JP2023084853A - Airtight package, electronic device and lid material for airtight package - Google Patents

Abstract

To provide a constitution that makes it possible to easily confirm whether an airtight package has a defect spoiling its airtightness through appearance inspection through a lid material having a glass-made infrared light transmission part.SOLUTION: An airtight package 3 comprises a base material 4, a frame body 5 provided on a principal surface 4a of the base material 4, and a lid material 6 provided on the frame body 5, and the lid material 6 comprises a glass-made infrared-light transmission part 7, and a glass-made visible light transmission part 8 having a holding part 8c holding an outer peripheral surface 7c of the infrared-light transmission part 7.SELECTED DRAWING: Figure 1

Description

The present invention relates to hermetic packages, electronic devices and lids for hermetic packages.

2. Description of the Related Art In electronic devices with electronic components such as laser elements, the electronic components are typically housed in a hermetic package.

For example, as disclosed in Patent Document 1, an airtight package includes a base material having a main surface (a first member in the same document) and a frame provided on the main surface of the base material (a first member in the same document). 2 member) and a cover member (cover member in the document) provided on the frame.

WO2015/190242

Some electronic devices of this type include a laser element that emits infrared light as an electronic component, and are used in fields such as gas analysis and precision processing. When infrared light is used in an electronic device in this way, the cover member needs to have an infrared light transmitting portion that transmits infrared light. In addition, the lid material is preferably made of glass with high gas barrier properties in order to ensure airtightness over a long period of time.

However, infrared light transmitting glass generally has low visible light transmittance. Therefore, when the lid material is made of infrared light transmitting glass, it is difficult to confirm the bonding state of the interface between the frame and the lid material by visual inspection such as visual inspection through the lid material. Therefore, there is a possibility that a defect in the interface between the frame and the cover material may be overlooked. If such a defect is overlooked, the airtightness in the airtight package cannot be ensured due to the defect, and the reliability of the electronic component in the airtight package may be impaired.

SUMMARY OF THE INVENTION An object of the present invention is to provide a configuration that allows easy confirmation of the presence or absence of defects that impede the airtightness of an airtight package by visual inspection through a cover member made of glass having an infrared light transmitting portion.

(1) The present invention, invented to solve the above problems, comprises a substrate having a main surface, a frame provided on the main surface of the substrate, and a lid provided on the frame. In the airtight package, the lid member includes an infrared light transmitting portion made of glass and a visible light transmitting portion made of glass having a holding portion that holds the outer circumference of the infrared light transmitting portion. .

In this way, the state of the interface between the frame and the cover member, the state of the interface between the infrared light transmitting portion and the visible light transmitting portion, and the like can be observed by visual inspection such as visual inspection through the visible light transmitting portion. Therefore, the presence or absence of defects that impede the airtightness of the airtight package can be easily confirmed by visual inspection.

(2) In the above configuration (1), the infrared light transmitting portion has an internal transmittance of 70 to 99% in a wavelength range of 3 to 14 μm when the thickness is 2 mm, and 0.4 The internal transmittance in the wavelength range of ~0.8 μm is 2% or less, and the visible light transmission part has an internal transmittance of 50% in the wavelength range of 0.4 to 0.8 μm when the thickness is 2 mm. It is preferable that it is above.

In this way, visible light is sufficiently transmitted through the visible light transmission portion while infrared light is sufficiently transmitted through the infrared transmission portion. Therefore, defects in the interface between the frame body and the cover material can be easily found through the visible light transmitting portion by visual inspection.

(3) In the configuration of (1) or (2) above, the infrared light transmitting portion is preferably made of chalcogenide glass.

By doing so, good infrared light transmittance can be achieved in the infrared light transmitting portion.

(4) In the configuration of (3) above, the chalcogenide glass contains 50 to 80% of S, 0 to 40% of Sb (but not including 0%), and 0 to 18% of Ge (but not including 0%) in terms of molar percentage. not included), Sn 0-20%, and Bi 0-20%.

(5) In the configuration of (3) above, the chalcogenide glass may contain 4 to 80% Te, 0 to 50% Ge (but not including 0%), and 0 to 20% Ga in terms of molar percentage. good.

(6) In any one of the configurations (1) to (5) above, in the holding portion, the infrared light transmitting portion and the visible light transmitting portion have joints joined together, and the infrared light It is preferable that the junction between the transmitting portion and the visible light transmitting portion has a silicon layer.

Infrared light transmitting glass often has poor adhesion and bondability with other members, but has good adhesion and bondability with a silicon layer. Therefore, the bonding strength (airtightness) between the infrared light transmitting portion and the visible light transmitting portion can be increased by interposing the silicon layer.

(7) In the configuration of any one of (1) to (6) above, the infrared light transmitting portion and the frame have a joint portion bonded to each other, and the infrared light transmitting portion and the frame are It is preferable that the joint portion has a silicon layer and a solder layer in order from the infrared light transmitting portion side.

Infrared light transmitting glass often has poor adhesion and bondability with other members, but has good adhesion and bondability with a silicon layer. On the other hand, the solder layer has the advantage that it is easy to ensure the airtightness of the joint. Therefore, by interposing the silicon layer and the solder layer, the bonding strength (airtightness) between the infrared light transmitting portion and the frame can be increased.

(8) In any one of the configurations (1) to (7) above, the visible light transmitting portion and the frame have a bonding portion bonded to each other, and the visible light transmitting portion and the frame are bonded together. The part preferably has a solder layer.

Compared with infrared light transmitting glass, visible light transmitting glass often has better adhesiveness and bondability with other members. Therefore, if the visible light transmitting portion and the frame are joined via the solder layer, the bonding strength (airtightness) between the visible light transmitting portion and the frame can be increased.

(9) In any one of the configurations (1) to (8) above, it is preferable that the infrared light transmitting portion has a retaining portion that engages with the visible light transmitting portion in the thickness direction in the holding portion. .

