7. The electronic device according to claim 6, wherein one of the first heat radiating section and the second heat radiating section, which has a smaller amount of heat radiated, is arranged closer to the inlet than the other. 8. The electronic device according to claim 7, wherein the second heat radiating section is located closer to the inlet than the first heat radiating section. An electronic device having a duct through which a fluid flows,
a board on which a first electronic component is mounted;
a duct forming member forming a portion of the duct on the substrate side;
a heat transfer member having a heat receiving part thermally connected to the first electronic component and a heat radiating part that radiates heat transmitted from the heat receiving part;
The heat transfer member has a bent part between the heat receiving part and the heat radiating part,
The heat transfer member extends from the outside of the duct in which the heat receiving part is arranged, so that the bent part penetrates the duct and extends into the inside of the duct, so that the heat radiating part is arranged inside the duct. An electronic device featuring: The bent portion penetrates a part of the wall forming the thickness of the duct,
10. The electronic device according to claim 9, wherein an air layer or a heat insulating member is provided between the heat radiation part and a part of the wall part that is different from the part through which the bent part penetrates. The electronic device according to claim 9 or 10, wherein the heat transfer member has an extension part extending from the heat radiation part in the flow direction of the fluid inside the duct. The electronic device according to any one of claims 9 to 11, wherein the heat transfer member has a bent portion that is inclined with respect to the flow direction of the fluid inside the duct. The electronic device according to any one of claims 9 to 12, wherein the heat transfer member is a vapor chamber. The electronic device according to any one of claims 1 to 12,
An imaging device, wherein the first electronic component is an element that performs image processing during imaging.