In this way, the infrared light transmitting portion can be reliably held with respect to the visible light transmitting portion.

(10) In the configuration of (9) above, the retaining portion is provided at the end portion of the infrared light transmitting portion on the frame body side, and at least a part of the retaining portion overlaps with the frame. is preferred.

With this configuration, the retaining portion is provided at the end portion on the frame body side, so that the processing for forming the retaining portion is easy. In addition, since at least a part of the retainer is pressed by the frame, the infrared light transmitting section can be held more reliably with respect to the visible light transmitting section.

(11) The present invention, invented to solve the above problems, is an electronic device comprising an airtight package having any one of the above (1) to (10) and an internal space of the airtight package. and an electronic component that is accommodated in the infrared light transmission part and irradiates the infrared light to the outside through the infrared light transmission part.

In this way, the same effect as the corresponding configuration already described can be enjoyed.

(12) The present invention, which has been devised to solve the above problems, is a lid member for an airtight package, comprising an infrared light transmitting part made of glass and a holding part for holding the outer periphery of the infrared light transmitting part. and a visible light transmitting portion made of glass having a thickness of 2 mm, the infrared light transmitting portion has an internal transmittance of 70 to 99% in a wavelength range of 3 to 14 μm, and 0. The internal transmittance in the wavelength range of 4 to 0.8 μm is 2% or less, and the visible light transmitting portion has an internal transmittance of 50 in the wavelength range of 0.4 to 0.8 μm when the thickness is 2 mm. % or more.

By using such a lid member in an airtight package, it is possible to enjoy the same effect as the corresponding configuration already described.

According to the present invention, even if the lid member has a glass-made infrared light-transmitting portion, the appearance inspection through the glass-made visible light-transmitting portion of the lid member is performed to determine whether or not there is a defect that hinders the airtightness of the airtight package. can be easily verified.

1 is a cross-sectional view showing an electronic device according to a first embodiment; FIG. FIG. 2 is a cross-sectional view showing an enlarged X region of FIG. 1; It is sectional drawing which shows the manufacturing method (lid material preparation process) of the lid material which concerns on 1st embodiment. It is sectional drawing which shows the manufacturing method (lid material preparation process) of the lid material which concerns on 1st embodiment. It is sectional drawing which shows the lid|cover material which concerns on 2nd embodiment. It is sectional drawing which shows the lid|cover material which concerns on 3rd embodiment. It is a sectional view showing a cover material concerning a fourth embodiment. It is a sectional view showing a cover material concerning a fifth embodiment. It is a sectional view showing the cover material concerning a sixth embodiment. It is a sectional view showing the cover material concerning a seventh embodiment. FIG. 11 is a cross-sectional view showing a lid material according to an eighth embodiment;

EMBODIMENT OF THE INVENTION Hereinafter, it demonstrates, referring drawings for the form for implementing this invention. In addition, overlapping description may be omitted by attaching the same reference numerals to the corresponding constituent elements in each embodiment. When only a part of the configuration is described in each embodiment, the configurations of other embodiments previously described can be applied to other portions of the configuration. In addition to combinations of configurations explicitly specified in the description of each embodiment, configurations of a plurality of embodiments can be partially combined even if they are not specified unless there is a particular problem with the combination.

FIG. 1 illustrates an electronic device 1 according to a first embodiment of the invention. In the following embodiments, the lid member 6 side will be described as "top" and the substrate 4 side will be described as "bottom", but the vertical direction is not limited to this.

An electronic device 1 according to this embodiment includes an electronic component 2 and an airtight package 3 that accommodates the electronic component 2 therein.

The electronic component 2 is a laser element (light source) that emits infrared light L in this embodiment. Examples of laser devices include quantum cascade laser devices. When the electronic component 2 is a quantum cascade laser element, the electronic device 1 is used, for example, as a gas analyzer or a laser processing device.

The airtight package 3 includes a base material 4 having an upper surface (principal surface) 4a on which the electronic component 2 is mounted, a frame body 5 provided on the upper surface 4a of the base material 4 so as to surround the electronic component 2, and a frame body. 5 and a lid member 6 provided thereon.

The base material 4 is a plate-like body having a flat upper surface 4a and a lower surface 4b. The upper surface 4a of the base material 4 may be provided with a concave portion in a portion where the electronic component 2 is mounted.

The frame body 5 is a cylindrical body having a through portion (for example, a circular or rectangular through hole in a plan view) 5c extending in the vertical direction (thickness direction) at the center. The frame 5 surrounds the electronic component 2 arranged in the space corresponding to the through portion 5c. In this embodiment, the frame body 5 is configured as a rectangular cylinder, but may be other cylindrical shapes such as a cylinder.

The base material 4 and the frame 5 are made of, for example, ceramics such as aluminum nitride or aluminum oxide, glass, glass ceramics, silicon compounds such as silicon, or composites of these materials and metals such as Ag or Cu. In this embodiment, the base material 4 and the frame 5 are made of metal. When the base material 4 and the frame body 5 are made of the same material, the base material 4 and the frame body 5 may be made as one piece, or the base material 4 and the frame body 5 may be made as separate pieces. may be joined together. When joining the upper surface 4a of the base material 4 and the lower surface 5b of the frame 5, any joining method such as laser joining, soldering, or glass frit joining can be used.

The cover member 6 is a plate-like body having a flat upper surface 6a and a lower surface 6b, and is joined to the upper surface 5a of the frame 5 so as to close the through portion 5c of the frame 5. As shown in FIG. At least a part of the upper surface 6a and the lower surface 6b of the lid member 6 may be configured with a convex curved surface or a concave curved surface so as to have a lens function.

The lid member 6 includes an infrared light transmitting portion 7 made of glass and a visible light transmitting portion made of glass arranged outside the infrared light transmitting portion 7 so as to surround the outer peripheral surface 7c of the infrared light transmitting portion 7. a part 8;

When the lid member 6 is a plate-like body, the upper surface 7a of the infrared light transmitting portion 7 and the upper surface 8a of the visible light transmitting portion 8 are preferably flush with each other, and the lower surface 7b of the infrared light transmitting portion 7 and the visible light transmitting portion 8 are preferably flush with each other. It is preferably flush with the lower surface 8 b of the light transmitting portion 8 .

For example, when the thickness is 2 mm, the infrared light transmitting portion 7 has an internal transmittance of 70 to 99% in a wavelength range of 3 to 14 μm and a transmittance in a wavelength range of 0.4 to 0.8 μm. The internal transmittance is 2% or less. The internal transmittance can be measured using, for example, UH-4150 manufactured by Hitachi High-Tech Science.

The infrared light transmitting portion 7 is made of chalcogenide glass in this embodiment. In addition, the infrared light transmitting portion 7 is not limited to chalcogenide glass as long as it is glass having the above internal transmittance.

The chalcogenide glasses, in molar percentages, are S 50-80%, Sb 0-40% (but not including 0%), Ge 0-18% (but not including 0%), Sn 0-20%, Bi 0 It may contain up to 20%.

In the chalcogenide glass, the S content is preferably 55% or more, more preferably 60% or more, more preferably 75% or less, and still more preferably 70% or less in terms of molar percentage. When the S content in the glass is less than 50%, vitrification becomes difficult. On the other hand, when the content of S in the glass exceeds 80%, the weather resistance of the glass deteriorates, which limits the operating environment of the electronic device 1 .

The Sb content in the chalcogenide glass is preferably 5% or more, more preferably 10% or more, more preferably 35% or less, and still more preferably 33% or less in terms of molar percentage. When the glass does not contain Sb, or when the content exceeds 40%, vitrification becomes difficult.

In the chalcogenide glass, the molar percentage of Ge is preferably 2% or more, more preferably 4% or more, more preferably 20% or less, and still more preferably 15% or less. If the glass does not contain Ge, it becomes difficult to vitrify. On the other hand, if the Ge content in the glass exceeds 18%, Ge-based crystals precipitate out of the glass, making it difficult to obtain an internal transmittance that satisfies the characteristics of the infrared light transmitting portion 7 .

In the chalcogenide glass, the Sn content is preferably 1% or more, more preferably 5% or more, more preferably 15% or less, and still more preferably 10% or less in terms of molar percentage. Sn in the glass is a component that promotes vitrification. However, when the Sn content in the glass exceeds 20%, vitrification becomes difficult.

In the chalcogenide glass, the molar percentage of Bi content is preferably 0.5% or more, more preferably 2% or more, more preferably 10% or less, and still more preferably 8% or less. Bi in the glass is a component that suppresses the energy required for vitrification of raw materials when the glass is melted. On the other hand, when the content of Bi in the glass exceeds 20%, it becomes difficult to obtain the internal transmittance that satisfies the properties of the infrared light transmitting portion 7 due to precipitation of Bi-based crystals from the glass.

The chalcogenide glass is not limited to the above composition, and may contain 4 to 80% Te, 0 to 50% Ge (but not including 0%), and 0 to 20% Ga in molar percentage.

In the chalcogenide glass, the molar percentage of Te is preferably 10% or more, more preferably 20% or more, more preferably 75% or less, and still more preferably 70% or less. When the Te content in the glass is less than 4%, vitrification becomes difficult. On the other hand, when the Te content in the glass exceeds 80%, Te-based crystals precipitate from the glass, making it difficult to obtain an internal transmittance that satisfies the properties of the infrared light transmitting portion 7 .

In the chalcogenide glass, the molar percentage of Ge is preferably 1% or more, more preferably 5% or more, more preferably 40% or less, and still more preferably 30% or less. If the glass does not contain Ge, it becomes difficult to vitrify. On the other hand, if the Ge content in the glass exceeds 50%, Ge-based crystals precipitate from the glass, making it difficult to obtain the internal transmittance that satisfies the properties of the infrared light transmitting portion 7 .

In the chalcogenide glass, the Ga content in terms of molar percentage is preferably 0.1% or more, more preferably 1% or more, more preferably 15% or less, and still more preferably 10% or less. By containing Ga in the glass, the vitrification range can be widened and the thermal stability (vitrification stability) of the glass can be enhanced.

For example, when the visible light transmitting portion 8 has a thickness of 2 mm, the internal transmittance in the wavelength range of 0.4 to 0.8 μm is 50% or more. The internal transmittance can be measured using, for example, UH-4150 manufactured by Hitachi High-Tech Science.

The visible light transmitting portion 8 is not particularly limited, but is made of, for example, silicate glass, silica glass, borosilicate glass, soda glass, soda lime glass, aluminosilicate glass, alkali-free glass, or the like. .

The thermal expansion coefficient of chalcogenide glass is significantly larger than that of silicate glass, silica glass, borosilicate glass, soda glass, soda lime glass, aluminosilicate glass, and alkali-free glass. Therefore, when chalcogenide glass is used for the infrared light transmitting portion 7 and the glasses listed above are used for the visible light transmitting portion 8, the mismatch between the thermal expansion coefficients of the two causes the difference between the infrared light transmitting portion and the visible light transmitting portion. There is a risk that the silicon layer, which is the joint between the two, may be damaged and the mechanical strength of the lid member may be reduced. In order to solve this problem, the difference between the thermal expansion coefficient of the chalcogenide glass applied to the infrared light transmitting portion and the thermal expansion coefficient of the glass applied to the visible light transmitting portion is preferably 150×10 ⁻⁷ /° C. or less. More preferably 130×10 ⁻⁷ /° C. or less, still more preferably 110×10 ⁻⁷ /° C. or less, and particularly preferably 90×10 ⁻⁷ /° C. or less.

The visible light transmitting portion 8 has a holding portion 8 c for holding the infrared light transmitting portion 7 at a position corresponding to the through portion 5 c of the frame 5 . In the present embodiment, the holding portion 8c is composed of a through portion (for example, a through hole having a circular or rectangular shape in a plan view), and the inner peripheral surface of the holding portion 8c holds the outer peripheral surface 7c of the infrared light transmitting portion 7. ing.

An outer peripheral surface 7 c of the infrared light transmitting portion 7 has a retaining portion 9 .

The retaining portion 9 is provided only at the lower end portion (the end portion on the frame body 5 side) of the outer peripheral surface 7c of the infrared light transmitting portion 7 . The retainer portion 9 is composed of a tapered portion whose diameter gradually expands toward the outer diameter side as it moves toward the frame body 5 side. The visible light transmitting portion 8 includes an engaging portion 10 that has a shape (tapered portion) following the retaining portion 9 in the holding portion 8c and engages with the retaining portion 9 in the vertical direction. By engaging the retaining portion 9 of the infrared light transmitting portion 7 with the engaging portion 10 of the visible light transmitting portion 8, upward movement of the infrared light transmitting portion 7 is restricted.

At least a portion of the retainer 9 (a portion of the lower surface 7 b of the infrared light transmitting portion 7 ) overlaps the upper surface 5 a of the frame 5 . As a result, at least a part of the retainer 9 is pressed by the frame 5, and downward movement of the infrared light transmitting portion 7 is restricted. As a result, the movement of the infrared light transmitting portion 7 to both sides in the vertical direction is restricted. maintained.

As shown in FIG. 2, the outer peripheral surface 7c of the infrared light transmitting portion 7 and the holding portion 8c of the visible light transmitting portion 8 have a first joint portion 11 joined to each other. The first junction 11 includes a silicon layer 12 . The infrared light transmitting glass (for example, chalcogenide glass) constituting the infrared light transmitting portion 7 often has very poor adhesion and bonding with other members, but has poor adhesion and bonding with the silicon layer. Good. Therefore, by interposing the silicon layer 12, the bonding strength (airtightness) between the infrared light transmitting portion 7 and the visible light transmitting portion 8 can be increased. Also, the silicon layer has a buffer function. Therefore, when the silicon layer 12 is formed on the first bonding portion 11, the infrared light transmitting portion 7 is made of chalcogenide glass, and the visible light transmitting portion 8 is made of silicate glass, silica glass, borosilicate glass, soda glass, When using soda-lime glass, aluminosilicate glass, alkali-free glass, etc., it is possible to relax the residual stress that occurs due to the mismatch of the thermal expansion coefficients of the two, reducing the risk of damage to the lid material. can be effective. In this embodiment, the silicon layer 12 is provided at a position corresponding to the retaining portion 9 and the engaging portion 10 . In other words, the retaining portion 9 and the engaging portion 10 are in contact with each other through the silicon layer 12, and the infrared light transmitting portion 7 and the visible light transmitting portion 8 are in direct contact at a position excluding the retaining portion 9. ing.

The silicon layer 12 is a film formed on the glass surface of either the infrared light transmitting portion 7 or the visible light transmitting portion 8 by vapor deposition, sputtering, or the like, and adheres between the infrared light transmitting portion 7 and other members. It has a role to improve sexuality.

The thickness of the silicon layer 12 is, for example, preferably 0.01 to 0.50 μm, 0.02 to 0.30 μm, particularly 0.03 to 0.10 μm.

The lower surface 7b of the infrared light transmitting portion 7 (the lower surface of the retainer portion 9) and the upper surface 5a of the frame 5 have a second joint portion 13 joined to each other. The second joint portion 13 is annularly formed on the upper surface 5 a of the frame 5 so as to surround the through portion 5 c of the frame 5 . The second joint portion 13 includes a silicon layer 14, a metallized layer 15, and a solder layer 16 in order from the infrared light transmitting portion 7 side. As described above, the infrared light-transmitting glass constituting the infrared light-transmitting portion 7 often has very poor adhesion and bonding to other members, but has good adhesion and bonding to the silicon layer 14. is. The silicon layer 14 has good adhesiveness and bondability with the metallized layer 15 . The solder layer 16 has the advantages of good adhesiveness and bondability with the metallized layer 15 and easy securing of the airtightness of the second joint portion 13 . Therefore, by interposing the silicon layer 14, the metallized layer 15, and the solder layer 16, the bonding strength (airtightness) between the infrared light transmitting portion 7 and the frame 5 can be increased.

The silicon layer 14 is a film formed on the glass surface of the infrared light transmitting portion 7 by vapor deposition, sputtering, or the like, and serves to improve adhesion between the infrared light transmitting portion 7 and other members. The metallized layer 15 is a metal film formed on the silicon layer 14 by vapor deposition, sputtering, or the like, and serves to improve adhesion with the solder layer 16 . If the adhesion between the frame 5 and the solder layer 16 is poor, it is preferable to form a metallized layer also between the frame 5 and the solder layer 16 .

As a material for the metallized layer 15, for example, Cr, Ti, Ni, Pt, Au, W, Pd, an alloy layer containing these, or a multilayer film of these metals or alloys can be used. Materials for the solder layer 16 include, for example, Au, Sn, Ag, Pb, In, Bi, and alloys containing these metals, that is, Au—Sn solder, Sn—Ag solder, Sn—In solder, Sn— Bi-based solder, Pb-based solder, or the like can be used.

The thickness of the silicon layer 14 is, for example, preferably 0.01 to 0.50 μm, 0.02 to 0.30 μm, particularly 0.03 to 0.10 μm. The thickness of the metallized layer 15 is, for example, 0.10 to 10.0 μm, 0.50 to 5.00 μm, preferably 1.00 to 3.00 μm. The thickness of the solder layer 16 is, for example, preferably 1-300 μm, 5-100 μm, particularly preferably 15-50 μm.

The lower surface 8b of the visible light transmitting portion 8 and the upper surface 5a of the frame 5 have a third joint portion 17 joined to each other. The third joint portion 17 is annularly formed on the upper surface 5 a of the frame 5 so as to surround the through portion 5 c of the frame 5 and the second joint portion 13 . The third joint portion 17 includes a metallized layer 18 and a solder layer 19 in order from the visible light transmitting portion 8 side. In many cases, the visible light transmitting glass forming the visible light transmitting portion 8 has better adhesion and bondability with other members than the infrared light transmitting glass. Therefore, if the visible light transmitting portion 8 and the frame 5 are bonded via the metallized layer 18 and the solder layer 19, the bonding strength (airtightness) between the visible light transmitting portion 8 and the frame 5 can be increased. .

The metallized layer 18 is a metal film formed on the glass surface of the visible light transmitting portion 8 by vapor deposition, sputtering, or the like, and serves to improve adhesion with the solder layer 19 . If the adhesion between the frame 5 and the solder layer 19 is poor, it is preferable to form a metallized layer between the frame 5 and the solder layer 19 as well.

The thickness of the metallized layer 18 is, for example, 0.01 to 0.50 μm, 0.02 to 0.30 μm, preferably 0.03 to 0.10 μm. The thickness of the solder layer 19 is, for example, preferably 1-300 μm, 5-100 μm, particularly preferably 15-50 μm. In FIG. 2, the thickness of the metallized layer 18 of the third joint 17 is shown to be larger than the thickness of the metallized layer 15 of the second joint 13 for the sake of convenience. The thickness of the silicon layer 14 is very small, and the thickness difference between the metallization layers 18 and 15 is negligible.

The silicon layer 14 of the second joint portion 13 may protrude into the third joint portion 17 . In other words, part of the formation region of the silicon layer 14 may be located within the range of the lower surface 8 b of the visible light transmitting portion 8 .

The second joint portion 13 is continuous in contact with the third joint portion 17, and the first joint portion 11 is continuous in contact with at least one of the second joint portion 13 and the third joint portion 17. ing. At least one of the first joint portion 11, the second joint portion 13, and the third joint portion 17 may not be continuous with the other joint portions.

According to the electronic device 1 configured as described above, an external appearance inspection such as visual inspection through the visible light transmitting portion 8 confirms the state of the joint portion between the frame 5 and the lid member 6, and the infrared light transmitting portion 7 and the visible light. The state of the junction with the light transmitting portion 8 can be observed. Therefore, the presence or absence of a defect that impedes the airtightness of the airtight package 3 of the electronic device 1 can be easily confirmed by visual inspection.

Next, an example of a method for manufacturing the electronic device 1 configured as described above will be described.

This manufacturing method comprises a base material preparation step of preparing a base material 4 on which electronic components 2 are mounted, a frame body preparation process of preparing a frame body 5, a cover material preparation process of preparing a cover material 6, a base material 4, and an assembling step of joining the frame 5 and the lid member 6 (see FIG. 1).

In the substrate preparation step, the electronic component 2 is mounted on the upper surface 4 a of the substrate 4 .

In the frame preparation step, the through portion 5c is formed in the base material of the frame 5 . Examples of the method for forming the penetrating portion 5c include pressing, cutting, etching, laser processing, and sandblasting. In this embodiment, press working is used.

In the cover material preparation step, the visible light transmitting portion forming step of forming the holding portion 8c in the base material glass of the visible light transmitting portion 8, and the base material glass of the infrared light transmitting portion 7 are deformed by heating to form the visible light transmitting portion. and an infrared light transmitting portion forming step of forming the infrared light transmitting portion 7 in which the outer peripheral surface 7c is held by the holding portion 8c.

In the visible light transmitting portion forming step, the retaining portion 8 c having the engaging portion 10 is formed on a plate-shaped base glass having the same glass composition as the visible light transmitting portion 8 . Methods for forming the holding portion 8c include, for example, pressing, cutting, etching, laser processing, sandblasting, and the like. In this embodiment, an etching process is used.

As shown in FIGS. 3 and 4 , in the infrared light transmitting portion forming step, a columnar (for example, cylindrical) base glass 20 having the same glass composition as that of the infrared light transmitting portion 7 is applied to the visible light transmitting portion 8 . While being inserted into the holding portion 8c, the base glass 20 is pressed by the molding die 21 while being heated.

The molding die 21 is arranged below the first molding die 22 having a molding surface 22a for molding the upper surface 7a of the infrared light transmitting portion 7, and the first molding die 22 to form the lower surface 7b of the infrared light transmitting portion 7. A second molding die 23 having a molding surface 23a for molding is provided. The first forming die 22 and the second forming die 23 are made of steel such as cemented carbide or SUS.

When the base material glass 20 is exposed to oxygen in a heating environment, the surface layer of the base material glass 20 is easily oxidized. Therefore, it is preferable that the mold 21 and the base glass 20 are placed in a reduced pressure environment or in a chamber filled with an inert gas (for example, nitrogen gas). As a result, it is possible to avoid the possibility that the optical properties of the base material glass 20 are degraded and the possibility that the airtight adhesion at the interface between the base material glass 20 and the holding portion 8c is deteriorated. A heater (not shown) for heating the mold 21 and the base glass 20 is provided outside the chamber.

In the infrared light transmitting portion forming step, the base glass 20 is inserted through the holding portion 8c of the visible light transmitting portion 8 (see FIG. 3). In this state, one of the upper surface 20a and the lower surface 20b of the base material glass 20 protrudes outside the visible light transmitting portion 8, and the other surface of the base material glass 20 is flush with the visible light transmitting portion 8. (Fig. 3 illustrates a state in which the lower surface 20b protrudes). The molding surface 22a of the first molding die 22 and the molding surface 23a of the second molding die 23 sandwich the upper surface 20a and the lower surface 20b of the base glass 20 inserted into the holding portion 8c from above and below. After that, while the mold 21 and the base glass 20 are heated by the heater, the molding surface 22a of the first mold 22 and the molding surface 23a of the second mold 23 are brought close to each other to press the base glass 20 ( See Figure 4).

In the process of forming the infrared light transmitting portion, the base material glass 20 is heated to 160 to 260° C., for example. The heated base glass 20 is softened and deformed by the pressure applied by the molding surface 22 a of the first mold 22 and the molding surface 23 a of the second mold 23 . As a result, the base material glass 20 expands in the width direction while shrinking in the vertical direction, and adheres to the holding portion 8c. Therefore, the outer peripheral surface 20c of the base material glass 20 has a shape that follows the holding portion 8c. By slowly cooling the base material glass 20, the visible light transmitting portion 8 having the retaining portion 9 is formed while being held by the holding portion 8c.

In the infrared light transmitting portion forming step, before pressing the base material glass 20 with the molding die 21, the silicon layer 12 is formed in advance on at least part of the holding portion 8c of the visible light transmitting portion 8 by vapor deposition, sputtering, or the like. be done. In this embodiment, a silicon layer 12 is formed on the glass surface of the engaging portion 10 . Therefore, as described above, when the glass base material 20 is deformed so as to come into contact with the holding portion 8c, the visible light transmitting portion 8 and the glass base material 20 are brought into close contact with each other with the silicon layer 12 interposed therebetween. As a result, the first joint portion 11 that joins the visible light transmitting portion 8 and the infrared light transmitting portion 7 is formed, and airtightness is ensured.

The assembling process includes a first joining step of joining the base material 4 and the frame 5 and a second joining step of joining the frame 5 and the lid member 6 .

In the first bonding step, the upper surface 4a of the base material 4 and the lower surface 5b of the frame 5 are bonded by any method such as laser bonding, soldering, or glass frit bonding. When the base material 4 and the frame body 5 are configured as an integral product, the first joining step is omitted.

In the second joining step, the upper surface 5a of the frame 5 and the lower surface 6b of the lid member 6 are joined. Specifically, the upper surface 5a of the frame 5 and the lower surface 7b of the infrared light transmitting portion 7 of the lid member 6 are composed of a silicon layer 14, a metallized layer 15, and a solder layer 16 in this order from the infrared light transmitting portion 7 side. (see FIG. 2). The upper surface 5a of the frame 5 and the lower surface 8b of the visible light transmitting portion 8 of the lid member 6 form a third joint portion 17 including a metallized layer 18 and a solder layer 19 in order from the visible light transmitting portion 8 side. (see FIG. 2). The silicon layer 14 and metallized layers 15 and 18 are formed by vapor deposition, sputtering, or the like. The solder layers 16, 19 are formed by melting the solder material and then solidifying it.

5 to 11 each show a lid member 6 according to another embodiment of the invention. The infrared light transmitting portion 7 of the lid member 6 is in the state of only the lid member 6 (before being joined to the frame 5): (1st to 3rd embodiments), (2) the thickness direction of the infrared light transmitting portion 7 with respect to the holding portion 8c of the visible light transmitting portion 8 It is roughly classified into those having retaining portions for restricting movement to both sides (fourth to seventh embodiments) and (3) those not having retaining portions (eighth embodiment).

As shown in FIG. 5, in the lid member 6 according to the second embodiment, the retaining portion 31 is provided over the entire area of the outer peripheral surface 7c of the infrared light transmitting portion 7 in the vertical direction (thickness direction). The retainer portion 31 is composed of a tapered portion whose diameter gradually expands toward the outer diameter side as it moves toward the frame body 5 side. The visible light transmitting portion 8 includes an engaging portion 32 that engages with the retaining portion 31 in the vertical direction in the holding portion 8c. By engaging the retaining portion 31 of the infrared light transmitting portion 7 with the engaging portion 32 of the visible light transmitting portion 8, the infrared light transmitting portion 7 can be moved to the upper side (the side opposite to the frame 5). movement is restricted. If at least a portion of the retaining portion 31 overlaps with the upper surface 5a of the frame 5, the downward movement of the infrared light transmitting portion 7 (to the side of the frame 5) is also restricted.

As shown in FIG. 6 , in the lid member 6 according to the third embodiment, the retaining portion 41 is provided only at the lower end portion of the outer peripheral surface 7 c of the infrared light transmitting portion 7 . The retaining portion 9 is formed of a large-diameter portion having a constant diameter larger than the diameter of a portion (small-diameter portion) of the outer peripheral surface 7c of the infrared light transmitting portion 7 where the retaining portion 41 is not formed. The visible light transmitting portion 8 includes an engaging portion 42 that engages with the retaining portion 41 in the vertical direction in the holding portion 8c. By engaging the retaining portion 41 of the infrared light transmitting portion 7 with the engaging portion 42 of the visible light transmitting portion 8, upward movement of the infrared light transmitting portion 7 is restricted. If at least a portion of the retaining portion 41 overlaps with the upper surface 5a of the frame 5, downward movement of the infrared light transmitting portion 7 is also restricted.

As shown in FIG. 7 , in the lid member 6 according to the fourth embodiment, retaining portions 51 and 52 are provided at the lower end portion and the upper end portion of the outer peripheral surface 7 c of the infrared light transmitting portion 7 . The first retaining portion 51 provided at the lower end portion of the outer peripheral surface 7c of the infrared light transmitting portion 7 is composed of a tapered portion whose diameter gradually increases toward the outer diameter side as it moves downward. The second retaining portion 52 provided at the upper end portion of the outer peripheral surface 7c of the infrared light transmitting portion 7 is composed of a tapered portion whose diameter gradually increases toward the outer diameter side as it moves upward. In the holding portion 8c, the visible light transmission portion 8 has a first engagement portion 53 that engages with the first retaining portion 51 in the vertical direction, and a second engagement portion that engages with the second retaining portion 52 in the vertical direction. a portion 54; By engaging the retaining portions 51 and 52 of the infrared light transmitting portion 7 with the engaging portions 53 and 54 of the visible light transmitting portion 8, the infrared light transmitting portion 7 can be moved to both sides in the vertical direction. Regulated. Therefore, even if the lower surface 7b of the infrared light transmitting portion 7 does not overlap the upper surface 5a of the frame 5, the movement of the infrared light transmitting portion 7 is reliably restricted.

As shown in FIG. 8 , in the lid member 6 according to the fifth embodiment, retaining portions 61 and 62 are provided at the lower end portion and the upper end portion of the outer peripheral surface 7 c of the infrared light transmitting portion 7 . The first retaining portion 61 provided at the lower end portion of the outer peripheral surface 7c of the infrared light transmitting portion 7 is a portion of the outer peripheral surface 7c of the infrared light transmitting portion 7 where the retaining portions 61 and 62 are not formed ( (small diameter portion). Similarly, the second retaining portion 62 provided at the upper end portion of the outer peripheral surface 7c of the infrared light transmitting portion 7 has the retaining portions 61 and 62 formed on the outer peripheral surface 7c of the infrared light transmitting portion 7. It is composed of a large-diameter portion having a constant diameter larger than that of a portion (small-diameter portion). In the holding portion 8c, the visible light transmitting portion 8 has a first engaging portion 63 that engages with the first retaining portion 61 in the vertical direction, and a second engaging portion that engages with the second retaining portion 62 in the vertical direction. a portion 64; By engaging the retaining portions 61 and 62 of the infrared light transmitting portion 7 with the engaging portions 63 and 64 of the visible light transmitting portion 8, the infrared light transmitting portion 7 can be moved to both sides in the vertical direction. Regulated. Therefore, even if the lower surface 7b of the infrared light transmitting portion 7 does not overlap the upper surface 5a of the frame 5, the movement of the infrared light transmitting portion 7 is reliably restricted.

As shown in FIG. 9 , in the lid member 6 according to the sixth embodiment, retaining portions 71 and 72 are provided at the lower end portion and the upper end portion of the outer peripheral surface 7 c of the infrared light transmitting portion 7 . A first retaining portion 71 provided at the lower end portion of the outer peripheral surface 7c of the infrared light transmitting portion 7 is composed of a tapered portion whose diameter gradually decreases toward the inner diameter side as it moves toward the frame body 5 side. . The second retaining portion 72 provided at the upper end portion of the outer peripheral surface 7c of the infrared light transmitting portion 7 is composed of a tapered portion whose diameter gradually decreases toward the inner diameter side as it moves to the side opposite to the frame body 5. ing. In the holding portion 8c, the visible light transmission portion 8 has a first engagement portion 73 that engages with the first retaining portion 71 in the vertical direction, and a second engagement portion that engages with the second retaining portion 72 in the vertical direction. a portion 74; By engaging the retaining portions 71 and 72 of the infrared light transmitting portion 7 with the engaging portions 73 and 74 of the visible light transmitting portion 8, the infrared light transmitting portion 7 can be moved to both sides in the vertical direction. Regulated. Therefore, even if the lower surface 7b of the infrared light transmitting portion 7 does not overlap the upper surface 5a of the frame 5, the movement of the infrared light transmitting portion 7 is reliably restricted.

As shown in FIG. 10 , in the cover member 6 according to the seventh embodiment, the retainer portion 81 is provided in the vertical intermediate portion of the outer peripheral surface 7 c of the infrared light transmitting portion 7 . The retaining portion 81 is formed of a large diameter portion having a constant diameter larger than the diameter of a portion (small diameter portion) of the outer peripheral surface 7c of the infrared light transmitting portion 7 where the retaining portion 81 is not formed. The visible light transmitting portion 8 includes an engaging portion 82 that engages with the retaining portion 81 in the vertical direction in the holding portion 8c. By engaging the retaining portion 81 of the infrared light transmitting portion 7 with the engaging portion 82 of the visible light transmitting portion 8, movement of the infrared light transmitting portion 7 to both sides in the vertical direction is restricted. Therefore, even if the lower surface 7b of the infrared light transmitting portion 7 does not overlap the upper surface 5a of the frame 5, the movement of the infrared light transmitting portion 7 is reliably restricted.

As shown in FIG. 11, in the cover member 6 according to the eighth embodiment, the outer peripheral surface 7c of the infrared light transmitting portion 7 has a constant diameter throughout the vertical direction. In other words, the infrared light transmitting portion 7 does not have a retaining portion. Even in this case, if a part of the lower surface 7b of the infrared light transmitting portion 7 overlaps with the upper surface 5a of the frame 5, the downward movement of the infrared light transmitting portion 7 is restricted.

In addition, the present invention is not limited to the configuration of the above-described embodiment, nor is it limited to the above-described effects. Various modifications can be made to the present invention without departing from the gist of the present invention.

In the above embodiment, the holding portion 8c of the visible light transmitting portion 8 may be configured as a non-penetrating portion. That is, the holding portion 8c of the visible light transmitting portion 8 may be a recess with a bottom. This makes it difficult for the infrared light transmitting portion 7 to fall off from the holding portion 8c. However, from the viewpoint of increasing the transmittance of the infrared light L, it is preferable that the holding portion 8c of the visible light transmitting portion 8 is formed of a penetrating portion so that the visible light transmitting portion 8 is not positioned in the infrared light L transmitting region. .

In the above-described embodiment, a portion of the lower surface 7b of the infrared light transmitting portion 7 does not have to overlap the upper surface 5a of the frame 5 . However, from the viewpoint of ensuring high airtightness, it is preferable that part of the lower surface 7b of the infrared light transmitting portion 7 overlaps with the upper surface 5a of the frame 5 in order to form the second joint portion 13. .

In the above embodiment, if the airtightness of the second joint portion 13 and the third joint portion 17 is high, the airtightness inside the airtight package 3 can be ensured even if the airtightness of the first joint portion 11 is low. Therefore, the silicon layer 12 of the first joint portion 11 is omitted if the infrared light transmitting portion 7 can be reliably held in the holding portion 8c of the visible light transmitting portion 8 by the configuration of the retaining portion 9 and the like. good too. However, from the viewpoint of improving the airtightness of the airtight package 3 and maintaining good assembly properties, it is preferable to provide the silicon layer 12 on the first joint portion 11 .

The present invention also includes the following inventions (1) to (7).

(1) A joint structure characterized by joining infrared light transmitting glass and another member via a silicon layer.
(2) In the structure of (1), the infrared light transmitting glass is chalcogenide glass.
(3) In the configuration of (2) above, the chalcogenide glass contains 50 to 80% S, 0 to 40% Sb (but not including 0%), and 0 to 18% Ge (but 0% ), Sn 0-20%, Bi 0-20%.
(4) In the configuration of (2) above, the chalcogenide glass contains 4 to 80% Te, 0 to 50% Ge (but not including 0%), and 0 to 20% Ga in terms of molar percentages. structure.
(5) A joint structure according to any one of (1) to (4) above, wherein the other member includes glass.
(6) A joint structure according to any one of (1) to (5) above, wherein the other member includes a metallized layer.
(7) In the configuration of (6) above, the other member may further include a solder layer formed on the metallized layer.

Infrared light-transmitting glass often has poor adhesiveness and bondability with other members. and can be firmly joined.

1 electronic device 2 electronic component 3 airtight package 4 base material 4a upper surface (principal surface)
4b Lower surface 5 Frame body 5a Upper surface 5b Lower surface 5c Penetrating portion 6 Lid member 6a Upper surface 6b Lower surface 7 Infrared light transmitting portion 7a Upper surface 7b Lower surface 7c Peripheral surface 8 Visible light transmitting portion 8a Upper surface 8b Lower surface 8c Holding portion 9 Retaining portion 10 Engagement Joint portion 11 First joint portion 12 Silicon layer 13 Second joint portion 14 Silicon layer 15 Metallized layer 16 Solder layer 17 Third joint portion 18 Metallized layer 19 Solder layer 20 Base material glass 20a Upper surface 20b Lower surface 20c Peripheral surface 21 Mold 22 First molding die 22a Molding surface 23 Second molding die 23a Molding surface 31 Retaining portion 32 Engaging portion 41 Retaining portion 42 Engaging portion 51 First retaining portion 52 Second retaining portion 53 First engaging portion 54 Second engaging portion 61 First retaining portion 62 Second retaining portion 63 First engaging portion 64 Second engaging portion 71 First retaining portion 72 Second retaining portion 73 First engaging portion 74 Second Engagement portion 81 Retaining portion 82 Engagement portion L Infrared light

Claims (12)

An airtight package comprising a substrate having a main surface, a frame provided on the main surface of the substrate, and a lid member provided on the frame,
An airtight package, wherein the lid member includes an infrared light transmitting portion made of glass and a visible light transmitting portion made of glass having a holding portion that holds an outer periphery of the infrared light transmitting portion. The infrared light transmitting portion has an internal transmittance of 70 to 99% in a wavelength range of 3 to 14 μm and an internal transmittance in a wavelength range of 0.4 to 0.8 μm when the thickness is 2 mm. rate is 2% or less,
2. The airtight package according to claim 1, wherein the visible light transmitting portion has an internal transmittance of 50% or more in a wavelength range of 0.4 to 0.8 μm when the thickness is 2 mm. 3. The airtight package according to claim 1, wherein the infrared light transmitting portion is made of chalcogenide glass. The chalcogenide glass, in terms of molar percentage, contains 50 to 80% S, 0 to 40% Sb (but not including 0%), 0 to 18% Ge (but not including 0%), 0 to 20% Sn, Bi The hermetic package of claim 3, containing 0-20%. 4. The hermetic package of claim 3, wherein the chalcogenide glass contains 4-80% Te, 0-50% Ge (but not including 0%), and 0-20% Ga in molar percentages. In the holding portion, the infrared light transmitting portion and the visible light transmitting portion have joint portions joined to each other,
The airtight package according to any one of claims 1 to 5, wherein the joint portion between the infrared light transmitting portion and the visible light transmitting portion has a silicon layer. The infrared light transmitting portion and the frame have a joint portion joined to each other,
The airtightness according to any one of claims 1 to 6, wherein the joint portion between the infrared light transmitting portion and the frame has a silicon layer and a solder layer in order from the infrared light transmitting portion side. package. The visible light transmitting portion and the frame have a joint portion joined to each other,
The airtight package according to any one of claims 1 to 7, wherein the joint portion between the visible light transmitting portion and the frame has a solder layer. The airtight package according to any one of claims 1 to 8, wherein the infrared light transmitting portion has a retaining portion that engages with the visible light transmitting portion in the thickness direction in the holding portion. The retaining portion is provided at an end portion of the infrared light transmitting portion on the frame side,
10. The airtight package according to claim 9, wherein at least a portion of said retaining portion overlaps said frame. The airtight package according to any one of claims 1 to 10, and an electronic component that is housed in the internal space of the airtight package and irradiates infrared light to the outside through the infrared light transmission part. An electronic device characterized by: A lid material for an airtight package,
An infrared light transmitting portion made of glass and a visible light transmitting portion made of glass having a holding portion that holds the outer periphery of the infrared light transmitting portion,
The infrared light transmitting portion has an internal transmittance of 70 to 99% in a wavelength range of 3 to 14 μm and an internal transmittance in a wavelength range of 0.4 to 0.8 μm when the thickness is 2 mm. rate is 2% or less,
A lid material for an airtight package, wherein the visible light transmission part has an internal transmittance of 50% or more in a wavelength range of 0.4 to 0.8 μm when the thickness is 2 mm.

Images